TWI551438B - Laminate composed of a resin and a metal layer made of a plate-shaped carrier - Google Patents

Description

Laminated body composed of a resin plate-shaped carrier and a metal layer

The present invention relates to a laminate comprising a laminate in which metal layers are detachably contacted with each other. More specifically, the present invention relates to a laminate for use in the production of a single-sided or two-layer multilayer laminate or an ultra-thin coreless substrate used in a printed wiring board.

In general, a printed wiring board is a dielectric material called a "prepreg". The dielectric material called "prepreg" is a synthetic resin board. A substrate such as a glass plate, a glass non-woven fabric, or paper is obtained by impregnating a synthetic resin. Further, a sheet such as a conductive copper or copper alloy foil is bonded to the side opposite to the prepreg. The laminate thus assembled is generally referred to as a CCL (Copper Clad Laminate) material. In order to increase the joint strength, the surface of the copper foil which is in contact with the prepreg is usually made into a rough surface. There is also a case where a foil of aluminum, nickel, zinc or the like is used instead of copper or a copper alloy foil. These foils have a thickness of about 5 to 200 μm. This commonly used CCL (Copper Clad Laminate) material is shown in Fig. 1.

Patent Document 1 proposes a metal foil comprising a plate-shaped carrier made of synthetic resin and a metal foil which is mechanically peelably adhered to at least one surface of the carrier, and it is described that the metal foil of the carrier can be supplied The purpose of assembling a printed wiring board. Further, it is disclosed that the peel strength of the plate-shaped carrier and the metal foil is desirably 1 gf/cm to 1 kgf/cm. According to the metal of the carrier The foil supports the entire surface of the copper foil with synthetic resin, so that wrinkles of the copper foil during the lamination process can be prevented. Further, since the metal foil with the carrier is in close contact with the synthetic resin without a gap, when the surface of the metal foil is plated or etched, it can be put into a chemical liquid for plating or etching. Further, since the linear expansion coefficient of the synthetic resin is equivalent to the copper foil as the substrate constituent material and the prepreg after the polymerization, the positional deviation of the circuit is not caused, so that it is possible to reduce the occurrence of defective products and improve the yield. Excellent results.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-272589

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-196207

The metal foil with a carrier described in the patent document 1 is an epoch-making invention that contributes greatly to the reduction of the manufacturing cost by simplifying the manufacturing steps of the printed wiring board and improving the yield. However, the laminate of the plate-shaped carrier and the metal foil is laminated. Methods and so on still leave room for research. In particular, the conventional metal foil with a carrier is in contact with another member at the time of conveyance or processing (in operation), or the chemical liquid penetrates into the interface between the metal layers in contact with each other. The metal layer is peeled off and becomes defective, and improvement is expected. Accordingly, an object of the present invention is to provide a laminated body which is intended to prevent peeling of metal layers from each other during operation.

The inventors of the present invention have conducted an effort to study the structure of a laminate obtained by laminating metal layers, and as a result, it has been found that at least a part of the outer periphery of the laminated portion is covered with a resin when the metal layer is viewed from above, it is possible to prevent the metal layers from colliding with each other and colliding with each other. Other components cause the metal layers to separate from each other, or the chemical solution penetrates into the interface between the two to cause corrosion or erosion of the metal layer, thereby The present invention has been completed.

That is, the present invention is as follows.

(1) A laminated body in which a metal layer is placed in contact with each other, and at least a part of the outer periphery of the laminated portion is covered with a resin when the metal layer is viewed in plan.

(2) A laminated body in which a metal layer is formed in a separable contact with each other, and at least a part of the outer periphery of the laminated portion is covered with a resin when the metal layer is viewed in plan.

(3) A laminate in which a metal layer is bonded to each other, and at least a part of the outer periphery of the laminate portion is covered with a resin when the metal layer is viewed in plan.

(4) The laminated body according to any one of (1) to (3), wherein the entire outer periphery of the laminated portion is covered with a resin when the metal layer is viewed from above.

(5) The laminate according to any one of (1) to (3), wherein the metal layer is exposed when the surface of at least one of the metal layers is viewed from above.

(6) The laminate according to any one of (1) to (3), wherein the metal layer is bonded to each other by using a release layer.

The laminate according to any one of (1) to (3), wherein the metal layer has a peel strength of 0.5 gf/cm or more and 200 gf/cm or less.

(8) The laminate of any one of (1) to (3), wherein a ten-point average roughness (Rz jis) of the contact surface of the metal layer with the other metal layer is 3.5 μm or less.

(9) The laminate according to any one of (1) to (3) wherein the peeling strength of the metal layer to the metal sheet is 0.5 after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours. Gf/cm or more and 200 gf/cm or less.

(10) The laminate according to any one of (1) to (3) wherein the resin contains thermosetting property Resin.

The laminate according to any one of (1) to (3), wherein the resin contains a thermoplastic resin.

The laminated body according to any one of (1) to (3) wherein the resin is provided with a hole on the outer side of the metal layer.

(13) The laminate according to (12), wherein the hole has a diameter of 0.01 mm to 10 mm, and is provided at 1 to 10.

(14) The laminate of any one of (1) to (3), wherein the laminate has pores.

(15) The laminate according to (14), wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10.

The laminate according to any one of (1) to (3), wherein the at least one metal layer is composed of copper or a copper alloy.

(17) A laminate comprising the laminate defined in any one of (1) to (13), provided with a pore.

(18) The laminate according to (17), wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10.

(19) A laminate having the laminate of (17) or (18).

(20) A laminate having two or more selected from the group consisting of the laminates defined in any one of (1) to (13) and the laminates of (17) or (18).

(21) A laminate comprising a plate-like resin and a laminate which is laminated on both surfaces of the plate-like resin so that the metal layers are detachably contactable with each other, and at least a portion of the outer periphery of the laminate portion when the metal layer is viewed in plan Covered with resin.

(22) The laminate according to (21), wherein the entire outer periphery of the laminated portion is covered with a resin when the metal layer is viewed in plan.

(23) The laminate according to (21), wherein the plate-like resin is formed integrally with the resin.

(24) The laminate according to (22), wherein the plate-shaped resin is formed integrally with the resin.

(25) The laminate according to (21), wherein the plate-like resin and the resin are formed into different members.

(26) The laminate according to (22), wherein the plate-shaped resin and the resin are formed into different members.

(27) The laminate according to any one of (21) to (26), wherein the metal layer is bonded to each other using a release layer.

The laminate according to any one of (21) to (26), wherein the metal layer has a peel strength of 0.5 gf/cm or more and 200 gf/cm or less.

The laminated body according to any one of (21) to (26), wherein the ten-point average roughness (Rz jis) of the metal layer on the side surface of the contact with the other metal layer is 3.5 μm or less.

(30) The laminate according to any one of (21) to (26) wherein the peeling strength of the metal layer to the metal sheet is 0.5 after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours. Gf/cm or more and 200 gf/cm or less.

The laminate according to any one of (21) to (26), wherein the resin contains a thermosetting resin.

The laminate according to any one of (21) to (26), wherein the resin contains a thermoplastic resin.

(33) The laminate according to any one of (21) to (26) wherein the resin is in the metal layer The outside is provided with a hole.

(34) The laminate according to (33), wherein the hole has a diameter of 0.01 mm to 10 mm and is provided at 1 to 10.

The laminate according to any one of (21) to (26), wherein the at least one metal layer is composed of copper or a copper alloy.

(36) A metal layer with a carrier obtained by cutting a layer of any one of (1) to (16) and (19) to (35) on a layer of the metal layer when the surface of the metal layer is viewed from above .

(37) A method of producing a multilayer metal-clad laminate comprising the step of: facing a surface of at least one metal layer of the laminate of any one of (1) to (16) and (19) to (35) The resin or metal layer is laminated one or more times.

(38) A method of producing a multilayer metal-clad laminate comprising the step of: facing a surface direction of at least one metal layer of the laminate of any one of (1) to (16) and (19) to (35), A resin, a single-sided or double-sided metal-clad laminate, a laminate of any one of (1) to (16) and (19) to (35), and a laminate defined by any one of (1) to (13) The laminate of (17) or (18), the metal layer of the carrier (36), the metal layer of the resin-attached substrate, or the metal layer is formed one or more times.

(39) A method of producing a multilayer metal-clad laminate according to (37) or (38), comprising the step of cutting the laminate at least one side of a layer of the metal layers when the surface of the metal layer is viewed from above.

(40) The method for producing a multilayer metal-clad laminate according to (39), further comprising the step of separating the metal layers of the laminated body after cutting and separating them.

(41) The method for producing a multilayer metal-clad laminate according to (39), further comprising the step of separating the metal layers of the laminated body after cutting and separating them.

(42) A method of producing a multilayer metal-clad laminate according to (40), comprising the step of partially or completely removing one of the metal layers separated by peeling by etching.

(43) A method of producing a multilayer metal-clad laminate according to (41), comprising the step of partially or completely removing one of the metal layers separated by peeling by etching.

(44) A multilayer metal-clad laminate obtained by the production method of (37) to (42).

(45) A method of manufacturing a buildup substrate, comprising the step of: facing a face of at least one metal layer of the laminate of any one of (1) to (16) and (19) to (35) Forming one or more build-up wiring layers.

(46) The method for producing a build-up substrate according to (45), wherein the build-up wiring layer is formed by at least one of a subtractive method, a full addition method, or a semi-additive method.

(47) A method of producing a build-up substrate comprising the steps of: resin in a direction of a surface of at least one metal layer of the laminate of any one of (1) to (16) and (19) to (35) , a single-sided or two-sided wiring substrate, a single-sided or two-sided metal-clad laminate, the laminated body of any one of (1) to (16) and (19) to (35), and any one of (1) to (13) The laminate as defined in the item, the laminate of (17) or (18), the metal layer of the carrier (36), the metal layer of the resin-attached substrate, the wiring, the circuit, or the metal laminate are once or more.

(48) The method for producing a build-up substrate according to (47), further comprising the steps of: a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a metal layer of a laminate, a resin of a laminate, and a metal a layer, a resin of a metal layer with a carrier, a metal layer of a metal layer with a carrier, a resin of a metal layer with a resin substrate, a metal layer of a metal layer with a resin substrate, or a resin, and a side surface of the hole and Conductive plating is performed on the bottom surface.

(49) The method for producing a build-up substrate according to (47), which further comprises the step of performing the following steps: a metal layer constituting the single-sided or double-sided wiring substrate, and a single-sided or double-sided metal-clad laminate At least one of the metal layer, the metal layer constituting the laminate, the metal layer constituting the metal layer with the carrier, the metal layer of the metal layer to which the resin substrate is attached, and the metal layer form wiring.

(50) The method for producing a build-up substrate according to (48), which further comprises the step of performing the following steps: a metal layer constituting the single-sided or double-sided wiring substrate, and a metal constituting the one-sided or double-sided metal-clad laminate At least one of the layer and the metal layer constituting the laminate, the metal layer constituting the metal layer with the carrier, the metal layer of the metal layer to which the resin substrate is attached, and the metal layer form wiring.

(51) The method for producing a build-up wiring board according to any one of (47) to (50), further comprising the step of: stacking the patent claims 1 to 16 and 19 to the surface after the wiring is formed A laminate of any of the 35 items, or a metal layer of the carrier of claim 36.

The method of manufacturing a build-up wiring board according to any one of (45) to (50), comprising the step of: cutting the laminated body on at least one side of a layer of the metal layers when the surface of the metal layer is viewed from above .

(53) A method of producing a build-up wiring board, which further comprises the step of: laminating the metal layer of the metal layer of the carrier with the carrier in the method of manufacturing the build-up substrate according to any one of (45) to (50) The layers are separated from each other and separated.

