TWI548120B - Frame structure for lateral led - Google Patents

Description

Bracket structure of lateral type light-emitting diode

The invention relates to a light-emitting diode, in particular to a support structure of a lateral-type light-emitting diode.

One of the semiconductor components of the light-emitting diode is widely used in 3C product indicators, display devices and lamps because of its small size, long life and low power consumption.

In recent years, in the widespread use of light-emitting diodes, most of the light-emitting diodes are manufactured to enhance the brightness of the light-emitting diodes or have a multi-color function. However, in order to make a good light-emitting diode, the support structure of the light-emitting diode is also one of the most important techniques in production.

The bracket structure of the lateral type light-emitting diode includes a rubber seat and a metal bracket. The metal bracket is made by stamping a copper metal strip, and the metal bracket is subjected to electroplating treatment, and the silver material is electroplated on the metal. Forming a plating layer on the surface of the bracket, and placing the plated metal bracket on the male and female molds by hot pressing or injection molding, the rubber seat will be formed on the metal bracket and have a metal supply on the rubber seat The hollow functional area exposed by the bracket, the hollow functional area is used for solid crystal bonding and wire bonding, and the colloid is injected into the hollow functional area after the wire is wound, that is, the packaging process of the lateral type light emitting diode is completed.

In the past, the electrode pins of the lateral type LEDs were exposed to the outside of the plastic holder. Therefore, after the package is completed, the electrode pins are cut and bent to make the lateral type LEDs side. Solder to the board for use. Since the electrode pins are cut and bent, the plating layer on the electrode pins is damaged, and the copper material of the metal bracket is exposed. Therefore, when the subsequent lateral type LEDs are soldered to the circuit board, Causes welding defects between the electrode pins and the solder joints on the board, resulting in The lateral type light-emitting diode cannot be illuminated.

Therefore, the main object of the present invention is to solve the above-mentioned conventional deficiencies. The present invention redesigns the bracket structure of the lateral type illuminating body, and does not damage the lateral direction when the package is completed to cut the lateral type illuminating diode. The side welding electrode of the type of light-emitting diode enables the side-side welding electrode of the lateral-type light-emitting diode to be effectively welded to the solder joint on the circuit board.

In order to achieve the above object, the present invention provides a bracket structure for a lateral type light emitting diode, comprising: a metal bracket, at least one set of a first electrode layer and a second electrode layer, and a first electrode layer a first protruding portion is protruded from the side surface, the first protruding portion has a first through hole, and an inner wall surface of the first through hole forms a first soldering portion; and a side surface of the second electrode layer is convex a second protruding portion is formed, the second protruding portion has a second through hole, and the inner wall surface of the second through hole forms a second soldering portion; a plating layer is disposed on the surface of the metal bracket At least one rubber seat is disposed on the metal bracket and the plating layer, the rubber seat has a hollow functional area, the hollow functional area exposes the first electrode layer and the second electrode layer, and the hollow functional area Each of the two sides has a first through hole and a second through hole. The first through hole exposes the first protruding portion of the first electrode layer and the first through hole, and the second through hole makes the second through hole The second protruding portion of the second electrode layer and the second through hole are exposed.

Wherein, the metal bracket is an alloy copper material.

The first through hole and the second through hole are elongated.

The first electrode layer further has a first front surface and a first back surface, and the first back surface has at least one first recess portion.

The second electrode layer further has a second front surface and a second back surface, and the second back surface has at least one second recess portion.

Wherein, the metal bracket further has a metal frame, the metal frame has a plurality of connecting portions, the plurality of connecting portions have connected the plurality of sets of the first electrode layer and the first Two electrode layers.

In order to achieve the above object, the present invention provides a support structure for another lateral light-emitting diode, comprising: a metal support, at least one set of a first electrode layer and a second electrode layer, the first electrode layer a first protruding portion is protruded on a side surface, the first protruding portion has a first through hole, and an inner wall surface of the first through hole forms a first soldering portion; and a side surface of the second electrode layer a second protruding portion is formed on the second protruding portion, and a second welding portion is formed on the inner wall surface of the second through hole; a plating layer is disposed on the surface of the metal bracket At least one rubber seat is disposed on the metal bracket and the plating layer, and the rubber seat has a hollow functional area, and the hollow functional area exposes the first electrode layer and the second electrode layer.

Wherein, the metal bracket is an alloy copper material.

The first through hole and the second through hole are elongated.

The first electrode layer further has a first front surface and a first back surface, and the first back surface has at least one first recess portion.

The second electrode layer further has a second front surface and a second back surface, and the second back surface has at least one second recess portion.

The metal bracket further has a metal frame, and the metal frame has a plurality of connecting portions, and the plurality of connecting portions have connected the plurality of sets of the first electrode layer and the second electrode layer.

