TW201714354A - Eight-frequency band antenna - Google Patents
Eight-frequency band antenna Download PDFInfo
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- TW201714354A TW201714354A TW104132780A TW104132780A TW201714354A TW 201714354 A TW201714354 A TW 201714354A TW 104132780 A TW104132780 A TW 104132780A TW 104132780 A TW104132780 A TW 104132780A TW 201714354 A TW201714354 A TW 201714354A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/378—Combination of fed elements with parasitic elements
Abstract
Description
本發明係有關一種天線，尤指一種具有提昇低頻頻率響應及增加高頻頻寬的八頻段天線。The present invention relates to an antenna, and more particularly to an eight-band antenna having an improved low frequency response and an increased high frequency bandwidth.
目前市面上常見的雙頻倒F型天線(Planar Inverted-F Antenna，PIFA)，此倒F型天線的製作是透過二維印刷印刷電路板技術直接將金屬銅材質印刷在印刷印刷電路板上，以形成平板狀的多頻天線，或者利用沖壓技術將金屬薄片沖壓形成三維的多頻天線。Planar Inverted-F Antenna (PIFA), which is commonly used in the market, is manufactured by directly printing metal copper on a printed circuit board through two-dimensional printed circuit board technology. The metal foil is stamped to form a three-dimensional multi-frequency antenna by forming a flat multi-frequency antenna.
由於改變印刷印刷電路板二維輻射體圖案或改變金屬薄片沖壓的三維輻射體的幾何形狀，可以使天線達到多頻段的收發效果。但是為了滿足信號收發品質，以及避免周圍環境的影響造成其頻率協調失準，因此以該印刷印刷電路板上形成的天線，或者以該金屬薄片沖壓形成的天線的輻射體勢必具有一特定體積，為了安裝具有特定體積的PIFA 天線結構，電子裝置內部也必須預留一適當的空間來安置該PIFA 天線結構，如此一來勢必違背電子裝置朝輕薄短小的小型化設計的需求。By changing the two-dimensional radiator pattern of the printed circuit board or changing the geometry of the three-dimensional radiator stamped by the foil, the antenna can be multi-band transmitted and received. However, in order to satisfy the signal transmission and reception quality and avoid the influence of the surrounding environment, the frequency coordination misalignment thereof, the radiation formed by the antenna formed on the printed circuit board or the antenna formed by stamping the metal foil is bound to have a specific volume. In order to install a PIFA antenna structure with a specific volume, an appropriate space must be reserved inside the electronic device to house the PIFA antenna structure, which is inevitably contrary to the demand for the miniaturized design of the electronic device toward a light, thin and short.
在科技技術不斷的提昇下，為了解決上述的問題，將天線的輻射體製作在由陶瓷材質製成的方形載體上，如圖1及圖2所示，該天線10的載體101表面上具有一收發信號的高頻段102及一低頻段103的輻射體，並將該載體101固接於該印刷電路板20上，該印刷電路板20的二表面上各具有一接地金屬面201、一信號饋入微帶線202及一接地線203。以該信號饋入微帶線202及該接地線203與載體101的輻射體電性連結。由於該高頻段102位於該載體101的右邊，該低頻段103位於該載體101的左邊，在天線10與印刷電路板20電性固接後，使該低頻段103對應該印刷電路板20的接地金屬面201的面積大於該高頻段102對應該接地金屬面201的面積，因此使該低頻段102受到接地屏蔽影響較多，在通信時使該低頻段103的頻率響應變差(如圖2的標號A)，且也使得高頻段102的頻寬也不夠寬(僅限於在6個頻段，如圖2的標號B)，讓整個天線的收發信號品質降低，以及收發信號頻寬受到限制。Under the continuous improvement of technology, in order to solve the above problems, the radiator of the antenna is fabricated on a square carrier made of ceramic material. As shown in FIG. 1 and FIG. 2, the carrier 101 of the antenna 10 has a surface on the surface. Transmitting and transmitting the high frequency band 102 of the signal and the radiator of the low frequency band 103, and fixing the carrier 101 to the printed circuit board 20. The printed circuit board 20 has a grounded metal surface 201 and a signal feed on each of the two surfaces. The microstrip line 202 and a ground line 203 are inserted. The signal is fed into the microstrip line 202 and the ground line 203 is electrically connected to the radiator of the carrier 101. Since the high frequency band 102 is located on the right side of the carrier 101, the low frequency band 103 is located on the left side of the carrier 101, and after the antenna 10 is electrically fixed to the printed circuit board 20, the low frequency band 103 is grounded corresponding to the printed circuit board 20. The area of the metal surface 201 is larger than the area of the high frequency band 102 corresponding to the grounded metal surface 201. Therefore, the low frequency band 102 is affected by the grounding shield, and the frequency response of the low frequency band 103 is deteriorated during communication (as shown in FIG. 2). The label A) also makes the bandwidth of the high frequency band 102 not wide enough (only in 6 frequency bands, as shown by the reference B in FIG. 2), so that the transmission and reception signal quality of the entire antenna is lowered, and the bandwidth of the transmission and reception signals is limited.
