TWI559189B - Optical transparent conductive material - Google Patents

Description

Light penetrating conductive material

The present invention relates to a light-transmitting conductive material that can be suitably used in a capacitive touch panel or the like.

In an electronic device such as a PDA (Personal Digital Assistant), a notebook PC, an OA device, a medical device, or a car navigation system, a touch panel is widely used as an input means in such displays.

The touch panel has optical, ultrasonic, surface-type electrostatic capacitance, projection type electrostatic capacitance type, and resistive film type depending on the position detection method. The resistive film type touch panel is configured such that a light-transmitting conductive material and a glass with a transparent conductor layer are disposed to face each other with a spacer interposed therebetween, and an electric current flows through the light-transmitting conductive material, and The configuration of the voltage in the glass to which the transparent conductor layer is attached is measured. On the other hand, in the capacitive touch panel, the light-transmitting electrode that becomes the touch sensor is used as a light-transmitting conductive material having a light-transmitting conductive layer on the support. Since the basic structure is characterized in that it has no movable portion and has high durability and high light transmittance, it can be applied to various uses. Furthermore, since the projection type capacitive touch panel can perform multiple points Synchronous detection, so it is widely used in smart phones or tablet PCs.

In the capacitive touch panel, it becomes a light-transmitting electrode (light-transmitting conductive material) of the touch sensor, and has a plurality of light-transmitting conductive portions (light-transmitting sensor portion) Therefore, excellent characteristics capable of performing multi-point synchronization detection or moving point detection can be obtained. In order to extract the signal detected by the plurality of light-transmitting sensor portions to the outside, the light-transmitting sensor portion and the terminal portion for extracting the signal to the outside are provided. A peripheral wiring portion composed of a plurality of peripheral wirings electrically connected to each other is provided. In recent years, it has been demanded to further narrow the portion other than the screen of the liquid crystal display, and it is required to narrow the area occupied by the peripheral wiring portion. Therefore, in the peripheral wiring portion, it is necessary to further refine the peripheral wiring and further narrow the interval between the peripheral wirings.

When the touch panel is manufactured, the light-transmitting sensor portion and the light-transmitting conductive material of the peripheral wiring are used in connection with other light-transmitting conductive materials, protective panels, and the like. When the line width of the peripheral wiring is refined and the interval between the peripheral wirings is narrowed, damage may occur at the time of manufacture to cause disconnection. In order to eliminate this problem, a protective film is generally attached to the surface of the light-transmitting conductive material to protect the sensor portion, peripheral wiring, and the like. Since the protective film used for the purpose is easily charged, when the surface of the light-transmitting conductive material is coated with a protective film, the electric charge carried by the protective film is easily moved to the sensor portion, and the sensor portion is charged. . Further, when the protective film is peeled off from the light-transmitting conductive material, the sensor portion is also easily charged. When the potential difference between the plurality of charged sensor portions is increased, discharge is easily generated between the peripheral wirings individually connected to the sensor portion, and the interval between the peripheral wirings is narrow. At the time, the discharge is more pronounced. When this discharge occurs, defects (static breakdown) occur in the peripheral wiring portion, and the yield at the time of manufacturing the touch panel is remarkably lowered.

In addition, when manufacturing a capacitive touch panel, two pieces of light-transmitting conductive material are bonded, and the bonded light-transmitting conductive material is connected to an FPC (flexible printed circuit board) cable. The FPC cable is connected to the controller IC, which is connected as a circuit to eliminate charging. However, in the stage before the connection of the controller IC, for example, in the assembly step or the storage step of the light-transmitting conductive material at the stage before the controller IC is connected, it is extremely difficult to eliminate the cause of the electrostatic breakdown as the peripheral wiring portion. The generation of the potential difference of the sensor portion caused by the charging.

In Patent Document 1, it is described that a protective wire that is not electrically connected to the light-transmitting conductive portion is provided beside the peripheral wiring portion in order to prevent damage of the peripheral wiring generated in the manufacturing process of the touch panel. In Patent Document 2, the content of the line width of the peripheral wiring is changed in order to improve the corrosion resistance of the metal pattern or the uniformity of the electroless plating adhesion. In Patent Document 3, in order to reduce the difference in capacitance of each wiring, it is described that the auxiliary wiring is provided and the interval between the line width of the peripheral wiring and the peripheral wiring is changed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-63467

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-206301

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-237673

Even if the method described in Patent Document 1, Patent Document 2, or Patent Document 3 is used, satisfactory results cannot be obtained for the purpose of preventing electrostatic breakdown of peripheral wiring and improving the yield of the touch panel. Accordingly, it is an object of the present invention to provide a light-transmitting conductive material capable of improving low yield in the manufacture of a touch panel.

The above problems of the present invention can basically be solved by the following light-transmitting conductive materials. The light transmissive conductive material is attached to the support body with a light transmissive sensor portion extending in a first direction, and the sensor in a second direction belonging to a direction perpendicular to the first direction a dummy portion of the light transmissive portion that is alternately arranged, a terminal portion, a peripheral wiring portion that is electrically connected to the plurality of peripheral wires of the sensor portion and the terminal portion, and a portion that is not connected to the sensor portion a plurality of ground wirings electrically connected to each other; the plurality of peripheral wirings of the peripheral wiring portion have a parallel portion between the adjacent wirings, and the plurality of ground wirings of the ground portion have In the parallel portion of the adjacent ground wiring, in the parallel portion of the peripheral wiring, the minimum separation distance between the peripheral wirings is A, and the ground wiring is the smallest in the parallel portion of the ground wiring. When the separation distance is B, A>B.

