TWI549218B - Semiconductor apparatus and the processing chamber and the wafer transfer method thereof - Google Patents

Description

Semiconductor device, processing chamber thereof and method for carrying object to be processed

The present invention relates to a semiconductor device, and more particularly to a multi-wafer processing chamber for a semiconductor device and a wafer transfer method therefor.

In the semiconductor manufacturing process, the quality of the products produced often depends on the advantages and disadvantages of the semiconductor machine equipment. One of the conventional semiconductor machine equipment is called a cluster process equipment. The semiconductor machine has a substrate processing apparatus that includes a plurality of processing chambers, each of which is coupled to a transfer chamber. The substrate may be subjected to a film forming process, a reforming process, an etching process, and the like in each processing chamber. For example, in the substrate processing apparatus 10 shown in FIG. 1, the substrate processing apparatus 10 may have a polygonal transfer chamber 12 and a plurality of processing chambers, each of which has a substrate 13 that can be mounted, such as a semiconductor wafer 13. The stage 14 is placed. In general, the transfer chamber 12 can be a quadrangle, a pentagon, a hexagon, or other polygonal shape, and FIG. 1 is exemplified as an octagon. Again, only one processing chamber is shown in Figure 1 and is labeled 11-k, where k represents one of a plurality of processing chambers. The substrate 13 or the semiconductor wafer 13 can be moved between a plurality of processing chambers by a retractable and rotatable transfer arm 15 disposed in the transfer chamber 12.

However, the conventional substrate processing apparatus does not effectively plan and effectively utilize the space. In addition, if a mechanical arm is to be placed in the processing chamber of the conventional substrate processing apparatus, it may take up to 3 to 5 processing chamber sizes because the mechanical arm is large in size and requires a rotating or moving area. Space. Therefore, the planning and utilization of the cluster-type process equipment space is more unfavorable, that is, the number of processing chambers that can be combined around the transfer chamber is sharply reduced, so that the cluster-type process equipment is not practical for mass production. Furthermore, if the environment of the processing chamber is a vacuum, the mechanical arm is increased in cost to satisfy the vacuum condition. It is obvious that the robot arm cannot be effectively applied to the current cluster type process equipment. In the processing chamber, the present invention therefore provides a new semiconductor device that is fully compatible with a processing chamber of limited space.

In view of the above problems, it is an object of the present invention to provide a low cost The object to be processed such as a sheet substrate or a wafer is placed in a processing chamber of a limited space, thereby improving space utilization and being suitable for various environments, including semiconductor devices in a vacuum environment.

Accordingly, the present invention provides a semiconductor device comprising: a transfer chamber; a delivery arm is disposed on the transfer chamber; and at least one processing chamber is coupled to the transfer chamber, the at least one processing chamber having a first mounting table and a second mounting table; wherein the first mounting table The upper system has a plurality of first openings, and the second mounting table has a plurality of second openings, and wherein one of the plurality of first openings has a size larger than the other one of the plurality of first openings The size of the opening is larger than the size of the plurality of second openings; and wherein the larger opening of the plurality of first openings forms a channel, and the other openings of the plurality of first openings form a plurality of openings The first processed object mounting area, and the plurality of second openings form a plurality of second processed object mounting areas.

Moreover, another object of the present invention is to provide a substrate, a wafer, etc. The processing body is placed in a processing chamber of a limited space to increase the space utilization of the processing chamber.

Accordingly, the present invention provides a processing chamber that is coupled to a transfer chamber. The transport chamber is provided with a transfer arm, the processing chamber includes: a first mounting table having a plurality of first openings; and a second mounting table located under the first mounting table and having a plurality of a second opening; wherein an opening of one of the plurality of first openings is larger than a size of the other openings of the plurality of first openings and larger than a size of the plurality of second openings; and wherein the plurality of first openings The larger opening in the opening forms a channel, and the other openings in the plurality of first openings form a plurality of first processed object mounting regions, and the plurality of second openings form a plurality of second The object to be processed is placed in the area.

Moreover, another object of the present invention is to provide a substrate, a wafer, etc. A method of transporting a processed object that is transferred to a processing chamber of a limited space.

Accordingly, the present invention provides a method of transporting a processed object, which is attached to a processing chamber Transferring a processed object from a first mounting table to a processed object carrier of a second mounting table The first mounting table has a plurality of first openings, the plurality of first openings include a channel and a plurality of first processed object mounting regions, and the second mounting table has a plurality of second openings, The plurality of second openings include a plurality of second processed object mounting areas, and the processed object transporting method includes: raising a lifting mechanism and placing the second processed object mounting area and the first processed object And lifting the object to be processed in the first object to be processed area and placing it in a temporary storage area of the object to be processed; lowering the lifting mechanism and releasing the first object to be processed The first mounting table is rotated, and the channel is aligned with the lifting mechanism and the temporary storage area of the object to be processed; the lifting mechanism is raised and passed through the channel, and is placed in the temporary storage area of the object to be processed The object to be processed is taken out; and the elevating mechanism is lowered and passed through the channel and the second object to be processed, and the object to be processed is placed in the second object to be processed.

10, 20, 30, 40‧‧‧ substrate processing equipment

11-k, 21-k, 31-k, 41-k, 51-k, 61-k‧‧‧ processing chamber

12, 22‧‧‧Transfer room

13‧‧‧Substrate, semiconductor wafer

14, 24-1, 24-2, 24-3, 24-4‧‧‧ mounting table

15, 25‧‧‧Transport arm

26, 36‧‧‧ Lifting mechanism

27, 27-1, 27-2, 27-3, 27-4‧‧‧ first opening

27-5, 27-6, 27-7, 27-8, 27-9‧‧‧ first opening

28, 28-1, 28-2, 28-3, 28-4‧‧‧ second opening

28-5, 28-6, 28-7, 28-8, 28-9‧‧‧ second opening

29, 39‧ ‧ ‧ temporary storage area

37, 37-1, 37-2, 37-3, 37-4‧‧‧ third opening

37-5, 37-6, 37-7, 37-8, 37-9‧‧‧ third opening

38, 38-1, 38-2, 38-3, 38-4‧‧‧ fourth opening

38-5, 38-6, 38-7, 38-8, 38-9‧‧‧ fourth opening

FIG. 1 is a diagram showing a conventional substrate processing apparatus.

2A is a top plan view of a substrate processing apparatus in accordance with a first embodiment of the present invention.

2B is a schematic view showing a workpiece mounting table in a processing chamber of the substrate processing apparatus shown in FIG. 2A.

3A is a top plan view of a substrate processing apparatus in accordance with a second embodiment of the present invention.

3B is a schematic view showing a workpiece mounting table in a processing chamber of the substrate processing apparatus shown in FIG. 3A.

