TWI550465B - Touch device - Google Patents

Description

Touch device

The invention relates to a touch device.

In recent years, with the continuous development of touch technology, touch devices have been widely used in various electronic products such as mobile phones, personal digital assistants (PDAs), game console input interfaces, and computer touch screens. In practical applications, the touch device is usually combined with a flat panel display (FPD) to form a touch panel for mounting on various electronic products. Users input data and commands through the touch panel instead of traditional input devices such as keyboards and mice, which bring great convenience to users.

Generally, the transparent conductive substrate of the touch device is mainly formed with a transparent conductive layer on a transparent substrate as a sensing circuit layer and a signal circuit layer electrically connected to the sensing circuit layer. It should be noted here that the transparent conductive layer is usually made of indium tin oxide (ITO) having brittleness, and the signal circuit layer is made of silver glue which is difficult to resist deflection and bending. (Ag paste). Therefore, if the existing flexible touch device is bent or even flexed for a long period of time, the resistance of the sensing circuit layer and the signal circuit layer will be greatly improved, so that the existing flexible touch device is In actual operation, there is still insufficient stability. problem.

According to the above description, the electrical characteristics of the touch device are improved to prevent the resistance of the sensing circuit layer and the signal circuit layer of the touch device from being improved due to long-term bending, and the operational stability of the touch device is insufficient. The problem is a difficult problem to be solved by relevant technical personnel in this technical field.

Therefore, the object of the present invention is to provide a touch device that improves the resistance of the touch device due to bending and slows down the operation stability of the touch device.

Therefore, the touch device of the present invention comprises: a flexible substrate unit, a sensing circuit layer disposed on the flexible substrate unit, a signal circuit layer disposed on the flexible substrate unit and electrically connected to the sensing circuit layer, and A thermoplastic resin layer unit partially covering and contacting the signal wiring layer.

Preferably, the signal line layer has a plurality of line segments and a plurality of bonding pad sections corresponding to the respective line segments, the circuit segments being respectively connected between the sensing circuit layer and each bonding pad segment, the thermoplastic resin The layer unit covers the line segments of the signal line layer and correspondingly exposes the bond pad segments.

Preferably, the thermoplastic resin layer unit has a plurality of openings, and the signal circuit layer has a plurality of circuit segments and a plurality of bonding pad segments correspondingly connected to the respective circuit segments, and the circuit segments are respectively connected between the sensing circuit layer and each bonding pad segment. The thermoplastic resin layer unit covers each of the signal circuit layers The peripheral edge of the mat segment is partially exposed, and each of the openings partially exposes an intermediate portion of each of the mat segments.

Preferably, the signal circuit layer is composed of silver paste; the thermoplastic resin layer unit material comprises one of polyphenylene sulfide (PPS), an insulating ink and a photoresist; the thickness of the thermoplastic resin layer unit is Between 8μm and 24μm.

Preferably, the touch device of the present invention further comprises a light transmissive resin layer unit covering the sensing circuit layer, and the sensing circuit layer is composed of Ag nanowires.

Preferably, the thickness of the sensing circuit layer is between 20 nm and 150 nm.

Preferably, the nanowire of the sensing circuit layer has a length between 1 μm and 50 μm and a wire diameter between 20 nm and 50 nm.

Preferably, the light transmissive resin layer unit has an average surface roughness (Ra) and Ra ≦ 0.2 μm.

Preferably, the thickness of the light transmissive resin layer unit is between 80 nm and 400 nm.

Preferably, an embodiment of the touch device of the present invention further comprises a first optical clear adhesive (OCA) layer. The flexible substrate unit has a first flexible substrate and a second flexible substrate. The first flexible substrate and the second flexible substrate each have a visible area and a wiring area adjacent to the visible area thereof. The sensing circuit layer has a plurality of first sensing lines and a plurality of second sensing lines. The first sensing lines and the second sensing lines are respectively disposed on the visible area of the first flexible substrate. The visible areas of the second flexible substrate are staggered with each other. The signal circuit layer includes a plurality of first signal lines electrically isolated from each other and a plurality of second signal lines electrically isolated from each other, and the first signal lines and the second signal lines are respectively connected to the first sensing lines and the respective The second sensing lines are respectively disposed on the wiring area of the first flexible substrate and the wiring area of the second flexible substrate. The thermoplastic resin layer unit includes a first thermoplastic resin layer partially covering the first signal lines, and a second thermoplastic resin layer partially covering the second signal lines. The first optical adhesive layer is attached to the first flexible substrate and the second flexible substrate disposed opposite to each other. More preferably, in the embodiment of the touch device of the present invention, a second optical adhesive layer and a transparent protective cover are attached, and the second optical adhesive layer is attached to the second flexible substrate and the transparent protective cover. .