(54) The method for producing a build-up wiring board according to (53), which further comprises the step of removing part or all of the metal layer separated by peeling by etching.

(55) The method of producing a build-up wiring board according to (54), which further comprises the step of removing part or all of the metal layer separated by peeling by etching.

(56) A method of manufacturing a build-up wiring board, the method of manufacturing the build-up substrate of (52) Further, the method further includes the step of separating the metal layers of the laminated body after cutting and separating them.

(57) A build-up wiring board obtained by the production method of any one of (53) to (56).

(58) A method of manufacturing a printed circuit board, comprising the steps of: manufacturing a build-up wiring board by the manufacturing method according to any one of (53) to (56).

According to the present invention, it is possible to make it difficult for the laminated body obtained by the overlapping metal layers to peel off from each other due to the state at the time of conveyance or processing. Therefore, the operability of the laminated body is improved, and the productivity of the printed wiring board using the laminated body is improved.

10‧‧‧Laminated metal mold

11‧‧‧Metal layer with carrier

11a‧‧‧metal layer

11b‧‧‧metal layer

11c‧‧‧Resin

12‧‧‧Prepreg

13‧‧‧ Inner core

Page 14‧‧‧

15‧‧ ‧

16‧‧‧Additional

20‧‧‧Layered body

21‧‧‧Resin

22, 23‧‧‧ metal layer

24‧‧‧ release layer

30‧‧‧Layered body

31‧‧‧Resin

32, 33‧‧‧ metal layer

40‧‧‧Layered body

41‧‧‧Resin

42, 43‧‧‧ metal layer

50‧‧‧Layered body

51‧‧‧Resin

52‧‧‧ openings

60‧‧ ‧ laminated body

61‧‧‧Resin

62‧‧‧ openings

Fig. 1 shows a configuration example of a CCL.

Fig. 2 shows a typical configuration example when the laminate of the present invention is laid down.

Fig. 3 is a cross-sectional view taken along line A-A' of the configuration example of Fig. 2;

Fig. 4 shows another typical configuration example of the laminated body of the present invention.

Fig. 5 is a view showing another typical configuration example of the laminated body of the present invention, and shows a cross-sectional view taken along line A-A' of the configuration example of Fig. 4.

Fig. 6 shows another typical configuration example of the laminated body of the present invention.

Fig. 7 shows another typical configuration example of the laminated body of the present invention.

Fig. 8 shows an example of assembly of a multilayer CCL using a copper foil with a carrier of the present invention (a form in which a copper foil is bonded to one surface of a resin sheet).

Fig. 9 is a view showing a copper foil with a carrier of the present invention (a copper foil is bonded to both sides of a resin sheet) The form of the multilayer CCL assembly.

Fig. 10 is a view showing the configuration of an embodiment of the present invention.

Fig. 11 is a view showing the configuration of another embodiment of the present invention.

Fig. 12 is a view showing the configuration of another embodiment of the present invention.

Fig. 13 is a view showing the configuration of another embodiment of the present invention.

Fig. 14 is a view showing the configuration of another embodiment of the present invention.

Fig. 15 is a view showing the configuration of another embodiment of the present invention.

Fig. 16 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 17 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 18 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 19 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

Fig. 20 is a schematic view showing an example of assembly of a multilayer CCL using the laminated body of the present invention.

In one embodiment of the laminate according to the present invention, the laminate is formed by laminating at least a part of the outer periphery of the laminate portion when the metal layer is viewed in a laminate in which the metal layers are detachably contacted.

When the metal layers which are in contact with each other in the embodiment of the laminated body used in the present invention have adhesion to each other, they are separated, that is, peeled off, so that the adhesion is too high, which is a problem, but it is preferably provided on the printed circuit board. The degree of adhesion of the peeling does not occur in the chemical liquid processing step such as plating in the production process. From such a viewpoint, the peel strength between the metal layers is preferably 0.5 gf/cm or more, preferably 1 gf/cm or more, preferably 2 gf/cm or more. Preferably, it is 3 gf/cm or more, preferably 5 gf/cm or more, preferably 10 gf/cm or more, more preferably 30 gf/cm or more, further preferably 50 gf/cm or more, and on the other hand, preferably 200 gf/cm. Hereinafter, it is more preferably 150 gf/cm or less, further preferably 80 gf/cm or less. When the metal layers are in close contact with each other, the peeling strength between the metal layers is set to such a range, and peeling does not occur at the time of conveyance or processing, and can be easily peeled off by hand.

The adjustment of the peel strength for achieving such adhesion can be easily achieved by subjecting the surface of any of the metal layers to a predetermined surface treatment as described below.

Here, the metal layer with a carrier is, for example, a laminate 20 shown in FIGS. 2 and 3 along with a resin 21 - a metal layer (metal carrier) 22 - a release layer 24 - a metal layer (metal foil) 23 - a resin 21 The surface of the laminated structure is obtained by cutting the cutting line B. Alternatively, as shown below, when the surface of the metal layer is viewed in plan, the metal layer is cut at the level of the layers. It is also possible to form a wiring layer, a resin, a buildup layer, or the like on the laminated body, and then cut the metal layer at the predetermined position and separate the metal layers from each other, thereby forming the outermost surface of the multilayer metallized laminate or the buildup substrate. The state of the metal layer is exposed.

By providing the exposed metal layer to the circuit, the manufacturing cost reduction effect can be maintained by the simplification of the manufacturing steps of the printed circuit board and the improvement of the yield, and the productivity can be improved.

The laminated body 20 has a configuration in which at least a part of the outer periphery of the laminated portion is covered with a resin when the metal layers 22 and 23 are viewed from above, and covers the entire metal layer. The laminated portion of the metal layers covered with the resin is preferably set to be the entire peripheral portion of the laminated portion of the metal layers (that is, in the laminate formed by detachably contacting the metal layers with each other, the metal layer is viewed from above) The portion of the entire outer perimeter of the layered portion.

That is, as a preferred embodiment, the following three aspects can be considered: Form 1 , when the surface of the metal layer is viewed from above, the resin covers the entire metal layer and covers the entire outer periphery of the laminated portion of the metal layers ( FIGS. 2 and 3 ); In the form 2, the resin covers the entire surface of the metal layer, and covers a part of the outer periphery of one of the laminated portions of the metal layers (for example, FIG. 4); and in the form 3, the resin covers the metal layers with each other in a manner of having an opening in a plan view of the surface of the metal layer. The outer layer of the laminated portion is exposed, and a metal layer (for example, FIG. 6, FIG. 7, FIG. 10, FIG. 11) or the like is exposed in the opening.

2 and 3 show a typical configuration example of the laminated body. Fig. 2 is a plan view showing a configuration example, and Fig. 3 is a view showing a cross section taken along line A-A' of the configuration example.

In Figs. 2 and 3, the metal layer (metal carrier) 22 is in contact with the metal layer (metal foil) 23 via the release layer 24, and the resin 21 covers the entire metal layer 22, 23 while covering the entire periphery of the layer of the metal layers. Thereby, the laminated body 20 is constructed.

With such a configuration, when the surface of the metal layer is viewed from above, the laminated portions of the metal layers are covered with the resin, and it is possible to prevent the other members from colliding from the side direction of the portion, that is, in the lateral direction with respect to the lamination direction. As a result, the peeling of the metal layers in operation can be reduced. Further, by covering the outer periphery of the laminated portion of the metal layers, it is possible to prevent the chemical solution from penetrating into the interface in the chemical chemical treatment step as described above, and it is possible to prevent corrosion or erosion of the metal layer.

Further, as another typical configuration example of the present invention, as shown in FIG. 4, a part of the laminated portion of the metal layers in plan view may be exposed. That is, in Fig. 4, although the metal layer 32 is not covered by the resin 31 in the lateral direction, the metal layers are not separated from each other. From this point of view, the same effect can be obtained in this aspect. The side surface not covered by the resin 31 becomes a metal layer to each other Since the laminated portion is exposed, it is difficult to prevent the chemical liquid from infiltrating from the direction. Therefore, in the case where the corrosion or erosion of the metal layer becomes a serious problem, it is necessary to prevent the chemical liquid from infiltrating from four directions. In this case, the form of Fig. 2 is preferable.

Further, in the laminated body of FIGS. 2 to 4, for example, a laminate obtained by bringing the metal layers 22 and 23 into contact with each other is sandwiched between two plate-like resins, and the plate-like resins are heat-bonded to each other in order to maintain the structure. This heating bonding is performed by hot pressing at a temperature in a state in which the resin flows. Alternatively, the bonding may not be performed as long as there is a certain degree of adhesion. Therefore, in the case where the resins are brought into close contact with each other by bonding, a bonding agent such as an epoxy resin-based bonding agent can be suitably used. Further, the adhesion can be effectively exhibited when the region where the plate-like resin is joined or heated to a certain extent. From this point of view, the ratio (Sa/Sb) of the area (Sa) of the metal layer in the plan view to the area (Sb) of the plate-like resin is 0.6 or more and less than 1.0, preferably 0.80 or more and 0.95 or less. It is preferable to ensure a sufficient area for bonding the plate-like resins to each other or heat-bonding. Further, in other respects, the ratio of the area (Sp) of the two plate-shaped resins joined or heated to the area (Sq) of the plate-like resin containing the joined or heat-bonded surface (Sp/ Sq) is preferably 0.001 or more and 0.2 or less, preferably 0.01 or more and 0.20 or less, and it is also preferable to ensure a sufficient area for bonding the plate-like resins to each other or to heat-bonding. The area and shape of the two plate-like resins directly laminated in the respective metal layers are preferably the same, but may be different. When the area and shape of the two plate-shaped resins are different, the values of Sa and Sq use the value of the plate-shaped resin having a large area.

Further, the shape of the resin is not limited as long as it can cover the laminated portion of the metal layers. In other words, in FIGS. 2 to 4, the shape of the resin in a plan view is a quadrangular shape, but other shapes may be employed. On the other hand, the metal layer can also be set to four A shape other than a polygon.

Further, as shown in FIG. 5, the release layer used in the form of FIG. 3 may not be formed, but two metal layers (metal plates) 42, 43 may be directly contacted to laminate, and cover the two metal layers 42. The resin 41 is formed in a manner other than the laminated portion of 43, and the laminated body 40 is formed. In this case, when the surface of the metal layer 42 is viewed in a plan view, the laminated body 40 is cut at the level of the metal layers 42 and 43 such as the dicing line B, and an appropriate circuit is formed by the following layering method or the like to obtain a formed circuit. A laminate or metal layer of a suitable circuit.

Further, the lamination of the metal layers performed without forming the release layer may be carried out, for example, by the following method, in addition to merely superposing.

(a) Metallurgical joining methods: welding (arc welding, TIG (Tungsten Inert Gas) welding, MIG (Metal Inert Gas) welding, resistance welding, seam welding, spot welding), pressure Welding (ultrasonic welding, friction stir welding), soldering; (b) mechanical joining method: caulking, joining with rivets (joining with self-piercing rivet, joining with rivets), fitting (c) Physical bonding method: bonding agent, (double-sided) tape. A metal layer and another metal may be bonded by bonding a part or all of one metal layer to a part or all of another metal layer by using the above bonding method. The laminate is laminated to produce a laminate in which metal layers are detachably contacted with each other. In the case where a metal layer is weakly bonded to another metal layer to laminate a metal layer and another metal layer, a metal layer can be bonded to another metal layer without removing a joint portion of the metal layer and the other metal layer. The metal layer is separated. In addition, in the case where a metal layer is strongly bonded to another metal layer, a portion where one metal layer is bonded to the other metal layer by dicing or chemical polishing (etching or the like), mechanical polishing, or the like is removed. Put a metal layer with another metal Layer separation.

