TWI750501B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

A placing part 40 of the substrate processing apparatus 1 is provided at a connection portion between a processing block 20 and an indexer block 10. The placing part 40 holds an unprocessed substrate 9 passed from the indexer block 10 to a center robot 22. Further, the placing part 40 holds a processed substrate 9 transferred from the center robot 22 to the indexer block 10. A first shielding part 51 can shut off the movement of the gas between the indexer block 10, the placing part 40 and a transport path 23 that connects a processing part 21 and the placing part 40 in the processing block 20. The indexer block 10 and the placing part 40 are low oxygen atmosphere with lower oxygen concentration than the atmosphere. Thereby, the oxidation of the substrate 9 in the substrate processing apparatus 1 can be suppressed.

Description

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for processing substrates.

Conventionally, in a substrate processing apparatus for processing substrates, a substrate accommodated in a carrier such as a hoop is unloaded by an indexer robot, placed on a placement unit, and then moved by a center robot ( center robot) is transported from the placing unit to the processing unit and given various treatments.

For example, in the substrate processing systems of Japanese Patent No. 6280837 (Document 1) and Japanese Patent No. 5626249 (Document 2), an acceptor is provided between a substrate conveying mechanism of an in-out station and a substrate conveying mechanism of a processing station. Department. Since the openings on both sides of the receiving and receiving unit are constantly opened without a locking mechanism, the internal spaces of the two stations are constantly communicated through the receiving and receiving unit. The substrate processing system is installed in a clean room (cleaning room), and supplies the air in the clean room to the inner space of the two stations via FFU (fan filter unit; fan filter unit).

In the substrate processing system of Document 1, the pressure of the internal space of the loading and unloading station is set higher than the pressure of the internal space of the processing station, thereby forming the flow of air from the loading and unloading station to the processing station through the receiving and receiving section. Thereby, the chemical atmosphere etc. which generate|occur|produce in a process unit are suppressed from entering a carry-in and carry-out station. In addition, in order to reduce the influence of humidity on the devices on the wafer in the transfer section, a gas ejection section for supplying dry gas is provided in the opening of the transfer section on the loading and unloading station side.

On the other hand, in the substrate processing apparatus of Japanese Patent No. 4669257 (Document 3), a load lock chamber, a transfer chamber in which a transfer robot is arranged, and a processing chamber for processing wafers are provided by It is evacuated by a vacuum pump. In addition, in this substrate processing apparatus, nitrogen can be supplied to the load lock chamber, the transfer chamber, and the processing chamber. Contamination of the substrate such as reverse diffusion of oil from the vacuum pump is suppressed by supplying nitrogen.

In addition, the substrate processing apparatus of Japanese Patent No. 3737604 (Document 4) includes a receiving chamber on which a carrier that accommodates a plurality of unprocessed substrates is placed, and a transfer chamber on which a transfer robot is arranged; A plurality of processing chambers; and a transfer chamber, on which a plurality of processed substrates have been accommodated. In this substrate processing apparatus, an inert gas is supplied to each chamber, and the pressure in each chamber is set so that the pressure of the transfer chamber is higher than the pressure of the transfer chamber and the pressure of the transfer chamber is higher than the pressure of the plurality of processing chambers.

However, in the apparatus of Document 1, although there is a flow of air from the loading and unloading station toward the processing station, there is a concern that the chemical atmosphere generated in the processing unit may enter the loading and unloading station through the processing station due to diffusion. In addition, since the wafers placed in the receiving and receiving parts are in contact with the air for a long time, there is a concern that the surface of the wafers is oxidized.

In addition, in the apparatus of Document 3, the load lock chamber, the transfer chamber, and the processing chamber can be set to a low-oxygen atmosphere, but since all of the load lock chamber, the transfer chamber, and the processing chamber need to have a structure that can cope with a vacuum atmosphere, From the viewpoints of complication and enlargement of the apparatus, it is not considered to apply the structure of the apparatus to a substrate processing apparatus that does not perform processing under vacuum.

In the apparatus of Document 4, the pressure of the transfer chamber is set to be higher than the pressure of the transfer chamber, whereby the flow of the inert gas from the transfer chamber to the transfer chamber is formed when the shutter between the transfer chamber and the transfer chamber is opened, but the There is a concern that the chemical atmosphere generated in the processing chamber enters the transfer chamber through the transfer chamber due to diffusion.

[The problem to be solved by the invention]

The present invention is directed to a substrate processing apparatus for processing a substrate, and aims to suppress oxidation of the substrate by setting the space in which the substrate is placed for a long time to a low-oxygen atmosphere.

A substrate processing apparatus according to a preferred aspect of the present invention includes: a processing block, which is provided with a processing unit for processing substrates and a first transfer robot for carrying in and out of substrates relative to the processing unit; an index area The block is equipped with a second transfer robot for carrying the substrates in and out of the carrier capable of accommodating a plurality of substrates; the placing unit is provided at the connecting portion between the processing block and the index block, used to hold the unprocessed substrates transferred from the second transfer robot to the first transfer robot and the processed substrates transferred from the first transfer robot to the second transfer robot; and the first shielding portion, which can block The movement of the gas between the index block and the placing unit in a low oxygen atmosphere with an oxygen concentration lower than that of the atmosphere, and the conveying path connecting the processing unit and the placing unit in the processing block. According to this substrate processing apparatus, the oxidation of the substrate can be suppressed.

Preferably, the first shielding portion includes a door body for opening and closing an opening for connecting the inner space of the conveyance path and the inner space of the placement unit.

Preferably, the substrate processing apparatus further includes a first gas supply unit configured to supply an inert gas to the placement unit, thereby setting the placement unit to a low-oxygen atmosphere.

Preferably, the substrate processing apparatus is further provided with: a second shielding portion capable of blocking the movement of the gas between the index block and the placing unit.

Preferably, the second shielding portion includes a door for opening and closing an opening for connecting the inner space of the index block and the inner space of the placing unit.

Preferably, the substrate processing apparatus further includes: a second gas supply unit for supplying an inert gas to the index block, thereby setting the index block in a low-oxygen atmosphere.

Preferably, the substrate processing apparatus is further provided with: a second shielding part for blocking the movement of gas between the index block and the placing unit; and a first gas supplying part for supplying the placing unit an inert gas for setting the placing unit in a low-oxygen atmosphere; a second gas supply part for supplying an inert gas to the index block, thereby setting the index block in a low-oxygen atmosphere; and a control part, for The supply of the inert gas from the first gas supply part and the supply of the inert gas from the second gas supply part are individually controlled.

Preferably, the oxygen concentration of the conveyance path is higher than the oxygen concentration of the index block and the oxygen concentration of the placement unit.

Preferably, the aforementioned conveyance path is in the atmosphere.

Preferably, the substrate processing apparatus further includes: a first gas supply unit for supplying an inert gas to the placement unit, thereby setting the placement unit in a low-oxygen atmosphere; and a second shielding unit for blocking movement of gas between the index block and the placing unit; and a control unit for controlling the first transfer robot, the second transfer robot, the first shielding unit, the first gas supply unit, and the second shade. The first shielding portion includes a first door body for opening and closing a first opening for connecting the inner space of the conveyance path and the inner space of the placement unit. The second shielding portion includes a second door for opening and closing a second opening for connecting the inner space of the index block and the inner space of the placing unit. Under the control of the control unit, the placing unit is set to a low-oxygen atmosphere in a state where the first opening and the second opening are closed by the first door and the second door, and then the first door is opened. Two openings, the unprocessed substrates are loaded into the placing unit through the second opening by the second transfer robot, the second opening is closed by the second door, the first opening is opened, and the first opening is opened by the second opening. The first transfer robot carries out the unprocessed substrate from the placement unit through the first opening.

Preferably, the substrate processing apparatus further includes: a first gas supply unit for supplying an inert gas to the placement unit, thereby setting the placement unit in a low-oxygen atmosphere; and a second shielding unit for blocking movement of gas between the index block and the placing unit; and a control unit for controlling the first transfer robot, the second transfer robot, the first shielding unit, the first gas supply unit, and the second shade. The first shielding portion includes a first door body for opening and closing a first opening for connecting the inner space of the conveyance path and the inner space of the placement unit. The second shielding portion includes a second door for opening and closing a second opening for connecting the inner space of the index block and the inner space of the placing unit. Under the control of the control unit, in a state in which the second opening is closed by the second door and the first opening is opened, the processed substrate is carried in through the first opening by the first transfer robot. After the placing unit, the first opening is closed by the first door, and the first opening and the second opening are placed in a state in which the first opening and the second opening are closed by the first door and the second door. After the unit is set in a low-oxygen atmosphere, the second opening is opened, and the processed substrate is carried out from the placement unit through the second opening by the second transfer robot.

