TWI542604B - Novel polymer - Google Patents

Novel polymer Download PDF

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TWI542604B
TWI542604B TW103110083A TW103110083A TWI542604B TW I542604 B TWI542604 B TW I542604B TW 103110083 A TW103110083 A TW 103110083A TW 103110083 A TW103110083 A TW 103110083A TW I542604 B TWI542604 B TW I542604B
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acrylate
monomer
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meth
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TW201428012A (en
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Minoru Yamaguchi
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Nippon Catalytic Chem Ind
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36Amides or imides
    • C08F222/40Imides, e.g. cyclic imides
    • C08F222/402Alkyl substituted imides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02Monomers containing only one unsaturated aliphatic radical
    • C08F212/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06Hydrocarbons
    • C08F212/12Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36Amides or imides
    • C08F222/40Imides, e.g. cyclic imides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

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Description

新穎聚合物 Novel polymer

本發明係關於一種耐熱性優異之新穎聚合物。 The present invention relates to a novel polymer excellent in heat resistance.

以往,耐熱性優異之具有光聚合性之聚合物係提出例如:將含有馬來醯亞胺之單體成分加以聚合而成之聚合物(例如,參照日本專利特開2003-201316號公報)、將特定結構的化合物即2-(羥基烷基)丙烯酸酯之醚二聚物加以聚合而成之聚合物(例如,參照日本專利特開2004-300203號公報)等。 In the past, a polymer having a photopolymerizable property, which is excellent in heat resistance, has been proposed, for example, a polymer obtained by polymerizing a monomer component containing maleimide (for example, refer to JP-A-2003-201316). A polymer obtained by polymerizing an ether dimer of a compound of a specific structure, that is, a 2-(hydroxyalkyl) acrylate (for example, refer to JP-A-2004-300203).

然而,該等聚合物在膜、薄膜之形成步驟中之加熱時會熱分解,並產生分解氣體的情況係相當明顯。例如,使用該等聚合物作為液晶顯示器、印刷配線基板製作用之感光性樹脂的情況時,有於製造步驟中加熱時產生之分解物會汙染加熱爐、或者分解物會汙染液晶、基板而電氣絕緣性降低等情況。 However, the fact that the polymers are thermally decomposed upon heating in the film or film forming step and the decomposition gas is generated is quite remarkable. For example, when such a polymer is used as a photosensitive resin for producing a liquid crystal display or a printed wiring board, the decomposition product generated during heating in the manufacturing step may contaminate the heating furnace, or the decomposition product may contaminate the liquid crystal or the substrate and be electrically Insulation is reduced, etc.

又,有人提出馬來醯亞胺、苯乙烯、以及具有酸基之聚合物(例如,參照日本專利特開2002-30119號公報)等。但是,此種聚合物有對有機溶劑、鹼之溶解速度慢的問題。因此,係要求一種聚合物,其提高耐熱性同時容易調製樹脂組成物,且作為感光性樹脂使用時可提高顯影性。 Further, maleimide, styrene, and a polymer having an acid group have been proposed (for example, refer to Japanese Laid-Open Patent Publication No. 2002-30119). However, such a polymer has a problem that the dissolution rate of an organic solvent or an alkali is slow. Therefore, there is a demand for a polymer which is improved in heat resistance and which is easy to prepare a resin composition, and which can improve developability when used as a photosensitive resin.

因而,本發明之目的係提供一種聚合物,其耐熱性優異 而可減少於加熱時產生之氣體,對於有機溶劑、鹼之溶解速度快,且鹼顯影性優異。 Accordingly, it is an object of the present invention to provide a polymer which is excellent in heat resistance Further, it is possible to reduce the gas generated during heating, and it has a high dissolution rate for an organic solvent or an alkali, and is excellent in alkali developability.

本發明人為了解決上述課題而努力探討。其結果發現:以N-取代馬來醯亞胺及/或特定結構之化合物即2-(羥基烷基)丙烯酸酯之醚二聚物、乙烯基甲苯、以及具有酸基之單體作為必須成分共聚合而成之高分子(polymer)可一舉解決此課題,而本發明於焉完成。 The present inventors have made an effort to solve the above problems. As a result, it has been found that an N-substituted maleimide and/or a compound of a specific structure, that is, an ether dimer of 2-(hydroxyalkyl)acrylate, vinyltoluene, and a monomer having an acid group are essential components. The copolymerized polymer can solve this problem in one fell swoop, and the present invention is completed in 焉.

亦即,本發明之特徵在於係一種以N-取代馬來醯亞胺及/或下述通式(1)所表示之化合物、乙烯基甲苯、以及具有酸基之單體作為必須成分共聚合而成之高分子。 That is, the present invention is characterized in that a compound represented by N-substituted maleimide and/or a compound represented by the following formula (1), vinyl toluene, and a monomer having an acid group are copolymerized as an essential component. Made of polymer.

(式(1)中,R1及R2分別獨立,表示氫原子或可具有取代基之碳數1~25之烴基)。 (In the formula (1), R & lt 1 and R 2 each independently represents a hydrogen atom or a substituent having a carbon number of the hydrocarbon group of 1 to 25).

圖1係表示實施例3中鹼顯影後之基板狀態圖。 Fig. 1 is a view showing the state of a substrate after alkali development in Example 3.

圖2係表示比較例3中鹼顯影後之基板狀態圖。 Fig. 2 is a view showing a state of a substrate after alkali development in Comparative Example 3.

本案說明書中之「以上」、「以下」係包含該數值。亦即,「以上」意指不少於(該數值以及該數值以上)。 The above values and the following are included in the description of this manual. That is, "above" means not less than (the value and the value above).

本發明之聚合物係以N-取代馬來醯亞胺及/或下述通式(1)所表示之化合物(以下有時稱為「醚二聚物」)、乙烯基甲苯、以及具有酸基之單體作為必須成分共聚合而成之聚合物。 The polymer of the present invention is an N-substituted maleimide and/or a compound represented by the following formula (1) (hereinafter sometimes referred to as "ether dimer"), vinyl toluene, and an acid. A monomer obtained by copolymerizing a monomer as an essential component.