Here, in the direction in which the peripheral wiring of the peripheral wiring portion is in the direction of the wiring in the parallel portion, the direction of the wiring in the portion parallel to the ground wiring of the ground portion is preferably uniform. In addition, the wiring direction is the same as the surrounding The spacing distance between the peripheral wirings of the parallel portions of the wires is preferably the minimum spacing distance A. Further, it is preferable that the distance between the ground wirings in which the wiring directions are the same in the portions where the ground wirings are parallel is preferably smaller than the minimum separation distance A. Further, the minimum separation distance B is preferably 10 to 80% with respect to the minimum separation distance A. Further, the line width of the ground wiring is preferably equal to or greater than the line width of the peripheral wiring. Further, the ground portion is preferably composed of at least one ground wiring connected to the terminal portion and a plurality of ground wirings not connected to other portions. Further, at least one of the ground wirings preferably surrounds the light-transmitting sensor portion, the light-transmitting dummy portion, and the peripheral wiring portion at a portion other than the terminal portion.

According to the present invention, since the potential difference between the sensor portions can be eliminated and the electrostatic breakdown of the peripheral wiring is prevented, it is possible to provide a light-transmitting conductive material which can improve the low yield of the touch panel.

1‧‧‧Light penetrating conductive materials

2‧‧‧Support

11, 11a, 11b, 11c, 11p‧‧‧ Sensors

12, 12a, 12b, 12c‧‧‧ imaginary department

13‧‧‧Circuit wiring department

13a, 13b, 13c, 13p‧‧‧ peripheral wiring

14‧‧‧ Terminals

14a, 14b, 14c, 14r‧‧‧ terminals

15‧‧‧ Grounding Department

151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, 15h‧‧‧ grounding wiring

21, 22, 23, 24‧‧ ‧ line segments

221, 222, 231, 232‧ ‧ points

2211, 2221, 2311, 2321‧‧‧ vertical line

Fig. 1 is a schematic view showing an example of the light-transmitting conductive material of the present invention.

Fig. 2 is an enlarged view for explaining the positional relationship of adjacent wirings of the present invention.

Fig. 3 is an enlarged view of a peripheral wiring portion, a terminal portion, and a ground portion of the light-transmitting conductive material shown in Fig. 1.

Fig. 4(a) is an enlarged view for explaining the minimum separation distance A between the peripheral wirings, and Fig. 4(b) is for explaining the minimum separation distance between the ground wirings. An enlarged picture of B.

In the following, the present invention will be described in detail with reference to the drawings. However, the present invention can be variously modified and modified without departing from the scope of the invention, and is of course not limited to the following embodiments.

Fig. 1 is a schematic view showing an example of the light-transmitting conductive material of the present invention. The light transmissive conductive material 1 of the present invention has a light transmissive sensor portion 11 extending in a first direction (y direction in the drawing) on the support 2, and perpendicular to the first direction The second direction of the direction (the x direction in the drawing) is a dummy portion 12 of the light transmissiveness that is alternately arranged with the sensor portion 11. The sensor unit 11 is provided with a plurality of (11a, 11b, 11c, ..., 11p, etc. in the figure), and accordingly, the dummy portion 12 that is alternately arranged with the sensor portion 11 is also provided with plural numbers (in the figure) 12a, 12b, 12c, etc.). In the first drawing, the sensor portion 11 and the dummy portion 12 are simply indicated by a checkered pattern and a dot pattern in order to express such regions.

The terminal portion 14 is a portion for electrically connecting the sensor portion 11 and the outside, and corresponds to the number of the sensor portions 11 (including the terminal to which the ground wiring 151 to be described later is connected) by a plurality of terminals (14a, 14b in the drawing) , 14c, etc.). The sensor portion 11a is electrically connected to the terminal 14a through the peripheral wiring 13a, and is electrically connected to the outside through the terminal 14a, so that the change in the electrostatic capacitance sensed by the sensor portion 11 can be grasped. The dummy portion 12 is not electrically connected to the terminal 14.

The peripheral wiring 13 is formed by electrically connecting a plurality of peripheral wirings of the sensor portion 13 and the terminal 14 (13a, 13b, 13c, ..., 13p, etc.), each of the peripheral wirings is adjacent to each other, and is bent and extends in the y direction and the x direction in the drawing to connect the sensor portion 11 and the terminal 14, so that the peripheral wiring 13 has a plurality of peripheral wirings. Adjacent wiring perimeters have parallel sections. For example, in FIG. 1, between the peripheral wiring 13a and the peripheral wiring 13b adjacent thereto, there are parallel portions in the direction of the wiring in the y direction and the two directions in the x direction. The direction of the wiring of the parallel portion may be the y direction alone or the x direction alone, or may be oblique.

In the present invention, the plurality of peripheral wirings included in the peripheral wiring 13 have parallel portions between the adjacent wirings as described above. The parallel drawing will be described below using Fig. 2. Fig. 2 is an enlarged view for explaining the positional relationship of adjacent wirings of the present invention.

