TWI554868B - Apparatus, system and method for airflow monitoring and thermal management in a computing device - Google Patents

Description

Apparatus, system and method for airflow monitoring and thermal management in a computing device

The present invention relates to apparatus, systems and methods for airflow monitoring and thermal management in computing devices.

Background of the invention

The performance and capabilities of modern computing systems have increased rapidly in recent years. Many computing systems today include one or more processors, memory, wireless connectivity, and other heat producing components. The capabilities and types of modern computing systems continue to increase in number and type, which often leads to an increase in heat production because the size of the computing system continues to shrink. In addition, modern mobile computing systems are often used in a wide variety of locations and usage scenarios, which may result in computing systems being used on or near the surface of materials that may partially or completely block vents or other openings that are designed to aid heat dissipation in the system. . As a result, it is desirable to increase airflow awareness of the mobile computing device. There is thus essentially a need for techniques to dynamically monitor the airflow of a mobile computing system.

In accordance with an embodiment of the present invention, a device specifically includes a heat generating component; an air mover; and a thermal management module to monitor one or more parameters of the air mover, and based on the one or more One or more changes in the parameters indicate one or more changes to the airflow for the device, performing one or more thermal management operations.

Simple illustration

Figure 1A shows an embodiment of the first system.

Figure 1B shows an embodiment of the second system.

Figure 1C shows an embodiment of a third system.

Figure 2 shows an embodiment of a line graph.

Figure 3 shows an embodiment of a flow chart.

Figure 4 shows an embodiment of the fourth system.

Detailed description

Embodiments are generally related to techniques designed to dynamically monitor airflow of a mobile computing device. Embodiments provide a system, apparatus, and method that includes a heat generating component, an air mover, and a thermal management module to monitor one or more parameters of the air mover, and based on the one or more One or more changes in the parameter indicate one or more changes in the airflow of the device, performing one or more thermal management operations. Other embodiments and claimed patents are described.

Over time, the use of mobile computing devices is moving toward size reduction and cost reduction, and the available space for components designed to remove or reduce the heat generated by the mobile computing device is increasingly limited. Modern mobile computing devices such as tablets, handheld computing devices, smart phones, laptops, and small notebooks require effective cooling components to prevent overheating of critical system components and also reduce heat transfer to the usual skin contact with the user. Device housing. Current mobile computing devices include air movers, heat sinks or other cooling mechanisms to assist in mitigating heat generated by the heat generating components. These thermal management components may become ineffective when the user uses the mobile computing device in a new or unexpected location, which may block cooling vents or other openings, and the ever-increasing number of processing components and components continues to increase. .

Modern computing devices can be actively cooled, or can rely on an air mover such as a fan or blower to move cooling air throughout the system. If the system is placed on the user's lap or, for example, another soft place, the inlet or outlet vents of the computing device are blocked, the thermal performance of the system is compromised. Modern mobile computing devices often fail to provide an appropriate method of detecting blocked vents. In current mobile computing devices, the user may not know that the vent is clogged unless the skin or cabinet temperature rises significantly causing discomfort to the user. In various embodiments, even partially blocked vents may cause the skin temperature of the mobile computing device to increase by 5-10 degrees Celsius or above.

In one embodiment, monitoring of system airflow may be accomplished by monitoring air mover parameters to permit clogging of vents in the inspection system. In various embodiments, one or more parameters of the air mover may vary significantly when the inlet or outlet vents of the mobile computing device are significantly blocked. For example, in current systems, fan speeds that have been monitored by many systems may increase due to blocked vents. Accordingly, several embodiments described herein may utilize periodic monitoring of one or more air mover parameters to monitor airflow to the mobile computing device and to check for blocked vents. Other embodiments and claimed patents are described.

Embodiments may include one or more components. An element can contain any structure configured to perform certain operations. It is contemplated that a given set of design parameters or performance limitations may be embodied as hardware, software, or any combination thereof. Although embodiments may be illustrated by specific components in certain configurations, embodiments may also include combinations of components in alternate configurations.

It is intended that the specific features, structures, or characteristics described in connection with the embodiments of the present invention are included in the description of the embodiments. The words "in one embodiment" or "in an embodiment" are used in the context of the specification.

FIG. 1A illustrates a block diagram illustrating one embodiment of a mobile computing device 100. In various embodiments, mobile computing device 100 can include multiple nodes, elements or components. A node, element or component may generally comprise any entity or logical entity of the mobile computing device 100 and is contemplated as a given set of design parameters or performance limitations, and may be embodied as hardware, software, or any combination thereof. Although Figure 1A may show a limited number of nodes, components, and components for illustration, it is to be understood that more or fewer nodes, components, or components may be employed in a given embodiment.