(式(1)中,R1及R2分別獨立,表示氫原子或可具有取代基之碳數1~25之烴基。) (In the formula (1), R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.)

藉此,使用有本發明聚合物之感光性樹脂組成物成為耐熱性及透明性皆極為優異者。推測此原因在於因將N-取代馬來醯亞胺、前述醚二聚物加以聚合所形成之主鏈環結構、以及乙烯基甲苯結構而耐熱性大幅提高且熱分解受到抑制(耐熱分解性提高)所致。 Therefore, the photosensitive resin composition using the polymer of the present invention is extremely excellent in heat resistance and transparency. It is presumed that the reason is that the heat resistance is greatly improved and the thermal decomposition is suppressed (the heat decomposition resistance is improved by the main chain ring structure formed by polymerizing the N-substituted maleimide and the ether dimer, and the vinyl toluene structure. ) caused.

又,本發明人發現到關於感光性樹脂之耐熱性,若聚合物中有酯鍵結,則容易熱分解。因此,本發明之聚合物中,結構方面以實質上不具有酯鍵結較佳。此種聚合物,除了具有環結構之單體以及具有酸基之單體以外,係考慮將苯乙烯、乙烯基甲苯等不具有酯鍵結的單體加以共聚合所成者。其中,尤其在解決了上述課題後,發現使用乙烯基甲苯於本技術領域中係達到無法預期之效果,十分優異。亦即,藉由使用乙烯基甲苯,可形成對於有機溶劑、鹼之溶解速度可提高,且易於調製樹脂組成物,用於作為感光性樹脂時鹼顯影性優異之硬化塗膜。 Moreover, the inventors have found that the heat resistance of the photosensitive resin is likely to be thermally decomposed if there is an ester bond in the polymer. Therefore, in the polymer of the present invention, it is preferred that the structure has substantially no ester bond. Such a polymer is preferably a copolymer of a monomer having no ester bond, such as styrene or vinyltoluene, in addition to a monomer having a ring structure and a monomer having an acid group. Among them, in particular, after solving the above problems, it has been found that the use of vinyl toluene is excellent in an unexpected effect in the art. In other words, by using vinyl toluene, it is possible to form a cured coating film which is improved in the rate of dissolution of an organic solvent or an alkali, and which is easy to prepare a resin composition, and which is excellent in alkali developability as a photosensitive resin.

以下,說明前述聚合物。 Hereinafter, the above polymer will be described.

前述N-取代馬來醯亞胺可舉出:N-甲基馬來醯亞胺、N-異丙基馬來醯亞胺、N-環己基馬來醯亞胺等烷基取代馬來醯亞胺、N-苯基馬來醯亞胺、N-芐基馬來醯亞胺等具有芳香族基之馬來醯亞胺。該等之中,由對溶劑之溶解性、耐熱分解性、工業上容易取得等觀點來看,較佳為N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、N-芐基馬來醯亞胺。該等之中,由對溶劑之溶解性、加熱時之著色少之觀點來看,最佳為N-芐基馬來醯亞胺。 The N-substituted maleimide may be an alkyl-substituted maleate such as N-methylmaleimide, N-isopropylmaleimide or N-cyclohexylmaleimide. An aromatic group-containing maleimide such as an imine, N-phenylmaleimide or N-benzylmaleimide. Among these, N-phenylmaleimide, N-cyclohexylmaleimide, N- are preferable from the viewpoints of solubility in a solvent, thermal decomposition resistance, and industrial availability. Benzyl maleimide. Among these, N-benzylmaleimide is most preferable from the viewpoint of solubility in a solvent and a small color upon heating.

表示前述醚二聚物之前述通式(1)中,R1以及R2所表示之可具有取代基之碳數1~25之烴基並無特別限制,可舉出例如:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、第三戊基、硬脂醯基、月桂基、2-乙基己基等直鏈狀或支鏈狀烷基;苯基等芳香基;環己基、第三丁基環己基、二環戊二烯基、三環癸烯基、異莰基(isobornyl)、金剛烷基(adamantyl)、2-甲基-2-金剛烷基等脂環式基;以1-甲氧基乙基、1-乙氧基乙基等之烷氧基取代之烷基;以芐基等芳香基取代之烷基;等。該等之中碳數較佳為8以下,再者,由耐熱性之觀點來看,較佳為如甲基、乙基、環己基、芐基、2-乙基己基等這類難以因酸、熱而脫離之1級或2級碳之取代基。其中,R1以及R2可為同種取代基,亦可為不同之取代基。 In the above formula (1), the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R 1 and R 2 in the above-mentioned ether dimer is not particularly limited, and examples thereof include a methyl group and an ethyl group. a straight or branched alkyl group such as n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, third amyl, stearyl, lauryl or 2-ethylhexyl An aryl group such as phenyl; cyclohexyl, tert-butylcyclohexyl, dicyclopentadienyl, tricyclodecenyl, isobornyl, adamantyl, 2-methyl-2 An alicyclic group such as an adamantyl group; an alkyl group substituted with an alkoxy group such as a 1-methoxyethyl group or a 1-ethoxyethyl group; an alkyl group substituted with an aryl group such as a benzyl group; The carbon number in these is preferably 8 or less. Further, from the viewpoint of heat resistance, it is preferably such as a methyl group, an ethyl group, a cyclohexyl group, a benzyl group or a 2-ethylhexyl group. a substituent of a grade 1 or 2 carbon that is thermally removed. Wherein R 1 and R 2 may be the same substituent or different substituents.

