CN103713781A - Touch panel - Google Patents

Touch panel Download PDF

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Publication number
CN103713781A
CN103713781A CN201210380338.5A CN201210380338A CN103713781A CN 103713781 A CN103713781 A CN 103713781A CN 201210380338 A CN201210380338 A CN 201210380338A CN 103713781 A CN103713781 A CN 103713781A
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CN
China
Prior art keywords
sensing electrode
those
electrode pattern
contact panel
patterns
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CN201210380338.5A
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Chinese (zh)
Inventor
陈国兴
陈昱廷
苏振豪
刘锦璋
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LIANSHENG (CHINA) TECHNOLOGY CO LTD
Wintek Corp
Original Assignee
LIANSHENG (CHINA) TECHNOLOGY CO LTD
Wintek Corp
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Priority to CN201210380338.5A priority Critical patent/CN103713781A/en
Publication of CN103713781A publication Critical patent/CN103713781A/en
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Abstract

The invention provides a touch panel which comprises a substrate, multiple groups of sensing electrode assemblies, multiple first connecting cushions, multiple second connecting cushions, multiple first leads, multiple second leads and multiple connecting conductors. Each sensing electrode assembly comprises a first sensing electrode pattern and multiple second sensing electrode patterns configured beside the first sensing electrode pattern, the first leads electrically connect the first connecting cushions to the first sensing electrode patterns respectively, the second connecting cushions are electrically connected to one corresponding second sensing electrode patter through one of the second leads, the connecting conductors electrically connect one second sensing electrode patter of one of the sensing electrode assemblies to one second sensing electrode patter of the other sensing electrode assembly, the second leads and the first leads are not interlaced with one another, and the connecting conductors are not interlaced with one another.

Description

Contact panel
Technical field
The invention relates to a kind of panel, and particularly relevant for a kind of contact panel.
Background technology
Fig. 1 is the local schematic top plan view of the projected capacitive touch panel of existing a kind of tool multilayer sensing electrode.The projected capacitive touch panel 100 of tool multilayer sensing electrode comprises a substrate 110, a plurality of the first sensing serials 120, a plurality of the second sensing serials 130 and a plurality of wire 150.Wire 150 is electrically connected at respectively each the first sensing serials 120 and each second sensing serials 130, more for example, joins with a control circuit 160 (control chip).Each first sensing serials 120 comprises a plurality of the first sensing electrode pattern 120a, and each second sensing serials 130 comprises a plurality of the second sensing electrode pattern 130a.Due to the first sensing serials 120 and the second sensing serials 130 interlaced, independently electrical for these sensing serials are had, contact panel 100 be provided with a plurality of bridging lines 140 and bridging line 142 by each the first sensing electrode pattern 120a each other and each second sensing electrode pattern 130a be electrically connected each other.
In contact panel 100, use bridging line 140, bridging line 142 can make the manufacturing process of contact panel 100 comparatively complicated.Specifically, the bridging line 140 that is used for being connected in series the first sensing patterns 120a is the different conductor retes that belong in contact panel 100 with the bridging line 142 that is used for being connected in series the second sensing patterns 130a in fact, and is provided with a layer insulating (not shown in figure 1) between the two.So, in order to connect into the first required sensing serials 120 and the second sensing serials 130, must in insulation course, produce contact hole, or insulating layer pattern be realized to the bridge joint of conductor component.Therefore, the manufacturing process complexity of contact panel 100 and cost of manufacture cannot decline.
Summary of the invention
The invention provides a kind of contact panel, there is the technique of simplification and improve yield.
The present invention proposes a kind of contact panel and comprises a substrate, a sensing electrode layer, a plurality of the first connection pad, a plurality of the second connection pad, many first wires, many second wires and a plurality of link conductor.The first connection pad and the second connection pad are configured on substrate.Each sensing electrode group comprises one first sensing electrode pattern and a plurality of the second other sensing electrode pattern of the first sensing electrode pattern that is configured in.Aforesaid many first wires, are electrically connected at the first sensing electrode respectively by the first connection pad.Each second connection pad is electrically connected at corresponding one of them second sensing electrode by second wire wherein, wherein the second wire and the first wire mistake that mutually disjoints.Each link conductor is electrically connected a second sensing electrode pattern of a sensing electrode group wherein in a second sensing electrode pattern of another sensing electrode group, and mistake wherein mutually disjoints between each link conductor.
In one embodiment of this invention, the two ends of each above-mentioned link conductor be connected to a plurality of the second connection pads wherein both.
In one embodiment of this invention, above-mentioned link conductor comprises many privates, be configured in wherein between a second sensing electrode pattern of a sensing electrode group and a second sensing electrode pattern of another sensing electrode group, the second sensing electrode pattern of adjacent sensing electrode group is electrically connected to each other, wherein privates and the first wire or the second wire mistake that mutually disjoints.
