TWI559189B - Optical transparent conductive material - Google Patents
Optical transparent conductive material Download PDFInfo
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- TWI559189B TWI559189B TW104117609A TW104117609A TWI559189B TW I559189 B TWI559189 B TW I559189B TW 104117609 A TW104117609 A TW 104117609A TW 104117609 A TW104117609 A TW 104117609A TW I559189 B TWI559189 B TW I559189B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Description
本發明係關於可適合地使用在靜電電容式的觸控面板等之光穿透性導電材料。 The present invention relates to a light-transmitting conductive material that can be suitably used in a capacitive touch panel or the like.
於PDA(Personal Digital Assistant;個人數位助理)、筆記型PC、OA機器、醫療機器、或車用導航系統等之電子機器中,係在此等的顯示器中廣泛地採用觸控面板作為輸入手段。 In an electronic device such as a PDA (Personal Digital Assistant), a notebook PC, an OA device, a medical device, or a car navigation system, a touch panel is widely used as an input means in such displays.
觸控面板,因位置偵測方法的不同,而有光學式、超音波式、表面型靜電電容式、投影型靜電電容式、電阻膜式等。電阻膜式的觸控面板中,係構成為將光穿透性導電材料與附有透明導電體層的玻璃間隔著間隔材而對向地配置,使電流於光穿透性導電材料中流通,並測量附有透明導電體層的玻璃中之電壓之構造。另一方面,於靜電電容式的觸控面板中,關於成為觸控感測器之光穿透性電極,係以於在支撐體上具有光穿透性導電層之光穿透性導電材料作為基本構成,由於其特徵為不具有可動部分,而具有高耐久性及高光穿透性,所以可適用在各種用途。再者,由於投影型靜電電容式的觸控面板可進行多點 同步檢測,所以被廣泛地使用在智慧型手機或平板PC等。 The touch panel has optical, ultrasonic, surface-type electrostatic capacitance, projection type electrostatic capacitance type, and resistive film type depending on the position detection method. The resistive film type touch panel is configured such that a light-transmitting conductive material and a glass with a transparent conductor layer are disposed to face each other with a spacer interposed therebetween, and an electric current flows through the light-transmitting conductive material, and The configuration of the voltage in the glass to which the transparent conductor layer is attached is measured. On the other hand, in the capacitive touch panel, the light-transmitting electrode that becomes the touch sensor is used as a light-transmitting conductive material having a light-transmitting conductive layer on the support. Since the basic structure is characterized in that it has no movable portion and has high durability and high light transmittance, it can be applied to various uses. Furthermore, since the projection type capacitive touch panel can perform multiple points Synchronous detection, so it is widely used in smart phones or tablet PCs.
靜電電容式的觸控面板中,成為觸控感測器之光穿透性電極(光穿透性導電材料),由於具有多數個光穿透性導電部(光穿透性的感測器部),所以可得到能夠進行多點同步檢測或移動點的檢測之優異特性。為了將該多數個光穿透性的感測器部所檢測之訊號擷取至外部,係於全部光穿透性的感測器部、與用以將訊號擷取至外部所設置之端子部之間,設置有由電性連接此等之複數條周邊配線所構成之周邊配線部。近年來,係要求更進一步窄化液晶顯示器之畫面以外的部分,並要求窄化該周邊配線部所佔有之區域。因此,周邊配線部中,必須進一步細化周邊配線,並進一步窄化周邊配線的間隔。 In the capacitive touch panel, it becomes a light-transmitting electrode (light-transmitting conductive material) of the touch sensor, and has a plurality of light-transmitting conductive portions (light-transmitting sensor portion) Therefore, excellent characteristics capable of performing multi-point synchronization detection or moving point detection can be obtained. In order to extract the signal detected by the plurality of light-transmitting sensor portions to the outside, the light-transmitting sensor portion and the terminal portion for extracting the signal to the outside are provided. A peripheral wiring portion composed of a plurality of peripheral wirings electrically connected to each other is provided. In recent years, it has been demanded to further narrow the portion other than the screen of the liquid crystal display, and it is required to narrow the area occupied by the peripheral wiring portion. Therefore, in the peripheral wiring portion, it is necessary to further refine the peripheral wiring and further narrow the interval between the peripheral wirings.
製造觸控面板時,具有光穿透性的感測器部及周邊配線之光穿透性導電材料,係接著於其他光穿透性導電材料或保護面板等而使用。當細化周邊配線的線寬並窄化周邊配線的間隔時,於製造時有時會產生損傷而造成斷線。為了消除此問題,一般係將保護膜貼合於光穿透性導電材料的表面以保護感測器部及周邊配線等。由於使用在該用途之保護膜容易帶電,當以保護膜來被覆光穿透性導電材料的表面時,保護膜所帶有之電荷容易往感測器部移動,使感測器部帶有電荷。此外,從光穿透性導電材料剝離保護膜時,感測器部亦容易帶有電荷。當帶電之複數個感測器部間的電位差增大時,在個別連接於感測器部之周邊配線之間容易產生放電,當周邊配線的間隔較窄 時,放電的產生更加顯著。產生該放電時,於周邊配線部產生缺陷(靜電破壞),使製造觸控面板時的良率顯著降低。 When the touch panel is manufactured, the light-transmitting sensor portion and the light-transmitting conductive material of the peripheral wiring are used in connection with other light-transmitting conductive materials, protective panels, and the like. When the line width of the peripheral wiring is refined and the interval between the peripheral wirings is narrowed, damage may occur at the time of manufacture to cause disconnection. In order to eliminate this problem, a protective film is generally attached to the surface of the light-transmitting conductive material to protect the sensor portion, peripheral wiring, and the like. Since the protective film used for the purpose is easily charged, when the surface of the light-transmitting conductive material is coated with a protective film, the electric charge carried by the protective film is easily moved to the sensor portion, and the sensor portion is charged. . Further, when the protective film is peeled off from the light-transmitting conductive material, the sensor portion is also easily charged. When the potential difference between the plurality of charged sensor portions is increased, discharge is easily generated between the peripheral wirings individually connected to the sensor portion, and the interval between the peripheral wirings is narrow. At the time, the discharge is more pronounced. When this discharge occurs, defects (static breakdown) occur in the peripheral wiring portion, and the yield at the time of manufacturing the touch panel is remarkably lowered.
此外,製造靜電電容式的觸控面板時,係貼合2片光穿透性導電材料,且使貼合之光穿透性導電材料與FPC(可撓式印刷電路基板)纜線連接,該FPC纜線與控制器IC連接,此等係連接作為電路而消除帶電現象。然而,在連接控制器IC前的階段,例如在未連接控制器IC前的階段之光穿透性導電材料的組裝步驟或保管步驟中,極難以消除由作為周邊配線部的靜電破壞的原因之帶電所造成之感測器部之電位差的產生。 In addition, when manufacturing a capacitive touch panel, two pieces of light-transmitting conductive material are bonded, and the bonded light-transmitting conductive material is connected to an FPC (flexible printed circuit board) cable. The FPC cable is connected to the controller IC, which is connected as a circuit to eliminate charging. However, in the stage before the connection of the controller IC, for example, in the assembly step or the storage step of the light-transmitting conductive material at the stage before the controller IC is connected, it is extremely difficult to eliminate the cause of the electrostatic breakdown as the peripheral wiring portion. The generation of the potential difference of the sensor portion caused by the charging.
專利文獻1中,係記載有為了防止於觸控面板的製造過程中所產生之周邊配線的損傷,在周邊配線部的旁邊設置未與光穿透性導電部電性連接之防護線之內容。專利文獻2中,係記載有為了提升金屬圖案的抗腐蝕性或無電解電鍍附著的均一性,而改變周邊配線的線寬之內容。專利文獻3中,係記載有為了降低每條配線之電容的差異,而設置輔助配線並改變周邊配線的線寬與周邊配線間的間隔之內容。 In Patent Document 1, it is described that a protective wire that is not electrically connected to the light-transmitting conductive portion is provided beside the peripheral wiring portion in order to prevent damage of the peripheral wiring generated in the manufacturing process of the touch panel. In Patent Document 2, the content of the line width of the peripheral wiring is changed in order to improve the corrosion resistance of the metal pattern or the uniformity of the electroless plating adhesion. In Patent Document 3, in order to reduce the difference in capacitance of each wiring, it is described that the auxiliary wiring is provided and the interval between the line width of the peripheral wiring and the peripheral wiring is changed.
[專利文獻1]日本特開2014-63467號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-63467
[專利文獻2]日本特開2013-206301號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-206301
[專利文獻3]日本特開2009-237673號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-237673
即使使用專利文獻1、專利文獻2或專利文獻3等所記載之方法,在防止周邊配線的靜電破壞並提升觸控面板製造時的良率者之目的,仍無法得到令人滿意之結果。因此,本發明之目的在於提供一種能夠改善觸控面板製造時的低良率之光穿透性導電材料。 Even if the method described in Patent Document 1, Patent Document 2, or Patent Document 3 is used, satisfactory results cannot be obtained for the purpose of preventing electrostatic breakdown of peripheral wiring and improving the yield of the touch panel. Accordingly, it is an object of the present invention to provide a light-transmitting conductive material capable of improving low yield in the manufacture of a touch panel.