In Fig. 2, the line segments 21 to 24 all extend in the x direction, so that they are parallel to each other. In the line segment 22, between the points 221 to 222, the perpendicular line 2211 of the line segment 22 and the perpendicular line 2221 intersect the line segment 23. At this time, that is, when there is a portion where the line segment 22 and the line segment 23 are juxtaposed in the x direction in the figure, the line segment 22 and the line segment 23 can be said to be in an adjacent positional relationship. Further, in the line segment 23, between the points 231 to 232, the perpendicular line 2311 of the line segment 23 and the perpendicular line 2321 intersect the line segment 24. At this time, that is, when there is a portion where the line segment 23 and the line segment 24 are juxtaposed in the x direction in the figure, the line segment 23 and the line segment 24 can be said to be in an adjacent positional relationship. On the other hand, between the line segment 21 and the line segment 22, even if the vertical line is pulled out, there is no intersection area. At this time, that is, when there is no portion where the line segment 21 and the line segment 22 are juxtaposed in the x direction in the figure, the line segment 21 and the line segment 22 are not in the adjacent positional relationship. Here, even if two line segments are in a side-by-side positional relationship, when other patterns are held between them, there is When these are not adjacent. Thus, in FIG. 2, there are parallel portions between the adjacent line segments 22 and the line segments 23, and parallel portions exist between the adjacent line segments 23 and the line segments 24, and are respectively adjacent to each other. The line segment 22 of the relationship is parallel with the line segment 23 and the three segments of the line segment 24, so that these three pieces can be said to form parallel portions of the present invention. As described above, the parallel portion of the present invention can be formed only by two adjacent peripheral wirings or by three or more adjacent peripheral wirings. Further, the parallel portion only needs to exist at least at one place in the peripheral wiring portion. The definition of "adjacent connection" in the above-described invention is also synonymous with the positional relationship of the ground wiring of the ground portion.

Next, the grounding portion will be described. The light-transmitting conductive material of the present invention has a ground portion 15 that is not electrically connected to the above-described sensor portion 11.

Fig. 3 is an enlarged view of a peripheral wiring portion, a terminal portion, and a ground portion of the light-transmitting conductive material shown in Fig. 1. Further, in the third drawing, the light transmissive sensor portion 11 and the light penetrating dummy portion 12 are omitted. In the present invention, the ground portion 15 is not connected to the sensor portion 11. In the present invention, the ground wiring constituting the ground portion 15 may or may not be connected to the terminal portion 14. However, the ground portion 15 preferably has at least one ground wiring connected to the terminal portion and a plurality of ground wirings not connected to other portions. Composition. In the present embodiment, the ground portion 15 is composed of a ground wiring 151 connected to the terminal 14r and a plurality of ground wirings 15a, 15b, 15c, 15d, 15e, 15f which are not connected to other portions shown in Fig. 4(b). , 15g, 15h. In Fig. 3, the ground portion 15 has a portion which is adjacent to each other and which is parallel in the direction of the wiring in the x direction. In Figure 3, the direction of the wiring is x. In the direction, all the ground wirings in the adjacent relationship are parallel, but in the present invention, the parallel portions may be present in at least one of the ground portions.

In the third diagram, the ground wiring 151 is a wiring connected to the terminal 14r, and also surrounds the light-transmitting sensor portion 11 and the light-transmitting dummy portion 12 and the peripheral wiring portion at a place other than the terminal portion 14. 13 wiring (refer to Figure 1 above). As described above, at least one of the ground wirings is preferably provided outside the terminal portion 14, and surrounds the light transmissive sensor portion 11, the light transmissive dummy portion 12, and the peripheral wiring portion 13. Thereby, a light-transmitting conductive material which is particularly excellent in electrostatic breakdown resistance can be obtained.

In Fig. 3, the parallel portion between the plurality of peripheral wirings is the direction in which the wiring is parallel in the x direction, and the direction of the wiring is the direction parallel to the y direction. On the other hand, The parallel portion existing between the plurality of ground wirings is parallel in the direction of the wiring in the x direction, so that the direction of the wiring in the parallel portion between the plurality of peripheral wirings is parallel to the existence of the plurality of ground wirings The wiring of the part is in the same direction. In this way, the direction in which the peripheral wiring of the peripheral wiring portion is in the parallel portion is aligned with the direction of the wiring in the portion parallel to the ground wiring of the ground portion, and a light-transmitting conductive material having particularly excellent electrostatic breakdown resistance can be obtained. Therefore, it is better.

Next, the minimum separation distance of the present invention will be described using Figs. 3 and 4.

In Fig. 3, the peripheral wiring 13 is composed of peripheral wirings 13a, 13b, ..., 13p, and the peripheral wirings 13a, 13b, ..., 13p are arranged. The direction of the line is the y direction and the two directions of the x direction, and there are adjacent and parallel portions, respectively. In the parallel portions, the distance between the peripheral wirings is the narrowest (between the peripheral wirings 13a and 13b), and is displayed as D13 in Fig. 4(a). In the present invention, the wiring interval distance D13 at which the distance between the peripheral wirings is the narrowest is the minimum separation distance A. There may be a plurality of places where the distance between the peripheral wirings is the narrowest, and the distance between the wirings is the same as the distance between the peripheral wirings of the portions where the peripheral wirings are parallel (for example, in FIG. 3, the peripheral wirings 13a, 13b) The distance between each of the wirings of the ..., 13p is the same x direction, and the distance between the wirings of the portion parallel to the adjacent peripheral wiring is preferably the minimum separation distance A. Thereby, a light-transmitting conductive material excellent in electrostatic breakdown resistance can be obtained. In Fig. 3, the interval between the ground wirings is the narrowest, and is shown as D15 in Fig. 4(b). In the present invention, the wiring interval distance (the distance between the ground wirings 15g and 15h) D15 at which the distance between the ground wirings is the narrowest is the minimum separation distance B. There may be a plurality of D15s at the narrowest distance between the ground wirings. Further, in the present invention, the minimum separation distance A between the peripheral wirings and the minimum separation distance B between the ground wirings are in the relationship of A>B. By maintaining this relationship, a light-transmitting conductive material capable of improving the low yield due to electrostatic breakdown can be obtained. Further, the minimum separation distance B between the ground wirings is preferably 10 to 80% with respect to the minimum separation distance A between the peripheral wirings.