In various embodiments, the mobile computing device 100 can include a tablet, a palmtop, a personal digital assistant (PDA), a cell phone, a cell phone/PDA combination, a smart phone, a laptop, a super knee. A laptop, a portable computer, a personal computer (PC), a notebook PC, a small laptop, a pager, a messaging device, a media player, a digital music player, or other suitable mobile computing device. Various embodiments include a laptop, laptop, or portable computer. Embodiments are not limited to this one.

The mobile computing device 100 can include a device that operates to form part of a wired communication system, a wireless communication system, or a combination of both. For example, mobile computing device 100 can include one or more nodes configured to communicate information over one or more types of wired communication links. Examples of wired communication links may include, but are not limited to, wires, cables, bus bars, printed circuit board (PCB) Ethernet connections, point-to-point (P2P) connections, backplanes, switch organization, semiconductor materials, twisted pairs , coaxial cable, fiber optic connection, etc. The mobile computing device 102 can also include one or more nodes configured to communicate information over one or more types of wireless communication links. Examples of wireless communication links may include, but are not limited to, radio channels, infrared channels, radio frequency (RF) channels, wireless fidelity (Wi-Fi) channels, partial RF spectrum, and/or one or more licensed or unlicensed frequency band.

The mobile computing device 100 can organize one or more standard communication information as announced by the standards organization. For example, in one embodiment, a plurality of devices 100 including a portion of a communication system can be configured to operate in accordance with one or more of the following: IEEE 802.11 standards, WiGig Alliance specifications, wireless HD specifications, standards, or variations such as wireless HD specification 1.0d7 version December 1, 2007, and the child version published by Wireless HD (collectively referred to as "Wireless HD Specification"); or any other wireless standard operation announced by other standards organizations, such as international telecommunications Alliance (ITU), International Organization for Standardization (ISO), International Electrotechnical Commission (IEC), American Society of Electrical and Electronics Engineers (Information IEEE), Internet Engineering Project Team (IETF), etc. For example, in various embodiments, the mobile computing device 102 can communicate information according to one or more of: one for a wireless local area network (WLAN) or multiple IEEE 802.11 standards such as the information IEEE 802.11 standard (1999) Edition, System-Regional Network and Metropolitan Area Network-Inter-Information Technology Telecommunications and Information Exchange-Specific Requirements, Part 11: WLAN Media Access Control (MAC) Layer and Physical Layer (PHY) Specifications), its child versions And addenda (eg 802.11a, b, g/h, j, n, VHT SG, and variants); IEEE 802.15.3 and variants; IEEE 802.16 standards for WMAN include IEEE 802.16 standards such as 802.16-2004, 802.16. 2-2004, 802.16e-2005, 802.16f and variants; WGA (WiGig) pro version and variant; European Computer Manufacturers Association (ECMA) TG20 pro version and variant; and other wireless networking standards. Embodiments are not limited to this one.

The mobile computing device 100 can communicate, manage, or process information in accordance with one or more protocols. The agreement may include a predetermined specification or set of instructions for managing communication between the plurality of nodes. In various embodiments, for example, the communication system may employ one or more protocols, such as beamforming protocols, media access control (MAC) protocols, physical layer convergence protocols (PLCP), and simple network management protocols ( SNMP), Asynchronous Transfer Mode (ATM) protocol, Frame Relay Protocol, System Network Architecture (SNA) Protocol, Transmission Control Protocol (TCP), Internet Protocol (IP), TCP/IP, X.25, Super Text Transfer Protocol (HTTP), User Data Message Protocol (UDP), Competitive Base Period (CBP) Agreement, Decentralized Competitive Base Period (CBP) Agreement, etc. In various embodiments, communication system 100 can also be configured to operate in accordance with media processing standards and/or protocols. Embodiments are not limited to this one.

In some embodiments, mobile computing device 100 can include or interface a network with a plurality of other nodes. In various embodiments, the nodes may be embodied as various types of wireless or mobile computing devices. Examples of wireless devices may include, but are not limited to, IEEE 802.15.3 piconet controller (PNC), controller, IEEE 802.11 PCP, coordinator, information station, subscriber station, station, wireless access point (AP), wireless client Devices, wireless information stations (STAs), laptops, super laptops, portable computers, personal computers (PCs), notebook PCs, tablets, palmtops, personal digital assistants (PDAs), Cell phone, community phone/PDA combination, smart phone, pager, communication device, media player, digital music player, set-top box (STB), home appliances, workstation, user terminal device, mobile unit, Consumer electronic devices, televisions, digital televisions, high-definition televisions, television receivers, high-definition television receivers, and the like.

In some embodiments, the mobile computing device 100 can include or include one or more wireless interfaces and/or components for wireless communication, such as one or more transmitters, receivers, transceivers, chipsets, amplifiers, filters Control logic, network interface card (NIC), antenna, antenna array, module, etc. Examples of conventional antennas may include, but are not limited to, internal antennas, omnidirectional antennas, monopole antennas, two-pole antennas, end-fed antennas, circularly polarized antennas, microstrip antennas, diversity antennas, dual antennas, antenna arrays, and the like.