4A is a top plan view of a substrate processing apparatus in accordance with a third embodiment of the present invention.

4B is a schematic view showing a workpiece mounting table in a processing chamber of the substrate processing apparatus shown in FIG. 4A.

Fig. 5 is a schematic view showing a multilayer structure of a workpiece mounting table of the second embodiment.

Fig. 6 is a schematic view showing a multilayer structure of a workpiece mounting table according to a third embodiment.

Hereinafter, various embodiments of the present invention will be described. Please refer to Attach the drawings and refer to their corresponding descriptions. In the present specification and the drawings, the same or similar components will be denoted by the same reference numerals, and the description thereof will not be repeated.

Please refer to FIG. 2A and FIG. 2B. FIG. 2A illustrates the phase of the first embodiment of the present invention. FIG. 2B is a schematic view showing the substrate processing apparatus 20 in the processing chamber of the substrate processing apparatus 20, and FIG. The substrate processing device 20 is part of a semiconductor device. As shown in FIG. 2A and FIG. 2B, the substrate processing apparatus 20 may have a polygonal transfer chamber 22 and a plurality of processing chambers respectively coupled to the transfer chamber 22, and are represented by only one processing chamber 21-k in FIG. 2A. Where k represents one of a plurality of processing chambers. As shown in FIG. 2B, the processing chamber 21-k has a first mounting table 24-1, a second mounting table 24-2, a lifting mechanism 26, and a processed object temporary storage area 29. In the vertical relationship, the lifting mechanism 26 is located under the second mounting table 24-2, the second mounting table 24-2 is located under the first mounting table 24-1, and the first mounting table 24-1 is located. In the temporary storage area 29, wherein the lifting mechanism 26 and the processing body temporary storage area 29 (or the processing body temporary storage mechanism, for example, can clamp the periphery of the processed object (semiconductor wafer or substrate) and rise to the first mounting table The mechanism above the 24-1 is located on the same vertical axis. In the actual example, the lifting mechanism 26 can be a cylinder, but not limited thereto, or can be a linear motion mechanism.

In general, the transfer chamber 22 can be quadrangular, pentagonal, hexagonal, or other The polygons are also illustrated as octagonal in FIGS. 2A and 2B, so that the processing chamber 21-k is allocated and can be used in a space of about 45 degrees. The transfer chamber 22 is provided with a transfer arm 25, and the object to be processed (not shown) can be transported between the plurality of processing chambers by the expansion and contraction of the transfer arm 25. Moreover, as shown in FIG. 2B, the first mounting table 24-1 has four first openings 27, and the second mounting table 24-2 has four second openings 28, and four of the first openings. The first opening 27-1 of 27 is larger in size than the other first openings 27-2, 27-3 and 27-4 and larger than the four second openings 28-1, 28-2, 28-3 and Size of 28-4. Since the opening size of the first opening 27-1 is large, the first opening 27-1 can form a passage for the object to be processed to pass, and the other first openings 27-2, 27-3 and 27-4 are because of the opening size. Smaller, the object to be processed cannot pass and will be carried and placed to form three first processed object mounting areas, and the second openings 28-1, 28-2, 28-3 and 28-4 are also Since the size of the opening is small, the object to be processed cannot be passed through and is placed to form four second processed object mounting areas.

In one embodiment, the transfer arm 25 is transported from another processing chamber. The processed system is carried by the first mounting table 24-1. Hereinafter, how the object to be processed W-1 conveyed by the transfer arm 15 is transferred from the first stage 24-1 to the second stage 24-2 by the elevating mechanism 26 and the object temporary storage area 29 To explain.

For example, the object to be processed W-1 (not shown) conveyed by the transfer arm 25 is The first processed body mounting area formed by the first opening 27-3 is placed. First, the first mounting table 24-1 is rotated to align the first opening 27-3 with the lifting mechanism 26 and the workpiece temporary storage area 29. Next, the elevating mechanism 26 is vertically raised and passed through the second processed object mounting area formed by any of the second openings 28, for example, the second processed object mounting area formed by the second opening 28-3. And the first processed object mounting area formed by the first opening 27-3 to place the object to be processed W-1 placed in the first processed object mounting area formed by the first opening 27-3 Lift up and place it in the temporary storage area 29 of the object to be processed. Next, the elevating mechanism 26 is lowered and separated from the first object-substrate mounting region formed by the first opening 27-3. Next, the first mounting table 24-1 is rotated, and the passage formed by the first opening 27-1 is aligned with the elevating mechanism 26 and the object temporary storage area 29. Then, the elevating mechanism is raised 26 and passed through the passage formed by the first opening 27-1, and the object to be processed W-1 placed in the temporary storage area 29 of the object to be processed is taken out. Next, the elevating mechanism 26 is lowered and placed through the passage formed by the first opening 27-1 and the second processed body mounting area formed by the second opening 28-3, and the object to be processed W-1 is placed. The second processed body mounting area formed by the second opening 28-3. According to the above-described object transfer method, the second object 28 in the second target object placement area can be placed on the object to be processed.

In another embodiment, the transfer arm 25 is transported from other processing chambers. The processed system is carried by the second stage 24-2. Hereinafter, how the object to be processed W-2 (not shown) conveyed by the transfer arm 15 is transferred from the second stage 24-2 to the first by the elevating mechanism 26 and the object temporary storage area 29 The mounting table 24-1 will be described.

For example, when the object to be processed W-2 conveyed by the transfer arm 25 is placed, When the second object to be processed is formed in the second opening 28-3, the first stage 24-1 and the second stage 24-2 are rotated to allow the passage formed by the first opening 27-1. The elevating mechanism 26 and the object temporary storage area 29 are aligned with the second opening 28-3. Next, the elevating mechanism 26 is vertically raised and passed through the second processed body mounting region formed by the second opening 28-3 and the passage formed by the first opening 27-1 to be placed by the second The object to be processed W-2 of the second target object placement area formed by the opening 28-3 is lifted up and placed in the object temporary storage area 29. Next, the lifting mechanism 26 is lowered and disengaged. The passage formed by the first opening 27-1. Next, the first mounting table 24-1 is rotated to allow the first processed object mounting area formed by any of the other first openings 27-2, 27-3, and 27-4, for example, by the first opening 27 The first processed object mounting area formed by -3 is aligned with the elevating mechanism 26 and the processed object temporary storage area 29. Then, the elevating mechanism is raised 26 and passed through the first target object placement area formed by the first opening 27-3, and the object to be processed W-2 placed in the object temporary storage area 29 is taken out. Next, the elevating mechanism 26 is lowered and passed through the first processed object mounting area formed by the first opening 27-3 and the second processed object mounting area formed by the second opening 28-3, and will be The processing body W-2 is placed on the first processed object mounting area formed by the first opening 27-3. According to the above-described object transfer method, the first openings 27-2 to 27-4 in the first target object placement area can be placed on the object to be processed.