In one embodiment of this invention, the first above-mentioned sensing electrode pattern has one first relative side and one second side, and in sensing electrode group, the second sensing electrode pattern is all positioned at the second side of the first corresponding sensing electrode pattern.
In one embodiment of this invention, the first sensing electrode pattern in each above-mentioned sensing electrode group has one first relative side and one second side, and the second sensing electrode pattern in part sensing electrode group is all positioned at the first side of the first corresponding sensing electrode pattern, and the second sensing electrode pattern in another part sensing electrode group is all positioned at the second side of the first corresponding sensing electrode pattern.
In one embodiment of this invention, two the first sensing electrode patterns of above-mentioned adjacent two sensing electrode groups between the second sensing electrode pattern or the second sensing electrode pattern of adjacent two sensing electrode groups between two the first sensing electrode patterns.
In one embodiment of this invention, the first sensing electrode pattern of each above-mentioned sensing electrode group is that curved patterns defines a plurality of U-shaped patterns that surround in fact respectively the second sensing electrode pattern.
In one embodiment of this invention, the U-shaped pattern that two the first sensing electrode patterns of above-mentioned adjacent two sensing electrode groups form toward each other.
In one embodiment of this invention, the second sensing electrode that is arranged in two relative U-shaped patterns in above-mentioned adjacent two sensing electrode groups links together.
In one embodiment of this invention, above-mentioned contact panel also comprises a circuit board, is connected in the first connection pad and the second connection pad and circuit board and has aforesaid link conductor.
In one embodiment of this invention, the material of the first above-mentioned wire and the second wire is in transparent conductive material, metal material or mesh wire material or above-mentioned material, at least to appoint the compound substance of the two material.
In one embodiment of this invention, the first above-mentioned wire and the second wire isoplanar in fact.
In one embodiment of this invention, the material of above-mentioned sensing electrode group is in transparent conductive material, metal material or mesh wire material or above-mentioned material, at least to appoint the compound substance of the two material.
In one embodiment of this invention, above-mentioned contact panel also comprises a decorative layer, is arranged on the periphery of substrate.
Based on above-mentioned, contact panel of the present invention is made sensing electrode at grade, and utilize a plurality of link conductor a second sensing electrode pattern in a plurality of sensing electrode groups to be electrically connected to a second sensing electrode pattern of another sensing electrode group, can simplify whereby the manufacturing process of contact panel.When contact panel is when driving chip to be connected by flexible circuit board, one of them connection pad of flexible circuit board just can connect at least two electrode patterns, reduces whereby the connection pad quantity of flexible circuit board and the length that contributes to reduce flexible circuit board.If contact panel is to be directly connected (being COG, chip onglass) with driving chip, drive the number of channels of chip also can thereby effectively to reduce.In addition, between wire in contact panel and link conductor, can not intermesh, therefore in contact panel, do not need the bridge joint carrying out between conductor layer to process, this contributes to simplify the manufacturing process of contact panel and reduce manufacturing cost, also can improve production yield.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing explanation to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the local schematic top plan view of the projected capacitive touch panel of existing a kind of tool individual layer sensing electrode.
Fig. 2 is the local schematic top plan view of a kind of contact panel of the first embodiment of the present invention;
Fig. 3 A is the local schematic top plan view of a kind of contact panel of the second embodiment of the present invention;
Fig. 3 B is the local schematic top plan view of a kind of contact panel of the third embodiment of the present invention;
Fig. 4 is the local schematic top plan view of a kind of contact panel of the fourth embodiment of the present invention;
Fig. 5 is the local schematic top plan view of a kind of contact panel of the fifth embodiment of the present invention;
Fig. 6 is the local schematic top plan view of a kind of contact panel of the sixth embodiment of the present invention;
Fig. 7 is the local schematic top plan view of a kind of contact panel of the seventh embodiment of the present invention;
Fig. 8 is the local schematic top plan view of a kind of contact panel of the eighth embodiment of the present invention;
Fig. 9 A is the local schematic top plan view of a kind of contact panel of the ninth embodiment of the present invention;
Fig. 9 B is the local schematic top plan view of a kind of contact panel of the tenth embodiment of the present invention.
Description of reference numerals:
100: the projected capacitive touch panel of tool multilayer sensing electrode;
110,210: substrate;
120: the first sensing serials;
120a, 2211,3211,5211,8211: the first sensing electrode patterns;
130: the second sensing serials;
130a, 2212,3212,5212,8212: the second sensing electrode patterns;
140,142: bridging line;
150: wire;
160: control circuit;
200,300A, 300B, 400,500,600,700,800,900A, 900B: contact panel;
220,320: sensing electrode layer;
221,321,321A, 321B, 321C, 321D, 521,821: sensing electrode group;
2211a, 3211a: the first side;
2211b, 3211b: the second side;
230: the first connection pads;
240: the second connection pads;
240A: the first connection pad district;
240B: the second connection pad district;
250: the first wires;
260: the second wires;
270,980a: link conductor;
270a, 270b, 670a: privates;
280,980: circuit board;
5211a, 8211a:U type pattern;
D: first direction.