本發明之上述課題,基本上可藉由下列之光穿透性導電材料來解決。該光穿透性導電材料係於支撐體上具有:在第一方向上延伸之光穿透性的感測器部、在屬於垂直於第一方向之方向的第二方向上與該感測器部交互地排列之光穿透性的虛設部、端子部、由電性連接該感測器部與該端子部之複數條周邊配線所構成之周邊配線部、以及由未與該感測器部電性連接之複數條接地配線所構成之接地部;周邊配線部所具有之複數條周邊配線係具有於相鄰接之周邊配線間為平行的部分,接地部所具有之複數條接地配線係具有於相鄰接之接地配線間為平行的部分,於該周邊配線呈平行的部分中,以周邊配線間的最小間隔距離為A,於該接地配線呈平行的部分中,以接地配線間的最小間隔距離為B時,A>B。 The above problems of the present invention can basically be solved by the following light-transmitting conductive materials. The light transmissive conductive material is attached to the support body with a light transmissive sensor portion extending in a first direction, and the sensor in a second direction belonging to a direction perpendicular to the first direction a dummy portion of the light transmissive portion that is alternately arranged, a terminal portion, a peripheral wiring portion that is electrically connected to the plurality of peripheral wires of the sensor portion and the terminal portion, and a portion that is not connected to the sensor portion a plurality of ground wirings electrically connected to each other; the plurality of peripheral wirings of the peripheral wiring portion have a parallel portion between the adjacent wirings, and the plurality of ground wirings of the ground portion have In the parallel portion of the adjacent ground wiring, in the parallel portion of the peripheral wiring, the minimum separation distance between the peripheral wirings is A, and the ground wiring is the smallest in the parallel portion of the ground wiring. When the separation distance is B, A>B.
在此,周邊配線部之周邊配線呈平行的部分之配線的方向,與接地部之接地配線呈平行的部分之配線的方向較佳為呈一致。此外,配線方向為相同之周邊配 線呈平行的部分之周邊配線間的間隔距離,較佳為均為最小間隔距離A。此外,配線方向為相同之接地配線呈平行的部分之接地配線間的間隔距離,較佳為均較最小間隔距離A小。此外,最小間隔距離B較佳為相對於最小間隔距離A為10至80%。此外,接地配線的線寬較佳為周邊配線的線寬以上。此外,接地部較佳為由連接於端子部之至少一條接地配線、與未連接於其他部位之複數條接地配線所構成。此外,至少一條接地配線較佳在端子部以外的地方包圍光穿透性的感測器部、光穿透性的虛設部與周邊配線部。 Here, in the direction in which the peripheral wiring of the peripheral wiring portion is in the direction of the wiring in the parallel portion, the direction of the wiring in the portion parallel to the ground wiring of the ground portion is preferably uniform. In addition, the wiring direction is the same as the surrounding The spacing distance between the peripheral wirings of the parallel portions of the wires is preferably the minimum spacing distance A. Further, it is preferable that the distance between the ground wirings in which the wiring directions are the same in the portions where the ground wirings are parallel is preferably smaller than the minimum separation distance A. Further, the minimum separation distance B is preferably 10 to 80% with respect to the minimum separation distance A. Further, the line width of the ground wiring is preferably equal to or greater than the line width of the peripheral wiring. Further, the ground portion is preferably composed of at least one ground wiring connected to the terminal portion and a plurality of ground wirings not connected to other portions. Further, at least one of the ground wirings preferably surrounds the light-transmitting sensor portion, the light-transmitting dummy portion, and the peripheral wiring portion at a portion other than the terminal portion.
藉由本發明,由於可消除感測器部間的電位差,防止周邊配線的靜電破壞,故可提供一種能夠改善觸控面板製造時的低良率之光穿透性導電材料。 According to the present invention, since the potential difference between the sensor portions can be eliminated and the electrostatic breakdown of the peripheral wiring is prevented, it is possible to provide a light-transmitting conductive material which can improve the low yield of the touch panel.
1‧‧‧光穿透性導電材料 1‧‧‧Light penetrating conductive materials
2‧‧‧支撐體 2‧‧‧Support
11、11a、11b、11c、11p‧‧‧感測器部 11, 11a, 11b, 11c, 11p‧‧‧ Sensors
12、12a、12b、12c‧‧‧虛設部 12, 12a, 12b, 12c‧‧‧ imaginary department
13‧‧‧周邊配線部 13‧‧‧Circuit wiring department
13a、13b、13c、13p‧‧‧周邊配線 13a, 13b, 13c, 13p‧‧‧ peripheral wiring
14‧‧‧端子部 14‧‧‧ Terminals
14a、14b、14c、14r‧‧‧端子 14a, 14b, 14c, 14r‧‧‧ terminals
15‧‧‧接地部 15‧‧‧ Grounding Department
151、15a、15b、15c、15d、15e、15f、15g、15h‧‧‧接地配線 151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, 15h‧‧‧ grounding wiring
21、22、23、24‧‧‧線段 21, 22, 23, 24‧‧ ‧ line segments
221、222、231、232‧‧‧點 221, 222, 231, 232‧ ‧ points
2211、2221、2311、2321‧‧‧垂線 2211, 2221, 2311, 2321‧‧‧ vertical line
第1圖係顯示本發明之光穿透性導電材料的一例之概略圖。 Fig. 1 is a schematic view showing an example of the light-transmitting conductive material of the present invention.
第2圖係用以說明本發明之相鄰接之周邊配線的位置關係之擴大圖。 Fig. 2 is an enlarged view for explaining the positional relationship of adjacent wirings of the present invention.
第3圖係第1圖所示之光穿透性導電材料的周邊配線部、端子部及接地部之擴大圖。 Fig. 3 is an enlarged view of a peripheral wiring portion, a terminal portion, and a ground portion of the light-transmitting conductive material shown in Fig. 1.
第4圖(a)係用以說明周邊配線間的最小間隔距離A之擴大圖,第4圖(b)係用以說明接地配線間的最小間隔距離 B之擴大圖。 Fig. 4(a) is an enlarged view for explaining the minimum separation distance A between the peripheral wirings, and Fig. 4(b) is for explaining the minimum separation distance between the ground wirings. An enlarged picture of B.
以下,在詳細說明本發明時,係使用圖面來說明,但本發明在不脫離該技術範圍內,可進行各種變形和修正,且當然不限定於以下實施形態。 In the following, the present invention will be described in detail with reference to the drawings. However, the present invention can be variously modified and modified without departing from the scope of the invention, and is of course not limited to the following embodiments.
第1圖係顯示本發明之光穿透性導電材料的一例之概略圖。本發明之光穿透性導電材料1,於支撐體2上,具有:在第一方向(圖中y方向)延伸之光穿透性的感測器部11,以及在垂直於第一方向之方向的第二方向(圖中x方向)與該感測器部11交互地排列之光穿透性的虛設部12。感測器部11係設置有複數個(圖中11a、11b、11c…、11p等),因應於此,與該感測器部11交互地排列之虛設部12亦設置有複數個(圖中12a、12b、12c等)。第1圖中,感測器部11與虛設部12,為了表示此等的區域,簡便上係以方格圖樣與點圖樣來表示。 Fig. 1 is a schematic view showing an example of the light-transmitting conductive material of the present invention. The light transmissive conductive material 1 of the present invention has a light transmissive sensor portion 11 extending in a first direction (y direction in the drawing) on the support 2, and perpendicular to the first direction The second direction of the direction (the x direction in the drawing) is a dummy portion 12 of the light transmissiveness that is alternately arranged with the sensor portion 11. The sensor unit 11 is provided with a plurality of (11a, 11b, 11c, ..., 11p, etc. in the figure), and accordingly, the dummy portion 12 that is alternately arranged with the sensor portion 11 is also provided with plural numbers (in the figure) 12a, 12b, 12c, etc.). In the first drawing, the sensor portion 11 and the dummy portion 12 are simply indicated by a checkered pattern and a dot pattern in order to express such regions.
端子部14為用以電性連接感測器部11與外部之部分,並對應感測器部11的數目(亦包含連接有後述接地配線151之端子)由複數個端子(圖中14a、14b、14c等)所構成。感測器部11a透過周邊配線13a與端子14a電性連接,並藉由通過端子14a電性連接於外部,可掌握感測器部11所感測之靜電電容的變化。虛設部12未與端子14電性連接。 The terminal portion 14 is a portion for electrically connecting the sensor portion 11 and the outside, and corresponds to the number of the sensor portions 11 (including the terminal to which the ground wiring 151 to be described later is connected) by a plurality of terminals (14a, 14b in the drawing) , 14c, etc.). The sensor portion 11a is electrically connected to the terminal 14a through the peripheral wiring 13a, and is electrically connected to the outside through the terminal 14a, so that the change in the electrostatic capacitance sensed by the sensor portion 11 can be grasped. The dummy portion 12 is not electrically connected to the terminal 14.
周邊配線13,係由電性連接感測器部13與端子14之複數條周邊配線所構成(圖中13a、13b、13c…、 13p等),各條周邊配線相鄰接,且係彎折並往圖中y方向與x方向延伸而連接感測器部11與端子14,所以周邊配線13所具有之複數條周邊配線,於相鄰接之周邊配線間具有平行的部分。例如於第1圖中,於周邊配線13a和與此相鄰接之周邊配線13b之間,在配線的方向為y方向與x方向的2方向,存在有平行的部分。該平行的部分之配線的方向,可單獨為y方向或單獨為x方向,亦可為斜向。 The peripheral wiring 13 is formed by electrically connecting a plurality of peripheral wirings of the sensor portion 13 and the terminal 14 (13a, 13b, 13c, ..., 13p, etc.), each of the peripheral wirings is adjacent to each other, and is bent and extends in the y direction and the x direction in the drawing to connect the sensor portion 11 and the terminal 14, so that the peripheral wiring 13 has a plurality of peripheral wirings. Adjacent wiring perimeters have parallel sections. For example, in FIG. 1, between the peripheral wiring 13a and the peripheral wiring 13b adjacent thereto, there are parallel portions in the direction of the wiring in the y direction and the two directions in the x direction. The direction of the wiring of the parallel portion may be the y direction alone or the x direction alone, or may be oblique.