3A and 3B, FIG. 3A illustrates the second embodiment of the present invention. A plan view of the substrate processing apparatus 30 related to the embodiment, and FIG. 3B is a schematic view showing the object mounting stage in the processing chamber of the substrate processing apparatus 30. The substrate processing device 30 is part of a semiconductor device. As shown in FIG. 3A and FIG. 3B, the substrate processing apparatus 30 may have a transfer chamber 22 and a plurality of processing chambers respectively coupled to the transfer chamber 22, and only one processing chamber 31-k is represented in FIG. 3A, wherein k That is, it represents one of a plurality of processing chambers. As shown in FIG. 3B, the processing chamber 31-k has a first mounting table 24-1, a second mounting table 24-2, a lifting mechanism 26, and a processed object temporary storage area 29. In the vertical relationship, the lifting mechanism 26 is located under the second mounting table 24-2, the second mounting table 24-2 is located under the first mounting table 24-1, and the first mounting table 24-1 is located. The body temporary storage area 29 is located, wherein the lifting mechanism 26 and the processing body temporary storage area 29 are located on the same vertical axis. In FIGS. 3A and 3B, the transfer chamber 22 is exemplified as an octagonal shape, so that the processing chamber 31-k is allocated and can be used in a space of about 45 degrees. Moreover, as shown in FIG. 3B, the first mounting table 24-1 has four first openings 27, and the second mounting table 24-2 has nine second openings 28, and four of the first openings The first opening 27-1 of 27 is larger in size than the other first openings 27-2, 27-3 and 27-4 and larger than the nine second openings 28-1, 28-2, 28-3, Sizes of 28-4, 28-5, 28-6, 28-7, 28-8 and 28-9. Because the opening size of the first opening 27-1 is large, a channel is formed, and the other first openings 27-2, 27-3, and 27-4 form three first processed object mounting areas, and the second The openings 28-1, 28-2, 28-3, 28-4, 28-5, 28-6, 28-7, 28-8 and 28-9 form nine second processed object mounting areas.

In one embodiment, the transfer arm 25 is transported from another processing chamber. The processed system is carried by the first mounting table 24-1. In the following, how the object to be processed W-1 conveyed by the transport arm 25 is transferred from the first stage 24-1 to the second stage 24-2 by the elevating mechanism 26 and the object temporary storage area 29 Explain.

For example, when the object to be processed W-1 conveyed by the transfer arm 25 is placed, When the first object to be processed is formed by the first opening 27-3. First, the first mounting table 24-1 is rotated to align the first opening 27-3 with the lifting mechanism 26 and the workpiece temporary storage area 29. Next, the elevating mechanism 26 is vertically raised and passed through the second processed object mounting area formed by any of the second openings 28, for example, the second processed object mounting area formed by the second opening 28-3. And the first processed object mounting area formed by the first opening 27-3 to place the object to be processed W-1 placed in the first processed object mounting area formed by the first opening 27-3 Lift up and place it in the temporary storage area 29 of the object to be processed. Next, the elevating mechanism 26 is lowered and separated from the first object-substrate mounting region formed by the first opening 27-3. Next, the first mounting table 24-1 is rotated, and the passage formed by the first opening 27-1 is aligned with the elevating mechanism 26 and the object temporary storage area 29. Then, the elevating mechanism is raised 26 and passed through the passage formed by the first opening 27-1, and the object to be processed W-1 placed in the temporary storage area 29 of the object to be processed is taken out. Next, the elevating mechanism 26 is lowered and placed through the passage formed by the first opening 27-1 and the second processed body mounting area formed by the second opening 28-3, and the object to be processed W-1 is placed. The second processed body mounting area formed by the second opening 28-3. According to the above-described object transfer method, the second object 28 in the second target object placement area can be placed on the object to be processed.

Next, please refer to FIG. 4A and FIG. 4B, FIG. 4A illustrates the third embodiment of the present invention. A plan view of the substrate processing apparatus 40 according to the embodiment, and FIG. 4B is a schematic view of the object mounting stage in the processing chamber of the substrate processing apparatus 40. The substrate processing device 40 is part of a semiconductor device. As shown in FIG. 4A and FIG. 4B, the substrate processing apparatus 40 may have a transfer chamber 22 and a plurality of processing chambers respectively coupled to the transfer chamber 22, and only one processing chamber 41-k is represented in FIG. 4A, wherein k That is, it represents one of a plurality of processing chambers. As shown in FIG. 4B, the processing chamber 41-k has a first mounting table 24-1, a second mounting table 24-2, a lifting mechanism 26, and a processed object temporary storage area 29. In the vertical relationship, the lifting mechanism 26 is located under the second mounting table 24-2, the second mounting table 24-2 is located under the first mounting table 24-1, and the first mounting table 24-1 is located. The body temporary storage area 29 is located, wherein the lifting mechanism 26 and the processing body temporary storage area 29 are located on the same vertical axis. In FIGS. 4A and 4B, the transfer chamber 22 is exemplified as an octagonal shape, so that the processing chamber 41-k is allocated and usable. It is space of approximately 45 degrees. Moreover, as shown in FIG. 4B, the first mounting table 24-1 has nine first openings 27, and the second mounting table 24-2 has four second openings 28, and nine of the first openings The size of the first opening 27-1 in 27 is larger than the sizes of the other first openings 27-2, 27-3, 27-4, 27-5, 27-6, 27-7, 27-8 and 27-9. And larger than the size of the four second openings 28-1, 28-2, 28-3, and 28-4. Since the opening size of the first opening 27-1 is large, a passage is formed through which the object to be processed passes, and the other first openings 27-2, 27-3, 27-4, 27-5, 27-6, 27-7, 27-8 and 27-9 form eight first processed object mounting areas, and the second openings 28-1, 28-2, 28-3 and 28-4 form four second The body loading area is processed.

In one embodiment, the transfer arm 25 is transported from another processing chamber. The processed system is carried by the second stage 24-2. Hereinafter, how the object to be processed W-1 conveyed by the transfer arm 25 is transferred from the second stage 24-2 to the first stage 24-1 by the elevating mechanism 26 and the object temporary storage area 29 To explain.

