JP2017033369A - Light transmissive conductive material laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable light transmissive conductive material laminate.SOLUTION: A light transmissive conductive material laminate comprises a light transmissive conductive material and a light transmissive functional material bonded together via an adhesive layer, the light transmissive conductive material having a dummy peripheral wiring section that surrounds a sensor section and peripheral wiring sections except where terminal sections are located and is not electrically connected to any of the sensor section, terminal sections, and peripheral wiring sections. An outer edge of the adhesive layer lies no less than 10 μm outside an outer edge of the dummy peripheral wiring section.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a light-transmitting conductive material laminate having excellent reliability.

  In electronic devices such as smartphones, personal digital assistants (PDAs), notebook PCs, tablet PCs, OA devices, medical devices, and car navigation systems, touch panels are widely used as input means for these displays.

  The touch panel includes an optical method, an ultrasonic method, a resistance film method, a surface capacitance method, a projection capacitance method, and the like depending on the position detection method. An electric capacity method is preferably used. A resistive touch panel has a structure in which two light-transmitting conductive materials having a light-transmitting conductive layer on a light-transmitting support are used and these light-transmitting conductive materials are arranged to face each other via a dot spacer. By applying a force to one point on the touch panel, the light-transmitting conductive layers are brought into contact with each other, and the voltage applied to each light-transmitting conductive layer is measured through the other light-transmitting conductive layer. This is to detect the added position. On the other hand, the projected capacitive touch panel has one light transmissive conductive material having two light transmissive conductive layers or two light transmissive conductive materials having one light transmissive conductive layer. This is used to detect a change in capacitance between the light-transmitting conductive layers when a finger or the like is brought close to the position, and to detect the position where the finger is brought close. The latter has excellent durability because it has no moving parts, and can detect multiple points at the same time. Therefore, the latter is particularly widely used in smartphones and tablet PCs.

  In a projected capacitive touch panel, the light-transmitting conductive layer is patterned to form a plurality of sensor units, thereby enabling simultaneous detection of multiple points and detection of moving points. In order to extract the change in capacitance detected by the sensor unit to the outside as an electrical signal, between all the sensor units of the light-transmitting conductive material and the terminal unit provided to extract the electrical signal to the outside A peripheral wiring portion composed of a plurality of peripheral wirings that electrically connect them is provided. Usually, the above-described light-transmitting conductive layer is located on the display, and the peripheral wiring portion is located outside the display, that is, a so-called frame portion. Conventionally, ITO (indium-tin oxide) has been used as the material for the light-transmitting conductive layer, and metals such as aluminum, silver, and molybdenum alloys have been used as the material for the peripheral wiring. However, since ITO has a large refractive index and a large surface reflection of light, there is a problem that the total light transmittance is reduced, and because of low flexibility, there is a problem that the ITO is cracked when bent and the electric resistance value is increased. there were.

  Many light-transmitting conductive materials having a network metal fine wire pattern as a light-transmitting conductive layer have been proposed in place of the light-transmitting conductive material having ITO as the light-transmitting conductive layer. For example, in Japanese Patent Application Laid-Open No. 2007-287994 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2007-287993 (Patent Document 2), a thin catalyst layer and a base metal layer are formed on a light-transmitting support, and on that, After forming the resist pattern, a metal layer is deposited on the resist opening by plating, and finally the base metal layer protected by the resist layer and the resist layer is removed, thereby forming a semi-additive metal wire pattern. The law is disclosed. In JP-A-2014-197531 (Patent Document 3), a photosensitive resist layer surface is formed in an arbitrary pattern with respect to a conductive material precursor having a base layer and a photosensitive resist layer in this order on a light-transmitting support. After the exposure, develop and form a resist image of the exposed pattern, and then perform electroless plating to form a mesh metal fine line pattern on the underlayer not covered with the resist image, and then remove the resist image A manufacturing method of a light-transmitting conductive material is disclosed.

  Further, as a method for producing a light-transmitting conductive material having a reticulated metal fine wire pattern, a method using a silver salt photosensitive material as a conductive material precursor is also known. For example, a light-transmitting support using a direct development method is known. JP-A-2004-221564 (Patent Document 4) discloses a method for forming a mesh-like fine metal wire pattern thereon, and JP-A-2003-77350 (Patent Document 5) and JP-A-2007-188655 (Patent Document). In Reference 6), a soluble silver salt forming agent and a reducing agent are allowed to act in an alkaline solution on a conductive material precursor having at least a physical development nucleus layer and a silver halide emulsion layer in this order on a light-transmitting support. A silver salt diffusion transfer method for forming a reticulated metal fine line pattern is disclosed.

  An adhesive layer is bonded to the surface of the light-transmitting conductive material having a mesh-like metal fine line pattern on the light-transmitting support, and the light-transmitting functional material is stuck to the surface on the side having the mesh-like metal fine wire pattern. Combined light transmissive conductive material laminates are known. For example, JP-A-2014-198811 (Patent Document 7) discloses a laminate for a touch panel having a touch panel sensor, an adhesive sheet (adhesive layer), and a protective substrate in this order. As the metal of the network-like fine metal wire pattern of the light transmissive conductive material laminate described above, noble metals such as copper and silver are preferably used, but these are generally poor in chemical stability compared to ITO. To do. For this reason, a light-transmitting conductive material laminate using a light-transmitting conductive material having a mesh-like fine metal wire pattern on a light-transmitting support and having an adhesive layer bonded thereto is formed, for example, by hydrogen sulfide in the atmosphere. In some cases, the metal constituting the fine metal wire pattern changes to a metal sulfide, and the resistance value of the network fine metal wire pattern fluctuates or changes color. In the light-transmitting conductive material laminate, the metal constituting the reticulated metal fine wire pattern is changed to metal chloride by chloride ions contained in human sweat, and the resistance value of the reticulated metal fine wire pattern varies. Or discolored. When the resistance value of the mesh metal fine line pattern fluctuates, the reliability as a touch sensor is significantly lowered. The above-mentioned hydrogen sulfide and chloride ions permeate from the side surface of the adhesive layer described above and are thought to affect the network metal fine line pattern. However, in recent years, the touch panel has become narrower from the viewpoint of design, Hydrogen and chloride ions are particularly likely to act on the reticulated metal fine wire pattern, and improvement has been demanded.