In the present invention, the line width of the peripheral wiring constituting the peripheral wiring portion is preferably 5 to 200 μm, and more preferably 10 to 100 μm. The length of the peripheral wiring varies depending on the screen size of the touch panel. Usually, The range is from 1 to 1000 mm. On the other hand, the distance between the peripheral wirings of the peripheral wiring portions is preferably 5 to 150 μm, more preferably 10 to 70 μm, particularly preferably 10 to 50 μm. By adjusting the distance between the line width of the peripheral wiring and the peripheral wiring, it is possible to further narrow the portion other than the screen of the liquid crystal display. The line width of the ground wiring constituting the ground portion is preferably the same as or thicker than the line width of the peripheral wiring constituting the peripheral wiring portion. Thereby, a light-transmitting conductive material excellent in electrostatic breakdown resistance can be obtained. Further, as described above, the minimum separation distance B between the ground wirings is smaller than the minimum separation distance A between the peripheral wirings, but the wiring direction is the spacing distance between the ground wirings in which the ground wirings are parallel (for example, in the third In the figure and Fig. 4, it is preferable that the directions of the wirings of the ground wiring 151 and the ground wirings 15a to 15h are the same x direction and the distance between the wirings of the portions parallel to the adjacent ground wirings. Both are smaller than the minimum separation distance A between the peripheral wirings. Further, in the case where the condition is satisfied, the distance between the ground wirings is preferably 5 to 150 μm, particularly preferably 5 to 50 μm. The wiring intervals of the ground portions may all be the same or different. The thickness of the peripheral wiring and the ground wiring is preferably 0.05 to 10 μm, and more preferably 0.05 to 2 μm.

The support body of the light-transmitting conductive material of the present invention can preferably be made of plastic, glass, rubber, ceramics or the like. In the present invention, the support is preferably a support having a total light transmittance of 60% or more. Among the plastics, a flexible resin film is preferably used from the viewpoint of excellent handleability. Specific examples of the resin film used as the light-transmitting support include polyester resins such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), acrylic resins, and the like. Epoxy resin, fluororesin, poly Oxide resin, diacetate resin, triacetate resin, polycarbonate, polyarylate, polyvinyl chloride, polyfluorene, polyether oxime, polyimine, polyamine, polyolefin, cyclic polymerization The resin film composed of an olefin or the like preferably has a thickness of 25 to 300 μm. The support may have a generally known layer of a physical development core layer, an easy adhesion layer, an adhesive layer, and the like.

The light transmissive sensor portion of the light-transmitting conductive material of the present invention, and the imaginary portion of the light-transmitting property that is alternately arranged with the sensor portion, can be generally known to use light penetration. Conductive layer, etc. For example, a light transmissive sensor portion can be formed with an ITO (Indium Tin Oxide) conductive film, and a portion of the ITO-free conductive film can be formed as a dummy portion. Further, since it has an advantage of being more capable of improving light transmittance and flexibility than the ITO conductive film, a mesh metal pattern formed of thin metal wires can be preferably used as the light transmittance sensing. The imaginary part of the device and the light penetration. The metal used in forming the mesh-like metal pattern is preferably composed of gold, silver, copper, nickel, aluminum, and the like. In the present invention, when the same metal is used to form the light transmissive sensor portion, the light transmissive dummy portion, the terminal portion, the peripheral wiring portion, and the ground portion, the same method can be used simultaneously, so that the production is performed. The point of view of sex is better.

A method of forming a light transmissive sensor portion, a light transmissive dummy portion, a terminal portion, a peripheral wiring portion, and a ground portion by using a metal pattern, and using a silver salt photosensitive material to obtain a silver image a method of further applying electroless plating or electrolytic plating to a silver image obtained by the same method; a method of printing a conductive ink by screen printing or the like; and a method of printing a conductive ink by an inkjet method; Electroless plating a method of forming a conductive layer made of a metal such as copper; or forming a conductive layer by vapor deposition or sputtering, forming a photoresist film thereon, and then performing exposure, development, and conductivity; a method of etching a layer and removing a photoresist layer; bonding a metal foil such as a copper foil, and then forming a photoresist film thereon, and then performing exposure, development, etching of the metal foil, and removal of the photoresist layer A method generally known. Among them, a silver salt diffusion transfer method in which the mesh-like metal pattern constituting the light-transmitting sensor portion and the light-transmitting dummy portion is easily made fine is preferable. The method of using the silver salt diffusion transfer method is described, for example, in JP-A-2003-77350 and JP-A-2005-250169. The thickness of the fine line of the mesh-like metal pattern produced by such a method is preferably 0.05 to 5 μm, particularly preferably 0.1 to 1 μm.

When the light transmissive sensor portion and the light transmissive dummy portion of the light transmissive conductive material of the present invention have a mesh metal pattern formed of thin metal wires, the mesh metal pattern is preferably There is a geometric shape in which a plurality of unit lattices are arranged in a mesh shape. The shape of the unit lattice may be, for example, a triangle in which an equilateral triangle, an isosceles triangle, a right triangle, or the like is combined, a square shape of a square, a rectangle, a rhombus, a parallelogram, a trapezoid, or the like, a hexagon, an octagon, a dodecagonal, and a twenty. The shape of an n-angle such as an angle, a star shape, or the like may be a single repetition of these shapes or a combination of two or more plural shapes. Among them, the shape of the unit lattice is preferably a square or a diamond. In addition, irregular geometric shapes represented by Voronoi graphics or Delaunay graphics, Penrose graphics, etc., are also preferred meshes of the present invention. One of the shapes of the metal pattern.

