TWI652000B - Waterproof case - Google Patents
Waterproof case Download PDFInfo
- Publication number
- TWI652000B TWI652000B TW106125354A TW106125354A TWI652000B TW I652000 B TWI652000 B TW I652000B TW 106125354 A TW106125354 A TW 106125354A TW 106125354 A TW106125354 A TW 106125354A TW I652000 B TWI652000 B TW I652000B
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- Prior art keywords
- waterproof
- buffer
- groove
- glue
- waterproof rubber
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
一種防水外殼包含有一防水膠溝槽以及一防水膠緩衝溝槽。防水膠緩衝溝槽設置於防水膠溝槽之中,以容置一防水膠的一起點與一終點。防水膠緩衝溝槽包含有一緩衝底面、一第一緩衝面以及一第二緩衝面,且緩衝底面設置於第一緩衝面以及第二緩衝面之間。A waterproof shell includes a waterproof rubber groove and a waterproof rubber buffer groove. The waterproof rubber buffer groove is arranged in the waterproof rubber groove to accommodate a point and an end point of a waterproof rubber. The waterproof rubber buffer groove includes a buffer bottom surface, a first buffer surface and a second buffer surface, and the buffer bottom surface is disposed between the first buffer surface and the second buffer surface.
Description
本發明係有關於一種電子產品外殼,特別是有關於一種防水的電子產品外殼。The invention relates to an electronic product shell, and particularly to a waterproof electronic product shell.
近年來,由於電子、資訊工業的迅速發展,其相關之產品亦日益精密。就目前個人電腦領域觀之,除了尋求更高速、運算能力更強之計算功能之運算單元和各式各樣週邊設備之配合來滿足使用者需求外,針對輕薄之可攜式電子設備亦為業界發展之重點領域。In recent years, due to the rapid development of the electronics and information industries, their related products have become increasingly sophisticated. From the perspective of the current personal computer field, in addition to seeking a higher-speed, more powerful computing function computing unit and a variety of peripheral devices to meet user needs, in addition to thin and light portable electronic devices for the industry Focus areas for development.
現今的可攜式電子設備,不論是平板電腦或者是行動電話等電子設備,更具有輕薄的特性,目前也廣泛的使用於個人或者是商用的市場。Today's portable electronic equipment, whether it is a tablet computer or an electronic device such as a mobile phone, has more thin and light features, and is currently widely used in the personal or commercial market.
一般而言,可攜式電子設備除了運算性能與顯示能力上的提升,在其他輔助的功能上,亦日新月異。例如,為了增加可攜式電子設備的防水能力,各家廠商無不竭盡所能的增加可攜式電子設備的防水功能。如何能夠提供一種防水能力強,且具有高度可靠性的防水外殼,將有助於可攜式電子設備的防水能力的提升。In general, in addition to the improvement of computing performance and display capabilities of portable electronic devices, other auxiliary functions are also changing with each passing day. For example, in order to increase the waterproof capability of portable electronic devices, various manufacturers have endeavored to increase the waterproof function of portable electronic devices. How to provide a waterproof shell with high waterproof capability and high reliability will help to improve the waterproof capability of portable electronic equipment.
有鑒於此,本發明揭露一種防水外殼,可以有效地增加電子產品外殼的防水性能,且簡化防水膠條的安裝流程。In view of this, the present invention discloses a waterproof shell, which can effectively increase the waterproof performance of the shell of electronic products and simplify the installation process of the waterproof rubber strip.
根據本發明之一實施例,本發明係揭露一種防水外殼包含有一防水膠溝槽以及一防水膠緩衝溝槽。防水膠緩衝溝槽設置於防水膠溝槽之中,以容置一防水膠的一起點與一終點。According to an embodiment of the present invention, the present invention discloses that a waterproof casing includes a waterproof rubber groove and a waterproof rubber buffer groove. The waterproof rubber buffer groove is arranged in the waterproof rubber groove to accommodate a point and an end point of a waterproof rubber.
防水外殼包含有一邊框,而防水膠溝槽一般係環形設置於邊框之上。The waterproof shell includes a frame, and the waterproof rubber groove is generally arranged on the frame in a ring shape.