The present invention also focuses on a substrate processing method for processing a substrate by a substrate processing apparatus. The substrate processing apparatus includes: a processing block configured with a processing unit for processing substrates and a first transfer robot for carrying in and out of substrates relative to the processing unit; an index block configured with processing a second transfer robot for carrying and unloading substrates into and out of a carrier capable of accommodating a plurality of substrates; and a loading unit, which is arranged at the connection portion between the processing block and the index block, and is used to maintain the load from the first Two unprocessed substrates transferred from the first transfer robot to the first transfer robot and processed substrates transferred from the first transfer robot to the second transfer robot. A substrate processing method according to a preferred aspect of the present invention includes: step (a), wherein the second transfer robot transfers the substrate from the index block to the placing unit; step (b), is performed by The first transfer robot unloads the substrate from the placement unit and carries it into the processing unit; step (c) is to process the substrate in the processing unit; step (d) is performed by the first transfer robot The substrate is unloaded from the processing unit and loaded into the placement unit; and in step (e), the second transfer robot is used to unload the substrate from the placement unit to the index block. The movement of the gas between the index block and the placing unit and the conveying path in the low-oxygen atmosphere with the oxygen concentration lower than that of the atmospheric air can be blocked, and the conveying path is connected with the treating unit and the placing in the treating block. unit. Thereby, according to this substrate processing method, the oxidation of the substrate can be suppressed.

The above-described objects and other objects, features, aspects, and advantages of the present invention will become apparent from the following detailed description of the present invention with reference to the accompanying drawings.

FIG. 1 is a plan view of a substrate processing apparatus 1 according to one embodiment of the present invention. FIG. 2 is a view of the substrate processing apparatus 1 viewed from the line II-II in FIG. 1 . In addition, the XYZ orthogonal coordinate system which makes the Z-axis direction the vertical direction (that is, the up-down direction) and the XY plane as the horizontal plane is appropriately attached to each figure referred to below. In addition, in FIG. 2, illustration of a part of the +X side of the substrate processing apparatus 1 is abbreviate|omitted.

The substrate processing apparatus 1 is an apparatus for continuously processing a plurality of substantially disc-shaped semiconductor substrates 9 (hereinafter simply referred to as "substrates 9"). In the substrate processing apparatus 1 , for example, liquid processing for supplying a processing liquid to the substrate 9 is performed. The substrate processing apparatus 1 includes a plurality of carrier stages 11 , an index block 10 , a processing block 20 , a mounting unit 40 , and a control unit 60 . The index block 10 and the processing block 20 are also referred to as an index area and a processing area, respectively. In addition, the index block 10 is also referred to as an Equipment Front End Module (EFEM; Equipment Front End Module) unit or the like. In the example shown in FIG. 1 , a plurality of (for example, three) carrier stages 11 , index blocks 10 , and processing blocks 20 are arranged adjacent to each other in this order from the −X side toward the +X side.

The plurality of carrier stages 11 are arranged in the Y direction along the side wall on the -X side of the index block 10 . The plurality of carrier tables 11 are respectively a mounting table on which the carrier 95 is mounted. The carrier 95 can accommodate a plurality of disk-shaped substrates 9 . The inner space of the carrier 95 is filled with an inert gas such as nitrogen (N ₂ ) or argon (Ar) and becomes a low-oxygen atmosphere. An opening is provided at a position corresponding to the carrier 95 on each carrier table 11 in the side wall on the -X side of the index block 10 . A carrier shutter is provided at the opening, and the carrier shutter is opened and closed when the substrate 9 is carried out and loaded into the carrier 95 .

The carriers 95 that have accommodated the plurality of unprocessed substrates 9 are carried in from the outside of the substrate processing apparatus 1 by an OHT (Overhead Hoist Transfer) or the like, and are placed on the respective carrier stages 11 . In addition, the processed substrates 9 that have been processed in the processing block 20 are accommodated in the carrier 95 placed on the carrier stage 11 . The carrier 95 in which the processed substrate 9 is accommodated is carried out to the outside of the substrate processing apparatus 1 by OHT or the like. That is, the stage 11 functions as a substrate stacking portion for stacking the unprocessed substrates 9 and the processed substrates 9 .

The carrier 95 is, for example, a FOUP (Front Opening Unified Pod) used to accommodate the substrate 9 in a closed space. The carrier 95 is not limited to FOUP, for example, it can also be a SMIF (Standard Mechanical Inter Face; Standard Manufacturing Interface) box or the like. In addition, the number of the carrier stage 11 may be one or more than two.

The index block 10 receives the unprocessed substrate 9 from the carrier 95 and transfers it to the processing block 20 . In addition, the index block 10 receives the processed substrate 9 carried out from the processing block 20 and carries it into the carrier 95 . In the inner space 100 of the index block 10, an index robot 12 for carrying the substrate 9 in and out of the carrier 95 is disposed.

The index robot 12 includes two transfer arms 121 a and 121 b , an arm base 122 and a base 123 . The two conveyance arms 121 a and 121 b are mounted on the arm base 122 . The base 123 is fixed to the frame of the index block 10 .

The arm base 122 is mounted on the base 123 . A motor (not shown) for rotating the arm table 122 around a rotation axis extending in the up-down direction (ie, the Z direction) and a motor (not shown) for moving the arm table 122 in the up-down direction are built in the base 123 . icon). The conveyance arms 121a and 121b are arranged on the arm base 122 so as to be separated from each other up and down.

A substantially U-shaped hand is provided at the front ends of the conveyance arms 121a and 121b, respectively. The hand is provided with, for example, a base extending in the width direction, and two pawls extending from both widthwise ends of the base in a longitudinal direction perpendicular to the widthwise direction. The conveying arms 121a and 121b respectively support the lower surface of one substrate 9 with their hands. In addition, the conveying arms 121a and 121b are flexed and extended by a multi-joint mechanism by a drive mechanism (not shown) built in the arm base 122 so as to follow the horizontal direction (that is, the radial direction with the rotation axis of the arm base 122 as the center). move independently of each other. In other words, the hand is provided on the index robot 12 so as to be able to move forward and backward, to extend and fall, and to rotate freely.

The indexing robot 12 is a transfer robot for individually accessing the carrier 95 and the placing unit 40 on the carrier table 11 by the transfer arms 121a and 121b holding the substrate 9 by their hands, respectively. Here, the substrate 9 is conveyed between the carrier 95 and the placement unit 40 . The moving mechanism described above in the index robot 12 is not limited to the example described above, and may be other mechanisms. For example, as a mechanism for moving the conveyance arms 121a and 121b in the up-down direction, a belt conveying mechanism using a pulley and a timing belt or the like may be employed.

The processing block 20 is provided with a conveyance path 23 used for conveyance of the substrate 9 , and a plurality of processing units 21 arranged around the conveyance path 23 . In the example shown in FIG. 1, the conveyance path 23 extends in the X direction at the center of the processing block 20 in the Y direction. The center robot 22 is arranged in the inner space 230 of the conveyance path 23 , and the center robot 22 is used for carrying in and out of the substrates 9 with respect to the respective processing units 21 .

The center robot 22 includes two transfer arms 221 a and 221 b , an arm base 222 , and a support column 223 . The two conveyance arms 221 a and 221 b are mounted on the arm base 222 . The pillars 223 are fixed to the frame of the processing block 20 .

The arm platform 222 is provided on the support column 223 so as to be movable in the vertical direction. A lift mechanism 224 for moving the arm table 222 in the up-down direction is built in the support column 223 . The elevating mechanism 224 is, for example, a mechanism combining a motor and a ball screw. The structure of the elevating mechanism 224 may be variously changed. The conveyance arms 221a and 221b are arranged on the arm base 222 so as to be separated from each other up and down.

A substantially U-shaped hand is provided at the front ends of the conveyance arms 221a and 221b, respectively. The hand is provided with, for example, a base extending in the width direction, and two pawls extending from both widthwise ends of the base in a longitudinal direction perpendicular to the widthwise direction. The conveying arms 221a and 221b support the lower surface of one substrate 9 with their hands, respectively. The conveying arms 221a and 221b move independently of each other in the horizontal direction by flexing and extending the multi-joint mechanism by a drive mechanism (not shown) built in the arm base 222 . In addition, the conveyance arms 221a and 221b are rotated horizontally independently of each other by the drive mechanism built in the arm base 222 . In other words, the hand is provided on the center robot 22 so as to be able to move forward and backward, to extend and fall, and to rotate freely.

The central robot 22 is a transfer robot, and is used to individually access the transfer arms 221 a and 221 b holding the substrate 9 by their hands to the placing unit 40 and the plurality of processing units 21 , so that the placing unit 40 and the processing units 21 The board 9 is conveyed between 21. In the following description, the center robot 22 and the index robot 12 are also referred to as "first transfer robot" and "second transfer robot", respectively. The moving mechanism described above in the center robot 22 is not limited to the example described above, and may be other mechanisms. For example, as a mechanism for moving the conveyance arms 221a and 221b in the up-down direction, a belt conveying mechanism using a pulley and a timing belt, etc. may be employed.

In each processing unit 21, the substrate 9 is processed. In the example shown in FIG. 1 and FIG. 2 , twelve processing units 21 are provided in the processing block 20 . Specifically, four groups of three processing units 21 stacked in the Z direction are arranged around the processing unit 21 in a plan view.

FIG. 3 is a diagram showing an example of the processing unit 21 . The processing unit 21 includes a housing 211 and a processing unit 24 . The processing unit 24 is accommodated in the inner space of the casing 211 . The processing unit 24 includes a substrate holding unit 241 , a substrate rotating mechanism 242 , a cup unit 243 , a nozzle 244 , and a top plate 245 . The processing unit 24 performs, for example, liquid processing such as etching processing on the upper surface 91 of the substrate 9 .