In various embodiments, mobile computing device 100 can comprise or form part of a wireless network. For example, in some embodiments, a wireless network may include or be embodied as a variety of wireless networks and associated protocols for WPANs, wireless local area networks (WLANs), wireless metropolitan area networks, wireless wide area networks ( WWAN), broadband wireless access (BWA) network, radio network, television network, satellite network such as Direct Broadcast Satellite (DBS) network, Long Term Evolution (LTE) network and/or configuration in accordance with the implementation Any other wireless communication network operated by the example.

Although the embodiments are not limited to this context, in several embodiments, mobile computing device 100 illustrates one possible node. In various embodiments, the mobile computing device 100 can include a heat generating component 102, a memory 104, a thermal management module 106, an air mover 108, a digital display 110, a power supply 112, and a vent 124. Although FIG. 1A shows a limited number of components and arrangements for illustrative purposes, it should be understood that the mobile computing device 100 can include any number of components and arrangements while still falling within the scope of the embodiments. For example, in some embodiments, mobile computing device 100 can additionally include memory containing instructions to be executed by, for example, one or more multi-core processors. However, the embodiments are not limited to the elements or configurations shown in this figure. Additional components of the mobile computing device 100 are discussed below with reference to Figure 4 for further details.

In some embodiments, one or more of the heat generating components 102 can comprise any suitable electrical device, semiconductor device, single wafer system, or other component that can generate heat. For example, in various embodiments, one or more heat producing components 102 can include a multi-core processor. In some embodiments, one or more heat producing components 102 can include or include one or more radio modules or transmitter/receiver combinations (eg, transceivers) devices. In various embodiments, a transceiver device can include a device having a combination of both a transmitter and a receiver and sharing a common circuit or a single housing. For example, in some embodiments, the transceiver is operative to activate the wireless communication capabilities of the mobile computing device 100. Other embodiments and claimed patents are described.

In some embodiments, memory 104 can include any suitable physical device for storing data, programs, sequences of instructions, or other information on the mobile computing device 100 for temporary or permanent use. For example, the memory 104 can include, for example, an electrical or non-electrical memory, RAM, ROM, virtual memory, or a hard disk drive. Embodiments are not limited to this one.

In various embodiments, the thermal management module 106 can comprise any suitable combination of software, firmware, hardware, or software, firmware, or hardware. For example, in one embodiment, the thermal management module 106 can include logic stored in the memory 104 to be executed by the processor for thermal management operations. In some embodiments, the thermal management module 106 can include a firmware or embedded controller embodied in the operating system of the computing device 100. Although shown as part of memory 104 in FIG. 1, it is to be understood that thermal management module 106 can be embodied anywhere within computing device 100 while still falling within the scope of the described embodiments. Other embodiments and claimed patents are described.

In several embodiments, the air mover 108 can include any suitable device that can generate an air flow. For example, the air mover 108 can include a fan or blower configured to generate an air flow at the computing device 100. In various embodiments, the air mover 108 may include a rotating configuration of blades or blades acting on the air to create an air flow, or may include a fan wheel comprised of a plurality of blades or ribs surrounding the axle mounting to create an air flow. Although a limited number and type of air movers are shown and described for illustrative purposes, any number, type, or configuration of air movers can be used while still falling within the scope of the described embodiments.

In some embodiments, display 110 can include any suitable visual interface for displaying content to a user of mobile computing device 100. In one embodiment, for example, display 110 may be embodied by a liquid crystal display (LCD) or a tactilely sensitive color LCD screen. In some embodiments, a touch sensitive LCD can be used in a stylus and/or handwriting recognizer program. In some embodiments, display 110 can include a digital touch display configuration to occupy a substantial portion of the first side of the laptop computing device.

In various embodiments, power supply 112 can include any device suitable for providing power to computing device 100. For example, the power supply 112 can include an AC power supply or a DC power supply. In some embodiments, power supply 112 can include a battery or other energy storage device that can store and provide power to computing device 100. Other embodiments and claimed patents are described.

In some embodiments, the vent 124 can include any opening, slot, or other configuration of the device 100 that allows air to enter the mobile computing device 100. In various embodiments, vents 124 may be provided to allow airflow 126 to enter mobile computing device 100 while cooling internal components of device 100, such as heat producing component 102.

In various embodiments, the thermal management module 106 is operable to monitor one or more parameters of the air mover 108. For example, the thermal management module 106 is operable to monitor the speed, revolutions per minute (RPM), voltage, pulse width modulation (PWM), or any other suitable parameter of the air mover 108. In some embodiments, the air mover 108 can include a fan or blower, and one or more parameters can include the speed of the fan or blower or the voltage of the fan or blower.