Preferably, in another embodiment of the touch device of the present invention, a plurality of bridge lines and a light transmissive resin layer unit are further included. The flexible substrate unit has a first flexible substrate having a visible area and a wiring area adjacent to the visible area thereof. The sensing circuit layer has a plurality of first sensing lines and a plurality of second sensing lines. The first sensing lines and the second sensing lines are respectively disposed in the visible area of the first flexible substrate, and each of the first sensing lines has a majority of each other. Each of the second sensing lines has a plurality of sensing segments spaced apart from each other, and the sensing segments of the second sensing circuits are respectively located on the first sensing circuit. The sides of the connecting segment. The light transmissive resin layer unit has a first light transmissive resin layer covering the first sensing lines and the second sensing lines, and the first light transmissive resin layer has a plurality of pairs The through holes are located at opposite ends of each of the two adjacent sensing segments of each of the second sensing lines. The bridge lines respectively fill each pair of through holes to electrically connect each two adjacent sensing segments of each of the second sensing lines. The signal circuit layer includes a plurality of first signal lines electrically isolated from each other and a plurality of second signal lines electrically isolated from each other, and the first signal lines and the second signal lines are respectively connected to the first sensing lines and the respective The second sensing lines are respectively disposed on the wiring areas of the first flexible substrate. The thermoplastic resin layer unit includes a first thermoplastic resin layer partially covering the first signal lines, and a second thermoplastic resin layer partially covering the second signal lines. More preferably, in another embodiment of the touch device of the present invention, the method further includes a first optical adhesive layer and a transparent protective cover, the first optical adhesive layer is attached to the first flexible substrate and the transparent Protective cover.

Still more preferably, the transparent protective cover of the embodiments is selected from a 2-dimensional (2D) planar substrate, a 2.5 dimensional (2.5D) curved substrate, or a 3-dimensional (3D) curved substrate.

More preferably, each of the first signal lines and the second signal lines of the embodiments of the present invention respectively have a line segment and a bonding pad segment correspondingly connected to the line segment, and each of the first signal lines and each of the second signal lines The line segments of the signal lines respectively connect the first sensing lines and the second sensing lines, and the first thermoplastic resin layer and the second thermoplastic resin layer respectively have the openings, and the openings of the first thermoplastic resin layer Correspondingly, an intermediate portion of the bonding pad segment of each of the first signal lines is partially exposed, and each opening of the second thermoplastic resin layer partially exposes each of the second signal lines An intermediate region of the mat segment.

The effect of the present invention is that the resistance of the circuit layer of the touch device can be avoided for a long time or multiple times by partially covering the thermoplastic resin layer unit of the signal line layer and the light transmissive resin layer unit covering the sensing circuit layer. The bending is used to improve and slow down the problem of insufficient operational stability of the touch device.

2‧‧‧Soft substrate unit

21‧‧‧First flexible substrate

211‧‧‧visible area

212‧‧‧ wiring area

22‧‧‧Second flexible substrate

221‧‧‧visible area

222‧‧‧ wiring area

3‧‧‧Induction circuit layer

31‧‧‧First sensing line

311‧‧‧ Sensing section

312‧‧‧ Connection section

32‧‧‧Second sensing line

321‧‧‧ Sensing section

4‧‧‧Signal circuit layer

41‧‧‧First signal line

411‧‧‧ line segment

412‧‧‧Joint pad

42‧‧‧second signal line

421‧‧‧ line segment

422‧‧‧bonding pad

5‧‧‧ thermoplastic resin layer unit

51‧‧‧First thermoplastic resin layer

511‧‧‧ openings

52‧‧‧Second thermoplastic resin layer

521‧‧‧ openings

6‧‧‧Transparent resin layer unit

61‧‧‧First light transmissive resin layer

611‧‧‧through holes

62‧‧‧Second light transmissive resin layer

71‧‧‧First flexible printed circuit board

72‧‧‧Second flexible printed circuit board

73‧‧‧ Anisotropic conductive adhesive

81‧‧‧First optical layer

82‧‧‧Second optical layer

9‧‧‧Transparent protective cover

91‧‧‧Bridge line

X‧‧‧ first direction

Y‧‧‧second direction

Other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a front elevational cross-sectional view showing a first embodiment of the touch device of the present invention; FIG. 2 is a partial view. A perspective view showing a detailed structure of a plurality of first sensing lines and a plurality of first signal lines in the first embodiment of the present invention; and FIG. 3 is a partial perspective view showing a majority of the second sensing lines and the majority in the first embodiment of the present invention; FIG. 4 is a front elevational cross-sectional view showing a second embodiment of the touch device of the present invention; FIG. 5 is a front elevational cross-sectional view showing a third embodiment of the touch device of the present invention; 6 is a partial perspective view illustrating a detailed structure of a first functional film of a fourth embodiment of the touch device of the present invention; FIG. 7 is a partial perspective view showing a second embodiment of the touch device of the present invention. Detailed structure of the functional film; FIG. 8 is a partial top view showing a touch device of the present invention 5 is a detailed sectional view of a sensing circuit layer and a signal circuit layer; FIG. 9 is a partial cross-sectional view taken along line IX-IX of FIG. 8, illustrating a film layer of the detail of the fifth embodiment of the present invention. FIG. 10 is a partial top plan view showing a detailed structure of a sensing circuit layer and a signal circuit layer in a sixth embodiment of the touch device of the present invention; FIG. 11 is a graph showing a resistance versus bending times, illustrating the present invention. The electrical characteristics of the signal line layer of a comparative example 5 (CE5) of the touch device; and FIG. 12 is a graph of the resistance versus bending times, illustrating a specific example 5 (E5) of the flexible touch device of the present invention. The electrical characteristics of the signal line layer.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

<Detailed Description of the Invention>

Referring to FIG. 1, FIG. 2 and FIG. 3, a first embodiment of the touch device of the present invention is applied to a flat panel display (not shown). The embodiment of the present invention is exemplified by a capacitive touch device, but is not limited thereto. The first embodiment of the present invention comprises: a flexible substrate unit 2, a sensing circuit layer 3 disposed on the flexible substrate unit 2, and a signal line disposed on the flexible substrate unit 2 and electrically connected to the sensing circuit layer 3. a layer 4, a thermoplastic resin layer unit 5 partially covering and contacting the signal line layer 4, a light transmissive resin layer unit 6 covering the sensing circuit layer 3, and a first flexible printed circuit board (FPC) A second flexible printed circuit board 72, a first optical adhesive layer 81, a second optical adhesive layer 82, and a transparent protective cover 9.