The substrate holding portion 241 holds the substrate 9 in a horizontal state, for example. The substrate holding portion 241 includes, for example, a plurality of mechanical chucks, and the plurality of mechanical chucks contact and hold the peripheral portion of the substrate 9 . The substrate rotation mechanism 242 rotates the substrate holding portion 241 about the rotation axis J1 facing the vertical direction as a center, thereby rotating the substrate 9 held by the substrate holding portion 241 . The substrate rotation mechanism 242 is, for example, an electric motor, and is connected to the lower surface of the substrate holding portion 241 .

The cover portion 243 is a substantially cylindrical member, and surrounds the periphery of the substrate holding portion 241 over the entire circumference. The cover portion 243 catches the liquid scattered from the rotating substrate 9 to the surroundings. The top plate 245 is a blocking plate, covering the top of the substrate 9 and blocking the surrounding atmosphere. The top plate 245 is supported from below by, for example, the substrate holding portion 241 , and is rotated together with the substrate holding portion 241 by the substrate rotating mechanism 242 . The nozzle 244 is inserted into the opening provided in the center part of the top plate 245 , and supplies the processing liquid to the center part of the upper surface of the substrate 9 .

As shown in FIG. 1 and FIG. 2 , between the index block 10 and the processing block 20 , a partition wall 30 for an atmosphere barrier extending substantially in the Y direction is provided. The partition wall 30 is provided over the entire length of the index block 10 in the Y direction and the entire length in the Z direction. In the central portion of the index block 10 in the Y direction, a part of the partition wall 30 protrudes to the side of the processing block 20 (that is, the +X side). In the following description, this protruding portion is referred to as a "connecting portion 31". The slightly tunnel-shaped inner space 310 of the connection unit 31 is a part of the inner space 100 of the index block 10 , and connects the index block 10 and the transport path 23 of the processing block 20 .

The placing unit 40 is placed on the end portion on the +X side in the inner space 310 of the connecting portion 31 . In other words, the mounting unit 40 is disposed at the connection portion between the index block 10 and the processing block 20 . As described above, the index robot 12 and the center robot 22 can access the placement unit 40 . The placement unit 40 is connected to the plurality of processing units 21 via the conveyance path 23 in which the center robot 22 is arranged.

The index robot 12 places the unprocessed substrate 9 carried out from the carrier 95 on the placement unit 40 . The center robot 22 carries out the unprocessed substrate 9 from the placement unit 40 and carries it into the processing unit 21 . In addition, the center robot 22 mounts the processed substrate 9 carried out from the processing unit 21 on the mounting unit 40 . The index robot 12 carries out the processed substrate 9 from the placement unit 40 and carries it into the carrier 95 . In other words, the placement unit 40 holds the unprocessed substrates 9 transferred from the indexing robot 12 to the center robot 22 and the processed substrates 9 transferred from the center robot 22 to the indexing robot 12 .

FIG. 4 is a side view of the placement unit 40 viewed from the +X side. FIG. 5 is a side view of the placement unit 40 viewed from the -X side. FIG. 6 is a view of the inside of the placement unit 40 viewed from the +X side. In FIG. 6 , the frame body 434 of the placement unit 40 is shown in cross section, and the inside of the placement unit 40 is illustrated. In addition, in FIG. 6, the structure other than the mounting unit 40 is shown together.

The placement unit 40 includes a frame body 434 , a substrate support portion 431 , a first shutter 432 , and a second shutter 433 . The frame body 434 is a substantially cubic box-shaped member. Four substrates 9 can be accommodated in the inner space 400 of the placement unit 40 . The four substrates 9 are arranged in a state of being separated from each other, and are placed in the vertical direction (that is, the Z direction). The substrate support portion 431 is accommodated inside the frame body 434 . The substrate support portion 431 supports each of the substrates 9 in a horizontal state. The substrate support portion 431 is, for example, a plurality of convex portions protruding from the inner surface of the frame body 434 , and the peripheral portion of the substrate 9 is placed on the plurality of convex portions. The shape and structure of the substrate support portion 431 may be appropriately changed.

A first opening 435 is provided on the side wall on the +X side of the frame body 434 , and the first opening 435 connects the inner space 230 of the conveyance path 23 of the processing block 20 and the inner space 400 of the placing unit 40 . The first opening 435 is a substantially rectangular through hole. The first opening 435 allows the two substrates 9 held by the central robot 22 to pass therethrough. A second opening 436 is provided on the side wall on the -X side of the frame body 434 , and the second opening 436 connects the inner space 100 of the index block 10 and the inner space 400 of the placing unit 40 . The second opening 436 is a substantially rectangular through hole. The second opening 436 allows the two substrates 9 held by the indexing robot 12 to pass therethrough.

The first blocking door 432 is a door body (ie, the first door body) used to open and close the first opening 435 of the frame body 434 . The first shutter 432 is a substantially rectangular plate-shaped member. The first door 432 is moved in the up-down direction (ie, the Z direction) and also in the X direction by the first door moving mechanism 437 . The first door moving mechanism 437 includes, for example, an actuator (not shown) such as an electric cylinder for moving the first door 432 in the vertical direction, and an actuator (not shown) for moving the first door 432 An actuator (not shown) such as an electric cylinder is pressed against the frame body 434 . In addition, illustration of the 1st shutter moving mechanism 437 is abbreviate|omitted in FIG.

As shown by the solid line in FIG. 4 , the first shutter 432 overlaps with the first opening 435 in the X direction, whereby the first opening 435 is closed. The first shutter 432 is pressed toward the frame body 434 by the first shutter door moving mechanism 437 , thereby airtightly contacting the frame body 434 around the first opening 435 . Thereby, the gas between the inner space 230 of the conveyance path 23 of the processing block 20 and the inner space 400 of the placing unit 40 is blocked from moving through the first opening 435 . Furthermore, the first opening 435 is opened by moving the first door 432 away from the frame 434 in the +X direction by the first door moving mechanism 437 and then descending toward the position shown by the two-dot chain line in FIG. 4 . Thereby, the air between the inner space 230 of the conveyance path 23 and the inner space 400 of the placement unit 40 can move through the first opening 435 .

The second blocking door 433 is a door body (ie, the second door body) used to open and close the second opening 436 of the frame body 434 . The second shutter 433 is a substantially rectangular plate-like member. The second door 433 is moved in the up-down direction (ie, the Z direction) and also in the X direction by the second door moving mechanism 438 . The second shutter moving mechanism 438 includes, for example, an actuator (not shown) such as an electric cylinder for moving the second shutter 433 in the vertical direction, and an electric motor for pressing the second shutter 433 toward the frame 434 . Actuators such as cylinders (not shown). In addition, illustration of the 2nd door moving mechanism 438 is abbreviate|omitted in FIG.

As shown by the solid line in FIG. 5 , the second shutter 433 overlaps with the second opening 436 in the X direction, whereby the second opening 436 is closed. The second shutter 433 is pressed toward the frame body 434 by the second shutter moving mechanism 438 , thereby airtightly contacting the frame body 434 around the second opening 436 . Thereby, the gas between the inner space 100 of the index block 10 and the inner space 400 of the placing unit 40 is blocked from moving through the second opening 436 . In addition, the second door 433 is separated from the frame body 434 in the -X direction by the second door moving mechanism 438 and then descends toward the position shown by the two-dot chain line in FIG. 5 , whereby the second opening 436 is opened. . Thereby, the air between the inner space 100 of the index block 10 and the inner space 400 of the placing unit 40 can move through the second opening 436 .

In a state where the first opening 435 of the placing unit 40 is closed by the first shutter 432, the partition wall 30 including the connecting portion 31 shown in FIG. 1 and FIG. 2, the frame body 434 of the placing unit 40, and the The first shutter 432 moved by the first shutter moving mechanism 437 blocks the movement of the gas between the index block 10 and the placement unit 40 and the conveyance path 23 of the processing block 20 . That is, the partition wall 30 , the frame body 434 , the first shutter 432 and the first shutter moving mechanism 437 constitute the first shielding portion 51 , and the first shielding portion 51 can block the index block 10 and the placing unit 40 from processing The movement of the gas between the conveyance paths 23 of the block 20 . The first shielding portion 51 may also include structures other than the partition wall 30 , the frame body 434 , the first shutter 432 , and the first shutter moving mechanism 437 .

In addition, in a state where the second opening 436 of the placement unit 40 is closed by the second shutter 433 moved by the second shutter moving mechanism 438, the frame 434 of the placement unit 40 and the second shutter 433 The movement of the gas between the index block 10 and the placing unit 40 is blocked. That is, the frame body 434 , the second shutter 433 , and the second shutter moving mechanism 438 constitute the second shielding portion 52 , and the second shielding portion 52 can block the gas between the index block 10 and the placing unit 40 . move. The second shielding portion 52 may also include structures other than the frame body 434 , the second shutter 433 and the second shutter moving mechanism 438 .

As shown in FIG. 6 , the substrate processing apparatus 1 further includes a first gas supply unit 55 that supplies an inert gas (eg, nitrogen or argon) to the mounting unit 40 . The first gas supply part 55 includes a central discharge part 551 , a peripheral discharge part 552 , a side discharge part 553 , and an exhaust port 554 . The central ejection portion 551 and the peripheral ejection portion 552 are arranged in the vicinity of the top cover portion of the frame body 434 of the mounting unit 40 , and are connected to the inert gas supply source 58 via the valve 581 . The side ejection portion 553 is arranged around the substrate 9 placed in the placement unit 40 , and is connected to the inert gas supply source 58 via the valve 582 . The exhaust port 554 is connected to the suction mechanism 59 . The inert gas supply source 58 and the suction mechanism 59 are provided, for example, outside the substrate processing apparatus 1 .