  For example, in Japanese Patent Application Laid-Open No. 2014-29671 (Patent Document 8), the conductive material for a touch panel provided with a first electrode pattern containing silver, an adhesive insulating layer, and a second electrode pattern in this order. An adhesive film is disclosed, and by using a metal corrosion inhibitor such as a triazole compound or a tetrazole compound together with an adhesive insulating material having a specific acid value in the adhesive insulating layer, occurrence of malfunction of the touch panel is suppressed. However, it was not satisfactory.

  On the other hand, in JP2015-14964A (Patent Document 9) and JP2015-69525A (Patent Document 10), improvement in the design of the touch panel (how the peripheral wiring looks in the decorative layer), In order to improve the disconnection caused by the step when the decorative layer is thickened, the peripheral wiring portion and the dummy are formed on the frame portion around the light-transmitting conductive layer patterned with the transparent conductive layer made of a transparent conductive material such as ITO. It is disclosed that a peripheral wiring portion is provided. Japanese Patent Laying-Open No. 2014-63467 (Patent Document 11) aims to protect the peripheral wiring portion from physical and thermal damage in the touch panel manufacturing process, and includes a peripheral wiring portion on the frame portion of the touch panel and a peripheral portion on the outside thereof. It is disclosed that a guard line made of metal is provided along the length direction of the peripheral wiring constituting the wiring portion.

JP 2007-287994 A JP 2007-287953 A JP 2014-197531 A JP 2004-221564 A JP 2003-77350 A JP 2007-188655 A JP 2014-198811 A JP 2014-29671 A JP2015-14964A Japanese Patent Laying-Open No. 2015-69525 JP 2014-63467 A

  An object of the present invention is to provide a light-transmitting conductive material laminate excellent in reliability.

The above object of the present invention is achieved by the following invention.
(1) A light transmissive conductive material laminate in which a light transmissive conductive material and a light transmissive functional material are bonded via an adhesive layer, wherein the light transmissive conductive material is disposed on a light transmissive support. It has at least a sensor part having a mesh-like metal fine line pattern, a terminal part, and a peripheral wiring part that electrically connects the sensor part and the terminal part, and the sensor part and the peripheral wiring part are located at locations other than the terminal part. And a dummy peripheral wiring part that is not electrically connected to any of the sensor part, the terminal part, and the peripheral wiring part, and the outer edge of the adhesive layer is 10 μm or more outside the outer edge of the dummy peripheral wiring part A light-transmitting conductive material laminate, characterized by being positioned.
(2) The light transmissive conductive material laminate according to (1) above, wherein the dummy peripheral wiring portion has a mesh-like metal fine line pattern.

  According to the present invention, a light-transmitting conductive material laminate having excellent reliability can be provided.

Schematic which shows an example of the light transmissive conductive material which comprises the light transmissive conductive material laminated body of this invention Schematic which shows another example of the light transmissive conductive material which comprises the light transmissive conductive material laminated body of this invention. Schematic showing an example in which the sensor part and the peripheral wiring part are surrounded by a part other than the terminal part by a single dummy peripheral wiring part. Schematic showing an example in which the dummy peripheral wiring part is an assembly in which metal line segments are arranged in parallel Enlarged view for explaining the angle with the peripheral wiring or ground wiring when the assembly with metal line segments arranged in parallel is used as dummy peripheral wiring Schematic showing an example when the dummy peripheral wiring part is a mesh-like metal fine line pattern Positive-type transparent original 4 used in the example

  The present invention will be described below with reference to the drawings. The light transmissive conductive material laminate of the present invention is obtained by bonding a light transmissive conductive material and a light transmissive functional material via an adhesive layer.

  The light transmissive conductive material constituting the light transmissive conductive material laminate of the present invention (hereinafter also referred to as the laminate of the present invention) will be described in detail. The light-transmitting conductive material included in the laminate of the present invention includes a sensor unit having a mesh-like metal fine line pattern on a light-transmitting support, a terminal unit, and a periphery that electrically connects the sensor unit and the terminal unit. It has at least a wiring part, and further includes a dummy peripheral wiring part that surrounds the sensor part and the peripheral wiring part at a place other than the terminal part and is not electrically connected to any of the sensor part, the terminal part, and the peripheral wiring part .

  FIG. 1 is a schematic view showing an example of a light transmissive conductive material constituting the light transmissive conductive material laminate of the present invention. In FIG. 1, the light transmissive conductive material 1 constituting the laminate of the present invention has a sensor portion 11 on a light transmissive support 2. The sensor unit 11 is formed by arranging a plurality of sensors (for example, 11a, 11b, 11c, etc.) having a mesh-like metal fine line pattern extending in the x direction in the drawing in the y direction in the drawing. Further, the light-transmitting conductive material is alternately arranged in the y direction with the aforementioned sensors 11a to 11c in order to reduce the visibility of the sensor unit 11 in the y direction in the figure, and a plurality of dummy having a mesh-like metal fine line pattern. It is preferable to have the dummy sensor part 12 comprised from the sensors 12a-12c. The dummy sensor unit 12 is not electrically connected to the sensor unit 11 and the peripheral wiring units 13 and 13 ′.