因此，本發明之主要目的，在於解決傳統的缺失，本發明將天線的載體表面上所依附的高頻段及低頻段的輻射體變換位置，在該天線的載體與印刷電路板固接後，讓該載體上的低頻段對應較小面積的接地金屬面，使該載體上的低頻段處於一自由空間上，讓低頻段的頻率響應效果佳以及增加高頻段的頻寬。Therefore, the main object of the present invention is to solve the conventional problem. In the present invention, the high frequency band and the low frequency band of the antenna are attached to the surface of the antenna, and after the carrier of the antenna is fixed to the printed circuit board, The low frequency band on the carrier corresponds to a grounded metal surface of a small area, so that the low frequency band on the carrier is in a free space, so that the frequency response of the low frequency band is good and the bandwidth of the high frequency band is increased.
本發明之另一目的，在於以該載體上的盲孔及肋條狀結構的設計，作為載體本身的減重與抑制成型翹曲變形，且該盲孔的面積與容積用以調整該載體的等效介電常數，以達成調整天線諧振頻率與頻寬的目的。且該盲孔之形狀與對稱性可因設計做任意變換調整。Another object of the present invention is to reduce the weight of the carrier itself and suppress the warpage deformation of the carrier by using the design of the blind hole and the rib structure on the carrier, and the area and volume of the blind hole are used to adjust the carrier. The dielectric constant is used to achieve the purpose of adjusting the antenna resonance frequency and bandwidth. And the shape and symmetry of the blind hole can be adjusted by any transformation of the design.
本發明之再一目的，在於以一電感器電性連結在接地線與微帶線上，除了可以調整阻抗外，還形成一個下地連結狀態，使天線形成一個雙頻倒F型的耦極天線。A further object of the present invention is to electrically connect the ground line and the microstrip line with an inductor. In addition to adjusting the impedance, a lower ground connection state is formed, so that the antenna forms a dual-frequency inverted-F type coupling antenna.
為達上述之目的，本發明所提供的一種八頻段天線，包括：一載體、一高頻段、一低頻段、一印刷電路板及一電感器。該載體為陶瓷方形體，其上具有一正面、一頂面、一背面及一底面，該正面上開設有複數深入於該載體本體的盲孔，該些盲孔間具有至少一肋條狀結構。該高頻段係以該載體的正面為基準，設於該載體左邊的各該正面、該頂面、該背面及該底面上。該低頻段係以該載體的正面為基準，設於該載體右邊的各該正面、該頂面、該背面及該底面上。該印刷電路板上具有一底邊、一左側斜邊、一斜底邊、一右側短邊、一缺口邊及一右側長邊所形成，該印刷電路板具有一第一表面及第二表面，該第一表面上具有一第一接地金屬面及一微帶線，該微帶線具一前段及一後段，該前段上具有一穿孔，該微帶線的前段延伸於該第一接地金屬面中，使該第一接地金屬面與該微帶線之間具有一間隙，該第一接地金屬面由該左側斜邊至該間隙的面積大於該缺口邊至該間隙之間的面積，以該缺口邊至該間隙之間較小面積的第一接地金屬面上延伸有一接地線，該接地線與該微帶線的後段呈平行關係並列，且該微帶線的後段與該接地線之間具有一間距；又於，於該第一表面的裸空區上具有二相對應的固定端。該電感器電性連結於該微帶線的後段及該接地線，且位於該間距上。以該第一表面的裸空區的二固定端與該載體的底面固接，讓該載體的低頻段對應於該印刷電路板的缺口邊至該間隙之間較小面積的該第一接地金屬面，使該低頻段處於一自由空間上，以提昇低頻段的頻率響應及高頻段的頻寬。To achieve the above objective, an eight-band antenna provided by the present invention includes: a carrier, a high frequency band, a low frequency band, a printed circuit board, and an inductor. The carrier is a ceramic square body having a front surface, a top surface, a back surface and a bottom surface. The front surface is provided with a plurality of blind holes deep in the carrier body, and the blind holes have at least one rib structure. The high frequency band is based on the front side of the carrier, and is disposed on each of the front surface, the top surface, the back surface, and the bottom surface on the left side of the carrier. The low frequency band is based on the front side of the carrier, and is disposed on each of the front surface, the top surface, the back surface and the bottom surface on the right side of the carrier. The printed circuit board has a bottom side, a left side oblique side, an oblique bottom side, a right side short side, a notched side and a right side long side. The printed circuit board has a first surface and a second surface. The first surface has a first grounded metal surface and a microstrip line, the microstrip line has a front section and a rear section, the front section has a through hole, and the front section of the microstrip line extends on the first grounded metal surface Providing a gap between the first grounded metal surface and the microstrip line, the area of the first grounded metal surface from the left oblique side to the gap being greater than the area between the notched side and the gap, A grounding wire extends from the notch edge to the first grounding metal surface of the smaller area between the gaps, the grounding wire is juxtaposed in parallel with the rear section of the microstrip line, and between the rear section of the microstrip line and the grounding wire Having a spacing; and having two corresponding fixed ends on the bare space of the first surface. The inductor is electrically connected to the rear portion of the microstrip line and the ground line, and is located at the pitch. The two fixed ends of the bare space of the first surface are fixed to the bottom surface of the carrier, so that the low frequency band of the carrier corresponds to the first ground metal of the printed circuit board with a smaller area between the gaps of the printed circuit board The low frequency band is placed in a free space to improve the frequency response of the low frequency band and the bandwidth of the high frequency band.