The central ejection portion 551 is located above the central portion (ie, the portion excluding the peripheral portion) of the substrate 9 placed in the placement unit 40 . The lower surface of the central ejection portion 551 is formed of, for example, a substantially disc-shaped punching plate in which a plurality of ejection ports are distributed approximately evenly. The peripheral ejection portion 552 is located above the peripheral portion of the substrate 9 placed in the placement unit 40 . On the lower surface of the peripheral discharge portion 552, for example, a substantially annular and slit-shaped discharge port is provided.

The side ejection portion 553 includes a plurality of ejection elements 555, and the plurality of ejection elements 555 are arranged at approximately equal angular intervals in the circumferential direction around the substrate 9 (that is, the central axis extending in the normal direction through the center of the substrate 9). as the circumferential direction of the center). Each of the ejection elements 555 is a member having a substantially cylindrical bottom, and extends from the top cover portion of the frame body 434 to a substantially vertical downward direction. The lower end of each ejection element 555 is located on the lower side than the substrate 9 located at the lowermost stage (ie, closest to the -Z side). A plurality of ejection ports are provided on the side surfaces of each ejection element 555 toward the direction in which the substrate 9 is placed (that is, toward the inner direction in the radial direction with the center axis as the center described above). In the example shown in FIG. 6 , each of the ejection elements 555 is provided with three ejection ports, which are located in the vertical direction at approximately the same positions as the three gaps of the four substrates 9 arranged in the vertical direction. The exhaust port 554 is arranged below the four substrates 9 . In the example shown in FIG. 6 , the plurality of exhaust ports 554 are arranged in the circumferential direction at approximately equal angular intervals.

In the placement unit 40, when the first opening 435 and the second opening 436 are closed by the first shutter 432 and the second shutter 433, as described above, the inner space 400 of the placement unit 40 is connected to the index The inner space 100 of the block 10 and the inner space 230 of the conveyance path 23 are blocked. In this state, the valve 581 and the valve 582 are opened, the inert gas is supplied to the placement unit 40, and the suction mechanism 59 sucks through the exhaust port 554, whereby the air in the inner space 400 of the placement unit 40 is replaced with inert gas gas, the inner space 400 of the mounting unit 40 becomes an inert gas atmosphere. In other words, the inner space 400 of the placement unit 40 becomes a low-oxygen atmosphere with an oxygen concentration lower than that of the atmosphere. The oxygen concentration of the mounting unit 40 is, for example, 100 ppm or less.

Specifically, when the valve 581 is opened, the inert gas is supplied from the central ejection portion 551 to a slightly vertically downward direction. The inert gas system from the central ejection portion 551 flows from the central ejection portion 551 toward the substrate 9 located at the uppermost stage (ie, the closest to the +Z side) slightly vertically downward, and flows radially outward along the upper surface of the substrate 9 . . The flow of inert gas is shown by arrows in FIG. 6 . The inert gas is supplied from the peripheral discharge portion 552 toward the outer side in the radial direction and toward the lower side. The above-described supply direction of the inert gas from the peripheral discharge portion 552 is achieved by, for example, orienting the discharge port of the peripheral discharge portion 552 toward the outer direction in the radial direction and downward. The inert gas system from the peripheral ejection portion 552 flows downward through the vicinity of the peripheral edge of the uppermost substrate 9 . Thereby, the air which exists above and the side of the board|substrate 9 flows below the board|substrate 9, and is exhausted to the outside of the mounting unit 40 via the exhaust port 554.

The flow velocity of the inert gas jetted from the peripheral jetting portion 552 is, for example, larger than the flow velocity of the inert gas jetted from the central jetting portion 551 . Thereby, the air above the substrate 9 can be quickly pushed toward the exhaust port 554 . In addition, by setting the flow velocity of the inert gas ejected from the central ejection portion 551 to be small, the vibration of the uppermost substrate 9 due to the inert gas from the central ejection portion 551 can be suppressed.

In addition, in the mounting unit 40, when the valve 582 is opened, the inert gas is supplied from the plurality of ejection elements 555 of the side ejection portion 553 toward the inner direction in the radial direction. The inert gas system from the side ejection portion 553 flows downward from the periphery of the substrate 9 through the gap between the four substrates 9 arranged in the vertical direction. As a result, the air existing between the plurality of substrates 9 flows below the substrates 9 and is exhausted to the outside of the placement unit 40 through the exhaust port 554 .

As shown in FIG. 2 , the substrate processing apparatus 1 further includes a second gas supply unit 56 , and the second gas supply unit 56 supplies an inert gas (eg, nitrogen or argon) to the index block 10 . The second gas supply part 56 includes a gas ejection part 561 and an exhaust port 562 . The gas ejection portion 561 is disposed near the top cover portion of the index block 10, and is connected to the inert gas supply source 58 (see FIG. 6 ) via a valve not shown. The exhaust port 562 is connected to the suction mechanism 59 (refer to FIG. 6 ). In addition, the gas ejection part 561 may be connected to another inert gas supply source different from the inert gas supply source 58 . In addition, the exhaust port 562 may also be connected to other suction mechanisms different from the suction mechanism 59 .

The gas ejection portion 561 is located above the index robot 12 , and is provided over almost the entire upper surface of the index robot 10 . The gas ejection unit 561 is, for example, an FFU. The exhaust port 562 is arranged at a portion (or a bottom surface) near the bottom surface of the side wall of the index block 10 .

In the placing unit 40, when the second opening 436 is closed by the second shutter 433, as described above, the inner space 100 of the index block 10 is connected to the inner space 400 of the placing unit 40 and the conveying path 23 The inner space 230 is blocked. In this state, the valve described above is opened, the inert gas is supplied to the index block 10 from the gas ejection part 561 , and the suction mechanism 59 sucks through the exhaust port 562 , whereby the inner space 100 of the index block 10 is sucked. The air is replaced with an inert gas, and the inner space 400 of the mounting unit 40 becomes an inert gas atmosphere. In other words, the inner space 100 of the index block 10 is set to a hypoxic atmosphere with an oxygen concentration lower than that of the atmosphere. The oxygen concentration of the index block 10 is, for example, 100 ppm or less.

The supply of the inert gas system from the second gas supply unit 56 is continuously performed while the substrate processing apparatus 1 processes the substrate 9 (described later), and the inner space 100 of the index block 10 is maintained in a low-oxygen atmosphere. In the case where the second opening 436 is opened in the placement unit 40 , the inert gas is supplied from the first gas supply part 55 and the second gas supply part 56 , whereby the inner space 400 of the placement unit 40 and the inner space of the index block 10 are supplied with inert gas. The inner space 100 is set to a hypoxic atmosphere.

The substrate processing apparatus 1 further includes an air supply unit 57 , and the air supply unit 57 supplies clean air to the conveyance path 23 of the processing block 20 . The air supply part 57 is provided with the air ejection part 571 and the exhaust port 572 (refer FIG. 1). The air ejection unit 571 is disposed near the top cover of the conveyance path 23 , and supplies clean air in the clean room in which the substrate processing apparatus 1 is disposed to the inner space 230 of the conveyance path 23 . The air ejection part 571 is located above the center robot 22 , and is provided almost entirely over the upper surface of the conveyance path 23 . The air ejection unit 571 is, for example, an FFU. The exhaust port 572 is arranged at a portion (or a bottom surface) near the bottom surface of the side wall of the conveyance path 23 among the ends on the +X side of the conveyance path 23 . The exhaust port 572 is connected to an unillustrated suction mechanism.

In the processing block 20, clean air is supplied to the conveyance path 23 from the air ejection part 571, and is sucked through the exhaust port 572, whereby the inner space 230 of the conveyance path 23 is formed with air from the −X side to the +X side. Downdraft of air. The air supply from the air supply unit 57 is continuously performed while the substrate processing apparatus 1 is processing the substrate 9 (described later), and the internal space 230 of the conveyance path 23 of the processing block 20 is maintained in the atmosphere (specifically, a clean environment). gas atmosphere).

In the substrate processing apparatus 1, since the inner space 230 of the conveyance path 23 is in the atmosphere, as described above, the oxygen concentration of the conveyance path 23 is higher than the oxygen concentration of the index block 10 maintained in the low oxygen atmosphere . In addition, as described above, the oxygen concentration of the conveyance path 23 is higher than the oxygen concentration of the placement unit 40 set in the low-oxygen atmosphere. In addition, the air pressure system of the conveyance path 23 is maintained to be higher than the air pressure of each processing unit 21 . Thereby, when the substrates 9 are carried in and out of the respective processing units 21 , the atmosphere (eg, chemical liquid atmosphere) in the processing units 21 is suppressed from entering the conveyance path 23 . In addition, the air pressure system of the index block 10 and the placement unit 40 is maintained to be higher than the air pressure of the conveyance path 23 . Thereby, the atmospheric atmosphere in the conveyance path 23 is suppressed from entering the placement unit 40 and the index block 10 . The processing unit 21 is, for example, a negative pressure, and the conveying path 23, the placing unit 40, and the index block 10 are, for example, a positive pressure.