Preferably, the material of the thermoplastic resin layer unit 5 is a thermoplastic resin material having high mechanical properties, such as insulating ink, photoresist, polyphenylene sulfide (PPS), etc., which can be formed by processes such as printing, coating, transfer, and the like. Signal line layer 4. The thickness of the thermoplastic resin layer unit 5 is between 8 μm and 24 μm. The thickness of the light transmissive resin layer unit 6 is between 80 nm and 400 nm, and has an average surface roughness Ra and Ra ≦ 0.2 μm. Here, the average surface roughness Ra ≦ 0.2 μm of the light-transmitting resin layer unit 6 of the present invention can reduce the haze of the light-transmitting resin layer unit 6. More preferably, the light transmissive resin layer unit 6 is composed of a thermoplastic polymer paste, and the thermoplastic polymer gel is a light transmissive resin such as polymethyl methacrylate (PMMA). In the first embodiment of the present invention, the thermoplastic resin layer unit 5 is polyphenylene sulfide (PPS); and the thermoplastic polymer paste is polymethyl methacrylate (PMMA).

More specifically, the flexible substrate unit 2 of the first embodiment of the present invention has a first flexible substrate 21 and a second flexible substrate 22 disposed opposite each other. The first flexible substrate 21 and the second flexible substrate 22 respectively have a visible area 211, 221, and a wiring area 212, 222 adjacent to the visible areas 211, 221 thereof, and the usual wiring areas 212, 222 are respectively located around the visible area or At least one side. In the first embodiment of the present invention, the flexible substrate unit 2 is made of polyethylene terephthalate (PET).

The sensing circuit layer 3 has a plurality of first sensing lines 31 and a plurality of second sensing lines 32. The first sensing line 31 and the second sensing lines 32 are respectively disposed on the visible area 211 of the first flexible substrate 21 and the first The visible area 221 of the two flexible substrates 22, and the first sensing line 31 and the second sensing lines 32 are alternately arranged. Specifically, the first sensing lines 31 respectively extend along a first direction X and are spaced apart from each other along a second direction Y substantially perpendicular to the first direction X. The second sensing lines 32 respectively extend along the second direction Y and are spaced apart from each other along the first direction X. In the first embodiment of the present invention, the sensing circuit layer 3 is formed by a nano silver wire to improve the flexibility of the touch device; the thickness of the sensing circuit layer 3 is between 20 nm and 150 nm; The nanowire of the wiring layer 3 has a length of between 1 μm and 50 μm and a wire diameter of between 20 nm and 50 nm.

The signal line layer 4 includes a plurality of first signal lines 41 that are electrically isolated from each other and a plurality of second signal lines 42 that are electrically isolated from each other. The first signal lines 41 and the second signal lines 42 are respectively connected to the first sensing lines 31 and the second sensing lines 32, and are respectively disposed on the wiring area 212 and the second of the first flexible substrate 21. The wiring region 222 of the flexible substrate 22. Each of the first signal line 41 and each of the second signal lines 42 has a line segment 411, 421 corresponding to each of the first sensing line 31 and each of the second sensing lines 32, and a bonding pad correspondingly connected to each of the line segments 411, 421 Segments 412, 422. In the first embodiment of the invention, the material of the signal line layer 4 is composed of silver paste.

The thermoplastic resin layer unit 5 includes a first thermoplastic resin layer 51 and a second thermoplastic resin layer 52, and each of the thermoplastic resin layers 51, 52 has a thickness of between 8 μm and 24 μm. Referring to FIG. 2 and FIG. 3, the first thermoplastic resin layer 51 partially covers the first signal lines 41, and Exposing at least a portion of the bond pad segment 412 in the first signal line 41 so that the bond pad segment 412 can be electrically coupled to the first flexible printed circuit board 71; the second thermoplastic resin layer 52 partially covering the second Signal line 42 and at least a portion of bond pad segment 422 in second signal line 42 are exposed to facilitate bonding of bond pad segment 422 to second flexible printed circuit board 72.

The light transmissive resin layer unit 6 has a first light transmissive resin layer 61 covering the first sensing lines 31, and a second light transmissive resin layer 62 covering the second sensing lines 32, and each The thickness of the light transmissive resin layers 61, 62 is between 80 nm and 400 nm.