Embodiment
Each following accompanying drawing has been adjusted to the ratio of each element and can have clearly presented each element, so the size of each element does not illustrate according to actual ratio.In addition, in following a plurality of embodiment, the schematically illustrated array sensing electrode group that goes out display panel only, but the present invention is as limit, and deviser can go out according to the Demand Design of practical application the quantity of suitable sensing electrode group.
Fig. 2 is the local schematic top plan view of a kind of contact panel of the first embodiment of the present invention.Please refer to Fig. 2, contact panel 200 comprises a substrate 210, a sensing electrode layer 220, a plurality of the first connection pad 230, a plurality of the second connection pad 240, many first wires 250, many second wires 260 and a plurality of link conductor 270.Sensing electrode layer 220, the first connection pad 230 and the second connection pad 240 are configured on substrate 210.Sensing electrode layer 220 comprises many group sensing electrode groups 221, and each sensing electrode group 221 comprises one first sensing electrode pattern 2211 and a plurality of the second other sensing electrode pattern 2212 of the first sensing electrode pattern 2211 that is configured in.
Aforesaid many first wires 250 are electrically connected at the first sensing electrode pattern 2211 respectively by the first connection pad 230.And each second connection pad 240 is electrically connected at corresponding one of them second sensing electrode pattern 2212 by second wire 260 wherein.270 of each link conductor are electrically connected a second sensing electrode pattern 2212 of a sensing electrode group 221 wherein in a second sensing electrode pattern 2212 of another sensing electrode groups 221.It should be noted that as shown in Figure 2 the mistake that mutually disjoints between each second wire 260 and each the first wire 250, and each link conductor 270 also non-intersect mistake each other.The arrangement connected mode of such wire and conductor can not need to use bridge process, therefore can simplify the manufacturing process of contact panel 200, and the manufacturing process of simplifying more can improve the production yield of product.That is to say, these first wires 250, the second wire 260 and link conductor 270 can optionally adopt same conductive film layer to make, and must between these conductive members, not be provided with insulation course, be not also required to be and allowed these conductor components realize needed annexation and carry out the making of the contact hole in insulation course.
In the present embodiment, the first sensing electrode pattern 2211 in each sensing electrode group 221 can be as the scan electrode in contact panel 200, can be as sensing electrode and be positioned at first sensing electrode pattern 2211 these other the second sensing electrode patterns 2212.The first sensing electrode pattern 2211 of sensing electrode group 221 can not scan in order on the same group.When the first sensing electrode pattern 2211 of some sensing electrode groups 221 is when being scanned state, corresponding several the second sensing electrode patterns 2212 can carry out sensing.Now, the signal that the second sensing electrode pattern 2212 senses can transfer to via the second wire 260 of correspondence the second corresponding connection pad 240 and produce corresponding instruction to export to control chip (not shown).
In order really to allow the signal of 2212 sensings of the second sensing electrode pattern of each sensing electrode group 221 be distinguished, several second sensing electrode patterns 2212 of each sensing electrode group 221 can be connected to the second different connection pads 240.But, the signal of 2212 sensings of the second sensing electrode pattern of different sensing electrode groups 221 can be distinguished by the difference of scanning sequence, so the second sensing electrode pattern 2212 of different sensing electrode groups 221 can optionally be connected in fact the second identical connection pad 240.Thus, the connection pad quantity that the signal that control chip (not shown) can sense by least two the second sensing electrodes 2212 of one of them second connection pad 240 reception of flexible circuit board contributes to reduce the required setting of flexible circuit board.If contact panel is to be directly connected (being COG, chip on g1ass) with driving chip, drive the number of channels of chip also can thereby effectively to be reduced.
Specifically, in the present embodiment, the two ends of each link conductor 270 be connected to the second connection pad 240 wherein both, one of a sensing electrode group 221 wherein the second sensing electrode pattern 2212 is electrically connected to a second sensing electrode pattern 2212 of another sensing electrode groups 221.In detail, wherein two the second sensing electrode patterns 2212 that belong in different sensing electrode groups 221 can first be electrically connected to different the second connection pads 240 by different the second wires 260 respectively.And, via a corresponding bonding conductor 270, these second different connection pad 240 electric connections are realized to the wherein annexation of a second sensing electrode pattern 2212 of second sensing electrode pattern 2212 another sensing electrode groups 221 of electric connection of a sensing electrode group 221.