  The peripheral wiring part 13 and the peripheral wiring part 13 'are a plurality of peripheral wirings (13a, 13b, 13c, 13'a, 13'b in the figure) that electrically connect the sensor part 11, the terminal part 14 and the terminal part 14'. , 13'c, etc.). The terminal portion 14 and the terminal portion 14 ′ are portions for electrically connecting the sensor portion 11 and the outside, and are connected to a ground wiring 15 to be described later according to the number of sensors included in the sensor portion 11. It includes a plurality of terminals (including terminals 14a, 14b, 14c, 14'a, 14'b, 14'c, etc.). The sensor 11a is electrically connected to the terminal 14a and the terminal 14'a via the peripheral wiring 13a and the peripheral wiring 13'a, and the capacitance change detected by the sensor 11a is electrically transmitted through the terminal 14a and the terminal 14'a. It is taken out as a signal. The ground wiring 15 is preferably provided in order to prevent external noise from affecting the sensor unit 11, and is electrically connected to the terminal unit 14 and the terminal unit 14 '.

  In FIG. 1, dummy peripheral wiring portion 16 and dummy peripheral wiring portion 16 ′ include sensor portion 11, peripheral wiring portion 13 and peripheral wiring portion 13 ′, and ground wiring 15 at locations other than terminal portion 14 and terminal portion 14 ′. The dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are electrically connected to the sensor portion 11, the peripheral wiring portion 13 and the peripheral wiring portion 13 ′, the terminal portion 14 and the terminal portion 14 ′, and the ground wiring 15. Do not connect. The widths of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are not particularly limited, but from the viewpoint of the reliability of the laminate of the present invention, the width of these peripheral wiring portions is preferably 10 μm or more, more preferably 30 μm or more. 50 μm or more is particularly preferable. The upper limit of the width of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ is not particularly limited, but is usually limited by the size of the touch panel (the width of the frame portion) and is preferably 30 mm or less. The widths of the dummy peripheral wiring part 16 and the dummy peripheral wiring part 16 'may be uniform or non-uniform. In FIG. 1 described above, an example of the light transmissive conductive material in the case where the widths of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are uniform is shown.

  On the other hand, FIG. 2 is a schematic view showing another example of the light transmissive conductive material constituting the light transmissive conductive material laminate of the present invention, and the light transmissive property when the width of the dummy peripheral wiring portion is non-uniform. An example of the conductive material is shown. In FIG. 2, the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 'located between the terminal portion 14 and the terminal portion 14' have different line widths. Is wider. Although not shown, the dummy peripheral wiring portion 16 may have a wider line width. 1 and 2 described above are also examples in which the sensor portion and the peripheral wiring portion are surrounded by a plurality of dummy peripheral wiring portions at locations other than the terminal portions. As described above, the dummy peripheral wiring portion may be divided into a plurality of regions or may be present as a single region. FIG. 3 shows an example in which the sensor portion and the peripheral wiring portion are surrounded by portions other than the terminal portion by a single dummy peripheral wiring portion. 1 to 3, the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 'are both linear, but the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16' are curved or meandering. It may be wavy or wavy. In addition, when surrounding the sensor unit and the peripheral wiring part at a place other than the terminal part by the dummy peripheral wiring part, the total extension of the dummy peripheral wiring part is at least with respect to the peripheral length other than the terminal part of the light transmissive conductive material. It is preferably 80% or more, more preferably 95% or more. However, as will be described later, even when the shape of the dummy peripheral wiring portion is an assembly of metal line segments, if the interval between the metal line segments is 500 μm or less, the assembly of the metal line segments is used in the present invention. The dummy peripheral wiring portion formed by the above is also regarded as a continuous dummy peripheral wiring portion.

  In FIG. 1 to FIG. 3, a broken line indicates an outer edge 17 of the adhesive layer used when the light-transmitting conductive material is bonded to the light-transmitting functional material, and the broken line itself indicates the light-transmitting conductive material 1. Does not exist above. In the laminate of the present invention, the inner side of the region indicated by the outer edge 17 of the light-transmitting conductive material is covered with an adhesive layer. The outer edge 17 is located at least 10 μm outside the outer edge of the dummy peripheral wiring portion 16. If the position of the outer edge 17 is at least a position less than 10 μm from the outer edge of the dummy peripheral wiring portion 16, the reliability of the laminate of the present invention may be insufficient. Therefore, it is preferable that the outer edge 17 of the adhesive layer is located outside by 10 μm or more across the entire outer edge of the dummy peripheral wiring portion 16.

  In the present invention, the peripheral wiring section 13, the peripheral wiring section 13 ', the terminal section 14, the terminal section 14', the ground wiring 15, the dummy peripheral wiring section 16 and the dummy peripheral wiring section 16 'are the sensor section 11 and the dummy sensor section described above. Similarly to the mesh-like fine metal wire pattern that constitutes 12, it is preferably made of metal. Examples of such metals include gold, silver, copper, nickel, aluminum, and composite materials thereof. In the present invention, from the viewpoint of productivity, a mesh metal fine wire pattern, a peripheral wiring portion 13, a peripheral wiring portion 13 ', a terminal portion 14, a terminal portion 14', and a ground wiring 15 constituting the sensor portion 11 and the dummy sensor portion 12 are used. The dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are preferably all made of the same metal, and are preferably formed simultaneously from the viewpoint of productivity. The formation method is not particularly limited. For example, a method using a silver salt diffusion transfer method described in Japanese Patent Application Laid-Open No. 2003-77350 and Japanese Patent Application Laid-Open No. 2005-250169, and a silver image further obtained by using the method are used. A method of applying electroless plating, a method of printing conductive ink by screen printing, ink jet printing, etc., forming a metal layer by electroless plating, vapor deposition, sputtering, bonding of metal foil, etc., and forming a resist film thereon In addition, a known method such as exposure, development, etching, or a method of removing the resist layer can be used. In particular, it is particularly preferable to use a silver salt diffusion transfer method in which it is easy to make a fine mesh-like metal line pattern of the sensor unit 11 and the dummy sensor unit 12. Mesh-like fine metal wire pattern constituting sensor unit 11 and dummy sensor unit 12, peripheral wiring unit 13, peripheral wiring unit 13 ', terminal unit 14, terminal unit 14', ground wiring 15, dummy peripheral wiring unit 16 and dummy peripheral wiring The thickness of the metal constituting the portion 16 ′ is preferably 0.05 to 5 μm, more preferably 0.08 to 1 μm.

