TWI553963B - Ten-frequency band antenna - Google Patents
Ten-frequency band antenna Download PDFInfo
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- TWI553963B TWI553963B TW104132758A TW104132758A TWI553963B TW I553963 B TWI553963 B TW I553963B TW 104132758 A TW104132758 A TW 104132758A TW 104132758 A TW104132758 A TW 104132758A TW I553963 B TWI553963 B TW I553963B
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- frequency band
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- carrier
- line
- band
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/378—Combination of fed elements with parasitic elements
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Description
本發明係有關一種天線,尤指一種具有提昇低頻頻率響應及增加高頻頻寬的十頻段天線。 The present invention relates to an antenna, and more particularly to a ten-band antenna having a low frequency response and a high frequency bandwidth.
目前市面上常見的雙頻倒F型天線(Planar Inverted-F Antenna,PIFA),此倒F型天線的製作是透過二維印刷印刷電路板技術直接將金屬銅材質印刷在印刷印刷電路板上,以形成平板狀的多頻天線,或者利用沖壓技術將金屬薄片沖壓形成三維的多頻天線。 Planar Inverted-F Antenna (PIFA), which is commonly used in the market, is manufactured by directly printing metal copper on a printed circuit board through two-dimensional printed circuit board technology. The metal foil is stamped to form a three-dimensional multi-frequency antenna by forming a flat multi-frequency antenna.
由於改變印刷印刷電路板二維輻射體圖案或改變金屬薄片沖壓的三維輻射體的幾何形狀,可以使天線達到多頻段的收發效果。但是為了滿足信號收發品質,以及避免周圍環境的影響造成其頻率協調失準,因此以該印刷印刷電路板上形成的天線,或者以該金屬薄片沖壓形成的天線的輻射體勢必具有一特定體積,為了安裝具有特定體積的PIFA天線結構,電子裝置內部也必須預留一適當的空間來安置該PIFA天線結構,如此一來勢必違背電子裝置朝輕薄短小的小型化設計的需求。 By changing the two-dimensional radiator pattern of the printed circuit board or changing the geometry of the three-dimensional radiator stamped by the foil, the antenna can be multi-band transmitted and received. However, in order to satisfy the signal transmission and reception quality and avoid the influence of the surrounding environment, the frequency coordination misalignment thereof, the radiation formed by the antenna formed on the printed circuit board or the antenna formed by stamping the metal foil is bound to have a specific volume. In order to install a PIFA antenna structure with a specific volume, an appropriate space must be reserved inside the electronic device to house the PIFA antenna structure, which is in hindrance to the need for the electronic device to be thin, light and small.
在科技技術不斷的提昇下,為了解決上述的問題,將天線的輻射體製作在由陶瓷材質製成的方形載體上,如圖1及圖2所示,該天線10的載體101表面上具有一收發信號的高頻段102及一低頻段103的輻射體,並 將該載體101固接於該印刷電路板20上,該印刷電路板20的二表面上各具有一接地金屬面201、一信號饋入微帶線202及一接地線203。以該信號饋入微帶線202及該接地線203與載體101的輻射體電性連結。由於該高頻段102位於該載體101的右邊,該低頻段103位於該載體101的左邊,在天線10與印刷電路板20電性固接後,使該低頻段103對應該印刷電路板20的接地金屬面201的面積大於該高頻段102對應該接地金屬面201的面積,因此使該低頻段102受到接地屏蔽影響較多,在通信時使該低頻段103的頻率響應變差(如圖2的標號A),且也使得高頻段102的頻寬也不夠寬(僅限於在6個頻段,如圖2的標號B),讓整個天線的收發信號品質降低,以及收發信號頻寬受到限制。 Under the continuous improvement of technology, in order to solve the above problems, the radiator of the antenna is fabricated on a square carrier made of ceramic material. As shown in FIG. 1 and FIG. 2, the carrier 101 of the antenna 10 has a surface on the surface. Transmitting and transmitting signals in the high frequency band 102 and a low frequency band 103 radiator, and The carrier 101 is fixed to the printed circuit board 20. Each of the two surfaces of the printed circuit board 20 has a grounded metal surface 201, a signal fed to the microstrip line 202, and a grounding line 203. The signal is fed into the microstrip line 202 and the ground line 203 is electrically connected to the radiator of the carrier 101. Since the high frequency band 102 is located on the right side of the carrier 101, the low frequency band 103 is located on the left side of the carrier 101, and after the antenna 10 is electrically fixed to the printed circuit board 20, the low frequency band 103 is grounded corresponding to the printed circuit board 20. The area of the metal surface 201 is larger than the area of the high frequency band 102 corresponding to the grounded metal surface 201. Therefore, the low frequency band 102 is affected by the grounding shield, and the frequency response of the low frequency band 103 is deteriorated during communication (as shown in FIG. 2). The label A) also makes the bandwidth of the high frequency band 102 not wide enough (only in 6 frequency bands, as shown by the reference B in FIG. 2), so that the transmission and reception signal quality of the entire antenna is lowered, and the bandwidth of the transmission and reception signals is limited.
因此,本發明之主要目的,在於解決傳統的缺失,本發明將天線的載體表面上所依附的高頻段及低頻段的輻射體變換位置,在該天線的載體與印刷電路板固接後,該載體上的低頻段位對應該印刷電路板較小面積的接地金屬面,使該載體上的低頻段處於一自由空間上,讓低頻段的頻率響應效果佳以及增加高頻段的頻寬。 Therefore, the main object of the present invention is to solve the conventional defect. The present invention combines the high frequency band and the low frequency band of the antenna on the surface of the carrier, after the carrier of the antenna is fixed to the printed circuit board, The low frequency band on the carrier corresponds to the grounded metal surface of the printed circuit board with a small area, so that the low frequency band on the carrier is in a free space, so that the frequency response of the low frequency band is good and the bandwidth of the high frequency band is increased.