本發明中,周邊配線13所具有之複數條周邊配線,係如上述般,於相鄰接之周邊配線間具有平行的部分。以下使用第2圖來說明平行的部分。第2圖係用以說明本發明之相鄰接之周邊配線的位置關係之擴大圖。 In the present invention, the plurality of peripheral wirings included in the peripheral wiring 13 have parallel portions between the adjacent wirings as described above. The parallel drawing will be described below using Fig. 2. Fig. 2 is an enlarged view for explaining the positional relationship of adjacent wirings of the present invention.
第2圖中,線段21至24均於x方向上延伸,故相互呈平行。線段22中,於點221至222間,線段22的垂線2211及垂線2221與線段23相交。此時,亦即在圖中x方向上存在有線段22與線段23並列之部分時,線段22與線段23可說是處於相鄰接之位置關係。此外,線段23中,於點231至232間,線段23的垂線2311及垂線2321與線段24相交。此時,亦即在圖中x方向上存在有線段23與線段24並列之部分時,線段23與線段24可說是處於相鄰接之位置關係。另一方面,於線段21與線段22之間,即使拉出垂線,亦無相交之區域。此時,亦即在圖中x方向上不存在線段21與線段22並列之部分時,線段21與線段22不處於相鄰接之位置關係。在此,即使2條線段處於並列之位置關係,當其他圖案夾持於此等之間而存在 時,此等並非相鄰接。如此,第2圖中,於相鄰接之線段22與線段23之間存在有平行的部分,於相鄰接之線段23與線段24之間存在有平行的部分,並且分別處於相鄰接之關係的線段22與線段23與線段24之3條呈平行,所以此等3條,可說是形成本發明之平行的部分。如此,本發明之平行的部分,可僅由相鄰接之2條周邊配線所形成,或是由分別相鄰接之3條以上的周邊配線所形成。此外,平行的部分於周邊配線部中只須至少存在於1處即可。上述本發明之「相鄰接」的定義,於接地部之接地配線的位置關係中亦為同義。 In Fig. 2, the line segments 21 to 24 all extend in the x direction, so that they are parallel to each other. In the line segment 22, between the points 221 to 222, the perpendicular line 2211 of the line segment 22 and the perpendicular line 2221 intersect the line segment 23. At this time, that is, when there is a portion where the line segment 22 and the line segment 23 are juxtaposed in the x direction in the figure, the line segment 22 and the line segment 23 can be said to be in an adjacent positional relationship. Further, in the line segment 23, between the points 231 to 232, the perpendicular line 2311 of the line segment 23 and the perpendicular line 2321 intersect the line segment 24. At this time, that is, when there is a portion where the line segment 23 and the line segment 24 are juxtaposed in the x direction in the figure, the line segment 23 and the line segment 24 can be said to be in an adjacent positional relationship. On the other hand, between the line segment 21 and the line segment 22, even if the vertical line is pulled out, there is no intersection area. At this time, that is, when there is no portion where the line segment 21 and the line segment 22 are juxtaposed in the x direction in the figure, the line segment 21 and the line segment 22 are not in the adjacent positional relationship. Here, even if two line segments are in a side-by-side positional relationship, when other patterns are held between them, there is When these are not adjacent. Thus, in FIG. 2, there are parallel portions between the adjacent line segments 22 and the line segments 23, and parallel portions exist between the adjacent line segments 23 and the line segments 24, and are respectively adjacent to each other. The line segment 22 of the relationship is parallel with the line segment 23 and the three segments of the line segment 24, so that these three pieces can be said to form parallel portions of the present invention. As described above, the parallel portion of the present invention can be formed only by two adjacent peripheral wirings or by three or more adjacent peripheral wirings. Further, the parallel portion only needs to exist at least at one place in the peripheral wiring portion. The definition of "adjacent connection" in the above-described invention is also synonymous with the positional relationship of the ground wiring of the ground portion.
接著說明接地部。本發明之光穿透性導電材料,具有未與前述感測器部11電性連接之接地部15。 Next, the grounding portion will be described. The light-transmitting conductive material of the present invention has a ground portion 15 that is not electrically connected to the above-described sensor portion 11.
第3圖係第1圖所示之光穿透性導電材料的周邊配線部、端子部及接地部之擴大圖。另外,第3圖中省略了光穿透性的感測器部11與光穿透性的虛設部12。本發明中,接地部15未與感測器部11連接。本發明中,構成接地部15之接地配線,可連接或不連接於端子部14,但接地部15較佳係由連接於端子部之至少一條接地配線與未連接於其他部位之複數條接地配線所構成。本實施形態中,接地部15係由連接於端子14r之接地配線151、與第4圖(b)所示之未連接於其他部位之複數條接地配線15a、15b、15c、15d、15e、15f、15g、15h所構成。第3圖中,接地部15在配線的方向為x方向上,具有分別相鄰接且呈平行的部分。第3圖中,係顯示在配線的方向為x 方向上,處於分別相鄰接之關係的全部接地配線呈平行之例子,但在本發明中,平行的部分只要存在於接地部中的至少1處即可。 Fig. 3 is an enlarged view of a peripheral wiring portion, a terminal portion, and a ground portion of the light-transmitting conductive material shown in Fig. 1. Further, in the third drawing, the light transmissive sensor portion 11 and the light penetrating dummy portion 12 are omitted. In the present invention, the ground portion 15 is not connected to the sensor portion 11. In the present invention, the ground wiring constituting the ground portion 15 may or may not be connected to the terminal portion 14. However, the ground portion 15 preferably has at least one ground wiring connected to the terminal portion and a plurality of ground wirings not connected to other portions. Composition. In the present embodiment, the ground portion 15 is composed of a ground wiring 151 connected to the terminal 14r and a plurality of ground wirings 15a, 15b, 15c, 15d, 15e, 15f which are not connected to other portions shown in Fig. 4(b). , 15g, 15h. In Fig. 3, the ground portion 15 has a portion which is adjacent to each other and which is parallel in the direction of the wiring in the x direction. In Figure 3, the direction of the wiring is x. In the direction, all the ground wirings in the adjacent relationship are parallel, but in the present invention, the parallel portions may be present in at least one of the ground portions.
第3圖中,接地配線151為連接於端子14r之配線,同時亦為在端子部14以外的地方包圍光穿透性的感測器部11與光穿透性的虛設部12與周邊配線部13之配線(參考前述第1圖)。如此,至少一條接地配線較佳係在端子部14以外的地方,包圍光穿透性的感測器部11、光穿透性的虛設部12、與周邊配線部13。藉此可得到耐靜電破壞性特別優異之光穿透性導電材料。 In the third diagram, the ground wiring 151 is a wiring connected to the terminal 14r, and also surrounds the light-transmitting sensor portion 11 and the light-transmitting dummy portion 12 and the peripheral wiring portion at a place other than the terminal portion 14. 13 wiring (refer to Figure 1 above). As described above, at least one of the ground wirings is preferably provided outside the terminal portion 14, and surrounds the light transmissive sensor portion 11, the light transmissive dummy portion 12, and the peripheral wiring portion 13. Thereby, a light-transmitting conductive material which is particularly excellent in electrostatic breakdown resistance can be obtained.
第3圖中,存在於複數條周邊配線間之平行的部分,為配線的方向為x方向上之平行的部分,與配線的方向為y方向上之平行的部分之2方向,另一方面,存在於複數條接地配線間之平行的部分,在配線的方向為x方向上呈平行,所以存在於複數條周邊配線間之平行的部分之配線的方向,與存在於複數條接地配線間之平行的部分之配線的方向呈一致。如此,周邊配線部之周邊配線呈平行的部分之配線的方向,與接地部之接地配線呈平行的部分之配線的方向呈一致,可得到耐靜電破壞性特別優異之光穿透性導電材料,故較佳。 In Fig. 3, the parallel portion between the plurality of peripheral wirings is the direction in which the wiring is parallel in the x direction, and the direction of the wiring is the direction parallel to the y direction. On the other hand, The parallel portion existing between the plurality of ground wirings is parallel in the direction of the wiring in the x direction, so that the direction of the wiring in the parallel portion between the plurality of peripheral wirings is parallel to the existence of the plurality of ground wirings The wiring of the part is in the same direction. In this way, the direction in which the peripheral wiring of the peripheral wiring portion is in the parallel portion is aligned with the direction of the wiring in the portion parallel to the ground wiring of the ground portion, and a light-transmitting conductive material having particularly excellent electrostatic breakdown resistance can be obtained. Therefore, it is better.
接著使用第3圖及第4圖說明本發明之最小間隔距離。 Next, the minimum separation distance of the present invention will be described using Figs. 3 and 4.