防水膠緩衝溝槽則包含有一緩衝底面、一第一緩衝面以及一第二緩衝面,且緩衝底面設置於第一緩衝面以及第二緩衝面之間。The waterproof rubber buffer groove includes a buffer bottom surface, a first buffer surface and a second buffer surface, and the buffer bottom surface is disposed between the first buffer surface and the second buffer surface.
在一實施例中,第一緩衝面與第二緩衝面係由斜面所形成。In one embodiment, the first buffer surface and the second buffer surface are formed by inclined surfaces.
在一實施例中,第一緩衝面與第二緩衝面係由弧面所形成。In one embodiment, the first buffer surface and the second buffer surface are formed by curved surfaces.
在一實施例中,防水膠溝槽包含有一溝槽底面以及二溝槽側壁形成於溝槽底面的兩側,且緩衝底面的深度大於溝槽底面的深度。In one embodiment, the waterproof rubber groove includes a groove bottom surface and two groove side walls formed on both sides of the groove bottom surface, and the depth of the buffer bottom surface is greater than the depth of the groove bottom surface.
在一實施例中,防水膠包含有矽膠,然並不限定於此。In one embodiment, the waterproof glue includes silicon glue, but it is not limited thereto.
在一實施例中,防水膠的終點形成一防水膠重疊部,與防水膠的起點重疊於防水膠緩衝溝槽之上。In one embodiment, an end portion of the waterproof glue forms a waterproof glue overlapping portion, and the starting point of the waterproof glue overlaps the waterproof glue buffer groove.
在一實施例中,防水膠係利用一點膠機沿著防水膠溝槽所形成。In one embodiment, the waterproof glue is formed along a groove of the waterproof glue by a glue dispenser.
綜上所述,本發明之防水外殼可以利用防水膠緩衝溝槽容置防水膠的起點與終點所形成之防水膠重疊部,更可以使防水膠重疊部不會過於高出其他部分的防水膠,以使電子裝置背蓋與邊框更為密合,有效地增強電子裝置外殼的防水能力,進而提升電子裝置的防水性能。In summary, the waterproof shell of the present invention can use the waterproof rubber buffer groove to accommodate the waterproof rubber overlapping portion formed by the starting point and the ending point of the waterproof rubber, and the waterproof rubber overlapping portion can not be too high above the waterproof glue of other parts. In order to make the back cover of the electronic device closer to the frame, the waterproof ability of the electronic device shell is effectively enhanced, and the waterproof performance of the electronic device is improved.
下文係舉實施例配合所附圖式進行詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖式僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following is a detailed description with examples and the accompanying drawings, but the examples provided are not intended to limit the scope covered by this disclosure, and the description of the structure operation is not used to limit the order of its implementation. Any combination of components The structure and the devices with the same effect are all the scope covered by this disclosure. In addition, the drawings are for illustrative purposes only, and are not drawn to the original dimensions. In order to facilitate understanding, the same elements or similar elements in the following description will be described with the same symbols.
另外,在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本揭露之描述上額外的引導。In addition, the terms used throughout the specification and the scope of patent applications, unless otherwise specified, usually have the ordinary meaning of each term used in this field, in the content disclosed here, and in special content. . Certain terms used to describe this disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of this disclosure.
於實施方式與申請專利範圍中,除非內文中對於冠詞有所特別限定,否則『一』與『該』可泛指單一個或複數個。而步驟中所使用之編號僅係用來標示步驟以便於說明,而非用來限制前後順序及實施方式。In the embodiments and the scope of patent application, unless there is a special limitation on the article in the text, "a" and "the" can refer to a single or plural. The numbers used in the steps are only used to indicate the steps for ease of description, but not to limit the order and implementation.
其次,在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。Secondly, the terms "including", "including", "having", "containing" and the like used in this article are all open-ended terms, which means including but not limited to.
參閱第1圖至第3圖,第1圖係揭露本發明一實施例所繪示的一種防水外殼的示意圖。而第2圖則是揭露依照本發明一實施例所繪示的一種防水外殼之部分側視示意圖。第3圖揭露依照本發明一實施例所繪示的一種防水外殼之防水膠緩衝溝槽之局部放大示意圖。Referring to FIG. 1 to FIG. 3, FIG. 1 is a schematic diagram of a waterproof casing according to an embodiment of the present invention. FIG. 2 is a schematic side view of a part of a waterproof casing according to an embodiment of the present invention. FIG. 3 discloses a partially enlarged schematic diagram of a waterproof rubber buffer groove of a waterproof shell according to an embodiment of the present invention.