For example, when the object to be processed W-1 conveyed by the transfer arm 15 is placed, When the second object to be processed is formed in the second opening 28-3, the first stage 24-1 and the second stage 24-2 are rotated to allow the passage formed by the first opening 27-1. The elevating mechanism 26 and the object temporary storage area 29 are aligned with the second opening 28-3. Next, the elevating mechanism 26 is vertically raised and passed through the second processed body mounting region formed by the second opening 28-3 and the passage formed by the first opening 27-1 to be placed by the second The object to be processed W-1 of the second target object placement area formed by the opening 28-3 is lifted up and placed in the object temporary storage area 29. Next, the elevating mechanism 26 is lowered and disengaged from the passage formed by the first opening 27-1. Next, the first mounting table 24-1 is rotated, and the other first openings 27-2, 27-3, 27-4, 27-5, 27-6, 27-7, 27-8, and 27 are allowed to be rotated. The first processed object mounting area formed by -9, for example, the first processed object mounting area formed by the first opening 27-3, is aligned with the elevating mechanism 26 and the processed object temporary storage area 29. Then, the elevating mechanism is raised 26 and passed through the first target object placement area formed by the first opening 27-3, and the object to be processed W-1 placed in the object temporary storage area 29 is taken out. Next, the elevating mechanism 26 is lowered and passed through the first processed object mounting area formed by the first opening 27-3 and the second processed object mounting area formed by the second opening 28-3, and will be The processing body W-1 is placed in the first processed object mounting area formed by the first opening 27-3. According to the above-described object transfer method, the first openings 27-2 to 27-9 in the first target object placement area can be placed on the object to be processed.

Next, in order to further improve space utilization, the second embodiment may be And the structure described in the third embodiment is mainly to add an additional mounting table. Referring first to FIG. 5 in conjunction with FIG. 3A, a schematic view of a multilayer structure of a processed object mounting table of the second embodiment is shown. In Fig. 5, the processing chamber 51-k is coupled to the transfer chamber 22 (Fig. 3A). The transfer chamber 22 is provided with a transfer arm 25, and the processing chamber 51-k includes a first mounting table 24-1. There are four first openings 27; the second mounting table 24-2 is located under the first mounting table 24-1 and has nine second openings 28; the third mounting table 24-3 is located at the second mounting table 24. -2 and having four third openings 37; and a fourth mounting table 24-4, located under the third mounting table 24-3 and having nine fourth openings 38; wherein the first of the four first openings 27 The size of one opening 27-1 and the size of the second opening 28-1 of the nine second openings 28 are larger than the sizes of the other openings 27-2, 27-3 and 27-4 of the four first openings, greater than The other openings 28-2, 28-3, 28-4, 28-5, 28-6, 28-7, 28-8 and 28-9 of the nine second openings are larger than the four third openings 37- 1, 37-2, 27-3, and 27-4, and larger than nine fourth openings 38-1, 38-2, 38-3, 38-4, 38-5, 38-6, 38-7 The dimensions of 38-8 and 38-9; and wherein the first opening 27-1 forms a first passage, and the second opening 28-1 forms a second passage, the first opening 27-2, 27-3 and 27-4 form three first processed object mounting areas, second openings 28-2, 28-3, 28-4, 28-5, 28-6, 28-7, 28-8 And 28-9 form eight second processed body mounting areas, and the third openings 37-1, 37-2, 27-3, and 27-4 form four third processed object mounting areas, and The four openings 38-1, 38-2, 38-3, 38-4, 38-5, 38-6, 38-7, 38-8, and 38-9 form nine fourth processed object mounting areas.

In one embodiment, the transfer arm 25 is transported from another processing chamber. The processed system is carried by the first mounting table 24-1. Hereinafter, how the object to be processed conveyed by the transfer arm 25 is transferred from the first stage 24-1 to the second stage 24-2 by the first elevating mechanism 26 and the first to-be-processed temporary storage area 29, The third stage 24-3 is transferred from the second stage 24-2 to the fourth stage 24-4 by the second lifting mechanism 36 and the second object temporary storage area 39.

For example, when the object to be processed W-1 conveyed by the transfer arm 25 is placed, When the first object to be processed is formed by the first opening 27-3, the first stage 24-1 is rotated to allow the first object to be placed by the first opening 27-3. The first lifting mechanism 26 and the first object to be processed temporary storage area 29 are provided. Next, the fourth object to be processed, which is formed by any of the fourth openings 38, and the third object to be processed, which is formed by any of the fourth openings 38, is placed in the third object to be processed. The second opening 28, for example, the second object to be processed formed by the second opening 28-3 is placed a region, and a first object to be processed region formed by the first opening 27-3 to place the object to be processed W-1 placed in the first object to be processed region formed by the first opening 27-3 Lifting up and placing it in the first object to be processed temporary storage area 29; lowering the first lifting mechanism 26 and disengaging from the first processed object mounting area formed by the first opening 27-3; and making the first mounting table 24- 1 rotating, and the first opening 27-1 or the first channel is aligned with the first lifting mechanism 26 and the first object to be processed temporary storage area 29; the first lifting mechanism 26 is raised and passed through the first opening 27-1 Or the first channel, and the object to be processed W-1 placed in the first object to be processed portion 27 is taken out; and the first lifting mechanism 26 is lowered and passed through the first opening 27-1 or the first The one channel, the second object to be processed area, the third object to be processed area, and the fourth object to be processed are placed, and the object to be processed W-1 is placed in the second object to be processed.

Moreover, the object to be processed W-2 conveyed by the transfer arm 25 is placed in the first opening When the first object to be processed is formed in the port 27-3, the first stage 24-1 is rotated to align the first object to be placed by the first opening 27-3. A lifting mechanism 26 and a first object to be processed temporary storage area 29. Next, the first elevating mechanism is raised 26 and passed through any of the fourth processed object mounting areas, any of the third processed object mounting areas, and any second opening, for example, formed by the second opening 28-3. a second object to be processed area, and a first object to be processed area formed by the first opening 27-3 to be placed on the first object to be processed formed by the first opening 27-3 The object to be processed W-2 is lifted up and placed in the first object to be processed temporary storage area 29; the first lifting mechanism is lowered 26 and separated from the first object to be processed formed by the first opening 27-3 a second area to be processed by the second opening 28-3; the first stage 24-1 and the second stage 24-2 are rotated, and the first opening 27-1 is called Aligning the first elevating mechanism 26 with the first object to be suspended in the first channel and the second opening 28-1 or the second channel; the first elevating mechanism 26 is raised and passed through the second channel and the first channel a channel, and the object to be processed W-2 placed in the first object to be processed portion 29 is taken out; and the first lifting mechanism 26 is lowered and processed through the first channel, the second channel, and the third The body mounting region and the fourth object to be processed are placed, and the object to be processed W-2 is placed in the third object to be processed.