第3圖中,周邊配線13係由周邊配線13a、13b、…、13p所構成,周邊配線13a、13b、…、13p在配 線的方向為y方向與x方向的2方向,分別有相鄰接且平行的部分。於此等平行的部分中,周邊配線間的間隔距離最窄之處(周邊配線13a與13b之間),於第4圖(a)中以D13來顯示。本發明中,將該周邊配線間的間隔距離最窄之處D13之配線間隔距離,設為最小間隔距離A。周邊配線間的間隔距離最窄之處D13可存在複數個,此外,配線的方向為相同之周邊配線呈平行的部分之周邊配線間的間隔距離(例如於第3圖中,周邊配線13a、13b、…、13p之各配線的方向為相同的x方向,且與相鄰接之周邊配線呈平行的部分之各配線間的間隔距離),較佳均為最小間隔距離A。藉此可得到耐靜電破壞性優異之光穿透性導電材料。第3圖中,接地配線間的間隔距離最窄之處,於第4圖(b)中以D15來顯示。本發明中,將該接地配線間的間隔距離最窄之處(接地配線15g與15h之間)D15之配線間隔距離,設為最小間隔距離B。接地配線間的間隔距離最窄之處D15可存在複數個。此外,本發明中,周邊配線間的最小間隔距離A與接地配線間的最小間隔距離B,處於A>B之關係。藉由保持該關係,可得到能夠改善因靜電破壞所導致之低良率之光穿透性導電材料。此外,接地配線間的最小間隔距離B,相對於周邊配線間的最小間隔距離A,較佳為10至80%。 In Fig. 3, the peripheral wiring 13 is composed of peripheral wirings 13a, 13b, ..., 13p, and the peripheral wirings 13a, 13b, ..., 13p are arranged. The direction of the line is the y direction and the two directions of the x direction, and there are adjacent and parallel portions, respectively. In the parallel portions, the distance between the peripheral wirings is the narrowest (between the peripheral wirings 13a and 13b), and is displayed as D13 in Fig. 4(a). In the present invention, the wiring interval distance D13 at which the distance between the peripheral wirings is the narrowest is the minimum separation distance A. There may be a plurality of places where the distance between the peripheral wirings is the narrowest, and the distance between the wirings is the same as the distance between the peripheral wirings of the portions where the peripheral wirings are parallel (for example, in FIG. 3, the peripheral wirings 13a, 13b) The distance between each of the wirings of the ..., 13p is the same x direction, and the distance between the wirings of the portion parallel to the adjacent peripheral wiring is preferably the minimum separation distance A. Thereby, a light-transmitting conductive material excellent in electrostatic breakdown resistance can be obtained. In Fig. 3, the interval between the ground wirings is the narrowest, and is shown as D15 in Fig. 4(b). In the present invention, the wiring interval distance (the distance between the ground wirings 15g and 15h) D15 at which the distance between the ground wirings is the narrowest is the minimum separation distance B. There may be a plurality of D15s at the narrowest distance between the ground wirings. Further, in the present invention, the minimum separation distance A between the peripheral wirings and the minimum separation distance B between the ground wirings are in the relationship of A>B. By maintaining this relationship, a light-transmitting conductive material capable of improving the low yield due to electrostatic breakdown can be obtained. Further, the minimum separation distance B between the ground wirings is preferably 10 to 80% with respect to the minimum separation distance A between the peripheral wirings.
本發明中,構成周邊配線部之周邊配線的線寬,較佳為5至200μm,尤佳為10至100μm。周邊配線的長度,因觸控面板之畫面大小的不同而不同,通常該 範圍為1至1000mm。另一方面,周邊配線部之各條周邊配線間的間隔距離,較佳為5至150μm,尤佳為10至70μm,特佳為10至50μm。藉由調整該周邊配線的線寬與周邊配線間的間隔距離,可進一步窄化液晶顯示器之畫面以外的部分。構成接地部之接地配線的線寬,較佳與構成周邊配線部之周邊配線的線寬相同或是較此更粗。藉此可得到耐靜電破壞性優異之光穿透性導電材料。此外,如前述般,接地配線間的最小間隔距離B較周邊配線間的最小間隔距離A小,但配線的方向為相同之接地配線呈平行的部分之接地配線間的間隔距離(例如於第3圖及第4圖中,接地配線151及接地配線15a至15h之各配線的方向為相同的x方向,且與相鄰接之接地配線呈平行的部分之各配線間的間隔距離),較佳均較周邊配線間的最小間隔距離A小。再者,於滿足該條件下,接地配線間的間隔距離,較佳為5至150μm,尤佳為5至50μm。接地部的配線間隔可均為相同或不同。周邊配線與接地配線的厚度,較佳為0.05至10μm,尤佳為0.05至2μm的厚度。 In the present invention, the line width of the peripheral wiring constituting the peripheral wiring portion is preferably 5 to 200 μm, and more preferably 10 to 100 μm. The length of the peripheral wiring varies depending on the screen size of the touch panel. Usually, The range is from 1 to 1000 mm. On the other hand, the distance between the peripheral wirings of the peripheral wiring portions is preferably 5 to 150 μm, more preferably 10 to 70 μm, particularly preferably 10 to 50 μm. By adjusting the distance between the line width of the peripheral wiring and the peripheral wiring, it is possible to further narrow the portion other than the screen of the liquid crystal display. The line width of the ground wiring constituting the ground portion is preferably the same as or thicker than the line width of the peripheral wiring constituting the peripheral wiring portion. Thereby, a light-transmitting conductive material excellent in electrostatic breakdown resistance can be obtained. Further, as described above, the minimum separation distance B between the ground wirings is smaller than the minimum separation distance A between the peripheral wirings, but the wiring direction is the spacing distance between the ground wirings in which the ground wirings are parallel (for example, in the third In the figure and Fig. 4, it is preferable that the directions of the wirings of the ground wiring 151 and the ground wirings 15a to 15h are the same x direction and the distance between the wirings of the portions parallel to the adjacent ground wirings. Both are smaller than the minimum separation distance A between the peripheral wirings. Further, in the case where the condition is satisfied, the distance between the ground wirings is preferably 5 to 150 μm, particularly preferably 5 to 50 μm. The wiring intervals of the ground portions may all be the same or different. The thickness of the peripheral wiring and the ground wiring is preferably 0.05 to 10 μm, and more preferably 0.05 to 2 μm.
本發明之光穿透性導電材料所具有之支撐體,可較佳地使用塑膠、玻璃、橡膠、陶瓷等。本發明中,支撐體較佳為總透光率60%以上的支撐體。塑膠當中,具有可撓性之樹脂薄膜,從處理性優異之觀點來看,可較佳地使用。用作為光穿透性支撐體之樹脂薄膜的具體例,可列舉出由聚對苯二甲酸乙二酯(PET)或聚萘二甲酸乙二酯(PEN)等之聚酯樹脂、丙烯酸樹脂、環氧樹脂、氟樹脂、聚 矽氧樹脂、二乙酸酯樹脂、三乙酸酯樹脂、聚碳酸酯、聚芳酯、聚氯乙烯、聚碸、聚醚碸、聚醯亞胺、聚醯胺、聚烯烴、環狀聚烯烴等所構成之樹脂薄膜,該厚度較佳為25至300μm。支撐體可具有物理顯影核心層、易黏著層、接著劑層等之一般所知的層。 The support body of the light-transmitting conductive material of the present invention can preferably be made of plastic, glass, rubber, ceramics or the like. In the present invention, the support is preferably a support having a total light transmittance of 60% or more. Among the plastics, a flexible resin film is preferably used from the viewpoint of excellent handleability. Specific examples of the resin film used as the light-transmitting support include polyester resins such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), acrylic resins, and the like. Epoxy resin, fluororesin, poly Oxide resin, diacetate resin, triacetate resin, polycarbonate, polyarylate, polyvinyl chloride, polyfluorene, polyether oxime, polyimine, polyamine, polyolefin, cyclic polymerization The resin film composed of an olefin or the like preferably has a thickness of 25 to 300 μm. The support may have a generally known layer of a physical development core layer, an easy adhesion layer, an adhesive layer, and the like.
本發明之光穿透性導電材料所具有之光穿透性的感測器部,以及與該感測器部交互地排列之光穿透性的虛設部,可使用一般所知的光穿透性導電層等。例如能以ITO(氧化銦錫)導電膜來形成光穿透性的感測器部,並且將無ITO導電膜之部分構成為虛設部。再者,由於具有與ITO導電膜相比更能夠提高光穿透性及可撓性高等優點,故可較佳地使用由金屬細線所形成之網目狀金屬圖案來作為光穿透性的感測器部及光穿透性的虛設部。形成網目狀金屬圖案時所使用之金屬,較佳是由金、銀、銅、鎳、鋁、及該等的複合材所構成。本發明中,當使用相同金屬來形成光穿透性的感測器部、光穿透性的虛設部、端子部、周邊配線部、以及接地部時,能夠以相同手法同時製作,故從生產性之觀點來看較佳。 The light transmissive sensor portion of the light-transmitting conductive material of the present invention, and the imaginary portion of the light-transmitting property that is alternately arranged with the sensor portion, can be generally known to use light penetration. Conductive layer, etc. For example, a light transmissive sensor portion can be formed with an ITO (Indium Tin Oxide) conductive film, and a portion of the ITO-free conductive film can be formed as a dummy portion. Further, since it has an advantage of being more capable of improving light transmittance and flexibility than the ITO conductive film, a mesh metal pattern formed of thin metal wires can be preferably used as the light transmittance sensing. The imaginary part of the device and the light penetration. The metal used in forming the mesh-like metal pattern is preferably composed of gold, silver, copper, nickel, aluminum, and the like. In the present invention, when the same metal is used to form the light transmissive sensor portion, the light transmissive dummy portion, the terminal portion, the peripheral wiring portion, and the ground portion, the same method can be used simultaneously, so that the production is performed. The point of view of sex is better.