前述醚二聚物之具體例可舉出例如:二甲基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯(dimethyl-2,2’-[oxybis(methylene)bis-2-propenoate]、二乙基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(正丙基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(異丙基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(正丁基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(異丁基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(第三丁基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(第三戊基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(硬脂醯基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(月桂基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(2-乙基己基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(1-甲氧基乙基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(1-乙氧基乙基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二芐基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二苯基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二環己基-2,2’-[氧雙(亞甲基)]雙 -2-丙烯酸酯、二(第三丁基環己基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(二環戊二烯基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(三環癸烯基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(異莰基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二金剛烷基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(2-甲基-2-金剛烷基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯等。 Specific examples of the ether dimer include dimethyl-2,2'-[oxybis(methylene)]bis-2-acrylate (dimethyl-2,2'-[oxybis(methylene)). Bis-2-propenoate], diethyl-2,2'-[oxybis(methylene)]bis-2-acrylate, di(n-propyl)-2,2'-[oxybis(sub. Base]] bis-2-acrylate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, di(n-butyl)-2,2'- [oxybis(methylene)]bis-2-acrylate, di(isobutyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, di(t-butyl -2,2'-[oxybis(methylene)]bis-2-acrylate, bis(third amyl)-2,2'-[oxybis(methylene)]bis-2-propenoic acid Ester, bis(stearyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, bis(lauryl)-2,2'-[oxybis(methylene) Bis-2-acrylate, bis(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, bis(1-methoxyethyl)-2 , 2'-[oxybis(methylene)]bis-2-acrylate, bis(1-ethoxyethyl)-2,2'-[oxybis(methylene)]bis-2-acrylic acid Ester, dibenzyl-2,2'-[oxybis(methylene)]bis-2-acrylate, diphenyl-2,2'- [Oxygen bis(methylene)] bis-2-acrylate, dicyclohexyl-2,2'-[oxybis(methylene)] double -2-acrylate, bis(t-butylcyclohexyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, bis(dicyclopentadienyl)-2,2 '-[Oxobis(methylene)]bis-2-acrylate, bis(tricyclodecenyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, di(( Isodecyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, diamantyl-2,2'-[oxybis(methylene)]bis-2-acrylic acid Ester, bis(2-methyl-2-adamantyl)-2,2'-[oxybis(methylene)]bis-2-acrylate, and the like.

該等之中尤其以二甲基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二乙基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二環己基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二芐基-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯、二(2-乙基己基)-2,2’-[氧雙(亞甲基)]雙-2-丙烯酸酯為佳。該等醚二聚物可僅為1種,亦可為2種以上。 Among these, especially dimethyl-2,2'-[oxybis(methylene)]bis-2-acrylate, diethyl-2,2'-[oxybis(methylene)] double 2-acrylate, dicyclohexyl-2,2'-[oxybis(methylene)]bis-2-acrylate, dibenzyl-2,2'-[oxybis(methylene)] double Preferably, 2-acrylate or bis(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-acrylate is preferred. These ether dimers may be used alone or in combination of two or more.

獲得本發明之聚合物時之單體成分中N-取代馬來醯亞胺及/或前述醚二聚物之比例並無特別限制,但於總單體成分中為2~60質量,較佳為5~50質量,更佳為5~40質量。N-取代馬來醯亞胺及/或醚二聚物的量若過多,則有對溶劑、鹼之溶解性降低、或聚合時會變得容易析出或凝膠化之虞。另一方面,若過少,則有耐熱性不足之虞。 The ratio of the N-substituted maleimide and/or the ether dimer in the monomer component when the polymer of the present invention is obtained is not particularly limited, but is 2 to 60 mass in the total monomer component, preferably. It is 5~50 mass, more preferably 5~40 mass. When the amount of the N-substituted maleimide and/or the ether dimer is too large, the solubility in a solvent or an alkali may be lowered, or the precipitate may be easily precipitated or gelled during polymerization. On the other hand, if it is too small, there is a lack of heat resistance.

前述乙烯基甲苯有鄰乙烯基甲苯、對乙烯基甲苯、間乙烯基甲苯。該等之中,工業上取得容易之間乙烯基甲苯、對乙烯基甲苯、以及間乙烯基甲苯與對乙烯基甲苯之混合物為佳,尤其以工業上取得容易之間乙烯基甲苯與對乙烯基甲苯之混合物較適合。 The aforementioned vinyl toluene includes o-vinyltoluene, p-vinyltoluene, and m-vinyltoluene. Among these, it is industrially easy to obtain a mixture of vinyl toluene, p-vinyl toluene, and a mixture of m-vinyl toluene and p-vinyl toluene, especially industrially easy to obtain between vinyl toluene and vinyl. A mixture of toluene is preferred.

前述聚合物之單體成分中乙烯基甲苯之比例並無特別限制,於總單體成分中為5~80質量%,較佳為10~70質量%,更佳為15~60質量%。乙烯基甲苯的量若過多,則對鹼之溶解性有降低之虞。又,若過少,則有熱安定性降低且加熱時分解氣體產生變多之虞。 The proportion of the vinyl toluene in the monomer component of the polymer is not particularly limited, and is 5 to 80% by mass, preferably 10 to 70% by mass, and more preferably 15 to 60% by mass based on the total monomer component. If the amount of vinyl toluene is too large, the solubility in alkali is lowered. Further, if the amount is too small, the thermal stability is lowered and the decomposition gas is increased during heating.

前述具有酸基之單體(含有酸基之單體)例,只要是具有 酸基與聚合性雙鍵之單體即無特別限制,較佳為丙烯酸、甲基丙烯酸。尤其,本發明之聚合物因含有乙烯基甲苯單位作為必須成分故疏水性強。因此,為了發揮充分鹼可溶性,較強親水性之丙烯酸最佳。 Examples of the monomer having an acid group (a monomer having an acid group) as long as it has The monomer of the acid group and the polymerizable double bond is not particularly limited, and is preferably acrylic acid or methacrylic acid. In particular, the polymer of the present invention is highly hydrophobic because it contains a vinyl toluene unit as an essential component. Therefore, in order to exhibit sufficient alkali solubility, acrylic acid having a relatively high hydrophilicity is preferred.