Moreover, the object to be processed W-3 conveyed by the transfer arm 25 is placed in the first opening The first processed object mounting area formed by the opening 27-3 is then transported to any of the second processed object mounting areas formed by the second opening 28, for example, formed by the second opening 28-3. When the second object to be processed is placed, the second stage 24-2 is rotated to align the second object to be placed formed by the second opening 28-3 with the second lifting mechanism 36 and the second The processed object temporary storage area 39. Then, make the second liter The descending mechanism 36 ascends and passes through any of the fourth processed body mounting regions and the second processed body mounting region formed by the second opening 28-3 to be placed in the second processed object mounting region. The object to be processed W-3 is lifted up and placed in the second object to be processed temporary storage area 39; the second lifting and lowering mechanism 36 is lowered and separated from the second object to be processed area formed by the second opening 28-3; Rotating the second mounting table 24-2, and aligning the second opening 28-3 or the second passage with the second lifting mechanism 36 and the second processed body temporary storage area 39; raising the second lifting mechanism 36 and Taking out the object to be processed W-3 placed in the second object to be processed temporary storage area 39 through the second passage; and lowering the second lifting and lowering mechanism 36 and passing through the second and fourth processed body mounting areas The object to be processed W-3 is placed in the fourth object to be processed area.

According to the above-mentioned object transfer method, the second processed body can be loaded. The object to be processed is placed in each of the third opening 37 and the fourth opening 38 in the set area, the third processed object mounting area, and the fourth processed object mounting area.

Furthermore, referring to FIG. 6 in conjunction with FIG. 4A, the above-mentioned third embodiment is shown. Schematic diagram of the multilayer structure of the physical mounting platform. In Fig. 6, the processing chamber 61-k is connected to the transfer chamber 22 (Fig. 4A), and the transfer chamber 22 is provided with a transfer arm 25, and the processing chamber 61-k includes a first mounting table 24-1. There are nine first openings 27; the second mounting table 24-2 is located under the first mounting table 24-1 and has four second openings 28; the third mounting table 24-3 is located at the second mounting table 24. -2 and having nine third openings 37; and a fourth mounting table 24-4, located under the third mounting table 24-3 and having four fourth openings 38; wherein the nine of the nine first openings 27 The size of one opening 27-1 and the second opening 28-1 of the four second openings 28 are larger than the other openings 27-2, 27-3, 27-4, 27-5 of the nine first openings. The dimensions of 27-6, 27-7, 27-8, and 27-9, the sizes of the other openings 28-2, 28-3, and 28-4 that are greater than the four second openings are greater than the nine third openings 37- 1, 37-2, 27-3, 27-4, 37-5, 37-6, 27-7, 27-8, and 37-9, and larger than four fourth openings 38-1, 38-2 The dimensions of 38-3 and 38-4; and wherein the first opening 27-1 forms a first passage, and the second opening 28-1 forms a second passage, the first opening 27-2, 27-3, 27-4, 27-5, 27-6, 27-7, 27-8, and 27-9 form eight first processed object mounting areas, second openings 28-2, 28-3 And 28-4 form three second processed body mounting areas, third openings 37-1, 37-2, 27-3, 27-4, 37-5, 37-6, 27-7, 27- 8 and 37-9 form nine third processed object mounting areas, and the fourth openings 38-1, 38-2, 38-3 and 38-4 form four fourth processed object mounting areas.

In one embodiment, the transfer arm 25 is transported from another processing chamber. The processed system is carried by the second stage 24-2. Hereinafter, how the object to be processed conveyed by the transfer arm 25 is transferred from the second stage 24-1 to the first stage 24-2 by the first elevating mechanism 26 and the first to-be-processed temporary storage area 29, The third mounting table 24-3 is transferred from the first mounting table 24-1 to the third mounting table 24-3 by the second elevating mechanism 36 and the second processed object temporary storage area 39.

For example, when the object to be processed W-1 conveyed by the transfer arm 25 is placed, When the second object to be processed is formed in the second opening 28-3, the first mounting table 24-1 and the second mounting table 24-2 are rotated to allow the first opening 27-1 to be formed. One passage and the second processed body mounting area formed by the second opening 28-3 are aligned with the first lifting mechanism 26 and the first processed object temporary storage area 29. Next, the first elevating mechanism 26 is raised and placed on any of the fourth processed object mounting areas, any of the third processed object mounting areas, and the second processed object formed by the second opening 28-3. The first channel and the first channel are lifted by the object to be processed W-1 placed in the second object to be processed area formed by the second opening 28-3, and placed in the first object to be processed 29: lowering and disengaging the first lifting mechanism 26 from the first passage; rotating the first mounting table 24-1, and aligning any of the first processed object mounting regions with the first lifting mechanism 26 and the first object to be processed a temporary storage area 29; the first lifting mechanism 26 is raised and passed through the first processed object mounting area, and the processed object W-1 placed in the first processed object temporary storage area 29 is taken out; and the first The elevating mechanism 26 descends and passes through the first processed object mounting area, the second processed object mounting area, the third processed object mounting area, and the fourth processed object mounting area, and the object to be processed W-1 Placed in the first processed object mounting area.

Moreover, the object to be processed W-2 conveyed by the transfer arm 25 is placed in the second opening. When the second object to be processed is formed in the port 28-3, the first stage 24-1 and the second stage 24-2 are rotated to allow the first passage formed by the first opening 27-1. The first elevating mechanism 26 and the first to-be-processed temporary storage area 29 are aligned with the second processed body mounting area formed by the second opening 28-3. Next, the first elevating mechanism 26 is raised and placed on any of the fourth processed object mounting areas, any of the third processed object mounting areas, and the second processed object formed by the second opening 28-3. And a first channel for lifting the object to be processed W-2 placed in the second object to be processed area formed by the second opening 28-3, and placing it in the first object to be processed 29; lowering and disengaging the first lifting mechanism 26 from the first passage and the second processed body mounting area formed by the second opening 28-3; rotating the second mounting table 24-2 to allow the first passage to The second passage is aligned with the first lifting mechanism 26 and the first processed body temporary storage area 29; the first lifting mechanism 26 is raised and passed through the second passage and the first passage, and will be placed in The object to be processed W-2 of the first processed object temporary storage area 29 is taken out; and the first lifting mechanism 26 is lowered and passed through the first passage, the second passage, the third processed object mounting area, and the fourth object to be processed The processing area is placed, and the object to be processed W-2 is placed in the third processed object mounting area.