藉由金屬圖案來形成光穿透性的感測器部、光穿透性的虛設部、端子部、周邊配線部以及接地部之方法,可使用:使用銀鹽感光材料而得到銀圖像之方法;對使用同一方法所得之銀圖像進一步施以無電解電鍍或電解電鍍之方法;藉由網版印刷等來印刷導電性油墨之方法;藉由噴墨法來印刷導電性油墨之方法;以無電解電鍍 等來形成由銅等的金屬所構成之導電性層之方法;或是藉由蒸鍍或濺鍍等來形成導電性層,並於該上方形成光阻膜,然後進行曝光、顯影、導電性層的蝕刻、光阻層去除而得之方法;貼合銅箔等之金屬箔,然後於該上方形成光阻膜,然後進行曝光、顯影、金屬箔的蝕刻、光阻層去除而得之方法等之一般所知的方法。當中,較佳為可容易使構成光穿透性的感測器部及光穿透性的虛設部之網目狀金屬圖案達到細微化之銀鹽擴散轉印法。使用銀鹽擴散轉印法之方法,例如有記載於日本特開2003-77350號公報和日本特開2005-250169號公報者。以此等手法所製作之網目狀金屬圖案之細線的厚度,較佳為0.05至5μm,尤佳為0.1至1μm。 A method of forming a light transmissive sensor portion, a light transmissive dummy portion, a terminal portion, a peripheral wiring portion, and a ground portion by using a metal pattern, and using a silver salt photosensitive material to obtain a silver image a method of further applying electroless plating or electrolytic plating to a silver image obtained by the same method; a method of printing a conductive ink by screen printing or the like; and a method of printing a conductive ink by an inkjet method; Electroless plating a method of forming a conductive layer made of a metal such as copper; or forming a conductive layer by vapor deposition or sputtering, forming a photoresist film thereon, and then performing exposure, development, and conductivity; a method of etching a layer and removing a photoresist layer; bonding a metal foil such as a copper foil, and then forming a photoresist film thereon, and then performing exposure, development, etching of the metal foil, and removal of the photoresist layer A method generally known. Among them, a silver salt diffusion transfer method in which the mesh-like metal pattern constituting the light-transmitting sensor portion and the light-transmitting dummy portion is easily made fine is preferable. The method of using the silver salt diffusion transfer method is described, for example, in JP-A-2003-77350 and JP-A-2005-250169. The thickness of the fine line of the mesh-like metal pattern produced by such a method is preferably 0.05 to 5 μm, particularly preferably 0.1 to 1 μm.
當本發明之光穿透性導電材料所具有之光穿透性的感測器部及光穿透性的虛設部具有由金屬細線所形成之網目狀金屬圖案時,網目狀金屬圖案較佳係具有將複數個單位格子配置為網目狀的幾何學形狀。單位格子的形狀,例如可列舉出組合有正三角形、等腰三角形、直角三角形等之三角形,正方形、長方形、菱形、平行四邊形、梯形等之四角形,六角形、八角形、十二角形、二十角形等之n角形,星形等之形狀,此外,可列舉出此等形狀的單獨重複,或是2種以上的複數種形狀之組合。當中,單位格子的形狀較佳為正方形或菱形。此外,以沃羅諾伊(Voronoi)圖形或德洛涅(Delaunay)圖形、潘洛斯(Penrose)圖形等為代表之不規則幾何學形狀,亦為本發明之較佳網目 狀金屬圖案的形狀之一。 When the light transmissive sensor portion and the light transmissive dummy portion of the light transmissive conductive material of the present invention have a mesh metal pattern formed of thin metal wires, the mesh metal pattern is preferably There is a geometric shape in which a plurality of unit lattices are arranged in a mesh shape. The shape of the unit lattice may be, for example, a triangle in which an equilateral triangle, an isosceles triangle, a right triangle, or the like is combined, a square shape of a square, a rectangle, a rhombus, a parallelogram, a trapezoid, or the like, a hexagon, an octagon, a dodecagonal, and a twenty. The shape of an n-angle such as an angle, a star shape, or the like may be a single repetition of these shapes or a combination of two or more plural shapes. Among them, the shape of the unit lattice is preferably a square or a diamond. In addition, irregular geometric shapes represented by Voronoi graphics or Delaunay graphics, Penrose graphics, etc., are also preferred meshes of the present invention. One of the shapes of the metal pattern.
構成光穿透性的感測器部及光穿透性的虛設部之金屬線的線寬較佳為20μm以下,尤佳為1至10μm。此外,單位格子的重複間隔較佳為600μm以下,尤佳為400μm以下。單位格子的重複間隔的下限為50μm。光穿透性的感測器部及光穿透性的虛設部之開口率,較佳為85%以上,尤佳為88至99%。 The line width of the metal line constituting the light transmissive sensor portion and the light transmissive dummy portion is preferably 20 μm or less, and more preferably 1 to 10 μm. Further, the repeating interval of the unit lattice is preferably 600 μm or less, and particularly preferably 400 μm or less. The lower limit of the repetition interval of the unit lattice is 50 μm. The aperture ratio of the light transmissive sensor portion and the light transmissive dummy portion is preferably 85% or more, and particularly preferably 88 to 99%.
本發明之光穿透性導電材料所具有之光穿透性的虛設部,係以降低光穿透性的感測器部之辨視性者為目的而應用,光穿透性的虛設部,未與端子部電性連接。如前述般,當使用ITO導電膜作為感測器部時,可僅將無ITO導電膜之部分構成為虛設部,但當以金屬細線來形成感測器部時,於虛設部上未設置任何細線時,感測器部會變得顯眼,所以亦將金屬細線的圖案形成於虛設部,藉此可減少感測器部與虛設部之辨視上的差距,而降低感測器部的辨視性。然而,當以金屬細線來形成虛設部時,會產生導電性,所以須於感測器部與虛設部之間至少設置不存在導電部分之絕緣部分以斷絕電性連接。該絕緣部分,可容易地在金屬細線上設置斷線部分而形成。斷線部分的長度較佳為30μm以下,尤佳為3至15μm,更佳為5至12μm。此外,於虛設部的內部,較佳亦設置複數個斷線部分。藉此可得到作為感測器時的感度優異之光穿透性導電材料。此外,虛設部,由於以降低感測器部的辨視性者為目的,故較佳係由與感測器部相同形狀之單位格子所構 成,亦可構成為由一部分形成斷線之單位格子所構成斷線方格。設置斷線方格之方法,可為以與構成單位格子之金屬細線正交之方式,於方格的一部分設置斷線部,或是設置使構成單位格子之金屬細線斜向地斷線之斷線部。虛設部之金屬細線的線寬,較佳與感測器部之金屬細線的線寬相同,或是更粗相當於虛設部之斷線部分的面積之量。虛設部之斷線部分的長度較佳為30μm以下,尤佳為3至15μm。此外,感測器部與虛設部之總透光率的差,較佳為1%以內。 The imaginary portion of the light-transmitting property of the light-transmitting conductive material of the present invention is applied for the purpose of improving the visibility of the sensor portion for reducing light transmittance, and the imaginary portion of the light-transmitting property is Not electrically connected to the terminal. As described above, when an ITO conductive film is used as the sensor portion, only a portion of the ITO-free conductive film may be formed as a dummy portion, but when the sensor portion is formed by a thin metal wire, no dummy portion is provided. In the case of a thin line, the sensor portion becomes conspicuous, so the pattern of the thin metal wires is also formed in the dummy portion, thereby reducing the difference in the discrimination between the sensor portion and the dummy portion, and reducing the discrimination of the sensor portion. Visual. However, when the dummy portion is formed by the thin metal wires, electrical conductivity is generated, so that at least an insulating portion where the conductive portion is not present is provided between the sensor portion and the dummy portion to cut off the electrical connection. The insulating portion can be easily formed by providing a broken portion on the thin metal wire. The length of the broken portion is preferably 30 μm or less, more preferably 3 to 15 μm, still more preferably 5 to 12 μm. Further, in the interior of the dummy portion, a plurality of broken portions are preferably provided. Thereby, a light-transmitting conductive material excellent in sensitivity when used as a sensor can be obtained. In addition, since the dummy portion is intended to reduce the visibility of the sensor portion, it is preferably constructed by a unit lattice having the same shape as the sensor portion. Alternatively, it may be configured as a broken square formed by a unit lattice in which a part of the broken line is formed. The method of setting the broken squares may be such that a broken line portion is provided in a part of the square in a manner orthogonal to the thin metal lines constituting the unit lattice, or a metal wire constituting the unit lattice is obliquely broken. Line department. The line width of the thin metal wires of the dummy portion is preferably the same as the line width of the thin metal wires of the sensor portion, or is thicker than the area of the broken portion of the dummy portion. The length of the broken portion of the dummy portion is preferably 30 μm or less, and more preferably 3 to 15 μm. Further, the difference in total light transmittance between the sensor portion and the dummy portion is preferably within 1%.
本發明中,端子部係與連接於光穿透性的感測器部之周邊配線連接,藉由將FPC配線等接合於該端子部而連接於IC電路,而具有將光穿透性的感測器部上所接收之靜電電容資訊傳送至IC電路之功能。端子部所具有之複數個端子的形狀,可使用長方形、圓角長方形、圓、橢圓等之一般所知的形狀。 In the present invention, the terminal portion is connected to the peripheral wiring of the sensor portion connected to the light transmissive portion, and is connected to the IC circuit by bonding the FPC wiring or the like to the terminal portion, thereby having a feeling of penetrating light. The function of the electrostatic capacitance received on the detector unit is transmitted to the IC circuit. The shape of the plurality of terminals included in the terminal portion can be a generally known shape such as a rectangle, a rounded rectangle, a circle, or an ellipse.
本發明之光穿透性導電材料,於具有光穿透性的感測器部、光穿透性的虛設部等之一側的面上,或是該相反側的面上,可具有硬塗層、抗反射層、黏著層、防眩層等之一般所知的層。 The light-transmitting conductive material of the present invention may have a hard coat on a surface on one side of a light transmissive sensor portion, a light transmissive dummy portion, or the like. A layer generally known as a layer, an antireflection layer, an adhesive layer, an antiglare layer, or the like.
