201239596 六、發明說明： I：發明戶斤屬之技術領域3 本發明係有關於用於計算裝置中之氣流監測及熱管理 的設備、系統與方法。 L ^ 發明背景 近代計算系統之效能及能力近年來已經快速提高。今 曰許多計算系統包括一或多個處理器、記憶體、無線連結 性及其它產熱組件。近代計算系統之能力及組件的數目及 型別繼續增加，其經常導致產熱的增加，原因在於計算系 統的尺寸持續縮小。此外，近代行動計算系統經常用於廣 泛多個位置及使用情況，可能導致計算系統被用在可能部 分地或完全地堵塞系統中設計來輔助散熱的通風口或其它 開口的材料表面上或材料附近。結果，期望增加對行動計 算裝置的氣流知曉。因而實質上需要有動態地監測行動計 算系統的氣流之技術。 I：發明内容3 依據本發明之一實施例，係特地提出一種設備包含一 產熱組件；一空氣推進器；及一熱管理模組來監測該空氣 推進器的一或多個參數，及基於該等一或多個參數的一或 多個變化指示針對該設備之氣流的一或多個變化，執行一 或多個熱管理操作。 圖式簡單說明 第1Α圖顯示第一系統之一個實施例。 201239596 第1B圖顯示第二系統之一個實施例 第1C圖顯示第三系統之一個實施例 第2圖顯示線圖之一個實施例。 第3圖顯示流程圖之一個實施例。 第4圖顯示第四系統之一個實施例。 【實施方式3 詳細說明 實施例大致上係有關於設計用來動悲地監測行動計算 裝置的氣流之技術。多個實施例提供系統、設備及方法， 其包括一產熱組件、一空氣推進器、及一熱管理模組來監 測該空氣推進器的一或多個參數，及基於該等一或多個參 數的一或多個變化指示該設備之氣流的一或多個變化，執 行一或多個熱管理操作。描述其它實施例及請求專利。 隨著時間的經過行動計算裝置的使用朝向尺寸縮小及 成本的減低方向進行，設計用來去除或減少行動計算裝置 所產生的熱之組件可用空間逐漸受限制。近代行動計算裝 置私平板電腦1上型計算裝置、智慧型手機、膝上型 鼓_及小筆電要求有效冷卻元件，以防緊要的系統組件過 ，也減^傳熱i通常與使用者皮膚接觸的裝置殼體。 構來:動指裝置包括空氣推進11、散熱座或其它冷卻機 以_賴纽料。當使用者將該行動 2用在新處理或未預期的位置其可能堵塞冷卻通 持二二::::^ 201239596 ▲近代計算裝置可以主動式冷卻，也可仰仗空氣推進器 諸如風扇或鼓風機來將冷卻魏移動遍及整⑽統。若藉 將系、、先放置於使用者膝上或例如另—個柔軟地方讓計算誓 置的入口或出口通風口堵塞，則系統的熱效能受損。近代 行動計算裝置經常未能提供制堵塞通風口的適當方法。 ^目前行動計算裝置巾，除非皮膚或機殼溫度顯著升高而 v致使用者不適’否則使用者可能不會得知通風口堵塞。 :夕们κ鉍例中，即便部分堵塞的通風口仍可能導致行動 計算裝置的皮膚溫度升高攝氏5-1G度或以上。 。於-個實施例中，系統氣流的監測可藉監測空氣推進 器參數達成，來許可檢測线中堵塞的通風口。於多個實 ^例中’ §行動計算裝置的人口或出口通風。顯著堵塞 日寸’空亂推進器的_或多個參數可能顯著改變。舉例言之， 於目前系統中’已經藉許多系統監測的風扇速度可能因堵 塞的通風口㈣高。因此，此處描狀轩實施例可利用 一或多個錢推進器參數蚊期監測來監測行動計算裝置 之乳流及檢驗堵塞的通風σ。描述其它實施例及請求專利。 實施例可包含一或多個元件。一個元件可包含配置來 執行某些操作的任何結構。針對設計參數或效能限制的— 個、’、。疋集合所期望’各個元件可體現為硬體、軟體、或其 ，種組合。雖然實施例可以呈某些配置的特定元件舉例 說明’但實施例也可包括呈替代配置的元件組合。 值得注意者為任何述及「一個實施例」或「-實施例」 表示關聯«施_科之特定特徵、結構讀性係含括 201239596 於本發明之至少一個實施例。於本說明書各處出現「於一 個實施例中」I「於—實施例中」等詞並非絕對必然係指 相同實施例。 第1A圖例示說明行動計算裝置1〇〇之一個實施例之方 塊圖。於多個實施例中’行動計算裝置剛可包含多個節 點、元件或組件。節點、元件或組件通料包含行動計算 裝置酬的任何實體麵輯實體，歸對設計參數或效能限 制的-個給定集合所期望，可體現為硬體、軟體、或其任 -種組合。雖然WA圖可能顯示有限數目㈣點、元件及 組件用於舉例說明，但須瞭解更多或更少的節點、元件或 組件可採用於一個給定體現。 於多個實施例中，行動計算裝置1〇〇可包含平板電腦、 掌上型電腦、個人數位助理器（PDA)、小區式電話、小區式 電活/PDA組合、智慧型手機、膝上型電腦、超級膝上型電 腦、可攜式電腦、個人電腦(PC)、筆記型pc：、小筆電、傳 哞機 '傳訊裝置、雜播放器、數位音雜放器、或其它 適當行動計算裝置。多個實施例包括述及筆記型電腦、膝 上型電腦、或可攜式電腦。實施例並非囿限於此一脈絡。 行動計算裝置100可包括操作來構成有線通訊系統、無 線通訊系統、或二者的組合之—部分之裝置。舉例言之， 行動計算裝置100可包含配置來透過一或多型有線通訊鏈 路而通訊資訊之-或多個節點。有線通訊鏈路之實例可包 括但非限於導線、纜線、匯流排、印刷電路板(pcB)乙太網 路連結、點對點(P2P)連結、背板、開關組織結構、半導體 201239596 材料、雙絞線、同軸纟覽線 '光纖連結等。行動計算裝置1〇2 也可包括配置來透過一或多型無線通訊鏈路而通訊資訊之 一或多個節點。無線通訊鏈路之實例可包括但非限於無線 電頻道、紅外線頻道、射頻(RF)頻道、無線保真(Wi_Fi)頻 道、部分RF頻譜、及/或一或多個核發執照或無執照的頻帶。 行動計算裝置100可依據標準組織所公告的一或多個 標準通訊資訊。舉例言之，於一個實施例中，包含部分通 訊系統的多個裝置100可經配置來依據下列中之一或多者 操作：IEEE 802.11標準、WiGig聯盟規格、無線HD規格、 標準或變化諸如無線HD規格l.〇d7版2007年12月1日、及由 無線HD公司公布的子代版本(合稱為「無線hd規格」）；或 依據其它標準組織所公告的任何其它無線標準操作，諸如 國際電信聯盟(ITU)、國際標準化組織(iso)、國際電氣技術 委員會(IEC)、美國電機及電子工程師學會（資訊ieee)、網 際網路工程專案小組(IETF)等。舉例言之，於多個實施例 中，行動計算裝置102可依據下列中之一或多者通訊資訊： 針對無線區域網路(WLAN)之一或多個IEEE 802· 11標準諸 如資訊IEEE 802.11標準（1999版，系統-區域網路及都會區 域網路-間資訊技術電通訊與資訊交換_特定要求，部分11 : WLAN媒體存取控制（MAC)層及實體層（PHY)規格）、其子 代版本及補遺（例如802_lla、b、g/h、j、η、VHT SG、及變 化版本）；IEEE 802·15_3及變化版本；針對WMAN之IEEE 802.16 標準包括 IEEE 802.16 標準諸如 802.16-2004、 802.16.2-2004、802.16e-2005、802.16f 及變化版本； 201239596 WGA(WiGig)子代版本及變化版本；㉟洲電腦製造商協會 (ECMA) TG2G子代版本及變化版本；及其它無線網路標 準。實施例並非囿限於此一脈絡。 行動計算裝置1〇〇可依據一或多個協定通訊、管理、或 處理資訊。協定可包含用來管理多個節點間的通訊之一預 定規格或指令集合。於多個實施例中，舉例言之，通訊系 統可採用一或多個協定，諸如射束形成協定、媒體存取控 制(MAC)協定、實體層收歛協定(PLCP)、簡易網路管理協 定(SNMP)、異步傳輸模式(ATM)協定、訊框中繼協定、系 統網路架構(SNA)協定、傳輸控制協定(TCP)、網際網路協 定(IP)、TCP/IP、X.25、超文字傳輸協定(HTTP)、用戶資料 訊息協定(UDP)、競爭基礎週期（CBp)協定、分散式競爭基 礎週期（CBP)協定、等。於多個實施例中，通訊系統1〇〇也 可配置來依據媒體處理標準及/或協定操作。實施例並非囿 限於此一脈絡。201239596 VI. Description of the Invention: I: Technical Field of Inventions The present invention relates to apparatus, systems and methods for airflow monitoring and thermal management in computing devices. L ^ BACKGROUND OF THE INVENTION The performance and capabilities of modern computing systems have increased rapidly in recent years. Many computing systems today include one or more processors, memory, wireless connectivity, and other heat producing components. The capabilities and types of modern computing systems continue to increase in number and type, which often leads to an increase in heat production because the size of the computing system continues to shrink. In addition, modern mobile computing systems are often used in a wide variety of locations and usage scenarios, which may result in computing systems being used on or near the surface of materials that may partially or completely block vents or other openings that are designed to aid heat dissipation in the system. . As a result, it is desirable to increase the airflow awareness of the mobile computing device. Thus, there is a substantial need for techniques for dynamically monitoring the airflow of a mobile computing system. I: SUMMARY OF THE INVENTION According to one embodiment of the present invention, an apparatus specifically includes a heat generating component; an air mover; and a thermal management module to monitor one or more parameters of the air mover, and based on One or more changes in the one or more parameters indicate one or more changes to the airflow for the device, performing one or more thermal management operations. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows an embodiment of the first system. 201239596 FIG. 1B shows an embodiment of the second system. FIG. 1C shows an embodiment of the third system. FIG. 2 shows an embodiment of the line graph. Figure 3 shows an embodiment of a flow chart. Figure 4 shows an embodiment of the fourth system. [Embodiment 3] Detailed Description The embodiment is generally directed to a technique designed to sorrowfully monitor the airflow of a mobile computing device. Embodiments provide systems, devices, and methods that include a heat generating component, an air mover, and a thermal management module to monitor one or more parameters of the air mover, and based on the one or more One or more changes in the parameter indicate one or more changes in the airflow of the device, performing one or more thermal management operations. Other embodiments and claimed patents are described. Over time, the use of mobile computing devices is moving toward size reduction and cost reduction, and the available space for components designed to remove or reduce the heat generated by the mobile computing device is increasingly limited. Modern mobile computing devices, private tablet PCs, high-end computing devices, smart phones, laptop drums, and small notebooks require effective cooling components to prevent critical system components, and also reduce heat transfer i, usually with the user's skin. The device housing that is in contact. Construction: The moving finger device includes air propulsion 11, heat sink or other cooling machine. When the user uses the action 2 in a new or unexpected position, it may block the cooling pass. 2::::^ 201239596 ▲The modern computing device can be actively cooled, or it can rely on an air booster such as a fan or blower. Move the cooling Wei all over the whole (10) system. If the system is placed on the user's lap or, for example, another soft place, the inlet or outlet vents of the calculated oath are blocked, the thermal performance of the system is impaired. Modern mobile computing devices often fail to provide an appropriate method of plugging vents. ^ The current mobile computing device