Hold above-mentionedly, in the present embodiment, contact panel 200 can comprise a circuit board 280, for example, be flexible circuit board.In the electric connection mode of the present embodiment, although the quantity of the second connection pad 240 is equal to the quantity of the second sensing electrode pattern 2212.But, adopt circuit board 280 that the signal of the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212 is passed in control chip (not shown), one contact in two second connection pads 240 that circuit board 280 only needs to be connected with each the first connection pad 230 and each bonding conductor 270, does not need to contact with the second whole connection pads 240.Specifically, that is the present embodiment only need half quantity the second connection pad 240 with circuit board 280 or drive chip to engage.By such design, size that can reduction circuit plate or drive the port number of chip, reaches cost-effective advantage.In other words, when contact panel 200 is provided with N the second sensing electrode pattern 2212, circuit board 280 or control chip (not shown) only need to be connected to about N/2 the second connection pad 240 and just can receive the signal that all the second sensing electrode patterns 2212 sense and realize touch-control sensing function, and wherein N is positive integer.
In addition, the design of the sensing electrode of contact panel 200 in the present embodiment, can be that the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212 are made at grade, to form one deck sensing electrode layer 220.In other words, the present embodiment can be used same material rete to make the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212 simultaneously, makes the simplified manufacturing process of contact panel 200.Certainly, the present invention does not limit the production method of the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212, for example, the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212 also can be made on same plane respectively by the processing procedure in different step.In addition, in the present embodiment, the first wire 250 and the second wire 260 in fact also can be set to isoplanar, and therefore the first wire 250 can be made with the second wire 260 in technique, so as to simplifying the manufacturing process of contact panel 200.
In addition, in the present embodiment, the material of substrate 210 is for example glass or plastic cement, and the material of the first connection pad 230, the second connection pad 240, the first wire 250 and the second wire 260 can be metal or mesh wire, nontransparent conductive material (as: copper) for example, or other transparent conductive materials (as: tin indium oxide), but also can be in above-mentioned material, at least to appoint the compound wire of the two material, for example ITO/Ag/ITO.The material of sensing electrode layer 220 can be transparent conductive material, tin indium oxide (Indium-Tin Oxide for example, ITO), or other similar transparent conductive materials or metal or mesh wire material, but also can be the compound sensing electrode of at least appointing the two material in above-mentioned material, for example ITO/Ag/ITO.But, above-mentioned material is only the use illustrating, not in order to limit the present invention.
Below coordinate accompanying drawing that configuration, function and the electrical connection of each element in the first embodiment are described, then will coordinate accompanying drawing that the arrangement mode of sensing electrode group 221 in the first embodiment is described.Refer again to Fig. 2, in the first embodiment, with regard to the first sensing electrode pattern 2211 of sensing electrode group 221 and the arrangement mode of the second sensing electrode pattern 2212, the first sensing electrode pattern 2211 and the second sensing electrode pattern 2212 are along first direction D alternative arrangement.More specifically, the first sensing electrode pattern 2211 in each sensing electrode group 221 has one first relative side 2211a and one second side 2211b, the for example left side in drawing and right side, and the second sensing electrode pattern 2212 in each sensing electrode group 221 is all positioned at the second side 2211b of the first corresponding sensing electrode pattern 2211.That is to say, with accompanying drawing illustrated in fig. 2, the second sensing electrode pattern 2212 in each sensing electrode group 221 is all positioned at the right side of the first corresponding sensing electrode pattern 2211.At this, in Fig. 2, the arrangement mode of each element is in order to illustrate with embodiment preferably, and the purposes being not intended to limit, for example in other embodiments, the second wire 260 also can be between two sensing electrode patterns 2211 and 2212.
Hold above-mentioned, so the first sensing electrode pattern 2211 in the first embodiment and the second sensing electrode pattern 2212 are in fact along a first direction D alternative arrangement.In fact, in contact panel 200, except the electrode pattern of the leftmost side, the first side 2211a of each the first sensing electrode pattern 2211 and the second side 2211b are adjacent with a plurality of the second sense lateral electrode patterns 2212.Or, between any two first adjacent sensing electrode patterns 2211, be all provided with the second sensing electrode pattern 2212.
Fig. 3 A is the local schematic top plan view of a kind of contact panel of the second embodiment of the present invention.In a second embodiment, the configuration of each element is similar to the first embodiment, therefore adopts identical label to represent identical or approximate element.Specifically, the first embodiment and the second embodiment difference are mainly, the arrangement mode of a plurality of sensing electrode group 321A~sensing electrode group 321D of the sensing electrode layer 320 in the contact panel 300A of the second embodiment.But, the second embodiment is similar in the design being electrically connected to each member of the first embodiment.That is to say, each first connection pad 230 all can be connected to the first sensing electrode pattern 2211 and each second connection pad 240 all can be connected to the second sensing electrode pattern 2212 by second wire 260 by first wire 250.