When the surface of the metal layer of the laminated body is viewed in a plan view, the outer side of the use area of the laminated body may be outside the use area of the laminated body in the region occupied by the laminated body in the region where the laminated body is used (for example, the circuit is finally formed). In the space, use a drill or the like to set 1 to 10 holes with a diameter of about 0.01 mm to 10 mm. Here, the diameter means the smallest diameter surrounding the circle of the hole. The hole thus provided can be used as a means for fixing the positioning pin or the like when manufacturing the multilayer metal-clad laminate or the build-up substrate. Fig. 15 shows an example of a cross section of a laminated body in which a hole is punched. In the laminated body 110 in which the two metal layers 42 and 43 are joined at the ends by using the bonding agent 112, the hole 114 is formed on the inner side of the bonding agent 112 when the laminated body 110 is viewed in a plan view. In addition, before the punching, a metal layer and the other metal layer have the same shape and the ends are aligned, that is, when the shape is a rectangular shape, the position of the four corners in a plan view is not offset. The coincidence makes it easy to align the position at the time of punching, so it is preferable.

Further, as the release layer, for example, any release layer or intermediate layer known to those skilled in the art in a copper foil with a carrier (very thin copper foil with a carrier) can be used. For example, the release layer preferably contains Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al or alloys thereof, such hydrates, oxides or organics thereof. The layer is formed. The release layer may also be composed of a plurality of layers. Further, the release layer may have an anti-diffusion function. Here, the anti-diffusion function means that the element from the base material is prevented from diffusing toward the ultra-thin copper layer side.

In an embodiment of the invention, the release layer is formed from the side of the metal layer 22 (metal carrier) and is composed of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al. a single metal layer composed of any one of the elements, or an alloy layer composed of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al (this With defense a diffusion function) and a layer composed of a hydrate or an oxide or an organic substance of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al .

Further, for example, the release layer may be composed of a layer of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the side of the metal layer 22 (metal carrier). a single metal layer composed of any one element, or an alloy layer composed of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn, and then Cr, a single metal layer composed of any one of elemental groups of Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn or selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P An alloy layer composed of one or more elements of the element group of Cu, Al, and Zn. Further, the total adhesion amount of each element can be, for example, 1 to 50000 μg/dm ² , and can be, for example, 1 to 6000 μg/dm ² .

The release layer is preferably composed of two layers including a Ni layer and a Cr-containing layer. In this case, the Ni-containing layer is brought into contact with the interface of the metal layer 22 (metal carrier), the Cr-containing layer, and the metal layer 23 (the metal foil, and the laminate obtained by bringing the metal layers 22 and 23 into contact is extremely thin. In the case of a copper foil, the interface of the ultra-thin copper layer is laminated.

The release layer can be obtained, for example, by wet plating such as electroplating, electroless plating, or immersion plating, or dry plating such as sputtering, CVD, or PDV. From the viewpoint of cost, electroplating is preferred.

Further, for example, the release layer may be formed by sequentially laminating a nickel layer, a nickel-phosphorus alloy layer or a nickel-cobalt alloy layer, and a chromium layer or a chromium-containing layer on the carrier. Since the bonding strength of nickel and copper is higher than the bonding force of chromium and copper, in the case where the metal layer 23 (metal foil) is an extremely thin copper layer of a copper foil with a carrier, when the ultra-thin copper layer is peeled off, it is extremely thin copper. The layer is peeled off from the interface of the chrome layer or the chromium-containing layer. Further, it is expected that the nickel of the release layer exerts a barrier effect of preventing the component as a carrier constituent element from diffusing from the carrier to the metal layer 23 (a metal foil such as an extremely thin copper layer of an extremely thin copper foil with a carrier). A release layer adhered amount of nickel is preferably 100μg / dm ² or more 40000μg / dm ² or less, more preferably 100μg / dm ² or more 4000μg / dm ² or less, more preferably 100μg / dm ² or more 2500μg / dm ² or less, More preferably, it is 100 μg/dm ² or more and less than 1000 μg/dm ² , and the amount of chromium deposited in the release layer is preferably 5 μg/dm ² or more and 100 μg/dm ² or less. In the case where the release layer is provided only on one side of the metal layer 22, it is preferable to provide a rust-proof layer such as a Ni plating layer on the opposite side of the metal layer 22 (metal carrier). Further, the chromium-containing layer may be a chromate treatment layer or a chromium alloy plating layer. The chrome layer can also be a chrome layer.

Further, a release layer may be provided on both sides of the metal layer 22 (metal carrier).

Further, as shown in FIGS. 6 , 7 , and 10 to 12 , the laminated body 50 (or the laminated body 60 ) may have a structure in which an opening 52 (or an opening 60 ) is provided when viewed from at least one side. The opening portion exposes the metal layer 22 (or the metal layer 42 or the metal layer 23). The opening portion may be formed by a general lithography technique, or a technique of etching a masking tape or a masking sheet, and etching only the opening portion; or by using a resin The laminate is obtained by bringing the two metal layers into contact by pressing, and the resulting laminate is pressure-bonded or thermocompression bonded. The opening portion may be formed inside the end portion (outer periphery) of the metal layer in plan view, or may reach at least a part of the outer periphery of the metal layer or the outer layer of the two metal layers.

Further, as shown in FIG. 10 to FIG. 12, two or more laminates in which metal layers are brought into contact with each other may be contained in one laminated body. In this case, the plate-shaped resin may be integrally formed with the resin. In other words, the plate-shaped resin and the resin covering the layer may be integrally formed by heat-hardening or the like at the same time point.

Further, as shown in FIGS. 13 and 14, the plate-like resin and the resin may be formed as different members. In other words, in the laminated body 90 (or the laminated body 100), the plate-like resin 91 (or the plate-shaped resin 101) sandwiched by the metal layer with the carrier may be formed at different time points, and the layer may be covered from the side surface. The resin 93 (or the resin 103) formed by the method does not integrate the plate-like resin with the resin covering the layer as shown in Figs. 10 to 12 . Further, in FIGS. 13 and 14, the plate-like resin 91 (or the plate-like resin 101) and the resin 93 (or the resin 103) may be of different types or may be of the same type. In the case where the two are different, for example, the plate-like resin 91 (or the plate-like resin 101) may be a prepreg as described below, and the resin 93 (or the resin 103) may be an epoxy resin or the like.

In addition, as for the laminated body shown in FIG. 13 and FIG. 14, for example, the laminated body of the present invention is laminated on both surfaces of the plate-shaped resin, and the metal layer of the surface is shielded as needed, and the following layer of resin is applied to the deposited layer from the side surface. Heat hardened to obtain.

Although the production method of the present invention is as described above, in the case where the present invention is carried out, other steps may be included between or before the above steps within a range that does not adversely affect the above respective steps. For example, a cleaning step of cleaning the surface of the metal layer may also be performed before the release layer is formed.

Further, in the manufacturing process of the multilayer printed wiring board, the heat treatment is often performed in the lamination pressing step or the desmear step. Therefore, the more the number of layers, the more severe the heat history of the laminate becomes. Therefore, in particular, in consideration of application to a multilayer printed wiring board, in the case where the metal layers are adhered to each other after a desired thermal history, it is desirable that the peeling strength of the metal layers is within the range.

Therefore, in a more preferred embodiment of the present invention, heating conditions in the manufacturing process of the multilayer printed wiring board are envisaged, for example, after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours, the metal layers are mutually The peel strength is preferably 0.5 gf/cm or more, preferably 1 gf / cm or more, preferably 2 gf / cm or more, preferably 3 gf / cm or more, preferably 5 gf / cm or more, preferably 10 gf / cm or more, preferably 30 gf / cm or more, more preferably 50 gf /cm or more. Further, the peel strength is preferably 200 gf/cm or less, more preferably 150 gf/cm or less, still more preferably 80 gf/cm or less.

With respect to the peel strength after heating at 220 ° C, it is preferable that the peel strengths of both after 3 hours and 6 hours or after 6 hours and 9 hours are satisfied from the viewpoint of the number of layers to be laminated. More preferably, in this range, all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the range.

In the present invention, the peel strength is measured in accordance with the 90-degree peel strength measuring method prescribed by JIS C6481.

Hereinafter, specific configuration requirements of each material for realizing such peel strength will be described.

The resin covering the periphery of the laminated portion of the metal layers is not particularly limited, and a thermosetting resin such as a phenol resin, a polyimide resin, an epoxy resin, a styrene-butadiene resin emulsion, or an acrylonitrile may be used. Butadiene resin emulsion, carboxyl modified styrene-butadiene copolymer resin emulsion, acrylic resin emulsion, or thermosetting polyurethane, or natural rubber or turpentine, fluororesin (polytetrafluoroethylene, poly A vinylidene fluoride or the like, an anthracene resin, an anthrone, or a thermoplastic resin such as polyethylene, polypropylene, polystyrene, acrylic resin, thermoplastic polyurethane or thermoplastic natural rubber. More typically, a heat resistant resin which does not melt at 250 ° C and/or a glass transition temperature of 200 ° C or higher, such as a fluororesin (polytetrafluoroethylene, polyvinylidene fluoride, etc.) can be used, and can be preferably used. A heat resistant resin which does not melt at 250 ° C and has a glass transition temperature of 200 ° C or higher, such as a polyimide resin or a liquid crystal polymer resin (LCP resin). Further, the resin is preferably a resin having chemical resistance to chemical liquidity, particularly acid resistance and stain removal resistance. In addition, the term "decontamination treatment" as used herein refers to the removal of a metal foil or a metal layer by etching or the like after the resin is perforated by a laser and/or a drill, or after a metal foil or a metal layer is bonded to the surface of the resin. Then, the resin or the metal foil or the metal layer, for example, the residue of the copper foil or the copper layer, is removed by the treatment liquid; the "decontamination liquid" means the treatment liquid used for the removal. In addition, the viscosity of the resin is only 0.5 Pa. s above, 1Pa. s above, 5Pa. s above, 10Pa. s above 10000Pa. s below, 5000Pa. s below, 3000Pa. s can be below, about 100Pa. The range below s is measured in accordance with JIS Z 8803 (2011) using JIS Z 8803 (2011) "6 Viscosity measurement method using a capillary viscometer 6.2.3 Ubum viscometer" viscosity viscosity viscosity, above 100Pa . The range of s is measured using the viscosity viscosity of "7] Using the viscosity measurement method of the ball viscous meter in JIS Z 8803 (2011). Further, a prepreg impregnated with a thermoplastic resin or a thermosetting resin may also be used. In particular, in the case of using a prepreg impregnated with a thermosetting resin, it is preferred that the prepreg before the metal layer is bonded in the B-stage. The linear expansion coefficient of the prepreg (C stage) is 12 to 18 (×10 ^-6 /°C) and the copper foil 16.5 (×10 ^-6 /°C) as the substrate constituent material or 17.3 (×10 ^-6 ) of the SUS platen. /°C) is substantially equal, so that it is difficult to produce a circuit position shift due to a phenomenon in which the substrate size before and after pressing is different from the size at the time of design (scale change). Further, as a synergistic effect of these advantages, it is also possible to produce a multilayer ultra-thin coreless substrate. The prepreg used herein may be the same prepreg as the prepreg constituting the circuit substrate, or may be a different prepreg.