towel, unless the temperature of the skin or the case is significantly increased and the user is uncomfortable, otherwise the user may not know that the vent is blocked. In the case of eves, even a partially blocked vent may cause the skin temperature of the mobile computing device to rise by 5-1G degrees Celsius or above. . In one embodiment, monitoring of system airflow may be accomplished by monitoring air propeller parameters to permit clogging of the vents in the test line. Ventilation of the population or outlet of the '§Action Computing Unit in multiple instances. Significantly blocked _ or _ or more parameters of the airborne propeller may change significantly. For example, fan speeds that have been monitored by many systems in current systems may be high due to blocked vents (four). Thus, the embodiment herein can utilize one or more money propeller parameter mosquito monitoring to monitor the milk flow of the mobile computing device and to verify the ventilation σ of the blockage. Other embodiments and claimed patents are described. Embodiments may include one or more components. A component can contain any structure that is configured to perform certain operations. _, ', for design parameters or performance limitations. The individual components are expected to be embodied as hardware, software, or a combination thereof. Although the embodiments may be illustrated by specific components in some configurations, the embodiments may also include combinations of components in alternate configurations. It is noted that any reference to "an embodiment" or "an embodiment" means that the particular feature, structure readability, includes at least one embodiment of the present invention. The words "in one embodiment", "in" or "an embodiment" are used throughout the specification and are not necessarily referring to the same embodiment. Fig. 1A is a block diagram showing an embodiment of the mobile computing device 1A. In many embodiments, the 'action computing device can just contain multiple nodes, elements or components. A node, component, or component material that contains any physical facet entity of the mobile computing device, is expected to be a given set of design parameters or performance limits, and can be embodied as hardware, software, or any combination thereof. Although a WA map may show a limited number (four) of points, components, and components for illustration, it is to be understood that more or fewer nodes, components, or components may be employed in a given embodiment. In various embodiments, the mobile computing device 1 can include a tablet, a palmtop computer, a personal digital assistant (PDA), a cell phone, a community electric/PDA combination, a smart phone, a laptop. , super laptop, portable computer, personal computer (PC), notebook pc:, small laptop, transmitter 'messaging device, miscellaneous player, digital squirrel, or other appropriate mobile computing device . Various embodiments include a notebook computer, a laptop computer, or a portable computer. Embodiments are not limited to this one. The mobile computing device 100 can include a portion of a device that operates to form a wired communication system, a wireless communication system, or a combination of both. For example, mobile computing device 100 can include - or multiple nodes configured to communicate information over one or more types of wired communication links. Examples of wired communication links may include, but are not limited to, wires, cables, bus bars, printed circuit board (PCBB) Ethernet connections, point-to-point (P2P) connections, backplanes, switch organization, semiconductor 201239596 materials, twisted pair Line, coaxial cable, fiber optic connection, etc. The mobile computing device 1 2 may also include one or more nodes configured to communicate information over one or more types of wireless communication links. Examples of wireless communication links may include, but are not limited to, radio channels, infrared channels, radio frequency (RF) channels, wireless fidelity (Wi_Fi) channels, partial RF spectrum, and/or one or more licensed or unlicensed frequency bands. The mobile computing device 100 can organize one or more standard communication information as announced by the standards organization. For example, in one embodiment, a plurality of devices 100 including a portion of a communication system can be configured to operate in accordance with one or more of the following: IEEE 802.11 standards, WiGig Alliance specifications, wireless HD specifications, standards, or variations such as wireless HD specification l.〇d7 version December 1, 2007, and the child version published by Wireless HD (collectively referred to as "wireless hd specification"); or any other wireless standard operation announced by other standards organizations, such as International Telecommunication Union (ITU), International Organization for Standardization (ISO), International Electrotechnical Commission (IEC), American Institute of Electrical and Electronics Engineers (Informationieee), Internet Engineering Project Team (IETF), etc. For example, in various embodiments, the mobile computing device 102 can communicate information according to one or more of the following: for one of a wireless local area network (WLAN) or multiple IEEE 802.11 standards such as the IEEE 802.11 standard. (1999 Edition, System-Regional Network and Metropolitan Area Network - Information Technology Telecommunications and Information Exchange _ Specific Requirements, Part 11: WLAN Media Access Control (MAC) Layer and Physical Layer (PHY) Specifications) Generation versions and addenda (eg 802_lla, b, g/h, j, η, VHT SG, and variants); IEEE 802.15_3 and variants; IEEE 802.16 standards for WMAN include IEEE 802.16 standards such as 802.16-2004, 802.16 .2-2004, 802.16e-2005, 802.16f and variants; 201239596 WGA (WiGig) child version and change version; 35 continent computer manufacturer association (ECMA) TG2G child version and change version; and other wireless networks standard. Embodiments are not limited to this one. The mobile computing device 1 can communicate, manage, or process information in accordance with one or more protocols. A contract can include a predetermined set of specifications or sets of instructions used to manage communication between multiple nodes. In various embodiments, for example, the communication system may employ one or more protocols, such as beamforming protocols, media access control (MAC) protocols, physical layer convergence protocols (PLCP), and simple network management protocols ( SNMP), Asynchronous Transfer Mode (ATM) protocol, Frame Relay Protocol, System Network Architecture (SNA) Protocol, Transmission Control Protocol (TCP), Internet Protocol (IP), TCP/IP, X.25, Super Text Transfer Protocol (HTTP), User Data Message Protocol (UDP), Competitive Base Period (CBp) Agreement, Decentralized Competitive Base Period (CBP) Agreement, etc. In various embodiments, the communication system 1 can also be configured to operate in accordance with media processing standards and/or protocols. The embodiment is not limited to this one.