本發明之另一目的,在於以該載體上的盲孔及肋條狀結構的設計,作為載體本身的減重與抑制成型翹曲變形,且該盲孔的面積與容積用以調整該載體的等效介電常數,以達成調整天線諧振頻率與頻寬的目的。且該盲孔之形狀與對稱性可因設計做任意變換調整。 Another object of the present invention is to reduce the weight of the carrier itself and suppress the warpage deformation of the carrier by using the design of the blind hole and the rib structure on the carrier, and the area and volume of the blind hole are used to adjust the carrier. The dielectric constant is used to achieve the purpose of adjusting the antenna resonance frequency and bandwidth. And the shape and symmetry of the blind hole can be adjusted by any transformation of the design.
本發明之再一目的,在於以一電感器電性連結在接地線與微帶線上,除了可以調整阻抗外,還形成一個下地連結狀態,使天線形成一個雙頻倒F型的耦極天線。 A further object of the present invention is to electrically connect the ground line and the microstrip line with an inductor. In addition to adjusting the impedance, a lower ground connection state is formed, so that the antenna forms a dual-frequency inverted-F type coupling antenna.
為達上述之目的,本發明所提供的一種十頻段天線,包括:一載體、一高頻段、一低頻段、一印刷電路板及一電感器。該載體為陶瓷方形體,其上具有一正面、一頂面、一背面及一底面,該正面上開設有複數深入於該載體本體的盲孔,該些盲孔間具有至少一肋條狀結構。該高頻段係由一倒π形輻射體、一一字形輻射體、一彎延線輻射體及一L形輻射體組成,以該載體的正面為基準,該高頻段設於該載體左邊的各該正面、該頂面、該背面及該底面上。該低頻段係由一第一方形輻射體、一第二方形輻射體、一第三方形輻射體及一第四方形輻射體組成,以該載體的正面為基準,設於該載體右邊的各該正面、該頂面、該背面及該底面上。該印刷電路板,其具有一頂邊、一左側斜邊、一斜底邊、一右側短邊、一缺口邊及一右側長邊所形成,該印刷電路板具有一第一表面及第二表面,該第一表面上具有一第一接地金屬面及一微帶線,該微帶線具一前段及一後段,該前段上具有一穿孔,該微帶線的前段延伸於該第一接地金屬面中,使該第一接地金屬面與該微帶線之間具有一間隙,該第一接地金屬面由該左側斜邊至該間隙的面積大於該缺口邊至該間隙之間的面積,以該缺口邊至該間隙之間較小面積的第一接地金屬面上延伸有一接地線,使該微帶線的後段與該接地線之間具有一間距;又於該第一表面的裸空區上具有二相對應的固定端。該電感器係位於該間距上,以該電感器一端電性連結於該微帶 線的後段上,另一端電性連結於該接地線上。以該第一表面的裸空區的二固定端與該載體的底面固接,使該載體的低頻段對應於該印刷電路板的缺口邊,且對應該缺口邊至該間隙之間較小面積的該第一接地金屬面,讓該低頻段處於一自由空間上,以提昇低頻段的頻率響應,以及以該倒π形輻射體及該一字形輻射體與該彎延線輻射體耦合關係,以增加高頻段的頻寬。 To achieve the above purpose, a ten-band antenna provided by the present invention includes: a carrier, a high frequency band, a low frequency band, a printed circuit board, and an inductor. The carrier is a ceramic square body having a front surface, a top surface, a back surface and a bottom surface. The front surface is provided with a plurality of blind holes deep in the carrier body, and the blind holes have at least one rib structure. The high frequency band is composed of an inverted π-shaped radiator, a flat-shaped radiator, a curved radiator and an L-shaped radiator. The high frequency band is set on the left side of the carrier. The front surface, the top surface, the back surface and the bottom surface. The low frequency band is composed of a first square radiator, a second square radiator, a third-party radiator and a fourth square radiator, and is disposed on the right side of the carrier based on the front surface of the carrier. The front surface, the top surface, the back surface and the bottom surface. The printed circuit board has a top side, a left side oblique side, an oblique bottom side, a right side short side, a notched side and a right side long side. The printed circuit board has a first surface and a second surface. The first surface has a first grounding metal surface and a microstrip line, the microstrip line has a front section and a rear section, the front section has a through hole, and the front section of the microstrip line extends to the first grounding metal a gap between the first grounded metal surface and the microstrip line, the area of the first grounded metal surface from the left oblique side to the gap being larger than the area between the notched side and the gap, a grounding wire extending from the notch edge to the first grounding metal surface of the smaller area between the gaps, such that the rear section of the microstrip line and the grounding wire have a spacing; and the bare space of the first surface There are two corresponding fixed ends on the top. The inductor is located at the pitch, and one end of the inductor is electrically connected to the microstrip On the rear side of the line, the other end is electrically connected to the ground line. The two fixed ends of the bare space of the first surface are fixed to the bottom surface of the carrier such that the low frequency band of the carrier corresponds to the notch side of the printed circuit board, and corresponds to a small area between the notch edge and the gap The first grounded metal surface allows the low frequency band to be in a free space to enhance the frequency response of the low frequency band, and the coupling relationship between the inverted π-shaped radiator and the linear radiator and the curved line radiator To increase the bandwidth of the high frequency band.
