TW201405936A - Chip antenna and manufacturing method thereof - Google Patents

Abstract

The present invention provides a chip antenna and a manufacturing method thereof, whose construction face mainly comprises: a printed circuit carrier includes: a surface, a mounting surface and a lateral surface; three-dimensional twisty radiation layers jointly formed at least on the surface and lateral surface of the printed circuit carrier, which comprises an etching formed surface section jointed on the surface of the printed circuit carrier; at least two vertical connection sections being coated and formed with conductive body and vertically jointed between the surface and the mounting surface of the printed circuit carrier, the top of the vertical connection sections being connected with the etching formed surface section; a double-face crossed feed welding portion formed by an end portion area of one of the vertical connection sections close to the mounting surface and a feed bottom layer connected from the end portion area turning to extend the mounting surface; and a double-face crossed grounding welding portion formed by an end portion section of the other vertical connection section close to the mounting surface and a grounding bottom layer connected from the end portion section turning to extend the mounting surface. Accordingly, the electrical connection between the chip antenna and the circuit substrate can be achieved through a surface mounting technology, and the purposes of practical progressive and better industry economic benefits such as simplifying manufacture processes, improving of yield and reducing costs are achieved.

Description

Wafer type antenna and manufacturing method thereof

The present invention relates to an antenna; and more particularly to an innovative design of a wafer type antenna structure and a method of fabricating the same.

According to the communication equipment, it is an indispensable auxiliary tool in the life of modern people. For all kinds of communication equipment to achieve the purpose of message transmission, the antenna is a vital unit component, and with the development trend of miniaturization of communication equipment, The requirement of external communication for the communication products makes the hidden antenna become the development trend of new products. However, if some antennas with more complicated structures are to be installed in the structure of communication equipment with limited space, the miniaturization design of the antenna is obviously It is necessary, for this reason, some related micro-antennas have been developed by the relevant industry.

However, although the micro-antenna can be adapted to a communication device structure with limited space due to the miniaturization of the structure, other aspects still have some imperfections, such as manufacturing cost, process yield and efficiency, etc. Micro-antennas often have problems due to the lack of design of their structural types and manufacturing methods; for example, conventional micro-antennas must be passed through a common body (ie, the grounding portion, the radiating portion, and the feeding portion) after molding. The welding process combines the feed line and the feed portion. However, due to the increase of this process, it has a negative impact on manufacturing cost, yield and efficiency. In other words, the conventional micro antenna is still limited in its structural form. The design of the manufacturing method has made it impossible to adopt a relatively simple and efficient process technology (such as surface adhesion technology, referred to as SMT), which is a technical issue that needs to be considered again.

Therefore, in view of the problems existing in the above-mentioned conventional antennas, how to develop an innovative design that can be more ideal and practical, and the relevant industry should further consider the goal and direction of breakthrough.

In view of this, the inventor has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the inventor has finally obtained the practical invention.

The main object of the present invention is to provide a wafer type antenna and a manufacturing method thereof, and the problem to be solved is to aim at how to develop a new type of wafer antenna structure and a manufacturing method thereof which are more ideal and practical. Thinking about the innovation breakthrough; the technical feature of the problem solving of the present invention is to provide a wafer type antenna, which mainly comprises: a printed circuit carrier, which is composed of a plate-shaped or block-shaped insulator, including a surface, a facing surface and a standing a laterally facing surface between the surface and the periphery of the facing surface; at least one three-dimensional meandering radiating layer is combined and formed on at least a surface and a lateral surface of the printed circuit carrier, the three-dimensional meandering radiation layer comprising: an etched surface area a segment bonded to the surface of the printed circuit carrier; at least two vertical connecting segments are formed to be vertically coupled between the surface of the printed circuit carrier and the facing surface for forming the coated conductor, and the upper end of the vertical connecting portion is The etched surface section is joined; the feed weld is spanned across the double face, and an end portion of the directional joint is adjacent to the end region of the face, and from the end The regional connection is formed by a feed-in bottom layer extending to the facing surface, and the feed-welding portion is formed to span the double-faced configuration; the double-faced ground-welded portion is formed by another one of the vertical joint sections. Forming an end portion adjacent to the surface and a grounding layer extending from the end portion to the ground surface to form a grounded welded portion spanning the double-faced type With this innovative and unique design, the present invention can be placed on a circuit substrate by the surface of the printed circuit carrier, and is fed to the soldering portion and the grounding soldering portion. The board is matched with the preset feeding circuit and the grounding circuit of the circuit board, and the surface bonding technology can electrically combine the wafer antenna and the circuit board, and the welding process of the feeding line can be omitted, thereby simplifying the process. Improve practical yield and better industrial economic benefits such as improving yield and reducing costs.