FIG. 7 is a diagram showing the configuration of the computer 8 included in the control unit 60 . The computer 8 is a normal computer including a processor 81 , a memory 82 , an input/output unit 83 , and a bus 84 . The bus bar 84 is a signal circuit for connecting the processor 81 , the memory 82 and the input/output part 83 . The memory 82 stores various programs and various information. The processor 81 executes various kinds of processing (for example, numerical calculation) while using the memory 82 and the like in accordance with a program or the like stored in the memory 82 . The input/output unit 83 includes a keyboard 85 and a mouse 86 for receiving operator input; a display 87 for displaying output from the processor 81 and the like; In addition, the control unit 60 may also be a programmable logic controller (PLC; Programmable Logic Controller), a circuit board, or the like.

In the substrate processing apparatus 1 , each of the index robot 12 , the center robot 22 , the processing unit 21 , the first gas supply unit 55 , the second gas supply unit 56 , and the air supply unit 57 is controlled by the control unit 60 . In the present embodiment, the control unit 60 individually controls the supply of the inert gas from the first gas supply unit 55 to the mounting unit 40 and the supply of the inert gas from the second supply unit 56 to the index block 10 . In addition, the control unit 60 also controls the first shutter moving mechanism 437 of the first shielding portion 51 and the second shutter moving mechanism 438 of the second shielding portion 52 .

Next, an example of the flow of processing of the substrate 9 by the substrate processing apparatus 1 will be described with reference to FIGS. 8A and 8B . As described above, in the substrate processing apparatus 1 during processing of the substrate 9, the inner space 100 of the index block 10 is maintained in a low-oxygen atmosphere by the second gas supply unit 56, and the inner space 230 of the conveyance path 23 is The atmosphere is maintained by the air supply unit 57 . In addition, in the mounting unit 40, the first opening 435 or the second opening 436 is opened only when the substrate 9 is carried in and out, and in other cases, the first opening 435 and the second opening 436 are closed by the first shutter 432. And the second door 433 is locked.

In the substrate processing apparatus 1 , first, in the mounting unit 40 in a state where the first opening 435 and the second opening 436 are closed by the first shutter 432 and the second shutter 433 (that is, the inside of the mounting unit 40 ) When the space 400 is sealed), the opposite gas is supplied from the first gas supply unit 55 to the inner space 400 of the placement unit 40, and the placement unit 40 is set to a low-oxygen atmosphere (step S11).

The supply flow rate of the inert gas from the first gas supply unit 55 in step S11 is, for example, 1000 liters/minute or less. The time required until the placement unit 40 is set to a desired low-oxygen atmosphere is, for example, within 30 seconds. In the mounting unit 40 , the supply of the inert gas from the first gas supply unit 55 is continuously performed while the substrate 9 is being processed in the substrate processing apparatus 1 . However, the supply flow rate of the inert gas by the first gas supply unit 55 is appropriately changed as described later.

When the placement unit 40 becomes the low-oxygen atmosphere, the unprocessed substrate 9 is carried out from the carrier 95 by the index robot 12 (step S12). As described above, since the carrier 95 and the index block 10 are in a low-oxygen atmosphere, the oxygen concentration of the carrier 95 and the index block 10 does not increase when the substrate 9 is unloaded from the carrier 95 . Actually, in the substrate processing apparatus 1 , two substrates 9 are unloaded from the carrier 95 and the two substrates 9 are processed in parallel.

Next, the second shutter moving mechanism 438 is driven by the control unit 60, and the second shutter 433 is moved downward to open the second opening 436 (step S13). As described above, similarly to the index block 10 , since the inner space 400 of the placement unit 40 is set to a low-oxygen atmosphere, the oxygen concentration of the index block 10 does not increase due to the opening of the second opening 436 . .

When the second opening 436 is opened, the unprocessed substrate 9 is carried into the placement unit 40 through the second opening 436 by the index robot 12 (step S14). The substrate 9 is supported by the lower substrate support portion 431 in the placement unit 40 , and the index robot 12 is withdrawn from the placement unit 40 . Next, the second shutter moving mechanism 438 is driven by the control unit 60, and the second shutter 433 is moved upward to close the second opening 436 (step S15). Thereby, the internal space 400 of the mounting unit 40 is hermetically sealed. As described above, the low-oxygen atmosphere of the placement unit 40 is maintained. When step S15 is completed, the control unit 60 controls the first gas supply unit 55, whereby the supply flow rate of the inert gas supplied from the first gas supply unit 55 to the mounting unit 40 is reduced, for example, to 100 liters/min.

When the second opening 436 is closed, the first shutter moving mechanism 437 is driven by the control unit 60, and the first shutter 432 is moved downward to open the first opening 435 (step S16). As described above, the inert gas is continuously supplied from the first gas supply unit 55 to the mounting unit 40 even after the first opening 435 is opened, but the atmosphere in the conveyance path 23 enters the mounting unit due to diffusion or the like. within unit 40.

When the first opening 435 is opened, the unprocessed substrate 9 in the placement unit 40 is carried out from the placement unit 40 through the first opening 435 by the center robot 22 (step S17 ). Next, the first shutter moving mechanism 437 is driven by the control unit 60, and the first shutter 432 is moved upward to close the first opening 435 (step S18). After that, the placing unit 40 is set to a low-oxygen atmosphere by the first gas supply unit 55, and a new unprocessed substrate 9 is loaded by the indexing robot 12 as required.

The substrate 9 carried out from the mounting unit 40 is carried into the processing unit 21 (step S19). In the processing unit 21, the processing unit 24 processes the substrate 9 (step S20). Specifically, a chemical solution (for example, an etching solution or the like) is supplied from the nozzle 244 to the upper surface 91 of the rotating substrate 9 , and the chemical solution treatment of the substrate 9 is performed. Next, a cleaning liquid (for example, pure water or the like) is supplied to the upper surface 91 of the substrate 9 from the nozzle 244 or another nozzle not shown, and the cleaning process of the substrate 9 is performed. After that, the rotational speed of the substrate 9 is increased, and the drying process of the substrate 9 is performed.

When the processing of the substrate 9 in the processing unit 21 is completed, the processed substrate 9 is carried out from the processing unit 21 by the center robot 22 (step S21). Next, the first shutter moving mechanism 437 is driven by the control unit 60, and the first shutter 432 is moved downward to open the first opening 435 (step S22). At this time, the second opening 436 is blocked by the second blocking door 433 . Next, the processed substrate 9 is carried into the placement unit 40 through the first opening 435 by the center robot 22 (step S23). The processed substrate 9 is supported by the upper substrate support portion 431 in the placement unit 40 , and the center robot 22 is withdrawn from the placement unit 40 . After that, the first shutter moving mechanism 437 is driven by the control unit 60, and the first shutter 432 is moved upward to close the first opening 435 (step S24). Thereby, the internal space 400 of the mounting unit 40 is hermetically sealed.

When the first opening 435 is closed, the control unit 60 controls the first gas supply unit 55 to increase the flow rate of the inert gas supplied from the first gas supply unit 55 to the inner space 400 of the mounting unit 40 . For example, the supply flow rate of the inert gas is 1000 liters/minute or less. Next, by supplying the inert gas at the supply flow rate for a predetermined period of time, the oxygen concentration in the inner space 400 of the placement unit 40 is rapidly reduced, and the placement unit 40 is set to a low-oxygen atmosphere (step S25 ). For example, the time required until the placement unit 40 is set to a desired low-oxygen atmosphere is within 30 seconds.

When the placing unit 40 becomes the low-oxygen atmosphere, the control unit 60 drives the second shutter moving mechanism 438, and the second shutter 433 moves downward to open the second opening 436 (step S26). As described above, similarly to the index block 10 , since the inner space 400 of the placement unit 40 is set to a low-oxygen atmosphere, the oxygen concentration of the index block 10 does not increase due to the opening of the second opening 436 . . In step S26, the supply flow rate of the inert gas supplied from the first gas supply unit 55 to the mounting unit 40 is the same as that in step S25. In this way, the supply flow rate of the inert gas is maintained even after the placement unit 40 is in a low-oxygen atmosphere, whereby the decrease in the internal pressure of the placement unit 40 can be suppressed compared to the case where the supply of the inert gas is stopped. As a result, it is possible to prevent or suppress an increase in the oxygen concentration due to the entry of outside air or the like into the mounting unit 40 .

When the second opening 436 is opened, the processed substrate 9 is carried out from the placement unit 40 through the second opening 436 by the index robot 12 (step S27 ). Next, the second shutter moving mechanism 438 is driven by the control unit 60, and the second shutter 433 is moved upward to close the second opening 436 (step S28). Thereby, the internal space 400 of the mounting unit 40 is hermetically sealed. When step S28 is completed, the control unit 60 controls the first gas supply unit 55, whereby the supply flow rate of the inert gas supplied from the first gas supply unit 55 to the mounting unit 40 is reduced, for example, to 100 liters/min.

The processed substrates 9 carried out from the placement unit 40 are carried into the carrier 95 by the index robot 12 , thereby ending a series of processing of the substrates 9 (step S29 ). As described above, since the carrier 95 and the index block 10 are in a low-oxygen atmosphere, the oxygen concentration of the carrier 95 and the index block 10 does not increase when the substrate 9 is loaded into the carrier 95 .