It is to be noted that the first embodiment of the present invention covers the first light transmissive resin layer 61 and the second light transmissive resin layer on each of the first sensing line 31 and each of the second sensing lines 32. 62. The adhesion between each of the first sensing lines 31 and the second sensing lines 32 and the first flexible substrate 21 and the second flexible substrate 22 can be increased, and the first sensing lines 31 and the second sensing lines 32 can be improved. It is flexible and protects each of the first sensing lines 31 and the second sensing lines 32 from being oxidized or eroded, and reduces the haze of the touch device. The first thermoplastic resin layer 51 and the second thermoplastic resin layer 52 are partially covered on the first signal line 41 and the second signal line 42, respectively, since the first thermoplastic resin layer 51 and the second thermoplastic resin layer 52 have High mechanical properties, strong restoring force after compression or bending deformation, so that adhesion of the first signal line 41 to the first flexible substrate 21 and adhesion of the second signal line 42 to the second flexible substrate 22 can be increased. The flexibility of the first signal line 41 and the second signal line 42 is improved to avoid the first sensing line 31, the second sensing line 32, and the first signal of the first embodiment of the present invention. The resistance of the line 41 and the second signal line 42 is increased by being used for a long time of bending, and thereby the operational stability of the touch device is improved.

The circuit of the first flexible printed circuit board 71 and the second flexible printed circuit board 72 is electrically connected to the first signal of the signal line layer 4 through an anisotropic conductive paste (ACP) 73, respectively. The line 41 and the second signal line 42 engage the pad segments 412, 422.

The first optical adhesive layer 81 is bonded to the first flexible substrate 21 and the second flexible substrate 22 , and the second optical adhesive layer 82 is bonded to the second flexible substrate 22 and the transparent protective cover 9 . Specifically, the first flexible substrate 21 and the second flexible substrate 22 may be oppositely disposed on the first and second sensing lines 31 and 32 formed thereon, such that the first optical adhesive layer 81 is located on the first sensing circuit. 31 and the second sensing line 32 (not shown); further, the first flexible substrate 21 and the second flexible substrate 22 may also be formed on the first and second sensing lines 31, 32 toward the transparent protective cover The first optical layer 81 is located between the first sensing line 31 and the second flexible substrate 22 (as shown in FIG. 1); or the first flexible substrate 21 and the second flexible substrate 22 are also The first and second sensing lines 31 and 32 formed thereon are all facing away from the transparent protective cover 9 so that the first optical adhesive layer 81 is located between the second sensing line 32 and the first flexible substrate 21 ( The figure is not shown). The transparent protective cover 9 suitable for the present invention is a flexible planar substrate selected from a two-dimensional (2D), a 2.5-dimensional (2.5D) curved substrate, or a three-dimensional (3D) curved substrate. Wherein, the flexible planar substrate may be selected from the group consisting of acrylic (PMMA), polyvinyl chloride (PVC), polypropylene (PP), polyethylene terephthalate (PET), and polyethylene naphthalate. Ester (PEN), polycarbonate (PC), polystyrene (PS) Any of them. In the first embodiment of the invention, the transparent protective cover 9 is a two-dimensional flexible planar substrate.

As can be seen from the detailed description of the first embodiment of the present invention, the touch device of the first embodiment is a double-layer functional film. For example, the first functional film includes the first flexible substrate 21 and the first sensing lines 31 and the first signal lines 41 disposed thereon, and the first thermoplastic partially covering the first signal lines 41. a resin layer 51 and a first light transmissive resin layer 61 covering the first sensing lines 31; similarly, the second functional film includes a second flexible substrate 22 and the second sensing lines 32 disposed thereon The second signal line 42 and the second thermoplastic resin layer 52 partially covering the second signal lines 42 and the second light transmissive resin layer 62 covering the second sensing lines 32.

Referring to FIG. 4, the second embodiment of the touch device of the present invention is substantially the same as the first embodiment, except that the transparent protective cover 9 of the second embodiment of the present invention is a 2.5-dimensional curved glass. board.

Referring to FIG. 5, the third embodiment of the touch device of the present invention is substantially the same as the first embodiment, except that the transparent protective cover 9 of the third embodiment of the present invention is a three-dimensional curved glass. board.

The second embodiment and the third embodiment of the present invention use a 2.5-dimensional curved glass plate and a 3-dimensional curved glass plate as the transparent protective cover 9, which is mainly intended to modify and hide the first signal line 41, The second signal line 42. Further, based on the first signal line 41 and the second signal line 42 of the second and third embodiments, a curved glass plate corresponding to 2.5-dimensional or 3-dimensional is disposed, and the first signal line 41 and the second signal line 42 are also subjected to through The deformation of the protective cover 9 is caused to be deflected. However, it is to be noted here that the first thermoplastic resin layer 51 and the second thermoplastic resin layer 52 respectively covering the signal lines 41, 42 can effectively slow down the first signal line 41 and the first The rate of change in resistance of the two signal lines 42 due to deflection.

Referring to FIG. 6 and FIG. 7, a fourth embodiment of the touch device of the present invention is substantially the same as the embodiments, and the difference is that the first functional film (see FIG. 6) and the second functional film (see FIG. 6) The detailed structure of Fig. 7) is different from the previous embodiment. That is, in the fourth embodiment of the present invention, the first thermoplastic resin layer 51 and the second thermoplastic resin layer 52 of the thermoplastic resin layer unit 5 have a plurality of openings 511, 521, respectively. The first thermoplastic resin layer 51 of the thermoplastic resin layer unit 5 covers and contacts the peripheral edge of each of the bonding pad segments 412 of the first signal lines 41, and the respective openings 511 of the first thermoplastic resin layer 51 are partially exposed. An intermediate portion of the bonding pad segment 412 of each of the first signal lines 41 (other than the periphery of the bonding pad segment 412); the second thermoplastic resin layer 52 of the thermoplastic resin layer unit 5 covers and contacts the second signal lines 42 a peripheral edge of each of the bonding pad segments 422, and each opening 521 of the second thermoplastic resin layer 52 correspondingly partially exposes an intermediate portion of the bonding pad segment 422 of each of the second signal lines 42 (except for the periphery of the bonding pad segment 422) Other areas). The exposed portions of the bond pad segments 412, 422 are for electrical bonding with the flexible printed circuit board.