Another object of the present invention is to provide a method for manufacturing a wafer type antenna, which mainly comprises: preparing a plate-like or block-shaped insulating substrate, the insulating substrate comprising a surface and a facing surface; Forming at least one etched surface portion of the three-dimensional meandering radiation layer on the surface of the insulating substrate; and forming at least a gap-shaped feed bottom layer and a ground bottom layer on the surface of the insulating substrate; The carrier forms at least two perforations of the through surface and the facing surface, and the through hole is connected to the etched surface portion and the feed bottom layer and the ground bottom layer; a conductive material is filled in the through hole and hardened and shaped to be perforated The entire hole wall surface; the edge cutting step of the insulating substrate is performed from the punching position by a cutting means to obtain at least one printed circuit carrier having the vertical direction of the surface and the facing surface a lateral surface between the perimeters; thereby, the conductive material bonded to the perforations fed into the bottom layer is connected to form a three-dimensional meandering spoke One of the vertical joining sections of the layer, and the end region adjacent to the facing surface forms a feed-welding portion spanning the double face together with the feed bottom layer; the communicating etched surface section and the grounding bottom layer are perforated The electrically conductive material combined with the shaping constitutes another vertical connecting section of the three-dimensional meandering radiating layer, and the end section adjacent to the facing surface forms a spanning double-faced joint with the feeding grounded bottom layer. Ground welding part.

1 to 6 are preferred embodiments of the wafer type antenna of the present invention and a method of manufacturing the same, but the embodiments are for illustrative purposes only and are not limited by the structure in the patent application; The wafer-type antenna A includes a printed circuit carrier 10 which is formed of a plate-shaped or block-shaped insulator, and includes a surface 11 , a facing surface 12 , and a vertical connection to the surface 11 . a lateral surface 13 between the periphery of the surface 12; at least one three-dimensional meandering radiation layer 20 is integrally formed on at least the surface 11 and the lateral surface 13 of the printed circuit carrier 10, the three-dimensional meandering radiation layer 20 comprising: an etched surface The segment 21 is bonded to the surface 11 of the printed circuit carrier 10 in an etched molding state; at least two vertical connecting portions 221 and 223 are vertically bonded to the surface of the printed circuit carrier 10 in a state in which the coated conductor is molded. 11 is disposed between the facing surface 12 and the upper ends of the vertical connecting sections 221 and 223 are coupled to the etched molding surface section 21; wherein the vertical connecting sections 221 and 223 are disposed on the side of the printed circuit carrier 10 The face 13 has a grooved surface pattern or a planar pattern; wherein The groove surface pattern includes a circular arc-shaped cross-sectional aspect and an elongated cross-sectional aspect; the vertical connecting sections 221 and 223 as shown in FIG. 1 are the lateral faces 13 provided on the printed circuit carrier 10. And the embodiment of the arc-shaped cross-sectional groove surface type; the feed-welding portion 23 spanning the double-face is formed by one of the vertical connecting sections 221 adjacent to the end region 231 of the facing surface 12, And a feed-in bottom layer 232 that is coupled to the end surface region 231 and extends to the facing surface 12, and the feed-welding portion 23 is formed to span a double-faceted configuration (as shown in FIG. 5); A double-faceted grounding weld 24 is adjacent to the end section 241 of the facing surface 12 from the other of the vertical joint sections 223, and from the end The section 241 is coupled to a grounding layer 242 extending to the facing surface 12, and the grounding soldering portion 24 is formed to span a double-faced configuration (as shown in FIG. 6); As shown in FIG. 7, the wafer type antenna A can be placed on a circuit substrate 30 by the surface 12 of the printed circuit carrier 10, and is fed back to the soldering portion 23, the ground soldering portion 24, and the circuit substrate. 30 The predetermined feeding circuit 31 and the grounding circuit 32 are oppositely arranged, and the electrical bonding operation between the wafer type antenna A and the circuit substrate 30 can be performed by the surface adhesion technology, and the welding process of the feeding line can be omitted. The surface mount technology, also known as Surface Mount Technology (SMT), places and repositions semiconductor components such as precision ICs, resistors, capacitors, inductors, etc. on a printed circuit board (PCB). One of the technologies, the advantage of using this SMT is that it can miniaturize electronic products and speed up production. It can be directly combined with the circuit board through the hot melt of the tin furnace, without manual assembly, which can greatly reduce the labor cost. Therefore, compared with the conventional conventional plug-in production machine, the speed and quality can be improved, and the defect rate can be effectively reduced.