The line width of the metal line constituting the light transmissive sensor portion and the light transmissive dummy portion is preferably 20 μm or less, and more preferably 1 to 10 μm. Further, the repeating interval of the unit lattice is preferably 600 μm or less, and particularly preferably 400 μm or less. The lower limit of the repetition interval of the unit lattice is 50 μm. The aperture ratio of the light transmissive sensor portion and the light transmissive dummy portion is preferably 85% or more, and particularly preferably 88 to 99%.

The imaginary portion of the light-transmitting property of the light-transmitting conductive material of the present invention is applied for the purpose of improving the visibility of the sensor portion for reducing light transmittance, and the imaginary portion of the light-transmitting property is Not electrically connected to the terminal. As described above, when an ITO conductive film is used as the sensor portion, only a portion of the ITO-free conductive film may be formed as a dummy portion, but when the sensor portion is formed by a thin metal wire, no dummy portion is provided. In the case of a thin line, the sensor portion becomes conspicuous, so the pattern of the thin metal wires is also formed in the dummy portion, thereby reducing the difference in the discrimination between the sensor portion and the dummy portion, and reducing the discrimination of the sensor portion. Visual. However, when the dummy portion is formed by the thin metal wires, electrical conductivity is generated, so that at least an insulating portion where the conductive portion is not present is provided between the sensor portion and the dummy portion to cut off the electrical connection. The insulating portion can be easily formed by providing a broken portion on the thin metal wire. The length of the broken portion is preferably 30 μm or less, more preferably 3 to 15 μm, still more preferably 5 to 12 μm. Further, in the interior of the dummy portion, a plurality of broken portions are preferably provided. Thereby, a light-transmitting conductive material excellent in sensitivity when used as a sensor can be obtained. In addition, since the dummy portion is intended to reduce the visibility of the sensor portion, it is preferably constructed by a unit lattice having the same shape as the sensor portion. Alternatively, it may be configured as a broken square formed by a unit lattice in which a part of the broken line is formed. The method of setting the broken squares may be such that a broken line portion is provided in a part of the square in a manner orthogonal to the thin metal lines constituting the unit lattice, or a metal wire constituting the unit lattice is obliquely broken. Line department. The line width of the thin metal wires of the dummy portion is preferably the same as the line width of the thin metal wires of the sensor portion, or is thicker than the area of the broken portion of the dummy portion. The length of the broken portion of the dummy portion is preferably 30 μm or less, and more preferably 3 to 15 μm. Further, the difference in total light transmittance between the sensor portion and the dummy portion is preferably within 1%.

In the present invention, the terminal portion is connected to the peripheral wiring of the sensor portion connected to the light transmissive portion, and is connected to the IC circuit by bonding the FPC wiring or the like to the terminal portion, thereby having a feeling of penetrating light. The function of the electrostatic capacitance received on the detector unit is transmitted to the IC circuit. The shape of the plurality of terminals included in the terminal portion can be a generally known shape such as a rectangle, a rounded rectangle, a circle, or an ellipse.

The light-transmitting conductive material of the present invention may have a hard coat on a surface on one side of a light transmissive sensor portion, a light transmissive dummy portion, or the like. A layer generally known as a layer, an antireflection layer, an adhesive layer, an antiglare layer, or the like.

[Examples]

Hereinafter, the present invention will be described in detail by way of examples. However, the invention is not limited to the embodiments described below.

<Production of Light Penetrating Conductive Material 1>

A polyethylene terephthalate film having a thickness of 100 μm was used as a support. The total light transmittance of the support was 91%.

Next, the physical development core layer coating liquid was prepared according to the following formulation, and this was applied onto a support and dried to provide a physical development core layer.

<Modulation of palladium sulfide sol>

While stirring the A liquid and the B liquid, the palladium sulfide sol was obtained by a column packed with an ion exchange resin after 30 minutes.

<Modulation of physical development core layer coating liquid> The amount of silver salt photosensitive material per 1 m ²

(SP-200 manufactured by Nippon Shokubai Co., Ltd.; average molecular weight 10000)

Next, an intermediate layer having the following composition, a silver halide emulsion layer, and a protective layer are sequentially applied onto the physical development core layer from the vicinity of the support, and dried to obtain a silver salt photosensitive material. The silver halide emulsion is produced by a general double jet mixing method using a silver halide emulsion for photographs. The silver halide emulsion was prepared so as to have 95% by mole of silver chloride and 5 % by mole of silver bromide, and an average particle diameter of 0.15 μm. The silver halide emulsion thus obtained was subjected to sulfurized gold sensitization using sodium thiosulfate and chloroauric acid according to a predetermined method. The silver halide emulsion thus obtained contained 0.5 g of gelatin per 1 g of silver.