在本發明之一實施例中,該盲孔位於該正面上的面積與深入該載體內部的容積用以調整該載體的等效介電常數,以達成調整天線諧振頻率與頻寬。 In an embodiment of the invention, the area of the blind hole on the front surface and the volume deep inside the carrier are used to adjust the equivalent dielectric constant of the carrier to achieve adjustment of the antenna resonant frequency and bandwidth.
在本發明之一實施例中,該盲孔的面積比例範圍占該載體本體的面積約30%-50%。 In an embodiment of the invention, the area ratio of the blind holes ranges from about 30% to 50% of the area of the carrier body.
在本發明之一實施例中,該盲孔的面積比例為40%。 In an embodiment of the invention, the blind hole has an area ratio of 40%.
在本發明之一實施例中,該盲孔的容積比例範圍占該載體本體的20%-30%。 In an embodiment of the invention, the blind hole has a volume ratio ranging from 20% to 30% of the carrier body.
在本發明之一實施例中,該盲孔的容積比例以24%。 In an embodiment of the invention, the volume ratio of the blind holes is 24%.
在本發明之一實施例中,該倒π形輻射體具有一第一直線部、一第二直線部及一L形部組成,該第一直線部分別設於該載體的正面、頂面、背面及底面的邊側上,該第一直線部位於該底面的部份的第一直線部形成與該印刷電路板固接的固接點。 In an embodiment of the present invention, the inverted π-shaped radiator has a first straight portion, a second straight portion and an L-shaped portion, and the first straight portions are respectively disposed on the front surface, the top surface and the back surface of the carrier. On a side of the bottom surface, a first straight portion of the portion of the first straight portion located at the bottom surface forms a fixed contact point to the printed circuit board.
在本發明之一實施例中,該一字形輻射體電性連結於該第二直線部一側,該一字形輻射體分別設於該載體的正面及底面,該一字形輻射體 一端相鄰於該彎延線輻射體形成耦合關係連結,以該位在底面的該一字形輻射體形成信號饋入點。 In an embodiment of the present invention, the inline radiator is electrically connected to one side of the second straight portion, and the inline radiators are respectively disposed on a front surface and a bottom surface of the carrier, and the inline radiator One end of the radiator adjacent to the curved line forms a coupling relationship, and the in-line radiator at the bottom surface forms a signal feeding point.
在本發明之一實施例中,該彎延線輻射體一端與該第二直線部一端電性連結,該彎延線輻射體另一端與該低頻段電性連結,使該倒π形輻射體的L形部的短邊與該彎延線輻射體形成耦合關係連結。 In one embodiment of the present invention, one end of the bend line radiator is electrically connected to one end of the second straight portion, and the other end of the bend line radiator is electrically connected to the low frequency band to make the inverted π-shaped radiator The short sides of the L-shaped portion are coupled to the bend line radiator in a coupled relationship.
在本發明之一實施例中,該彎延線輻射體的間距為0.15mm~0.3mm,以該彎延線輻射體形成一LC共振,以產生2400MHz~2700MHz的諧振頻率。 In an embodiment of the invention, the pitch of the bend line radiator is 0.15 mm~0.3 mm, and an LC resonance is formed by the bend line radiator to generate a resonance frequency of 2400 MHz to 2700 MHz.
在本發明之一實施例中,該L形輻射體分設於該載體的正面及該底面,該L形輻射體的短邊與該一字形輻射體平行相對應,該L形輻射體的長邊與該一字形輻射體呈垂直對應,且與該彎延線輻射體平行相對應,該L形輻射體的長邊形成接地點。 In an embodiment of the present invention, the L-shaped radiator is disposed on a front surface and a bottom surface of the carrier, and a short side of the L-shaped radiator corresponds to the in-line radiator, and the length of the L-shaped radiator The side vertically corresponds to the inline radiator and corresponds to the bending line radiator, and the long side of the L-shaped radiator forms a grounding point.
在本發明之一實施例中,該高頻段包含了一第4頻段、一第5頻段、一第6頻段、一第7頻段、一第8頻段、一第9頻段及一第10頻段,該第4頻段、第5頻段、第6頻段、第7頻段、第8頻段、第9頻段及第10頻段的頻寬範圍分佈在1710MHz~6000MHz。 In an embodiment of the present invention, the high frequency band includes a fourth frequency band, a fifth frequency band, a sixth frequency band, a seventh frequency band, an eighth frequency band, a second frequency band, and a tenth frequency band. The bandwidth ranges of the 4th, 5th, 6th, 7th, 8th, 9th, and 10th bands are distributed between 1710MHz and 6000MHz.
在本發明之一實施例中,該低頻段包含一第1頻段、一第2頻段及一第3頻段,該第1頻段、該第2頻段及該第3頻段頻寬範圍在700MHz~960MHz。 In an embodiment of the present invention, the low frequency band includes a first frequency band, a second frequency band, and a third frequency band, and the first frequency band, the second frequency band, and the third frequency band have a bandwidth ranging from 700 MHz to 960 MHz.
在本發明之一實施例中,該第二表面上具有一第二接地金屬面,該穿孔貫穿至該第二接地金屬面上,該穿孔電性連結一銅軸電纜線的信號饋入端電性連結,該第二接地金屬面與該銅軸電纜線的接地端電性連結。 In an embodiment of the invention, the second surface has a second grounding metal surface, the through hole penetrating to the second grounding metal surface, the through hole electrically connecting the signal feeding end of the copper shaft cable The second grounding metal surface is electrically connected to the grounding end of the copper shaft cable.