在本發明之一實施例中，該盲孔位於該正面上的面積與深入該載體內部的容積用以調整該載體的等效介電常數，以達成調整天線諧振頻率與頻寬。In an embodiment of the invention, the area of the blind hole on the front surface and the volume deep inside the carrier are used to adjust the equivalent dielectric constant of the carrier to achieve adjustment of the antenna resonant frequency and bandwidth.
在本發明之一實施例中，該盲孔的面積比例範圍占該載體的正面的面積約30%-50%。In an embodiment of the invention, the area ratio of the blind holes ranges from about 30% to 50% of the area of the front surface of the carrier.
在本發明之一實施例中，該盲孔的面積比例為40%。In an embodiment of the invention, the blind hole has an area ratio of 40%.
在本發明之一實施例中，該盲孔的容積比例範圍占該載體本身的20%-30%。In an embodiment of the invention, the volume ratio of the blind holes ranges from 20% to 30% of the carrier itself.
在本發明之一實施例中，該盲孔的容積比例以24%。In an embodiment of the invention, the volume ratio of the blind holes is 24%.
在本發明之一實施例中，該高頻段上具有一雙T形輻射體、一第一L形輻射體、一一字形輻射體、一彎延線輻射體及一第二L形輻射體組成，該雙T形輻射體分別設於該載體的正面、頂面、背面及該底面，以該雙T形輻射體位於該底面的部份輻射體形成固接點與該印刷電路板的固定端固接；該雙T形輻射體的其一底部與設於該背面的該第一L形輻射體的短邊一端電性連結，該第一L形輻射體的短邊的另一端與設於該正面及該底面的一字形輻射體電性連結，該一字形輻射體與該微帶線電性連結；另，該第一L形輻射體的設於該頂面及背面的長邊與設於該頂面及該背面的該彎延線輻射體形成耦合連結；又該第二L形輻射體分設於該正面及該底面，該第二L形輻射體的短邊與該一字形輻射體平行相對應，該第二L形輻射體的長邊與該一字形輻射體呈垂直對應，且與該彎延線輻射體平行相對應，該第二L形輻射體的長邊與該接地線電性連結。In an embodiment of the present invention, the high frequency band has a pair of T-shaped radiators, a first L-shaped radiator, a flat-shaped radiator, a curved radiator, and a second L-shaped radiator. The double T-shaped radiators are respectively disposed on the front surface, the top surface, the back surface and the bottom surface of the carrier, and a part of the radiator body of the double T-shaped radiator body at the bottom surface forms a fixed point and a fixed end of the printed circuit board. a bottom portion of the double-shaped radiator is electrically connected to one end of the short side of the first L-shaped radiator provided on the back surface, and the other end of the short side of the first L-shaped radiator is disposed at The front surface and the bottom surface of the inline radiator are electrically connected, and the inline radiator is electrically connected to the microstrip line; and the first L-shaped radiator is disposed on the top side and the back side The curved line radiators on the top surface and the back surface form a coupling connection; and the second L-shaped radiator is disposed on the front surface and the bottom surface, the short side of the second L-shaped radiator and the inline radiation Corresponding to the parallel, the long side of the second L-shaped radiator vertically corresponds to the inline radiator, and the bending is performed Parallel to the corresponding radiator, the second L-shaped long side of the radiator is electrically connected to the ground line.
在本發明之一實施例中，該高頻段包含一第4頻段、一第5頻段、一第6頻段、一第7頻段及一第8頻段，該第4頻段、該第5頻段、該第6頻段、該第7頻段及該第8頻段頻寬範圍分佈在1710MHZ ~2700MHZ 。In an embodiment of the present invention, the high frequency band includes a fourth frequency band, a fifth frequency band, a sixth frequency band, a seventh frequency band, and an eighth frequency band, and the fourth frequency band, the fifth frequency band, and the 6 bands, the seventh and the eighth band frequency bandwidth range distribution 1710MH Z ~ 2700MH Z.
在本發明之一實施例中，該彎延線輻射體的間距為0.15㎜~0.3㎜，以該彎延線輻射體形成一LC共振，以產生2400MHZ ~2700MHZ 的諧振頻率。In one embodiment of the invention, the pitch line of the curved extension of the radiator is 0.15㎜ ~ 0.3 mm, curved extension of the line to form an LC resonant radiator, to cause the resonance frequency of 2400MH Z ~ 2700MH Z.
在本發明之一實施例中，該低頻段係由不同面積的一第一方形輻射體、一第二方形輻射體、一第三方形輻射體及一第四方形輻射體組成，且分別設於該正面、該頂面、該背面及該底面上，且以位於該底面的第三方形輻射體形成與該印刷電路板的固定端固接的固接點。In an embodiment of the present invention, the low frequency band is composed of a first square radiator, a second square radiator, a third-party radiator, and a fourth square radiator of different areas, and is respectively configured On the front surface, the top surface, the back surface and the bottom surface, and a third-party radiator located on the bottom surface forms a fixing point fixed to the fixed end of the printed circuit board.
在本發明之一實施例中，該低頻段包含一第1頻段、一第2頻段及一第3頻段，該第1頻段、該第2頻段及該第3頻段頻寬範圍在700MHZ ~960MHZ 。In one embodiment of the invention, the low frequency band comprises a first band, a second band and a third frequency band, the first band, the second band and the third frequency bandwidth range 700MH Z ~ 960MH Z.