As described above, the substrate processing apparatus 1 includes the processing block 20 , the index block 10 , the mounting unit 40 , and the first shielding portion 51 . Disposed in the processing block 20 are: a processing unit 21 for processing the substrates 9 ; A second transfer robot (ie, the index robot 12 ) is disposed in the index block 10 , and the second transfer robot carries out the loading and unloading of the substrates 9 with respect to the carrier 95 that can accommodate a plurality of substrates 9 . The mounting unit 40 is disposed at the connection portion between the processing block 20 and the index block 10 . The placement unit 40 holds the unprocessed substrate 9 transferred from the index block 10 to the center robot 22 . In addition, the placement unit 40 holds the processed substrate 9 transferred from the center robot 22 to the index block 10 . The first shielding portion 51 can block the movement of the gas between the index block 10 and the placement unit 40 in a low oxygen atmosphere with an oxygen concentration lower than that of the atmosphere, and the conveyance path 23 connected to the processing block 20 . The processing unit 21 and the placing unit 40 .

In this way, in the substrate processing apparatus 1, the index block 10 and the mounting unit 40 in the space where the substrate 9 is placed for a long time can be set to a low oxygen atmosphere, whereby the oxidation of the substrate 9 in the substrate processing apparatus 1 can be suppressed. . In addition, since the inside of the susceptor 95 connected to the inner space 100 of the index block 10 can also be maintained in a low-oxygen atmosphere, oxidation of the substrate 9 in the susceptor 95 can also be suppressed.

As described above, in the substrate processing apparatus 1, since the index block 10 and the placement unit 40 can be set to a low-oxygen atmosphere, the structure of the substrate processing apparatus 1 is particularly suitable for the oxygen concentration ratio index area of the conveyance path 23 A substrate processing apparatus in which the oxygen concentration of the block 10 and the oxygen concentration of the mounting unit 40 are still high. For example, the structure of the substrate processing apparatus 1 is particularly suitable for a substrate processing apparatus in which the conveyance path 23 is in the atmosphere.

As described above, the first opening 435 is an opening for connecting the inner space 230 of the conveyance path 23 and the inner space 400 of the placement unit 40 . Preferably, the first shielding portion 51 is provided with a door body (ie, the first blocking door 432 ) for opening and closing the first opening 435 . Thereby, the movement of the gas between the mounting unit 40 and the conveyance path 23 can be suitably blocked with a simple structure.

As described above, it is preferable that the substrate processing apparatus 1 further includes the first gas supply unit 55 , and the first gas supply unit 55 sets the placement unit 40 to a low level by supplying the inert gas to the placement unit 40 . oxygen atmosphere. Thereby, the placement unit 40 can be easily set to a low-oxygen atmosphere.

As described above, the substrate processing apparatus 1 is preferably further provided with the second shielding portion 52 , and the second shielding portion 52 can block the movement of the gas between the index block 10 and the placement unit 40 . Thereby, the low-oxygen atmosphere in the index block 10 can be easily maintained.

As described above, the second opening 436 is an opening for connecting the inner space 100 of the index block 10 and the inner space 400 of the placement unit 40 . Preferably, the second shielding portion 52 is provided with a door body (ie, the second blocking door 433 ) for opening and closing the first opening 435 . Thereby, the movement of the gas between the mounting unit 40 and the index block 10 can be suitably blocked with a simple structure.

As described above, the substrate processing apparatus 1 is preferably further provided with the second gas supply unit 56 , and the second gas supply unit 56 sets the index block 10 to be low by supplying the inert gas to the index block 10 . oxygen atmosphere. Thereby, the index block 10 can be easily maintained in a low-oxygen atmosphere.

As described above, the substrate processing apparatus 1 further includes the processing block 20 , the index block 10 , the mounting unit 40 , the first shielding portion 51 , the second shielding portion 52 , the first gas supply portion 55 , and the second shielding portion 51 . Gas supply unit 56 and control unit 60 . Preferably, the control unit 60 individually controls the supply of the inert gas from the first gas supply unit 55 and the supply of the inert gas from the second gas supply unit 56 . Thereby, the index block 10 and the mounting unit 40 can be respectively set to a desired low-oxygen atmosphere. In addition, the air pressure of the index block 10 can be set higher than the air pressure of the placement unit 40 , and the air pressure of the placement unit 40 can be set higher than the air pressure of the conveyance path 23 .

As described above, the substrate processing apparatus 1 includes the processing block 20 , the index block 10 , the mounting unit 40 , the first shielding portion 51 including the first shutter 432 , and the second shutter having the second shutter 433 . The shielding part 52 , the first gas supply part 55 , and the control part 60 . The control unit 60 controls the center robot 22 , the index robot 12 , the first shielding unit 51 , the second shielding unit 52 , and the first gas supply unit 55 . Preferably, under the control of the control unit 60, the placing unit 40 is set to a low-oxygen atmosphere in a state where the first opening 435 and the second opening 436 are closed by the first shutter 432 and the second shutter 433. , the second opening 436 is opened. Next, the unprocessed substrate 9 is carried into the placement unit 40 through the second opening 436 by the index robot 12 . Next, after the second opening 436 is closed by the second blocking door 433 , the first opening 435 is opened. Next, the unprocessed substrate 9 is carried out from the placement unit 40 through the first opening 435 by the center robot 22 . Thereby, when the unprocessed substrate 9 is transferred from the index robot 12 to the center robot 22 , the index block 10 can be appropriately maintained in the low-oxygen atmosphere.

As described above, the substrate processing apparatus 1 includes the processing block 20 , the index block 10 , the mounting unit 40 , the first shielding portion 51 including the first shutter 432 , and the second shutter having the second shutter 433 . The shielding part 52 , the first gas supply part 55 , and the control part 60 . The control unit 60 controls the center robot 22 , the index robot 12 , the first shielding unit 51 , the second shielding unit 52 , and the first gas supply unit 55 . Preferably, under the control of the control unit 60 , the second opening 436 is closed by the second shutter 433 , and the processed substrate 9 is passed through the first opening 435 by the central robot 22 when the first opening 435 is opened. After being loaded into the placing unit 40 , the first opening 435 is closed by the first shutter 432 . Next, after setting the mounting unit 40 to a low-oxygen atmosphere in a state where the first opening 435 and the second opening 436 are closed by the first shutter 432 and the second shutter 433 , the second opening 436 is opened. Next, the processed substrate 9 is carried out from the placement unit 40 through the second opening 436 by the index robot 12 . This makes it possible to appropriately maintain the index block 10 in the low-oxygen atmosphere when the processed substrate 9 is transferred from the center robot 22 to the index robot 12 .

The substrate processing method of the substrate processing apparatus 1 described above includes the following steps: the index robot 12 carries the substrate 9 from the index block 10 to the placement unit 40 (step S14 ); 9 is carried out from the placement unit 40 (step S17 ) and carried into the processing unit 21 (step S19 ); the substrate 9 is processed in the processing unit 21 (step S20 ); the substrate 9 is carried out from the processing unit 21 by the center robot 22 (Step S21 ) and carry it into the placement unit 40 (step S23 ); and the substrate 9 is carried out from the placement unit 40 to the index block 10 by the index robot 12 (step S27 ). In addition, the movement of the gas between the index block 10 and the placement unit 40 in the low oxygen atmosphere whose oxygen concentration is lower than that of the atmospheric air can be blocked, and the conveyance path 23 is connected in the process block 20 to the processing unit 21 and the conveyance path 23 . Mounting unit 40 . As described above, the index block 10 and the placement unit 40 in the space where the substrate 9 is placed for a long time can be set to a low oxygen atmosphere, and as a result, the oxidation of the substrate 9 in the substrate processing apparatus 1 can be suppressed.

Various modifications can be made to the substrate processing apparatus 1 and the substrate processing method described above.

For example, the number of substrates 9 placed on the placement unit 40 may be appropriately changed. In addition, the structure of the mounting unit 40 may be changed into various structures. For example, a support portion moving mechanism (eg, an actuator such as an electric cylinder) for moving the four substrate support portions 431 in the vertical direction may be provided in the inner space 400 of the frame body 434, and the loaded substrate 9 may be placed thereon. The predetermined substrate support portion 431 or the substrate support portion 431 on which the predetermined substrate 9 to be carried out is placed is moved to the same height as the opening of the frame body 434 . Thereby, the height in the vertical direction of the opening can be reduced in size. As a result, it is possible to prevent the atmospheric atmosphere from entering the placement unit 40 when the center robot 22 carries the substrate 9 in and out.

A space for placing the unprocessed substrate 9 and a space for placing the processed substrate 9 may be independently provided in the placement unit 40 . The placement unit 40 a shown in FIGS. 9 to 11 is provided with a lower placement portion 41 for placing the unprocessed substrate 9 and an upper placement portion 42 for placing the processed substrate 9 . The upper mounting portion 42 is arranged on the upper side of the lower mounting portion 41 . The inner space of the lower mounting portion 41 and the inner space of the upper mounting portion 42 are independent of each other. The lower placement portion 41 and the upper placement portion 42 also serve as placement units for placing the substrate 9, respectively.

The lower placement portion 41 and the upper placement portion 42 have substantially the same structure as the placement unit 40 described above, except that the two substrates 9 can be placed therein. Specifically, the lower mounting portion 41 includes a frame body 414 , a substrate support portion 411 , a first shutter 412 , and a second shutter 413 . The frame body 414 is provided with: a first opening 415 , which is opened and closed by the first blocking door 412 ; and a second opening 416 , which is opened and closed by the second blocking door 413 . The first door 412 and the second door 413 are respectively moved by the first door moving mechanism 417 and the second door moving mechanism 418 . Inside the frame body 414, a gas supply part 419 having the same structure as the first gas supply part 55 is provided.