<Intermediate layer composition> Silver salt photosensitive material per 1 m ²

<Silver halide emulsion layer composition> Silver salt photosensitive material per 1 m ²

<Protective layer composition> Silver salt photosensitive material per 1 m ²

The silver salt photosensitive material thus obtained is closely adhered to the positive-transmission pattern having the pattern of FIG. 1 , and the resin filter that filters out light of 400 nm or less is passed through a close-contact printing machine using a mercury lamp as a light source. Exposure. In the positive-transmission pattern having the pattern of Fig. 1, the light-transmitting sensor portion 11 has a rhombic unit having a line width of 5 μm, a single side of 300 μm, and a narrower angle of 60°. A mesh pattern formed by graphics. Light penetration The dummy portion 12 is formed of a rhombic unit pattern having a line width of 5 μm and having the same shape as the light transmissive sensor portion 11, but a disconnection portion having a length of 5 μm is provided at the center of the rhombic side. A disconnection portion having a length of 10 μm is provided at a boundary portion between the light transmissive sensor portion 11 and the light transmissive dummy portion 12. The difference in total light transmittance between the sensor portion 11 and the dummy portion 12 was 0.05%. The peripheral wiring 13, the terminal portion 14 and the ground portion 15 are each constituted by a blank line segment. When the positive through pattern is described with reference to FIGS. 3 and 4, the line widths of the peripheral wirings (13a, 13b, ..., 13p) of the peripheral wiring portion 13 are both 20 μm, and the wiring direction is x. In the direction, the wiring distances of the adjacent and parallel portions are both 20 μm. The wiring interval of the parallel portions is 20 μm, and since the wiring distance of the other parallel portions of the peripheral wiring portion 13 is small, the minimum separation distance A is 20 μm. Further, the ground lines (151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, and 15h) of the ground portion 15 have a line width of 30 μm, and the wiring direction is in the x direction, and the adjacent ones are connected. The wiring intervals in the parallel portions are all 10 μm, and therefore, the minimum separation distance B is also 10 μm. (In the following example, the wiring interval distance between the peripheral wiring portion and the ground portion also refers to the value of the portion in which the wiring is adjacent and parallel in the x direction, and the minimum separation distance A and the minimum separation distance B. Exist in the parallel part).

Then, the exposed silver salt photosensitive material is immersed in a diffusion transfer developing solution described below at 20 ° C for 60 seconds, and then washed with water in 40 ° C of warm water to remove the silver halide emulsion layer, the intermediate layer, and the protective layer, and is carried out. The light-transmitting conductive material 1 is obtained by a drying treatment. Repeat the above operation to obtain 100 light-transmitting guides of the metal pattern having the shape of FIG. Electrical material 1. The line width of the metal pattern of the obtained light-transmitting conductive material and the wiring separation distance are the same as those of the positive type through pattern having the pattern of Fig. 1. Further, the thickness of the thin line of the mesh-like metal pattern constituting the light-transmitting sensor portion 11 and the light-transmitting dummy portion 12, and the peripheral wirings (13a, 13b, 13c, ..., 13p) When the thickness of the metal pattern of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is 0.1 μm. In the following light-transmitting conductive materials 2 to 8, the thickness of each of the metal patterns investigated by the confocal microscope was 0.1 μm.

<Diffusion transfer developer composition>

Water was added to make the whole amount 1000 ml, and the pH was adjusted to 12.2.

<Production of Light Penetrating Conductive Material 2>

In the positive penetration pattern having the pattern of Fig. 1, the wiring interval distance between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 18 μm (hence, the minimum interval) The distance B also becomes 18 μm), except for the other positive through-transmission artwork, except that the positive-penetrating artwork is used for exposure, and the light-transmitting conductive material is used. 1 is identical to obtain 100 pieces of light-transmitting conductive material 2.

<Production of Light Penetrating Conductive Material 3>

In the positive type penetration pattern having the pattern of Fig. 1, the wiring interval distance between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 25 μm (hence, the minimum interval) The distance B is also 25 μm), and other positive through-transmission artworks other than the above are obtained in the same manner as the light-transmitting conductive material 1 except that the positive-through penetrating artwork is used for exposure. 100 pieces of light-transmitting conductive material 3.

<Production of Light Penetrating Conductive Material 4>

In the positive type through pattern having the pattern of Fig. 1, among the ground wirings provided in the ground portion 15, only the ground wiring 151 is left, and the other ground wirings (15a, 15b, 15c, ..., 15h) are removed. , except for the other positive-type penetrating artwork, except that the positive-penetrating artwork is used for exposure, the other is the same as the light-transmitting conductive material 1 to obtain 100 pieces of light penetrability. Conductive material 4.

<Production of Light Penetrating Conductive Material 5>

In the positive-transmission pattern having the pattern of Fig. 1, in the ground wiring, the wiring interval between the wirings of the ground wirings 15a, 15b, 15c, and 15d is changed to 25 μm, and 15d, 15e, and 15f are used. The wiring spacing distance between the wiring lines of 15g, 15h, and 151 is changed to 18 μm (hence, the minimum separation distance B is 18 μm), and otherwise the same positive type is worn. Through the artwork, 100 sheets of the light-transmitting conductive material 5 were obtained in the same manner as the light-transmitting conductive material 1 except that the positive-transmission artwork was used for exposure.

<Production of Light Penetrating Conductive Material 6>

In the positive type penetration pattern having the pattern of Fig. 1, in the ground wiring, the wiring separation distance between 15a and 15b is set to 10 μm, and the wiring separation distance between 15b and 15c is set to 14 μm, 15c and The wiring interval distance between 15d is set to 18 μm, the wiring separation distance between 15d and 15e is 22 μm, the wiring separation distance between 15e and 15f is set to 26 μm, and the wiring separation distance between 15f and 15g is set to 30 μm. The wiring separation distance between 15g and 15h is set to 34 μm, and the wiring separation distance between 15h and 151 is set to 38 μm, so that the distance between adjacent ground wirings is increased by 4 μm from 15a to 151 each time. (Thus, the minimum separation distance B becomes 10 μm), except for the other positive penetration patterns, except that the positive penetration pattern is used for exposure, and the other is transparent to the light-transmitting conductive material. 1 is identical to obtain 100 sheets of light-transmitting conductive material 6.