前述聚合物之單體成分中含有酸基之單體之比例並無特別限制,實質上於總單體成分中為5~40質量%較佳,8~30質量%更佳,8~20質量%最佳。含有酸基之單體量若過少,則鹼可溶性有不足之虞。又,若過多,則耐熱分解性會降低或對溶劑之溶解性有降低之虞。此處,含有酸基之單體之實質比例,係指除去為了將反應性雙鍵導入於後述之側鏈,而使(甲基)丙烯酸縮水甘油酯等反應所消耗之量的比例。本發明中,如後所述,為了將反應性雙鍵導入於側鏈,有時會使(甲基)丙烯酸縮水甘油酯等進行反應。此時,所消耗之含有酸基之單體量必須預先增加至上述量,增加後的含有酸基之單體總量較佳為15~60質量%,更佳為20~55質量%,最佳為20~50質量%。 The ratio of the monomer having an acid group in the monomer component of the polymer is not particularly limited, and is preferably 5 to 40% by mass, more preferably 8 to 30% by mass, and 8 to 20% by mass based on the total monomer component. %optimal. If the amount of the monomer having an acid group is too small, the alkali solubility may be insufficient. On the other hand, if it is too large, the thermal decomposition resistance is lowered or the solubility in a solvent is lowered. Here, the substantial ratio of the monomer containing an acid group means the ratio which removes the quantity which the reaction of the (meth)acrylic acid glycidyl- In the present invention, as described later, in order to introduce a reactive double bond into a side chain, a reaction such as glycidyl (meth)acrylate may be carried out. At this time, the amount of the acid group-containing monomer to be consumed must be increased to the above amount in advance, and the total amount of the acid group-containing monomer to be added is preferably 15 to 60% by mass, more preferably 20 to 55% by mass, most preferably Good is 20~50% by mass.

本發明之聚合物雖然可含有或不含有上述必須之單體單位以外的單體單位,但上述必須之單體單位占聚合物之合計質量比例例如50質量%以上較佳。更較佳為70質量%以上,再更佳為90質量%以上,而實質上所有的成分皆為必須之單體單位最佳。 The polymer of the present invention may or may not contain a monomer unit other than the above-mentioned necessary monomer unit, and the above-mentioned necessary monomer unit is preferably 50% by mass or more based on the total mass ratio of the polymer. It is more preferably 70% by mass or more, still more preferably 90% by mass or more, and substantially all of the components are the most preferable monomer units.

本發明聚合物中之單體單位的排列形態可為例如:無規共聚物、交替共聚合物、嵌段共聚合物之任一者。 The arrangement of the monomer units in the polymer of the present invention may be, for example, any of a random copolymer, an alternating copolymer, and a block copolymer.

本發明之聚合物進一步於側鏈含有聚合性雙鍵較佳。藉由於側鏈帶有聚合性雙鍵,可以熱、光來進行硬化。因此,耐熱分解性更為提高之外,製成感光性樹脂組成物時對光之感度提高,可以較少的光進行硬化且硬化後機械強度亦變高。將聚合性雙鍵導入於側鏈之方法較佳為將帶有與雙鍵及酸基反應之官能基之單體與前述聚合物酸基的局 部反應之方法。帶有與雙鍵及酸基反應之官能基之單體較佳為(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧基環己酯、異丙烯基噁唑啉等,從工業取得容易性、反應性之觀點來看,甲基丙烯酸縮水甘油酯最佳。其中,本說明書中,「(甲基)丙烯酸」係表示甲基丙烯酸與丙烯酸兩者之記載。 The polymer of the present invention further preferably contains a polymerizable double bond in the side chain. By the side chain having a polymeric double bond, it can be hardened by heat or light. Therefore, the heat-resistant decomposability is further improved, and the sensitivity to light is improved when the photosensitive resin composition is formed, and the light can be hardened with less light and the mechanical strength after hardening is also increased. The method of introducing a polymerizable double bond into a side chain is preferably a unit of a monomer having a functional group reactive with a double bond and an acid group and the aforementioned polymer acid group. The method of reaction. The monomer having a functional group reactive with a double bond and an acid group is preferably glycidyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, isopropenyloxazoline. Etc., glycidyl methacrylate is the most preferable from the viewpoint of ease of industrial use and reactivity. In the present specification, "(meth)acrylic acid" means both methacrylic acid and acrylic acid.

將雙鍵導入於側鏈時,就雙鍵之含量而言,雙鍵當量為400~10萬較佳、400~1萬更較佳,500~3000最佳。雙鍵當量過高時,對光之感度有變低之虞,又,雙鍵當量過低時,有保存安定性變差或對溶劑之溶解性降低之虞。將(甲基)丙烯酸縮水甘油酯等帶有與雙鍵及酸基反應之官能基之單體加成於聚合物中酸基局部之方法可採用習知方法,並無特別限制,反應溫度較佳為60℃~140℃,又,使用三乙胺、二甲基芐胺等胺化合物、四乙基氯化銨等銨鹽、四苯基溴化鏻等鏻鹽、二甲基甲醯胺等醯胺化合物等習知之觸媒較佳。 When the double bond is introduced into the side chain, the double bond equivalent is preferably 400 to 100,000, more preferably 400 to 10,000, and most preferably 500 to 3,000. When the double bond equivalent is too high, the sensitivity to light is lowered, and when the double bond equivalent is too low, the storage stability is deteriorated or the solubility in a solvent is lowered. A method of adding a monomer having a functional group reactive with a double bond and an acid group such as glycidyl (meth)acrylate to the acid group in the polymer can be carried out by a conventional method, and is not particularly limited, and the reaction temperature is relatively high. Preferably, it is 60 ° C to 140 ° C, and an amine compound such as triethylamine or dimethylbenzylamine, an ammonium salt such as tetraethylammonium chloride, a phosphonium salt such as tetraphenylphosphonium bromide or dimethylformamide is used. A known catalyst such as a guanamine compound is preferred.

前述聚合物係如上所述,較佳為實質上所有的成分皆為必須之單體單位,但亦可視需要含有其他可共聚合之單體。 The above polymers are as described above, and it is preferred that substantially all of the components are essential monomer units, but other copolymerizable monomers may optionally be included.