The upper placement portion 42 includes a frame body 424 , a substrate support portion 421 , a first shutter 422 and a second shutter 423 . The frame body 424 is provided with a first opening 425 , which is opened and closed by the first blocking door 422 , and a second opening 426 , which is opened and closed by the second blocking door 423 . The first door 422 and the second door 423 are moved by the first door moving mechanism 427 and the second door moving mechanism 428, respectively. Inside the casing 424, an upper gas supply part 429 having the same structure as the first gas supply part 55 is provided.

The first shutter 412 and the second shutter 413 of the lower mounting portion 41 and the first shutter 422 and the second shutter 423 of the upper mounting portion 42 are movable independently. In addition, the control unit 60 can independently control the lower gas supply unit 419 to supply the inert gas to the lower mounting unit 41 and the upper gas supply unit 429 to supply the inert gas to the upper mounting unit 42 .

The processing flow of the substrate 9 in the substrate processing apparatus 1 in which the placing unit 40a is provided in place of the placing unit 40 is substantially the same as that shown in FIGS. 8A and 8B . Specifically, as shown in FIGS. 12A and 12B , first, the lower loading unit 41 is set to a low-oxygen atmosphere by the lower gas supply unit 419 (step S31 ). At this time, the upper mounting portion 42 may be different from the lower mounting portion 41 and may have an atmosphere. Next, the unprocessed board|substrate 9 is carried out from the carrier 95 by the index robot 12 (step S32). Next, the second opening 416 of the lower loading portion 41 is opened, and the unprocessed substrate 9 is loaded into the lower loading portion 41, and then the second opening 416 is closed (steps S33 to S35).

Next, the first opening 415 of the lower loading portion 41 is opened, and the unprocessed substrate 9 is carried out from the lower loading portion 41 by the center robot 22, and then the first opening 415 is closed (steps S36 to S38). Next, the substrate 9 is carried into the processing unit 21 by the center robot 22, and after the substrate 9 is processed in the processing unit 21, the substrate 9 is carried out from the processing unit 21 (steps S39 to S41).

Next, the first opening 425 of the upper placement portion 42 is opened, and the processed substrate 9 is loaded in by the center robot 22, and then the first opening 425 is closed (steps S42 to S44). Next, the upper mounting part 42 is set to a low-oxygen atmosphere by the upper gas supply part 429 (step S45). After that, the second opening 426 of the upper mounting portion 42 is opened, the processed substrate 9 is carried out from the upper mounting portion 42 by the index robot 12, and the second opening 426 is closed (steps S46 to S48). Then, the processed substrate 9 is carried into the carrier 95 by the index robot 12, and the series of processing on the substrate 9 is completed (step S49).

In the placement unit 40a, the space for placing the unprocessed substrate 9 and the space for placing the processed substrate 9 are divided, whereby the center robot 22 carries the substrate 9 in and out, and a low-oxygen atmosphere is set. space miniaturization. Therefore, the usage-amount of inert gas can be reduced. In addition, since the time required for setting the space in a low-oxygen atmosphere can be shortened, the time required for processing the substrate 9 can also be shortened. Furthermore, since the opening for carrying in and carrying out the substrate 9 can be reduced in size, it is possible to prevent the atmospheric atmosphere from entering the placement unit 40a when the center robot 22 carries in and out the substrate 9 .

In the placing unit 40 shown in FIGS. 4 to 6 , other structures (eg, an air curtain) that can block the movement of gas through the first opening 435 can also be provided instead of the first blocking door 432 . In addition, instead of the second blocking door 433 , other structures (eg, a gas curtain) that can block the movement of the gas through the second opening 436 can also be provided. The same applies to the mounting unit 40a.

In the substrate processing apparatus 1, as long as the mounting units 40 and 40a are provided at the connection portion between the index block 10 and the processing block 20, the connection portion 31 does not necessarily need to be provided.

In the substrate processing apparatus 1, the conveyance path 23 does not necessarily need to be in the atmosphere. For example, only an inert gas may be supplied to the periphery of the center robot 22, and a part of the conveyance path 23 (that is, the periphery of the center robot 22) may be set to a low oxygen level. Ambience. In addition, the oxygen concentration of the conveyance path 23 does not necessarily need to be higher than the oxygen concentration of the index block 10 and the oxygen concentration of the placement units 40 and 40a. In any case, in the substrate processing apparatus 1, the atmosphere of the conveyance path 23 can be suppressed from entering the index block 10 via the placement units 40 and 40a.

The second shielding portion 52 may also be omitted in the substrate processing apparatus 1 . In addition, it is not necessarily necessary to individually control the supply of the inert gas from the first gas supply part 55 and the supply of the inert gas from the second gas supply part 56 .

The low-oxygen atmosphere of the mounting unit 40 may be realized by means other than supplying the inert gas from the first gas supply unit 55 . The same applies to the mounting unit 40a. In addition, the low-oxygen atmosphere of the index block 10 can also be realized by means other than supplying the inert gas from the second gas supply part 56 similarly.

In the substrate processing apparatus 1, the structure of the center robot 22 may be variously changed. For example, the number of substrates 9 that can be transported at one time by the center robot 22 may be one or three or more. In addition, the shape and structure of the hand of the center robot 22 may be variously changed. The same applies to the index robot 12 .

Processing units of various structures other than the processing unit 21 described above may be provided in the processing block 20 of the substrate processing apparatus 1 to perform various treatments on the substrate 9 (eg, cleaning of the lower surface of the substrate 9 ).

The substrate processing apparatus 1 described above can also be used for a glass substrate used in a flat panel display such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, in addition to a semiconductor substrate, or for other applications. Processing of glass substrates for display devices. In addition, the substrate processing apparatus 1 described above can also be used for processing optical disk substrates, magnetic disk substrates, optical magnetic disk substrates, mask substrates, ceramic substrates, solar cell substrates, and the like.

The configurations in the above-described embodiment and each modification example may be appropriately combined as long as they do not contradict each other.

While the invention has been described in detail, these descriptions are illustrative and not restrictive. Therefore, various changes and aspects are naturally possible without departing from the scope of the present invention.

1: Substrate processing device 8: Computer 9: Substrate 10: Index block 11: Carrier table 12: Index Robot 20: Process Blocks 21: Processing unit 22: Center Robot 23: Handling path 24: Processing Department 30: Next door 31: Liaison Department 40, 40a: Mounting unit 41: Download and set the department 42: Uploading part 51: First shade 52: Second shade 55: First gas supply part 56: Second gas supply part 57: Air supply part 58: Inert gas supply source 59: Attract agencies 60: Control Department 81: Processor 82: memory 83: Input and output section 84: Busbar 85: Keyboard 86: Mouse 87: Display 88: Sending Department 91: Upper surface 95: Carrier 100: Internal space (of the index block) 121a, 121b, 221a, 221b: carrying arms 122, 222: Arm stand 123: Abutment 211: Shell 223: Pillar 224: Lifting mechanism 230: Interior space (of the carrying path) 241: Substrate holding part 242: Substrate Rotation Mechanism 243: Hood 244: Nozzle 245: Top Plate 310: Interior space (of the liaison department) 400: Internal space (of the placement unit) 412, 422, 432: First stop 413, 423, 433: Second stop 415, 425, 435: first opening 416, 426, 436: Second opening 419: Lower gas supply part 429: Upper gas supply part 431: Substrate support part 434: Frame 437: First stop door moving mechanism 438: Second door moving mechanism 551: Central ejection part 552: Peripheral ejection part 553: Side ejection part 554, 562, 572: exhaust port 555: Ejection Elements 561: Gas ejection part 571: Air ejection part 581: Valve J1: Rotary axis

FIG. 1 is a plan view of a substrate processing apparatus according to one embodiment. FIG. 2 is a front view showing the interior of the substrate processing apparatus. FIG. 3 is a diagram showing an example of a processing unit. Fig. 4 is a side view of the placement unit. Fig. 5 is a side view of the placement unit. FIG. 6 is a diagram showing the inside of the placement unit. FIG. 7 is a diagram showing the configuration of the control unit. FIG. 8A is a diagram showing the flow of processing of the substrate. FIG. 8B is a diagram showing the flow of processing of the substrate. FIG. 9 is a side view of another mounting unit. Fig. 10 is a side view of another placement unit. FIG. 11 is a diagram showing the inside of another mounting unit. FIG. 12A is a diagram showing the flow of processing of the substrate. FIG. 12B is a diagram showing the flow of processing of the substrate.