1‧‧‧Metal bracket

11‧‧‧Metal border

11a, 11b‧‧‧ Connections

12‧‧‧First electrode layer

121‧‧‧ first positive

122‧‧‧ first back

123‧‧‧The first depression

124‧‧‧ side

125‧‧‧First bulge

126‧‧‧First through hole

127‧‧‧First Welding Department

13‧‧‧Second electrode layer

131‧‧‧Second positive

132‧‧‧ second back

133‧‧‧Second depression

134‧‧‧ side

135‧‧‧second bulge

136‧‧‧second through hole

137‧‧‧Second welding department

2‧‧‧Glass

21‧‧‧Hard Functional Zone

22‧‧‧ first through hole

23‧‧‧Second through hole

3‧‧‧Circuit board

The first figure is a schematic view of a metal stent of a stent structure of a lateral type light-emitting diode of the present invention.

The second figure is a front view showing a plurality of plastic seats formed on the metal bracket of the present invention.

The third figure is a schematic view of a bottom surface on which a plurality of rubber seats are formed on the metal bracket of the present invention.

The fourth figure is a front view showing the cutting structure of the stent of the present invention.

The fifth figure is a perspective view showing the appearance of a single support structure after the stent structure of the present invention is cut.

Fig. 6 is a schematic view showing the state of use of the lateral type light-emitting diode of the present invention.

Figure 7 is a schematic view of another embodiment of the present invention.

The technical content and detailed description of the present invention are as follows:

Please refer to the first figure, which is a schematic diagram of a metal bracket of a bracket structure of a lateral type light-emitting diode of the present invention. As shown in the figure, the bracket structure 10 of the lateral type light-emitting diode of the present invention is formed by stamping a metal piece of alloy copper material into a metal bracket 1 having a metal frame 11 on the metal frame. A plurality of sets of the stamped first electrode layer 12 and the second electrode layer 13 are connected through a plurality of connecting portions 11a and 11b. The metal holder 1 is stamped and formed by the plurality of sets of the first electrode layer 12 and the second electrode layer 13 to perform silver plating treatment on the first electrode layer 12 and the second electrode layer 13 of the metal holder 1 A plating layer (not shown) is formed on the surface. After the plating layer is formed to provide the lateral type light emitting diode, the first electrode layer 12 and the second electrode layer 13 can be electrically connected to the circuit board ( The figure is shown).

The first electrode layer 12 has a first front surface 121 and a first back surface 122 , and has at least one first recess portion 123 on the first back surface 122 . A first protrusion 125 is protruded from a side surface 124 of the first electrode layer 12, and the first protrusion 125 has an elongated first through hole 126. The first through hole 126 is inside. The wall surface forms a first welded portion 127.

The second electrode layer 13 has a second front surface 131 and a second back surface 132. The second back surface 132 has at least one second recess 133. A second protrusion 135 is protruded from a side surface 134 of the second electrode layer 13. The second protrusion 135 has an elongated second through hole 136. The second through hole 136 is formed inside. The wall surface forms a second welded portion 137.

Please refer to the second and third figures, which are schematic diagrams of the front and bottom surfaces of a plurality of plastic seats formed on the metal bracket of the present invention. As shown in the figure: when the metal bracket 1 is stamped and plated Then, the metal bracket 1 is formed into a mold (not shown), and the plastic is molded on the metal bracket 1 by hot pressing or injection molding to form a plurality of rubber seats 2, each of which has a rubber seat 2 a hollow functional area 21, the first front surface 121 of the first electrode layer 12 and the second front surface 131 of the second electrode layer 13 are exposed, and each of the two sides of the hollow functional area 21 has a a first through hole 22 and a second through hole 23, the first through hole 22 exposing the first protruding portion 125 and the first through hole 126 of the first electrode layer 12; similarly, the second through hole 23 The second protruding portion 135 and the second through hole 136 of the second electrode layer 13 are exposed.

Please refer to the fourth and fifth figures, which is a perspective view showing the appearance of the single-bracket structure after cutting the front surface and cutting the bracket structure of the present invention. As shown in the figure: before the cutting of the stent structure 10, the processing, such as solid crystal, wire bonding and sealing, is performed in the hollow functional zone 21 of the rubber seat 2, and the glue is applied after the solid crystal, the wire bonding and the sealing process. The cutting of the seat 2.

When cutting, when the cutting line 2a of the side of the hollow functional area 21 of the rubber seat 2 is cut, the first through hole 126 and the second through hole 23 of the first through hole 22 are cut. The second through hole 136 is such that the first soldering portion 127 of the first through hole 126 on the first through hole 22 and the second soldering portion 137 of the second through hole 136 of the second through hole 23 are formed after cutting The open portion is exposed, and the first welded portion 127 and the second welded portion 137 form a side welding electrode.

Moreover, after the cutting, the plating layer on the first soldering portion 127 and the second soldering portion 137 is not damaged after cutting, so that the first soldering portion 127 and the second soldering portion 137 allow the lateral direction The light emitting diode can be electrically soldered to the circuit board.