前述其他可共聚合之單體可舉出例如:苯乙烯等之芳香族乙烯基化合物;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸芐酯、(甲基)丙烯酸2-羥基乙酯等(甲基)丙烯酸酯類;丁二烯、異戊二烯等丁二烯或取代丁二烯化合物;乙烯、丙烯、氯乙烯基、丙烯腈等乙烯或取代乙烯化合物;乙酸乙烯酯等乙烯酯類;等。該等之中較佳為(甲基)丙烯酸甲酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸芐酯。該等可共聚合之其他單體可僅使用1種亦可併用2種以上。其中, 本說明書中,「(甲基)丙烯酸」係表示甲基丙烯酸與丙烯酸兩者。 Examples of the other copolymerizable monomer include aromatic vinyl compounds such as styrene; methyl (meth)acrylate, ethyl (meth)acrylate, and n-propyl (meth)acrylate; Isopropyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (methyl) (cyclo) hexyl acrylate, benzyl (meth) acrylate, (meth) acrylate such as 2-hydroxyethyl (meth) acrylate; butadiene or substituted butadiene such as butadiene or isoprene a compound; an ethylene or substituted ethylene compound such as ethylene, propylene, vinyl chloride or acrylonitrile; a vinyl ester such as vinyl acetate; and the like. Among these, methyl (meth)acrylate, cyclohexyl (meth)acrylate, and benzyl (meth)acrylate are preferable. These other monomers which can be copolymerized may be used alone or in combination of two or more. among them, In the present specification, "(meth)acrylic acid" means both methacrylic acid and acrylic acid.

獲得前述聚合物時之單體成分包含前述可共聚合之其他單體的情況時,其含有比例並無特別限制,較佳為聚合物中50質量%以下,更佳為30質量%以下,再更佳為10質量%以下。尤其,(甲基)丙烯酸酯類因耐熱安定性差,故於加熱時易於發生醇從酯結構脫離。因此,(甲基)丙烯酸酯的情況時,較佳為20質量%以下,更佳為10質量%以下,再更佳為實質上不含(甲基)丙烯酸酯。其中,於(甲基)丙烯酸單位加成有(甲基)丙烯酸縮水甘油酯等單位因加熱時會交聯,故熱安定性降低少。本發明中,(甲基)丙烯酸酯並不含有於(甲基)丙烯酸單位加成有(甲基)丙烯酸縮水甘油酯之單位。 When the monomer component in the case where the polymer is obtained contains the other monomer which can be copolymerized, the content ratio thereof is not particularly limited, but is preferably 50% by mass or less, more preferably 30% by mass or less, more preferably 30% by mass or less. More preferably, it is 10% by mass or less. In particular, since (meth) acrylates are inferior in heat stability, the alcohol is apt to be detached from the ester structure upon heating. Therefore, in the case of (meth) acrylate, it is preferably 20% by mass or less, more preferably 10% by mass or less, and still more preferably substantially no (meth) acrylate. Among them, a unit such as glycidyl (meth)acrylate is added to the unit of (meth)acrylic acid because it is crosslinked during heating, so that the thermal stability is less reduced. In the present invention, the (meth) acrylate is not contained in units of (meth)acrylic acid unit-added glycidyl (meth)acrylate.

前述單體成分之聚合反應方法並無特別限制,可採用以往習知的各種聚合方法,但以溶液聚合法進行尤佳。其中,聚合溫度、聚合濃度(聚合濃度(%)=[單體成分之總重量/(單體成分之總重量+溶劑重量)]×100)雖因所使用之單體成分的種類或比率、目標高分子之分子量而異,但定為聚合溫度40~150℃、聚合濃度20~50%較佳,定為聚合溫度60~130℃、聚合濃度30~45%更佳。 The polymerization reaction method of the monomer component is not particularly limited, and various conventional polymerization methods can be employed, but it is particularly preferable to carry out the solution polymerization method. In addition, the polymerization temperature and the polymerization concentration (polymerization concentration (%) = [total weight of monomer components / (total weight of monomer components + solvent weight)] × 100) are due to the type or ratio of the monomer components used, The molecular weight of the target polymer varies, but the polymerization temperature is 40 to 150 ° C, and the polymerization concentration is preferably 20 to 50%, and the polymerization temperature is preferably 60 to 130 ° C, and the polymerization concentration is preferably 30 to 45%.

於前述單體成分之聚合中使用溶劑時,使用一般的自由基聚合反應所使用之溶劑做為溶劑即可。具體而言,可舉出例如:四氫呋喃、二噁烷、乙二醇二甲基醚、二乙二醇二甲基醚等醚類;丙酮、甲乙酮、甲基異丁酮、環己酮等酮類;乙酸乙酯、乙酸丁酯、丙二醇單甲基醚乙酸酯、乙酸3-甲氧基丁酯等酯類;甲醇、乙醇、異丙醇、正丁醇、乙二醇單甲基醚、丙二醇單甲基醚等醇類;甲苯、二甲苯、乙基苯等芳香族烴類;氯仿;二甲基亞碸;等。該等溶劑可僅使用1種或併用2種以上。又,尤其在含有酸基之單體含量超過30質量%的情況時,為了防 止重量體的析出,較佳為丙二醇單甲基醚乙酸酯等酯系溶劑與、丙二醇單甲基醚、異丙醇等醇系溶劑之混合溶劑。其中,此處之含有酸基之單體的含量係指增加了為了於側鏈導入反應性雙鍵所消耗之量。 When a solvent is used for the polymerization of the monomer component, a solvent used in a general radical polymerization reaction may be used as a solvent. Specific examples thereof include ethers such as tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; and ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. Ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, etc.; methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether An alcohol such as propylene glycol monomethyl ether; an aromatic hydrocarbon such as toluene, xylene or ethylbenzene; chloroform; dimethyl hydrazine; These solvents may be used alone or in combination of two or more. Further, especially in the case where the content of the monomer having an acid group exceeds 30% by mass, in order to prevent The precipitation of the weight-retaining body is preferably a mixed solvent of an ester solvent such as propylene glycol monomethyl ether acetate or an alcohol solvent such as propylene glycol monomethyl ether or isopropyl alcohol. Here, the content of the acid group-containing monomer herein means an amount which is increased in order to introduce a reactive double bond to the side chain.