The advantages of the feed-welding portion 23 and the ground-welding portion 24 across the double-faceted configuration in the present invention are mainly that the molten solder can be bonded to the bottom layer 232 of the placement surface 12 when the SMT process is performed. In addition to the grounding layer 242, the end region 231 and the end portion 241 of the vertical connecting sections 221 and 223 can be further attracted upward, thereby obtaining excellent electrical connection and firm positioning effect.

The printed circuit carrier 10 can be in a single-set configuration or a plurality of stacked configurations; wherein, in a plurality of stacked configurations, the phase-stacked printed circuit carriers 10 can be formed by etching. A conductive connection state is achieved.

Referring to FIGS. 1 and 2, the three-dimensional meandering radiation layer 20 may further include an etched molding surface bonded to the printed circuit carrier 10. The bottom radiating section 25 is coupled to the etched surface section 21 by the corresponding lateral faces of the printed circuit carrier 10 to the joining section 22B.

Referring to FIGS. 1 to 6, the printed circuit carrier 10 may be provided with a single or a plurality of electrically conductive perforations 40 arranged at intervals and extending through the surface 11 and the facing surface 12, the entire aperture wall surface of the conductive via 40 The conductive layer 41 is bonded, and the upper end of the conductive via 40 is connected to the etched surface portion 21 of the three-dimensional meandering radiating layer 20, and the lower end of the conductive via 40 is fed to the bottom layer 232, the ground layer 242 or the bottom radiation region. At least one of the segments 25 is linked. The conductive via 40 can be regarded as a plated through hole (PTH), and the conductive perforations 40 are arranged at a plurality of intervals, and can be used as a reference point for cutting different specifications by the relevant manufacturer during mass production. In this way, it can flexibly respond to the diverse needs of the client.