Moreover, the object to be processed W-3 conveyed by the transfer arm 25 is placed in the second opening. The second processed object mounting area formed by the port 28-3 is then transported to any of the first processed object mounting areas formed by the first opening 27, for example, formed by the first opening 27-3. When the first processed object mounting area is opened, the first mounting table 24-1 is rotated to align the first processed object mounting area formed by the first opening 27-3 with the second lifting mechanism 36 and the second The processed object temporary storage area 39. Next, the second elevating mechanism 36 is raised and passed through any of the third processed object mounting regions and the first processed object mounting region formed by the first opening 27-3 to be placed by the first opening 27 to 3, the object to be processed W-3 of the first object to be processed area is lifted up and placed in the second object to be processed temporary storage area 39; the second lifting mechanism 36 is lowered and separated from the first opening 27-3 formed first processed object mounting area; rotating the first mounting table 24-1, and aligning the first passage with the second lifting mechanism 36 and the second processed body temporary storage area 39 to make the second The lifting mechanism 36 ascends and passes through the first passage, and takes out the object to be processed W-3 placed in the second processed body temporary storage area 39; and lowers the second lifting mechanism 36 and passes through the first passage and the third passage The body mounting area is processed, and the object to be processed W-3 is placed in the third object to be processed area.

According to the above-mentioned object transfer method, the first processed object can be loaded. The third opening 37 and the fourth opening 38 of the set area, the third processed object mounting area, and the fourth processed object mounting area are all placed to fill the object to be processed.

The present invention has been described by way of the above embodiments. The above is for illustrative purposes The present invention can be more easily understood by those skilled in the art, but the present invention is not limited to the contents described in the above embodiments, and those skilled in the art can understand that various combinations and combinations of the above embodiments and modifications can be made without departing from the spirit of the present invention. Variety.

For example, although the first stage in the first embodiment has a pass a track, three objects to be processed, and a second stage having four objects to be processed; and, although the first stage in the second embodiment has one channel and three objects to be processed a mounting area, and the second mounting table has nine processed object mounting areas; further, although the first mounting stage in the third embodiment has one channel, eight processed object mounting areas, and the second There are four processed object mounting areas on the mounting table; although FIG. 5 shows that the first mounting table has one channel and three are placed The physical loading area, the second mounting table has one channel, eight processed object mounting areas, the third mounting table has four processed object mounting areas, and the fourth mounting table has nine processed The body mounting area; and although FIG. 6 shows that the first mounting table has one channel and eight processed object mounting areas, the second mounting table has one channel, three processed object mounting areas, and the third loading There are nine processed object mounting areas on the table, and four processed object mounting areas on the fourth mounting table. However, the design is only for the 45 degree processing chamber and the 300 mm size of the processed object. Designed, the skilled person can change the size of the stage and the number of objects to be processed according to the processing chambers of different sizes and the size of the objects to be processed of different sizes.

Further, for example, although the above embodiment has described in detail the movement of the object to be processed However, the order of the above-described handling steps is merely illustrative, and those skilled in the art can make various adjustments and changes to the order of the above-described handling steps without departing from the spirit of the above embodiments.

21-k‧‧‧Processing chamber

24-1, 24-2‧‧‧ mounting platform

26‧‧‧ Lifting mechanism

27, 27-1, 27-2, 27-3, 27-4‧‧‧ first opening

28, 28-1, 28-2, 28-3, 28-4‧‧‧ second opening

29‧‧‧Storage area

Claims (30)