在本發明之一實施例中，該第二表面上具有一第二接地金屬面，該穿孔貫穿至該第二接地金屬面上，該穿孔電性連結一銅軸電纜線的信號饋入端電性連結，該第二接地金屬面與該銅軸電纜線的接地端電性連結。In an embodiment of the invention, the second surface has a second grounding metal surface, the through hole penetrating to the second grounding metal surface, the through hole electrically connecting the signal feeding end of the copper shaft cable The second grounding metal surface is electrically connected to the grounding end of the copper shaft cable.
茲有關本發明之技術內容及詳細說明，現配合圖式說明如下：The technical content and detailed description of the present invention are as follows:
請參閱圖3~圖7，係本發明之八頻段天線各面的金屬輻射體的圖案及圖案展開示意圖。如圖所示：本發明之八頻段天線，包括有：一載體1、一高頻段2及一低頻段3。Please refer to FIG. 3 to FIG. 7 , which are schematic diagrams showing the pattern and pattern development of the metal radiator on each side of the eight-band antenna of the present invention. As shown in the figure, the eight-band antenna of the present invention includes: a carrier 1, a high frequency band 2, and a low frequency band 3.
該載體1，係為陶瓷材料製成一方形體，其上具有一正面11、一頂面12、一背面13及一底面14。於該正面11上開設有複數盲孔15，該些盲孔15間具有至少一肋條狀結構16，以該盲孔15及肋條狀結構16的設計，作為載體1本體的減重與抑制成型翹曲變形。該盲孔15的位於該正面11上的面積與深入該載體1內部的容積用以調整該載體1的等效介電常數，以達成調整天線諧振頻率與頻寬的目的。其中，該盲孔15的面積比例範圍占該載體1本體的面積約30-50%，以面積比例為40%。該盲孔15的容積比例範圍占該載體1本身的20-30%，以容積比例範圍為24%。且該盲孔15之形狀與對稱性可因設計做任意變換調整。The carrier 1 is made of a ceramic material and has a square body having a front surface 11, a top surface 12, a back surface 13 and a bottom surface 14. A plurality of blind holes 15 are defined in the front surface 11 , and the blind holes 15 have at least one rib structure 16 , and the blind holes 15 and the rib structure 16 are designed as the weight reduction and suppression molding of the carrier 1 body. Curved deformation. The area of the blind hole 15 on the front surface 11 and the volume deep inside the carrier 1 are used to adjust the equivalent dielectric constant of the carrier 1 for the purpose of adjusting the resonant frequency and bandwidth of the antenna. The area ratio of the blind hole 15 is about 30-50% of the area of the body of the carrier 1, and the area ratio is 40%. The volume ratio of the blind hole 15 is 20-30% of the carrier 1 itself, and the volume ratio ranges from 24%. Moreover, the shape and symmetry of the blind hole 15 can be adjusted by any transformation.
該高頻段2，係以該載體1的正面11為基準，該高頻段2係位於該載體1左邊，其上具有一雙T形輻射體21、一第一L形輻射體22、一一字形輻射體23、一彎延線輻射體24及一第二L形輻射體25組成，該雙T形輻射體21分別設於該載體1的正面11、頂面12、背面13及底面14，且以該雙T形輻射體21位於該底面14的部份輻射體211形成與該印刷電路板(圖中未示)固接的固接點。該雙T形輻射體21的其一底部與設於該背面13的該第一L形輻射體22的短邊221一端電性連結，該第一L形輻射體22的短邊221的另一端與設於該正面11及該底面14的一字形輻射體23電性連結，在本圖式中該一字形輻射體23形成信號饋入點。另，該第一L形輻射體22的設於該頂面12及背面13的長邊222與設於該頂面12及該背面13的該彎延線輻射體24形成耦合連結，該彎延線輻射體24的間距241為0.15㎜~0.3㎜，以該彎延線輻射體24形成一LC共振，以產生2400MHZ ~2700MHZ 的諧振頻率。又，該第二L形輻射體25分設於該載體1的正面11及該底面14，該第二L形輻射體25的短邊251與該一字形輻射體23平行相對應，該第二L形輻射體25的長邊252與該一字形輻射體23呈垂直對應，且與該彎延線輻射體24平行相對應，在本圖式中，該第二L形輻射體25的長邊252形成接地點。在本圖式中，該高頻段2包含了本發明的第4頻段、第5頻段、第6頻段、第7頻段及第8頻段，該第4頻段、第5頻段、第6頻段、第7頻段及第8頻段的頻寬範圍分佈在1710MHZ ~2700MHZ ，可用於GSM、WCDMA、WIFI及LTE通訊系統。The high frequency band 2 is based on the front side 11 of the carrier 1. The high frequency band 2 is located on the left side of the carrier 1 and has a pair of T-shaped radiators 21, a first L-shaped radiator 22, and a flat shape. a radiator 23, a bending line radiator 24 and a second L-shaped radiator 25, wherein the double T-shaped radiators 21 are respectively disposed on the front surface 11, the top surface 12, the back surface 13 and the bottom surface 14 of the carrier 1, and A portion of the radiator 211 on the bottom surface 14 of the double T-shaped radiator 21 forms a fixed contact point to the printed circuit board (not shown). One end of the double T-shaped radiator 21 is electrically connected to one end of the short side 221 of the first L-shaped radiator 22 disposed on the back surface 13. The other end of the short side 221 of the first L-shaped radiator 22 The in-line radiator 23 is electrically connected to the front surface 11 and the bottom surface 14. In the figure, the in-line radiator 23 forms a signal feeding point. The long side 222 of the first L-shaped radiator 22 disposed on the top surface 12 and the back surface 13 is coupled to the curved line radiator 24 disposed on the top surface 12 and the back surface 13 , and the bending is formed. line spacing of radiator 241 is 0.15㎜ 24 ~ 0.3 mm, curved extension of the line to the radiator 24 is formed an LC resonance to produce a resonance frequency of 2400MH Z ~ 2700MH Z. Moreover, the second L-shaped radiator 25 is disposed on the front surface 11 and the bottom surface 14 of the carrier 1. The short side 251 of the second L-shaped radiator 25 corresponds to the in-line radiator 23, and the second The long side 252 of the L-shaped radiator 25 vertically corresponds to the inline radiator 23 and corresponds in parallel with the curved line radiator 24, in the figure, the long side of the second L-shaped radiator 25 252 forms a ground point. In the figure, the high frequency band 2 includes the fourth frequency band, the fifth frequency band, the sixth frequency band, the seventh frequency band and the eighth frequency band of the present invention, and the fourth frequency band, the fifth frequency band, the sixth frequency band, and the seventh frequency band The frequency range of the frequency band and the 8th frequency band are distributed in 1710MH Z ~ 2700MH Z and can be used in GSM, WCDMA, WIFI and LTE communication systems.