In various embodiments, the thermal management module 106 can determine whether one or more parameter changes of the air mover 108 occur and take appropriate action based on the detected changes. For example, the thermal management module 106 can determine or obtain predetermined baseline parameters of the air mover 108, such as a target speed or target voltage. In some embodiments, the thermal management module 106 can continuously or periodically check the speed or voltage and compare the target speed or target voltage to a target speed or target voltage. In various embodiments, a change in speed or voltage of the air mover 108 may indicate that the computing device 100 has experienced a change in airflow. For example, a significant change in system airflow may result in a measurable change in one or more parameters of air mover 108. In systems using air propulsion 108 based on speed for closed loop control, the blocked vent 124 can be identified as a voltage drop required to maintain the speed of the air mover. In systems using air propulsion 108 based on speed for closed loop control, the blocked vent 124 can be identified as an increase in air mover speed. Other embodiments and claimed patents are described.

In some embodiments, the thermal management module 106 is operative to perform one or more thermal management operations based on one or more parameter changes of the air mover 108. In various embodiments, once a blocked vent is detected based on one or more parameter changes of the air mover 108, the thermal management module 106 can take several actions to perform thermal management. For example, an operating system notification such as a work area notification or an audible alarm beep may be employed. In some embodiments, such notification may report the severity of the blockage (eg, mild blockage/severe blockage/etc.) and/or recommend that the user take an action such as "please adjust the position of the notebook to avoid overheating."

In various embodiments, the thermal management operation can include generating a user notification regarding the speed change or voltage change. In some embodiments, the user notifications may include visual, tactile, or audible notifications presented to the user to alert them that the flow of the computing device 100 is known to have changed. In various embodiments, the user notification may include information regarding speed or voltage changes and/or proposed actions to compensate for speed or voltage changes. For example, computing device 100 can display a message on display 110 to alert the user that the fan speed has increased by a certain percentage, indicating that vent 124 is blocked. The message may also instruct the user to change the position of the computing device 100 to compensate for the blockage and prevent overheating.

In several embodiments, the thermal management operation can include changing the component performance state of the computing device 100 based on the detected airflow being limited. For example, the performance state of the heat producing component 102 can be automatically changed based on the speed or voltage change of the air mover 108. In various embodiments, changing the performance state can include throttling the heat generating component 102 if the speed of the air mover 108 is increased or the voltage is reduced. If the vent 124 is blocked, the thermal management module 106 can adjust the heat generated by the computing device 100 to help prevent overheating of the device 100 or temperature rise of the skin or housing by changing the performance state of the assembly.

In several embodiments, there may be more complex reactions. Some thermal management systems can rely on system level calibration to determine the most effective throttling for any given workload requirement. These system level calibrations may depend on the system performance of the normal operating air mover. However, in several embodiments, it may be possible to use the thermal management module 106 to make a second calibration (or calibration range) for poor air mover conditions (eg, blocked vent operation). In this manner, when the vent is clogged, the system can immediately detect a change in revolutions per minute (RPM), switch to a set of calibration constants that are more suitable for the current situation, and perform an improved thermal management of computing device 100.

Moreover, in various embodiments, the thermal management module 106 is operable to monitor air mover performance and maintenance notifications over time. For example, when the air mover performance degrades over time, the air mover's response to changes in system impedance may remain qualitatively the same. Thus, in several embodiments, during the entire life of the system, the thermal management module 106 can perform a simple calibration to permit detection of airflow blockage, even when the performance of the air mover 106 or other system components is reduced.

In various embodiments, the thermal management module 106 can actuate or enhance the thermal management system using fan vent blockage detection as an additional input. In conjunction with known thermal management applications and devices, the thermal management module 106 can improve the ergonomics of the end user in terms of audible noise, and adjust the air propulsion by adjusting the air propeller speed and thus based on the detected airflow characteristics. The power consumption of the device is used to manage the power draw of the system. The thermal management module 106 can also improve the robustness of the pressurized flow design, which may be disproportionately sensitive to blocked inlets. Other embodiments and claimed patents are described.

The first and second graphs illustrate the mobile computing devices 150 and 180, respectively. In various embodiments, mobile computing devices 150 and 180 can include the same or similar devices as computing device 100 of FIG. 1A. In various embodiments, apparatus 150 of FIG. 1B illustrates a perspective view of a laptop computing device. Apparatus 180 of Figure 1C illustrates a close-up side view of a device, such as the laptop computing device of Figure 1B. Embodiments are not limited to the configuration or configuration shown in Figures 1A, 1B, and 1C. A limited number and type of configurations and configurations are presented for illustrative purposes and not limitation.