以下係使用實施例來詳細地說明本發明,但只要不超越該主旨,本發明不限定於下述實施例。 Hereinafter, the present invention will be described in detail by way of examples. However, the invention is not limited to the embodiments described below.
使用厚度100μm的聚對苯二甲酸乙二酯膜作為支撐體。該支撐體的總透光率為91%。 A polyethylene terephthalate film having a thickness of 100 μm was used as a support. The total light transmittance of the support was 91%.
接著依據下述配方來調製物理顯影核心層塗布液,將此塗布於支撐體上並進行乾燥而設置物理顯影核心層。 Next, the physical development core layer coating liquid was prepared according to the following formulation, and this was applied onto a support and dried to provide a physical development core layer.
一邊攪拌並混合A液與B液,於30分鐘後通過充填有離子交換樹脂之管柱而得硫化鈀溶膠。 While stirring the A liquid and the B liquid, the palladium sulfide sol was obtained by a column packed with an ion exchange resin after 30 minutes.
接著從靠近支撐體者開始,依序將下述組成的中間層、鹵化銀乳劑層、及保護層塗布於上述物理顯影核心層上,進行乾燥而得銀鹽感光材料。鹵化銀乳劑,係藉由照片用鹵化銀乳劑之一般的雙噴注混合法來製造。該鹵化銀乳劑,係以成為氯化銀95莫耳%與溴化銀5莫耳%,且平均粒徑0.15μm的方式來調製。將如此得到之鹵化銀乳劑,依循既定方法,使用硫代硫酸鈉與氯金酸來施以硫化金增感。如此得到之鹵化銀乳劑,每1g的銀係含有0.5g的明膠。 Next, an intermediate layer having the following composition, a silver halide emulsion layer, and a protective layer are sequentially applied onto the physical development core layer from the vicinity of the support, and dried to obtain a silver salt photosensitive material. The silver halide emulsion is produced by a general double jet mixing method using a silver halide emulsion for photographs. The silver halide emulsion was prepared so as to have 95% by mole of silver chloride and 5 % by mole of silver bromide, and an average particle diameter of 0.15 μm. The silver halide emulsion thus obtained was subjected to sulfurized gold sensitization using sodium thiosulfate and chloroauric acid according to a predetermined method. The silver halide emulsion thus obtained contained 0.5 g of gelatin per 1 g of silver.
將如此得到之銀鹽感光材料與具有第1圖的圖案之正型穿透圖稿密合,藉由以汞燈為光源之密合印刷機,經過會濾除400nm以下的光之樹脂濾鏡進行曝光。於具有第1圖的圖案之正型穿透圖稿中,光穿透性的感測器部11,係具有由線寬5μm、單邊300μm且較窄者的角度為60°之菱形的單位圖形所構成之網目狀圖案。光穿透 性的虛設部12,係由線寬5μm且為與光穿透性的感測器部11為相同形狀之菱形的單位圖形所構成,但在菱形之邊的中央設置長5μm的斷線部,於光穿透性的感測器部11與光穿透性的虛設部12之交界部設置長10μm的斷線部。感測器部11與虛設部12之總透光率的差為0.05%。周邊配線13與端子部14及接地部15,均由空白的線段所構成。以第3圖及第4圖來說明該正型穿透圖稿時,周邊配線部13所具有之周邊配線(13a、13b、…、13p)的線寬均為20μm,於配線的方向在x方向,該等相鄰接且呈平行的部分之配線間隔距離均為20μm。該平行的部分之配線間隔距離20μm,由於較周邊配線部13之其他平行的部分之配線間隔距離小,所以最小間隔距離A為20μm。此外,接地部15所具有之接地配線(151、15a、15b、15c、15d、15e、15f、15g、15h)的線寬均為30μm,於配線的方向在x方向,該等相鄰接且呈平行的部分之配線間隔距離均為10μm,因此,最小間隔距離B亦為10μm。(以下的例子中,周邊配線部及接地部的配線間隔距離,亦指分別在配線的方向為x方向上,配線相鄰接且呈平行的部分之值,最小間隔距離A及最小間隔距離B存在於該平行的部分)。 The silver salt photosensitive material thus obtained is closely adhered to the positive-transmission pattern having the pattern of FIG. 1 , and the resin filter that filters out light of 400 nm or less is passed through a close-contact printing machine using a mercury lamp as a light source. Exposure. In the positive-transmission pattern having the pattern of Fig. 1, the light-transmitting sensor portion 11 has a rhombic unit having a line width of 5 μm, a single side of 300 μm, and a narrower angle of 60°. A mesh pattern formed by graphics. Light penetration The dummy portion 12 is formed of a rhombic unit pattern having a line width of 5 μm and having the same shape as the light transmissive sensor portion 11, but a disconnection portion having a length of 5 μm is provided at the center of the rhombic side. A disconnection portion having a length of 10 μm is provided at a boundary portion between the light transmissive sensor portion 11 and the light transmissive dummy portion 12. The difference in total light transmittance between the sensor portion 11 and the dummy portion 12 was 0.05%. The peripheral wiring 13, the terminal portion 14 and the ground portion 15 are each constituted by a blank line segment. When the positive through pattern is described with reference to FIGS. 3 and 4, the line widths of the peripheral wirings (13a, 13b, ..., 13p) of the peripheral wiring portion 13 are both 20 μm, and the wiring direction is x. In the direction, the wiring distances of the adjacent and parallel portions are both 20 μm. The wiring interval of the parallel portions is 20 μm, and since the wiring distance of the other parallel portions of the peripheral wiring portion 13 is small, the minimum separation distance A is 20 μm. Further, the ground lines (151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, and 15h) of the ground portion 15 have a line width of 30 μm, and the wiring direction is in the x direction, and the adjacent ones are connected. The wiring intervals in the parallel portions are all 10 μm, and therefore, the minimum separation distance B is also 10 μm. (In the following example, the wiring interval distance between the peripheral wiring portion and the ground portion also refers to the value of the portion in which the wiring is adjacent and parallel in the x direction, and the minimum separation distance A and the minimum separation distance B. Exist in the parallel part).
然後將曝光後的銀鹽感光材料,於20℃浸漬在下述擴散轉印顯影液中60秒,接著在40℃的溫水中進行水洗以去除鹵化銀乳劑層、中間層、及保護層,並進行乾燥處理而得到光穿透性導電材料1。重複以上作業,而得到100片具有第1圖之形狀的金屬圖案之光穿透性導 電材料1。所得之光穿透性導電材料之金屬圖案的線寬與配線間隔距離,係與具有第1圖的圖案之正型穿透圖稿相同。此外,以共焦顯微鏡來調查構成光穿透性的感測器部11及光穿透性的虛設部12之網目狀金屬圖案之細線的厚度,及周邊配線(13a、13b、13c、…、13p)與接地配線(151、15a、15b、15c、…、15h)之金屬圖案的厚度時,任一者均為0.1μm。下述光穿透性導電材料2至8中,以共焦顯微鏡所調查之各金屬圖案的厚度時,任一者亦均為0.1μm。 Then, the exposed silver salt photosensitive material is immersed in a diffusion transfer developing solution described below at 20 ° C for 60 seconds, and then washed with water in 40 ° C of warm water to remove the silver halide emulsion layer, the intermediate layer, and the protective layer, and is carried out. The light-transmitting conductive material 1 is obtained by a drying treatment. Repeat the above operation to obtain 100 light-transmitting guides of the metal pattern having the shape of FIG. Electrical material 1. The line width of the metal pattern of the obtained light-transmitting conductive material and the wiring separation distance are the same as those of the positive type through pattern having the pattern of Fig. 1. Further, the thickness of the thin line of the mesh-like metal pattern constituting the light-transmitting sensor portion 11 and the light-transmitting dummy portion 12, and the peripheral wirings (13a, 13b, 13c, ..., 13p) When the thickness of the metal pattern of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is 0.1 μm. In the following light-transmitting conductive materials 2 to 8, the thickness of each of the metal patterns investigated by the confocal microscope was 0.1 μm.
加入水以使全量成為1000ml,並將pH調整至12.2。 Water was added to make the whole amount 1000 ml, and the pH was adjusted to 12.2.
使用於具有第1圖的圖案之正型穿透圖稿中,將接地配線(151、15a、15b、15c、…、15h)之各配線間的配線間隔距離均變更為18μm(因此,最小間隔距離B亦成為18μm),除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外其他均與光穿透性導電材料 1相同而得到100片光穿透性導電材料2。 In the positive penetration pattern having the pattern of Fig. 1, the wiring interval distance between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 18 μm (hence, the minimum interval) The distance B also becomes 18 μm), except for the other positive through-transmission artwork, except that the positive-penetrating artwork is used for exposure, and the light-transmitting conductive material is used. 1 is identical to obtain 100 pieces of light-transmitting conductive material 2.
使用於具有第1圖的圖案之正型穿透圖稿中,將接地配線(151、15a、15b、15c、…、15h)之各配線間的配線間隔距離均變更為25μm(因此,最小間隔距離B亦成為25μm),除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料3。 In the positive type penetration pattern having the pattern of Fig. 1, the wiring interval distance between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 25 μm (hence, the minimum interval) The distance B is also 25 μm), and other positive through-transmission artworks other than the above are obtained in the same manner as the light-transmitting conductive material 1 except that the positive-through penetrating artwork is used for exposure. 100 pieces of light-transmitting conductive material 3.
使用於具有第1圖的圖案之正型穿透圖稿中,接地部15所具有之接地配線中,僅留下接地配線151,其他接地配線(15a、15b、15c、…、15h)均去除,除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料4。 In the positive type through pattern having the pattern of Fig. 1, among the ground wirings provided in the ground portion 15, only the ground wiring 151 is left, and the other ground wirings (15a, 15b, 15c, ..., 15h) are removed. , except for the other positive-type penetrating artwork, except that the positive-penetrating artwork is used for exposure, the other is the same as the light-transmitting conductive material 1 to obtain 100 pieces of light penetrability. Conductive material 4.