於若干實施例中’行動計算裝置100可包含或聯結網路 及多個其它節點。於多個實施例中’節點可體現為各型無 線或行動計算裝置。無線裝置之實例可包括但非限於IEEE 802.15.3微微網控制器（PNC)、控制器、IEEE 802.11 pcp ' 協調器、資訊台、用戶站台、站台、無線存取點（AP)、無 線客端裝置、無線資訊站（STA)、膝上型電腦、超級膝上型 電腦、可攜式電腦、個人電腦(PC)、筆記型pC、平板電腦、 掌上型電腦、個人數位助理器（PDA)、小區式電話' 小區式 電話/PDA組合、智慧型手機、傳呼機：傳訊裝置、媒體播 201239596 放器、數位音樂播放器、機上盒(STB)、家電產品、工作站、 使用者終端裝置、行動單元、消費者電子裝置、電視機、 數位電視、高傳真電視、電視接收器、高傳真電視接收器 等。 於若干實施例中，行動計算裝置100可包含或包括一或 多個供無線通訊的無線介面及/或組件，諸如一或多個發射 器、接收器、收發器、晶片組、放大器、濾波器、控制邏 輯、網路介面卡(NIC)、天線、天線陣列、模組等。習知天 線之實例可包括但非限於内部天線 '全向天線、單極天線、 兩極天線'端饋天線、圓形極化天線、微條天線、分集天 線、雙重天線、天線陣列等。 於多個實施例中，行動計算裝置1 〇 〇可包含無線網路或 構成其中一部分。舉例言之，於若干實施例中，無線網路 可包含或體現為各型無線網路及相聯結的協定適用於 WPAN、無線區域網路(WLAN)、無線都會區域網路、無線 廣域網路(WWAN)、寬帶無線存取(BWA)網路、無線電網 路、電視網路、衛星網路諸如直接廣播衛星(DBS)網路、長 期演進(LT E)網路及/或配置來依據所述實施例操作的任何 其它無線通訊網路。 雖然貰施例並非囿限於此一脈絡，但於若干實施例 中’行動計异裝置1 〇〇例示說明一個可能的節點。於多個實 施例中’行動計算裝置100可包括產熱組件102、記憶體 104、熱管理模組丨06、空氣推進器1〇8、數位顯示器11〇、 電源供應器112、及通風口 124。雖然第1A圖顯示有限數目 9In some embodiments, the mobile computing device 100 can include or interface with a network and a plurality of other nodes. The nodes in various embodiments may be embodied as various types of wireless or mobile computing devices. Examples of wireless devices may include, but are not limited to, IEEE 802.15.3 piconet controller (PNC), controller, IEEE 802.11 pcp 'coordinator, information station, subscriber station, station, wireless access point (AP), wireless client Devices, wireless information stations (STAs), laptops, super laptops, portable computers, personal computers (PCs), notebook PCs, tablets, palmtops, personal digital assistants (PDAs), Cellular telephone's community telephone/PDA combination, smart phone, pager: communication device, media broadcast 201239596 radio, digital music player, set-top box (STB), home appliances, workstation, user terminal device, action Units, consumer electronics, televisions, digital TVs, high-fidelity TVs, TV receivers, high-fidelity TV receivers, etc. In some embodiments, the mobile computing device 100 can include or include one or more wireless interfaces and/or components for wireless communication, such as one or more transmitters, receivers, transceivers, chipsets, amplifiers, filters Control logic, network interface card (NIC), antenna, antenna array, module, etc. Examples of conventional antennas may include, but are not limited to, internal antennas 'omnidirectional antennas, monopole antennas, two-pole antennas' end-fed antennas, circularly polarized antennas, microstrip antennas, diversity antennas, dual antennas, antenna arrays, and the like. In various embodiments, the mobile computing device 1 can include or comprise a portion of a wireless network. For example, in some embodiments, a wireless network may include or be embodied as a variety of wireless networks and associated protocols for WPANs, wireless local area networks (WLANs), wireless metropolitan area networks, wireless wide area networks ( WWAN), broadband wireless access (BWA) network, radio network, television network, satellite network such as Direct Broadcast Satellite (DBS) network, Long Term Evolution (LT E) network and/or configuration according to the Any other wireless communication network in which the embodiment operates. Although the embodiment is not limited to this context, in some embodiments the 'action-independent device 1' illustrates one possible node. In various embodiments, the mobile computing device 100 can include a heat generating component 102, a memory 104, a thermal management module 丨06, an air mover 〇8, a digital display 11A, a power supply 112, and a vent 124. . Although Figure 1A shows a limited number 9
S 201239596 計算裝 的組件及排列用於例示說明之目的，但須瞭解行動 置100可包括任何數目的組件及排列而仍係 落入於所述實 施例範圍内。舉例言之，於若干實施例中，行動4十_ 100可額外地包括記憶體，含有欲藉例如一或多個多技、 理器執行的指令。但該等實施例並非囿限於本圖所示 或組態。行動計算裝置100之額外組件參考第4圖以進牛 細節討論如下。 於若干實施例中’一或多個產熱組件102可包含任何尚 當電氣裝置、半導體裝置、單晶片系統或可產生熱的其^ 組件。舉例言之，於多個實施例中，一或多個產熱組件1〇2 可包含多核心處理器。於若干實施例中，一或多個產熱組 件102可包括或包含一或多個無線電模組或發射器/接收器 組合(例如收發器）裝置。於多個實施例中，收發器裝置可包 含一個裝置其具有發射器及接收器二者組合且共享共用電 路或單一殼體。舉例言之，於若干實施例中，收發器可操 作來作動行動計算裝置100的無線通訊能力。描述其它實施 例及請求專利。 於若干實施例中，記憶體104可包含用在行動計算裝置 100上以暫時或永久為基礎，儲存資料、程式、指令序列、 或其它資訊的任何適當實體裝置。舉例言之，記憶體1〇4例 如可包含依電性或非依電性記憶體、RAM、r〇M、虛擬記 憶體或硬碟機。實施例並非囿限於此一脈絡。 •於多個實施例中’熱管理模組1〇6可包含軟體、韌體、 硬k、或軟體、韌體或硬體之任何適當組合。舉例言之， 10 201239596 於-個實施财’熱管理模組1G6可包含儲存於記憶體ι〇4 的邏輯，有待藉處理器執行來進行熱管理操作。於若干實 施例中，熱管理模組106可包含體現在計算裝置1〇〇之作業 系統_體或嵌人控制器。雖'然於第！圖中顯示為記憶體 104的一部分，但須瞭解熱管理模組1〇6可體現在計算裝置 100内部任何位置而仍係^人於所述實施例之範圍内。描述 其它實施例及請求專利。 於若干實施例中，空氣推進器可包含可產生氣流的 任何適當裝置。舉例言之，空氣推進器108可包含配置來在 。十算裝置100產生空氣流的風扇或鼓風機。於多個實施例 中工氣推進器108可包含葉片或紫葉的旋轉配置作用在空 氣來產生’或可包括由多個扇葉或肋條環繞輪轴安裝 所組成的風扇輪來產生空氣流^雖然用於舉例說明目的， 顯不及也述有限數目及型別的空氣推進器，但可使用任何 數目型別或配置的空氣推進器而仍係落入於所述實施例 之範圍内。 於右干實施例中’顯示器110可包含任何適當視覺介面 用來』不内4給行動計算裝置1GG的使用者。於-個實施例 中例如顯不器110可藉液晶顯示器(LCD)或觸覺敏感彩色 螢幕體現。於若干實施例中，觸覺敏感LCD可用在針 筆及/或手寫辨增呙 + 蠘态私式。於若干實施例中，顯示器110可 包含數位觸控 負不盗配置來占據膝上型計算裝置第一側的 相當大部分。 於夕個實施例中’電源供應器112可包含適用於提供電 £ 11 201239596 力給計算裝置1_任何裝置。舉财之，電源供應㈣ 可包含AC電源供應器或DC電源供應器。於若 電源供應器112可包含電池或其它能量儲存I置= 儲存且 提供電力料算裝置㈣。描述其它實_及請求專利。 於若干實施例中，通風口以可包含允許空氣進 計算裝置100的裝置刚之任何開口 '開槽或其它配置。於 多個實施例中，通風口 124可設置來允許氣流126進入行動 計算裝置1GG而冷卻裝置⑽的内部組件，諸如產熱組件 102。 於多個實施例令，熱管理模組1〇6可操作來監測空氣推 進器108的-或多個參數。舉例言之，熱管理模組1〇6可操 作來監測空氣推進器108的速度、每分鐘轉數(RPM)、電壓、 脈寬調變(PWM)餘何其它適當參數。於若干實施例中， 空氣推進器1G8可包含風扇或鼓風機，及—或多個參數可包 含風扇或鼓風機之速度或風扇或鼓風機之電壓。 於多個實施例中，熱管理模組1〇6可決定是否出現空氣 推進器10 8的一或多個參數變化，及基於檢測得之變化而採 取適當動作。舉例言之，熱管理模組1〇6可決定或可取得空 氣推進器108的預定基準線參數，諸如目標速度或目標電 壓。於若干實施例中，熱管理模組1〇6可連續地或定期地檢 查速度或電壓’且將此目標速度或目標電壓與目標速度或 目標電壓作比較。於多個實施例中，空氣推進器1〇8的速度 或電壓的改變可指示計算裝置丨〇 〇已經出現氣流變化。舉例 s之，系統氣流的顯著變化可能導致空氣推進器1〇8的一或 12 201239596 多個參數可測量的變化。在使用基於速度作閉路控制的空 氣推進器108之系統中，堵塞通風口 124可識別為要求來維 持空氣推進器速度之電壓降。在使用基於速度作閉路控制 的空氣推進器108之系統中，堵塞通風口 124可識別為空氣 推進器速度加快。描述其它實施例及請求專利。 於若干實施例中，熱管理模組106可操作來基於空氣推 進益108的—或多個參數變化而執行一或多個熱管理操 作於夕個實施例中，一旦基於空氣推進器1〇8的一或多個 參數變化而檢測得堵塞的通風口，熱管理模組1〇6可採行數 個動作來執行熱管理。舉例言之，可採料業系統通知諸 如工作列區域通知或可聽聞的警報嗶聲。於若干實施例 中此種通知可報告堵塞嚴重程度(例如輕度堵塞/重度堵塞 /等）及/或推薦使用者採取動作諸如「請調整筆電位置以免 過熱」。 ，於夕個實施例中’熱管理操作可包含有關該速度變化 或電昼變化產生-使用者通知。於若干實施例中，使用者 可匕3視覺、觸覺或聽覺通知，呈示給使用者來提醒 他們计錢置⑽的氣流已知發生變化。於多個實施例中， 使用者通知可包括㈣速度或電壓變化量之資訊及/或提 祕作來彌補速度或電壓變化。舉例言之，計算裝置ι〇〇可 ’打m㈣ϋ UG上來提醒使用者風扇速度已經增加 =百分ι表示通風口124堵塞。該訊息也可指示使用者 改變叶算ι置⑽的位置來彌補堵塞且防止過熱。 於若十實施例中，熱管理操作可包含基於檢測得氣流S 201239596 The components and permutations of the computing package are for illustrative purposes, but it should be understood that the action set 100 can include any number of components and permutations and still fall within the scope of the described embodiments. For example, in some embodiments, the action 400_100 may additionally include memory containing instructions to be executed by, for example, one or more multi-processors. However, such embodiments are not limited to the illustration or configuration shown in this figure. Additional components of the mobile computing device 100 are discussed below with reference to Figure 4 for details. In one embodiment, the one or more heat producing components 102 can comprise any electrical device, semiconductor device, single wafer system, or component that can generate heat. For example, in various embodiments, one or more of the heat producing components 1〇2 can include a multi-core processor. In some embodiments, one or more of the heat generating components 102 can include or include one or more radio modules or transmitter/receiver combinations (e.g., transceivers) devices. In various embodiments, a transceiver device can include a device having a combination of a transmitter and a receiver and sharing a common circuit or a single housing. For example, in some embodiments, the transceiver is operable to activate the wireless communication capabilities of the mobile computing device 100. Other embodiments and patents are described. In some embodiments, memory 104 can include any suitable physical device for use on mobile