  The shapes of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are not particularly limited, and may be a solid pattern (a pattern in which metal exists in the entire range in the region) or a metal thin line pattern. . The larger the specific surface area of the metal constituting the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′, the higher the reliability of the laminate of the present invention can be increased. The shape of the portion 16 and the dummy peripheral wiring portion 16 'is preferably a metal fine line pattern. Examples of the metal fine line pattern include an aggregate in which metal line segments are arranged in parallel (an aggregate in which no intersection exists between the metal line segments) and a mesh-like metal fine line pattern. The interval between the metal line segments in the aggregate in which the metal line segments are arranged in parallel is preferably 10 to 500 μm from the viewpoint of the reliability of the laminate of the present invention, and more preferably 20 to 400 μm. From the viewpoint of the reliability of the laminated body of the present invention, it is particularly preferable that the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ have a mesh-like fine metal wire pattern. 1, 2, and 3 described above, an example of the light transmissive conductive material in the case where the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are solid patterns is shown.

  FIG. 4 shows an example in which the dummy peripheral wiring portion is an aggregate in which metal line segments are arranged in parallel. FIG. 5 shows an enlarged view for explaining an angle with the peripheral wiring or the ground wiring when an assembly in which metal line segments are arranged in parallel is used as a dummy peripheral wiring portion.

  In FIG. 5, the alternate long and short dash line is described for explaining the angle with the peripheral wiring or the ground wiring when an assembly in which metal line segments are arranged in parallel is used as a dummy peripheral wiring portion. It does not exist on the transparent conductive material 1. In FIG. 5, an alternate long and short dash line 100 is a line obtained by extending metal lines arranged in parallel in the dummy peripheral wiring portion 16 as it is, and a corner 18 formed between the alternate long and short dash line 100 and the ground wiring 15 and / or From the viewpoint of the reliability of the laminate of the present invention, the angle 18 ′ formed between the alternate long and short dash line 100 and the peripheral wiring constituting the peripheral wiring portion 13 is preferably 10 to 80 °. The angle is more preferably 15 to 70 °, and further preferably 20 to 60 °. The metal line segments constituting the metal fine line pattern of the dummy peripheral wiring portion 16 may be parallel to each other or non-parallel, but when they are non-parallel, the metal line segments forming the dummy peripheral wiring portion are It is preferable that 60% of the whole is within the range of the angle described above. Further, from the viewpoint of the reliability of the laminate of the present invention, it is preferable that the metal line segments constituting the metal fine line pattern of the dummy peripheral wiring portion 16 are parallel to each other. 4 and 5 described above, the light transmissive conductive material in the case where the metal line segments constituting the metal fine line pattern of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 'are parallel to each other and the angle 18 is 45 °. An example was given. It is preferable that the metal line segments constituting the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ or the metal line segments constituting the aggregate in which the metal line segments are arranged in parallel or non-parallel are 1-1000 μm, More preferably, it is 3-500 micrometers.

  FIG. 6 shows an example in which the dummy peripheral wiring portion is a mesh metal fine line pattern. It is preferable from the viewpoint of the reliability of the laminate of the present invention that the mesh-like metal fine line pattern has a geometric shape in which a plurality of unit cells are arranged in a mesh. Examples of unit cell shapes include triangles such as regular triangles, isosceles triangles, and right triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, and other squares, hexagons, octagons, dodecagons, decagons, etc. The shape which combined n square shape, star shape, etc. of these is mentioned, Moreover, the repetition of these shapes independently, or the combination of two or more types of multiple shapes is mentioned. Among them, the shape of the unit cell is preferably a square or a rhombus. Irregular geometric shapes represented by Voronoi graphics, Delaunay graphics, Penrose tile graphics, etc. are also one of the preferred mesh-like metal fine line pattern shapes. In FIG. 6, a dummy peripheral wiring portion 16 and a dummy peripheral wiring portion 16 ′ are formed using a square as a unit lattice. From the viewpoint of the reliability of the laminate of the present invention, the line width of the fine metal wires in the dummy peripheral wiring portion is preferably 1 to 1000 μm, more preferably 3 to 500 μm, and the unit cell repeat interval is 50 to 1000 μm. The following is preferable, More preferably, it is 50-600 micrometers.

  In the present invention, the mesh metal fine line pattern of the sensor unit 11 and the dummy sensor unit 12 has a geometric shape in which a plurality of unit lattices are arranged in a mesh pattern, so that the sensitivity and visibility of the sensor (the shape of the sensor can be seen). It is preferable from the standpoint of Examples of unit cell shapes include triangles such as regular triangles, isosceles triangles, and right triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, and other squares, hexagons, octagons, dodecagons, decagons, etc. The shape which combined n square shape, star shape, etc. of these is mentioned, Moreover, the repetition of these shapes independently, or the combination of two or more types of multiple shapes is mentioned. Among them, the shape of the unit cell is preferably a square or a rhombus. Irregular geometric shapes represented by Voronoi graphics, Delaunay graphics, Penrose tile graphics, etc. are also one of the preferred mesh-like metal fine line pattern shapes.