該低頻段3，係以該載體1的正面11為基準，該低頻段3係位於該載體1右邊，該低頻段3係由不同面積的一第一方形輻射體31、一第二方形輻射體32、一第三方形輻射體33及一第四方形輻射體34組成，且分別設於該載體1的正面11、頂面12、背面13及底面14上，且以位於該載體1底面14的第三方形輻射體33形成與印刷電路板固接的固接點。在本圖式中，該低頻段3包含了本發明的第1頻段、第2頻段及第3頻段，該第1頻段、第2頻段及該第3頻段的頻寬範圍在700MHZ ~960MHZ ，可用於LTE及GMS通訊系統上。The low frequency band 3 is based on the front side 11 of the carrier 1, and the low frequency band 3 is located on the right side of the carrier 1. The low frequency band 3 is radiated by a first square radiator 31 and a second square of different areas. The body 32, a third-party radiator 33 and a fourth square radiator 34 are respectively disposed on the front surface 11, the top surface 12, the back surface 13 and the bottom surface 14 of the carrier 1, and are located on the bottom surface 14 of the carrier 1. The third-party shaped radiator 33 forms a fixed point of attachment to the printed circuit board. In the drawings, the low frequency band 3 comprises the first invention, the second and third frequency bands, the first band, the second frequency range and bandwidth of the third frequency band in 700MH Z ~ 960MH Z It can be used on LTE and GMS communication systems.
請參閱圖8~圖10，係本發明之八頻段天線與印刷電路板分解、印刷電路板背面及電性連結組合示意圖。如圖所示：在本圖式中，本發明之八頻段天線更包含有一固接該載體1的印刷電路板4，該印刷電路板4的形狀依序具有一頂邊4a、一左側斜邊4b、一斜底邊4c、一右側短邊4d、一缺口邊4e及一右側長邊4f所圍成。且，該印刷電路板4具有一第一表面41及第二表面42。該第一表面41上具有一第一接地金屬面43及一微帶線44，該微帶線44具一前段441及一後段442，該前段441上具有一穿孔443，該微帶線44的前段441延伸於該第一接地金屬面43中，並與該第一接地金屬面43之間具有一間隙45，使該第一接地金屬面43由該左側斜邊4b至該間隙45的面積431大於該缺口邊4e至該間隙45之間的面積432。Please refer to FIG. 8 to FIG. 10 , which are schematic diagrams showing the combination of the eight-band antenna and the printed circuit board of the present invention, the back surface of the printed circuit board and the electrical connection. As shown in the figure, in the figure, the eight-band antenna of the present invention further comprises a printed circuit board 4 fixed to the carrier 1. The printed circuit board 4 has a top edge 4a and a left oblique side. 4b, an inclined bottom edge 4c, a right short side 4d, a notched edge 4e and a right long side 4f are enclosed. Moreover, the printed circuit board 4 has a first surface 41 and a second surface 42. The first surface 41 has a first grounding metal surface 43 and a microstrip line 44. The microstrip line 44 has a front section 441 and a rear section 442. The front section 441 has a through hole 443, and the microstrip line 44 The front section 441 extends in the first grounding metal surface 43 and has a gap 45 between the first grounding metal surface 43 and the first grounding metal surface 43 from the left oblique side 4b to the area 431 of the gap 45. It is larger than the area 432 between the notch edge 4e and the gap 45.