10‧‧‧天線 10‧‧‧Antenna
101‧‧‧載體 101‧‧‧ Carrier
102‧‧‧高頻段 102‧‧‧High frequency band
103‧‧‧低頻段 103‧‧‧low frequency band
20‧‧‧印刷電路板 20‧‧‧Printed circuit board
201‧‧‧接地金屬面 201‧‧‧Grounded metal surface
202‧‧‧信號饋入微帶線 202‧‧‧Signal feeding microstrip line
203‧‧‧接地線 203‧‧‧ Grounding wire
1‧‧‧載體 1‧‧‧ Carrier
11‧‧‧正面 11‧‧‧ positive
12‧‧‧頂面 12‧‧‧ top surface
13‧‧‧背面 13‧‧‧Back
14‧‧‧底面 14‧‧‧ bottom
15‧‧‧盲孔 15‧‧‧Blind hole
16‧‧‧肋條狀結構 16‧‧‧ ribbed structure
2‧‧‧高頻段 2‧‧‧High frequency band
21‧‧‧倒π形輻射體 21‧‧‧Inverted π-shaped radiator
211‧‧‧第一直線部 211‧‧‧First straight line
211a‧‧‧部份的第一直線部 The first straight part of the 211a‧‧‧ part
212‧‧‧第二直線部 212‧‧‧Second straight section
213‧‧‧L形部 213‧‧‧L-shaped
213a‧‧‧短邊 213a‧‧‧ Short side
22‧‧‧一字形輻射體 22‧‧‧1-shaped radiator
23‧‧‧彎延線輻射體 23‧‧‧Bending line radiator
231‧‧‧間距 231‧‧‧ spacing
24‧‧‧L形輻射體 24‧‧‧L-shaped radiator
241‧‧‧短邊 241‧‧‧ Short side
242‧‧‧長邊 242‧‧‧Longside
3‧‧‧低頻段 3‧‧‧low frequency band
31‧‧‧第一方形輻射體 31‧‧‧First square radiator
32‧‧‧第二方形輻射體 32‧‧‧Second square radiator
33‧‧‧第三方形輻射體 33‧‧‧Third-party radiator
34‧‧‧第四方形輻射體 34‧‧‧fourth square radiator
4‧‧‧印刷電路板 4‧‧‧Printed circuit board
4a‧‧‧頂邊 4a‧‧‧ top side
4b‧‧‧左側斜邊 4b‧‧‧left side bevel
4c‧‧‧斜底邊 4c‧‧‧ oblique bottom
4d‧‧‧右側短邊 4d‧‧‧right short side
4e‧‧‧缺口邊 4e‧‧‧ gap side
4f‧‧‧右側長邊 4f‧‧‧ long side on the right
41‧‧‧第一表面 41‧‧‧ first surface
42‧‧‧第二表面 42‧‧‧ second surface
43‧‧‧第一接地金屬面 43‧‧‧First grounded metal surface
431、432‧‧‧面積 431, 432‧‧‧ area
43’‧‧‧第二接地金屬面 43'‧‧‧Second grounded metal surface
44‧‧‧微帶線 44‧‧‧Microstrip line
441‧‧‧前段 441‧‧‧
442‧‧‧後段 442‧‧‧After
443‧‧‧穿孔 443‧‧‧Perforation
45‧‧‧間隙 45‧‧‧ gap
46‧‧‧接地線 46‧‧‧ Grounding wire
47‧‧‧間距 47‧‧‧ spacing
48‧‧‧固定端 48‧‧‧ fixed end
5‧‧‧電感器 5‧‧‧Inductors
圖1,係為傳統的多頻天線結構示意圖。 FIG. 1 is a schematic diagram of a conventional multi-frequency antenna structure.
圖2,係圖1的反射損失曲線示意圖。 Figure 2 is a schematic diagram of the reflection loss curve of Figure 1.
圖3~圖6,係本發明之十頻段天線正面、頂面、背面及底面金屬輻射體的圖案示意圖。 3 to FIG. 6 are schematic diagrams showing the patterns of the front, top, back and bottom metal radiators of the ten-band antenna of the present invention.
圖7,係本發明之十頻段天線各面金屬輻射體的圖案展開示意圖。 Fig. 7 is a schematic view showing the pattern development of the metal radiators on each side of the ten-band antenna of the present invention.
圖8,係本發明之十頻段天線與印刷電路板分解示意圖。 Figure 8 is a schematic exploded view of the ten-band antenna and printed circuit board of the present invention.
圖9,係本發明之印刷電路板背面示意圖。 Figure 9 is a schematic rear view of a printed circuit board of the present invention.
圖10,係本發明之十頻段天線與印刷電路板電性連結組合示意圖。 FIG. 10 is a schematic diagram showing the electrical connection of the ten-band antenna and the printed circuit board of the present invention.
圖11,係本發明之十頻段天線的反射損失曲線示意圖。 Figure 11 is a schematic diagram showing the reflection loss curve of the ten-band antenna of the present invention.
茲有關本發明之技術內容及詳細說明,現配合圖式說明如下: The technical content and detailed description of the present invention are as follows:
請參閱圖3~圖7,係本發明之十頻段天線各面的金屬輻射體的圖案及圖案展開示意圖。如圖所示:本發明之十頻段天線,包括有:一載體1、一高頻段2及一低頻段3。 Please refer to FIG. 3 to FIG. 7 , which are schematic diagrams showing the pattern and pattern development of the metal radiator on each side of the ten-band antenna of the present invention. As shown in the figure, the ten-band antenna of the present invention comprises: a carrier 1, a high frequency band 2 and a low frequency band 3.
