TWI552653B - Electronic device and component module - Google Patents

Description

Electronic device and its component module

The present disclosure relates to an electronic device and its component module, and more particularly to an electronic device and a component module thereof that can achieve a loss free of components.

In recent years, the use of various types of electronic devices such as mobile phones, tablet computers, notebook computers, and smart phones has become more common and convenient. A versatile and aesthetically pleasing design direction is developed to provide users with more choices.

A number of components, such as electronic components or components, are integrated inside the electronic device. When manufacturing or repairing an electronic device, it is necessary to disassemble the component, whether it is rework, recovery of a proper component, or replacement of a replacement component. However, with the precision and miniaturization of components, known disassembly methods may not apply or damage components, resulting in an increase in production costs or maintenance costs.

The present disclosure proposes an electronic device that can remove components without damaging components, which not only enables easy and quick component removal, but also helps improve the proper production or maintenance.

The electronic device of the present disclosure includes a housing, an element, and a flexible substrate. The housing has a placement area, and the component is disposed in the placement area. The flexible substrate includes a joint and an extension. The joint is between the element and a bearing surface of the placement zone, and the joint has a first surface and a second surface relative to the first surface, wherein the first surface is joined to The element, and the second surface is joined to the bearing surface. The extension connects the joint and extends beyond the placement zone.

In an embodiment of the present disclosure, the housing has a recess in the placement area, and the component is disposed on the bearing surface at the bottom of the recess.

In an embodiment of the present disclosure, the extension extends beyond the recess by a gap between the element and an inner wall of the recess.

In an embodiment of the present disclosure, the extension through the gap is bent to extend beyond the recess.

In an embodiment of the present disclosure, the flexible substrate has a weakened structure at a bend of the extension.

In an embodiment of the present disclosure, the weakened structure includes one or more holes extending through the extension.

In an embodiment of the present disclosure, the flexible substrate has a through-the-delay A gripping hole at the end of the extension.

In an embodiment of the present disclosure, the end of the extension is fixed to the surface of the housing.

In an embodiment of the present disclosure, the extension portion includes a first extension portion and a second extension portion on opposite sides of the joint portion.

In an embodiment of the present disclosure, the joint is annular and joined to the element.

In an embodiment of the disclosure, the electronic device further includes a first adhesive layer disposed between the first surface of the joint and the component.

In an embodiment of the present disclosure, the electronic device further includes a second adhesive layer disposed between the second surface of the joint portion and the bearing surface.

In an embodiment of the present disclosure, the housing has a plurality of through holes in the placement area for communicating the inner and outer spaces of the housing, and the component includes a sound output element.

The present disclosure further proposes a component module suitable for the aforementioned electronic device, including the foregoing components and the aforementioned flexible substrate. The component module can realize simple, rapid and non-destructive component disassembly operation, and can improve the proper production rate of electronic devices.

Based on the above, the present disclosure discloses a flexible substrate as a carrier member and a member for fixing the component to the housing, and the extension of the flexible substrate extends beyond the placement area of the component. Therefore, when the component is disassembled, it is only necessary to extract the extension of the flexible substrate located outside the placement area, and the component can be removed from the housing together with the flexible substrate, so the disassembly process Simple and fast. In addition, the present disclosure applies force to the flexible substrate when the component is disassembled, instead of directly applying force to the component, thereby greatly reducing the chance of the component being damaged by an external force during the disassembly process, thereby contributing to an increase in production or Proper rate of maintenance.

The above described features and advantages of the present invention will be more apparent from the following description.

10‧‧‧Electronic devices

100‧‧‧shell

102‧‧‧through holes

110‧‧‧Placement area

112‧‧‧ dent

112a‧‧‧ bearing surface

200‧‧‧Component Module

210‧‧‧ components

220‧‧‧Flexible substrate

222‧‧‧ joints

222a‧‧‧ first surface

222b‧‧‧ second surface

224‧‧‧Extension

232‧‧‧First adhesive layer

234‧‧‧Second Adhesive Layer

270‧‧‧ gap

280‧‧‧Weakened structure

290‧‧‧ holding hole

510‧‧‧ components

520‧‧‧Flexible substrate

522‧‧‧ joint

524‧‧‧First Extension

526‧‧‧Second extension

F‧‧‧ Rally

P‧‧‧ pivot

FIG. 1 illustrates a partial structure of an electronic device in accordance with an embodiment of the present disclosure.

Figure 2 is an exploded view of the partial structure of Figure 1.

Figure 3 is a cross-sectional view of the partial structure of Figure 1 taken along line A-A'.

4A-4C illustrate a component disassembly process of one embodiment of the present disclosure.

FIG. 5 illustrates a flexible substrate of another embodiment of the present disclosure.

6 is a partial cross-sectional view of an electronic device to which the flexible substrate of FIG. 5 is applied.

The following embodiments will be described by taking a speaker of a handheld electronic device as an example. In fact, the scope of application of the various technical solutions proposed by the present disclosure is not limited thereto. Where possible, other components of the handheld electronic device may be similarly configured for easy, fast and non-destructive disassembly. On the other hand, those having ordinary skill in the art, after referring to the disclosure, can also understand other types of electronic devices as well as the reasonable application scope of the present disclosure.

