TWI544109B - Method of attaching diamond using immersion plating, and apparatus for the method - Google Patents

Description

Diamond adhesion method using immersion plating and diamond attachment device utilizing the same

The present invention relates to a diamond attachment technique, and more particularly to a technique capable of easily attaching diamond particles to a base material as compared with the adhesion of diamond particles based on a conventional electrical adhesion method.

Diamond particles are widely used in cutting tools and the like because of their preferable hardness. Generally, the diamond particles are attached to and fixed to the base material in the form shown in Fig. 1 or Fig. 2 . The example shown in Fig. 1 corresponds to a case where diamond is coated with a conductor, and the example shown in Fig. 2 corresponds to a case where diamond is not coated with a conductor.

First, the diamond particles 110 coated with the conductor are attached to the base material 101 through the fine particle adhesion layer 115. Thereafter, in order to increase the fixing force of the fine particle adhesion layer 115 including the diamond particles 110, the culture plating layer 120 is formed using nickel or the like. In the case where the diamond is coated with a conductor, as in the example shown in Fig. 1, the diamond particles are exposed by the polishing line 130. Conversely, in the case where the diamond is not coated with a conductor, as in the example shown in Fig. 2, the diamond particles can be exposed without undergoing a separate polishing process.

On the other hand, in the examples shown in Figs. 1 and 2, the fine particle adhesion layer 115 is mainly formed by electrolytic nickel plating. However, the diamond attachment method based on the electrolytic nickel plating method requires a complicated pre-treatment process. Further, in order to construct an apparatus for electrolytic nickel plating, a complicated structure such as a rectifier, an anode, or an electric wire is required. Further, in order to increase the efficiency of electrolytic nickel plating, it is necessary to increase the current density of the electrode and maintain a relatively high temperature of 50 ° C or higher. Moreover, the diamond adhesion method based on the electrolytic nickel plating method is often generated on the diamond particles during electrolytic nickel plating. The phenomenon of attaching other diamond particles.

An object of the present invention is to provide a diamond adhesion method in which a mother material can easily adhere to diamond particles, which is different from the conventional electrolytic nickel plating method.

Another object of the present invention is to provide an apparatus that can be utilized in the above diamond attachment method.

A diamond adhesion method according to an embodiment of the present invention for achieving the above object, characterized in that the ionic state includes a plating material having a lower ionization tendency than a plated base material, and immersion plating in which diamond particles are dispersed The liquid is immersed in the plated base material, and the plating material is immersed in the plated base material, and the diamond particles are adhered to the plated base material together with the plating material.

In this case, it is preferred that the plated base material is subjected to pickling treatment first, and then the plating material is immersed.

Further, after the plating material is immersed, the culture plating is performed to increase the fixing force of the diamond particles.

Further, the plated base material may be in the form of a wire or a metal plate. Further, the plated base material may be a tool material having a predetermined shape.

A diamond attachment apparatus according to an embodiment of the present invention for achieving the above object, comprising: a plating container, and a immersion plating liquid stored in the plating container, containing an ionization tendency in an ionic state lower than being plated In the plating material of the base material, diamond particles are dispersed in the immersion plating solution; and the plated base material is immersed in the immersion plating solution to complete immersion of the plated base material and the plating material. At the same time as plating, the diamond particles are attached to the plated base material together with the plating material.

In this case, a direction changing unit may be further included, and the direction converting unit is disposed in the plating container, and the plated base material is continuously immersed in the immersion plating liquid and discharged.

The diamond adhesion method of the present invention utilizes a dip plating method, so that a plating layer having a preferable coating force can be formed by a simple production method, whereby the diamond particles can easily adhere to the base material.

Further, the diamond adhesion method of the present invention can be carried out at a relatively low temperature as compared with the diamond adhesion method using the electrolytic nickel plating method, and a rectifier or an anode is not required, so that the manufacturing method cost can be reduced.

Further, in the diamond adhesion method of the present invention, since only a predetermined thickness is formed by the plating layer which is subjected to the displacement reaction of the plated base material and the plating material, there is an advantage that the diamond particles can be attached in a single layer.