It is worth mentioning here that the fourth embodiment of the present invention usually passes through a plurality of photolithography processes and etching processes during the manufacturing process, for example, using lithography and etching. The sensing lines 31 and 32 are formed, and the openings 511 and 521 of the thermoplastic resin layers 51 and 52 of the fourth embodiment of the present invention are designed such that the first signal lines 41 and the second signal lines 42 are respectively subjected to the first The thermoplastic resin layer 51 and the second thermoplastic resin layer 52 are effectively covered to avoid the bonding pad section 412 and the second signal lines 42 of the first signal lines 41 in the actual manufacturing process of the fourth embodiment of the present invention. The side surface of the bonding pad segment 422 is corroded by the wet etchant, and the adhesion between the first and second bonding pad segments 412 and 422 and the first and second flexible substrates 21 and 22, respectively, can be improved to prevent peeling off. Thereby, the reliability between the bonding pad segments 412, 422 of the first and second signal lines 41, 42 and the respective flexible printed circuit boards 71, 72 (not shown) is improved.

Referring to FIG. 8 and FIG. 9, the fifth embodiment of the touch device of the present invention is substantially the same as the first, second, and third embodiments, and the difference is that the touch is performed in the fifth embodiment of the present invention. The device includes a single functional film, and the structure of the sensing circuit layer 3 is different from the foregoing embodiment. In this embodiment, the sensing circuit layer 3 further includes a plurality of bridging lines 91, and the fifth embodiment only includes the first optical adhesive layer 81; Further, the detailed structure of the flexible substrate unit 2, the sensing circuit layer 3, the signal wiring layer 4, the thermoplastic resin layer unit 5, and the light transmissive resin layer unit 6 is different from the above embodiments.

Specifically, the flexible substrate unit 2 has the first flexible substrate 21, and the first flexible substrate 21 has the visible region 211 and the wiring region 212 adjacent to the visible region 211 thereof.

The sensing circuit layer 3 has the first sensing lines 31 and the second sensing lines 32. The first sensing lines 31 and the second sensing lines 32 are respectively disposed on the visible area 211 of the first flexible substrate 21, and The electrodes are electrically insulated from each other on the same surface of the first flexible substrate 21. The first sensing lines 31 respectively extend along the first direction X and are spaced apart from each other along the second direction Y. Each of the first sensing lines 31 has a plurality of sensing segments 311 spaced apart from each other, and a plurality of connecting segments 312 connecting each of the two adjacent sensing segments 311. Each of the second sensing lines 32 has a plurality of sensing segments 321 spaced apart from each other along the second direction Y, and the sensing segments 321 of the second sensing circuits 32 are respectively located at two sides of the connecting portion 312 of the first sensing circuit 31, for example The circumferences of the sensing sections 321 of the second sensing line 32 are two adjacent sensing sections 311 spaced apart from each other by four adjacent first sensing lines 31.

The translucent resin layer unit 6 has the first light transmissive resin layer 61 covering the first inductive lines 31 and the second inductive lines 32, and the thickness of the first translucent resin layer 61 is Between 80nm and 400nm. The first light transmissive resin layer 61 has a plurality of through holes 611 which are spaced apart along the second direction Y, and each of the pair of through holes 611 is located at every two phases of each of the second sensing lines 32. Adjacent to the opposite ends of the sensing section 321 .

The bridge lines 91 are respectively formed on the first light transmissive resin layer 61 at intervals in the second direction Y, and each of the pair of through holes 611 is filled to electrically connect each of the two adjacent sensing lines of the second sensing lines 32. Segment 321.

The signal line layer 4 includes the first signal lines 41 electrically isolated from each other and the second signal lines 42 electrically isolated from each other. The first signal lines 41 and the second signal lines 42 are respectively connected to the first sensing lines 31 and the second sensing lines 32, and are respectively disposed in the wiring regions 212 of the first flexible substrate 21.

The thermoplastic resin layer unit 5 includes the first thermoplastic resin layer 51 and the second thermoplastic resin layer 52, and each of the thermoplastic resin layers 51, 52 has a thickness of between 8 μm and 12 μm. The first thermoplastic resin layer 51 partially covers and contacts the first signal lines 41. The second thermoplastic resin layer 52 partially covers and contacts the second signal lines 42 and exposes the bonding pad segments in the first signal line 41. At least a portion of the 412 is adapted to facilitate electrical engagement of the bond pad segment 412 with the first flexible printed circuit board 71. The first optical adhesive layer 81 is attached to the first flexible substrate 21 and the transparent protective cover 9 and exposes at least a portion of the bonding pad segment 422 in the second signal line 42 so that the bonding pad segment 422 can The second flexible printed circuit board 72 is electrically coupled.