Please refer to Fig. 3 A, in a second embodiment, the first sensing electrode pattern 3211 in each sensing electrode group 321A~sensing electrode group 321D has one first relative side 3211a and one second side 3211b, and the second sensing electrode pattern 3212 in part sensing electrode group 321 is all positioned at the first side 3211a of the first corresponding sensing electrode pattern 3211, and the second sensing electrode pattern 3212 in another part sensing electrode group 321 is all positioned at the second side 3211b of the first corresponding sensing electrode pattern 3211.
More specifically, in contact panel 300A, two the first sensing electrode patterns 3211 of adjacent two sensing electrode groups 321 (for example sensing electrode group 321B and sensing electrode group 321C) between the second sensing electrode pattern 3212 or the second sensing electrode pattern 3212 of adjacent two sensing electrode groups 321 (for example sensing electrode group 321A and sensing electrode group 321B or sensing electrode group 321C and sensing electrode group 321D) between two the first sensing electrode patterns 3211.Thus, sensing electrode group 321A~321D for example presents symmetrical layout type.
In the present embodiment, the second sensing electrode pattern 3212 of sensing electrode group 321A and sensing electrode group 321B is adjacent one another are, so be connected in the second connection pad 240 of sensing electrode group 321A and sensing electrode group 321B, can intensively be arranged on the first connection pad district 240A.Similarly, the second sensing electrode pattern 3212 of sensing electrode group 321C and sensing electrode group 321D is adjacent one another are, so be connected in the second connection pad 240 of sensing electrode group 321C and sensing electrode group 321D, can intensively be arranged on the second connection pad district 240B.At this, the second connection pad 240 in the second connection pad district 240B can be connected in the second connection pad 240 in the first connection pad district 240A by link conductor 270.The circuit board that the control chip of contact panel 300A or wish are connected to control chip by contact panel 300A only needs to be connected in that the second connection pad 240 in the first connection pad district 240A just can be communicated with the second all sensing electrode patterns 3212 and the transmission and the reception that realize touching signal.That is to say, the second connection pad 240 in the second connection pad district 240B can be considered as virtual connection pad and not need to be connected in practically control chip or circuit board.
It should be noted that, in the electrode pattern arrangement mode of the second embodiment, the first sensing electrode pattern 3211 of part is adjacent between two, for example the first sensing electrode pattern 3211 of sensing electrode group 321B and the first sensing electrode pattern 3211 of sensing electrode group 321C.Because the first sensing electrode pattern 3211 of sensing electrode group 321B is when scanning, the first sensing electrode pattern 3211 of sensing electrode group 321C and the second sensing electrode pattern 3212 of sensing electrode group 321C are all in initial state, for example ground connection or suspension joint, thus, the first sensing electrode pattern 3211 of sensing electrode group 321C can provide shielding (shielding) effect and avoid the second sensing electrode pattern 3212 of sensing electrode group 321C that sensing occurs when sensing electrode group 321B carries out sensing, and the second sensing electrode pattern 3212 can provide the effect of absorption of noise.In other words, contact panel 300A can have desirable touch-control accuracy.At this, that the first sensing electrode pattern 3211 with sensing electrode group 321B is when scanning, the first sensing electrode pattern 3211 of sensing electrode group 321C and the first sensing electrode pattern 3211 of sensing electrode group 321C are to be all that example explains in initial state, but in other embodiments, can optionally make the first sensing electrode pattern 3211 or the second sensing electrode pattern 3212 both one of them in original state.
Fig. 3 B is the local schematic top plan view of a kind of contact panel of the third embodiment of the present invention.In a second embodiment, be that the second connection pad 240 between the first connection pad district 240A and the second connection pad district 240B is done and connected by bonding conductor 270, to connect corresponding the second sensing electrode pattern 3212.But the second connection pad district 240B can also selectively not be provided with the second connection pad 240, and directly with link conductor 270, is connected in the second wire 260 that sensing electrode group 321C is connected with sensing electrode group 321D.Please refer to Fig. 3 B, the 3rd embodiment of Fig. 3 B is similar in fact to the second embodiment, and both difference are mainly in the present embodiment, and the second connection pad district 240B is not provided with the second connection pad 240.So deviser can optionally not arrange the second connection pad 240 at the second connection pad district 240B.
Fig. 4 is the local schematic top plan view of a kind of contact panel of the fourth embodiment of the present invention.Please refer to Fig. 4, in the 4th embodiment, the arrangement mode of the configuration of each element and sensing electrode group 321A~sensing electrode group 321D is similar to the second embodiment, therefore adopts identical label to represent identical or approximate element.Both differences are mainly, in the contact panel 400 of the 4th embodiment, except utilize connecting the link conductor 270 of two the second connection pads 240 links together the second sensing electrode pattern 3212 of different sensing electrode groups 321, further utilize many privates 270a as the link conductor that the second sensing electrode pattern 3212 of different sensing electrode groups 321 is linked together.Particularly, each privates 270a is configured in wherein between a second sensing electrode pattern 3212 of sensing electrode group 321A~sensing electrode group 321D and a second sensing electrode pattern 3212 of another sensing electrode group 321A~sensing electrode group 321D, and the second sensing electrode pattern 3212 of adjacent sensing electrode group 321A~sensing electrode group 321D is electrically connected to each other.