Next, the method for manufacturing the wafer antenna of the present invention will be described as follows: (please refer to FIG. 8) 1. As shown in FIG. 8(a), a plate or block type is prepared. The insulating substrate 10B includes a surface 11 and a facing surface 12; 2. As shown in FIG. 8(b), the surface 11 of the insulating substrate 10B is formed by an etching forming means. At least one etched surface portion 21 of a three-dimensional meandering radiation layer 20; and at least a gap-shaped feed bottom layer 232 and a ground bottom layer 242 are formed on the face 12 of the insulating substrate 10B; 3. As shown in FIG. 8 ( c), by means of a drilling means 50, at least two through holes 40B are formed in the insulating substrate 10B for the through surface 11 and the facing surface 12, and the perforations 40B are connected to the etched surface section 21 and the feed Into the bottom layer 232, the grounding bottom layer 242; 4, as shown in Figure 8 (d), fill the perforation 40B with a guide The electric material 41B is hardened and bonded to the surface of the entire hole wall of the through hole 40B; 5. As shown in FIG. 8(e), the edge of the insulating substrate is made from the position of the through hole 40B by a cutting means 60. Forming a step of obtaining at least one printed circuit carrier 10, as shown in FIG. 8(f), the printed circuit carrier 10 having a lateral face that is vertically engaged between the surface 11 and the periphery of the face 12 13; thereby, the conductive etching surface portion 21 and the conductive material 41B combined in the through hole 40B fed into the bottom layer constitute one of the vertical connecting sections 221 of the three-dimensional meandering radiation layer 20, and The end region adjacent to the face 12 is combined with the feed bottom layer 232 to form a feed weld 23 that spans the double face (please refer to Figures 1, 2, 5, and 6); the interconnected etched surface section The electrically conductive material 41B, which is formed in the perforation 40B of the grounding layer 242, forms another vertical connecting section 223 of the three-dimensional meandering radiating layer 20, and is adjacent to the end section of the facing surface 12. The grounding bottom layer 242 together form a grounding soldering portion 24 that spans the double facing (please refer to the first Figure 2,5,6).

Further, as shown in FIG. 9, the vertical connecting sections 221 and 223 of the three-dimensional meandering radiating layer 20 are formed on the lateral surface 13 of the printed circuit board 10 and have a long-shaped concave groove surface type. Aspect. Further, as shown in Fig. 10, the vertical connecting sections 221 and 223 are formed in a planar state in which the lateral surface 13 of the printed circuit board 10 is formed.

Further, as shown in FIG. 11, in the figure, the vertical connecting sections 221 and 223 of the three-dimensional meandering radiating layer 20 are formed by the conductive through holes 225 penetrating the surface 11 and the facing surface 12, so that the conductive The upper end of the through hole 225 is connected to the etched surface portion 21 of the three-dimensional meandering radiation layer 20, and the lower end of the conductive through hole 225 is connected to the feed bottom layer 232 and the ground bottom layer 242. This example is used to illustrate the vertical joint portion 221 In addition to the above-mentioned form of being exposed to the lateral surface 13, the 223 may also be a perforated hidden type.

Advantages of the invention:

According to the prior art of the prior art, the wafer type antenna can be placed on a circuit substrate by the surface of the printed circuit carrier. The feeding portion and the grounding soldering portion are matched with the predetermined feeding circuit and the grounding circuit of the circuit board, and the electrical connection between the wafer type antenna and the circuit substrate can be performed by the surface adhesion technology, and the photoelectric bonding can be omitted. The welding process of the feed line achieves practical progress and better industrial economic benefits such as simplifying the process, improving the yield, and reducing the cost.

The above embodiments are intended to be illustrative of the present invention, and are not to be construed as limiting the scope of the invention. The principles are changed and modified to achieve an equivalent purpose, and such changes and modifications are to be included in the scope defined by the scope of the patent application as described later.

A‧‧‧wafer antenna

10‧‧‧Printed circuit carrier

10B‧‧‧Insulation substrate

11‧‧‧ surface

12‧‧‧Setting

13‧‧‧ lateral side

20‧‧‧Three-dimensional zigzag radiation layer

21‧‧‧etched surface section

221, 223, 22B‧‧ ‧ vertical link section

225‧‧‧Electrical through holes

23‧‧‧Feed in the welding department

231‧‧‧End area

232‧‧‧Feed into the ground floor

24‧‧‧Grounding Welding Department

241‧‧‧End section

242‧‧‧ Grounding ground

25‧‧‧Bottom radiation section

30‧‧‧ circuit board

31‧‧‧Feed in circuit

32‧‧‧ Grounding circuit

40‧‧‧Electrical perforation

40B‧‧‧Perforation

41‧‧‧ Conductive layer

41B‧‧‧Electrical materials

50‧‧‧Drilling means

60‧‧‧ cutting means

Fig. 1 is a top perspective view showing a preferred embodiment of the wafer type antenna structure of the present invention.