The advantages and features of the present invention, as well as the methods of achieving these advantages and features, will become more apparent from the following detailed description of the embodiments. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various manners. This embodiment is only for making the disclosure of the present invention more complete and helpful to those of ordinary skill in the art to which the present invention pertains. Within the scope of the invention, the invention is defined by the scope of the claims. Throughout the specification, the same reference numerals denote the same structural elements.

Hereinafter, a diamond adhesion method by immersion plating and a diamond attachment apparatus using the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the present invention, the immersion plating used for forming the fine particle adhesion layer 115 shown in FIGS. 1 and 2 utilizes a difference in ionization tendency.

That is, in the present invention, a substitution reaction of a base metal having a high ionization tendency and a plating metal ion having a relatively low ionization tendency is used. The base metal is ionized in order to obtain electrons, and the plated metal ions are non-ionized while being immersed in the base material.

It is known that the ionization tendency of a metal is based on hydrogen (H) and can be expressed as follows.

Li>K>Ba>Ca>Na>Mg>Al>Zn>Fe>Ni>Sn>Pb>H H>Cu>Hg>Ag>Pt>Au

For example, when the base metal is Fe and the plating metal is in the ionic state of Cu, the following substitution reaction occurs between Fe having a high ionization tendency and Cu having a relatively low ionization tendency.

Fe+Cu ²⁺ →Fe ²⁺ +Cu

Therefore, in the present invention, the base material to be plated, that is, the metal plated material to be plated, is made of a metal having a relatively high ionization tendency, and a metal having a relatively low ionization tendency is used for the plated metal which is present in an ion state. .

Fig. 3 is a view showing a diamond attachment device using immersion plating in an embodiment of the present invention.

Referring to Fig. 3, a diamond attachment device using immersion plating includes a plating container 310 and a immersion plating solution 320.

The plating container 310 provides an internal space for performing immersion plating, and the immersion plating liquid 320 is stored in the above internal space.

The immersion plating bath 320 stored in the plating container 310 contains a plating material having a lower ionization tendency than the plated base material 301 in an ionic state to perform immersion plating. And, the diamond solution is dispersed in the immersion bath 320 The stone particles 322 adhere the diamond particles to the to-be-plated base material 301 together with the plating material at the time of immersion plating.

The immersion plating solution 320 may be a solution of copper or silver in the form of ions (Cu ²⁺ , Ag ⁺ ) such as an aqueous solution of copper sulfate (CuSO ₄ ) or an aqueous solution of silver nitrate (AgNO ₃ ).

Referring to the photographs shown in Figs. 15 to 18, diamond particles 322 of about 20 μm can be utilized. However, it is not necessary to be limited to this.

When the plated base material 301 is immersed in the immersion plating solution 320, immersion plating of the plated base material 301 and the plating material is achieved. At this time, as the plating material moves toward the substrate to be plated 301, the diamond particles 322 dispersed in the immersion plating solution 320 also move toward the side of the substrate to be plated 301, and as a result, the diamond particles 322 together with the plating material Adhered to the base material 301 to be plated.

When the above-mentioned dip-plated diamond particles are adhered, an electrode or a rectifier for plating is not required, and plating can be performed by a simple manufacturing method which can be carried out at a normal temperature, and diamond particles are adhered thereto, thereby contributing to reduction in manufacturing. Method cost.

Further, if the plating of a predetermined thickness is achieved in the characteristics of the immersion plating, the plating is not performed. Therefore, the diamond particles 322 can be attached in a single layer form.

As the material constituting the base material 301 to be plated, aluminum (Al), zinc (Zn), iron (Fe) or the like which is widely used for a tool material or the like can be used.

As the plating material, zinc (Zn), iron (Fe), nickel (Ni), copper (Cu), silver (Ag), platinum (Pt), gold (Au) or the like can be used. At this time, the plating material utilizes a substance having a lower ionization tendency than the base material to be plated.

In view of this, the displacement reaction between the plated base material and the plating material can be as follows.

Fe+Cu ²⁺ →Fe ²⁺ +Cu Zn+Cu ²⁺ →Zn ²⁺ +Cu 2Al+3Cu ²⁺ →2Al ³⁺ +3Cu 2Al+3Zn ²⁺ →2Al ³⁺ +3Zn 2Al+3Ni ²⁺ → 2Al ³⁺ +3Ni Fe+Ni ²⁺ →Fe ²⁺ +Ni Zn+Ni ²⁺ →Zn ²⁺ +Ni

On the other hand, the to-be-plated base material 301 may be in the form of a wire or a metal plate. Further, the plated base material 301 may be a tool material having a predetermined shape.