另，於該缺口邊4e至該間隙45之間較小面積432的第一接地金屬面43上延伸有一接地線46，該接地線46與該微帶線44的後段442呈平行關係並列，且該微帶線44的後段442與該接地線46之間具有一間距47，在該微帶線44的後段442及該接地線46之間的間距47電性連結有一電感器5，以該電感器5一端電性連結於該微帶線44的後段442上，另一端電性連結於該接地線46上，該電感器5除了可以調整阻抗外，還形成一個下地連結狀態，使天線形成一個雙頻倒F型的耦極天線。又於，於該第一表面41的裸空區上具有二相對應的固定端48，該二固定端48用以固接該載體1底面14的部份輻射體211及該第三方形輻射體33固接。In addition, a grounding line 46 extends from the first grounding metal surface 43 of the smaller area 432 between the notch edge 4e and the gap 45, and the grounding wire 46 is juxtaposed in parallel with the rear section 442 of the microstrip line 44, and A gap 47 is formed between the rear section 442 of the microstrip line 44 and the ground line 46. An inductor 5 is electrically coupled to the gap 47 between the rear section 442 of the microstrip line 44 and the ground line 46. One end of the device 5 is electrically connected to the rear portion 442 of the microstrip line 44, and the other end is electrically connected to the ground line 46. In addition to adjusting the impedance, the inductor 5 forms a lower ground connection state, so that the antenna forms a Dual-frequency inverted F-type coupling antenna. And a corresponding fixed end 48 on the bare space of the first surface 41, the two fixed ends 48 are used for fixing a part of the radiator 211 of the bottom surface 14 of the carrier 1 and the third-party radiator 33 fixed.
又，於該第二表面42上具有一第二接地金屬面43’，該穿孔443貫穿至該第二接地金屬面43’上，該穿孔443以供銅軸電纜線的信號饋入端(圖中未示)電性連結，該第二接地金屬面43’與該銅軸電纜線的接地端電性連結。Moreover, the second surface 42 has a second grounding metal surface 43'. The through hole 443 extends through the second grounding metal surface 43' for feeding the signal of the copper shaft cable. The electrical connection is not shown. The second grounded metal surface 43' is electrically connected to the ground end of the copper shaft cable.
在該載體1與印刷電路板4固接時，以該第一表面41的裸空區上具有二固定端48與該載體1底面14的部份輻射體211及該第三方形輻射體33固接，使該底面14的一字形輻射體23與該微帶線44電性連結，以及該第二L形輻射體25的長邊252與該接地線46電性連結。在固接後，該載體1上的低頻段3位於裸空區且對應該印刷電路板4的缺口邊4e，且對應該較小的面積432的第一接地金屬面43，使該載體1上的低頻段3處於一自由空間上，讓八頻段段的天線的低頻段3的頻率響應效果佳。When the carrier 1 is fixed to the printed circuit board 4, the partial radiator 211 having the two fixed ends 48 and the bottom surface 14 of the carrier 1 and the third-party radiator 33 are fixed on the bare space of the first surface 41. The in-line radiator 23 of the bottom surface 14 is electrically connected to the microstrip line 44, and the long side 252 of the second L-shaped radiator 25 is electrically connected to the grounding line 46. After the fixing, the low frequency band 3 on the carrier 1 is located in the bare space and corresponds to the notched edge 4e of the printed circuit board 4, and the first grounded metal surface 43 corresponding to the smaller area 432 is made on the carrier 1. The low frequency band 3 is in a free space, so that the frequency response of the low frequency band 3 of the antenna of the eight band segment is good.
請參閱圖11，係本發明之八頻段天線的反射係數曲線示意圖，且同時參閱圖10所示。如圖所示：由於本發明之載體1與印刷電路板4固接後，使該載體1上的低頻段3位於該印刷電路板4的缺口邊4e上對應該較少的第一接地金屬面43面積時，使該載體1上的低頻段3處於接地屏蔽較少的自由空間時，讓八頻段天線的低頻段3的頻率響應效果更佳(如圖11標號C)，也使得高頻段2的頻寬增加(如圖11的標號D)，且該低頻段3的頻率分佈第1頻段、第2頻段及該第3頻段的頻寬範圍在700MHZ ~960MHZ ，應用於LTE及GSM系統。該高頻段2的第4頻段、第5頻段及第6頻段的頻寬範圍在1710MHZ ~2170MHZ ，應用GSM、WCDMA系統。該第7頻段的頻寬範圍在2400MHZ ~2500MHZ ，應用於WIFI系統及該第8頻段的頻寬範圍在2600MHZ ~2700MHZ ，應用於LTE系統。Please refer to FIG. 11, which is a schematic diagram of a reflection coefficient curve of the eight-band antenna of the present invention, and FIG. 10 is also shown. As shown in the figure, since the carrier 1 of the present invention is fixed to the printed circuit board 4, the low frequency band 3 on the carrier 1 is located on the notched edge 4e of the printed circuit board 4 corresponding to the first ground metal surface. At the area of 43, when the low frequency band 3 on the carrier 1 is in a free space with less ground shielding, the frequency response effect of the low frequency band 3 of the eight-band antenna is better (as shown in FIG. 11 and C), and the high frequency band 2 is also made. increasing the bandwidth (in FIG numeral D 11), and the low-band frequency distribution of the first 3 band, the second frequency range and bandwidth of the third frequency band in 700MH Z ~ 960MH Z, LTE and GSM systems applied . The high frequency band of 2 to 4, the fifth frequency band and the second bandwidth in the range of 6 1710MH Z ~ 2170MH Z, use GSM, WCDMA system. The bandwidth of the frequency range of 7 2400MH Z ~ 2500MH Z, WIFI system and applied to the eighth frequency bandwidth range in 2600MH Z ~ 2700MH Z, is applied to the LTE system.