  It is preferable from a viewpoint of visibility that the line width of the thin metal wire which comprises the sensor part 11 and the dummy sensor part 12 is 20 micrometers or less, More preferably, it is 1-10 micrometers. Moreover, it is preferable from a viewpoint of the sensitivity and visibility of a sensor that the repeating space | interval of a unit cell is 50-600 micrometers, More preferably, it is 50-400 micrometers. The aperture ratio of the sensor unit 11 and the dummy sensor unit 12 is preferably 85% or more from the viewpoint of light transmittance of the laminate of the present invention, and more preferably 88 to 99%.

  In order to cut off the electrical connection between the sensor unit 11 and the dummy sensor unit 12, it is preferable that the unit cell positioned at the boundary between the sensor unit 11 and the dummy sensor unit 12 has a disconnected portion. The length of the disconnected portion is preferably 30 μm or less from the viewpoint of visibility, more preferably 3 to 15 μm, and further preferably 5 to 12 μm. In addition, it is preferable to provide a plurality of disconnections in the dummy sensor unit 12 from the viewpoint of obtaining good sensor sensitivity. From the viewpoint of visibility, the length of the broken portion inside the dummy sensor portion is preferably 30 μm or less, and more preferably 3 to 15 μm. Moreover, it is preferable that the dummy sensor part 12 consists of a unit lattice of the same shape as the sensor part 11 for the purpose of reducing the visibility of the sensor part 11. In addition, when the unit grid of the dummy sensor unit 12 includes a disconnected portion, the shape change due to the presence of the disconnected portion is not included in the shape comparison with the unit grid of the sensor unit. As a method of providing the disconnection part, a disconnection part may be provided in a part of the grid so as to be orthogonal to the fine metal wire constituting the unit grid, or a disconnection part for obliquely disconnecting the fine metal wire constituting the unit grid may be provided. It may be provided. It is preferable from the viewpoint of visibility that the line width of the fine metal wire of the dummy sensor portion 12 is thicker by the same width as the fine metal wire of the sensor portion 11 or the area corresponding to the broken portion of the dummy sensor portion 12. Moreover, it is preferable from a viewpoint of visibility that the difference of the total light transmittance of the sensor part 11 and the dummy sensor part 12 is 0 to 1%.

  In the present invention, the line width of the peripheral wiring constituting the peripheral wiring portion 13 and the peripheral wiring portion 13 ′ is preferably 5 to 200 μm, more preferably 10 to 100 μm. The length of the peripheral wiring varies depending on the screen size of the touch panel, but is generally 1 to 3000 mm. On the other hand, the shortest distance between individual peripheral wires in the peripheral wiring portion 13 and the peripheral wiring portion 13 ′ is preferably 5 to 150 μm, more preferably 10 to 70 μm, and particularly preferably 10 to 50 μm. . By adjusting the line width of the peripheral wiring and the shortest distance between the peripheral wirings, the frame portion can be made narrower. The line width of the ground wiring 15 is preferably the same as or larger than the line width of the peripheral wiring constituting the peripheral wiring portion 13 and the peripheral wiring portion 13 ′ from the viewpoint of noise resistance of the sensor of the present invention. The length of the ground wiring varies depending on the screen size of the touch panel, but is generally 5 to 6000 mm.

  In the present invention, as shown in FIG. 1 described above, the terminal portion 14 and the terminal portion 14 ′ are connected to the peripheral wiring portion 13, the peripheral wiring portion 13 ′, and the ground wiring 15. An electric signal can be transferred to the IC circuit by bonding an FPC wiring or the like to the terminal portion 14 and the terminal portion 14 'and connecting it to the IC circuit. A known shape such as a rectangle, a rounded rectangle, a circle, or an ellipse can be used as the shape of the terminals of the terminal portion 14 and the terminal portion 14 '.

  In the present invention, plastic, glass, rubber, ceramics and the like are preferably used as the light transmissive support that the light transmissive conductive material has. These light transmissive supports preferably have a total light transmittance of 60% or more. Among plastics, a resin film having flexibility is preferably used because it is easy to handle. Specific examples of the resin film used as the light transmissive support include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic resins, epoxy resins, fluororesins, silicone resins, polycarbonate resins, Examples include acetate resin, triacetate resin, polyarylate resin, polyvinyl chloride, polysulfone resin, polyether sulfone resin, polyimide resin, polyamide resin, polyolefin resin, and cyclic polyolefin resin. Moreover, it is preferable that the thickness of a resin film is 25-300 micrometers. The light-transmitting support may have a known layer such as an easy adhesion layer, a hard coat layer, an antireflection layer, an adhesive layer, or an antiglare layer.

  Further, the light-transmitting conductive material constituting the laminate of the present invention has a hard coat layer, an antireflection layer, an antiglare layer, etc. on the surface having the sensor portion, the dummy sensor portion, etc., or the opposite surface. It can have a known layer.

  Next, the light transmissive functional material constituting the laminate of the present invention will be described in detail. The light transmissive functional material constituting the present invention is composed of the above light transmissive conductive material, glass such as chemically tempered glass, soda glass, quartz glass, and alkali-free glass, and various light transmissive resins such as polyethylene terephthalate. Examples thereof include a film and a material having a known light-transmitting functional layer such as a hard coat layer, an antireflection layer, an antiglare layer, and a polarizing layer on at least one surface of the glass or film described above.