In various embodiments, although not shown in FIG. 1B for clarity, computing device 150 may include the same or similar devices as computing device 100 of FIG. 1A. Computing device 150 includes display 110, housing 120, vent 124, and user notification 128. Although shown as a laptop computing device for purposes of illustration, it is to be understood that the embodiments described herein are applicable to any suitable computing device. Other embodiments and claimed patents are described.

In various embodiments, the housing 120 can include a housing configured to house the heat generating component 102, the air mover 106, and other internal components of the computing devices 100, 150. In various embodiments, the housing includes one or more outer surfaces including one or more openings (eg, vents 124) to assist in the flow of air into and out of the housing 120. Although the vent 124 is shown on the side of the housing 120 in Figure 1B, it should be understood that the vents can be positioned anywhere on the housing 120 while still falling within the scope of the described embodiments. For example, in some embodiments, the vent 124 can be located at the bottom of the housing 120. In such embodiments, the thermal management module 120 is advantageously used to detect vent clogging when the computing device 150 is placed on a user's knee or other soft surface as a commonly blocked vent. Embodiments are not limited to this one.

Figure 1C illustrates a side view of device 180 in several embodiments. As shown, device 180 can include, but is not limited to, heat producing component 102, memory 104, thermal management module 106, air mover 108, housing 120, vent 124 airflow 126, and clogging 132. The components of device 180 may be the same or similar to the components of the same numbered device 100 of Figure 1A and device 150 of Figure 1B. Although a limited number of components are shown for illustrative purposes, it is to be understood that any number, combination, and arrangement of components can be used while still falling within the scope of the embodiments.

In various embodiments, the airflow 126 can be drawn into the interior of the housing 120 by the air mover 108 through the vent 124. For example, the air mover 108 may include a fan or blower design to draw airflow 126 into the housing 120 to cool one or more components of the device 180, such as the heat producing assembly 102. As shown in FIG. 1C, in some embodiments, the vent 124 may be partially or fully blocked, possibly affecting the airflow 126. In various embodiments, the occlusion 132 may include or be located due to the location of the device 180. For example, if the device 180 is placed on a messy tabletop, a user's lap, a cushion, a soft seat, a bed, or any other suitable material known to those skilled in the art, some materials or clutter will block the vents. 124, such as blockage 132 is illustrated. The embodiment is not limited to this context and it is to be understood that any item that can block the vent 124 falls within the scope of the embodiment, and any amount of clogging 132 (eg, part or all) falls within the scope of the embodiment. Within the scope of the described embodiments.

In some embodiments, the blockage 132 can be detected by the thermal management module 106 based on one or more parameter changes of the air mover 108. For example, when the vent 124 is blocked 132, the speed of the air mover 108 may increase or the voltage used to drive the air mover 108 may decrease. In various embodiments, the thermal management module 106 is operable to dynamically monitor the parameters of the air mover 108 to detect the clogging 132 as previously described with respect to FIGS. 1A and 1B. Other embodiments and claimed patents are described.

Figure 2 illustrates a line graph 200 showing how variations in system airflow in several embodiments may result in measurable changes in air mover speed, voltage, or pulse width modulation. For example, as the line graph 200 shows, as the flow rate decreases, the air mover speed (RPM) increases. Based on the line graph 200, it is apparent that the vent clogging result of the computing system results in system airflow reduction that can be detected based on one or more parameter changes of the air mover, such as speed voltage or PWM. Based on these changes, a thermal management module, such as thermal management module 106 of FIG. 1A, can be used to improve the thermal performance of the computing system.

FIG. 3 illustrates one embodiment of a logic flow diagram 300. The logic flow diagram 300 can be executed by a plurality of systems and/or devices and can be embodied as hardware, software, firmware, and/or any combination thereof, as set forth in a given set of design parameters or performance limitations. For example, one or more of the logic flow diagrams 300 may be embodied by an executable program or other non-transitional computer readable instructions that are to be executed by a logical device (eg, a computer, a processor). Logic flow diagram 300 may describe dynamic airflow monitoring and thermal management as previously described with reference to Figures 1A, 1B, 1C, and 2. Other embodiments and claimed patents are described.

In various embodiments, one or more parameters of the air mover can be monitored at 302. For example, in several embodiments, the thermal management module 106 can monitor one or more parameters of the air mover 108, such as speed or voltage. At 304, a change in one or more parameters can be detected. For example, the thermal management module 106 can detect changes in parameters of the air mover 108, such as increased fan speed or voltage reduction. At 306, in various embodiments, one or more thermal management operations can be performed based on one or more parameter changes that indicate a change in airflow of the computing device. For example, the thermal management module 106 is operable to instruct the user to notify or adjust operational parameters of other system components based on parameter changes in the air mover 108 indicating that the vent 124 of the computing device 100 is clogged.