When a prepreg is used, when the laminate is formed by disposing the metal layers in a separable manner from the side of the metal layer, it is preferable to use a large size from the viewpoint of effectively inhibiting penetration of the chemical solution into the side surface of the laminate. A circle of prepreg. It can effectively prevent prepreg during pressing From the viewpoint that the material expands and overflows, causing contamination of other layers, it is preferable to laminate a metal layer having a larger size on the prepreg of the B stage.

Further, it is preferable that the thermal expansion coefficient of the resin is within +10% or -30% of the thermal expansion coefficient of the metal layer. Thereby, it is possible to effectively prevent the positional shift of the circuit due to the difference in thermal expansion between the metal layer and the resin, thereby reducing the occurrence of defective products and improving the yield.

The thickness of the resin is not particularly limited, and may be rigid or soft. If it is too thick, it may adversely affect the heat distribution in hot pressing. On the other hand, if it is too thin, it may bend to cause a printed wiring board. Since the manufacturing process is interrupted, it is usually 5 μm or more and 1000 μm or less, preferably 50 μm or more and 900 μm or less, and more preferably 100 μm or more and 400 μm or less.

Further, in a form in which at least a part of the surface of the metal layer is covered with a resin in a plan view, the thickness of the resin layer is preferably as small as possible, and is typically 50 μm or less, preferably 40 μm or less, more preferably 30 μm or less, and typical. It is 1 μm or more, preferably 2 μm or more, and more preferably 5 μm or more. The thickness of the resin layer referred to herein means, for example, the thickness t shown in FIG. 10, which is the thickness of the portion of the resin 71 covering the metal layer 22 when the laminated body 70 is viewed in plan.

Further, from the viewpoint of the yield, it is preferable to provide an opening portion in a plan view of the laminated body, and a tangent line is drawn at an end portion of the metal layer 22, and is perpendicular to the tangent line and perpendicular to a tangent to the end portion of the metal layer in a plan view. For example, in the form shown in Fig. 10, the width w of the resin 71 from the end portion of the opening portion 72 of the resin 71 to the end portion of the metal layer 22 is typically 10 mm or less. It is 5 mm or less, more preferably 3 mm or less, and is typically 0.1 mm or more, preferably 0.2 mm or more, and more preferably 0.5 mm or more. If the width of the resin layer If it is too large, it is not preferable from the viewpoint of yield, and conversely, if it is too small, the effect of effectively inhibiting penetration of the chemical liquid from the end of the opening portion is reduced.

As the metal layer, a copper or copper alloy foil or a plate is typically used, and a foil or a plate of aluminum, nickel, zinc or the like may be used. Particularly in the case of copper or copper alloy foil, an electrolytic foil or a rolled foil can be used. The metal layer is not limited. However, in consideration of the wiring used as the printed circuit board, it is generally 1 μm or more, preferably 5 μm or more, and 400 μm or less, preferably 120 μm or less. As the metal layer to be overlapped, a metal layer of the same thickness or a metal layer of a different thickness may be used.

Various surface treatments can also be applied to the metal layers used. For example, metal plating for imparting heat resistance (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating, Co) -Ni alloy plating, etc.), chromate treatment for imparting rust resistance or discoloration resistance (including inclusion of one or more alloys of Zn, P, Ni, Mo, Zr, Ti, etc. in the chromate treatment liquid) The case of the element), the roughening treatment for adjusting the surface roughness (for example, using copper plating or Cu-Ni-Co alloy plating, Cu-Ni-P alloy plating, Cu-Co alloy plating, Cu) -Ni alloy plating, Cu-W alloy plating, Cu-As alloy plating, copper alloy plating such as Cu-As-W alloy plating). Of course, the roughening treatment affects the peel strength of the metal layer and the plate-shaped carrier, and the chromate treatment also has a large influence. The chromate treatment is important from the viewpoint of rust resistance and discoloration resistance, but it has been found that the peel strength tends to increase remarkably. Therefore, it is also useful as a means for adjusting the peel strength.

In the present invention, when the resin is bonded to the surface of the metal layer, the peel strength is preferably high. Therefore, it is preferable to set the rough surface (M surface) of the metal layer (for example, electrolytic copper foil) to The surface of the resin is bonded to a surface treatment such as roughening treatment to realize the use of chemistry and physics. The fixing effect improves the bonding force. Further, it is preferable to carry out various measures such as adding various binders to enhance the bonding force with the metal layer on the resin side.

Therefore, in the case where the surface of the metal layer of the laminate of the present invention is covered with a resin, in a preferred embodiment, the peel strength of the surface of the resin and the metal layer is adjusted to a preferred range (for example, 800 gf/cm or more). When the surface roughness of the bonding surface is expressed by the ten-point average roughness (Rz jis) of the surface of the metal layer measured in accordance with JIS B 0601:2001, it is preferably 0.4 μm or more, preferably 0.5 μm or more. It is preferably 0.8 μm or more, preferably 1.0 μm or more, preferably 1.2 μm or more, preferably 1.5 μm or more, and more preferably 2.0 μm or more. Further, the upper limit is not particularly required, and is preferably, for example, 10.0 μm or less, preferably 8.0 μm or less, preferably 7.0 μm or less, preferably 6.0 μm or less, and preferably 5.0 μm or less.

Further, in a preferred embodiment of the laminate of the present invention, in order to adjust the peel strength of the metal layers to the preferred range, when the surface of the metal layer measured according to JIS B 0601:2001 is used, ten points are used. The average roughness (Rz jis) is preferably 3.5 μm or less, and more preferably 3.0 μm or less, when the surface roughness of the metal layer on the contact side surface of the other metal layer is used. However, it is costly and time-consuming to reduce the surface roughness indefinitely, and the cost is increased. Therefore, it is preferably 0.1 μm or more, and more preferably 0.3 μm or more. In the case where an electrolytic copper foil is used as the metal layer, any surface of the glossy surface (gloss surface, S surface) and rough surface (matte surface, M surface) may be used as long as the surface roughness is adjusted, but S is used. The surface is easily adjusted to the surface roughness. On the other hand, the ten-point average roughness (Rz jis) of the surface on the side where the metal layer is not in contact with the carrier is preferably 0.4 μm or more and 10.0 μm or less.

By laminating a resin in which the metal layers are brought into contact with each other in a separable manner, a laminate in which at least a part of the outer periphery of the laminated portion is covered with a resin in a plan view of the metal layer is produced as heat for manufacturing the laminate. In the case of using a prepreg (for example, a plate-like prepreg) as a resin, it is preferred to carry out hot pressing at a temperature of 30 to 40 kg/cm ² above the glass transition temperature of the prepreg.

Moreover, from another point of view, the present invention provides the use of the laminate.

First, the present invention provides a method of manufacturing a multilayer metal-clad laminate comprising the steps of: resin or metal layer with respect to a plane direction of at least one metal layer of the laminate, that is, a direction substantially perpendicular to a surface of the metal layer Stack more than once, for example 1~10 times.

Secondly, a method for producing a multi-layer metal-clad laminate can be cited, comprising the steps of: coating a resin, a single-sided or two-sided metal-clad laminate, or a laminate of the present invention with respect to a plane direction of at least one metal layer of the laminate. Or a metal layer with a carrier obtained by cutting the laminated body of the present invention, a metal layer with a resin substrate, or a metal laminated layer may be used once or more. Further, the laminate may be subjected to a desired number of times, and each laminate may be composed of a group consisting of a resin, a single-sided or double-sided metal-clad laminate, a laminate of the present invention, a metal layer and a metal layer of the carrier of the present invention. Make a selection arbitrarily. In addition, as the metal layer to which the resin substrate is attached, a conventional metal foil with a resin carrier or the like can be suitably used.

In the method for producing a multilayer metal-clad laminate, the method further includes the steps of: cutting the laminate on at least one side of the layer of the metal layers when the surface of the metal layer is viewed from above, for example, on the metal layer of the laminate; Further, the metal layer of the carrier-attached carrier or the metal layer of the laminated body after the dicing is peeled off from each other and separated. In the method of manufacturing the multilayer metal-clad laminate, the method further includes the step of cutting the laminate at least one side of the layer of the metal layers when the surface of the metal layer is viewed from above.

And may include the steps of: separating the metal layers from each other and separating them by The etching removes a portion or all of the metal layer.

Thirdly, the present invention provides a method for manufacturing a build-up substrate, comprising the steps of: resin, single-sided or double-sided wiring substrate, single-sided or double-sided metal-clad laminate with respect to a plane direction of at least one metal layer of the laminate; Or a laminated body of the present invention or a metal layer with a carrier obtained by cutting the laminated body of the present invention, a metal layer with a resin substrate, a wiring, a circuit, or a metal laminated layer, for example, 1 to 10 times. Further, the laminate may be carried out only for the desired number of times, and each laminate may be formed from a resin, a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a laminate of the present invention, and a metal layer of the carrier of the present invention. The group composed of the metal layer is arbitrarily selected. In addition, similarly to the above, the metal layer to which the resin substrate is attached can be suitably used, such as a metal foil with a resin carrier.

Fourthly, the present invention provides a method for producing a build-up substrate, comprising the steps of laminating one or more layers of a build-up wiring layer with respect to a plane direction of at least one metal layer of the laminate. At this time, the build-up wiring layer can be formed using at least one of a subtractive method or a full additive method or a semi-additive method.

Here, in the fourth application of the laminated body, that is, the method of manufacturing the build-up substrate, the subtractive method refers to a method of coating a metal-clad laminate or a wiring substrate (including a printed wiring board and a printed circuit by etching or the like). Unnecessary portions of the metal layer on the board) are selectively removed to form a conductor pattern. The full additive method is a method in which a conductive layer is formed by electroless plating or/and electroplating without using a metal layer, and the semi-additive method is, for example, precipitation of an electroless metal and plating, etching, or both. A method of forming a conductor pattern on a seed layer composed of a metal layer and then etching to remove an unnecessary seed layer, thereby obtaining a conductor pattern.

In the method of manufacturing the build-up substrate, the method may further include the following steps: Surface or double-sided wiring substrate, single-sided or double-sided metal-clad laminate, metal layer of laminated body, resin of laminated body, metal layer, resin of metal layer with carrier, metal layer of metal layer with carrier, and resin substrate The resin of the metal layer, the metal layer of the metal layer with the resin substrate, or the resin is perforated, and the side surface and the bottom surface of the hole are electrically plated. Further, the method further includes the step of performing a metal layer constituting the single-sided or double-sided wiring board, a metal layer constituting the single-sided or double-sided metal-clad laminate, and a metal constituting the laminated metal layer and the carrier. At least one of the metal layer of the layer, the metal layer of the metal layer to which the resin substrate is attached, and the metal layer form wiring.

In the method for producing the build-up substrate, the step of laminating the layered body of the present invention or the metal layer of the carrier obtained by cutting the layered body of the present invention on the surface after the wiring is formed may be further included.

Further, the term "surface after wiring formation" means a portion where wiring is formed on the surface which is present during the layering process, and the layered substrate includes the final product and the product formed in the middle.

In the method of manufacturing the build-up substrate, the method further includes the steps of: cutting the laminate on at least one side of the layer of the metal layers when the surface of the metal layer is viewed, for example, on the metal layer of the laminate; The metal layer of the laminated carrier or the metal layer of the laminated body after the dicing is peeled off from each other and separated. In the method of manufacturing the build-up substrate, the method further includes the step of cutting the laminate in a side surface than a portion where the metal layer is joined or welded or joined in a plan view. The joint portion of the metal layer and the metal layer may be removed by chemical polishing such as cutting, grinding, mechanical polishing, or etching.

Further, the method further includes the step of separating the metal layers from each other and separating them, and then removing a part or all of the metal layers by etching.