FIG. 1 illustrates a partial structure of an electronic device in accordance with an embodiment of the present disclosure. Figure 2 is an exploded view of the partial structure of Figure 1.

As shown in FIGS. 1 and 2 , the electronic device 10 of the present embodiment includes a housing 100 and a component module 200 disposed on the housing 100 . The component module 200 includes an element 210 and a flexible substrate 220. Here, the electronic device 10 is, for example, a handheld electronic device, and the component 210 is, for example, a sound output component of a handheld electronic device. When the component 210 is a sound output component of the handheld electronic device, the housing 100 further has a plurality of through holes 102 communicating the inner and outer spaces for the component 210 to output sound. For example, element 210 can be a speaker or a receiver. In addition, the housing 100 has a placement area 110 and the component 210 is disposed within the placement area 110 by a flexible substrate 220. The material of the flexible substrate 220 is, for example, polyethylene terephthalate (PET), polyester film (Mylar) or other suitable flexible material. In more detail, the flexible substrate 220 does not have any circuits or traces.

Figure 3 is a cross-sectional view of the partial structure of Figure 1 taken along line A-A'. In order to facilitate the description and clearly illustrate the technical solutions of the present disclosure, FIG. 3 is only a schematic diagram, and some structural details are omitted. Referring to FIGS. 1 to 3 at the same time, more specifically, the housing 100 of the present embodiment has, for example, a recess 112 in the placement area 110 and accommodating the component 210, and the bottom of the recess 112 has a bearing surface on which the component 210 can be placed. 112a. The flexible substrate 220 includes a joint 222 between the element 210 and the load bearing surface 112a and an extension 224 that is coupled to the joint 222. The joint portion 222 has a first surface 222a and a second surface 222b relative to the first surface 222a, wherein the element 210 is joined to the first surface 222a by, for example, a first adhesive layer 232 or other, and the second surface 222b is For example, the second adhesive layer 234 or otherwise joined to the carrier surface 112a.

The first adhesive layer 232 or the second adhesive layer 234 herein is, for example, a glue material previously applied to the surface of the flexible substrate 220 or a glue material previously applied to the element 210 or the bearing surface 112a. Still alternatively, the flexible substrate 220 provided by the present disclosure may be a double-sided adhesive to provide a first surface 222a and a second surface 222b having a viscosity. When the component 210 is assembled, the protective film on one side of the double-sided adhesive (flexible substrate 220) may be first peeled off to expose the viscous first surface 222a, and the component 210 is bonded to the first surface 222a. Thereafter, the protective film on the other side of the double-sided tape (flexible substrate 220) is peeled off to expose the viscous second surface 222b to bond the flexible substrate 220 along with the component 210 to the carrier surface 112a.

The extension 224 connects the joint 222 and extends beyond the placement area 110. In the present embodiment, a gap 270 is formed between the element 210 and the inner wall of the recess 112, and the extension 224 extends from the joint 222 through the gap 270 and protrudes beyond the recess 112. In addition, in order to prevent the extension portion 224 from occupying the internal space of the electronic device 10, or to suspend the internal space to affect the assembly of other components, etc., the present embodiment selects to bend the extension portion 224 protruding from the recess 112, and can bend The end of the rear extension portion 224 is attached to the surface of the housing 100 outside the recess 112 by, for example, a glue or its own adhesiveness, or forms a possible interference structure (such as a slot or a tongue plate) on the housing 100. , a bump, etc.) for fixing the end of the extension 224.

This embodiment also selects to form a weakened structure 280 at the bend of the extension 224. The weakened structure 280 herein is, for example, a hole penetrating the extension portion 224 or other design that may weaken the structural strength of the flexible substrate 220 to facilitate the flexible substrate 220. Along this weakened structure 280 is bent. In addition, the flexible substrate 220 of the present embodiment further has a holding hole 290 penetrating the end of the extending portion 224. The grip hole 290 here can be biased by a human finger or a tool when the component 210 is detached.

The disassembly process applied to the element 210 of the present embodiment will be described below with reference to Figs. 4A to 4C. First, as shown in FIG. 4A, the end of the extension portion 224 fixed to the surface of the casing 100 can be separated from the surface of the casing 100 by a finger or a tool. Next, as shown in FIG. 4B, a pulling force F is applied to the end of the extending portion 224 to drive the engaging portion 222 away from the bearing surface 112a at the bottom of the recess 112. At this time, since the extending portion 224 is located on a single side of the joint portion 222, the element module 200 is rotated with one end away from the extending portion 224 as a fulcrum P, and is separated from the carrying surface 112a. After the component module 200 exits the recess 112, the flexible substrate 220 is removed from the component 210 as shown in FIG. 4C.

In the above embodiment, the removal of the component can be completed only by pulling the flexible substrate 220 and removing the flexible substrate 220 from the component 210, so that the disassembly process is simple and rapid. At the same time, since the entire disassembly process is applied to the flexible substrate 220 instead of directly applying the component 210, the component 210 can be prevented from being damaged by external force during the disassembly process, which contributes to the improvement of the production of the electronic device 10. Or the proper rate of repair.