In some embodiments, the air mover can include a fan or blower, and one or more parameters can include the speed or voltage of the fan or blower. In various embodiments, user notifications regarding speed or voltage changes can be generated. For example, the thermal management module 106 can generate a user notification to be displayed on the display 110 or as an audio notification. In several embodiments, the user notification may include information regarding the amount of speed or voltage change or a proposed action to compensate for the change in speed, and an increase in speed or a decrease in voltage may indicate an airflow restriction.

In several embodiments, the performance state of one of the components of the computing device can vary based on changes in speed or voltage. For example, the thermal management module 106 is operable to change the performance state of the heat producing component 102, such as if the speed of the air mover 108 is increased or the voltage is reduced, such as the throttle heat generating component 102.

In several embodiments, the maintenance status of the air mover can be monitored. For example, in addition to monitoring one or more parameters of the air mover 108, the thermal management module 106 is also operable to monitor the maintenance status of the air mover 108. In various embodiments, monitoring the maintenance status may include determining the wear of the air mover 108 during use, and how the wear or other maintenance information affects the performance of the air mover 108. In several embodiments, a maintenance notification may be generated if the maintenance state falls below a predetermined threshold. For example, if the air mover 108 ceases to operate as intended, or as defined by a maintenance schedule or schedule, the thermal management module 108 can operate to generate a notification.

In several embodiments, the first thermal configuration may be selected if one or more parameters of the air mover have not detected any changes. For example, if the thermal management module 106 determines that the air mover 108 is operating as intended (eg, if there is no speed increase or voltage reduction), then a first thermal configuration that allows the computing device 100 to operate normally can be selected. In other embodiments, the second thermal configuration may be selected if a change in one or more parameters of the air mover is detected. For example, if the thermal management module 106 determines that the vent 124 is blocked based on one or more parameter changes of the air mover 108, the thermal management module 106 can select the second thermal configuration, and the second thermal configuration can be Configure to produce less heat than the first thermal configuration. Other embodiments and claimed patents are described.

Figure 4 is a schematic diagram of a specific embodiment of the system. More specifically, FIG. 4 is a schematic diagram showing a system 400 that can include multiple components. For example, FIG. 4 shows that system 400 can include processor 402, chipset 404, input/output (I/O) device 406, random access memory (RAM) (such as dynamic RAM (DRAM)) 408, and Read only memory (ROM) 410, and a plurality of platform components 414 (eg, fans, crossflow blowers, heat sinks, DTM systems, cooling systems, enclosures, vents, etc.). These elements can be embodied as hardware, software, or any combination thereof. However, embodiments are not limited to such elements.

As shown in FIG. 4, I/O device 406, RAM 408, and ROM 410 are coupled to processor 402 by chipset 404. The chipset 404 can be coupled to the processor 402 by a bus 412. Accordingly, bus bar 412 can include multiple lines.

Processor 402 can be a central processing unit that includes one or more processor cores, and can include any number of processors having any number of processor cores. Processor 402 can include any type of processing unit, such as a CPU, a multi-processing unit, a reduced instruction set computer (RISC), a processor with pipelines, a complex instruction set computer (CISC), a digital signal processor (DSP), and the like.

Although not shown in the figures, system 400 can include various interface circuits, such as an Ethernet interface and/or a universal serial bus (USB) interface, and/or the like. In some embodiments, I/O device 406 can include one or more input devices coupled to the interface circuitry for loading data and instructions into system 400. For example, the input device can include a keyboard (physical or virtual/soft), a mouse, a touch screen, a track pad, a trackball, a grid system, a voice recognition system, and/or the like. Similarly, I/O device 406 can include one or more output devices coupled to the interface circuit for outputting information to an operator. For example, the output device can include one or more displays, printers, speakers, and/or other output devices, if desired. For example, one of the output devices can be a display. The display can be a cathode ray tube (CRT), a liquid crystal display (LCD), or any other type of display.

System 400 can also have a wired or wireless network interface to exchange data with other devices through a connection to the network. The network connection can be any type of network connection, such as an Ethernet connection, a digital subscriber line (DSL), a telephone line, a coaxial cable, and the like. The network can be any type of network, such as an Ethernet network, a telephone network, a cable network, a wireless network, a packet switched network, a circuit switched network, and/or the like.

Numerous specific details are set forth herein for a thorough understanding of the embodiments. Those skilled in the art will appreciate that the embodiments can be practiced without these specific details. In other instances, well-known operations, components, and circuits have not been described in detail to avoid obscuring the embodiments. It can be appreciated that the specific structural and functional details described herein may be in the form of representations and not necessarily limit the scope of the embodiments.