computing device 100 to store data, programs, sequences of instructions, or other information on a temporary or permanent basis. For example, the memory may include, for example, an electrical or non-electrical memory, RAM, r〇M, virtual memory, or a hard disk drive. Embodiments are not limited to this one. • In various embodiments, the thermal management module 1〇6 can comprise any suitable combination of software, firmware, hard k, or software, firmware or hardware. For example, 10 201239596 The implementation of the thermal management module 1G6 may include logic stored in the memory ι 4, which is to be executed by the processor for thermal management operations. In some embodiments, the thermal management module 106 can include an operating system or a built-in controller embodied in the computing device. Although 'there is the first! The figure is shown as part of the memory 104, but it should be understood that the thermal management module 1 6 can be embodied anywhere within the computing device 100 while still being within the scope of the described embodiments. Other embodiments and patents are described. In several embodiments, the air mover can include any suitable device that can generate an air flow. For example, air mover 108 can include a configuration. The counting device 100 generates a fan or blower for air flow. In various embodiments, the work air mover 108 may include a rotating arrangement of blades or purple leaves acting on the air to create 'or may include a fan wheel comprised of a plurality of blades or ribs surrounding the axle to create an air flow^ Although a limited number and type of air movers are not shown for illustrative purposes, any number of types or configurations of air movers may be used while still falling within the scope of the described embodiments. In the right-hand embodiment, the display 110 can include any suitable visual interface for the user of the mobile computing device 1GG. In an embodiment, for example, the display 110 can be embodied by a liquid crystal display (LCD) or a tactile-sensitive color screen. In some embodiments, the tactile-sensing LCD can be used in a stylus and/or handwritten recognition + 蠘 private mode. In some embodiments, display 110 can include a digital touch negative pirate configuration to occupy a substantial portion of the first side of the laptop computing device. In one embodiment, the power supply 112 can include any device suitable for providing power to the computing device 1_. For financial reasons, the power supply (4) can include an AC power supply or a DC power supply. The power supply 112 can include a battery or other energy storage I set = store and provide a power calculation device (4). Describe other real and patent claims. In some embodiments, the vents are slotted or otherwise configured to include any opening that allows air to enter the computing device 100. In various embodiments, vent 124 may be provided to allow airflow 126 to enter mobile computing device 1GG while cooling internal components of device (10), such as heat producing component 102. In various embodiments, the thermal management module 1 6 is operable to monitor - or a plurality of parameters of the air booster 108. For example, the thermal management module 1〇6 can be operated to monitor the speed, RPM, voltage, and pulse width modulation (PWM) of the air mover 108. In some embodiments, the air mover 1G8 can include a fan or blower, and - or a plurality of parameters can include the speed of the fan or blower or the voltage of the fan or blower. In various embodiments, the thermal management module 110 can determine whether one or more parameter changes of the air mover 108 occur and take appropriate action based on the detected change. For example, the thermal management module 110 can determine or obtain predetermined baseline parameters of the air mover 108, such as target speed or target voltage. In several embodiments, the thermal management module 1〇6 can continuously or periodically check the speed or voltage' and compare the target speed or target voltage to a target speed or target voltage. In various embodiments, a change in the speed or voltage of the air mover 1 可 8 may indicate that a change in airflow has occurred in the computing device 丨〇. For example, a significant change in system airflow may result in a measurable change in the parameters of the air mover 1〇8 or 12 201239596. In systems using air propulsion 108 based on speed for closed loop control, the blocked vent 124 can be identified as a voltage drop required to maintain the speed of the air mover. In systems using air propulsion 108 based on speed for closed loop control, the blocked vent 124 can be identified as an increase in air mover speed. Other embodiments and claimed patents are described. In some embodiments, the thermal management module 106 is operable to perform one or more thermal management operations based on the air propulsion benefit 108 - or a plurality of parameter changes in the embodiment, once based on the air propeller 1 〇 8 The thermal management module 1 6 can perform several actions to perform thermal management when one or more parameters change to detect a blocked vent. For example, the pick-up system informs, for example, a work area notification or an audible alarm beep. In some embodiments such notification may report the severity of the blockage (e.g., mild blockage/severe blockage/etc.) and/or recommend the user to take an action such as "please adjust the position of the notebook to avoid overheating." In an embodiment, the thermal management operation may include a user notification regarding the speed change or the power change occurrence. In some embodiments, the user may present a visual, tactile or audible notification to the user to alert them that the flow of the meter (10) is known to have changed. In various embodiments, the user notification may include (iv) information on speed or voltage changes and/or secrets to compensate for speed or voltage changes. For example, the computing device ι can be used to "m" (four) ϋ UG to remind the user that the fan speed has increased = a hundred percent means that the vent 124 is clogged. This message also instructs the user to change the position of the leaf (10) to compensate for the blockage and prevent overheating. In the ten embodiment, the thermal management operation may include detecting the airflow based on
S 13 201239596 受限制而改變計算裝置1⑼的組件效能狀態。舉例言之，產 熱組件102之效能狀態可基於空氣推進器108的速度或電壓 义化而自動地改變。於多個實施例中，改變效能狀態可包 3右忒空氣推進器1〇8的速度增高或電壓減低即節流該產 熱組件102。若通風口 124堵塞，藉由改變組件的效能狀態， 熱官理模組1G6可調整由計算裝置⑽所產生的熱來協助防 止裝置100的過熱情況或皮膚或殼體的溫度升高。 於若干實施例中，可能有更複雜的反應。某些熱管理 體系可仰㈣統層面校準來針對任何給定讀貞擔要求決 定最有效節流情況m統層面校準可取決於正常操作 空氣推進器之系統性能。但於若干實施例中，可能可使用 熱管理模組106針對*良空氣推進器狀況(例如堵塞的通風 口操作)做第二校準（或校準範圍）。藉此方式，當通風口堵 塞時，系統可即刻檢知每分鐘轉數(RPM)變化，切換成更為 適合目前狀況的校準常數集合’及執行計算裝置⑽之改良 式熱管理。 此外，於多個實施例中，管理模組1〇6可操作來監則 隨時間經過之空氣推進器效能及維護通知。舉例言之，當 空氣推進器效能隨時間經過而降級時，空氣推進器對^ 阻抗變化的回應可能維持定性相同。因此於若干實施例 中，系統的整個生命_間，熱管理模組1G6可執行簡單校 準來許可檢知a流堵S，即便當空氣推進器1()6或其它系統 組件的效能減低時亦復如此。 於多個實施例中，熱管理模、_6可作。動或加強熱管理 14 201239596 系統使用風扇軌謂塞_作為額外輸人。連同已知之 熱管理應用及裝置，熱管理缝廳就可聽聞㈣音而言可 改良終端使用者的人體工學’以及藉由調整空氣推進器速 度及如此基於檢測得之氣流特性調整空氣推進器的電力耗 用來官理系統的電力汲取。熱管理模組1〇6也可改良加壓流 設計的穩健’加壓流設計對堵塞的人口可能不成比例地敏 感。描述其它實施例及請求專利。 第1B及1C圖分別地例示說明行動計算裝置15〇及 180。於多個實施例中，行動計算裝置15〇及18〇可包含與第 1A圖之計算裝置1〇〇相同的或相似的裝置。於多個實施例 中，第1B圖之裝置15〇例示說明膝上型計算裝置之透視圖。 第1C圖之裝置180例示說明裝置諸如第丨2圖之膝上型計算 裝置之特寫側視圖。實施例並非囿限於第1A、1B ' lc圖所 示配置或組態。提出有限數目及型別的配置及組態以供例 示說明但非限制性。 於多個實施例中，雖然為求清晰並未全部顯示於第1β 圖，計算裝置150可包括與第1A圖之計算裝置100相同的或 相似的裝置。計算裝置150包括顯示器110、殼體12〇、通風 口 124及使用者通知128。雖然為了舉例說明顯示為膝上型 計算裝置，但須瞭解此處描述之實施例可應用於任何適當 計算裝置。描述其它實施例及請求專利。 