該載體1,係為陶瓷材料製成方形體,其上具有一正面11、一頂面12、一背面13及一底面14。於該正面11上開設有複數盲孔15,該些盲孔15間具有至少一肋條狀結構16,以該盲孔15及肋條狀結構16的設計,作為載體1本體的減重與抑制成型翹曲變形。該盲孔15的位於該正面11上的面積與深入該載體1內部的容積用以調整該載體1的等效介電常數,以達成調整天線諧振頻率與頻寬的目的。其中,該盲孔15的面積比例範圍占該載體1本體的面積約30%-50%,以面積比例為40%。該盲 孔15的容積比例範圍占該載體1本身的20%-30%,以容積比例範圍為24%。且該盲孔15之形狀與對稱性可因設計做任意變換調整。 The carrier 1 is a square body made of a ceramic material and has a front surface 11, a top surface 12, a back surface 13 and a bottom surface 14. A plurality of blind holes 15 are defined in the front surface 11 , and the blind holes 15 have at least one rib structure 16 , and the blind holes 15 and the rib structure 16 are designed as the weight reduction and suppression molding of the carrier 1 body. Curved deformation. The area of the blind hole 15 on the front surface 11 and the volume deep inside the carrier 1 are used to adjust the equivalent dielectric constant of the carrier 1 for the purpose of adjusting the resonant frequency and bandwidth of the antenna. The area ratio of the blind hole 15 is about 30%-50% of the area of the body of the carrier 1, and the area ratio is 40%. The blind The volume ratio of the holes 15 ranges from 20% to 30% of the carrier 1 itself, and the volume ratio ranges from 24%. Moreover, the shape and symmetry of the blind hole 15 can be adjusted by any transformation.
該高頻段2,係以該載體1的正面11為基準,該高頻段2係位於該載體1左邊,其上具有一倒π形輻射體21、一一字形輻射體22、一彎延線輻射體23及一L形輻射體24組成,該倒π形輻射體21具有一第一直線部211、一第二直線部212及一L形部213組成,該第一直線部211分別設於該載體1的正面11、頂面12、背面13及底面14的邊側上,該第一直線部211位於該底面14的部份的第一直線部211a形成與該印刷電路板(圖中未示)固接的固接點。該倒π形輻射體21的第二直線部212一側電性連結該一字形輻射體22,該一字形輻射體22分別設於該載體1的正面11及底面14,該一字形輻射體22一端相鄰於該彎延線輻射體23形成耦合關係以產生4900MHz~6000MHz頻寬,且以該位在底面14的該一字形輻射體23形成信號饋入點。該彎延線輻射體23一端與該第二直線部212一端電性連結,該彎延線輻射體23另一端與該低頻段3電性連結,使該倒π形輻射體21的L形部213的短邊213a與該彎延線輻射體23形成耦合關係連結產生3500MHz的頻寬,該彎延線輻射體23的間距231為0.15mm~0.3mm,以該彎延線輻射體23形成一LC共振,以產生2400MHz~2700MHz的諧振頻率。又,該L形輻射體24分設於該載體1的正面11及該底面14,該L形輻射體24的短邊241與該一字形輻射體22平行相對應,該L形輻射體24的長邊242與該一字形輻射體22呈垂直對應,且與該彎延線輻射體23平行相對應,在本圖式中,該L形輻射體24的長邊242形成接地點。在本圖式中,該高頻段2包含了本發明的第4 頻段、第5頻段、第6頻段、第7頻段及第8頻段,該第4頻段、第5頻段、第6頻段、第7頻段、第8頻段、第9頻段及第10頻段的頻寬範圍分佈在1710MHz~6000MHz,可用於GSM、WCDMA、WIFI、LTE、WIMAX、802.11ac通訊系統。 The high frequency band 2 is based on the front side 11 of the carrier 1, and the high frequency band 2 is located on the left side of the carrier 1, and has an inverted π-shaped radiator 21, a flat-shaped radiator 22, and a curved line radiation. The body 23 is composed of an L-shaped radiator 24, and the inverted π-shaped radiator 21 has a first straight portion 211, a second straight portion 212 and an L-shaped portion 213, and the first straight portion 211 is respectively disposed on the carrier 1 On the side of the front surface 11, the top surface 12, the back surface 13 and the bottom surface 14, the first straight portion 211a of the first straight portion 211 located at the bottom surface 14 is formed to be fixed to the printed circuit board (not shown). Secure the joint. The second straight portion 212 of the inverted π-shaped radiator 21 is electrically connected to the in-line radiator 22, and the in-line radiator 22 is respectively disposed on the front surface 11 and the bottom surface 14 of the carrier 1. The in-line radiator 22 One end adjacent to the bend line radiator 23 forms a coupling relationship to generate a bandwidth of 4900 MHz to 6000 MHz, and the in-line radiator 23 at the bottom surface 14 forms a signal feed point. One end of the curved wire radiator 23 is electrically connected to one end of the second straight portion 212, and the other end of the curved wire radiator 23 is electrically connected to the low frequency band 3 to make the L-shaped portion of the inverted π-shaped radiator 21 The short side 213a of the 213 is coupled to the curved line radiator 23 to generate a bandwidth of 3500 MHz, and the pitch 231 of the curved line radiator 23 is 0.15 mm to 0.3 mm, and the curved line radiator 23 is formed. The LC resonates to produce a resonant frequency of 2400 MHz to 2700 MHz. Moreover, the L-shaped radiator 24 is disposed on the front surface 11 and the bottom surface 14 of the carrier 1. The short side 241 of the L-shaped radiator 24 corresponds to the in-line radiator 22, and the L-shaped radiator 24 The long side 242 corresponds vertically to the inline radiator 22 and corresponds in parallel with the curved line radiator 23. In the present drawing, the long side 242 of the L-shaped radiator 24 forms a grounding point. In the figure, the high frequency band 2 contains the fourth aspect of the present invention. Frequency bands for the 4th, 5th, 6th, 7th, 8th, 9th and 10th bands in the Band, Band 5, Band 6, Band 7 and Band 8 Distributed in 1710MHz~6000MHz, it can be used in GSM, WCDMA, WIFI, LTE, WIMAX, 802.11ac communication systems.