Various embodiments may be embodied using hardware elements, software elements, or a combination of both. Examples of hardware components can include processors, microprocessors, circuits, circuit components (eg, transistors, resistors, capacitors, inductors, etc.), integrated circuits, application-specific integrated circuits (ASICs), programmable logic devices (PLD), digital signal processor (DSP), field programmable gate array (FPGA), logic gate, scratchpad, semiconductor device, wafer, microchip, chipset, etc. Examples of software may include software components, programs, applications, computer programs, application planning programs, system programs, machine programs, operating system software, mediation software, firmware, software modules, routines, subroutines, functions, Method, program, software interface, application programming interface (API), instruction set, calculation code, computer code, code segment, computer code segment, character, value, symbol, or any combination thereof. Determining whether an embodiment uses hardware components and/or software components can vary depending on any number of factors, such as desired operating rate, power level, thermal tolerance, processing cycle budget, input data rate, output data rate. , memory resources, data bus speed, and other design or performance limitations.

Several embodiments may be described using "coupled" and "linked" along with their derivatives. These terms are not intended as synonyms for each other. For example, several embodiments may use terms such as "coupled" and/or "coupled" to indicate that two or more elements are in direct physical or electrical contact with each other. However, the term "coupled" may also mean that two or more elements are not in direct contact with each other, but still cooperate or interact with each other.

Several embodiments may be embodied, for example, using machine readable or computer readable media or articles, which may store instructions, sets of instructions, or computer executable code that, if executed by a machine or processor, may cause the machine Or the processor performs the methods and/or operations in accordance with the embodiments. Such a machine may include, for example, any suitable processing platform, computing platform, computing device, processing device, computing system, processing system, computer, processor, etc., and may be embodied in any suitable combination of hardware and/or software. In some embodiments, the machine readable medium or article may comprise non-transitional media, and may include, for example, any suitable type of memory unit, memory device, memory object, memory medium, storage device, storage object, Storage medium and/or storage unit, such as memory, removable or non-removable media, electrical or non-electrical memory or media, erasable or non-erasable media, writable or Overwrite media, digital or analog media, hard disk, floppy disk, CD-ROM, CD-R, CD-RW, CD-ROM , disk, magneto-optical disc, removable memory card or memory disc, various types of digital audio and video discs (DVD), magnetic tape, cassettes, etc. Instructions may include any suitable type of code, such as source code, compiled code, interpreted code, executable code, static code, dynamic code, encrypted code, etc., using any suitable high order, low order, object oriented, visual, compiled, and/or Or interpret the language of the program.

Unless otherwise stated, terms such as "processing", "operation", "calculation", "decision", etc., refer to the actions and/or procedures of a computer or computing system or similar electronic computing device, which will be The data stored in the register and/or memory of the computer system as an entity (eg, electronic) is manipulated and/or transformed to be similarly represented as storage, transmission, or storage of information in a computer system, memory, or other such information. Or other information showing the amount of material inside the device. The embodiment is not limited to this one.

It should be noted that the methods described herein need not be performed in the order described or in any particular order. Moreover, multiple activities described in terms of the methods described herein can be performed in a serial or side-by-side manner.

Although the specific embodiments have been illustrated and described herein, it is understood that any configuration that is calculated to achieve the same objectives may be substituted for the particular embodiments shown. This disclosure is intended to cover any and all adaptations or variations of the various embodiments. It is to be understood that the foregoing description is illustrative and not restrictive. Combinations of the foregoing embodiments, and other embodiments not specifically described herein, will be apparent to those skilled in the art. As such, the scope of various embodiments includes any other application in which the foregoing compositions, structures, and methods are used.

It is important to emphasize that the Abstract section of the disclosure is provided in accordance with 37 C.F.R. § 1.72(b), and that the abstract description will allow the reader to quickly ascertain the nature and substance of the technical disclosure. It must be understood that it will not be used to interpret or limit the scope or meaning of the scope of the patent application. In addition, in the foregoing detailed description, it will be understood that various features are collectively combined in a single embodiment to facilitate the disclosure of the disclosure. The method of the present disclosure is in no way to be interpreted as reflecting that it is intended that the embodiments of the claimed invention are claimed. Instead, the following claims reflect the scope of the patent, and the subject matter of the invention is dependent on fewer features than all features of a single disclosed embodiment. Thus, the scope of the following claims is hereby incorporated by reference in its entirety in its entirety The terms "including" and "in" are used in the English equivalents of the "including" and "in" terms, respectively. In addition, the words "first", "second", and "third" are used merely as an indication rather than an intention to impose any ordinal requirements on their objects.

Although the subject matter has been described in terms of structural features and/or methodological acts, it is to be understood that the subject matter defined in the scope of the appended claims is not necessarily limited to the foregoing features or acts. Instead, the foregoing specific features or actions are disclosed as examples of the various embodiments of the invention.