使用於具有第1圖的圖案之正型穿透圖稿中,接地配線中,將接地配線15a、15b、15c、15d之各配線間的配線間隔距離均變更為25μm,將15d、15e、15f、15g、15h、151之各配線間的配線間隔距離均變更為18μm(因此,最小間隔距離B成為18μm),除此之外其他均相同的正型穿 透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料5。 In the positive-transmission pattern having the pattern of Fig. 1, in the ground wiring, the wiring interval between the wirings of the ground wirings 15a, 15b, 15c, and 15d is changed to 25 μm, and 15d, 15e, and 15f are used. The wiring spacing distance between the wiring lines of 15g, 15h, and 151 is changed to 18 μm (hence, the minimum separation distance B is 18 μm), and otherwise the same positive type is worn. Through the artwork, 100 sheets of the light-transmitting conductive material 5 were obtained in the same manner as the light-transmitting conductive material 1 except that the positive-transmission artwork was used for exposure.
使用於具有第1圖的圖案之正型穿透圖稿中,接地配線中,將15a與15b之間的配線間隔距離設為10μm,15b與15c之間的配線間隔距離設為14μm,15c與15d之間的配線間隔距離設為18μm,15d與15e之間的配線間隔距離設為22μm,15e與15f之間的配線間隔距離設為26μm,15f與15g之間的配線間隔距離設為30μm,15g與15h之間的配線間隔距離設為34μm,15h與151之間的配線間隔距離設為38μm,以使相鄰接之接地配線間的間隔距離從15a至151每次增加4μm之方式來變更(因此,最小間隔距離B成為10μm),除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料6。 In the positive type penetration pattern having the pattern of Fig. 1, in the ground wiring, the wiring separation distance between 15a and 15b is set to 10 μm, and the wiring separation distance between 15b and 15c is set to 14 μm, 15c and The wiring interval distance between 15d is set to 18 μm, the wiring separation distance between 15d and 15e is 22 μm, the wiring separation distance between 15e and 15f is set to 26 μm, and the wiring separation distance between 15f and 15g is set to 30 μm. The wiring separation distance between 15g and 15h is set to 34 μm, and the wiring separation distance between 15h and 151 is set to 38 μm, so that the distance between adjacent ground wirings is increased by 4 μm from 15a to 151 each time. (Thus, the minimum separation distance B becomes 10 μm), except for the other positive penetration patterns, except that the positive penetration pattern is used for exposure, and the other is transparent to the light-transmitting conductive material. 1 is identical to obtain 100 sheets of light-transmitting conductive material 6.
使用於具有第1圖的圖案之正型穿透圖稿中,周邊配線中,將13a與13b之間的配線間隔距離設為15μm,將其他周邊配線間的配線間距離均設為25μm(因此,最小間隔距離A成為25μm),並將接地配線(151、15a、15b、15c、…、15h)之各配線間的配線間隔距離均變更為20μ m(因此,最小間隔距離B亦成為20μm),除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料7。 In the positive type through pattern having the pattern of Fig. 1, in the peripheral wiring, the wiring interval between 13a and 13b is set to 15 μm, and the distance between wirings of other peripheral wirings is set to 25 μm (thus The minimum separation distance A is 25 μm), and the wiring interval between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 20 μ. m (hence, the minimum separation distance B also becomes 20 μm), except for the other positive-type penetrating artwork, except that this positive-type penetrating artwork is used for exposure, and other light penetration The conductive material 1 was identical to obtain 100 sheets of the light-transmitting conductive material 7.
使用於具有第1圖的圖案之正型穿透圖稿中,周邊配線中,將13a與13b之間的配線間隔距離設為15μm,將其他周邊配線間的配線間距離均設為25μm(因此,最小間隔距離A成為25μm),除此之外其他均相同的正型穿透圖稿,除了使用此正型穿透圖稿來進行曝光之外,其他均與光穿透性導電材料1相同而得到100片光穿透性導電材料8。 In the positive type through pattern having the pattern of Fig. 1, in the peripheral wiring, the wiring interval between 13a and 13b is set to 15 μm, and the distance between wirings of other peripheral wirings is set to 25 μm (thus , the minimum separation distance A becomes 25 μm), and otherwise the same positive penetration pattern, except that the positive penetration pattern is used for exposure, the other is the same as the light-transmitting conductive material 1 Thus, 100 sheets of light-transmitting conductive material 8 were obtained.
對於所得之光穿透性導電材料1至8,於具有第1圖的圖案之正型穿透圖稿中以處於連接有圖案之關係之感測器部11、周邊配線部13及端子部14,作為1個導電單位,並藉由測試機(Sainsonic公司製的DT9205A)測定該導電單位內之導電的有無、以及與其他導電單位間之短路的有無,在100片光穿透性導電材料內,導通係以具有全部的感測器部(11a至11p)之導電單位來確認,並評估完全無短路之光穿透性導電材料的片數作為良品率(%)。 With respect to the obtained light-transmitting conductive materials 1 to 8, the sensor portion 11, the peripheral wiring portion 13, and the terminal portion 14 which are in a pattern-connected relationship in the positive-transmission pattern having the pattern of Fig. 1 As one conductive unit, the presence or absence of conduction in the conductive unit and the presence or absence of a short circuit with other conductive units were measured by a tester (DT9205A manufactured by Sainsonic) in 100 pieces of light-transmitting conductive material. The conduction is confirmed by the conduction unit having all of the sensor portions (11a to 11p), and the number of pieces of the light-transmissive conductive material which is completely short-circuit-free is evaluated as the yield (%).
此外,以使具有光穿透性的感測器部、光穿透性的虛設部等側的面成為不與銅板接觸之朝向之方式,將所得之光穿透性導電材料1至8重疊於銅板上,進一步在銀圖像面上放置厚度100μm的聚對苯二甲酸乙二酯膜,於23℃、相對濕度50%環境下風乾1天後,使用靜電破壞試驗器(EM TEST公司製DITO ESD Simulator、前端晶片使用該公司製的DM1晶片),以下列方式進行靜電破壞測試。將靜電破壞試驗器的接地線安裝於銅板,將前端晶片部分放置在100μm的PET膜上且位於端子部14的上方,以電壓8kV進行1次靜電放射。靜電放射後,剝離PET膜,確認感測器部11的全線內以及周邊配線13的全線內之導通,以無斷線者為○,1根者為△,2根以上者為×。此等結果如表1所示。 In addition, the light-transmitting conductive materials 1 to 8 are superposed on each other such that the surface of the sensor portion having the light-transmitting property, the dummy portion of the light-transmitting property, or the like is not in contact with the copper plate. On the copper plate, a polyethylene terephthalate film having a thickness of 100 μm was further placed on the silver image surface, and air-dried at 23 ° C and a relative humidity of 50% for 1 day, and then an electrostatic breakdown tester (DITO manufactured by EM TEST Co., Ltd.) was used. The ESD Simulator and the front-end wafer were subjected to electrostatic breakdown testing in the following manner using the company's DM1 wafer. The grounding wire of the electrostatic breakdown tester was attached to a copper plate, and the front end wafer portion was placed on a 100 μm PET film and placed above the terminal portion 14, and electrostatic discharge was performed once at a voltage of 8 kV. After the electrostatic radiation, the PET film was peeled off, and the conduction in the entire line of the sensor unit 11 and the entire line of the peripheral wiring 13 was confirmed, and the number of disconnected persons was ○, the number of ones was Δ, and the number of two or more was ×. These results are shown in Table 1.
從上述表1的試驗結果中,可得知藉由本發明能夠得到良品率良好且靜電破壞少之光穿透性導電材料,能夠改善觸控面板製造時的低良率。 From the test results of the above Table 1, it can be seen that the light-transmitting conductive material having a good yield and low electrostatic breakdown can be obtained by the present invention, and the low yield during the manufacture of the touch panel can be improved.
於具有第1圖的圖案之正型穿透圖稿中,準備於光穿透性的感測器部11之部分僅以整塊圖案描繪而非以網目狀圖案描繪,且其他部分不具有圖案之圖稿。於ITO膜(東洋紡股份有限公司製300R)的ITO面上,層合厚度15μm的乾膜光阻(旭化成股份有限公司製SUNFORT系列SPG102),然後藉由以汞燈為光源之密合印刷機,不經過濾除400nm以下的光之樹脂濾鏡,使該正型穿透圖稿密合而曝光,接著一邊於30℃的1質量%碳酸鈉水溶液中搖動一邊進行40秒的顯影。接著使用ITO用蝕刻液(佐佐木化學藥品股份有限公司製S-Clean IS),於常溫下對ITO被膜進行120秒的蝕刻(另外,於蝕刻處理步驟前後設置水洗步驟),然後以噴霧吹送40℃的3質量%氫氧化鈉水溶液,藉此將乾膜光阻予以剝離去除,並進行乾燥而得到ITO的圖案膜。 In the positive type penetration pattern having the pattern of FIG. 1, the portion of the sensor portion 11 prepared for light transmittance is depicted only in a one-piece pattern instead of in a mesh pattern, and the other portions have no pattern. Artwork. A dry film photoresist (SUNFORT series SPG102 manufactured by Asahi Kasei Co., Ltd.) having a thickness of 15 μm was laminated on the ITO surface of an ITO film (300R manufactured by Toyobo Co., Ltd.), and then a compact printing machine using a mercury lamp as a light source was used. The resin filter of light having a wavelength of 400 nm or less was removed by filtration, and the positive-transmission pattern was adhered and exposed, and then developed for 40 seconds while shaking in a 1% by mass aqueous sodium carbonate solution at 30 °C. Then, an ITO etching solution (S-Clean IS manufactured by Sasaki Chemical Co., Ltd.) was used, and the ITO film was etched at room temperature for 120 seconds (in addition, a water washing step was performed before and after the etching treatment step), and then sprayed at 40 ° C by a spray. The dry film photoresist was peeled off by a 3 mass% aqueous sodium hydroxide solution, and dried to obtain a patterned film of ITO.