Specifically, in a second embodiment, each second sensing electrode pattern 3212 is all connected to the second connection pad 240 by second wire 260 of correspondence.But in the 3rd embodiment, after privates 270a can first be electrically connected to each other part the second sensing electrode pattern 3212 in adjacent sensing electrode group 321A and sensing electrode group 321B, then with second wire 260, these the second sensing electrode patterns 3212 are electrically connected to the second connection pad 240.Or, after privates 270a can first be electrically connected to each other part the second sensing electrode pattern 3212 in adjacent sensing electrode group 321C and sensing electrode group 321D, then with second wire 260, these the second sensing electrode patterns 3212 are electrically connected to the second connection pad 240.Therefore, in contact panel 400 at least one second connection pad 240 can by second wire 260 wherein and wherein privates 270a be electrically connected at the second sensing electrode pattern 3212 of different sensing electrode group 321A~sensing electrode group 321D simultaneously.Whereby, can further reduce the quantity of the second wire 260 and the second connection pad 240.
In the present embodiment, several the second sensing electrode patterns 3212 that are away from the first connection pad 230 and the second connection pad 240 can also link together by same privates 270b.Now, privates 270b is connected in the second sensing electrode pattern 3212 of all sensing electrode group 321A~sensing electrode group 321D simultaneously, but not as only connected wherein two groups of sensing electrode group 321A and 321B or the second sensing electrode pattern 3212 of sensing electrode group 321C and sensing electrode group 321D as privates 270a.In addition by privates 270b, stretched out, and the routing path that is connected to one of them the second connection pad 240 can be considered as the second corresponding wire 260.That is to say, privates 270b is essentially with the second corresponding wire 260 wire that is connected to each other and is integral, and only with the member of its connection, draws and be divided into different members herein.
In addition, in the 4th embodiment, privates 270a, 270b, the first wire 250 and the second wire 260 are not staggered each other, therefore with aforementioned a plurality of embodiment similarly, the making of contact panel 400 does not need the advantage of cross-over connection technique.And the arrangement mode of the sensing electrode group 321 of the 4th embodiment is similar to the second embodiment, therefore the first sensing electrode pattern 3211 can provide the effect of shielding to promote sensing accuracy.
In addition, in the 4th embodiment, the first connection pad district 240A and the second connection pad district 240B are all provided with the second connection pad 240, but in other embodiment, the second connection pad district 240B more can selectively not be provided with the second connection pad 240, and directly with link conductor 270, is connected in the second wire 260 that sensing electrode group 321C is connected with sensing electrode group 321D.
Fig. 5 is the local schematic top plan view of a kind of contact panel of the fifth embodiment of the present invention.In aforesaid the first embodiment to the three embodiment, be take the first sensing electrode pattern 2211,3211 be shaped as strip as example, but the shape of the first sensing electrode pattern 2211,3211 is not as limit.Please refer to Fig. 5, in the 5th embodiment, contact panel 500 comprises a substrate 210, a plurality of sensing electrode group 521, a plurality of the first connection pad 230, a plurality of the second connection pad 240, many first wires 250, many second wires 260 and a plurality of link conductor 270.The first sensing electrode pattern 5211 of each sensing electrode group 521 is curved patterns, and these bending patterns define a plurality of U-shaped pattern 5211a.Each U-shaped pattern 5211a surrounds in fact a second sensing electrode pattern 5212 in same sensing electrode group 521.In the 5th embodiment, the second sensing electrode pattern 5212 represents with circle, but the present invention is not limited to this, and the second sensing electrode pattern 5212 can adopt other figures that can be surrounded by U-shaped pattern 5211a arbitrarily, such as triangular form, square, hexagonal etc.
In the present embodiment, each second sensing electrode pattern 5212 can be connected to second connection pad 240 by second wire 260 wherein.Therefore, in the situation that there is no link conductor 270, when contact panel 500 will be connected to control chip, control chip or be connected in control chip and contact panel 500 between circuit board need to be connected to each second connection pad 240.That is to say, on control chip, on set number of channels or circuit board, set connection pad number needs will equal the quantity of the second sensing electrode pattern 5212.So, the bonding area of control chip or circuit board cannot reduce.So the link conductor 270 of the present embodiment is in order to link together the second sensing electrode pattern 5212 of different sensing electrode groups 521.Now, control chip or being connected in control chip only needs to be connected to the circuit board between contact panel 500 one of them second connection pad 240 that each link conductor 270 is connected.Such layout type contributes to the bonding area of reduction circuit plate, if COG structure also can be simplified by reducing the number of channels of control chip the design of control chip.