於若干實施例中，殼體120可包含配置來罩住產熱組件 102的機殼 '空氣推進器106及計算装置1〇〇、15〇之其它内 部組件。於多個實施例中，機殼包括一或多個外表面含〜 15 201239596 或夕個開口（例如通風口 124)來協助氣流的進出殼體12〇。雖 j弟1B圖中通風口 I%係顯示在殼體12〇該側，但須瞭解通 風口可位在殼體12Qjl的任何位置而㈣落人於所述實施 例之範圍内。舉例言之’於若干實施例中，通風口 124可位 在殼體120底部。於此等實施例中，當計算襞置15〇放置在 使用者膝上或其它柔軟表面時常見堵塞的通風口，可優異 地使用熱管理模組120來檢測通風口堵塞。實施例並非囿限 於此一脈絡。 第1C圖例示說明於若干實施例中裝置180之側視圖。如 圖所示，裝置180可包括但非限於產熱組件1〇2、記憶體 104、熱管理模組106、空氣推進器1〇8、殼體12〇、通風口 124氣流126及堵塞132。裝置180的組件可與第丨八圖之裝置 100及第1B圖之裝置150中相同編號的組件相同或相似。雖 然顯示有限數目的組件用於例示說明目的，但須瞭解組件 的任何數目、組合、及排列皆可使用而仍係落入於所述實 施例之範圍内。 於多個實施例中，氣流126可藉空氣推進器1〇8通過通 風口 124而沒取入殼體120内部。舉例言之，空氣推進器 可包含風扇或鼓風機設計來汲取氣流126進入殼體120而冷 卻裝置180的一或多個組件’諸如產熱組件1〇2。如第1C圖 所示，於若干實施例中，通風口 124可被部分或全部堵塞， 可能影響氣流126。於多個實施例中，堵塞132可包含裝置 180的定.位或位置或因裝置丨8〇位置而發生。舉例言之，若 裝置ιέο係置放在雜亂桌面上、使用者膝上、軟墊、柔軟座 16 201239596 椅、床、或熟諳技藝人士將瞭解的任何其它適當材料上， 部分材料或雜亂將堵塞通風口124,如堵塞132例示說明。 實施例並非囿限於此一脈絡且須瞭解可堵塞通風口 124的 任何物品皆係落入於所述實施例之範圍内，及任何堵塞i 3 2 虿（例如部分或全部）也皆係落入於所述實施例之範圍内。 於若干實施例中，堵塞132可藉熱管理模組1〇6基於空 氣推進器108的一或多個參數變化而檢測。舉例言之，當通 風口 124被堵塞132時，空氣推進器1〇8的速度可能升高或用 來驅動空氣推進器108的電壓可能降低。於多個實施例中， 熱管理模組106可操作來如前文就第ία及iB圖所述，動態 地監測空氣推進器1〇8之參數而檢測堵塞132。描述其它實 施例及請求專利。 第2圖例示說明線圖2〇〇，顯示於若干實施例中系統氣 流如何變化可能導致空氣推進器速度、電壓、或脈寬調變 之可測量變化。舉例言之，如線圖2〇〇顯示，隨著流速的減 低，空氣推進器速度(RPM)增加。基於線圖200，顯然計算 系統的通風口堵塞結果導致系統氣流減低可基於空氣推進 器的一或多個參數變化檢測，諸如速度電壓或pWM。基於 此等變化，熱管理模組諸如第1A圖之熱管理模組1〇6可用來 改良計算系統之熱效能。 第3圖例示說明邏輯流程圖300之一個實施例。邏輯流 程圖300可藉多個系統及/或裝置執行’且視設計參數或效 能限制之一給定集合所述，可體現為硬體、軟體、韌體、 及/或其任一種組合。舉例言之，邏輯流程圖3〇〇之一或多S 13 201239596 Restricted changes in the component performance status of computing device 1 (9). For example, the performance state of the heat producing component 102 can be automatically changed based on the speed or voltage of the air mover 108. In various embodiments, changing the performance state may throttle the increase in speed or voltage reduction of the right air propeller 1 〇 8 to throttle the heat generating assembly 102. If the vent 124 is clogged, the thermal authority module 1G6 can adjust the heat generated by the computing device (10) to assist in preventing overheating of the device 100 or temperature rise of the skin or housing by changing the performance state of the assembly. In several embodiments, there may be more complex reactions. Some thermal management systems can be calibrated to determine the most efficient throttling conditions for any given readout. The level of calibration can depend on the system performance of the normal operating air mover. However, in some embodiments, it may be possible to use the thermal management module 106 to make a second calibration (or calibration range) for a good air mover condition (e.g., a blocked vent operation). In this way, when the vent is blocked, the system can immediately detect the change in revolutions per minute (RPM), switch to a set of calibration constants that are more suitable for the current situation, and perform an improved thermal management of the computing device (10). Moreover, in various embodiments, the management module 116 is operable to monitor air mover performance and maintenance notifications over time. For example, when the air mover performance degrades over time, the air mover's response to the impedance change may remain qualitatively the same. Thus, in several embodiments, the thermal management module 1G6 can perform a simple calibration to permit detection of a flow block S throughout the life of the system, even when the performance of the air mover 1 () 6 or other system components is reduced. This is the case. In various embodiments, the thermal management module, _6, can be used. Dynamic or enhanced thermal management 14 201239596 The system uses the fan track to be plugged as an additional input. In conjunction with known thermal management applications and devices, the thermal management slot can improve the ergonomics of the end user in terms of audible (four) sounds and adjust the air mover by adjusting the air mover speed and thus based on the detected airflow characteristics. The power consumption is used to draw power from the government system. The thermal management module 1〇6 can also improve the robust flow design of the pressurized flow design. The pressurized flow design may be disproportionately sensitive to the clogged population. Other embodiments and claimed patents are described. The first and second graphs illustrate the mobile computing devices 15A and 180, respectively. In various embodiments, the mobile computing devices 15A and 18A can include the same or similar devices as the computing device 1A of Figure 1A. In various embodiments, device 15 of Figure 1B illustrates a perspective view of a laptop computing device. Apparatus 180 of Figure 1C illustrates a close-up side view of a device such as the laptop computing device of Figure 2. The embodiments are not limited to the configuration or configuration shown in Figures 1A, 1B 'lc. A limited number and type of configurations and configurations are presented for illustrative purposes and are not limiting. In various embodiments, although not all of the first map is shown for clarity, computing device 150 may include the same or similar devices as computing device 100 of FIG. Computing device 150 includes display 110, housing 12, vent 124, and user notification 128. Although shown as a laptop computing device for purposes of illustration, it is to be understood that the embodiments described herein are applicable to any suitable computing device. Other embodiments and claimed patents are described. In several embodiments, the housing 120 can include a housing 'air propeller 106 that is configured to house the heat generating assembly 102 and other internal components of the computing device 1〇〇, 15〇. In various embodiments, the housing includes one or more outer surfaces containing 〜15 201239596 or an opening (e.g., vent 124) to assist in the flow of air into and out of the housing 12. Although the vent I% is shown on the side of the casing 12, it is to be understood that the vents can be located anywhere in the casing 12Qj1 and (d) fall within the scope of the embodiment. By way of example, in several embodiments, the vent 124 can be located at the bottom of the housing 120. In such embodiments, the thermal management module 120 can be advantageously used to detect vent clogging when calculating the vents that are commonly clogged when placed on a user's lap or other soft surface. The embodiment is not limited to this one. Figure 1C illustrates a side view of device 180 in several embodiments. As shown, the device 180 can include, but is not limited to, a heat producing component 1200, a memory 104, a thermal management module 106, an air mover 1 〇 8, a housing 12 〇, a vent 124 airflow 126, and a clogging 132. The components of device 180 may be the same or similar to the same numbered components in device 100 of Figure 8 and device 150 of Figure 1B. Although a limited number of components are shown for illustrative purposes, it is to be understood that any number, combination, and arrangement of components can be used while still falling within the scope of the embodiments. In various embodiments, the airflow 126 may pass through the vent 124 through the air mover 1 〇 8 without being taken into the interior of the housing 120. For example, the air mover can include a fan or blower design to draw airflow 126 into the housing 120 to cool one or more components of the device 180, such as the heat producing component 1〇2. As shown in Figure 1C, in some embodiments, the vent 124 may be partially or fully blocked, possibly affecting the airflow 126. In various embodiments, the blockage 132 can include a position or position of the device 180 or occur due to the position of the device. For example, if