準備描繪出與第1圖相同之周邊配線部13、端子部14及接地部15的圖案,且其他部分為不具有圖案之正型穿透圖稿。該正型穿透圖稿中,周邊配線(13a、13b、…、13p)的線寬均設為20μm,周邊配線間的配線間距離均設為20μm(因此,最小間隔距離A亦為20μm),此外,接地配線(151、15a、15b、15c、15d、15e、15f、15g、 15h)的線寬均設為30μm,接地配線間的配線間距離均設為10μm(因此,最小間隔距離B亦為10μm)。於上述所得之ITO圖案膜之ITO側的面上,再次層合厚度15μm的乾膜光阻(旭化成股份有限公司製SUNFORT系列SPG102),然後藉由以汞燈為光源之密合印刷機,不經過濾除400nm以下的光之樹脂濾鏡,以使感測器部11與其他部分之位置關係成為與第1圖相同之方式,使該正型穿透圖稿密合而曝光,接著一邊於30℃的1質量%碳酸鈉水溶液中搖動一邊進行40秒的顯影。另外,光阻圖案之周邊配線部13、接地部15的線寬及配線間隔距離,係與正型穿透圖稿相同。接著以使固體成分塗布量成為1g/m2之方式塗布銀奈米油墨(三菱製紙股份有限公司製MU01)並乾燥,於40℃浸漬在30質量%氯化鈉水溶液1分鐘,進行水洗並乾燥。以100號的砂紙輕輕擦拭乾燥後的乾膜光阻表面後,以噴霧吹送40℃的3質量%氫氧化鈉水溶液,藉此將乾膜光阻予以剝離去除,然後進行水洗乾燥而得到光穿透性導電材料9。重複以上作業,而製作出100片光穿透性導電材料9。另外,所得之光穿透性導電材料9之周邊配線部13及接地部15的線寬、配線間隔距離,與正型穿透圖稿相同。以共焦顯微鏡來調查周邊配線(13a、13b、13c、…、13p)與接地配線(151、15a、15b、15c、…、15h)的厚度時,均為0.1μm。 It is prepared to draw a pattern of the peripheral wiring portion 13, the terminal portion 14, and the ground portion 15 which are the same as those in Fig. 1, and the other portions are positive through patterns having no pattern. In the positive penetration pattern, the line widths of the peripheral wirings (13a, 13b, ..., 13p) are both set to 20 μm, and the wiring distance between the peripheral wirings is set to 20 μm (hence, the minimum separation distance A is also 20 μm) Further, the line widths of the ground wirings (151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, and 15h) are all set to 30 μm, and the wiring distance between the ground wirings is set to 10 μm (hence, the minimum separation distance B) Also 10μm). On the ITO side surface of the ITO pattern film obtained above, a dry film photoresist having a thickness of 15 μm (SUNFORT series SPG102 manufactured by Asahi Kasei Co., Ltd.) was laminated again, and then a compact printing machine using a mercury lamp as a light source was used. The resin filter for removing light of 400 nm or less is filtered so that the positional relationship between the sensor portion 11 and the other portions is the same as that of the first embodiment, and the positive-transmission pattern is adhered and exposed, and then Development was carried out for 40 seconds while shaking in a 1% by mass aqueous sodium carbonate solution at 30 °C. Further, the line width of the peripheral wiring portion 13 and the ground portion 15 of the photoresist pattern and the wiring interval distance are the same as those of the positive through pattern. Followed by the solid coating amount becomes 1g / m 2 of coated silver nano ink of embodiment (MU01 manufactured by Mitsubishi Paper Co.) and dried at 40 ℃ immersed in 1 minute and 30 mass% aqueous sodium chloride solution, washed with water and dried . The dried dry film resist surface was lightly wiped with a 100-grit sandpaper, and then a dry film photoresist was peeled off by blowing a 3 mass% sodium hydroxide aqueous solution at 40 ° C, followed by washing with water to obtain light. Penetrating conductive material 9. The above operation was repeated to produce 100 pieces of light-transmitting conductive material 9. In addition, the line width and the wiring interval distance between the peripheral wiring portion 13 and the ground portion 15 of the obtained light-transmitting conductive material 9 are the same as those of the positive-through pattern. When the thicknesses of the peripheral wirings (13a, 13b, 13c, ..., 13p) and the ground wirings (151, 15a, 15b, 15c, ..., 15h) were investigated by a confocal microscope, they were all 0.1 μm.
準備描繪出與第1圖相同之周邊配線部13與端子部14,進一步地,僅描繪接地部15中的接地配線151(線寬30μm),且其他部分為不具有圖案之正型穿透圖稿。該正型穿透圖稿中,周邊配線(13a、13b、…、13p)的線寬均設為20μm,周邊配線間的配線間距離均設為20μm(因此,最小間隔距離A亦為20μm)。並且使用該正型穿透圖稿,來取代光穿透性導電材料9之描繪出周邊配線部13、端子部14及接地部15的圖案且其他部分為不具有圖案之正型穿透圖稿,除此之外,其他與光穿透性導電材料9相同而製作出100片光穿透性導電材料10。所得之光穿透性導電材料10之周邊配線部13的線寬、配線間隔距離、接地部15的線寬,與正型穿透圖稿相同。以共焦顯微鏡來調查周邊配線(13a、13b、13c、…、13p)與接地配線(151、15a、15b、15c、…、15h)的厚度時,任一者均為0.1μm。 It is prepared to draw the peripheral wiring portion 13 and the terminal portion 14 which are the same as those in Fig. 1, and further, only the ground wiring 151 (line width 30 μm) in the ground portion 15 is drawn, and the other portions are positive through patterns having no pattern. draft. In the positive penetration pattern, the line widths of the peripheral wirings (13a, 13b, ..., 13p) are both set to 20 μm, and the wiring distance between the peripheral wirings is set to 20 μm (hence, the minimum separation distance A is also 20 μm) . In addition, the positive-transmission artwork is used instead of the pattern of the peripheral conductive portion 13, the terminal portion 14, and the ground portion 15 of the light-transmitting conductive material 9, and the other portion is a positive-transmission artwork having no pattern. Except for this, 100 sheets of the light-transmitting conductive material 10 were produced in the same manner as the light-transmitting conductive material 9. The line width of the peripheral wiring portion 13 of the obtained light-transmitting conductive material 10, the wiring interval distance, and the line width of the ground portion 15 are the same as those of the positive-transmission pattern. When the thicknesses of the peripheral wirings (13a, 13b, 13c, ..., 13p) and the ground wirings (151, 15a, 15b, 15c, ..., 15h) were investigated by a confocal microscope, either of them was 0.1 μm.
與光穿透性導電材料1至8相同,對於光穿透性導電材料9與10進行良品率與靜電破壞進行評估試驗,而得到表2之結果。 The evaluation results of the yield and electrostatic breakdown of the light-transmitting conductive materials 9 and 10 were carried out in the same manner as the light-transmitting conductive materials 1 to 8, and the results of Table 2 were obtained.
從上述表2的試驗結果中,可得知藉由本發明能夠得到良品率良好且靜電破壞少之光穿透性導電材 料,能夠改善觸控面板製造時的低良率。 From the test results of the above Table 2, it can be seen that the light-transmitting conductive material having good yield and low electrostatic breakdown can be obtained by the present invention. It can improve the low yield of the touch panel manufacturing.
1‧‧‧光穿透性導電材料 1‧‧‧Light penetrating conductive materials
2‧‧‧支撐體 2‧‧‧Support
11、11a、11b、11c、11p‧‧‧感測器部 11, 11a, 11b, 11c, 11p‧‧‧ Sensors
12、12a、12b、12c‧‧‧虛設部 12, 12a, 12b, 12c‧‧‧ imaginary department
13‧‧‧周邊配線部 13‧‧‧Circuit wiring department
13a、13b、13c、13p‧‧‧周邊配線 13a, 13b, 13c, 13p‧‧‧ peripheral wiring
14‧‧‧端子部 14‧‧‧ Terminals
14a、14b、14c‧‧‧端子 14a, 14b, 14c‧‧‧ terminals
15‧‧‧接地部 15‧‧‧ Grounding Department
151‧‧‧接地配線 151‧‧‧ Grounding Wiring
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JP6920798B2 (en) * | 2016-08-29 | 2021-08-18 | エルジー ディスプレイ カンパニー リミテッド | Touch sensor and display device |
JP2018128877A (en) * | 2017-02-09 | 2018-08-16 | 三菱製紙株式会社 | Conductive material |
JP6815300B2 (en) | 2017-09-22 | 2021-01-20 | 三菱製紙株式会社 | Light-transmitting conductive material |
KR102611382B1 (en) | 2018-09-19 | 2023-12-07 | 삼성디스플레이 주식회사 | Touch sensing unit and display device including the same |
KR20210130333A (en) * | 2020-04-21 | 2021-11-01 | 삼성디스플레이 주식회사 | Display device and inspection method for defect of the same |
CN112750371B (en) * | 2020-12-30 | 2022-12-23 | 天马微电子股份有限公司 | Array substrate, display panel and display device |
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