將前述單體成分加以聚合時,視需要亦可添加一般使用之聚合起始劑。聚合起始劑並無特別限制,可舉出例如:異丙苯過氧化氫(cumene hydroperoxide)、二異丙基苯過氧化氫、過氧化二-第三丁基、過氧化月桂醯、過氧化苯甲醯、過氧化第三丁基異丙基碳酸酯、過氧2-乙基己酸第三戊酯、過氧-2-乙基己酸第三丁酯等有機過氧化物;2,2’-偶氮雙(異丁腈)、1,1’-偶氮雙(環己甲腈)(1,1’-azobis(cyclohexanecarbonitrile))、2,2’-偶氮雙(2,4-二甲基戊腈)、二甲基2,2’-偶氮雙(2-甲基丙酸酯)等偶氮化合物。該等聚合起始劑可僅使用1種或併用2種以上。其中,起始劑之使用量可因應所使用之單體的組合、反應條件、目標高分子之分子量等來適當地設定,並無特別限定,但從可獲得不會凝膠化且重量平均分子量為數千~數萬之高分子之觀點來看,相對於總單體成分為0.1~15質量%,較佳為0.5~10質量%。 When the monomer component is polymerized, a polymerization initiator which is generally used may be added as needed. The polymerization initiator is not particularly limited, and examples thereof include cumene hydroperoxide, diisopropylbenzene hydroperoxide, di-tert-butyl peroxide, laurel peroxide, and peroxidation. Organic peroxides such as benzamidine, tributyl isopropyl carbonate, third ester of peroxy 2-ethylhexanoate, and tert-butyl peroxy-2-ethylhexanoate; 2'-azobis(isobutyronitrile), 1,1'-azobis(cyclohexanecarbonitrile), 2,2'-azobis (2,4 An azo compound such as dimethylacetonitrile or dimethyl 2,2'-azobis(2-methylpropionate). These polymerization initiators may be used alone or in combination of two or more. In addition, the amount of the initiator to be used may be appropriately set depending on the combination of the monomers to be used, the reaction conditions, the molecular weight of the target polymer, and the like, and is not particularly limited, but a weight average molecular weight which is not gelled can be obtained. From the viewpoint of thousands to tens of thousands of polymers, it is 0.1 to 15% by mass, preferably 0.5 to 10% by mass based on the total monomer component.

將前述單體成分加以聚合時,為了調整分子量,亦可視需要添加一般所使用之鏈轉移劑。鏈轉移劑可舉出例如:正十二烷基硫醇(n-dodecyl mercaptan)、巰基丙酸、巰基乙酸、巰基乙酸甲酯等硫醇系鏈轉移劑、α-甲基苯乙烯二聚物等,但以鏈轉移效果高且可減少殘存單體、取得容易之正十二烷基硫醇、巰基丙酸較佳。使用鏈轉移劑的情況時,其使用量可因應所使用之單體的組合、反應條件、目標高分子之分子量等適當地設定,無特別限定,但從可獲得不會凝膠化且重量平均分子量為數千~數萬之高分子之觀點來看,較佳為相對於總單體成分為0.1~15質量%,更佳為0.5~10質量%。 When the monomer component is polymerized, a chain transfer agent which is generally used may be added as needed in order to adjust the molecular weight. The chain transfer agent may, for example, be a thiol chain transfer agent such as n-dodecyl mercaptan, mercaptopropionic acid, mercaptoacetic acid or methyl thioglycolate, or an α-methylstyrene dimer. For example, n-dodecyl mercaptan or mercaptopropionic acid is preferred because it has a high chain transfer effect and can reduce residual monomers. In the case of using a chain transfer agent, the amount of the monomer to be used may be appropriately set depending on the combination of the monomers to be used, the reaction conditions, the molecular weight of the target polymer, and the like, and is not particularly limited, but the gelation is not obtained and the weight average is obtained. From the viewpoint of a polymer having a molecular weight of several thousands to several tens of thousands, it is preferably from 0.1 to 15% by mass, more preferably from 0.5 to 10% by mass, based on the total monomer component.

本發明之聚合物之重量平均分子量雖無特別限制,但較佳為2000~200000、更佳為5000~100000。重量平均分子量超過200000時,會變得過高黏度而難以形成塗膜,另一方面,若未滿2000,則有變得難以展現充分耐熱性的傾向。其中,重量平均分子量之測定方法係示於下述實施例。 The weight average molecular weight of the polymer of the present invention is not particularly limited, but is preferably from 2,000 to 200,000, more preferably from 5,000 to 100,000. When the weight average molecular weight exceeds 200,000, the viscosity is too high and it is difficult to form a coating film. On the other hand, if it is less than 2,000, it tends to be difficult to exhibit sufficient heat resistance. Among them, the method for measuring the weight average molecular weight is shown in the following examples.

前述聚合物,酸價為30~300mgKOH/g較佳,更佳為50~200mgKOH。酸價未滿30mgKOH/g時,則難以適用於鹼顯影;超過300mgKOH/g時,則會變得過高黏度而有難以形成塗膜之傾向。又,對於溶劑之溶解性會變低,於合成中析出,有無法攪拌之虞。 The polymer preferably has an acid value of 30 to 300 mgKOH/g, more preferably 50 to 200 mgKOH. When the acid value is less than 30 mgKOH/g, it is difficult to apply to alkali development. When it exceeds 300 mgKOH/g, the viscosity tends to be too high, and it tends to be difficult to form a coating film. Further, the solubility in the solvent is lowered, and precipitation occurs during the synthesis, and there is a possibility that the solvent cannot be stirred.