the device ιέο is placed on a messy tabletop, the user's lap, the cushion, the soft seat 16 201239596 chair, bed, or any other suitable material that will be known to those skilled in the art, some materials or clutter will be blocked. Vent 124, such as clogging 132, is illustrated. The embodiment is not limited to this context and it is to be understood that any item that can block the vent 124 falls within the scope of the embodiment, and that any blockage i 3 2 虿 (eg, part or all) falls within the scope of the embodiment. Within the scope of the described embodiments. In some embodiments, the blockage 132 can be detected by the thermal management module 1〇6 based on one or more parameter changes of the air mover 108. For example, when the vent 124 is blocked 132, the speed of the air mover 1 〇 8 may increase or the voltage used to drive the air mover 108 may decrease. In various embodiments, the thermal management module 106 is operable to dynamically detect the parameters of the air mover 1 而 8 to detect clogging 132 as previously described for the ία and iB diagrams. Other embodiments and patents are described. Figure 2 illustrates a line diagram 2A showing how varying system airflow in several embodiments may result in measurable changes in air mover speed, voltage, or pulse width modulation. For example, as shown in Figure 2, as the flow rate decreases, the air mover speed (RPM) increases. Based on the line graph 200, it is apparent that the vent clogging result of the computing system results in system airflow reduction based on one or more parameter change detections of the air mover, such as speed voltage or pWM. Based on these changes, a thermal management module, such as thermal management module 1〇6 of Figure 1A, can be used to improve the thermal performance of the computing system. FIG. 3 illustrates one embodiment of a logic flow diagram 300. The logic flow diagram 300 can be implemented by a plurality of systems and/or devices and can be embodied as a given set of design parameters or performance limitations, and can be embodied as hardware, software, firmware, and/or any combination thereof. For example, one or more of the logic flow diagrams
S 17 201239596 個操作可藉欲藉邏輯裝置(例如電腦、處理器）執行的可執行 程式或其它非過渡電腦可讀取指令體現。邏輯流程圖可 描簡文參考第认、10、1(：及2圖描述的動態氣流監測及 熱官理。描述其它實施例及請求專利。 於多個實施例中，於搬可監測空氣推進器的一或多個 例如於右干實施例中，熱管理模組觸可監測空氣推 進益1〇8的—或多個參數’諸如速度或電壓。於3G4，可檢 測-或多個參數之變化。舉例言之，熱管理模組⑽可檢測 空乳推進器⑽的參數變化，諸如風扇速度增加或電壓減 ，。於遍’於多個實施例中’ 一或多個熱管理操作可基於 一或多個參數變化執行，該等參數指示計算裝置之氣流變 化。舉例言之’熱管理模組·可操作來基於空氣推進器⑽ 的广數k化;日料算m⑽的通風口以堵塞*產生使用 者通知或調整其它系統組件的操作參數。 於右干實施例令，空氣推進器可包含風扇或鼓風機， 及:或多個參數可μ風歧鼓職之速度或電壓。於多 =貫知例巾’可產生有關速度或電壓變化的使用者通知。 =言之’熱管理模、_6可產生使时通知將顯示在顯示 或如同音訊通知。於若干實施例中，使用者通知可 ^括有關速度或電壓變化量㈣訊或彌補速度變化的提議 動作’速度的增加或電壓的減低可指示氣流限制。 =干實施㈣，計算裝置之—崎的效能狀態可基 “：或，之變化而改變。舉例言之’熱管理模組106可 采卜改變產熱組件102的效能狀態，例如若空氣推進器 201239596 i〇8的速度增^或電壓減低，諸如節流產熱组件ι〇2。 於若干κ施例中，可監測空氣推進器之維護狀態。舉 例言之’除了監測空氣推進器108的—或多個參數外，熱管 理模組106也可操作來監測空氣推進器⑽之維護狀態。於 多個實施财’監測維絲態可包括決定线推進器1〇8之 使用期磨耗’及磨耗或其它維護資訊如何影響空氣推進器 108之效能。於若干實_巾，若_狀態降至低於預定臨 界值’則可產生維護通知。舉例言之，若空氣推進器應停 止如預期般輯作，或如賴表或日程表界^，則熱管理 模組108可操作來產生通知。 於若干實施例中，若空氣推進器的一或多個參數未檢 測得任何變化，則可選擇第一熱組態。舉例言之，若熱管 理模組H)6決;t空氣推進器⑽係如預期般地操作（例如^ 無速度增加或電壓減低），則可選擇允許計算裝置⑽正常 操作的第-熱組悲。於其它實施例中，則得空氣推進 器之-或多個參數的變化，則可選擇第二熱組態。舉例言 之，若基於空氣推進器1〇8的一或多個參數變化，熱管理模 組106決定通風口 124被堵塞，則熱管理模組1〇6可選擇第二 熱組態，第二熱組態可配置來產生比第一熱組態更少熱。 描述其它實施例及請求專利。 第4圖為系統具體實施例之略圖。更明確言之，第4曰 為略圖顯示一種系統400其可包括多個元件。舉例言之，第 4圖顯示系統400可包括處理器402、晶片組4〇4、輪入/輸出 (I/O)裝置406、隨機^取記憶體（RAM)(諸如動熊S 17 201239596 operations may be embodied by executable programs or other non-transitional computer readable instructions that are to be executed by logic devices (eg, computers, processors). The logic flow diagram can be described with reference to the dynamic airflow monitoring and thermal theory described in Figures 10 and 1 (described in the following figures: and other embodiments and patents are described. In various embodiments, the air propulsion can be monitored. One or more of the devices, for example, in the right-hand embodiment, the thermal management module can monitor the air-propelled benefits - or multiple parameters - such as speed or voltage - at 3G4, detectable - or multiple parameters For example, the thermal management module (10) can detect parameter changes in the empty milk pusher (10), such as fan speed increase or voltage decrease. In one embodiment, one or more thermal management operations can be based on One or more parameter changes are performed, the parameters indicating a change in the airflow of the computing device. For example, the 'thermal management module is operable to be based on the wide k of the air mover (10); the vent of the daily m(10) is blocked * Generate user notifications or adjust operating parameters of other system components. In the right-hand embodiment, the air thruster can include a fan or blower, and: or a plurality of parameters can be used to speed or voltage.知知例巾' Generate user notifications about speed or voltage changes. = 'The thermal management module, _6 can generate a notification that the time will be displayed on the display or as an audio notification. In some embodiments, the user notification can include speed or voltage. The amount of change (4) or the proposed action to compensate for the change in speed 'the increase in speed or the decrease in voltage can indicate the airflow limit. = Dry implementation (4), the performance state of the computing device - the performance of the state can be changed based on: "or change." The 'thermal management module 106 can change the performance status of the heat generating component 102, for example, if the speed of the air mover 201239596 i〇8 is increased or the voltage is reduced, such as the throttling heat generating component ι〇2. The maintenance state of the air mover can be monitored. For example, in addition to monitoring the air mover 108 or a plurality of parameters, the thermal management module 106 can also be operated to monitor the maintenance status of the air mover (10). Implementing the 'monitoring the wire state can include determining the wear of the line propeller 1〇8' and how the wear or other maintenance information affects the performance of the air mover 108. A maintenance notification may be generated if the _ state falls below a predetermined threshold. For example, if the air mover should stop compiling as expected, or as the table or schedule, the thermal management module 108 Operable to generate a notification. In several embodiments, the first thermal configuration may be selected if one or more parameters of the air mover are not detected. For example, if the thermal management module H) 6 The t-air thruster (10) operates as intended (eg, no speed increase or voltage reduction), and may select a first-hot group that allows the computing device (10) to operate normally. In other embodiments, an air mover is provided. The second thermal configuration may be selected by - or a plurality of parameters. For example, if one or more parameters of the air mover 1 变化 8 are changed, the thermal management module 106 determines that the vent 124 is blocked. The thermal management module 1 6 can then select a second thermal configuration that can be configured to generate less heat than the first thermal configuration. Other embodiments and claimed patents are described. Figure 4 is a schematic diagram of a specific embodiment of the system. More specifically, Section 4 shows a system 400 that may include multiple components. For example, the fourth diagram display system 400 can include a processor 402, a chipset 4〇4, a turn-in/output (I/O) device 406, and a random access memory (RAM) (such as a mobile bear).