Further, in the method for producing the multilayer metal-clad laminate and the method for producing a build-up substrate, the layers may be laminated by thermocompression bonding. The thermocompression bonding can be carried out every time layer by layer, and it can be carried out as a whole before stacking a certain level, or it can be carried out as a whole at the last time.

In particular, the present invention provides a method for producing a build-up substrate. In the method for producing a build-up substrate, the following steps are performed at least once: on a single-sided or double-sided wiring substrate, a single-sided or two-sided copper-clad laminate, and a laminate a metal layer of a body, a plate-shaped carrier of a laminate, a metal layer, a plate-shaped carrier of a metal layer with a carrier, a metal layer of a metal layer with a carrier, a resin of a metal layer with a resin substrate, and a metal layer with a resin substrate The metal layer or the resin is perforated, and the side surface and the bottom surface of the hole are electrically plated, and further, the metal foil and the circuit portion constituting the single-sided or double-sided wiring substrate, and the metal foil constituting the one-sided or double-sided copper-clad laminate The metal layer constituting the laminate, the metal layer constituting the metal layer with the carrier, the metal layer of the metal layer with the resin substrate, or the metal layer forming circuit.

Hereinafter, as a specific example of the use, a method of producing a four-layer CCL using the metal layer of the carrier of the present invention will be described. The metal layer with a carrier used here is a metal layer with a carrier formed by sandwiching a resin 11c and a prepreg 12, and the laminate is in a separable manner to bring the metal layer 11b and the metal layer 11a into contact with each other. And constitute. By sequentially overlapping a desired number of prepregs 12, a two-layer printed circuit board, or a two-layer metal-clad laminate, which is referred to as an inner core 13, on the metal layer of the carrier, and then prepreg 12, and further The metal layer of the carrier is attached, and the assembly unit of the 4-layer CCL of one set is completed. Then, the unit 14 (generally referred to as "page") is repeatedly formed about 10 times to constitute a press assembly 15 (generally referred to as "book") (Fig. 8). Thereafter, the booklet 15 is sandwiched between the laminated metal molds 10 and placed on a hot press, and pressurized at a predetermined temperature and pressure. Molding, whereby a large number of 4-layer CCLs can be produced at the same time. For the laminated metal mold 10, for example, a stainless steel plate can be used. The plate is not limited, and for example, a thick plate of about 1 to 10 mm can be used. Regarding CCL of four or more layers, it is generally possible to carry out production by the same procedure by increasing the number of layers of the inner core.

In the following, as a specific example of the use, a method of manufacturing a coreless build-up substrate using a metal layer 11 having a carrier formed by sandwiching two layers of resin 11c, which is obtained by cutting the laminate of the present invention, is exemplified. The laminate is formed by detachably contacting the metal layer 11b and the metal layer 11a with each other. In this method, a desired number of layers 16 are laminated on both sides of the metal layer 11 with a carrier, and finally the metal layers 11a and 11b are peeled off (refer to Fig. 9).

Further, for example, a resin as an insulating layer, a two-layer circuit substrate, and a resin as an insulating layer are sequentially superposed on the laminated body of the present invention, and the layered body or the metal layer of the carrier of the present invention is sequentially superposed thereon, and along The metal layers of the final laminate thus obtained are cut to each other to form a build-up substrate.

Further, as another method, a resin as an insulating layer and a metal layer as a conductor layer are sequentially laminated on the laminated body of the present invention. Next, a step of adjusting the thickness by half etching the entire surface of the metal layer as needed may be included. Then, laser processing is performed at a predetermined position of the metal layer of the laminated layer to form a through hole penetrating the metal layer and the resin, and a decontamination treatment for removing the stain in the through hole is performed, and then the bottom, the side, and the metal of the through hole are formed. The entire surface or a portion of the layer is subjected to electroless plating to form an interlayer connection, and further electroplating is performed as needed. It is also possible to form a plating resist in advance on the portion of the metal layer that does not require electroless plating or plating before performing each plating. Further, in the case where the adhesion between the electroless plating, the plating, and the plating resist and the metal layer is insufficient, the surface of the metal layer may be chemically roughened in advance. In the case of using a plating resist, after plating Remove the plating resist. Then, by etching, unnecessary portions of the metal layer, the electroless plating portion, and the plating portion are removed, thereby forming a circuit. Thereafter, the layer is cut along the layers of the metal layers of the laminate, whereby the buildup substrate can be manufactured. It is also possible to perform a plurality of steps from the lamination of the resin and the copper foil to the formation of the circuit, thereby forming a plurality of layers of the build-up substrate.

Further, the outermost surface of the build-up substrate may be laminated in contact with the laminate of the present invention or the metal layer of the carrier obtained by cutting the laminate of the present invention as described above. In addition, in the case where the laminated body is finally adhered, it is possible to cut along the layers of the previously overlapped metal layers, but it is also possible to perform the cutting without the cutting before the final bonding of the laminated body, and the metal containing all the laminated bodies in the last cutting surface. The cutting is performed in such a manner that the layers are layered with each other, so that one cut is performed.

Here, as the resin substrate for producing the build-up substrate, a prepreg containing a thermosetting resin or a thermoplastic resin can be suitably used.

In addition, as another method, a resin which is an insulating layer of an exposed surface layer of the metal layer which is provided with an opening in the plate-shaped carrier of the laminate of the present invention, for example, a prepreg or a photosensitive resin. Thereafter, a through hole is formed at a predetermined position of the resin. In the case of using, for example, a prepreg as a resin, the through holes can be performed by laser processing. After the laser processing, it is preferred to carry out a desmutting treatment for removing stains in the through holes. Further, in the case where a photosensitive resin is used as the resin, the resin of the forming portion can be removed from the through hole by photolithography. Next, the bottom surface, the side surface, and the entire surface or a part of the resin are subjected to electroless plating to form an interlayer connection, and further plating is performed as needed. It is also possible to form a plating resist in advance on the portion of the resin that does not require electroless plating or plating before performing each plating. Further, in the case where the adhesion between the electroless plating, the plating, and the plating resist and the resin is insufficient, the surface of the resin may be chemically roughened in advance. In the case of using a plating resist, the plating resist is removed after plating. Then, by etching, the electroless plating portion or the plating portion is not The necessary parts are removed, thereby forming a circuit. Thereafter, the metal layers along the laminate are cut to each other, whereby the build-up substrate can be manufactured. It is also possible to carry out the steps from the lamination of the resin to the formation of the circuit a plurality of times to form a layered substrate having more layers.

Further, the outermost surface of the build-up substrate may be laminated in contact with the laminate of the present invention or the metal layer of the carrier obtained by cutting the laminate of the present invention as described above. In addition, in the case where the laminated body is finally adhered, it is possible to cut along the layers of the previously overlapping metal layers, but it is also possible to perform the cutting without the cutting before the final bonding of the laminated body, and the metal containing all the laminated bodies in the last cutting surface. The cutting is performed in such a manner that the layers are layered with each other, so that one cut is performed.

Further, as another method, a build-up method as shown in FIGS. 16 to 18 can be cited.

That is, in Fig. 16, prepregs 115 and 116 are laminated on the exposed surfaces of the metal layers 42 and 43 of the laminated body shown in Fig. 15, and the circuit forming metal layers 117 and 118 are further laminated. After the lamination, the cutting is performed along the cutting line B. In the series of operations, the hole 114 functions as a positioning hole, and even if the prepreg or the metal layer of the upper surface layer of the hole 114 is irradiated with X-rays, the position can be detected. Further, the surface on the side of the layer on which the prepregs 115 and 116 of the metal layers 42 and 43 are laminated is preferably the surface of the M surface (rough surface, precipitation surface) of the metal layer (electrolytic metal layer) produced by electrodeposition. Or a surface having irregularities such as a surface of a surface on which the metal layer has been roughened. This is because the metal layers 42 and 43 are in good contact with the prepregs 115 and 116.

Next, in Fig. 17, the inside of the hole 114 of the laminated body obtained in Fig. 16 is punched with a hole 124 penetrating in the lamination direction. By this, people can also see the hole. Further, the hole 124 is drilled inside the hole 114, whereby the chemical liquid can be prevented from infiltrating between the metal layer and the metal layer of the laminate.

Then, in Fig. 18, the metal layer of the outermost layer of the laminated body obtained in Fig. 17 117, 118 form a circuit, and circuit regions 122, 123 are provided to obtain a build-up substrate 121. Thereafter, as shown in FIG. 19, the buildup layer 132 may be further formed in the build-up substrate 121 obtained in FIG. 18, and further, the buildup may be continued as needed, and finally, the predetermined cut may be set on the inner side of the hole 124 in plan view. Line B is cut and divided into two substrates 133, 134 along the interface of the metal layer along arrow D. Further, as shown in FIG. 18, it is possible to perform cutting along a prescribed cutting line B which is set inside the hole 124 in plan view, and to separate the interfaces of the metal layers 42, 43 to obtain two build-up substrates, as shown in FIG. The buildup layer 142 may be continuously formed on both surfaces of each build-up substrate 141, or a buildup layer may be formed only on one side.

Further, although not shown, an extremely thin metal foil may be formed in advance on the surfaces of the metal layers 42 and 43 of the laminated body of FIG. 15, and a prepreg or a metal layer may be formed on the surface area of the ultra-thin metal foil.

The coreless build-up substrate thus produced is subjected to a plating step and/or an etching step to form wiring on the surface, and further, the metal layers are peeled off and separated from each other to complete the build-up wiring board. The wiring may be formed on the peeled surface of the metal layer after the separation and separation, or the entire metal layer may be removed by etching to form a multilayer build-up wiring board. Further, the printed circuit board is completed by loading electronic parts on the build-up wiring board. In addition, a printed circuit board can also be obtained by directly loading an electronic component on the coreless build-up substrate before peeling.

[Examples]

The embodiments and comparative examples of the present invention are shown in the following, which are intended to provide a better understanding of the present invention and its advantages, and are not intended to limit the inventors.

<Experimental Example 1>

Two pieces of electrolytic copper foil (JTC; thickness 18 μm; gloss surface: surface roughness Rz jis (ten point average roughness) 1.5 μm; rough surface (precipitation surface): rough surface manufactured by JX Nippon Mining & Metal Co., Ltd. Degree Rz jis is 3.1 μm), the gloss surface and the glossy area layer are bonded via a bonding agent, Further, the outer periphery of the laminated portion was covered with a resin to form a laminated body having the structure shown in Fig. 2 . The peel strength at this time was 150 gf/cm. Further, when the outer periphery of the laminated portion of the metal layer is covered with the resin, the prepreg (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.)) which is one turn larger than the laminate is sandwiched between the layers which bring the metal layers into contact with each other. Both sides of the object are joined by hot pressing.

<Experimental Example 2>

Two pieces of electrolytic copper foil (JTC; thickness 18 μm; gloss surface: surface roughness Rz jis (ten point average roughness) 1.5 μm; rough surface (precipitation surface): rough surface manufactured by JX Nippon Mining & Metal Co., Ltd. The degree of Rz jis was 3.1 μm), and the shiny surface and the glossy area layer were further covered with a resin to cover the outer periphery of the laminated portion, and a laminate having the structure shown in Figs. 4 and 5 was produced. The peel strength at this time was 200 gf/cm. In addition, when the outer periphery of the laminated portion of the metal layer is covered with the resin, two prepregs (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.)) are used to sandwich both sides of the layer obtained by bringing the metal layers into contact with each other, and Bonding is performed by hot pressing. Further, a prepreg is used in which the length of one of the pair of sides is longer than that of the laminate, and the length of the opposite side of the other pair is the same as that of the laminate.