Certainly, in the present embodiment, the second connection pad 240 of part can selectively not be provided with the second connection pad 240, and directly with link conductor 270, connects corresponding the second wire 260.
Fig. 6 is the local schematic top plan view of a kind of contact panel of the sixth embodiment of the present invention.Please refer to Fig. 6, the 6th embodiment is similar in fact to the 5th embodiment, therefore adopts identical label to represent identical or approximate element.Both difference are mainly, in the contact panel 600 of the 6th embodiment, further with many privates 670a, the second sensing electrode pattern 5212 of the adjacent sensing electrode group 521 of part are electrically connected to each other.And, more further with the second wire 260, a plurality of the second sensing electrode patterns 5212 after connecting are electrically connected to corresponding the second connection pad 240.Thus, can reduce the quantity of the second wire 260 and the second connection pad 240, can simplify the manufacturing process of contact panel 600 and save cost of manufacture.In brief, the setting of privates 670a is to link together to allow the second same connection pad 240 can be connected in different the second sensing electrode patterns 5212 in the second sensing electrode pattern 5212 of different sensing electrode groups 521.
Fig. 7 is the local schematic top plan view of a kind of contact panel of the seventh embodiment of the present invention.Please refer to Fig. 7, the 7th embodiment is similar in fact to the 6th embodiment, therefore adopts identical label to represent identical or approximate element.Both difference are mainly, in the contact panel 700 of the 7th embodiment, the U-shaped pattern 5211a that two the first sensing electrode patterns 5211 of adjacent two sensing electrode groups 521 form toward each other.So the privates 670a between the second sensing electrode pattern 5212 of adjacent two sensing electrode groups 521 can be in fact straight line but not broken curve as shown in Figure 6.
Fig. 8 is the local schematic top plan view of a kind of contact panel of the eighth embodiment of the present invention.Please refer to Fig. 8, the 8th embodiment is similar in fact to the 7th embodiment, therefore adopts identical label to represent identical or approximate element.Both difference are, in the contact panel 800 of the 8th embodiment, the second sensing electrode pattern 8212 that is wherein arranged in two relative U-shaped pattern 8211a in adjacent two sensing electrode groups 821 is link together and form a continuous electrode pattern.
Similarly, in aforesaid the 5th embodiment to the eight embodiment, the second connection pad 240 of part can optionally not arrange, and directly with link conductor 270, connects corresponding the second wire 260.This is identical with aforesaid embodiment, therefore do not repeat them here.
It should be noted that aforesaid the first embodiment to the four embodiment are produced on the link conductor 270 that connects two second connection pads 240 on substrate 210, but the present invention is not as limit.Fig. 9 A is the local schematic top plan view of a kind of contact panel of the ninth embodiment of the present invention.Please refer to Fig. 9 A, the 9th embodiment is similar in fact to the first embodiment, therefore adopts identical label to represent identical or approximate element.Both difference are mainly, in the 9th embodiment, contact panel 900A more comprises a circuit board 980.Circuit board 980 is connected in the first connection pad 230 and the second connection pad 240, and circuit board 980 has link conductor 980a.That is to say, the present embodiment can utilize the configuration on circuit board 980 that the second different connection pads 240 is linked together.Now, on the substrate 210 of contact panel 700, without any conductor component interlaced with each other, and be not required to be, do not allow these conductor components realize needed annexation and the making step that carries out the contact hole in insulation course or carry out the patterning of insulation course.
In one embodiment, circuit board 980 can be flexible circuit board (Flexible printed circuitboard), and link conductor 980a is consisted of the wire line layer on flexible circuit board.In detail, flexible circuit board can adopt attach or similarly mode be configured in and on substrate 210, wire line layer can be connected with corresponding the first connection pad 230 with the second connection pad 240 and the second connection pad 240 of part is communicated with, with the signal that transmits the first sensing electrode pattern 2211 and the second sensing electrode 2212 needed number of active lanes of minimizing control contact panel 900A also.Certainly, circuit board 980 can be also printed circuit board (PCB), and now link conductor 980a is consisted of each conductor layer being produced in printed circuit board (PCB).
Fig. 9 B is the local schematic top plan view of a kind of contact panel of the tenth embodiment of the present invention.The tenth embodiment is similar in fact to the 9th embodiment, and both difference are that the second connection pad 240 of part can selectively not be provided with the second connection pad 240, and directly with link conductor 980a, connect corresponding the second wire 260.
In addition, link conductor 980a also can realize by the circuit in the middle of control chip.For instance, deviser can design the circuit of the signal of controlling the first connection pad 230 and the second connection pad 240 in control chip, and the method can be processed the signal transmitting on two the second connection pads 240 wherein.Now, the circuit of control chip has been to provide in fact the effect identical with link conductor 980a.