上述僅為本發明之較佳實施例而已，並非用來限定本發明實施之範圍。即凡依本發明申請專利範圍所做的均等變化與修飾，皆為本發明專利範圍所涵蓋。The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.
習知：Convention:
10‧‧‧天線10‧‧‧Antenna
101‧‧‧載體101‧‧‧ Carrier
102‧‧‧高頻段102‧‧‧High frequency band
103‧‧‧低頻段103‧‧‧low frequency band
20‧‧‧印刷電路板20‧‧‧Printed circuit board
201‧‧‧接地金屬面201‧‧‧Grounded metal surface
202‧‧‧信號饋入微帶線202‧‧‧Signal feeding microstrip line
203‧‧‧接地線203‧‧‧ Grounding wire
本發明：this invention:
1‧‧‧載體1‧‧‧ Carrier
11‧‧‧正面11‧‧‧ positive
12‧‧‧頂面12‧‧‧ top surface
13‧‧‧背面13‧‧‧Back
14‧‧‧底面14‧‧‧ bottom
15‧‧‧盲孔15‧‧‧Blind hole
16‧‧‧肋條狀結構16‧‧‧ ribbed structure
2‧‧‧高頻段2‧‧‧High frequency band
21‧‧‧雙T形輻射體21‧‧‧Double T-shaped radiator
211‧‧‧部份輻射體211‧‧‧Partial radiator
22‧‧‧第一L形輻射體22‧‧‧First L-shaped radiator
221‧‧‧短邊221‧‧‧ Short side
222‧‧‧長邊222‧‧‧ long side
23‧‧‧一字形輻射體23‧‧‧1-shaped radiator
24‧‧‧彎延線輻射體24‧‧‧Bending line radiator
241‧‧‧間距241‧‧‧ spacing
25‧‧‧第二L形輻射體25‧‧‧Second L-shaped radiator
251‧‧‧短邊251‧‧‧ Short side
252‧‧‧長邊252‧‧‧Longside
3‧‧‧低頻段3‧‧‧low frequency band
31‧‧‧第一方形輻射體31‧‧‧First square radiator
32‧‧‧第二方形輻射體32‧‧‧Second square radiator
33‧‧‧第三方形輻射體33‧‧‧Third-party radiator
34‧‧‧第四方形輻射體34‧‧‧fourth square radiator
4‧‧‧印刷電路板4‧‧‧Printed circuit board
4a‧‧‧頂邊4a‧‧‧ top side
4b‧‧‧左側斜邊4b‧‧‧left side bevel
4c‧‧‧斜底邊4c‧‧‧ oblique bottom
4d‧‧‧右側短邊4d‧‧‧right short side
4e‧‧‧缺口邊4e‧‧‧ gap side
4f‧‧‧右側長邊4f‧‧‧ long side on the right
41‧‧‧第一表面41‧‧‧ first surface
42‧‧‧第二表面42‧‧‧ second surface
43‧‧‧第一接地金屬面43‧‧‧First grounded metal surface
431、432‧‧‧面積431, 432‧‧‧ area
43’‧‧‧第二接地金屬面43'‧‧‧Second grounded metal surface
44‧‧‧微帶線44‧‧‧Microstrip line
441‧‧‧前段441‧‧‧
442‧‧‧後段442‧‧‧After
443‧‧‧穿孔443‧‧‧Perforation
45‧‧‧間隙45‧‧‧ gap
46‧‧‧接地線46‧‧‧ Grounding wire
47‧‧‧間距47‧‧‧ spacing
48‧‧‧固定端48‧‧‧ fixed end
5‧‧‧電感器5‧‧‧Inductors
圖1，係為傳統的多頻天線結構示意圖。FIG. 1 is a schematic diagram of a conventional multi-frequency antenna structure.
圖2，係圖1的反射損失曲線示意圖。Figure 2 is a schematic diagram of the reflection loss curve of Figure 1.
圖3~圖6，係本發明之八頻段天線正面、頂面、背面及底面金屬輻射體的圖案示意圖。3 to FIG. 6 are schematic diagrams showing the patterns of the front, top, back and bottom metal radiators of the eight-band antenna of the present invention.
圖7，係本發明之八頻段天線各面金屬輻射體的圖案展開示意圖。Fig. 7 is a schematic view showing the pattern development of the metal radiators on each side of the eight-band antenna of the present invention.
圖8，係本發明之八頻段天線與印刷電路板分解示意圖。Figure 8 is a schematic exploded view of an eight-band antenna and printed circuit board of the present invention.
圖9，係本發明之印刷電路板背面示意圖。Figure 9 is a schematic rear view of a printed circuit board of the present invention.
圖10，係本發明之八頻段天線與印刷電路板電性連結組合示意圖。FIG. 10 is a schematic diagram showing the electrical connection of the eight-band antenna and the printed circuit board of the present invention.
圖11，係本發明之八頻段天線的反射損失曲線示意圖。Figure 11 is a schematic diagram showing the reflection loss curve of the eight-band antenna of the present invention.