本發明之聚合物雖可特別適用於作為熱硬化性樹脂組成物、感光性樹脂組成物之黏結劑高分子,但以作為感光性樹脂組成物之黏結劑特佳。用作為感光性樹脂組成物之黏結劑時,前述聚合物之外,配合自由基聚合性化合物、光聚合起始劑,溶劑之外,視需要配合増感劑、顏料、顏料分散劑、界面活性劑等較佳。 The polymer of the present invention is particularly suitable as a binder polymer which is a thermosetting resin composition or a photosensitive resin composition, but is particularly preferable as a binder of a photosensitive resin composition. When a binder is used as the photosensitive resin composition, in addition to the above-mentioned polymer, a radical polymerizable compound, a photopolymerization initiator, and a solvent may be blended, if necessary, a sensitizer, a pigment, a pigment dispersant, and an interfacial activity. Agents and the like are preferred.

光聚合起始劑可舉出:2-氯噻噸酮等噻噸酮類;苯乙酮二甲基縮酮、芐基二甲基縮酮等縮酮類;二苯基酮等二苯基酮類;2-甲基-1-[4-(甲基硫)苯基]-2-嗎啉基-丙-1-酮、2-芐基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1;醯基膦氧化物(acylphosphine oxide)類以及氧雜蔥酮(xanthone)類等,該等可單獨使用亦可併用2種類以上。 Examples of the photopolymerization initiator include thioxanthones such as 2-chlorothioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; and diphenyl groups such as diphenyl ketone. Ketones; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinyl-propan-1-one, 2-benzyl-2-dimethylamino-1-( 4-morpholinylphenyl)-butanone-1; acylphosphine oxides and xanthones, and the like may be used alone or in combination of two or more.

又其含有比例相對於前述聚合物,較佳為0.1~50質量%,更佳為0.5~30質量%。 Further, the content thereof is preferably 0.1 to 50% by mass, more preferably 0.5 to 30% by mass based on the above polymer.

本發明之聚合物,視需要可含有作為稀釋劑之溶劑。前述溶劑只要是將聚合物均勻溶解且不會反應者即不特別限制。具體而言可舉出例如:四氫呋喃、二噁烷、乙二醇二甲基醚、二乙二醇二甲基醚 等醚類;丙酮、甲乙酮、甲基異丁基酮、環己烷等酮類;乙酸乙酯、乙酸丁酯、丙二醇單甲基醚乙酸酯、乙酸3-甲氧基丁酯等酯類;甲醇、乙醇、異丙醇、正丁醇、乙二醇單甲基醚、丙二醇單甲基醚等醇類;甲苯、二甲苯、乙基苯等芳香族烴類;氯仿、二甲基亞碸;等。其中,溶劑之含量可因應使用時之最適黏度適當地設定。 The polymer of the present invention may contain a solvent as a diluent as needed. The solvent is not particularly limited as long as it dissolves the polymer uniformly and does not react. Specific examples thereof include tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether. Ethers; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexane; ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, etc. ; alcohols such as methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether; aromatic hydrocarbons such as toluene, xylene, ethylbenzene; chloroform, dimethyl Oh; wait. Among them, the content of the solvent can be appropriately set depending on the optimum viscosity at the time of use.

本發明之聚合物係耐熱性高且加熱時之分解氣體少者,又,可形成極優異之塗膜,且對於有機溶劑、鹼之溶解速度亦快,故可適用於例如感光性樹脂組成物、各種塗佈劑、塗料等用途。 The polymer of the present invention has high heat resistance and a small amount of decomposition gas during heating, and can form an extremely excellent coating film, and has a fast dissolution rate with respect to an organic solvent or an alkali, and thus can be suitably used, for example, as a photosensitive resin composition. , various coating agents, coatings and other uses.

以下,藉由實施例詳細說明本發明,但本發明之範圍並不限定於該等實施例。其中,除非特別限定,「份」係指「重量份」。以下之實施例中,各種物性等係用以下方式測定。 Hereinafter, the present invention will be described in detail by way of examples, but the scope of the invention is not limited to the examples. Unless otherwise specified, "parts" means "parts by weight". In the following examples, various physical properties and the like were measured in the following manner.

<重量平均分子量> <weight average molecular weight>

以聚苯乙烯作為標準物質,並以THF(四氫呋喃)作為溶離液,以HLC-8220GPC(東曹公司製)測定重量平均分子量。 The weight average molecular weight was measured by using HLC-8220GPC (manufactured by Tosoh Corporation) using polystyrene as a standard material and THF (tetrahydrofuran) as a solution.

<酸價> <acid price>

精確秤量樹脂溶液3g,並溶解於丙酮70g/水30g混合溶劑,以瑞香草酚藍(thymol blue)作為指示劑,以0.1N KOH水溶液滴定,並由固體成分之濃度求出固體成分每1g之酸價。 Accurately weigh 3g of resin solution, dissolve it in 70g/water 30g mixed solvent, use thymol blue as indicator, titrate with 0.1N KOH aqueous solution, and determine the solid content per 1g from the concentration of solid component. Acid price.