該低頻段3,係以該載體1的正面11為基準,該低頻段3係位於該載體1右邊,該低頻段3係由不同面積的一第一方形輻射體31、一第二方形輻射體32、一第三方形輻射體33及一第四方形輻射體34組成,且分別設於該載體1的正面11、頂面12、背面13及底面14上,以位於該載體1底面14的第三方形輻射體33形成與該印刷電路板固接的固接點。在本圖式中,該低頻段3包含了本發明的第1頻段、第2頻段及第3頻段,該第1頻段、第2頻段及該第3頻段的頻寬範圍在700MHz~960MHz,可用於LTE及GMS通訊系統上。 The low frequency band 3 is based on the front side 11 of the carrier 1, and the low frequency band 3 is located on the right side of the carrier 1. The low frequency band 3 is radiated by a first square radiator 31 and a second square of different areas. The body 32, a third-party radiator 33 and a fourth square radiator 34 are respectively disposed on the front surface 11, the top surface 12, the back surface 13 and the bottom surface 14 of the carrier 1 to be located on the bottom surface 14 of the carrier 1. The third square radiator 33 forms a fixed point that is fixed to the printed circuit board. In the figure, the low frequency band 3 includes the first frequency band, the second frequency band, and the third frequency band of the present invention, and the bandwidth of the first frequency band, the second frequency band, and the third frequency band is in the range of 700 MHz to 960 MHz, and is available. On LTE and GMS communication systems.
請參閱圖8~圖10,係本發明之十頻段天線與印刷電路板分解、印刷電路板背面及電性連結組合示意圖。如圖所示:在本圖式中,本發明之十頻段天線更包含有一固接該載體1的印刷電路板4,該印刷電路板4的形狀依序具有一頂邊4a、一左側斜邊4b、一斜底邊4c、一右側短邊4d、一缺口邊4e及一右側長邊4f所圍成。且,該印刷電路板4具有一第一表面41及第二表面42。該第一表面41上具有一第一接地金屬面43及一微帶線44,該微帶線44具一前段441及一後段442,該前段441上具有一穿孔443,該微帶線44的前段441延伸於該第一接地金屬面43中,並與該第一接地金屬面43之間具有一間隙45,使該第一接地金屬面43由 該左側斜邊4b至該間隙45的面積431大於該缺口邊4e至該間隙45之間的面積432。 Please refer to FIG. 8 to FIG. 10 , which are schematic diagrams showing the combination of the ten-band antenna and the printed circuit board of the present invention, the back surface of the printed circuit board and the electrical connection. As shown in the figure, in the figure, the ten-band antenna of the present invention further comprises a printed circuit board 4 fixed to the carrier 1. The printed circuit board 4 has a top edge 4a and a left oblique side. 4b, an inclined bottom edge 4c, a right short side 4d, a notched edge 4e and a right long side 4f are enclosed. Moreover, the printed circuit board 4 has a first surface 41 and a second surface 42. The first surface 41 has a first grounding metal surface 43 and a microstrip line 44. The microstrip line 44 has a front section 441 and a rear section 442. The front section 441 has a through hole 443, and the microstrip line 44 The front grounding portion 441 extends in the first grounding metal surface 43 and has a gap 45 between the first grounding metal surface 43 and the first grounding metal surface 43. The area 431 of the left oblique side 4b to the gap 45 is larger than the area 432 between the notch side 4e and the gap 45.
另,於該缺口邊4e至該間隙45之間較小面積432的第一接地金屬面43上延伸有一接地線46,該接地線46與該微帶線44的後段442呈平行關係並列,且該微帶線44的後段442與該接地線46之間具有一間距47,在該微帶線44的後段442及該接地線46之間的間距47電性連結有一電感器5,以該電感器5一端電性連結於該微帶線44的後段442上,另一端電性連結於該接地線46上,該電感器5除了可以調整阻抗外,還形成一個下地連結狀態,使天線形成一個雙頻倒F型的耦極天線。又於,於該第一表面41的裸空區上具有二相對應的固定端48,該二固定端48用以固接該載體1底面14的部份的第一直線部211a及該第三方形輻射體33固接。 In addition, a grounding line 46 extends from the first grounding metal surface 43 of the smaller area 432 between the notch edge 4e and the gap 45, and the grounding wire 46 is juxtaposed in parallel with the rear section 442 of the microstrip line 44, and A gap 47 is formed between the rear section 442 of the microstrip line 44 and the ground line 46. An inductor 5 is electrically coupled to the gap 47 between the rear section 442 of the microstrip line 44 and the ground line 46. One end of the device 5 is electrically connected to the rear portion 442 of the microstrip line 44, and the other end is electrically connected to the ground line 46. In addition to adjusting the impedance, the inductor 5 forms a lower ground connection state, so that the antenna forms a Dual-frequency inverted F-type coupling antenna. Further, the first open surface 48 of the first surface 41 has two corresponding fixed ends 48, and the two fixed ends 48 are used for fixing the first straight portion 211a of the portion of the bottom surface 14 of the carrier 1 and the third-party shape. The radiator 33 is fixed.