A semiconductor device comprising: a transfer chamber; a transfer arm disposed on the transfer chamber; and at least one processing chamber coupled to the transfer chamber, the at least one processing chamber having a first mounting table and a a second mounting table; wherein the first mounting table has a plurality of first openings, and the second mounting table has a plurality of second openings, and wherein the size of one of the plurality of first openings And being larger than the size of the other openings in the plurality of first openings and larger than the size of the plurality of second openings; and wherein the larger opening of the plurality of first openings forms a channel, the plurality of The other openings in the first opening form a plurality of first processed object mounting areas, and the plurality of second openings form a plurality of second processed object mounting areas. The semiconductor device of claim 1, wherein the channel on the first mounting table has one, and the first object mounting area on the first mounting table has three, and the second mounting table has There are four second processed object mounting areas. The semiconductor device of claim 2, wherein the channel on the first mounting table has one, and the first object mounting area on the first mounting table has three, and the second mounting table has There are nine second processed object loading areas. The semiconductor device of claim 2, wherein the channel on the first mounting table has one, and the first object to be mounted on the first mounting table has eight, and the second mounting table has There are four such second object handling areas. The semiconductor device of claim 2 or 3, wherein the first mounting table is located on the second mounting table, and the at least one processing chamber further has a lifting mechanism and a temporary storage area of the object to be processed. A mounting stage transfers the object to be processed placed on the first object to be processed area to the second stage by the elevating mechanism and the temporary storage area of the object to be processed. The semiconductor device of claim 4, wherein the first mounting table is located on the second mounting table, and the at least one processing chamber further has a lifting mechanism and a temporary storage area of the object to be processed, the first load The loading unit transfers the object to be processed placed on the second object to be processed area to the first stage by the elevating mechanism and the temporary storage area of the object to be processed. A semiconductor device comprising: a transfer chamber; a transfer arm disposed on the transfer chamber; and at least one processing chamber coupled to the transfer chamber, the at least one processing chamber having a first mounting table, a second mounting table, a third mounting table and a fourth mounting table; wherein the first mounting table has a plurality of first openings, and the second mounting table has a plurality of second openings, the third loading The mounting platform has a plurality of third openings, and the fourth mounting table has a plurality of fourth openings, and wherein a size of one of the plurality of first openings and one of the plurality of second openings The size of one opening is larger than the size of the other openings in the plurality of first openings, larger than the size of the other openings in the plurality of second openings, larger than the size of the plurality of third openings, and larger than the plurality of fourth openings The size of the opening; and wherein the larger opening of the plurality of first openings forms a first channel, and the larger opening of the plurality of second openings forms a second channel, the The other openings of the plurality of first openings form a plurality of first processed object mounting areas, and the other openings of the plurality of second openings form a plurality of second processed object mounting areas, the plurality of third The opening forms a plurality of third processed object mounting areas, and the plurality of fourth openings form a plurality of fourth processed object mounting areas. The semiconductor device of claim 7, wherein the first channel has one, the second channel has one, the first processed object mounting area has three, and the second processed object mounting area has eight, There are four third processed object mounting areas, and nine of the fourth processed object mounting areas on the fourth mounting stage. The semiconductor device of claim 7, wherein the first channel has one, the second channel has one, the first processed object mounting area has eight, and the second processed object mounting area has three, There are four third processed object mounting areas, and nine of the fourth processed object mounting areas on the fourth mounting stage. The semiconductor device of claim 8, wherein the first mounting platform is located on the second mounting table, the second mounting platform is located on the third mounting table, and the third mounting platform is located at the fourth And the at least one processing chamber further has a first lifting mechanism, a first object to be processed temporary storage area, a second lifting mechanism, and a second processed body temporary storage area, the first load The first elevating mechanism and the first object to be processed temporary storage area are used to transfer a first object to be processed placed on the first object to be processed area to the second stage and The second mounting table; the second loading table and the second object to be processed are placed in the second object to be placed on the second object to be processed The treatment body is transferred to the fourth stage. The semiconductor device of claim 9, wherein the first mounting stage is located on the second mounting table, the second mounting stage is located on the third mounting stage, and the third mounting stage is located at the fourth stage And the at least one processing chamber further has a first lifting mechanism, a first object to be processed temporary storage area, a second lifting mechanism, and a second processed body temporary storage area, the second load The first transfer mechanism and the first processed object temporary storage area are used to transfer a first processed object placed on the second processed object mounting area to the first mounted stage and The fourth mounting table; the first loading table is configured to hold a second lifting device and the second object to be processed in the temporary storage area to allow a second to be placed on the first object to be processed area The treatment body is transferred to the third stage. A processing chamber is coupled to a transfer chamber, and the transfer chamber is provided with a transfer arm, the processing chamber comprising: a first mounting table having a plurality of first openings; a second mounting table is disposed under the first mounting table and has a plurality of second openings; wherein one of the plurality of first openings is larger in size than the other openings in the plurality of first openings The size is greater than the size of the plurality of second openings; and wherein the larger opening of the plurality of first openings forms a channel, and the other openings of the plurality of first openings form a plurality of first The processed object mounting area, and the plurality of second openings form a plurality of second processed object mounting areas. The processing chamber of claim 12, wherein the channel on the first mounting table has one, and the first object mounting area on the first mounting table has three, and the second mounting table has There are four such second object handling areas. The processing chamber of claim 12, wherein the channel on the first mounting table has one, and the first object mounting area on the first mounting table has three, and the second mounting table has There are nine second processed object loading areas. The processing chamber of claim 12, wherein the channel on the first mounting table has one, and the first substrate in the first mounting table has eight, and the second mounting table There are four second processed object loading areas on the upper surface. The processing chamber of claim 13 or 14, further comprising: a lifting mechanism located under the first mounting table and the second mounting table; and a temporary storage area of the processed object being located at the first a mounting table and the second mounting table; wherein the first mounting table is configured to be placed on the first processed object mounting area by the lifting mechanism and the temporary storage area of the processed object The body is transferred to the second stage. The processing chamber of claim 15 further comprising: a lifting mechanism located below the first mounting table and the second mounting table; and a temporary storage area of the processed object being located at the first mounting table And the second mounting table; wherein the first mounting table transfers the object to be processed placed on the second object to be processed by the lifting mechanism and the temporary storage area of the object to be processed To the first mounting table. A processing chamber is connected to a transfer chamber, and the transfer chamber is provided with a transfer arm, the processing chamber includes: a first mounting table having a plurality of first openings; and a second mounting table The first mounting table has a plurality of second openings; a third mounting table is located under the second mounting table and has a plurality of third openings; and a fourth mounting table is located at the third And a plurality of fourth openings; wherein a size of one of the plurality of first openings and a size of one of the plurality of second openings is greater than a size of the plurality of first openings a size of the other opening, a size larger than the other openings of the plurality of second openings, larger than a size of the plurality of third openings, and larger than a size of the plurality of fourth openings; and wherein the plurality of first openings The larger opening defines a first passage, and the larger opening of the plurality of second openings forms a second passage, and the other openings of the plurality of first openings form a plurality of first openings Be The physical loading area, the other openings of the plurality of second openings form a plurality of second processed object mounting areas, and the plurality of third openings form a plurality of third processed object mounting areas, and the plurality of The plurality of fourth openings form a plurality of fourth processed object mounting regions. The processing chamber of claim 18, wherein the first channel has one, the second channel has one, the first processed body mounting area has three, and the second processed object mounting area has eight There are four third processed object mounting areas, and nine of the fourth processed object mounting areas on the fourth mounting stage. The processing chamber of claim 18, wherein the first channel has one, the second channel has one, the first object to be processed has eight, and the second object has three There are four third processed object mounting areas, and nine of the fourth processed object mounting areas on the fourth mounting stage. The processing chamber of claim 19, further comprising: a first lifting mechanism, located at the first mounting table, the second mounting table, the third mounting table and the fourth mounting table; The temporary storage area of the object to be processed is located on the first mounting table, the second mounting table, the third mounting table and the fourth mounting table; a second lifting mechanism is located at the first mounting table and the second a mounting table, a third mounting table and the fourth mounting table; and a second processed object temporary storage area located in the first mounting table, the second mounting table, the third mounting table and the fourth load The first mounting platform is configured to hold a first object to be processed on the first object to be processed by the first lifting mechanism and the first object to be processed. Transferring to the second mounting table and the third mounting table; the second mounting table is placed on the second processed body by the second lifting mechanism and the second processed object temporary storage area A second object to be processed on the set is transferred to the fourth stage. The processing chamber of claim 