As shown in FIGS. 3 and 4, the form of the immersion plating bath 320 may be different depending on the form of the base material 301 to be plated.

In other words, when the plated base material 301 is in the form of a wire or a metal plate having a long length, as in the example shown in FIG. 3, the plated base material is continuously immersed in the immersion plating solution 320 and discharged.

On the other hand, in the case where the to-be-plated base material 301 is in the form of a metal plate or a tool material of a predetermined form, as in the example shown in FIG. 4, the method of immersing the base material 301 for a predetermined time is more preferable. At this time, the plated base material 301 is completely immersed in the immersion plating solution 320 by a difference in specific gravity or a separate unit or the like, or only a part of the predetermined attached diamond may be immersed.

On the other hand, as shown in Fig. 3, in the case where the plating target material is continuously immersed in the immersion plating solution and discharged, the direction conversion unit 330 may be further included in the plating container to transfer the plated base material. .

The direction changing unit 330 may be configured in the form of one or more rolls. As shown in Figure 3 For example, the direction conversion unit 330 may include an entrance side roller and an exit side roller. One of the two rolls shown in Fig. 3 is an entry side roll and the other is an exit side roll.

The entry side roller functions to change the direction of the plated base material 301 to immerse the plated base material 301 in the immersion plating solution 320. The exit side roller serves to change the direction of the base material to be plated, and after the diamond particles are immersed and adhered, the to-be-plated base material 301 is discharged from the immersion plating solution 320.

Fig. 5 is a sequence diagram showing a method of attaching diamond by immersion plating according to an embodiment of the present invention.

Referring to Fig. 5, in the present invention, diamond particles are attached by a dip plating method. In more detail, the diamond particle attaching method of the present invention may include a plated base material degreasing/pickling step (step S510) and a dip plating/diamond particle attaching step (step S520).

In the degreasing/pickling step (step S510), the plated base material may be first subjected to a pickling treatment to remove oxides or the like on the surface of the base material, and the surface is activated. Prior to pickling, a degreasing process for removing organic matter or the like on the surface of the base material is included.

In the immersion plating/diamond particle adhesion step (step S520), the plating material having a lower ionization tendency than the substrate to be plated is contained in the ion state, and the plating target material is immersed in the immersion plating solution in which the diamond particles are dispersed. The plated material is immersed in the plated base material in a state where the plated base material is immersed in the immersion plating solution. At the same time, the diamond particles are attached to the substrate to be plated together with the plating material.

After the immersion plating, the diamond particles are more firmly adhered to the base material, and the plating is performed to increase the fixing force (step S530).

On the other hand, in the immersion plating solution, the concentration of the plating material may be about 0.5 M to 3 M, and the concentration of the diamond particles may be about 50 ct/L to 1000 ct/L in consideration of the immersion plating efficiency and the like. However, the concentration of the plating material and the concentration of the diamond particles are not necessarily limited to this, and may be based on The immersion time of the plating base material, the size and shape of the plating container, and the like are appropriately selected.

Similarly, in the case of immersion plating, the immersion time of the plated base material may be about 5 seconds to 1 minute in consideration of immersion plating efficiency, peeling, and the like, but it is not necessarily limited thereto.

Fig. 6 to Fig. 9 are photographs showing the results of adhesion of diamond particles according to the wire immersion time.

For the experiment, 400 ct of diamond particles having an average particle diameter of about 20 μm were dispersed in a 1 M volume of 1 M copper sulfate solution, and immersed in a base material of Fe material.

Referring to Figures 6 to 9, it can be seen that the longer the immersion time of the base material under the same conditions, the larger the amount of diamond particle adhesion.

Fig. 10 to Fig. 14 are photographs showing the results of adhesion of diamond particles according to the concentration of diamond particles in the immersion bath.