<Experimental Example 3>

Two layers of JH Nippon Mining & Metal Co., Ltd. rolled copper foil (Tough pitch copper (JIS H3100 C1100); thickness 35 μm; surface roughness Ra = 0.09 μm (JIS B0601 1994)) Ultrasonic welding was performed, and the outer periphery of the laminated portion was further covered with a resin at each of three places at both ends, and a laminated body having the structure shown in Fig. 6 was produced. Further, regarding the lamination of the respective metal layers, the peel strengths were 55 gf/cm and 67 gf/cm, respectively. Further, when the outer periphery of the laminated portion of the metal layer is covered with the resin, the prepreg (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.)) which is one turn larger than the laminate is sandwiched between the layers which bring the metal layers into contact with each other. Object Both sides are joined by hot pressing, and thereafter, they are shielded and an etching process is performed so as to form an opening.

<Experimental Example 4>

Two layers of rolled copper foil (fine copper (JIS H3100 C1100); thickness 35μm; surface roughness Ra=0.09μm (JIS B0601 1994)) manufactured by JX Nippon Mining & Metal Co., Ltd., further covered with resin On the outer circumference, a laminate having the structure shown in Fig. 7 was produced. Further, when the outer periphery of the laminated portion of the metal layer is covered with the resin, the prepreg (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.)) which is one turn larger than the laminate is sandwiched between the layers which bring the metal layers into contact with each other. Both sides of the object are joined by hot pressing, and then they are shielded and etched by forming an opening.

<Experimental Example 5>

A laminate having two laminates having the structure shown in Fig. 10 was produced by using the ultra-thin copper foil with a carrier as a laminate in the following procedure.

As a carrier, a long strip of electrolytic copper foil (JTC manufactured by JX Nippon Mining & Metal Co., Ltd.) having a thickness of 35 μm was prepared. The shiny side (shiny side) of the copper foil was plated by a roll to roll type continuous plating line under the following conditions, thereby forming a Ni layer having an adhesion amount of 4000 μm/dm ² .

(1) Ni layer (Ni-containing layer, peeling layer: base plating 1)

The S surface of the copper foil carrier was plated by a roll-to-roll type continuous plating line under the following conditions, thereby forming a Ni layer having an adhesion amount of 1000 μg/dm ² . Specific plating conditions are described below.

Nickel sulfate: 270~280g/L

Nickel chloride: 35~45g/L

Nickel acetate: 10~20g/L

Boric acid: 30~40g/L

Polish: saccharin, butynediol, etc.

Sodium lauryl sulfate: 55~75ppm

pH: 4~6

Bath temperature: 55~65°C

Current density: 10A/dm ²

(2) Cr layer (containing Cr layer, peeling layer: base plating 2)

Then, after the surface of the Ni layer formed in (1) is washed with water and pickled, then electrolytic chromate treatment is performed on a roll-to-roll continuous plating line under the following conditions, thereby adhering on the Ni layer. A Cr layer of 11 μg/dm ² was attached.

Potassium dichromate 1~10g/L, zinc 0g/L

pH: 7~10

Liquid temperature: 40~60°C

Current density: 2A/dm ²

(3) Very thin copper layer

Then, after the surface of the Cr layer formed in (2) is washed with water and pickled, then on a roll-to-roll continuous plating line, electroplating is performed under the following conditions, thereby forming a very thin layer having a thickness of 2 μm on the Cr layer. A copper layer is used to make an extremely thin copper foil with a carrier.

Copper concentration: 80~120g/L

Sulfuric acid concentration: 80~120g/L

Electrolyte temperature: 50~80°C

Current density: 100A/dm ²

A copper foil with a carrier obtained by the treatment (the thickness of the ultra-thin copper layer was 2 μm, and the ultra-thin copper layer was roughened to form a surface roughness: Rz was 0.6 μm), and the rough surface of the copper foil (rough surface: M) The surface is subjected to rough plating as shown below. The processing conditions are shown below. These are the steps of the invention of the present invention for forming a roughened layer on a copper foil. The ratio of the roughened particles to the limiting current density at the time of formation of the roughened particles was set to 2.50.

(liquid composition 1)

Cu: 15g/L

H ₂ SO _4: 100g / L

W: 3mg/L

Sodium lauryl sulfate addition: 10ppm

(plating temperature 1) 50 ° C

After the roughening treatment, normal plating as shown below was performed. The processing conditions are shown below.

(liquid composition 2)

Cu: 40g/L

H ₂ SO _4: 100g / L

(plating temperature 1) 40 ° C

(current condition 1)

Current density: 30A / dm ²

Coulomb amount: 150As/dm ²

Then, electrolytic chromate treatment is performed on the heat-resistant rust preventive layer.

Electrolytic chromate treatment (chromium-zinc treatment (acid bath))

CrO ₃ : 1.5g / L

ZnSO ₄ . 7H ₂ O: 2.0g/L

Na ₂ SO ₄ : 18g/L

pH: 4.6

Bath temperature: 37 ° C

Current density: 2.0A/dm ²

Time: 1~30 seconds

(pH adjustment using sulfuric acid or potassium hydroxide)

Then, a decane treatment (by coating) is performed on the chromate coating layer. The conditions for the treatment of decane are as follows.

0.2% 3-glycidoxypropyltrimethoxydecane

Further, regarding the lamination of the respective metal layers, the peel strengths were 13 gf/cm and 10 gf/cm, respectively.

An aluminum plate of 0.1 mm smaller than the metal layer was placed on the thus obtained laminate. Then, after laminating in the order of aluminum plate/layered product/prepreg (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.)/layered product/aluminum plate), thermocompression bonding is performed by hot pressing, and then the aluminum plate is removed to obtain a pattern. The laminated body constructed as shown in FIG. In addition, the prepreg uses a prepreg that is one turn larger than the laminate. Further, an ultra-thin copper foil as a carrier attached to the laminate is laminated on the ultra-thin copper layer side to the prepreg to obtain a laminate.

<Experimental Example 6>

The ultrathin copper foil with a carrier was used as a laminate in the following order, and the production shown in FIG. 11 was produced. A laminate having two laminates constructed.

The formation of the peeling layer and the roughening treatment of the metal layer were carried out under the following conditions, and the subsequent treatment was carried out in the same manner as in Experimental Example 5. The thickness of the ultra-thin copper layer was set to 3 μm.

(formation of peeling layer)

(1) "Ni-Zn": nickel-zinc alloy plating

Under the conditions of the nickel plating, zinc in the form of zinc sulfate (ZnSO ₄ ) was added to the nickel plating solution, and the zinc concentration was adjusted to be in the range of 0.05 to 5 g/L to form a nickel-zinc alloy plating.

The Ni adhesion amount was 3000 μg/dm ² and the Zn adhesion amount was 250 μg/dm ² .

(2) "Organic": organic layer formation treatment

Spraying an aqueous solution containing carboxybenzotriazole (CBTA) at a concentration of 1 to 30 g/L at a liquid temperature of 40 ° C and a pH of 5 for 20 to 120 seconds to spray it onto the nickel-zinc alloy coating formed above. Thereby implementing the process. The thickness of the organic layer was 25 nm.

(Roughening treatment) The roughening treatment 1, the roughening treatment 2, the rust prevention treatment, the chromate treatment, and the decane coupling treatment were sequentially performed under the following conditions. Further, the thickness of the ultra-thin copper foil was set to 3 μm.

‧Coarse processing 1

Liquid composition: copper 10~20g/L, sulfuric acid 50~100g/L

Liquid temperature: 25~50°C

Current density: 1~58A/dm ²

Coulomb amount: 4~81As/dm ²

‧Coarse processing 2

Liquid composition: copper 10~20g/L, nickel 5~15g/L, cobalt 5~15g/L

pH: 2~3

Liquid temperature: 30~50°C

Current density: 24~50A/dm ²

Coulomb amount: 34~48As/dm ²

‧Anti-rust treatment

Liquid composition: nickel 5~20g/L, cobalt 1~8g/L

pH: 2~3

Liquid temperature: 40~60°C

Current density: 5~20A/dm ²

Coulomb amount: 10~20As/dm ²

‧Chromate treatment

Liquid composition: potassium dichromate 1~10g/L, zinc 0~5g/L

pH: 3~4

Liquid temperature: 50~60°C

Current density: 0~2A/dm ²

Coulomb amount: 0~2As/dm ²

‧decane coupling treatment

Coating of diaminodecane aqueous solution (diaminodecane concentration: 0.1 to 0.5 wt%)

Further, regarding the lamination of the respective metal layers, the peel strength was 5 gf/cm and 8 gf/cm.

An aluminum plate of 0.1 mm smaller than the metal layer was placed on the thus obtained laminate. Then, aluminum plate / laminate / prepreg (FR-4 Prepreg (made by Nanya Plastics Co., Ltd.)) / laminate After the lamination of the aluminum sheets was carried out in this order, thermocompression bonding was performed by hot pressing, and then the aluminum sheets were removed to obtain a laminate having the structure shown in Fig. 11. In addition, the prepreg uses a prepreg that is one turn larger than the laminate. Further, an ultra-thin copper foil as a carrier attached to the laminate was laminated on the prepreg from the carrier side to obtain a laminate.

<Experimental Example 7>

A laminate having two laminates having the structure shown in Fig. 12 was produced by using the ultra-thin copper foil with a carrier as a laminate in the following procedure.

The laminate obtained by bringing the metal layers into contact with each other was obtained in the same manner as the procedure shown in Experimental Example 6. Further, regarding the lamination of the respective metal layers, the peel strength was 5 gf/cm and 8 gf/cm.

Then, the laminate/prepreg (FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.))/layered product was laminated in this order, and then thermocompression bonding was performed by hot pressing to obtain a laminate having the structure shown in Fig. 12 . In addition, the prepreg uses a prepreg that is one turn larger than the laminate. Further, an ultra-thin copper foil as a carrier attached to the laminate was laminated on the prepreg from the carrier side to obtain a laminate.

<Experimental Example 8>

A laminate having two laminates having the structure shown in Fig. 13 was produced by using the ultra-thin copper foil with a carrier as a laminate in the following procedure.

A laminate obtained by bringing the metal layers into contact with each other was obtained in the same manner as the procedure shown in Experimental Example 6. Further, regarding the lamination of the respective metal layers, the peel strength was 5 gf/cm and 8 gf/cm.

The laminate and the prepreg thus obtained were laminated in the order of the laminate/prepreg (FR-4 Prepreg)/layered product, and then thermocompression bonded by hot pressing. Thereafter, an aluminum plate having a thickness of 0.1 mm smaller than the metal layer was placed on the surface of the laminate, and an epoxy resin (viscosity 1 Pa.s) was applied to the laminate from the side surface to heat-harden, and then the aluminum plate was removed. Obtained The laminated body of the structure shown in Fig. 13 was obtained. Further, the prepreg is a prepreg having the same size as the laminate when the ultra-thin copper foil is viewed from the laminate. Further, an ultra-thin copper foil as a carrier attached to the laminate was laminated on the prepreg from the carrier side to obtain a laminate.

<Experimental Example 9>

A laminate having two laminates having the structure shown in Fig. 14 was produced by using the ultra-thin copper foil with a carrier as a laminate in the following procedure.

The laminate obtained by bringing the metal layers into contact with each other was obtained in the same manner as the procedure shown in Experimental Example 6. Further, regarding the lamination of the respective metal layers, the peel strength was 5 gf/cm and 8 gf/cm.