如圖所示,本發明係揭露一種防水外殼100包含有一防水膠溝槽130以及一防水膠緩衝溝槽140。防水膠緩衝溝槽140設置於防水膠溝槽130之中,以容置一防水膠110的一防水膠起點112與終點所形成的一防水膠重疊部114。As shown in the figure, the present invention discloses that a waterproof casing 100 includes a waterproof rubber groove 130 and a waterproof rubber buffer groove 140. The waterproof rubber buffer groove 140 is disposed in the waterproof rubber groove 130 to accommodate a waterproof rubber overlapping portion 114 formed by a waterproof rubber starting point 112 and an ending point of a waterproof rubber 110.
換言之,當利用點膠機由一電子裝置的邊框120上沿著環形設置於邊框120之上防水膠溝槽130,點膠機環狀擠出防水膠110,以在防水膠溝槽130中形成所需的防水膠條。由於防水膠緩衝溝槽140的設置,防水膠起點112可容置於防水膠緩衝溝槽140之中,以有效改善防水膠110末端所形成的防水膠重疊部114過於凸出,以致於造成防水性能降低的問題。In other words, when a glue dispenser is used to form a waterproof glue groove 130 on a frame 120 of an electronic device along the ring shape along the ring 120, the glue machine extrudes the waterproof glue 110 in a ring shape to form the waterproof glue groove 130. Required waterproof tape. Due to the setting of the waterproof rubber buffer groove 140, the waterproof rubber starting point 112 can be accommodated in the waterproof rubber buffer groove 140, so as to effectively improve the waterproof rubber overlapping portion 114 formed at the end of the waterproof rubber 110, which is too convex, which results in waterproof Degraded performance.
在一實施例中,防水膠緩衝溝槽140更包含有一緩衝底面142、一第一緩衝面144以及一第二緩衝面146。緩衝底面142設置於第一緩衝面144以及第二緩衝面146之間,以構成一梯形的凹槽。In one embodiment, the waterproof rubber buffer groove 140 further includes a buffer bottom surface 142, a first buffer surface 144 and a second buffer surface 146. The buffer bottom surface 142 is disposed between the first buffer surface 144 and the second buffer surface 146 to form a trapezoidal groove.
在一實施例中,第一緩衝面144與第二緩衝面146可以是由斜面所形成。In one embodiment, the first buffer surface 144 and the second buffer surface 146 may be formed by inclined surfaces.
在一實施例中,第一緩衝面144與第二緩衝面146可以是由弧面所形成。In one embodiment, the first buffer surface 144 and the second buffer surface 146 may be formed by curved surfaces.
此外,在一實施例中,防水膠溝槽130則包含有一溝槽底面132以及二溝槽側壁134形成於溝槽底面132的兩側。其中,本發明之防水膠緩衝溝槽140的緩衝底面142深度H2大於防水膠溝槽130的溝槽底面132深度H1,以便於容置防水膠起點112與防水膠重疊部114於其中。In addition, in one embodiment, the waterproof rubber groove 130 includes a groove bottom surface 132 and two groove side walls 134 formed on both sides of the groove bottom surface 132. Among them, the depth H2 of the buffer bottom surface 142 of the waterproof rubber buffer groove 140 of the present invention is greater than the depth H1 of the bottom 132 of the waterproof rubber groove 130 so as to accommodate the waterproof rubber starting point 112 and the waterproof rubber overlapping portion 114 therein.
在一實施例中,防水膠110包含矽膠,然並不限定於此。In one embodiment, the waterproof adhesive 110 includes silicon rubber, but it is not limited thereto.
因此,本發明之防水外殼,可以利用防水膠緩衝溝槽容置防水膠的起點與終點,更可以使防水膠重疊部不會過於高出其他部分的防水膠,以使電子裝置背蓋可與邊框更為密合,有效地增強電子裝置外殼的防水能力,進而提升電子裝置的防水性能。Therefore, the waterproof shell of the present invention can use the waterproof rubber buffer groove to contain the starting point and the ending point of the waterproof glue, and the overlapping portion of the waterproof glue can not be too high than the waterproof glue of other parts, so that the electronic device back cover can be used with The frame is more tightly closed, which effectively enhances the waterproof ability of the electronic device casing, thereby improving the waterproof performance of the electronic device.