It should be noted that, in the embodiment shown in FIG. 8 and FIG. 9 , the first signal line 41 and the second signal lines 42 are respectively located in the wiring area 212 on the adjacent sides of the visible area 211 , in other embodiments. The first signal line 41 and the second signal lines 42 may be concentrated on the wiring area 212 on the same side of the visible area 211 according to the wiring design. Thus, the thermoplastic resin layer unit 5 can cover the first signal line 41 and the second signal line 42 at the same time in a single chip. In addition, the structure of the inductive wiring layer 3 is not limited to the biaxial conductive structure shown in the drawing, and may be a structure of a uniaxial or single conductive block.

Referring to FIG. 10, a sixth embodiment of the touch device of the present invention is substantially the same as the fifth embodiment, except that the first thermoplastic resin layer 51 of the thermoplastic resin layer unit 5 and the second thermoplastic The resin layers 52 have the openings 511 and 521, respectively. The first thermoplastic resin layer 51 of the thermoplastic resin layer unit 5 covers the peripheral edge of each of the bonding pad segments 412 of the first signal lines 41, and the openings 511 of the first thermoplastic resin layer 51. Correspondingly, an intermediate portion of the bonding pad segment 412 of each of the first signal lines 41 is partially exposed; the second thermoplastic resin layer 52 of the thermoplastic resin layer unit 5 covers one week of each bonding pad segment 422 of the second signal lines 42. The edge 521 and the respective openings 521 of the second thermoplastic resin layer 52 partially expose an intermediate portion of the bonding pad section 422 of each of the second signal lines 42. The exposed portions of the bond pads 412, 422 are used to electrically engage the flexible printed circuit boards 71, 72, respectively.

For a person skilled in the art to understand in detail the method for fabricating the functional film of the touch device of the present invention, the functional film of the first embodiment of the present invention is taken as an example and will be briefly described below. In addition, since the first embodiment of the present invention is a structure using two functional films, the structure and the manufacturing method of the two are substantially the same, and therefore, only the first functional film (ie, the first flexible substrate 21, and the respectively The first sensing circuit 31 and the first signal lines 41 formed on the visible region 211 of the first flexible substrate 21 and the wiring region 212, and the first thermoplastic resin layer 51 partially covering the first signal lines 41 The method of manufacturing the first light transmissive resin layer 61) covering the first sensing lines 31 will be described.

First, a nano silver wire solution mixed with isopropyl alcohol (IPA) and nano silver wire is applied onto the visible region 211 of the first flexible substrate 21 and dried to form a thickness. A nano silver wire film having a sheet resistance between 10 nm and 150 nm and having a sheet resistance of between 10 Ω/□ and 200 Ω/□. After the nanosilver film is completed, a first light transmissive resin layer 61 having a thickness of between 80 nm and 400 nm is coated on the nanosilver film by PMMA. Further, a picture is printed on the first light transmissive resin layer 61 An etch-resistant ink layer is patterned to define an etched region on the nano-silver film that is not covered by the patterned etch-resistant ink layer, and an etchant is used to penetrate the first etchant The photo-resin layer 61 is removed and the nano-silver film of the etched region is removed, and thus each of the first sensing lines 31 is formed. Subsequently, the patterned anti-etching layer is removed with an alkaline etchant. Then, silver paste is screen printed on the wiring region 212 of the first flexible substrate 21 to form the first signal lines 41, and polyphenylene sulfide (PPS) is coated on each of the first signal lines 41 and After hardening, the first thermoplastic resin layer 51 is formed.

The functional film obtained by the above-described production method of the present invention is analyzed by a surface roughness meter, and the average surface roughness Ra before and after the application of the first light-transmitting resin layer 61 is about 0.457 μm and 0.165 μm, respectively. .

Further, the touch device according to the first embodiment of the present invention can be applied to a liquid crystal display panel. Therefore, the first functional film of the present invention obtained by the production method of the above embodiment further analyzes its optical properties and is simply integrated in the following Table 1. In Table 1, the first functional film before and after the application of the first light-transmitting resin layer 61 is represented by "before coating" and "after coating", before and after coating. The first functional film is respectively taken at five positions for optical property analysis, and the color coordinate value includes brightness and a and b values; wherein brightness and a and b values are analyzed twice at each position, and are taken after analysis. average value.

Note 2: The b value is negative for the chromaticity blue; the b value is positive for the chromatic yellow.

As can be seen from the above Table 1. The optical properties of the first functional film of the first embodiment of the present invention did not change too much before and after the application of the first light-transmitting resin layer. Further, after the first functional film of the first embodiment of the present invention is coated with the first light-transmitting resin layer 61, the average haze (H) thereof is remarkably lowered to 1.12 due to the decrease in the average surface roughness Ra. Therefore, the first light transmissive resin layer 61 can reduce the surface roughness of the first sensing line 31, thereby reducing the haze of the touch device.

For the first sensing circuit and the first signal lines of the first functional film of the present invention, the present invention also provides several specific examples (Example, E) and several comparative examples (CE) according to the above manufacturing method. Electrical analysis of the flexible properties of each of the first functional films was performed.