  Next, the adhesion layer which comprises the laminated body of this invention is explained in full detail. From the viewpoint of light transmittance of the laminate of the present invention, the adhesive layer preferably has a total light transmittance of 90% or more, and particularly preferably 95% or more. From the same viewpoint, the haze of the adhesive layer is preferably 0 to 3%, particularly preferably 0 to 2%. A known adhesive substance can be used for forming the adhesive layer. Specific examples include natural rubber adhesives, synthetic rubber adhesives, acrylic adhesives, urethane adhesives, and silicone adhesives. Among these, acrylic pressure-sensitive adhesives are particularly preferable from the viewpoints of reliability and light transmittance of the laminate of the present invention because they are excellent in weather resistance and transparency.

  The method for forming the pressure-sensitive adhesive layer is not limited, and a pressure-sensitive adhesive tape using an acrylic pressure-sensitive adhesive as exemplified in JP-A-9-251159, JP-A-2011-74308 and the like is formed on the light-transmitting conductive material. A method of pasting, applying a curable resin as exemplified in JP2009-48214A, JP2010-257208A, JP2012-46658A, etc. on a light-transmitting conductive material and curing The method of making it etc. can be illustrated. Both the above-mentioned adhesive tape and curable resin are commercially available. In the former case, a highly transparent adhesive transfer tape (8171CL / 8172CL / 8146-1 / 8146-2 / 8146-3 / 8146-4) manufactured by Sumitomo 3M Limited is used. Etc.), transparent adhesive sheet for optics (LUCIACS CS9621T / CS9622T / CS3623, etc.) manufactured by Nitto Denko Corporation, highly transparent double-sided tape 5400 series (5402/5405, etc.) manufactured by Sekisui Chemical Co., Ltd., optics manufactured by Lintec Corporation Adhesive sheets MO series (MO-T015, MO-3014, etc.) can be exemplified, and the latter can be exemplified by UV-curable optical transparent adhesives Loctite LOCA series (Loctit 3192, 3193, 3195, 5192 etc.) manufactured by Henkel Japan K.K. Any of these can be preferably used. .

  The thickness of the adhesive layer is not particularly limited, but if it is too thin, it may not be able to follow the irregularities on the surface of the light-transmitting conductive material and bubbles may enter, and if it is too thick, the light transmittance of the laminate of the present invention may be impaired. is there. Therefore, 5-200 micrometers is preferable, More preferably, it is 10-175 micrometers.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, this invention is not limited to a following example, unless the summary is exceeded.

<Preparation of light transmissive conductive material A>
A polyethylene terephthalate film having a thickness of 100 μm was used as the light transmissive support. The total light transmittance of this light transmissive support was 91%.

  Next, a physical development nucleus layer having the following composition was coated on a light-transmitting support and dried to provide a physical development nucleus layer.

<Preparation of palladium sulfide sol>
Liquid A Palladium chloride 5g
Hydrochloric acid 40ml
1000ml distilled water
B liquid sodium sulfide 8.6g
1000ml distilled water
Liquid A and liquid B were mixed with stirring, and 30 minutes later, the solution was passed through a column filled with an ion exchange resin to obtain palladium sulfide sol.

<Physical development nuclei layer composition / 1 m ² per>
The palladium sulfide sol 0.4mg
0.2% aqueous 2 mass% glyoxal solution
Surfactant (S-1) 4mg
Denacol EX-830 50mg
(Polyethylene glycol diglycidyl ether manufactured by Nagase ChemteX Corporation)
10 mass% SP-200 aqueous solution 0.5 mg
(Nippon Shokubai Polyethyleneimine; average molecular weight 10,000)

  Subsequently, an intermediate layer, a silver halide emulsion layer, and a protective layer having the following composition are coated on the physical development nuclei solution layer in order from the side closest to the light-transmitting support and dried. Obtained. The silver halide emulsion was prepared by a general double jet mixing method for photographic silver halide emulsions. This silver halide emulsion was prepared with 95 mol% of silver chloride and 5 mol% of silver bromide, and an average grain size of 0.15 μm. The silver halide emulsion thus obtained was subjected to gold sulfur sensitization using sodium thiosulfate and chloroauric acid according to a conventional method. The silver halide emulsion thus obtained contains 0.5 g of gelatin per gram of silver.

<Intermediate layer composition / per 1 m ² >
Gelatin 0.5g
Surfactant (S-1) 5mg
Dye 1 5mg

<Silver halide emulsion layer composition / 1m ² per>
Gelatin 0.5g
Silver halide emulsion 3.0g Silver equivalent 1-Phenyl-5-mercaptotetrazole 3mg
Surfactant (S-1) 20mg

<Protective layer composition / per 1 m ² >
1g of gelatin
Amorphous silica matting agent (average particle size 3.5μm) 10mg
Surfactant (S-1) 10mg

  The silver salt light-sensitive material 1 obtained in this way and the positive transmission original 1 made of the figure shown in FIG. 1 are brought into close contact with each other through a resin filter that cuts light of 400 nm or less with a contact printer using a mercury lamp as a light source. And exposed. In the positive-type transparent original 1, the sensor unit 11 has a mesh-like fine line pattern made of rhomboid unit cells having a line width of 5 μm, a side of 300 μm, and a narrow angle of 60 °. The dummy sensor unit 12 is composed of the same rhomboid unit cell as the sensor unit 11 described above, but has a disconnection portion having a length of 5 μm at the center of the rhombus side, and is located at the boundary between the sensor unit 11 and the dummy sensor unit 12. In the unit cell to be cut, a disconnection portion having a length of 10 μm is provided at the center of the rhombus. The difference in total light transmittance between the sensor unit 11 and the dummy sensor unit 12 is 0.05%. Peripheral wiring portion 13 and peripheral wiring portion 13 ', terminal portion 14 and terminal portion 14', and ground wiring 15 are all configured by a solid pattern. The line widths of the peripheral wirings constituting the peripheral wiring part 13 and the peripheral wiring part 13 ′ are all 20 μm, and the shortest distance between adjacent peripheral wirings is 20 μm. The line width of the ground wiring 15 is 30 μm. The dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 'are also configured by a solid pattern, and the widths of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16' are both 600 μm.