Please refer to the sixth drawing, which is a schematic view showing the state of use of the lateral type light-emitting diode of the present invention. As shown in the figure, after the lateral type LED package and cutting is completed, the first soldering portion 127 and the second soldering portion 137 on both sides of the lateral type LED can be used to solder with the solder layer. Bonding, the lateral type light-emitting diode can be soldered to the soldering point (not shown) of the circuit board 3, so that the side of the plastic holder 2 of the lateral-type light-emitting diode is bonded to the circuit board 3 On the surface, when the lateral type light-emitting diode is illuminated, the light is projected into the parallel relationship with the circuit board 3.

Please refer to the seventh figure, which is a schematic view of another embodiment of the present invention. As shown in the figure: this embodiment is substantially the same as the first to sixth figures described above, and the difference lies in the present invention. When the rubber seat 2 of the bracket structure of the lateral type light-emitting diode is formed by hot pressing or injection molding, the first through hole 22 and the second through hole are not formed on both sides of the hollow functional area 21 of the rubber seat 2, The second protruding portion 135 and the second through hole 136 of the rear portion of the first electrode layer 12 and the first protruding portion 125, the first through hole 126, and the rear portion of the second electrode layer 13 are all exposed directly. .

After the cutting, the plating layer on the first soldering portion 127 and the second soldering portion 137 is not damaged after cutting, so that the first soldering portion 127 and the second soldering portion 137 allow the lateral light emitting layer to emit light. The diode can be electrically soldered to the circuit board.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.

1‧‧‧Metal bracket

11‧‧‧Metal border

12‧‧‧First electrode layer

121‧‧‧ first positive

122‧‧‧ first back

123‧‧‧The first depression

125‧‧‧First bulge

126‧‧‧First through hole

127‧‧‧First Welding Department

13‧‧‧Second electrode layer

131‧‧‧Second positive

132‧‧‧ second back

135‧‧‧second bulge

136‧‧‧second through hole

137‧‧‧Second welding department

2‧‧‧Glass

21‧‧‧Hard Functional Zone

22‧‧‧ first through hole

23‧‧‧Second through hole

Claims (12)

A bracket structure of a lateral type light-emitting diode includes: a metal bracket, at least one set of a first electrode layer and a second electrode layer, and a first protrusion is protruded from a side surface of the first electrode layer The first protruding portion has a first through hole, the inner wall surface of the first through hole defines a first soldering portion, and a second protruding portion protrudes from a side surface of the second electrode layer. The second protruding portion has a second through hole, the inner wall surface of the second through hole defines a second soldering portion; a plating layer is disposed on the surface of the metal bracket; at least one plastic seat is disposed on the The metal holder and the plating layer have a hollow functional area on the plastic seat, the hollow functional area exposes the first electrode layer and the second electrode layer, and each has a first side on both sides of the hollow functional area a through hole and a second through hole, the first through hole exposing the first protruding portion of the first electrode layer and the first through hole, the second through hole making the second protruding portion of the second electrode layer The portion and the second through hole are exposed. The stent structure of claim 1, wherein the metal stent is an alloy copper material. The stent structure of claim 2, wherein the first through hole and the second through hole are elongated. The bracket structure of claim 3, wherein the first electrode layer further has a first front surface and a first back surface, and the first back surface has at least one first recess portion. The bracket structure of claim 4, wherein the second electrode layer further has a second front surface and a second back surface, and the second back surface has at least one Two depressions. The bracket structure of claim 5, wherein the metal bracket further has a metal frame, the metal frame has a plurality of connecting portions, the plurality of connecting portions are connected to the plurality of sets of the first electrode layer and The second electrode layer. A bracket structure of a lateral type light-emitting diode includes: a metal bracket, at least one set of a first electrode layer and a second electrode layer, and a first protrusion is protruded from a side surface of the first electrode layer The first protruding portion has a first through hole, the inner wall surface of the first through hole defines a first soldering portion, and a second protruding portion protrudes from a side surface of the second electrode layer. The second protruding portion has a second through hole, the inner wall surface of the second through hole defines a second soldering portion; a plating layer is disposed on the surface of the metal bracket; at least one plastic seat is disposed on the The metal holder and the plating layer have a hollow functional area on the plastic seat, and the hollow functional area exposes the first electrode layer and the second electrode layer. The stent structure of claim 7, wherein the metal stent is an alloy copper material. The bracket structure of claim 8, wherein the first through hole and the second through hole are elongated. The bracket structure of claim 9, wherein the first electrode layer further has a first front surface and a first back surface, and the first back surface has at least one first recess portion. The bracket structure of claim 10, wherein the second electrode layer further has a second front surface and a second back surface, and the second back surface has at least one second recess portion. The bracket structure of claim 11, wherein the metal bracket further has a metal frame, the metal frame has a plurality of connecting portions, and the plurality of connections The plurality of sets of the first electrode layer and the second electrode layer are connected to each other.