An aluminum plate having a thickness of 0.1 mm larger than the metal layer was placed on the laminate thus obtained. Then, the laminate is laminated in the order of the laminate/prepreg (FR-4 Prepreg)/layer laminate, and then thermocompression bonding is performed by hot pressing, and the epoxy resin is further applied to the laminate from the side ( The viscosity was 15 Pa.s), which was heat-hardened, and thereafter the aluminum plate was removed to obtain a laminate having the structure shown in Fig. 14. Further, the prepreg is a prepreg having the same size as the laminate when the ultra-thin copper foil is viewed from the laminate. Further, an ultra-thin copper foil as a carrier attached to the laminate was laminated on the prepreg from the carrier side to obtain a laminate.

FR-4 Prepreg (made by Nanya Plastics Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metal Co., Ltd.) are sequentially superposed on both sides of the laminated body thus formed, on the side where the metal layer (copper foil) is exposed. JTC12μm (trade name)), copper foil (JX12μm (trade name)), FR-4 Prepreg (made by Nanya Plastics Co., Ltd.), copper Foil (manufactured by JX Nippon Mining & Metal Co., Ltd., JTC 12 μm (trade name)) was heat-pressed at 170 ° C for 100 minutes under a pressure of 3 MPa to prepare a four-layer to six-layer copper-clad laminate.

Then, using a laser processing machine, a copper foil which penetrated the surface of the four to six-layer copper clad laminates and a hole of 100 μm in diameter of the insulating layer (precured prepreg) thereunder were punched. Next, copper plating is performed on the copper foil surface of the inner layer and the side surface of the hole and the copper foil on the surface of the 4-6 layer copper-clad laminate which are exposed at the bottom of the hole by electroless copper plating or copper plating. An electrical connection is formed between the copper foil present on the inner layer and the copper foil on the surface of the 4-6 layer copper clad laminate. Then, a part of the copper foil on the surface of the 4 to 6-layer copper clad laminate was etched using a ferric chloride-based etching liquid to form an electric circuit. In this way, 4 to 6 layer build-up substrates can be produced.

Next, after the 4 to 6 layer build-up substrates are cut at the position on the metal layer, the metal layer constituting the laminate is separated from the metal layer and separated, thereby obtaining two sets of 2 to 3 build-up wiring boards.

Next, a copper foil which is a metal layer which is in contact with the metal layer (copper foil) on the two sets of the two to three-layer build-up wiring boards is etched to form wiring, and two sets of two to three multilayer build-up wiring boards are obtained.

Claims (98)