19 S 201239596 RAM(DRAM))408、及唯讀記憶體(R〇M)410、及多個平台 組件414(例如風扇、交叉流鼓風機、散熱座、DTM系統、 冷卻系統、機殼、通風口等）。此等元件可體現為硬體、軟 體、或其任一種組合。但實施例並非囿限於此等元件。 如第4圖所示，I/O裝置406、RAM 408、及ROM 410係 藉晶片組404耦接至處理器402。晶片組404可藉匯流排412 麵接至處理器402。據此匯流排412可包括多條線路。 處理器402可以是中央處理單元包令—或多個處理器 核心’及可包括任何數目之處理器具有任何數目之處理器 核心。處理器4〇2可包括任一型處理單元，諸如cpu、多處 理單元、精簡指令集電腦(RISC)、具有管線之處理器、複 雜指令集電腦(CISC)、數位信號處理器（DSP)等。 雖然於圖中未顯示，但系統400可包括各種介面電路， 諸如乙太網路介面及/或通用串列匯流排(USB)介面、及/或 其類。於若干具體實施例中，L/0裝置406可包含一或多個 輸入裝置連結至介面電路用以將資料及指令載入系統 400。舉例言之，輸入裝置可包括鍵盤(實體或虛擬/軟性）' 滑鼠、觸控螢幕、軌跡墊' 軌跡球、網格系統、語音辨識 系統、及/或其類。同理，：[/〇裝置406可包含一或多個輸出 裝置連結至介面電路用以輸出資訊給操作員。舉例言之， 若有所需’輪出裝置可包括一或多個顧示器、印表機、揚 聲器、及/或其它輸出裝置。舉例言之，輸出裝置中之一者 可以是顯示器。顯示器可以是陰極射線管（CRT)、液晶顯示 器（LCD)、或任何其它型別的顯示器。 。 20 201239596 系統4 Ο 0也可具有有線或無線網路介面來透過至網路 的連結而與其它裝置交換資料。網路連結可以是任一型網 路連結，諸如乙太網路連結、數位用戶線路(DSL)、電話線 路、同軸纜線等。網路可以是任一型網路，諸如乙太網路、 電話網路、纜線網路、無線網路、封包交換網路、電路交 換網路、及/或其類。 此處列舉多個特定細節以供徹底瞭解實施例。但熟諳 技藝人士將瞭解可無此等特定細節而實施該等實施例。於 其它情況下，眾所周知之操作、組件及電路未曾描述其細 節以免遮掩實施例。可瞭解此處描述之特定結構及功能細 節可以是表示型態而非必然限制實施例之範圍。 多個實施例可使用硬體元件、軟體元件、或二者之組 合體現。硬體元件之實例可包括處理器、微處理器、電路、 電路元件(例如電晶體、電阻器、電容器、電感器等）、積體 電路、特定應用積體電路(ASIC)、可規劃邏輯裝置(PLD)、 數位信號處理器（DSP)、可現場規劃閘陣列（FPGA)、邏輯 閘、暫存器、半導體裝置、晶片、微晶片、晶片組等。軟 體之實例可包括軟體組件、程式、應用程式、電腦程式、 應用規劃程式、系統程式、機器程式、作業系統軟體、中 介軟體、韌體、軟體模組、常式、次常式、函式、方法、 程序、軟體介面、應用程式規劃介面（API)、指令集、計算 代碼、電腦代碼、代碼節段、電腦代碼節段、字元、數值、 符碼、或其任一種組合。決定實施例是否使用硬體元件及/ 或軟體元件體現可依據任何數目之因素而改變，該等因素19 S 201239596 RAM (DRAM) 408, and read-only memory (R〇M) 410, and a plurality of platform components 414 (eg, fans, cross-flow blowers, heat sinks, DTM systems, cooling systems, enclosures, vents) Wait). These elements can be embodied as hardware, software, or any combination thereof. However, embodiments are not limited to such elements. As shown in FIG. 4, I/O device 406, RAM 408, and ROM 410 are coupled to processor 402 by chipset 404. Wafer set 404 can be interfaced to processor 402 by bus 412. Accordingly, bus bar 412 can include multiple lines. Processor 402 can be a central processing unit package - or multiple processor cores' and can include any number of processors having any number of processor cores. The processor 〇2 may include any type of processing unit such as a CPU, a multi-processing unit, a reduced instruction set computer (RISC), a processor with a pipeline, a complex instruction set computer (CISC), a digital signal processor (DSP), and the like. . Although not shown in the figures, system 400 can include various interface circuits, such as an Ethernet interface and/or a universal serial bus (USB) interface, and/or the like. In some embodiments, L/O device 406 can include one or more input devices coupled to the interface circuitry for loading data and instructions into system 400. For example, the input device can include a keyboard (physical or virtual/soft) 'mouse, touch screen, track pad' trackball, grid system, voice recognition system, and/or the like. Similarly, the [/〇 device 406 can include one or more output devices coupled to the interface circuit for outputting information to the operator. For example, if desired, the wheeling device can include one or more of an indicator, a printer, a speaker, and/or other output device. For example, one of the output devices can be a display. The display can be a cathode ray tube (CRT), a liquid crystal display (LCD), or any other type of display. . 20 201239596 System 4 Ο 0 can also have a wired or wireless network interface to exchange data with other devices through the connection to the network. The network connection can be any type of network connection, such as an Ethernet connection, a digital subscriber line (DSL), a telephone line, a coaxial cable, and the like. The network can be any type of network, such as an Ethernet network, a telephone network, a cable network, a wireless network, a packet switched network, a circuit switched network, and/or the like. Numerous specific details are set forth herein for a thorough understanding of the embodiments. Those skilled in the art will appreciate that the embodiments can be practiced without these specific details. In other instances, well-known operations, components, and circuits have not been described in detail to avoid obscuring the embodiments. It is understood that the specific structural and functional details described herein may be in the form of representations and are not intended to limit the scope of the embodiments. Various embodiments may use a hardware component, a software component, or a combination of both. Examples of hardware components can include processors, microprocessors, circuits, circuit components (eg, transistors, resistors, capacitors, inductors, etc.), integrated circuits, application-specific integrated circuits (ASICs), programmable logic devices (PLD), digital signal processor (DSP), field programmable gate array (FPGA), logic gate, scratchpad, semiconductor device, wafer, microchip, chipset, etc. Examples of software may include software components, programs, applications, computer programs, application planning programs, system programs, machine programs, operating system software, mediation software, firmware, software modules, routines, subroutines, functions, Method, program, software interface, application programming interface (API), instruction set, calculation code, computer code, code segment, computer code segment, character, value, symbol, or any combination thereof. Determining whether an embodiment uses hardware components and/or software components can vary depending on any number of factors, such factors
S 21 201239596 諸如期望的運鼻率、功率位準、熱公差、處理週期預算、 輸入資料率、輸出資料率、記憶體資源、資料匯流排速度、 及其它設計或效能限制。 若干實施例可使用「耦合」及Γ連結」連同其衍生詞 描述。此專術§吾並非意圖為彼此的同義詞β舉例言之，若 干實施例可使用「連結的」及/或「耦合的」等術語來指示 二或多個元件係彼此直接實體接觸或電氣接觸。但「耦合 的」一詞也可表示二或多個元件並非彼此直接接觸，但仍 然彼此協作或互動。 若干貝施例例如可使用機器可讀取或電腦可讀取媒體 或物件體現，該等媒體或物件可儲存指令、指令集、或電 腦可執行代碼，其若藉機S錢理器執行時可使得機器或 處理器執行依據實施例之方法及/或操作。此種機器可包括 例如任何適當處理平台、計算平台、計算裝置、處理裝置、 計算系統、處理系統、電腦、處理器等，及可使用硬體及/ 或軟體之任-種適當组合體現1若干實施例中，機器可 讀取媒體或物件可包含非過渡媒體，且可包括例如任何適 當型別的記憶體單^ '記憶«置、記憶體物件、記憶體 媒體、儲存裝置、儲存物件、儲存媒體及/或儲存單元，例 如記m或非可卸式媒體、依電性或非依電性記 憶體或媒體、可抹除或非可抹除媒體、可寫式或可覆寫式 =體、數位或類比媒體、硬碟、軟碟、光碟·唯讀記憶體 (CD-R0M)、·可錄式光碟(CD_R)、光碟可覆寫式(cd請）、 碟、磁碟 '磁光碟、可㈣記財或記憶碟、各型數位 22 201239596 影音碟(DVD)、磁帶、卡匣等。指令可包括任何適當型別 之代碼，諸如來源代碼、編譯代碼、解譯代碼、可執行代 碼、靜態代碼、動態代碼、加密代碼等使用任何適當高階、 低階、物件導向、視覺、編譯及/或解譯程式語言白 除非另行陳述，否則須瞭解術語諸如「處理」、「運算」、 「計算」、「決定」等係指電腦或計算系統或類似之電子^ 算裝置之動似/或處雌序，該料置將在㈣系統之暫 存器及/或記憶體内部表示為實體量(偏α電子）的資料操縱 及/或變換成類似地表示為在電腦系統之記憶體、暫存器或 ^它料資訊儲存、傳輸絲示裝置内部的實體量的其它 資料》實施例並非限於此一脈絡。 須注意此處描述之方法無需以所述順序或任何特定順 序執行。此外，就域所述之方法描述衫個活動可 列或並列方式執行。 雖然於此處已經例示說明及描述特定實施例，須瞭解 經計算來達成相同目的的任何配置皆可取代所示特定實施 例。本揭轉意圖㈣多個實施例之任何及全侧適或變 =。須瞭解前文描述係用於舉例說明而非限制性。前述實 施例之組合及此處未特別描述之其它實施例為熟諳技藝人 士綜覽前文描述時將賴自明。如此，多個實施例之範圍 包括其中使用前述組成、結構、及方法的任何其它應用。 須強調揭示的摘要說明部分係遵照37 c.fr §l 72(w :提供，要求摘錢明將允許讀者快迷確定技術揭示之本 質及主旨。