20, further comprising: a first lifting mechanism, located at the first mounting table, the second mounting table, the third mounting table and the fourth mounting table; The temporary storage area of the object to be processed is located on the first mounting table, the second mounting table, the third mounting table and the fourth mounting table; a second lifting mechanism is located at the first mounting table and the second a mounting table, a third mounting table and the fourth mounting table; and a second processed object temporary storage area located in the first mounting table, the second mounting table, the third mounting table and the fourth load The second mounting platform is configured to hold a first object to be processed on the second object to be processed by the first lifting mechanism and the first object to be processed. Transferring to the first mounting table and the fourth mounting table; the first mounting table is placed on the first object to be processed by the second lifting mechanism and the second object to be processed A second object to be processed on the set is transferred to the third stage. A method of transporting a processed object is a method of transporting a processed object from a first mounting table to a processed object carrying method in a second mounting table, wherein the first mounting table has a plurality of An opening, the plurality of first openings comprise a channel and a plurality of first processed object mounting regions, and the second mounting table has a plurality of second openings, the plurality of second openings comprising a plurality of second processed a body loading area, the method of transporting the object to be processed includes: raising a lifting mechanism and passing the second processed object mounting area and the first processed object mounting area to place the first processed object The object to be processed in the body loading area is lifted up and placed in a temporary storage area of the object to be processed; the lifting mechanism is lowered and separated from the first object to be processed area; and the first stage is rotated, and The channel is aligned with the lifting mechanism and the temporary storage area of the object to be processed; the lifting mechanism is raised and passed through the channel, and the object to be processed placed in the temporary storage area of the object to be processed is taken out; and the lifting mechanism is caused Drop and pass the channel with the second being processed Mounting region, and the target object is placed to the second mounting region is processed. A method of transporting a processed object, in a processing chamber, transferring a processed object from a second mounting table to a processed object carrying method of a first mounting table, wherein the first mounting table has a plurality of An opening, the plurality of first openings comprise a channel and a plurality of first processed object mounting regions, and the second mounting table has a plurality of second openings, the plurality of second openings comprising a plurality of second processed a body loading area, the method of transporting the object to be processed includes: raising a lifting mechanism and passing the second object to be processed and the channel to place the object placed in the second object to be processed The processing body is lifted up and placed in a temporary storage area of the object to be processed; the lifting mechanism is lowered and disengaged from the passage; the first mounting table is rotated, and the first processed object mounting area is aligned with the lifting mechanism And the temporary storage area of the object to be processed; the lifting mechanism is raised and passed through the first processed object mounting area, and placed in the The object to be processed in the processing body temporary storage area is taken out; and the lifting mechanism is lowered and passed through the first processed object mounting area and the second processed object mounting area, and the processed object is placed thereon The first processed object mounting area. A method of transporting a processed object is carried out in a processing chamber, and a processed object is transported between a first mounting table, a second mounting table, and a third mounting table and a fourth mounting table. The first carrier has a plurality of first openings, the plurality of first openings include a first channel and a plurality of first processed object mounting regions, and the second mounting table has a plurality of second Opening, the plurality of second openings include a second channel and a plurality of second processed object mounting regions, the third mounting table has a plurality of third openings, and the plurality of third openings includes a plurality of third processed And the fourth mounting table has a plurality of fourth openings, the plurality of fourth openings includes a plurality of fourth processed object mounting areas, and the processed object carrying method comprises: causing a first lifting mechanism Raising and passing the fourth processed object mounting area, the third processed object mounting area, the second processed object mounting area, and the first processed object mounting area to be placed on the first Lifting a first object to be processed in a processed object mounting area And juxtposed into a first object to be processed; and the first lifting mechanism is lowered and separated from the first object to be processed; the first stage is rotated, and the first channel is aligned with the first a lifting mechanism and the first object to be processed; and causing the first lifting mechanism to rise and pass through the first channel to take out the first object to be processed in the first object to be processed And lowering the first elevating mechanism and passing the first passage, the second processed object mounting area, the third processed object mounting area, and the fourth processed object mounting area, and A processed object is placed in the second processed object mounting area. The method of transporting a to-be-processed object according to claim 25, further comprising: raising the first elevating mechanism and passing the fourth object to be processed area and the third part a physical placement area, the second processed object mounting area, and the first processed object mounting area to lift a second processed object placed in the first processed object mounting area, And placing the first lifting mechanism in the temporary storage area; and lowering the first lifting mechanism from the first processed object mounting area and the second processed object mounting area; and the first mounting table and the first mounting table The second stage rotates, and the first channel and the second channel are aligned with the first lifting mechanism and the first object to be processed; and the first lifting mechanism is raised and passed through the second channel a first channel, wherein the second object to be processed placed in the temporary storage area of the first object is taken out; and the first lifting mechanism is lowered and passed through the first channel, the second channel, and the third The object to be processed and the fourth object to be processed are placed, and the second object to be processed is placed in the third object to be processed. The method of transporting a processed object according to claim 25 or 26, further comprising: raising a second lifting mechanism and passing the fourth processed object mounting area and the second processed object mounting area to carry a third object to be processed placed in the second object to be processed area is lifted up and placed in a second object to be processed; and the second lifting mechanism is lowered and separated from the second object to be processed Setting the second stage to rotate the second stage to align the second lifting mechanism with the second object to be processed; and causing the second lifting mechanism to rise and pass the second channel Taking out the third object to be processed placed in the temporary storage area of the second object to be processed; and lowering the second lifting mechanism and passing the second channel and the fourth object to be processed, thereby The third object to be processed is placed in the fourth object to be processed area. A method of transporting a processed object is carried out in a processing chamber, and a processed object is transported between a first mounting table, a second mounting table, and a third mounting table and a fourth mounting table. The first carrier has a plurality of first openings, and the plurality of first openings comprise a first channel and a plurality of first processed object mounting regions, and the second mounting table has a plurality of a plurality of second openings, the plurality of second openings including a second channel and a plurality of second processed object mounting regions, the third mounting table having a plurality of third openings, the plurality of third openings comprising a plurality of a third processed object mounting area, wherein the fourth mounting stage has a plurality of fourth openings, the plurality of fourth openings includes a plurality of fourth processed object mounting areas, and the processed object carrying method includes: The first lifting mechanism rises and passes through the fourth processed object mounting area, the third processed object mounting area, the second processed object mounting area, and the first passage to be placed in the second a first object to be processed in the object loading area is lifted up and placed in a first object to be processed; the first lifting mechanism is lowered and separated from the first channel; and the first stage is rotated And the first object to be processed area is aligned with the first lifting mechanism and the first object to be processed; and the first lifting mechanism is raised and passed through the first object to be placed, and The first object to be processed placed in the temporary storage area of the first object to be processed is taken out; Lowering the first elevating mechanism and passing the first object to be processed area, the second to-be-processed object placement area, the third to-be-processed object placement area, and the fourth to-be-processed object placement area The first object to be processed is placed in the first object to be processed area. The method of transporting a processed object according to claim 28, further comprising: raising the first elevating mechanism and passing the fourth processed object mounting area, the third processed object mounting area, and the second processed a body loading area and the first channel to lift a second object to be processed placed in the second object to be processed, and place it in the first object to be processed; a lifting mechanism is lowered and disengages from the first passage and the second object to be processed; the second stage is rotated, and the first passage and the second passage are aligned with the first lifting mechanism and the first a temporary storage area; the first lifting mechanism is raised and passes through the second passage and the first passage, and is placed Taking out the second object to be processed in the temporary storage area of the first object to be processed; and lowering the first lifting mechanism and passing the first channel, the second channel, the third object to be processed and the The fourth object to be processed is placed, and the second object to be processed is placed in the third object to be processed. The method of transporting a processed object according to claim 27 or 28, further comprising: raising a second lifting mechanism and passing the third processed object mounting area and the first processed object mounting area to carry a third object to be processed placed in the first object to be processed area is lifted up and placed in a second object to be processed; and the second lifting mechanism is lowered and separated from the first object to be processed Setting the first stage to rotate the first stage to align the second lifting mechanism with the second object to be processed; and causing the second lifting mechanism to rise and pass the first channel Taking out the third object to be processed placed in the temporary storage area of the second object to be processed; and lowering the second lifting mechanism and passing the first channel and the third object to be processed, thereby The third object to be processed is placed in the third object to be processed area.