What also need to carry is, in other embodiment, one decorative layer (not shown) can be arranged on the periphery of substrate, this substrate for example can be an overlay (cover lens), decorative layer can comprise pottery, class bore carbon, color ink, photoresistance and resin material at least one of them, in order to cover part the first wire and/or the second wire that is positioned at substrate periphery.
In sum, contact panel of the present invention utilizes link conductor a second sensing electrode pattern in one of them sensing electrode group to be electrically connected to a second sensing electrode pattern of another sensing electrode group.Link conductor can be connected to corresponding the second connection pad, or directly connects corresponding two the second sensing electrode patterns with the form of wire.Owing to can not intermeshing between each wire in contact panel and each link conductor, therefore in contact panel, do not need the structure of cross-over connection.Therefore, the contact panel of the embodiment of the present invention can be simplified the manufacturing process of contact panel, more can improve production yield.In addition, in contact panel of the present invention, electrode pattern comprises multiple different pattern shape and arrangement mode, therefore has good design flexibility.
Finally it should be noted that: each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit above; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.

Claims (14)

1. a contact panel, is characterized in that, comprising:
One substrate;
Many group sensing electrode groups, are configured on this substrate, and wherein respectively this sensing electrode group comprises:
One first sensing electrode pattern; And
A plurality of the second sensing electrode patterns, are configured in by this first sensing electrode pattern;
A plurality of the first connection pads, are configured on this substrate;
A plurality of the second connection pads, are configured on this substrate;
Many the first wires, are electrically connected at those the first sensing electrodes respectively by those first connection pads;
Many the second wires, respectively this second connection pad is electrically connected at corresponding one of them second sensing electrode by second wire wherein, wherein those second wires and those the first wires mistake that mutually disjoints; And
A plurality of link conductor, respectively this link conductor is electrically connected a second sensing electrode pattern of a sensing electrode group wherein in a second sensing electrode pattern of another sensing electrode group, and mistake wherein mutually disjoints between each link conductor.
2. contact panel according to claim 1, is characterized in that, respectively the two ends of this link conductor be connected to those the second connection pads wherein both.
3. contact panel according to claim 1, it is characterized in that, those link conductor comprise many privates, be configured in this wherein between a second sensing electrode pattern of a sensing electrode group and a second sensing electrode pattern of this another sensing electrode group, those the second sensing electrode patterns of those adjacent sensing electrode groups are electrically connected to each other, wherein those privates and those the first wires or those the second wires mistake that mutually disjoints.
4. contact panel according to claim 1, it is characterized in that, this the first sensing electrode pattern in each sensing electrode group has one first relative side and one second side, and in those sensing electrode groups, those the second sensing electrode patterns are all positioned at this second side of this corresponding the first sensing electrode pattern.
5. contact panel according to claim 1, it is characterized in that, this the first sensing electrode pattern in each sensing electrode group has one first relative side and one second side, and those the second sensing electrode patterns are all positioned at this first side of this corresponding the first sensing electrode pattern in those sensing electrode groups of part, and in those sensing electrode groups of another part, those the second sensing electrode patterns are all positioned at this second side of this corresponding the first sensing electrode pattern.
6. contact panel according to claim 5, it is characterized in that, two the first sensing electrode patterns of adjacent two sensing electrode groups between those the second sensing electrode patterns or those the second sensing electrode patterns of adjacent two sensing electrode groups between two the first sensing electrode patterns.
7. contact panel according to claim 1, is characterized in that, respectively this first sensing electrode pattern of this sensing electrode group is that curved patterns defines a plurality of U-shaped patterns that surround respectively those the second sensing electrode patterns.
8. contact panel according to claim 7, is characterized in that, the U-shaped pattern that two the first sensing electrode patterns of adjacent two sensing electrode groups form toward each other.
9. contact panel according to claim 8, is characterized in that, those second sensing electrodes that are arranged in two relative U-shaped patterns in adjacent two sensing electrode groups link together.
10. contact panel according to claim 1, is characterized in that, also comprises a circuit board, is connected in those first connection pads and those the second connection pads and this circuit board and has those link conductor.
11. contact panels according to claim 1, is characterized in that, the material of those first wires and those the second wires is in transparent conductive material, metal material or mesh wire material or above-mentioned material, at least to appoint the compound substance of the two material.
12. contact panels according to claim 1, is characterized in that, those first wires and those the second wire isoplanars.
13. contact panels according to claim 1, is characterized in that, the material of those sensing electrode groups is in transparent conductive material, metal material or mesh wire material or above-mentioned material, at least to appoint the compound substance of the two material.
14. contact panels according to claim 1, is characterized in that, also comprise a decorative layer, are arranged on the periphery of this substrate.
CN201210380338.5A 2012-10-09 2012-10-09 Touch panel Pending CN103713781A (en)

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Application publication date: 20140409