<Production of Light Penetrating Conductive Material 7>

In the positive type through pattern having the pattern of Fig. 1, in the peripheral wiring, the wiring interval between 13a and 13b is set to 15 μm, and the distance between wirings of other peripheral wirings is set to 25 μm (thus The minimum separation distance A is 25 μm), and the wiring interval between the wirings of the ground wirings (151, 15a, 15b, 15c, ..., 15h) is changed to 20 μ. m (hence, the minimum separation distance B also becomes 20 μm), except for the other positive-type penetrating artwork, except that this positive-type penetrating artwork is used for exposure, and other light penetration The conductive material 1 was identical to obtain 100 sheets of the light-transmitting conductive material 7.

<Production of Light Penetrating Conductive Material 8>

In the positive type through pattern having the pattern of Fig. 1, in the peripheral wiring, the wiring interval between 13a and 13b is set to 15 μm, and the distance between wirings of other peripheral wirings is set to 25 μm (thus , the minimum separation distance A becomes 25 μm), and otherwise the same positive penetration pattern, except that the positive penetration pattern is used for exposure, the other is the same as the light-transmitting conductive material 1 Thus, 100 sheets of light-transmitting conductive material 8 were obtained.

"Evaluation test of yield rate"

With respect to the obtained light-transmitting conductive materials 1 to 8, the sensor portion 11, the peripheral wiring portion 13, and the terminal portion 14 which are in a pattern-connected relationship in the positive-transmission pattern having the pattern of Fig. 1 As one conductive unit, the presence or absence of conduction in the conductive unit and the presence or absence of a short circuit with other conductive units were measured by a tester (DT9205A manufactured by Sainsonic) in 100 pieces of light-transmitting conductive material. The conduction is confirmed by the conduction unit having all of the sensor portions (11a to 11p), and the number of pieces of the light-transmissive conductive material which is completely short-circuit-free is evaluated as the yield (%).

"Evaluation Test of Electrostatic Disruption"

In addition, the light-transmitting conductive materials 1 to 8 are superposed on each other such that the surface of the sensor portion having the light-transmitting property, the dummy portion of the light-transmitting property, or the like is not in contact with the copper plate. On the copper plate, a polyethylene terephthalate film having a thickness of 100 μm was further placed on the silver image surface, and air-dried at 23 ° C and a relative humidity of 50% for 1 day, and then an electrostatic breakdown tester (DITO manufactured by EM TEST Co., Ltd.) was used. The ESD Simulator and the front-end wafer were subjected to electrostatic breakdown testing in the following manner using the company's DM1 wafer. The grounding wire of the electrostatic breakdown tester was attached to a copper plate, and the front end wafer portion was placed on a 100 μm PET film and placed above the terminal portion 14, and electrostatic discharge was performed once at a voltage of 8 kV. After the electrostatic radiation, the PET film was peeled off, and the conduction in the entire line of the sensor unit 11 and the entire line of the peripheral wiring 13 was confirmed, and the number of disconnected persons was ○, the number of ones was Δ, and the number of two or more was ×. These results are shown in Table 1.

From the test results of the above Table 1, it can be seen that the light-transmitting conductive material having a good yield and low electrostatic breakdown can be obtained by the present invention, and the low yield during the manufacture of the touch panel can be improved.

<Production of Light Penetrating Conductive Material 9>

In the positive type penetration pattern having the pattern of FIG. 1, the portion of the sensor portion 11 prepared for light transmittance is depicted only in a one-piece pattern instead of in a mesh pattern, and the other portions have no pattern. Artwork. A dry film photoresist (SUNFORT series SPG102 manufactured by Asahi Kasei Co., Ltd.) having a thickness of 15 μm was laminated on the ITO surface of an ITO film (300R manufactured by Toyobo Co., Ltd.), and then a compact printing machine using a mercury lamp as a light source was used. The resin filter of light having a wavelength of 400 nm or less was removed by filtration, and the positive-transmission pattern was adhered and exposed, and then developed for 40 seconds while shaking in a 1% by mass aqueous sodium carbonate solution at 30 °C. Then, an ITO etching solution (S-Clean IS manufactured by Sasaki Chemical Co., Ltd.) was used, and the ITO film was etched at room temperature for 120 seconds (in addition, a water washing step was performed before and after the etching treatment step), and then sprayed at 40 ° C by a spray. The dry film photoresist was peeled off by a 3 mass% aqueous sodium hydroxide solution, and dried to obtain a patterned film of ITO.