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed as above in the form of implementation, it is not intended to limit this disclosure. Any person with ordinary knowledge in the field can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure The scope of protection shall be determined by the scope of the attached patent application.
100‧‧‧防水外殼100‧‧‧Waterproof case
110‧‧‧防水膠 110‧‧‧Waterproof adhesive
112‧‧‧防水膠起點 112‧‧‧ Waterproof Adhesive
114‧‧‧防水膠重疊部 114‧‧‧ Waterproof glue overlap
120‧‧‧邊框 120‧‧‧ border
130‧‧‧防水膠溝槽 130‧‧‧Waterproof rubber groove
132‧‧‧溝槽底面 132‧‧‧Trench bottom surface
134‧‧‧溝槽側壁 134‧‧‧Trench sidewall
140‧‧‧防水膠緩衝溝槽 140‧‧‧Waterproof rubber buffer groove
142‧‧‧緩衝底面 142‧‧‧ buffer bottom
144‧‧‧第一緩衝面 144‧‧‧The first buffer surface
146‧‧‧第二緩衝面 146‧‧‧Second buffer surface
H1‧‧‧深度 H1‧‧‧ Depth
H2‧‧‧深度 H2‧‧‧ Depth
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖是依照本發明一實施例所繪示的一種防水外殼的示意圖。 第2圖是依照本發明一實施例所繪示的一種防水外殼之部分側視示意圖。 第3圖是依照本發明一實施例所繪示的一種防水外殼之防水膠緩衝溝槽之局部放大示意圖。In order to make the above and other objects, features, advantages, and embodiments of the present disclosure more comprehensible, the description of the drawings is as follows: FIG. 1 is a schematic diagram of a waterproof shell according to an embodiment of the present invention. FIG. 2 is a schematic partial side view of a waterproof shell according to an embodiment of the present invention. FIG. 3 is a partially enlarged schematic diagram of a waterproof rubber buffer groove of a waterproof shell according to an embodiment of the present invention.
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW106125354A TWI652000B (en) | 2017-07-27 | 2017-07-27 | Waterproof case |
CN201710830942.6A CN109310024A (en) | 2017-07-27 | 2017-09-15 | Waterproof case |
Applications Claiming Priority (1)
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TW106125354A TWI652000B (en) | 2017-07-27 | 2017-07-27 | Waterproof case |
Publications (2)
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TWI652000B true TWI652000B (en) | 2019-02-21 |
TW201911996A TW201911996A (en) | 2019-03-16 |
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TW106125354A TWI652000B (en) | 2017-07-27 | 2017-07-27 | Waterproof case |
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CN (1) | CN109310024A (en) |
TW (1) | TWI652000B (en) |
Citations (2)
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TWM467103U (en) * | 2013-08-01 | 2013-12-01 | Asian Power Devices Inc | Power supply housing with waterproof structure |
TWI574601B (en) * | 2013-02-28 | 2017-03-11 | 富士通股份有限公司 | Waterproofing case and method of manufacturing waterproofing case |
Family Cites Families (4)
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CN205005393U (en) * | 2015-08-31 | 2016-01-27 | 广东欧珀移动通信有限公司 | Terminal protecgulum subassembly and mobile terminal |
CN105263281B (en) * | 2015-08-31 | 2018-05-29 | 广东欧珀移动通信有限公司 | Housing unit and mobile terminal |
CN105120623B (en) * | 2015-08-31 | 2017-11-07 | 广东欧珀移动通信有限公司 | Terminal front cover component and mobile terminal |
CN107580090B (en) * | 2015-08-31 | 2020-01-14 | Oppo广东移动通信有限公司 | Terminal front cover assembly and terminal |
-
2017
- 2017-07-27 TW TW106125354A patent/TWI652000B/en active
- 2017-09-15 CN CN201710830942.6A patent/CN109310024A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI574601B (en) * | 2013-02-28 | 2017-03-11 | 富士通股份有限公司 | Waterproofing case and method of manufacturing waterproofing case |
TWM467103U (en) * | 2013-08-01 | 2013-12-01 | Asian Power Devices Inc | Power supply housing with waterproof structure |
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TW201911996A (en) | 2019-03-16 |
CN109310024A (en) | 2019-02-05 |
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