1‧‧‧載體 1‧‧‧ Carrier
11‧‧‧正面 11‧‧‧ positive
12‧‧‧頂面 12‧‧‧ top surface
15‧‧‧盲孔 15‧‧‧Blind hole
16‧‧‧肋條狀結構 16‧‧‧ ribbed structure
2‧‧‧高頻段 2‧‧‧High frequency band
21‧‧‧雙T形輻射體 21‧‧‧Double T-shaped radiator
211‧‧‧部份輻射體 211‧‧‧Partial radiator
22‧‧‧第一L形輻射體 22‧‧‧First L-shaped radiator
23‧‧‧一字形輻射體 23‧‧‧1-shaped radiator
24‧‧‧彎延線輻射體 24‧‧‧Bending line radiator
25‧‧‧第二L形輻射體 25‧‧‧Second L-shaped radiator
251‧‧‧短邊 251‧‧‧ Short side
252‧‧‧長邊 252‧‧‧Longside
3‧‧‧低頻段 3‧‧‧low frequency band
31‧‧‧第一方形輻射體 31‧‧‧First square radiator
33‧‧‧第三方形輻射體 33‧‧‧Third-party radiator
34‧‧‧第四方形輻射體 34‧‧‧fourth square radiator
4‧‧‧印刷電路板 4‧‧‧Printed circuit board
4a‧‧‧頂邊 4a‧‧‧ top side
4b‧‧‧左側斜邊 4b‧‧‧left side bevel
4c‧‧‧斜底邊 4c‧‧‧ oblique bottom
4d‧‧‧右側短邊 4d‧‧‧right short side
4e‧‧‧缺口邊 4e‧‧‧ gap side
4f‧‧‧右側長邊 4f‧‧‧ long side on the right
41‧‧‧第一表面 41‧‧‧ first surface
42‧‧‧第二表面 42‧‧‧ second surface
43‧‧‧第一接地金屬面 43‧‧‧First grounded metal surface
431、432‧‧‧面積 431, 432‧‧‧ area
43’‧‧‧第二接地金屬面 43'‧‧‧Second grounded metal surface
44‧‧‧微帶線 44‧‧‧Microstrip line
441‧‧‧前段 441‧‧‧
442‧‧‧後段 442‧‧‧After
443‧‧‧穿孔 443‧‧‧Perforation
45‧‧‧間隙 45‧‧‧ gap
46‧‧‧接地線 46‧‧‧ Grounding wire
47‧‧‧間距 47‧‧‧ spacing
48‧‧‧固定端 48‧‧‧ fixed end
5‧‧‧電感器 5‧‧‧Inductors
Claims (12)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104132780A TWI563735B (en) | 2015-10-06 | 2015-10-06 | Eight-frequency band antenna |
| EP16175515.2A EP3154125B1 (en) | 2015-10-06 | 2016-06-21 | Eight-frequency band antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104132780A TWI563735B (en) | 2015-10-06 | 2015-10-06 | Eight-frequency band antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI563735B TWI563735B (en) | 2016-12-21 |
| TW201714354A true TW201714354A (en) | 2017-04-16 |
Family
ID=56148282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104132780A TWI563735B (en) | 2015-10-06 | 2015-10-06 | Eight-frequency band antenna |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP3154125B1 (en) |
| TW (1) | TWI563735B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11088442B2 (en) | 2012-10-08 | 2021-08-10 | Taoglas Group Holdings Limited | Ultra-wideband LTE antenna system |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9755310B2 (en) | 2015-11-20 | 2017-09-05 | Taoglas Limited | Ten-frequency band antenna |
| US20170149136A1 (en) | 2015-11-20 | 2017-05-25 | Taoglas Limited | Eight-frequency band antenna |
| CN107123853B (en) * | 2017-05-20 | 2019-06-25 | 中国计量大学 | A kind of eight frequency range WWAN/LTE antenna for mobile phone of small size for taking into account navigation frequency range |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201440454U (en) * | 2009-05-08 | 2010-04-21 | 美磊科技股份有限公司 | Improved antenna structure |
| KR101714537B1 (en) * | 2010-11-24 | 2017-03-09 | 삼성전자주식회사 | Mimo antenna apparatus |
| TWI463738B (en) * | 2011-01-18 | 2014-12-01 | Cirocomm Technology Corp | Surface-mount multi-frequency antenna module |
| CN202042593U (en) * | 2011-04-18 | 2011-11-16 | 广东欧珀移动通信有限公司 | Multiple frequency-range built-in antenna device |
| TW201405936A (en) * | 2012-07-25 | 2014-02-01 | Wha Yu Ind Co Ltd | Chip antenna and manufacturing method thereof |
| CA2887126A1 (en) * | 2012-10-08 | 2014-04-17 | Eleazar ZUNIGA | Low cost ultra-wideband lte antenna |
| TWI566473B (en) * | 2012-10-24 | 2017-01-11 | 群邁通訊股份有限公司 | Broadband antenna and portable electronic deive having same |
| TWM459541U (en) * | 2013-01-21 | 2013-08-11 | Cirocomm Technology Corp | Patch type multiband antenna module |
-
2015
- 2015-10-06 TW TW104132780A patent/TWI563735B/en active
-
2016
- 2016-06-21 EP EP16175515.2A patent/EP3154125B1/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11088442B2 (en) | 2012-10-08 | 2021-08-10 | Taoglas Group Holdings Limited | Ultra-wideband LTE antenna system |
| US11705626B2 (en) | 2012-10-08 | 2023-07-18 | Taogals Group Holdings Limited | Ultra-wideband antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI563735B (en) | 2016-12-21 |
| EP3154125B1 (en) | 2020-04-08 |
| EP3154125A1 (en) | 2017-04-12 |
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