須暸解其將不用來解譯或限制中請專利範圍之S 21 201239596 such as desired nose delivery rate, power level, thermal tolerance, processing cycle budget, input data rate, output data rate, memory resources, data bus speed, and other design or performance limitations. Several embodiments may use "coupled" and "connected" along with their derivatives. This singularity is not intended to be a synonym for each other. For example, the terms "connected" and/or "coupled" may be used to indicate that two or more elements are in direct physical or electrical contact with each other. However, the term "coupled" may also mean that two or more elements are not in direct contact with each other, but still cooperate or interact with each other. A number of embodiments may be embodied, for example, using machine readable or computer readable media or objects, which may store instructions, instruction sets, or computer executable code that may be executed by an exciter. The machine or processor is caused to perform the methods and/or operations in accordance with the embodiments. Such a machine may include, for example, any suitable processing platform, computing platform, computing device, processing device, computing system, processing system, computer, processor, etc., and may be embodied in any suitable combination of hardware and/or software. In an embodiment, the machine readable medium or article may comprise non-transitional media, and may include, for example, any suitable type of memory memory, memory object, memory media, storage device, storage object, storage Media and/or storage unit, such as m or non-removable media, electrical or non-electrical memory or media, erasable or non-erasable media, writable or rewritable = body , digital or analog media, hard disk, floppy disk, CD-ROM, CD-R0M, CD-R, CD-ROM, CD-ROM, CD-ROM (4) Recording money or memory discs, various types of digital 22 201239596 audio and video discs (DVD), magnetic tapes, cassettes, etc. Instructions may include any suitable type of code, such as source code, compiled code, interpreted code, executable code, static code, dynamic code, encrypted code, etc., using any suitable high order, low order, object oriented, visual, compiled, and/or Or interpret the program language unless otherwise stated, such terms as "processing", "operation", "calculation", "decision", etc. refer to the movement or location of a computer or computing system or similar electronic computing device. In the female sequence, the material is manipulated and/or transformed into a physical quantity (partial alpha electron) in the scratchpad and/or memory of the system (4), and is similarly represented as a memory in the computer system, temporarily stored. The apparatus or other information for storing and transmitting the physical quantity inside the wire display device is not limited to this embodiment. It should be noted that the methods described herein need not be performed in the order described or in any particular order. In addition, the methods described in the domain describe how the activities can be performed in a column or side by side manner. Although the specific embodiments have been illustrated and described herein, it is understood that any configuration that is calculated to achieve the same objectives may be substituted for the particular embodiments shown. This disclosure is intended to (4) any and all aspects of the various embodiments. It is to be understood that the foregoing description is illustrative and not restrictive. Combinations of the foregoing embodiments, and other embodiments not specifically described herein, will be considered by those skilled in the art. Thus, the scope of various embodiments includes any other application in which the foregoing compositions, structures, and methods are used. It is important to emphasize that the abstract description of the disclosure is in accordance with 37 c.fr §l 72 (w: provided that the request for the withdrawal of the money will allow the reader to quickly determine the nature and subject matter of the technical disclosure. It must be understood that it will not be used for interpretation or limitation. Patent scope
23 S 201239596 範圍或意義而提交。此外，二， 各項特徵係共同集結在單―實:^說明部分中’可知 暢化。本揭不方法絕非解譯為反 内谷机 :之實施例要求比較申請專利範圍各= = :::: 的特徵，如下申請專利範圍各項反映，本發 取決於比早—所揭㈣施例之全部特曰如 :，下列申請專利範圍各項係藉此而併入詳細=:如 隨附之申請專利範圍各項中「^括_較佳實施例。於 別地係用作為「包含」及「其中」個_ 當物。此外，「第―」、「第二」、及「第三::央文相 標示用而非意圖對其物件加諸任何序數要求。4只作為 雖然已經料鄕徵及㈤枝動作的 主旨，但須瞭解隨附之申請專利範圍各項中界定=述 非必要囿限於前述特徵或動作。反而前述特定特徵^並 係揭示作為體現巾請專利範圍各項之實例形式或動作 【圖式簡辱_ ^^明】 第1A圖顯不第—系統之—個實施例。 第1B圖顯示第二系統之-個實施例。 第1C圖顯示第三系統之—個實施例。 第2圖顯不線圖之一個實施例。 第3圖顯示流程圖之一個實施例。 第4圖顯示第四系統之-個實施例。 24 201239596 【主要元件符號說明】 100、150、180…行動計算裝 置、通訊系統 102…產熱組件 104.. .記憶體 106.. .熱管理模組 108.. .空氣推進器 110.. .數位顯示器 112.. .電源供應器 120.. .殼體 124.. .通風口 126.. .氣流 128.. .使用者通知 132.. .堵塞 200.. .線圖 300.. .邏輯流程圖 302、304、306...處理方塊 400.. .系統 402.. .處理器 404.. .晶片組 406 ...I/O 裝置 408.. .隨機存取記憶體(RAM) 410…唯讀記憶體(ROM) 414.. .平台組件 2523 S 201239596 Submitted by scope or meaning. In addition, second, the characteristics are collectively assembled in the single-actual: ^ description section, which is known to be smooth. The method of this disclosure is by no means interpreted as an anti-inner machine: the embodiment requires comparison of the characteristics of the patent application scope = = ::::, as reflected in the following patent scope, this issue depends on the earlier-exposed (four) All the features of the following examples are as follows: The following claims are hereby incorporated by reference in their entirety. Contains "and" of them. In addition, "first", "second", and "third::" are used instead of the intention to impose any ordinal requirements on their objects. 4 as the main purpose of the action and the (five) action, However, it should be understood that the definitions in the accompanying patent application scope are not limited to the foregoing features or actions. Instead, the specific features described above are disclosed as examples of actions or actions of the patent scope. _ ^^明] Figure 1A shows an embodiment of the system - Figure 1B shows an embodiment of the second system. Figure 1C shows an embodiment of the third system. One embodiment of the line graph. Fig. 3 shows an embodiment of the flowchart. Fig. 4 shows an embodiment of the fourth system. 24 201239596 [Description of main component symbols] 100, 150, 180... mobile computing device, communication System 102... heat production component 104.. memory 106.. thermal management module 108.. air propeller 110.. digital display 112.. power supply 120.. housing 12.. Vent 126.. . Airflow 128.. User notification 132.. . Block 200.. . 300.. Logic Flowchart 302, 304, 306...Processing Block 400.. System 402.. Processor 404.. Chipset 406 ... I/O Device 408.. Random Access Memory Body (RAM) 410...Read only memory (ROM) 414.. Platform component 25