100, 150, 180. . . Mobile computing device, communication system

102. . . Heat production component

104. . . Memory

106. . . Thermal management module

108. . . Air propeller

110. . . Digital display

112. . . Power Supplier

120. . . case

124. . . Vent

126. . . airflow

128. . . User notification

132. . . Blockage

200. . . line graph

300. . . Logic flow chart

302, 304, 306. . . Processing block

400. . . system

402. . . processor

404. . . Chipset

406. . . I/O device

408. . . Random access memory (RAM)

410. . . Read only memory (ROM)

414. . . Platform component

Figure 1A shows an embodiment of the first system.

Figure 1B shows an embodiment of the second system.

Figure 1C shows an embodiment of a third system.

Figure 2 shows an embodiment of a line graph.

Figure 3 shows an embodiment of a flow chart.

Figure 4 shows an embodiment of the fourth system.

100. . . Mobile computing device, communication system

102. . . Processor, heat generating component

104. . . Memory

106. . . Thermal management module

108. . . Air mover

110. . . Digital display

112. . . Power Supplier

124. . . Vent

126. . . airflow

Claims (17)

An apparatus comprising: a heat producing component; an air propeller comprising a fan or a blower; and a thermal management module for monitoring one or more parameters of the air mover, and based on the one Or one or more changes in the plurality of parameters indicative of one or more changes to the airflow for the device, one or more thermal management operations, the one or more parameters including one of the fan or blower speed or a voltage of one of a fan or a blower; wherein the thermal management operation includes changing one of the performance states of the heat generating component based on one or more changes in speed or voltage. The apparatus of claim 1, wherein the thermal management operation further comprises one or more changes in speed or one or more changes in voltage to generate a user notification, wherein the increased speed or reduced voltage is indicative One of the airflow limits. The device of claim 2, wherein the user notification includes information about speed or voltage change amount or a proposed action to compensate for the speed or voltage change. The apparatus of claim 1, wherein changing the performance state comprises throttling the heat generating component if the speed is increased or the voltage is reduced. The apparatus of claim 1, comprising: a housing configured to surround the heat generating assembly and the air mover, the housing having one or more openings to assist in the flow of air into and out of the housing One or more outer surfaces, wherein the one or more parameters One or more of the changes indicate one or more variations in airflow into or out of one or more of the openings of the housing. A system comprising: a housing configured to enclose a heat producing component and an air mover, the housing having one or more openings to assist in the flow of air into and out of one or more outer surfaces of the housing The air mover includes a fan or a blower; and a thermal management module to monitor one or more parameters of the air mover, and one of the airflows based on one or more changes of the one or more parameters Or a plurality of changes, one or more thermal management operations, the one or more parameters comprising a speed or voltage of the fan or blower; wherein the thermal management operation comprises one or more changes based on speed or voltage And changing the performance state of one of the heat generating components. A system of claim 6 wherein the one or more changes in the one or more parameters are indicative of one or more changes in airflow flowing into or out of one or more of the openings of the housing. A system as claimed in claim 6 wherein the increased speed or reduced voltage is indicative of one of the airflow limits. The system of claim 8, wherein the thermal management operation further comprises generating a user notification to be displayed on a digital display, the user notification indicating a limitation of the airflow and including information about the limit amount or making up for the One of the restrictions proposes an action. The system of claim 8 wherein changing the performance state comprises throttling the heat generating component if the speed is increased or the voltage is reduced. A computer embodied method comprising: monitoring one or more parameters of an air mover, the air mover comprising a fan or a blower, the one or more parameters comprising one speed of the fan or blower or Detecting one or more of the one or more parameters; and indicating one or more changes to the airflow for a computing device based on one or more of the one or more parameters, performing one or more A plurality of thermal management operations; wherein the thermal management operation comprises changing a performance state of the one of the heat generating components based on one or more changes in speed or voltage. A computer-implemented method of claim 11, wherein performing one or more thermal management operations further comprises generating a user notification regarding one or more changes in the speed or voltage, wherein the user notification includes a speed or The voltage change amount information or one of the speed or voltage changes is proposed to act, and wherein the increased speed or reduced voltage is indicative of one of the airflow limits. The method embodied in the computer of claim 11, wherein changing the performance state comprises throttling the heat generating component if the speed is increased or the voltage is decreased. The method embodied in the computer of claim 11, wherein performing one or more thermal management operations further comprises: monitoring a maintenance state of the air propeller; and generating a maintenance if the maintenance state exceeds a predetermined threshold Notice. The method embodied in the computer of claim 11, wherein performing one or more thermal management operations further comprises: selecting a first heat if the one or more parameters of the air mover are not detected to be changed Configuration; and if the one or more parameters of the air mover detect one or more changes, a second thermal configuration is selected. A method embodied by the computer of claim 15 wherein the second thermal configuration is configured to generate less heat than the first thermal configuration. The method embodied in the computer of claim 16 wherein one of the one or more heat generating components has a performance state changed in the second thermal configuration system.