<Specific Examples 1 to 5 (E1 to E5) and Comparative Examples 1 to 5 (CE1 to CE5)>

Electrical analysis of the detailed conditions and bending characteristics of the first sensing lines of the first functional films of the specific examples 1 to 4 (E1 to E4) of the present invention and the first functional films of the comparative examples 1 to 4 (CE4 to CE4), It is simply summarized in the following Table 2. The first sensing lines of the comparative examples (CE1~CE4) are formed by ITO formed on the PET substrate, and the line widths of the first sensing lines are respectively 0.25mm, 0.5mm, 1.00mm and 5.00mm, and the resistance change rate (ΔR) after bending 400 times is measured by a radius of 10 mm; each of the specific examples 1 to 4 (E1 to E4) The first sensing circuit is composed of a nano silver wire coated with a translucent resin layer on the PET substrate (the PET substrate + nano silver wire + translucent resin layer has a total thickness of about 56 μm to 107 μm), and each of the first Line of induction line The road widths were 0.25 mm, 0.5 mm, 1.00 mm, and 5.00 mm, respectively, and the resistance change rate (ΔR) after bending 10,000 times was measured with a radius of 10 mm.

According to the analysis results shown in the above Table 2., in the comparative example 3 (CE3) and the specific example 3 (E3), each of the first sensing circuit layers (CE3) made of ITO is bent 400 times. After folding, the rate of change in resistance (ΔR) has reached as high as 468%. In contrast, in the specific example 3 (E3), the rate of change in resistance (ΔR) after 10,000 times of bending is only about 3%. It is confirmed that the first induction line of the present invention is coated with a thermoplastic polymer glue (ie, a light transmissive resin layer), which not only improves the adhesion of each first induction line (nano silver line) on the PET substrate, but also The inductive line can further reduce the rate of change in resistance after bending by the light transmissive resin layer. Therefore, the operational stability of the touch device can be effectively improved.

Referring to FIG. 11 and FIG. 12, the bending test results of the first signal lines of the first functional film of the comparative example 5 (CE5) and the specific example 5 (E5) of the present invention are respectively shown; wherein the comparative example 5 ( CE5) is that the first thermoplastic resin layer is not screen printed on each of the first signal lines (silver glue); the specific example 5 (E5) is that the first signal lines are printed on the first thermoplastic having a thickness of between 8 μm and 12 μm. The resin layer; the line width of each of the first signal lines of Comparative Example 5 (CE5) and Specific Example 5 (E5) was 100 μm, and resistance analysis was performed by taking 5 points respectively.

According to the results shown in Fig. 11, the comparative example 5 (CE5) had a resistance value of about 400 Ω after the 10,000 times of bending, but the resistance value was raised to about 700 Ω. On the other hand, in the specific example 5 (E5), after 10,000 times of bending (refer to FIG. 12), the resistance value is also only lower than 140 Ω. It is confirmed that the first thermoplastic resin layer (PPS) 51 is coated on each of the first signal lines of the present invention, so that not only the silver paste of each of the first signal lines 41 is oxidized from the environment, but also the first signal lines 41 can be borrowed. The first thermoplastic resin layer 51 is used to slow the increase in the resistance value. Therefore, the operational stability of the flexible touch device can be effectively improved.

In summary, the touch device of the present invention can protect the first signal line 41 and the second signal line 42 from the environment by partially covering the respective thermoplastic resin layers 51, 52 of the first signal line 41 and the second signal line 42. The oxidation can also reduce the amount of resistance increase of the touch device after being bent a plurality of times; in addition, the light transmissive resin layers 61 and 62 covering the first and second sensing lines 31 and 32 can further increase the inductance. The adhesion of the lines 31 and 32 greatly reduces the rate of change of resistance (ΔR) after multiple bending, thereby increasing the operational stability of the touch device and slowing down the operational stability of the touch device. Therefore, the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

2‧‧‧Soft substrate unit

21‧‧‧First flexible substrate

211‧‧‧visible area

212‧‧‧ wiring area

22‧‧‧Second flexible substrate

221‧‧‧visible area

222‧‧‧ wiring area

3‧‧‧Induction circuit layer

31‧‧‧First sensing line

32‧‧‧Second sensing line

4‧‧‧Signal circuit layer

41‧‧‧First signal line

411‧‧‧ line segment

412‧‧‧Joint pad

42‧‧‧second signal line

421‧‧‧ line segment

422‧‧‧bonding pad

5‧‧‧ thermoplastic resin layer unit

51‧‧‧First thermoplastic resin layer

52‧‧‧Second thermoplastic resin layer

6‧‧‧Transparent resin layer unit

61‧‧‧First light transmissive resin layer

62‧‧‧Second light transmissive resin layer

71‧‧‧First flexible printed circuit board

72‧‧‧Second flexible printed circuit board

73‧‧‧ Anisotropic conductive adhesive

81‧‧‧First optical layer

82‧‧‧Second optical layer

9‧‧‧Transparent protective cover

X‧‧‧ first direction

Y‧‧‧second direction

Claims (16)