  Thereafter, the film was immersed in the following diffusion transfer developer at 20 ° C. for 60 seconds, and then the silver halide emulsion layer, intermediate layer, and protective layer were washed away with warm water at 40 ° C. and dried. In this way, a light transmissive conductive material A was obtained. As a result of observation using a confocal microscope (Latertech Co., Ltd., Optics C130), the line width and line spacing of the obtained light-transmitting conductive material A were the same as those of the positive-type transmission original 1. Further, the thickness of the mesh-like metal thin wire pattern constituting the sensor unit 11 and the dummy sensor unit 12, the peripheral wiring unit 13 and the peripheral wiring unit 13 ', the terminal unit 14 and the terminal unit 14', the ground wiring 15, and the dummy peripheral wiring unit 16 When the thickness of the dummy peripheral wiring portion 16 ′ was also examined with a confocal microscope, it was found to be 0.10 μm.

<Diffusion transfer developer composition>
Potassium hydroxide 25g
Hydroquinone 18g
1-phenyl-3-pyrazolidone 2g
Potassium sulfite 80g
N-methylethanolamine 15g
Potassium bromide 1.2g
Total volume 1000ml with water
Adjust to pH = 12.2.

<Preparation of light transmissive conductive material B>
The silver salt light-sensitive material 1 and the positive-type transmission original 2 having the figure shown in FIG. 4 were brought into close contact with each other and exposed through a resin filter that cut light of 400 nm or less with a contact printer using a mercury lamp as a light source. In the positive transparent original 2, the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 'are thin line patterns in which line segments with a line width of 30 μm and a repetition interval of 30 μm are arranged in parallel, and the parallel line segments are extended as they are. The angle 18 formed between the ground line 15 and the ground wiring 15, and the angle 18 ′ formed between the line formed by extending parallel line segments as they are and the peripheral wiring constituting the peripheral wiring portion 13. Are 45 °, and the widths of the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are both 600 μm. The positive transmission original 2 is the same as the positive transmission original 1 except that the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are provided. After the exposure, a light transmissive conductive material B was obtained in the same manner as the light transmissive conductive material A. As a result of observation using a confocal microscope, the line width and line interval of the obtained light-transmitting conductive material B were the same as those of the positive-type transmission original 2. Further, the thickness of the mesh-like metal fine line pattern constituting the sensor part 11 and the dummy sensor part 12, the peripheral wiring constituting the peripheral wiring part 13 and the peripheral wiring part 13 ', the terminal part 14 and the terminal part 14' ground wiring 15, the dummy When the thickness of the fine metal wire pattern constituting the peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ was also examined with a confocal microscope, both were 0.10 μm.

<Preparation of light transmissive conductive material C>
The silver salt photosensitive material 1 and the positive-type transparent original 3 having the figure shown in FIG. 6 were brought into close contact with each other, and exposed through a resin filter that cut light of 400 nm or less with a contact printer using a mercury lamp as a light source. In the positive-type transparent original 3, the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ have a mesh-like fine line pattern made up of a square unit grid having a line width of 10 μm and a side of 200 μm. The widths of the peripheral wiring portions 16 ′ are all 600 μm. The positive-type transparent original 3 is the same as the positive-type transparent original 1 except that the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′ are provided. After the exposure, a light transmissive conductive material C was obtained in the same manner as the light transmissive conductive material A. As a result of observation using a confocal microscope, the line width and line interval of the obtained light-transmitting conductive material C were the same as those of the positive-type transmission original 3. Further, the thickness of the mesh-like metal fine line pattern constituting the sensor part 11, the dummy sensor part 12, the dummy peripheral wiring part 16 and the dummy peripheral wiring part 16 ', the peripheral wiring and terminals constituting the peripheral wiring part 13 and the peripheral wiring part 13' When the thicknesses of the portion 14, the terminal portion 14 ', and the ground wiring 15 were similarly examined with a confocal microscope, they were all 0.10 μm.

<Preparation of light transmissive conductive material D>
The silver salt photosensitive material 1 and the positive transmission original 4 shown in FIG. 7 were brought into close contact with each other and exposed through a resin filter that cut light of 400 nm or less with a contact printer using a mercury lamp as a light source. The positive-type transparent original 4 is the same as the positive-type transparent original 1 except that it does not have the dummy peripheral wiring portion 16 and the dummy peripheral wiring portion 16 ′. After the exposure, a light transmissive conductive material D was obtained in the same manner as the light transmissive conductive material A. As a result of observation using a confocal microscope, the line width and line interval of the obtained light-transmitting conductive material D were the same as those of the positive-type transmission original 4. Further, the thickness of the mesh-like metal fine wire pattern constituting the sensor part 11 and the dummy sensor part 12, the peripheral wiring constituting the peripheral wiring part 13 and the peripheral wiring part 13 ', the thickness of the terminal part 14 and the terminal part 14', and the ground wiring 15 Were similarly examined with a confocal microscope and found to be 0.10 μm.