1: Substrate processing device

9: Substrate

10: Index block

11: Carrier table

12: Index Robot

20: Process Blocks

21: Processing unit

22: Center Robot

23: Handling path

30: Next door

31: Liaison Department

40: Placement unit

51: First shade

52: Second shade

56: Second gas supply part

57: Air supply part

95: Carrier

100: Internal space (of the index block)

121a, 121b, 221a, 221b: carrying arms

122, 222: Arm stand

123: Abutment

223: Pillar

224: Lifting mechanism

230: Interior space (of the carrying path)

310: Interior space (of the liaison department)

432: First stop

433: Second stop

434: Frame

562: exhaust port

561: Gas ejection part

571: Air ejection part

Claims (12)

A substrate processing apparatus is used for processing substrates, and includes: a processing block, which is equipped with a processing unit for processing the substrate and a first conveying robot for carrying in and out of the substrate relative to the processing unit; an index area The block is equipped with a second transfer robot for carrying the substrates in and out of the carrier capable of accommodating a plurality of substrates; the placing unit is provided at the connecting portion between the processing block and the index block, It is used to hold the unprocessed substrates transferred from the second transfer robot to the first transfer robot and the processed substrates transferred from the first transfer robot to the second transfer robot; the first shielding part can block oxygen the movement of the gas between the index block of the hypoxic atmosphere with the concentration lower than that of the atmospheric air and the loading unit and the conveying path, the conveying path is connected to the processing unit and the loading unit in the processing block; A gas supply part supplies inert gas to the loading unit, thereby setting the loading unit to a low-oxygen atmosphere; a second shielding part can block the gas between the index block and the loading unit movement; and a control unit for controlling the first transfer robot, the second transfer robot, the first shielding unit, the first gas supply unit, and the second shielding unit; the first shielding unit includes: a first shielding unit The door body is used to open and close the first opening for connecting the inner space of the conveying path and the inner space of the loading unit; the second shielding part is provided with: a second door body, which is used to opening and closing with a second opening connecting the inner space of the index block and the inner space of the placing unit; Under the control of the control unit, the placing unit is set to a low-oxygen atmosphere in a state where the first opening and the second opening are closed by the first door and the second door, and then the first door is opened. Two openings, the unprocessed substrates are loaded into the placing unit through the second opening by the second transfer robot, the second opening is closed by the second door, the first opening is opened, and the first opening is opened by the second opening. The first transfer robot carries out the unprocessed substrate from the placement unit through the first opening. A substrate processing apparatus is used for processing substrates, and includes: a processing block, which is equipped with a processing unit for processing the substrate and a first conveying robot for carrying in and out of the substrate relative to the processing unit; an index area The block is equipped with a second transfer robot for carrying the substrates in and out of the carrier capable of accommodating a plurality of substrates; the placing unit is provided at the connecting portion between the processing block and the index block, It is used to hold the unprocessed substrates transferred from the second transfer robot to the first transfer robot and the processed substrates transferred from the first transfer robot to the second transfer robot; the first shielding part can block oxygen the movement of the gas between the index block of the hypoxic atmosphere with the concentration lower than that of the atmospheric air and the loading unit and the conveying path, the conveying path is connected to the processing unit and the loading unit in the processing block; A gas supply part supplies inert gas to the loading unit, thereby setting the loading unit to a low-oxygen atmosphere; a second shielding part can block the gas between the index block and the loading unit movement; and a control unit for controlling the first transfer robot, the second transfer robot, the first shielding unit, the first gas supply unit, and the second shielding unit; The first shielding portion includes: a first door for opening and closing a first opening for connecting the inner space of the conveyance path and the inner space of the placing unit; the second shielding portion includes a : The second door body is used to open and close the second opening for connecting the inner space of the index block and the inner space of the placing unit; under the control of the control unit, the second door is opened and closed by the second door. In a state where the second opening is closed and the first opening is opened, the processed substrate is loaded into the placement unit through the first opening by the first transfer robot, and then the first door is used to close the first door. In the first opening, after the placing unit is set to a low-oxygen atmosphere in a state where the first opening and the second opening are closed by the first door and the second door, the second opening is opened, and the second opening is opened. The processed substrate is carried out from the placement unit through the second opening by the second transfer robot. The substrate processing apparatus according to claim 1 or 2, wherein the first shielding portion includes a door for opening an opening for connecting the inner space of the conveyance path and the inner space of the placement unit Opening and closing. The substrate processing apparatus according to claim 1 or 2, further comprising: a first gas supply unit for supplying an inert gas to the placing unit, thereby setting the placing unit in a low-oxygen atmosphere. The substrate processing apparatus according to claim 1 or 2, further comprising: a second shielding portion capable of blocking movement of gas between the index block and the placement unit. The substrate processing apparatus according to claim 5, wherein the second shielding portion includes a door for opening and closing an opening for connecting the inner space of the index block and the inner space of the placement unit . The substrate processing apparatus according to claim 1 or 2, further comprising: The second gas supply unit supplies inert gas to the index block, thereby setting the index block to a low-oxygen atmosphere. The substrate processing apparatus according to claim 1 or 2, further comprising: a second shielding portion capable of blocking the movement of gas between the index block and the placement unit; and a first gas supplying portion for The loading unit supplies an inert gas, thereby setting the loading unit to a low-oxygen atmosphere; the second gas supply unit supplies an inert gas to the index block, thereby setting the index block to a low-oxygen atmosphere; and a control unit for individually controlling the supply of the inert gas from the first gas supply unit and the supply of the inert gas from the second gas supply unit. The substrate processing apparatus according to claim 1 or 2, wherein the oxygen concentration of the conveyance path is higher than the oxygen concentration of the index block and the oxygen concentration of the placement unit. The substrate processing apparatus according to claim 9, wherein the conveyance path is an atmosphere. A substrate processing method for processing a substrate by a substrate processing apparatus; the substrate processing apparatus includes: a processing block configured with a processing unit for processing the substrate and a substrate for carrying in and out of the processing unit relative to the processing unit a first transfer robot; an index block configured with a second transfer robot for carrying substrates into and out of a carrier capable of accommodating a plurality of substrates; and a placing unit disposed on the processing block and the index The connecting portion between the blocks is used to hold the unprocessed substrates transferred from the second transfer robot to the first transfer robot and the processed substrates transferred from the first transfer robot to the second transfer robot; The substrate processing method includes: a step (a) of carrying a substrate from the index block to the placement unit by the second transfer robot; and step (b) of transferring the substrate from the first transfer robot to the placement unit by the first transfer robot The loading unit unloads the substrate and carries it into the processing unit; step (c) is to process the substrate in the processing unit; step (d) is to use the first transfer robot to unload the substrate from the processing unit and carry it into the placing unit; and in step (e), the second transfer robot is used to unload the substrate from the placing unit to the index block; an inert gas can be supplied to the placing unit, whereby the The placing unit is set to a hypoxic atmosphere with an oxygen concentration lower than that of the atmosphere; an inert gas can be supplied to the index block, thereby setting the index block to a hypoxic atmosphere with an oxygen concentration lower than the atmosphere; The first door blocks the movement of the gas between the index block of the low-oxygen atmosphere and the loading unit and a conveying path, the conveying path is connected to the processing unit and the loading unit in the processing block, and the first A door system is used to open and close a first opening for connecting the inner space of the conveying path and the inner space of the placing unit; the second door can block the gap between the index block and the placing unit. During the movement of the gas, the second door system is used to open and close the second opening for connecting the inner space of the index block and the inner space of the placing unit; through the first door body and the second door After the loading unit is set to a low-oxygen atmosphere with the first opening and the second opening closed by the body, the second opening is opened, and the unprocessed substrate is carried in through the second opening by the second transfer robot. to the loading unit; after the second opening is closed by the second door, the first opening is opened. The unprocessed substrate is carried out from the placement unit through the first opening by the first transfer robot. A substrate processing method for processing a substrate by a substrate processing apparatus; the substrate processing apparatus includes: a processing block configured with a processing unit for processing the substrate and a substrate for carrying in and out of the processing unit relative to the processing unit a first transfer robot; an index block configured with a second transfer robot for carrying substrates into and out of a carrier capable of accommodating a plurality of substrates; and a placing unit disposed on the processing block and the index The connection parts between the blocks are used to hold the unprocessed substrates transferred from the second transfer robot to the first transfer robot and the processed substrates transferred from the first transfer robot to the second transfer robot; the aforementioned The substrate processing method includes: a step (a) of transferring a substrate from the index block to the placement unit by the second transfer robot; step (b) of transferring the substrate from the carrier to the first transfer robot by the first transfer robot Step (c), process the substrate in the processing unit; Step (d), use the first transfer robot to unload the substrate from the processing unit and carry it into the processing unit. Loading into the placing unit; and in step (e), the second transfer robot is used to unload the substrate from the placing unit to the index block; an inert gas may be supplied to the placing unit, thereby transferring the The placing unit is set to a hypoxic atmosphere with an oxygen concentration lower than that of the atmosphere; inert gas can be supplied to the index block, thereby setting the index block to a hypoxic atmosphere with an oxygen concentration lower than the atmosphere; The first door body can block the movement of the gas between the index block of the low-oxygen atmosphere and the carrying unit and the conveying path, and the conveying path is connected to the processing unit and the carrying unit in the processing block. the first door system is used to open and close the first opening for connecting the inner space of the conveying path and the inner space of the placing unit; the index block and the placing unit can be blocked by the second door body The movement of the gas between, the second door system is used to open and close the second opening for connecting the inner space of the index block and the inner space of the placing unit; In a state where the second opening is open and the first opening is opened, after the processed substrate is loaded into the placement unit through the first opening by the first transfer robot, the first opening is closed by the first door. ; After the placing unit is set to a low-oxygen atmosphere in a state where the first opening and the second opening are closed by the first door and the second door, the second opening is opened, and the second opening is opened by the first opening and the second opening. The two transfer robots carry out the processed substrates from the placement unit through the second opening.

Images