A touch device includes: a flexible substrate unit; a sensing circuit layer disposed on the flexible substrate unit; a signal circuit layer disposed on the flexible substrate unit and electrically connected to the sensing circuit layer; and a thermoplastic resin A layer unit that partially covers and contacts the signal line layer. The touch device of claim 1, wherein the signal line layer has a plurality of line segments and a plurality of bond pad segments corresponding to the respective line segments, and the line segments are respectively connected between the sensing circuit layer and each of the bonding pad segments. The thermoplastic resin layer unit covers the line segment of the signal line layer, and correspondingly exposes each of the bond pad segments. The touch device of claim 1, wherein the thermoplastic resin layer unit has a plurality of openings, the signal circuit layer having a plurality of line segments and a plurality of bond pad segments corresponding to the respective line segments, wherein the circuit segments are respectively connected to the sensing Between the circuit layer and each of the bonding pad segments, the thermoplastic resin layer unit covers a peripheral edge of each bonding pad segment of the signal circuit layer, and each opening correspondingly partially exposes an intermediate portion of each bonding pad segment. The touch device of claim 1, wherein the signal circuit layer is made of silver paste. The touch device of claim 1, wherein the thermoplastic resin layer unit material comprises one of polyphenylene sulfide, an insulating ink, and a photoresist; and the thickness of the thermoplastic resin layer unit is between 8 μm and 24 μm. The touch device of claim 1, further comprising a light transmissive resin layer unit covering the sensing circuit layer, wherein the sensing circuit layer is composed of a nano silver wire. The touch device of claim 6, wherein the thickness of the sensing circuit layer is between 20 nm and 150 nm. The touch device of claim 6, wherein the nanowire of the sensing circuit layer has a length between 1 μm and 50 μm and a wire diameter between 20 nm and 50 nm. The touch device according to claim 6, wherein the light transmissive resin layer unit has an average surface roughness Ra and Ra ≦ 0.2 μm. The touch device of claim 6, wherein the thickness of the light transmissive resin layer unit is between 80 nm and 400 nm. The touch device of claim 1, further comprising a first optical adhesive layer, wherein: the flexible substrate unit has a first flexible substrate and a second flexible substrate disposed opposite to each other, the first flexible substrate and the first The two flexible substrates each have a visible area and a wiring area adjacent to the visible area thereof; the sensing circuit layer has a plurality of first sensing lines and a plurality of second sensing lines, and the first sensing lines and the second sensing lines are respectively a visible area of the first flexible substrate and a visible area of the second flexible substrate, and staggered with each other; the signal circuit layer includes a plurality of first signal lines electrically isolated from each other and a plurality of second signals electrically isolated from each other a first signal line and the second signal lines are respectively connected to the first sensing lines And a second sensing line disposed on the wiring area of the first flexible substrate and the wiring area of the second flexible substrate; the thermoplastic resin layer unit includes a first thermoplastic resin layer and a second thermoplastic resin layer, The first thermoplastic resin layer partially covers the first signal lines, the second thermoplastic resin layer partially covers the second signal lines; and the first optical adhesive layer is attached to the first flexible substrate and the first optical substrate Two flexible substrates. The touch device of claim 11, further comprising a second optical adhesive layer and a transparent protective cover, the second optical adhesive layer being attached to the second flexible substrate and the transparent protective cover. The touch device of claim 1, further comprising a plurality of bridging lines and a light transmissive resin layer unit, wherein: the flexible substrate unit has a first flexible substrate, the first flexible substrate having a visible area and an adjacent The sensing circuit layer has a plurality of first sensing lines and a plurality of second sensing lines, and the first sensing lines and the second sensing lines are respectively disposed in the visible area of the first flexible substrate. Each of the first sensing lines has a plurality of sensing segments spaced apart from each other, and a plurality of connecting segments connecting each of the two adjacent sensing segments, each of the second sensing circuits having a plurality of sensing segments spaced apart from each other, and each of the second sensing circuits The sensing segments are respectively located at two sides of the connecting portion of the first sensing circuit; the transparent resin layer unit has a first light transmissive resin layer covering the first sensing lines and the second sensing lines, the first through The light resin layer has a plurality of through holes, and each of the pair of through holes is located at opposite ends of each two adjacent sensing segments of the second sensing lines; the bridge lines are respectively filled with the respective pairs of holes to electrically connect the respective holes Each two adjacent sensing segments of the second sensing circuit; the signal circuit layer includes a plurality of first signal lines electrically isolated from each other and a plurality of second signal lines electrically isolated from each other, the first signal lines and the second The signal lines are respectively connected to the first sensing lines and the second sensing lines, and respectively disposed on the wiring area of the first flexible substrate; and the thermoplastic resin layer unit includes a first thermoplastic resin layer and a second thermoplastic resin layer. The first thermoplastic resin layer partially covers the first signal lines, and the second thermoplastic resin layer partially covers the second signal lines. The touch device of claim 13 further comprising a first optical adhesive layer and a transparent protective cover, the first optical adhesive layer being attached to the first flexible substrate and the transparent protective cover. The touch device of claim 12 or 14, wherein the transparent protective cover is selected from a 2-dimensional planar substrate, a 2.5-dimensional curved substrate, or a 3-dimensional curved substrate. The touch device of claim 12 or 14, wherein each of the first signal lines and each of the second signal lines respectively has a line segment and a bonding pad segment correspondingly connected to the line segment, and each of the first signal lines and each The line segment of the second signal line is respectively connected to each of the first sensing line and each of the second sensing lines, the first thermoplastic resin layer and the second thermoplastic tree Each of the openings of the first thermoplastic resin layer partially exposes an intermediate portion of the bonding pad segments of the first signal lines, and the openings of the second thermoplastic resin layer are partially exposed. An intermediate region of the bond pad segments of each of the second signal lines.