又,於該第二表面42上具有一第二接地金屬面43’,該穿孔443貫穿至該第二接地金屬面43’上,該穿孔443以供銅軸電纜線的信號饋入端(圖中未示)電性連結,該第二接地金屬面43’與該銅軸電纜線的接地端電性連結。 Moreover, the second surface 42 has a second grounding metal surface 43'. The through hole 443 extends through the second grounding metal surface 43' for feeding the signal of the copper shaft cable. The electrical connection is not shown. The second grounded metal surface 43' is electrically connected to the ground end of the copper shaft cable.
在該載體1與印刷電路板4固接時,以該第一表面41的裸空區上具有二固定端48與該載體1底面14的部份的第一直線部211a及該第三方形輻射體33固接,使該底面14的一字形輻射體23與該微帶線44電性連結,以及該第二L形輻射體25的長邊252與該接地線46電性連結。在固接後,該載體1上的低頻段3位於裸空區且對應該印刷電路板4的缺口邊4e,且對應該較小的面積432的第一接地金屬面43,使該載體1上的低 頻段3處於一自由空間上,讓十頻段段的天線的低頻段3的頻率響應效果佳。 When the carrier 1 is fixed to the printed circuit board 4, the first straight portion 211a having the two fixed ends 48 and the bottom surface 14 of the carrier 1 on the bare space of the first surface 41 and the third-party radiator The fixed shape of the bottom surface 14 is electrically connected to the microstrip line 44, and the long side 252 of the second L-shaped radiator 25 is electrically connected to the ground line 46. After the fixing, the low frequency band 3 on the carrier 1 is located in the bare space and corresponds to the notched edge 4e of the printed circuit board 4, and the first grounded metal surface 43 corresponding to the smaller area 432 is made on the carrier 1. Low Band 3 is in a free space, and the frequency response of the low band 3 of the antenna of the ten band segment is good.
請參閱圖11,係本發明之十頻段天線的反射損失曲線示意圖,且同時參閱圖10所示。如圖所示:由於本發明之載體1與印刷電路板4固接後,使該載體1上的低頻段3位於該印刷電路板4的缺口邊4e上對應該較少的第一接地金屬面43面積時,使該載體1上的低頻段3處於接地屏蔽較少的自由空間時,讓十頻段天線的低頻段3的頻率響應效果更佳,也使得高頻段2的頻寬增加,且該低頻段3的頻率分佈第1頻段、第2頻段及該第3頻段的頻寬範圍在700MHz~960MHz(如圖11標號C)。該高頻段2的第4頻段、第5頻段及第6頻段的頻寬範圍在1710MHz~2170MHz(如圖11的標號D)。該第7頻段的頻寬範圍在2400MHz~2500MHz及該第8頻段的頻寬範圍在2600MHz~2700MHz(如圖11的標號D)。高頻段3的第9頻段的頻寬範圍在3500MHz~3700MHz(如圖11的標號E)。高頻段3的第10頻段的頻寬範圍在4900MHz~6000MHz(如圖11的標號F)。 Please refer to FIG. 11, which is a schematic diagram of the reflection loss curve of the ten-band antenna of the present invention, and is also shown in FIG. As shown in the figure, since the carrier 1 of the present invention is fixed to the printed circuit board 4, the low frequency band 3 on the carrier 1 is located on the notched edge 4e of the printed circuit board 4 corresponding to the first ground metal surface. When the area of 43 is made such that the low frequency band 3 on the carrier 1 is in a free space with less ground shielding, the frequency response effect of the low frequency band 3 of the ten-band antenna is better, and the bandwidth of the high frequency band 2 is also increased, and The frequency distribution of the low frequency band 3, the frequency band of the first frequency band, the second frequency band, and the third frequency band is in the range of 700 MHz to 960 MHz (refer to FIG. 11 and reference numeral C). The bandwidth of the fourth frequency band, the fifth frequency band, and the sixth frequency band of the high frequency band 2 ranges from 1710 MHz to 2170 MHz (refer to reference numeral D in FIG. 11). The bandwidth of the seventh frequency band ranges from 2400 MHz to 2500 MHz and the bandwidth of the eighth frequency band ranges from 2600 MHz to 2700 MHz (refer to reference numeral D in FIG. 11). The frequency band of the ninth frequency band of the high frequency band 3 ranges from 3500 MHz to 3700 MHz (refer to E in FIG. 11). The frequency band of the 10th frequency band of the high frequency band 3 ranges from 4900 MHz to 6000 MHz (refer to the reference F in Fig. 11).
上述僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。即凡依本發明申請專利範圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。 The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.