Fig. 2 is a bottom perspective view of a preferred embodiment of the wafer type antenna structure of the present invention.

Figure 3 is a plan top plan view of a preferred embodiment of the wafer type antenna structure of the present invention.

Figure 4 is a plan bottom plan view of a preferred embodiment of the wafer type antenna structure of the present invention.

Fig. 5 is a cross-sectional view taken along line A-A of Fig. 3.

Fig. 6 is a cross-sectional view taken along line B-B of Fig. 3.

Fig. 7 is a perspective view showing an embodiment in which the wafer type antenna of the present invention is placed on a circuit board.

Fig. 8 is a schematic view showing the steps of a method of manufacturing a wafer type antenna of the present invention.

Fig. 9 is a view showing an embodiment in which the upright connecting section of the present invention is in the form of a long-section concave groove surface.

Fig. 10 is a view showing an embodiment in which the standing connecting section of the present invention is in a planar form.

Fig. 11 is a view showing an embodiment of a vertical connecting section of the present invention which is constituted by a conductive through hole.

A‧‧‧wafer antenna

10‧‧‧Printed circuit carrier

11‧‧‧ surface

12‧‧‧Setting

13‧‧‧ lateral side

20‧‧‧Three-dimensional zigzag radiation layer

21‧‧‧etched surface section

221, 223, 22B‧‧ ‧ vertical link section

23‧‧‧Feed in the welding department

24‧‧‧Grounding Welding Department

40‧‧‧Electrical perforation

Claims (10)