It is prepared to draw a pattern of the peripheral wiring portion 13, the terminal portion 14, and the ground portion 15 which are the same as those in Fig. 1, and the other portions are positive through patterns having no pattern. In the positive penetration pattern, the line widths of the peripheral wirings (13a, 13b, ..., 13p) are both set to 20 μm, and the wiring distance between the peripheral wirings is set to 20 μm (hence, the minimum separation distance A is also 20 μm) Further, the line widths of the ground wirings (151, 15a, 15b, 15c, 15d, 15e, 15f, 15g, and 15h) are all set to 30 μm, and the wiring distance between the ground wirings is set to 10 μm (hence, the minimum separation distance B) Also 10μm). On the ITO side surface of the ITO pattern film obtained above, a dry film photoresist having a thickness of 15 μm (SUNFORT series SPG102 manufactured by Asahi Kasei Co., Ltd.) was laminated again, and then a compact printing machine using a mercury lamp as a light source was used. The resin filter for removing light of 400 nm or less is filtered so that the positional relationship between the sensor portion 11 and the other portions is the same as that of the first embodiment, and the positive-transmission pattern is adhered and exposed, and then Development was carried out for 40 seconds while shaking in a 1% by mass aqueous sodium carbonate solution at 30 °C. Further, the line width of the peripheral wiring portion 13 and the ground portion 15 of the photoresist pattern and the wiring interval distance are the same as those of the positive through pattern. Followed by the solid coating amount becomes 1g / m ² of coated silver nano ink of embodiment (MU01 manufactured by Mitsubishi Paper Co.) and dried at 40 ℃ immersed in 1 minute and 30 mass% aqueous sodium chloride solution, washed with water and dried . The dried dry film resist surface was lightly wiped with a 100-grit sandpaper, and then a dry film photoresist was peeled off by blowing a 3 mass% sodium hydroxide aqueous solution at 40 ° C, followed by washing with water to obtain light. Penetrating conductive material 9. The above operation was repeated to produce 100 pieces of light-transmitting conductive material 9. In addition, the line width and the wiring interval distance between the peripheral wiring portion 13 and the ground portion 15 of the obtained light-transmitting conductive material 9 are the same as those of the positive-through pattern. When the thicknesses of the peripheral wirings (13a, 13b, 13c, ..., 13p) and the ground wirings (151, 15a, 15b, 15c, ..., 15h) were investigated by a confocal microscope, they were all 0.1 μm.

<Production of Light Penetrating Conductive Material 10>

It is prepared to draw the peripheral wiring portion 13 and the terminal portion 14 which are the same as those in Fig. 1, and further, only the ground wiring 151 (line width 30 μm) in the ground portion 15 is drawn, and the other portions are positive through patterns having no pattern. draft. In the positive penetration pattern, the line widths of the peripheral wirings (13a, 13b, ..., 13p) are both set to 20 μm, and the wiring distance between the peripheral wirings is set to 20 μm (hence, the minimum separation distance A is also 20 μm) . In addition, the positive-transmission artwork is used instead of the pattern of the peripheral conductive portion 13, the terminal portion 14, and the ground portion 15 of the light-transmitting conductive material 9, and the other portion is a positive-transmission artwork having no pattern. Except for this, 100 sheets of the light-transmitting conductive material 10 were produced in the same manner as the light-transmitting conductive material 9. The line width of the peripheral wiring portion 13 of the obtained light-transmitting conductive material 10, the wiring interval distance, and the line width of the ground portion 15 are the same as those of the positive-transmission pattern. When the thicknesses of the peripheral wirings (13a, 13b, 13c, ..., 13p) and the ground wirings (151, 15a, 15b, 15c, ..., 15h) were investigated by a confocal microscope, either of them was 0.1 μm.

The evaluation results of the yield and electrostatic breakdown of the light-transmitting conductive materials 9 and 10 were carried out in the same manner as the light-transmitting conductive materials 1 to 8, and the results of Table 2 were obtained.

From the test results of the above Table 2, it can be seen that the light-transmitting conductive material having good yield and low electrostatic breakdown can be obtained by the present invention. It can improve the low yield of the touch panel manufacturing.

1‧‧‧Light penetrating conductive materials

2‧‧‧Support

11, 11a, 11b, 11c, 11p‧‧‧ Sensors

12, 12a, 12b, 12c‧‧‧ imaginary department

13‧‧‧Circuit wiring department

13a, 13b, 13c, 13p‧‧‧ peripheral wiring

14‧‧‧ Terminals

14a, 14b, 14c‧‧‧ terminals

15‧‧‧ Grounding Department

151‧‧‧ Grounding Wiring

Claims (8)

A light transmissive conductive material having a light transmissive sensor portion extending in a first direction on a support, and a sense in a second direction belonging to a direction perpendicular to the first direction a dummy portion of the light transmissive portion in which the detector portions are alternately arranged, a terminal portion, a peripheral wiring portion including a plurality of peripheral wirings electrically connecting the sensor portion and the terminal portion, and the sensing portion a plurality of ground wirings electrically connected to the device portion; the peripheral wiring portion of the peripheral wiring portion has a portion parallel to the adjacent wiring, and the plurality of ground wirings of the ground portion The part has a parallel portion between the adjacent ground wirings. In the parallel portion of the peripheral wiring, the minimum separation distance between the peripheral wirings is A, and the ground wiring is in a parallel portion of the ground wiring. When the minimum separation distance is B, A>B. The light-transmitting conductive material according to the first aspect of the invention, wherein the peripheral wiring of the peripheral wiring portion is in the direction of the wiring of the parallel portion, and the wiring of the portion parallel to the ground wiring of the ground portion is aligned. The light-transmitting conductive material according to the first or second aspect of the invention, wherein the distance between the peripheral wirings of the portions in which the wiring lines are the same in the parallel direction is the minimum separation distance A. The light-transmitting conductive material according to the first or second aspect of the invention, wherein the distance between the ground wirings in which the wiring lines are in the same parallel direction is smaller than the minimum separation distance A. The light-transmitting conductive material according to claim 1 or 2, wherein the minimum separation distance B is 10 to the minimum separation distance A 80%. The light-transmitting conductive material according to claim 1 or 2, wherein the line width of the ground wiring is equal to or greater than the line width of the peripheral wiring. The light-transmitting conductive material according to claim 1 or 2, wherein the ground portion is composed of at least one ground wiring connected to the terminal portion and a plurality of ground wirings not connected to other portions. The light-transmitting conductive material according to claim 1 or 2, wherein at least one of the ground wirings surrounds the light-transmitting sensor portion and the light-transmitting dummy portion at a portion other than the terminal portion Peripheral wiring section.