<Preparation of light transmissive conductive material laminates 1-4>
An optical adhesive sheet MO-T015 (adhesive layer thickness 50 μm) manufactured by Lintec Co., Ltd. is prepared, and the sensor part 11, the dummy sensor part 12, the peripheral wiring part 13 and the peripheral wiring part 13 ′ of the light-transmitting conductive material A, and the dummy periphery The wiring part 16 and the dummy peripheral wiring part 16 'are cut to a size covering them, and the sensor part 11, the dummy sensor part 12, the peripheral wiring parts 13, 13', and the dummy peripheral wiring part 16 on the light transmissive conductive material A are cut. The pressure-sensitive adhesive layer was formed by bonding so as to cover, and non-alkali glass (Eagle 2000 manufactured by Corning Japan Co., Ltd.) was further bonded to obtain a light-transmitting conductive material laminate 1. In the production of the light transmissive conductive material laminate 1 described above, the light transmissive conductive material is similarly used except that the light transmissive conductive material B or the light transmissive conductive material C is used instead of the light transmissive conductive material A. A laminate 2 and a light transmissive conductive material laminate 3 were obtained. Further, in the production of the light transmissive conductive material laminate 1 described above, a light transmissive conductive material laminate 4 was obtained in the same manner except that the light transmissive conductive material D was used instead of the light transmissive conductive material A. When the shortest distance between the outer edge of the adhesive layer of the light-transmissive conductive material laminates 1 to 3 and the outer edge of the dummy peripheral wiring portion 16 or the dummy peripheral wiring portion 16 ′ was examined with a confocal microscope, all were 20 μm. Met. Moreover, when the cross section of the transparent conductive material laminated bodies 1-4 was observed with the confocal microscope, the thickness of the adhesion layer was 50 micrometers.

<Preparation of light transmissive conductive material laminates 5 to 9>
The optical pressure-sensitive adhesive sheet is cut to be smaller than the one bonded to the light-transmitting conductive material laminate 1, and then bonded to the light-transmitting conductive material A to form an adhesive layer, and further, non-alkali glass is bonded. Thus, a light transmissive conductive material laminate 5 was obtained. Thereafter, the optical pressure-sensitive adhesive sheet to be bonded is cut into small steps step by step, respectively bonded to the light-transmissive conductive material A to form a pressure-sensitive adhesive layer, and further, alkali-free glass is bonded to the light-transmissive conductive material laminate. Body 6-9 was obtained. When the shortest distance between the outer edge of the adhesive layer of the light transmissive conductive material laminates 5 to 7 and the outer edge of the dummy peripheral wiring portion 16 was examined with a confocal microscope, they were 15 μm, 10 μm, and 5 μm, respectively. The outer edge of the adhesive layer of the light transmissive conductive material laminate 8 and the outer edge of the dummy peripheral wiring portion 16 completely overlap each other, and the shortest distance was 0 μm. In the light transmissive conductive material laminate 9, the dummy peripheral wiring portion 16 was partially exposed from the adhesive layer. When the cross sections of the light transmissive conductive material laminates 5 to 9 were observed with a confocal microscope, the thickness of the adhesive layer was 50 μm.

<Number of laminates with disconnection>
The above procedure was repeated to prepare 30 light transmissive conductive material laminates 1 to 9 each. After temporarily sealing the terminal portion 14 and the terminal portion 14 'of all the light-transmitting conductive material laminates with a masking tape, in accordance with JIS-Z2371, the salt spray tester manufactured by Suga Test Instruments Co., Ltd. And a neutral salt spray test was conducted for 72 hours. The sodium chloride concentration of the sodium chloride aqueous solution used for the test was 50 g / L, and the water temperature during the test was 35 ° C. After the test, the masking tape was peeled off, and the conduction between the corresponding terminals of the terminal portion 14 and the terminal portion 14 ′ was examined, and the light-transmitting conductive material laminate in which disconnection occurred in the sensor and / or peripheral wiring I checked the number of sheets. The results are shown in Table 1.

<Discoloration of sensor part and dummy sensor part>
Of the 30 light-transmitting conductive material laminates 1 to 9 after the neutral salt spray test described above, one arbitrarily selected sheet is formed into a mesh shape of the sensor unit and the dummy sensor unit using a confocal microscope. The presence or absence of discoloration of the fine metal line pattern was examined. The results are shown in Table 1.

<Discoloration at locations other than the sensor and dummy sensor>
Of the 30 light-transmitting conductive material laminates 1 to 9 after the neutral salt spray test described above, a dummy peripheral wiring part, a ground wiring part, And the presence or absence of discoloration of the peripheral wiring part was investigated. The results are shown in Table 1.

  From the results in Table 1, the effectiveness of the present invention can be seen.

DESCRIPTION OF SYMBOLS 1 Light transmissive conductive material 2 Light transmissive support body 11 Sensor part 11a, 11b, 11c Sensor 12 Dummy sensor part 12a, 12b, 12c Dummy sensor 13, 13 'Peripheral wiring part 13a, 13b, 13c, 13'a, 13 'B, 13'c Peripheral wiring 14, 14' Terminal portions 14a, 14b, 14c, 14'a, 14'b, 14'c Terminal 15 Ground wiring 16 Dummy peripheral wiring portion 17 Outer edge 18 corner

Claims (2)

  A light transmissive conductive material laminate in which a light transmissive conductive material and a light transmissive functional material are bonded via an adhesive layer, wherein the light transmissive conductive material is a mesh-like metal on a light transmissive support. At least a sensor part having a thin line pattern, a terminal part, and a peripheral wiring part for electrically connecting the sensor part and the terminal part, and further surrounding the sensor part and the peripheral wiring part at a place other than the terminal part, And having a dummy peripheral wiring portion that is not electrically connected to any of the sensor portion, the terminal portion, and the peripheral wiring portion, and the outer edge of the adhesive layer is located at least 10 μm outside the outer edge of the dummy peripheral wiring portion. A light transmissive conductive material laminate characterized by the above.   2. The light-transmitting conductive material laminate according to claim 1, wherein the dummy peripheral wiring portion has a mesh-like fine metal wire pattern.