Although the foregoing embodiment describes an embodiment of the present disclosure in conjunction with the drawings, the disclosure is not limited thereto. As mentioned above, the type of electronic device, the type of component itself, the configuration, etc., may be reasonably changed and adjusted. In addition, the shape or configuration of the flexible substrate 220 itself may also vary with actual needs. For example, the element 210 of the previous embodiment is, for example, a sound output element (such as a horn or The earpiece), so that the joint portion 222 of the flexible substrate 220 is annular, it is joined to the element 210, and the central portion of the element 210 and the through hole 102 of the housing 100 are exposed to allow the sound emitted by the element 210 to pass through the through hole. 102 outputs, or receives external sound through the through hole 102.

In view of the above, FIG. 5 further illustrates a flexible substrate 520 of another embodiment of the present disclosure, and FIG. 6 illustrates a partial cross-sectional structure of an electronic device to which the flexible substrate 520 is applied. This embodiment is similar to the previous embodiment, and the main difference is that the flexible substrate 520 of the present embodiment includes a joint portion 522 and a first extension portion 524 and a second extension portion 526 that are connected to opposite sides of the joint portion 522. Here, the first extension portion 524 and the second extension portion 526 are symmetrically disposed on opposite sides of the joint portion 522, for example. After the component 510 is disposed in the placement area 110 by the flexible substrate 520, the first extension 524 and the second extension 526 extending beyond the placement area 110 may be selected to be bent as described in the foregoing embodiments. And fixed to the surface of the housing 100. Of course, the first extension portion 524 and the second extension portion 526 may also have a weakened structure 280 similar to the foregoing embodiment and a design of the holding hole 290 (as shown in FIG. 2) to achieve a similar technical effect. Repeat one by one.

In addition, since the flexible substrate 520 of the present embodiment has the first extending portion 524 and the second extending portion 526 disposed symmetrically, it is only necessary to simultaneously apply the first extending portion 524 and the second extending portion 526 when the component 510 is detached. The pulling force can bring the joint 522 out of the placement area 110 together with the component 510 thereon.

The disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any one of ordinary skill in the art without departing from the disclosure. In the spirit and scope, when a little change and refinement can be made, the scope of protection disclosed herein is subject to the definition of the scope of the patent application.

100‧‧‧shell

102‧‧‧through holes

110‧‧‧Placement area

112‧‧‧ dent

112a‧‧‧ bearing surface

200‧‧‧Component Module

210‧‧‧ components

220‧‧‧Flexible substrate

222‧‧‧ joints

222a‧‧‧ first surface

222b‧‧‧ second surface

224‧‧‧Extension

280‧‧‧Weakened structure

290‧‧‧ holding hole

Claims (20)

An electronic device comprising: a housing having a placement area; an element disposed in the placement area; and a flexible substrate comprising: a joint between the element and a bearing surface of the placement area, and The joint has a first surface and a second surface opposite the first surface, wherein the first surface is joined to the element and the second surface is joined to the bearing surface; and an extension connecting the joint and extending to Outside the placement area. The electronic device of claim 1, wherein the housing has a recess in the placement area, and the component is disposed on the bearing surface of the bottom of the recess. The electronic device of claim 2, wherein the extension extends beyond the recess by a gap between the element and the inner wall of the recess. The electronic device of claim 3, wherein the extension through the gap is bent to extend beyond the recess. The electronic device of claim 4, wherein the flexible substrate has a weakened structure at a bend of the extension. The electronic device of claim 5, wherein the weakened structure comprises a hole extending through the extension. The electronic device of claim 1, wherein the flexible substrate has a holding hole extending through an end of the extension. The electronic device of claim 1, wherein an end of the extension is fixed to the surface of the housing. The electronic device of claim 1, wherein the extension comprises a first extension and a second extension on opposite sides of the joint. The electronic device of claim 1, wherein the joint is annular and joined to the element. The electronic device of claim 1, further comprising a first adhesive layer disposed between the first surface of the joint and the component. The electronic device of claim 1, further comprising a second adhesive layer disposed between the second surface of the joint and the bearing surface. The electronic device of claim 1, wherein the housing has a plurality of through holes in the placement area for communicating the inner and outer spaces of the housing, and the component comprises a sound output element. An element module is disposed on a casing of an electronic device, the casing has a placement area, the component module includes: an element disposed in the placement area; and a flexible substrate, including: a joint portion, Having a first surface and a second surface opposite the first surface, wherein the first surface is joined to the element and the second surface is joined to a bearing surface of the placement area; and an extension is coupled to the joint and Extend outward. The component module of claim 14, wherein the flexible substrate has a bend at the extension and a weakened structure at the bend. The component module of claim 15, wherein the weakened structure comprises a hole extending through the extension. The component module of claim 14, wherein the flexible substrate has a holding hole extending through an end of the extension. The component module of claim 14, wherein the extension comprises a first extension and a second extension on opposite sides of the joint. The component module of claim 14, wherein the joint is annular and joined to the component. The component module of claim 14, further comprising a first adhesive layer disposed between the first surface of the joint and the component.