A laminate comprising a metal layer in contact with another metal layer, wherein at least a portion of the outer periphery of the laminate portion is covered with a resin when the metal layer is viewed from above, and the one metal layer of the laminate The ten point average roughness (Rz jis) of the surface on the side in contact with the other metal layer and the ten point average roughness (Rz jis) of the surface of the other metal layer on the side in contact with the one metal layer Either or both are 3.5 μm or less. A laminate which is a laminate formed by detachably contacting one metal layer with another metal layer, wherein at least a part of the outer periphery of the laminate portion is covered with a resin when the metal layer is viewed from the plan, the one of the laminates Ten-point average roughness (Rz jis) of the surface of the metal layer on the side in contact with the other metal layer and ten-point average roughness of the surface of the other metal layer on the side in contact with the one metal layer (Rz jis Either or both of them are 3.5 μm or less. A laminate comprising a laminate formed by bonding one metal layer to another metal layer, wherein at least a portion of the outer periphery of the laminate portion is covered with a resin when the metal layer is viewed from above, and the one metal layer of the laminate The ten point average roughness (Rz jis) of the surface on the side in contact with the other metal layer and the ten point average roughness (Rz jis) of the surface of the other metal layer on the side in contact with the one metal layer Either or both are 3.5 μm or less. A laminate comprising a laminate formed by bonding one metal layer to another metal layer, wherein at least a portion of the outer periphery of the laminate portion is covered with a resin when the metal layer is viewed from above, and the one metal layer of the laminate The ten point average roughness (Rz jis) of the surface on the side in contact with the other metal layer and the ten point average roughness (Rz jis) of the surface of the other metal layer on the side in contact with the one metal layer Either or both are 3.5μm Next, the metal layers can be separated from each other by removing the joint portions of the metal layers. The laminate according to any one of claims 1 to 4, wherein at least a part of the outer periphery of the laminated portion is covered with a resin having a thickness of 5 μm or more when the metal layer is viewed in plan, the thickness of the resin is a plan view. The thickness of the resin covering a portion of the metal layer when the layer is laminated, the thickness of the resin being a thickness along the thickness direction of the metal layer. The laminate according to any one of claims 1 to 4, wherein the entire periphery of the laminate portion is covered with a resin when the metal layer is viewed from above. The laminate according to any one of claims 1 to 4, wherein the metal layer is exposed when the surface of at least one of the metal layers is viewed from above. The laminate according to any one of claims 1 to 4, which is obtained by laminating the metal layers with a release layer. The laminate according to any one of claims 1 to 4, wherein the metal layer has a peel strength of 0.5 gf/cm or more and 200 gf/cm or less. The laminate according to any one of claims 1 to 4, wherein the peeling strength of the metal layer and the metal sheet is 0.5 gf/ after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours. More than cm above 200gf/cm. The laminate according to any one of claims 1 to 4, wherein the resin contains a thermosetting resin. The laminate according to any one of claims 1 to 4, wherein the resin contains a thermoplastic resin. The laminate according to any one of claims 1 to 4, wherein the resin is provided with a hole on the outer side of the metal layer. For example, the laminated body of claim 13 wherein the diameter of the hole is 0.01 mm to 10 mm, and 1 to 10 places are provided. The laminate according to any one of claims 1 to 4, wherein the laminate has pores. For example, the laminated body of claim 15 wherein the diameter of the hole is 0.01 mm to 10 mm, and 1 to 10 places are provided. The laminate according to any one of claims 1 to 4, wherein the at least one metal layer is composed of copper or a copper alloy. A laminate comprising a laminate as defined in any one of claims 1 to 17, which is provided with a hole. For example, the laminated body of claim 18, wherein the hole has a diameter of 0.01 mm to 10 mm and is provided with 1 to 10 places. A laminate which is a laminate as defined in any one of claims 1 to 17 and which is used for the purpose of providing a hole penetrating the laminate and laminating a resin on both sides of the laminate. The wiring layer is laminated on the surface of the resin on both sides of the laminate. A laminate having the laminate of any one of claims 18 to 20. A laminate comprising two or more selected from the group consisting of a laminate as defined in any one of claims 1 to 17 and a laminate of any one of claims 18 to 20. A laminate having a plate-like resin and a laminate which is laminated on both sides of the plate-like resin so that one metal layer is detachably contacted with another metal layer, when the gold is viewed from above At least a part of the outer circumference of the laminate portion is covered with a resin, and the ten-point average roughness (Rz jis) of the surface of the one metal layer of the laminate which is in contact with the other metal layer and the other Either or both of the ten-point average roughness (Rz jis) of the surface of the metal layer on the side in contact with the one metal layer is 3.5 μm or less. The laminate according to claim 23, wherein at least a part of the outer periphery of the laminate portion is covered with a resin having a thickness of 5 μm or more when the metal layer is viewed from above, and the thickness of the resin covers the laminate when the laminate is viewed from above. The thickness of the resin in a portion of the metal layer, the thickness of the resin being the thickness along the thickness direction of the metal layer. The laminate according to claim 23, wherein the entire outer periphery of the laminate portion is covered with a resin when the metal layer is viewed from above. The laminate according to claim 23, wherein the plate-shaped resin is formed integrally with the resin. The laminate according to claim 25, wherein the plate-shaped resin is formed integrally with the resin. The laminate according to claim 23, wherein the plate-shaped resin is formed into a different member from the resin. The laminate according to claim 25, wherein the plate-shaped resin and the resin are formed into different members. The laminate according to any one of claims 23 to 29, wherein the metal layer is bonded to each other using a release layer. The laminate according to any one of claims 23 to 29, wherein the metal layer has a peel strength of 0.5 gf/cm or more and 200 gf/cm or less. The laminate according to any one of claims 23 to 29, wherein the peeling strength of the metal layer to the metal sheet is 0.5 gf/ after heating at 220 ° C for at least one of 3 hours, 6 hours or 9 hours. More than cm above 200gf/cm. The laminate according to any one of claims 23 to 29, wherein the resin contains a thermosetting resin. The laminate according to any one of claims 23 to 29, wherein the resin contains a thermoplastic resin. The laminate according to any one of claims 23 to 29, wherein the resin is provided with a hole on the outer side of the metal layer. For example, the laminated body of claim 35, wherein the hole has a diameter of 0.01 mm to 10 mm and is provided with 1 to 10 places. The laminate according to any one of claims 23 to 29, wherein the at least one metal layer is composed of copper or a copper alloy. A metal layer with a carrier is obtained by cutting a laminate of any one of claims 1 to 17 and 21 to 37 at a level of the metal layer on the surface of the metal layer. A multi-layered laminate, which is a laminate of any one of claims 1 to 17 and 21 to 37, or a laminate as defined in any one of claims 1 to 17, or an application The laminate of any one of the items of the first to eighth aspects of the present invention is formed by laminating a resin layer on the surface area of each of the metal layers. The multi-layered laminate according to claim 39, wherein when the surface of the metal layer is viewed from above, the area of the metal layer is set to Sa, and the area of the two plate-shaped resins is large in plan view. When the area of the plate-like resin is Sb, Sa/Sb is less than 1.0. For example, in the multi-layered laminate of claim 40, which satisfies one or both of the following items, the ratio of Sa to Sb Sa/Sb is 0.6 or more, and the ratio of Sa to Sb is Sa/Sb is 0.80. As described above, the ratio Sa/Sb of Sa to Sb is 0.95 or less. The multi-layer laminate according to claim 39, wherein an area of the two plate-like resins is set to be Sp in a plan view, and an area of the two plate-shaped resins is larger than another plate-like resin in plan view. When the area of the plate-like resin having the same area is Sq, the ratio Sp/Sq of Sp to Sq is 0.001 or more. For example, in the multi-layered laminate of claim 42, which satisfies one or both of the following items, the ratio Sp/Sq of Sp to Sq is 0.2 or less, and the ratio of Sp to Sq is Sp/Sq of 0.20. Hereinafter, the ratio of Sp to Sq, Sp/Sq, is 0.01 or more. The multi-layered laminate according to claim 40, wherein an area of the two plate-shaped resins is set to be Sp in a plan view, and an area of the two plate-shaped resins is larger than another plate-like resin in plan view. When the area of the plate-like resin having the same area is Sq, the ratio Sp/Sq of Sp to Sq satisfies one or both of the following items, or the ratio of Sp to Sq Sp/Sq 0.001 or more, the ratio Sp/Sq of Sp to Sq is 0.2 or less, and the ratio Sp/Sq of Sp to Sq is 0.20 or less. The ratio of Sp to Sq, Sp/Sq, is 0.01 or more. The multi-layered laminate according to claim 41, wherein an area of the two plate-like resins is set to be Sp in a plan view, and an area of the two plate-shaped resins is larger than another plate-like resin in plan view. When the area of the plate-like resin having the same area is Sq, the ratio Sp/Sq of Sp to Sq satisfies one or both of the following items, or the ratio of Sp to Sq Sp/Sq When the ratio is Sp or Sq, the ratio of Sp to Sq is 0.2 or less, the ratio of Sp to Sq is 0.20 or less, and the ratio of Sp to Sq is 0.01 or more. The multilayered laminate according to any one of claims 39 to 45, which is further formed of other metal layers on the surface layer of the respective resins. For example, in the multi-layered laminate of claim 46, when the surface of the metal layer is viewed from above, the size of the other metal layer is larger than the thickness of the metal layer. A multi-layer laminate according to any one of claims 39 to 45, which is a laminate of any one of claims 1 to 17 and 21 to 37, or a patent range 1 to 17. The laminate defined in any one of the items, or the laminate of any one of claims 18 to 20, is provided with a through hole. For example, the multi-layered laminate of claim 46, which is in any one of claims 1 to 17 and 21 to 37, or any one of claims 1 to 17 The defined laminate, or the laminate of any one of claims 18 to 20, is provided with a through hole. For example, the multi-layered laminate of claim 47, which is in the patent application range 1 to 17 And a laminate of any one of clauses 1 to 17 or a laminate of any one of claims 18 to 20, or a laminate of any one of claims 18 to 20. A through hole is provided in the middle. The multi-layered laminate according to claim 48, wherein a hole penetrating the entire multilayered body is provided on the inner side of the hole. The multi-layered laminate according to claim 49, wherein a hole penetrating the entire multilayered laminate is provided on the inner side of the hole. The multi-layer laminate according to claim 50, wherein a hole penetrating the entire multilayered body is provided on the inner side of the hole. A multi-layered laminate obtained by cutting a multi-layered laminate of claim 46 in the layer of the resin and the other metal layer when the surface of the other metal layer is viewed from above. A multi-layered laminate obtained by cutting a multi-layered laminate of the 50th article of the patent application when the surface of the other metal layer is viewed from the surface of the resin and the other metal layer. The multi-layered laminate according to claim 55, wherein a hole penetrating the entire multilayered body is provided on the inner side of the hole. A method for manufacturing a multi-layer metal-clad laminate comprising the steps of: laminating any one of claims 1 to 17 and 21 to 37, or applying any one of claims 1 to 17 The laminate of the layered material defined in any one of claims 18 to 20, or the surface orientation of at least one metal layer of the multilayer laminate of any one of claims 39 to 56, The resin or metal layer is laminated one or more times. A method for manufacturing a multi-layer metal-clad laminate comprises the following steps: The laminate of any of items 1 to 17 and 21 to 37, or the laminate defined in any one of claims 1 to 17, or the application of the scope of claims 18 to 20 A laminated article, or a surface direction of at least one metal layer of a multi-layer laminate according to any one of claims 39 to 56, which is a resin, a single-sided or a double-sided metal-clad laminate, and claims 1 to The laminate of any one of the items of the first to the first of A metal layer with a carrier of claim 38, a multilayer laminated body according to any one of claims 39 to 56, or a metal layer or a metal laminated layer with a resin substrate. A method of manufacturing a multi-layer metal-clad laminate according to the 57th or 58th aspect of the invention, comprising the step of cutting the laminate at least on one side of a layer of the metal layers when the surface of the metal layer is viewed from above. The method for producing a multi-layer metal-clad laminate according to claim 59, further comprising the step of separating the metal layers of the metal layer of the carrier of the laminated layer from each other and separating them. The method for producing a multi-layer metal-clad laminate according to claim 59, further comprising the step of separating the metal layers of the laminated body after cutting and separating them. A method of manufacturing a multi-layer metallized laminate according to claim 60, comprising the step of partially or completely removing one of the metal layers separated by peeling by etching. A method of manufacturing a multi-layer metallized laminate according to claim 61, comprising the step of partially or completely removing one of the metal layers separated by peeling by etching. A multi-layer metal-clad laminate obtained by the manufacturing method of any one of claims 57 to 63. A multi-layer metal-clad laminate obtained by the manufacturing method of any one of claims 60 to 63, which prevents corrosion or erosion of a metal layer caused by penetration of a chemical liquid. A multi-layer metal-clad laminate having a laminate of any one of claims 1 to 17 and 21 to 37, or a laminate as defined in any one of claims 1 to 17. Or a multi-layer laminate of any one of claims 18 to 20, or a surface layer of at least one metal layer provided on the multi-layer laminate One of the resin or metal layers. A multi-layer metal-clad laminate having a laminate of any one of claims 1 to 17 and 21 to 37, or a laminate as defined in any one of claims 1 to 17. Or a multi-layer laminate of any one of claims 18 to 20, or a surface layer of at least one metal layer provided on the multi-layer laminate The laminate selected from the group consisting of a resin, a single-sided or two-sided metal-clad laminate, any one of claims 1 to 17 and 21 to 37, and any one of claims 1 to 17 a laminate of the present invention, a laminate of any one of claims 18 to 20, a metal layer with a carrier of claim 38, a multilayer laminate of any one of claims 39 to 56, One of the layers of the metal layer or the metal layer of the resin substrate is attached. A multi-layer metal-clad laminate according to claim 66 or 67, wherein at least one side of the layer of the metal layers is cut when the metal layer of the plurality of metal-clad laminates is viewed from above. A method for manufacturing a buildup substrate, comprising the steps of: a laminate comprising any one of items 1 to 17 and 21 to 37, or a laminate as defined in any one of claims 1 to 17, or any of claims 18 to 20 A layered product, or a surface direction of at least one metal layer of the multilayered laminate of any one of claims 39 to 56, forming one or more build-up wiring layers. The method for producing a build-up substrate according to claim 69, wherein the build-up wiring layer is formed by at least one of a subtractive method or a full additive method or a semi-additive method. A method for manufacturing a build-up substrate, comprising the steps of: the laminate of any one of claims 1 to 17 and 21 to 37, or any one of claims 1 to 17 The laminated material of the definition, or the surface direction of at least one metal layer of the laminate of any one of claims 18 to 20, the resin, the single-sided or double-sided wiring substrate, the single-sided or double-sided metal-clad laminate, application The laminate of any one of claims 1 to 17 and 21 to 37, the laminate defined in any one of claims 1 to 17, and any one of claims 18 to 20 a laminate of the item, a metal layer with a carrier of the patent application No. 38, a multilayer laminate of any one of claims 39 to 56, a metal layer with a resin substrate, a wiring, a circuit or a metal laminate 1 More than once. The method for manufacturing a build-up substrate according to claim 71, further comprising the steps of: single-sided or double-sided wiring substrate, single-sided or double-sided metal-clad laminate, metal layer of laminated body, resin of laminated body, metal The layer, the resin of the metal layer with the carrier, the metal layer of the metal layer with the carrier, the metal layer of the multilayer laminate, the resin of the multilayer laminate, the other metal layer of the multilayer laminate, the resin of the metal layer with the resin substrate, and the The metal layer or the resin of the metal layer of the resin substrate is perforated, and the side surface and the bottom surface of the hole are electrically plated. The method for manufacturing a build-up substrate according to claim 71 of the patent application, which further comprises the following steps The metal layer constituting the single-sided or double-sided wiring board, the metal layer constituting the single-sided or double-sided metal-clad laminate, the metal layer constituting the laminate, the metal layer constituting the metal layer with the carrier, and the plurality of layers are sequentially performed. At least one of the metal layer of the laminate, the resin of the multilayer laminate, the other metal layer of the multilayer laminate, the metal layer of the metal layer with the resin substrate, and the metal layer forms wiring. The method for producing a build-up substrate according to claim 72, further comprising the step of: forming a metal layer constituting the single-sided or double-sided wiring substrate, and a metal constituting the single-sided or double-sided metal-clad laminate a layer, a metal layer constituting the laminate, a metal layer constituting the metal layer with the carrier, a metal layer of the multilayer laminate, a resin of the multilayer laminate, another metal layer of the multilayer laminate, a metal layer of the metal layer with the resin substrate, and At least one of the metal layers forms a wiring. The method for producing a build-up substrate according to any one of claims 71 to 74, further comprising the step of: stacking the patent claims in items 1 to 17 and items 21 to 37 on the surface after the wiring is formed a laminate of any one, or a metal layer attached to the carrier of claim 38, or a laminate as defined in any one of claims 1 to 17, or in the scope of claims 18 to 20 A laminate of any one of the above, or a multi-layer laminate of any one of claims 39 to 56. The method for producing a build-up substrate according to any one of claims 69 to 74, comprising the step of cutting the laminate at least one side of a layer of the metal layers when the surface of the metal layer is viewed from above. A method of manufacturing a build-up wiring board according to any one of claims 69 to 74, further comprising the step of: depositing the layered carrier The metal layers of the metal layer are separated from each other and separated. A method of manufacturing a build-up wiring board according to claim 77, further comprising the step of removing part or all of the metal layer separated by peeling by etching. A method for producing a build-up wiring board according to the 76th aspect of the invention, further comprising the step of separating the metal layers of the laminated body after separation and separating the metal layers. The method of manufacturing a build-up wiring board according to claim 79, further comprising the step of removing part or all of the metal layer separated by peeling by etching. A build-up wiring board obtained by the manufacturing method of any one of claims 77 to 80. A method of manufacturing a printed circuit board, comprising the steps of: manufacturing a build-up wiring board by the manufacturing method of any one of claims 77 to 80. A method for manufacturing a multi-layer metal-clad laminate comprising the steps of: laminating any one of claims 1 to 17 and 21 to 37, or applying for patents 1 to 17 The resin layer is laminated one or more times in a planar direction of a defined laminate or a two-layer metal layer of the laminate of any one of claims 18 to 20. For example, in the method for producing a multi-layer metal-clad laminate according to claim 83, the other metal layers are laminated one or more times on the surface of the respective resin. A multi-layer metallized laminate obtained by the manufacturing method of claim 83 or 84. A method for manufacturing a build-up substrate comprising the steps of: laminating the material of any one of claims 1 to 17 and 21 to 37, or applying for patents 1 to 17 The layered material defined in any one of the items, or the surface direction of the two metal layers of the laminate of any one of claims 18 to 20, each of which is laminated one or more times in this order. The method for producing a build-up substrate according to claim 86, further comprising the step of perforating the other metal layer and the resin, and conducting the plating on the side surface and the bottom surface of the hole. According to the method for producing a build-up substrate of claim 86, the method further comprises the step of forming a wiring on at least one of the other metal layers. In the method for producing a build-up substrate according to claim 87, the method further comprises the step of forming a wiring on at least one of the other metal layers. The method for manufacturing a build-up substrate according to claim 88, further comprising the steps of: laminating the laminate of any one of claims 1 to 17 and 21 to 37 on the surface on which the wiring is formed, A metal layer with a carrier of claim 38 or a multilayer laminate of any one of claims 39 to 56. The method for manufacturing a build-up substrate according to claim 89, further comprising the steps of: laminating the laminate of any one of claims 1 to 17 and 21 to 37 on the surface on which the wiring is formed, A metal layer with a carrier of claim 38 or a multilayer laminate of any one of claims 39 to 56. The method for producing a build-up substrate according to any one of claims 86 to 91, comprising the step of cutting the laminate at least one side of a layer of the metal layers when the surface of the metal layer is viewed from above. A method for manufacturing a build-up wiring board, which is in any one of claims 86 to 91 The method for producing a build-up substrate further includes the step of separating the metal layers of the laminated body of the laminated layer and separating them. A method for producing a build-up wiring board, which further comprises the step of separating the metal layers of the laminated body after cutting and separating the layers. A method of manufacturing a build-up wiring board according to claim 93 or 94, further comprising the step of removing part or all of the metal layer separated by peeling by etching. A build-up wiring board obtained by the manufacturing method of any one of claims 93 to 95. A build-up wiring board obtained by the manufacturing method of any one of claims 93 to 95, which prevents corrosion or erosion of a metal layer caused by penetration of a chemical liquid. A method of manufacturing a printed circuit board, comprising the steps of: manufacturing a build-up wiring board by the manufacturing method of any one of claims 93 to 95.