A wafer type antenna comprising: a printed circuit carrier formed of a plate-shaped or block-shaped insulator, comprising a surface, a facing surface, and a lateral direction that is longitudinally coupled between the surface and the periphery of the facing surface At least one three-dimensional meandering radiation layer is formed in combination with at least a surface and a lateral surface of the printed circuit carrier, the three-dimensional meandering radiation layer comprising: an etched molding surface section bonded to the printed circuit carrier for an etched molding state a surface; at least two vertical connecting sections, which are formed to be vertically coupled to the surface of the printed circuit carrier and the facing surface, and the upper end of the vertical connecting section and the etched surface section a feed-welding portion spanning the double-faced portion, wherein an end portion of the vertical joint portion is adjacent to the end surface, and a feed-in bottom layer extending from the end portion to the facing surface Forming, forming the feed weld portion across a double-faceted configuration; a double-faced ground weld portion, the other end portion of the vertical joint portion adjacent to the end face, and The end zone A steering link extending to the ground surface formed opposite the bottom, the grounding soldering portions constituting the double line across the cover are oriented patterns. The wafer-type antenna according to claim 1, wherein the printed circuit carrier is in a single-set configuration or a plurality of stacked configurations; wherein the stacked printed circuit is in a plurality of stacked configurations The conductive bonding state is achieved between the carriers by the surface layer formed by etching. The wafer-type antenna of claim 1, wherein the three-dimensional meandering radiation layer further comprises a bottom radiating section bonded to the printed circuit carrier facing surface in an etched molding manner, and the bottom radiating section is Establishing a link section by the corresponding lateral plane of the printed circuit carrier Attached to the etched surface section. The wafer type antenna according to claim 1, wherein the printed circuit carrier is provided with a single or a plurality of conductive perforations arranged at intervals and penetrating through the surface and the facing surface, and the integral hole wall surface of the conductive perforation is combined The conductive layer has a conductive layer, and the upper end of the conductive via is connected to the etched surface portion of the three-dimensional meandering radiation layer, and the lower end of the conductive via is connected to at least one of the feed bottom layer and the ground bottom layer. The wafer-type antenna according to claim 1, wherein the vertical connecting section of the three-dimensional meandering radiation layer is disposed on a lateral surface of the printed circuit carrier in a concave groove shape or a planar shape; The groove surface pattern includes a circular cross-sectional aspect and a long cross-sectional aspect. The wafer-type antenna of claim 1, wherein the three-dimensional meandering radiation layer further comprises a bottom radiating section bonded to the printed circuit carrier facing surface in an etched molding manner, and the bottom radiating section is And connecting the connecting section to the etched surface section by the corresponding lateral surface of the printed circuit carrier; and the vertical connecting section of the three-dimensional meandering radiating layer is electrically conductive through the through surface and the facing surface The hole is formed such that the upper end of the conductive through hole is coupled to the etched surface portion of the three-dimensional meandering radiation layer, and the lower end of the conductive through hole is coupled to the feed bottom layer, the ground bottom layer or the bottom radiation portion. A method for manufacturing a wafer type antenna, comprising: preparing an insulating substrate of a plate shape or a block shape, the insulating substrate comprising a surface and a surface; forming a surface on the surface of the insulating substrate by an etching forming means At least one etched surface portion of the three-dimensional meandering radiation layer; and at least a feed-in bottom layer and a ground bottom layer formed at intervals on the surface of the insulating substrate; formed on the insulating substrate by a drilling method Through surface and inlay At least two perforations of the face, and the perforations are respectively connected to the etched surface section and the feed bottom layer, the ground bottom layer; the conductive material is filled in the through hole and hardened and bonded to form the perforated integral hole wall surface Performing a edge cutting step of the insulating substrate from the perforation position to obtain at least one printed circuit carrier having a vertical connection between the surface and the periphery of the facing surface by a cutting means a lateral surface; thereby, the conductive material bonded to the perforated layer fed into the bottom layer is configured to form one of the vertical connecting sections of the three-dimensional meandering radiation layer, and is adjacent to the vertical surface The end region of the face is combined with the feed bottom layer to form a feed weld portion spanning the double face; the conductive material formed by the connection between the etched surface portion and the ground plated through hole constitutes the three-dimensional meandering radiation Another diametrically connected section of the layer, and its adjacent end section, together with the grounded bottom layer, forms a grounded weld that spans the double face. The method for manufacturing a wafer-type antenna according to the seventh aspect of the invention, wherein the printed circuit carrier is a single-set configuration type or a plurality of stacked arrangement types; wherein, in a plurality of stacked arrangement types, phase-stacked The printed circuit carrier is electrically connected to each other by an etched surface layer. The wafer-type antenna manufacturing method according to claim 7, wherein the three-dimensional meandering radiation layer further comprises a bottom radiating section bonded to the printed circuit carrier facing surface in an etched molding manner, and the bottom radiating section The segments are re-formed by the corresponding lateral faces of the printed circuit carrier to form another vertical joining segment to be joined to the etched molding surface segments. The wafer-type antenna manufacturing method of claim 7, wherein the three-dimensional meandering radiation layer further comprises a bottom radiating section bonded to the printed circuit carrier facing surface in an etched molding manner, and the bottom portion The radiation section is further formed by the corresponding lateral side of the printed circuit carrier to form another vertical joint section to be connected with the etched surface section; and the circuit carrier is printed and provided with a single or a plurality of spaced arrangement and a conductive perforation extending through the surface and the facing surface, the conductive perforated wall surface is coupled with a conductive layer, and the upper end of the conductive perforation is coupled to the etched surface portion of the three-dimensional meandering radiation layer, and the lower end of the conductive perforation is And at least one of the feed bottom layer, the ground bottom layer, and the bottom radiation portion.