1‧‧‧載體 1‧‧‧ Carrier
11‧‧‧正面 11‧‧‧ positive
12‧‧‧頂面 12‧‧‧ top surface
15‧‧‧盲孔 15‧‧‧Blind hole
16‧‧‧肋條狀結構 16‧‧‧ ribbed structure
2‧‧‧高頻段 2‧‧‧High frequency band
21‧‧‧倒π形輻射體 21‧‧‧Inverted π-shaped radiator
211‧‧‧第一直線部 211‧‧‧First straight line
211a‧‧‧部份的第一直線部 The first straight part of the 211a‧‧‧ part
213a‧‧‧短邊 213a‧‧‧ Short side
22‧‧‧一字形輻射體 22‧‧‧1-shaped radiator
23‧‧‧彎延線輻射體 23‧‧‧Bending line radiator
231‧‧‧間距 231‧‧‧ spacing
24‧‧‧L形輻射體 24‧‧‧L-shaped radiator
241‧‧‧短邊 241‧‧‧ Short side
242‧‧‧長邊 242‧‧‧Longside
3‧‧‧低頻段 3‧‧‧low frequency band
31‧‧‧第一方形輻射體 31‧‧‧First square radiator
33‧‧‧第三方形輻射體 33‧‧‧Third-party radiator
34‧‧‧第四方形輻射體 34‧‧‧fourth square radiator
4‧‧‧印刷電路板 4‧‧‧Printed circuit board
4a‧‧‧頂邊 4a‧‧‧ top side
4b‧‧‧左側斜邊 4b‧‧‧left side bevel
4c‧‧‧斜底邊 4c‧‧‧ oblique bottom
4d‧‧‧右側短邊 4d‧‧‧right short side
4e‧‧‧缺口邊 4e‧‧‧ gap side
4f‧‧‧右側長邊 4f‧‧‧ long side on the right
41‧‧‧第一表面 41‧‧‧ first surface
42‧‧‧第二表面 42‧‧‧ second surface
43‧‧‧第一接地金屬面 43‧‧‧First grounded metal surface
43’‧‧‧第二接地金屬面 43'‧‧‧Second grounded metal surface
431、432‧‧‧面積 431, 432‧‧‧ area
44‧‧‧微帶線 44‧‧‧Microstrip line
441‧‧‧前段 441‧‧‧
442‧‧‧後段 442‧‧‧After
443‧‧‧穿孔 443‧‧‧Perforation
45‧‧‧間隙 45‧‧‧ gap
46‧‧‧接地線 46‧‧‧ Grounding wire
47‧‧‧間距 47‧‧‧ spacing
48‧‧‧固定端 48‧‧‧ fixed end
5‧‧‧電感器 5‧‧‧Inductors
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TW104132758A TWI553963B (en) | 2015-10-06 | 2015-10-06 | Ten-frequency band antenna |
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EP16175514.5A EP3154124B1 (en) | 2015-10-06 | 2016-06-21 | Ten-frequency band antenna |
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TW104132758A TWI553963B (en) | 2015-10-06 | 2015-10-06 | Ten-frequency band antenna |
Country Status (2)
Country | Link |
---|---|
EP (2) | EP3154124B1 (en) |
TW (1) | TWI553963B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10135129B2 (en) | 2012-10-08 | 2018-11-20 | Taoglas Group Holding Limited | Low-cost ultra wideband LTE antenna |
US10483644B2 (en) | 2015-11-20 | 2019-11-19 | Taoglas Group Holdings Limited | Eight-frequency band antenna |
USRE49000E1 (en) | 2015-11-20 | 2022-03-29 | Taoglas Group Holdings Limited | Ten-frequency band antenna |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6380895B1 (en) * | 1997-07-09 | 2002-04-30 | Allgon Ab | Trap microstrip PIFA |
US20030063033A1 (en) * | 2001-09-29 | 2003-04-03 | Thomas Purr | Miniaturized directoral antenna |
US20040169606A1 (en) * | 2002-11-28 | 2004-09-02 | Kyocera Corporation | Surface-mount type antenna and antenna apparatus |
US7183980B2 (en) * | 2005-02-18 | 2007-02-27 | Advanced Connectek, Inc. | Inverted-F antenna |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI463738B (en) * | 2011-01-18 | 2014-12-01 | Cirocomm Technology Corp | Surface-mount multi-frequency antenna module |
WO2014058926A1 (en) * | 2012-10-08 | 2014-04-17 | Zuniga Eleazar | Low cost ultra-wideband lte antenna |
-
2015
- 2015-10-06 TW TW104132758A patent/TWI553963B/en active
-
2016
- 2016-06-21 EP EP16175514.5A patent/EP3154124B1/en active Active
- 2016-06-21 EP EP18185525.5A patent/EP3444896A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6380895B1 (en) * | 1997-07-09 | 2002-04-30 | Allgon Ab | Trap microstrip PIFA |
US20030063033A1 (en) * | 2001-09-29 | 2003-04-03 | Thomas Purr | Miniaturized directoral antenna |
US20040169606A1 (en) * | 2002-11-28 | 2004-09-02 | Kyocera Corporation | Surface-mount type antenna and antenna apparatus |
US7183980B2 (en) * | 2005-02-18 | 2007-02-27 | Advanced Connectek, Inc. | Inverted-F antenna |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10135129B2 (en) | 2012-10-08 | 2018-11-20 | Taoglas Group Holding Limited | Low-cost ultra wideband LTE antenna |
US10483644B2 (en) | 2015-11-20 | 2019-11-19 | Taoglas Group Holdings Limited | Eight-frequency band antenna |
US11264718B2 (en) | 2015-11-20 | 2022-03-01 | Taoglas Group Holdings Limited | Eight-frequency band antenna |
USRE49000E1 (en) | 2015-11-20 | 2022-03-29 | Taoglas Group Holdings Limited | Ten-frequency band antenna |
Also Published As
Publication number | Publication date |
---|---|
TW201714353A (en) | 2017-04-16 |
EP3154124A1 (en) | 2017-04-12 |
EP3444896A1 (en) | 2019-02-20 |
EP3154124B1 (en) | 2018-08-01 |
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