For the experiment, in 1M copper sulfate solution, 50ct/L (Fig. 10), 100ct/L (Fig. 11), 200ct/L (Fig. 12), 500ct/L (Fig. 13) and 1000ct/L ( Fig. 14 is a view showing the concentration of diamond particles having an average particle diameter of about 20 μm and plating on a base material of Fe material.

Referring to Figures 10 to 14, it can be seen that as the concentration of diamond particles in the immersion bath increases, the amount of adhesion also increases substantially.

15 to 18 are photographs showing an example in which diamond particles are attached to a base material after immersion plating.

Referring to Figs. 15 to 18, the diamond particles can be attached to the base material by simple immersion plating.

As described above, since the diamond adhesion method of the present invention utilizes the dip plating method, the diamond particles can be easily attached to the base material even by a simple production method.

Further, in the diamond adhesion method of the present invention, since the plating layer based on the displacement reaction of the plated base material and the plating material is formed only to a predetermined thickness, the diamond particles can be attached in a single layer.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

101‧‧‧Material

110‧‧‧Diamond particles

115‧‧‧Microparticle adhesion layer

120‧‧‧ Culture plating

130‧‧‧ polishing line

301‧‧‧Sheared base metal

310‧‧‧ plating container

320‧‧‧Dip plating bath

322‧‧‧Diamond particles

330‧‧‧ Directional conversion unit

Figs. 1 and 2 show an example in which diamond particles are adhered to a base material.

Fig. 3 is a view showing a diamond attachment device using immersion plating in an embodiment of the present invention.

Fig. 4 is a view showing a diamond attachment device using immersion plating in another embodiment of the present invention.

Fig. 5 is a sequence diagram showing a method of attaching diamond by immersion plating according to an embodiment of the present invention.

Fig. 6 to Fig. 9 are photographs showing the results of adhesion of diamond particles according to the wire immersion time.

Fig. 10 to Fig. 14 are photographs showing the results of adhesion of diamond particles according to the concentration of diamond particles in the immersion plating bath in the examples of the present invention.

15 to 18 are photographs showing an example in which diamond particles are attached to a base material after immersion plating in the embodiment of the present invention.

301‧‧‧Sheared base metal

310‧‧‧ plating container

320‧‧‧Dip plating bath

322‧‧‧Diamond particles

330‧‧‧ Directional conversion unit

Claims (9)

A diamond adhesion method comprising: plating a substance having an ionization tendency lower than that of a substrate to be plated in an ion state, and immersing the plated base material in a immersion plating solution in which diamond particles are dispersed, thereby immersing the plating material The diamond particles are attached to the plated base material together with the plating material, wherein the plated base material is selected from any one of aluminum, zinc, and iron. The plating material is selected from any one of zinc, iron, nickel, copper, silver, platinum, and gold, and a substance having a lower ionization tendency than the substrate to be plated is selected. The diamond attachment method according to claim 1, wherein the plated base material is first subjected to degreasing and pickling treatment, and then the plating material is immersed. The diamond attachment method according to claim 1, wherein after the plating of the plating material, culture plating is performed to increase the fixing force of the diamond particles. The diamond attachment method according to claim 1, wherein the plated base material is in the form of a wire. The diamond attachment method according to claim 1, wherein the plated base material is in the form of a metal plate. The method of attaching diamond according to claim 1, wherein the plated base material is a tool material having a predetermined shape. A diamond attachment device comprising: a plating container; and a immersion plating solution stored in the plating container, and containing a plating material having a lower ionization tendency than the plated base material in an ion state, wherein the immersion plating solution is dispersed a diamond particle; wherein the plated base material is immersed in the immersion plating solution to realize the plated base material and the plating While the material is immersed, the diamond particles are attached to the plated base material together with the plating material, and the plated base material is selected from any one of aluminum, zinc, and iron. The material to be applied is selected from any one of zinc, iron, nickel, copper, silver, platinum, and gold, and a substance having a lower ionization tendency than the substrate to be plated is selected. The diamond attachment device of claim 7, wherein the diamond attachment device comprises a direction conversion unit disposed in the plating container to continuously immerse the plated base material in the The immersion plating solution is described and discharged. The diamond attachment device of claim 8, wherein the direction conversion unit comprises: an entry side roller that immerses the plated base material in the immersion plating solution; and an exit side roller that The plated base material is discharged from the immersion plating solution.