實施例 Example

實施例1 Example 1

於作為反應槽之附冷卻管之可分離燒瓶加入丙二醇單甲基醚乙酸酯(PGMEA)100重量份,氮取代之後,升溫至90℃。另一方面,於滴下槽1將二甲基-2,2’-[氧雙(亞甲基雙)]-2-丙烯酸酯20.0份、丙烯酸25.0份、過氧-2-乙基己酸第三丁酯2.0份、PGMEA80份加以混合。又,於滴下槽2 將乙烯基甲苯(間-乙烯基甲苯以及對-乙烯基甲苯為60比40之混合物)55份、正十二基硫醇2.0份加以混合。一邊將反應溫度保持於90℃,一邊以4.0小時從滴下槽1及2以等速度滴下至反應槽。滴下結束後,保持於90℃30分鐘後,投入過氧-2-乙基己酸第三丁酯0.5份,再於90℃繼續反應30分鐘。之後,將反應溫度升溫至115℃,繼續反應1.5小時。一旦冷卻至室溫後,投入甲基丙烯酸縮水甘油酯19.7份、6-第三丁基-2,4-二甲苯酚0.10份、三乙胺0.30份,並將氧濃度調整至7%之氮、空氣混合氣體加以起泡同時升溫至110℃,並進行反應2小時。之後,升溫至115℃並使其反應5小時,再使反應結束,然後冷卻至室溫,獲得聚合物溶液1。 To a separable flask equipped with a cooling tube as a reaction vessel, 100 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) was added, and after nitrogen substitution, the temperature was raised to 90 °C. On the other hand, in the dropping tank 1, 20.0 parts of dimethyl-2,2'-[oxybis(methylenebis)]-2-acrylate, 25.0 parts of acrylic acid, and peroxy-2-ethylhexanoic acid were added. 2.0 parts of tributyl ester and 80 parts of PGMEA were mixed. Again, in the drop tank 2 55 parts of vinyl toluene (mixture of m-vinyltoluene and p-vinyltoluene of 60 to 40) and 2.0 parts of n-dodecylmercaptan were mixed. While maintaining the reaction temperature at 90 ° C, the mixture was dropped from the dropping tanks 1 and 2 at a constant rate to the reaction vessel at 4.0 hours. After completion of the dropwise addition, the mixture was kept at 90 ° C for 30 minutes, and then 0.5 part of perbutyl 2-ethylhexanoate was added, and the reaction was further continued at 90 ° C for 30 minutes. Thereafter, the reaction temperature was raised to 115 ° C, and the reaction was continued for 1.5 hours. Once cooled to room temperature, 19.7 parts of glycidyl methacrylate, 0.10 parts of 6-t-butyl-2,4-xylenol, 0.30 parts of triethylamine, and a nitrogen concentration of 7% were added. The air mixed gas was bubbled while raising the temperature to 110 ° C, and the reaction was carried out for 2 hours. Thereafter, the temperature was raised to 115 ° C and allowed to react for 5 hours, and the reaction was completed, followed by cooling to room temperature to obtain a polymer solution 1.

針對所得之聚合物溶液1測定各種物性,以標準物質為聚苯乙烯之GPC(凝膠滲透層析)所測得之重量平均分子量為16000,真空下以160℃乾燥所得之固體成分濃度為38.1%,由滴定法所求得之單位固體成分之酸價為100mgKOH/g。 The physical properties of the obtained polymer solution 1 were measured, and the weight average molecular weight measured by GPC (gel permeation chromatography) of the standard substance was polystyrene was 16,000, and the solid content concentration obtained by drying at 160 ° C under vacuum was 38.1. %, the acid value per unit solid content determined by the titration method was 100 mgKOH/g.

將100重量份之聚合物溶液1、30重量份之二季戊四醇五丙烯酸酯、3重量之作為光聚合起始劑之伊魯加居亞907(ciba-geigy公司製)、500重量份之PGMEA加以混合後,旋塗於玻璃基板上,於90℃乾燥3分鐘,形成膜厚3μm之塗膜1。 100 parts by weight of the polymer solution, 30 parts by weight of dipentaerythritol pentaacrylate, 3 parts by weight of Iruga Gaya 907 (manufactured by Ciba-geigy Co., Ltd.), and 500 parts by weight of PGMEA After mixing, it was spin-coated on a glass substrate, and dried at 90 ° C for 3 minutes to form a coating film 1 having a film thickness of 3 μm.

將塗膜1在20℃浸漬於PGMEA,以目視觀察膜到完全溶解為止之時間,到膜溶解為止之時間為15秒。以高壓水銀燈使塗膜1進行300mJ/cm2之UV曝光,再於200℃加熱30分鐘,使硬化結束。削下所得之硬化膜,以TG-DTA法(熱重量-示差熱分析法)所測定之以230℃保持30分鐘時之重量減少率為1.1%。所得之測定結果等示於表1。下述表1係表示實施例1~3、比較例1~3之聚合物成分之組成、聚合物溶液、塗膜、以及硬化膜之物性。 The coating film 1 was immersed in PGMEA at 20 ° C to visually observe the time until the film was completely dissolved, and the time until the film was dissolved was 15 seconds. The coating film 1 was subjected to UV exposure at 300 mJ/cm 2 with a high pressure mercury lamp, and then heated at 200 ° C for 30 minutes to complete the hardening. The obtained cured film was cut, and the weight reduction rate at 130 ° C for 30 minutes as measured by TG-DTA method (thermo-differential thermal analysis) was 1.1%. The measurement results obtained and the like are shown in Table 1. Table 1 below shows the compositions of the polymer components of Examples 1 to 3 and Comparative Examples 1 to 3, the physical properties of the polymer solution, the coating film, and the cured film.

實施例2 Example 2

如表1所示,使用N-芐基馬來醯亞胺取代二甲基-2,2’-[氧雙(亞甲基雙)]-2-丙烯酸酯,除此之外,係以與實施例1相同之操作進行來製作塗膜以及硬化膜,並測定物性等。 As shown in Table 1, N-benzyl maleimide was substituted for dimethyl-2,2'-[oxybis(methylenebis)]-2-acrylate, and In the same manner as in Example 1, a coating film and a cured film were produced, and physical properties and the like were measured.

塗膜溶解於PGMEA之時間為14秒。 The time during which the coating film was dissolved in PGMEA was 14 seconds.

又,硬化膜在230℃、30分鐘之重量減少率為0.6%。 Further, the cured film had a weight reduction rate of 0.6% at 230 ° C for 30 minutes.

實施例3 Example 3

於作為反應槽之附冷卻管之可分離燒瓶加入丙二醇單甲基醚乙酸酯(PGMEA)100重量份、丙二醇單甲基醚(PGME)50份,氮取代後,升溫至90℃。另一方面,於滴下槽1將N-芐基馬來醯亞胺15.0份、丙烯酸37.2份、過氧-2-乙基己酸第三丁酯2.0份、PGMEA56份、PGME24份加以混合。又,於滴下槽2將乙烯基甲苯(間-乙烯基甲苯以及對-乙烯基甲苯為60比40之混合物)47.8份、正十二基硫醇3.0份加以混合。一邊將反應溫度保持於90℃,一邊一邊以4.0小時從滴下槽1及2以等速度滴下至反應槽。滴下結束後,保持於90℃30分鐘後,投入過氧-2-乙基己酸第三丁酯0.5份,再於90℃繼續反應30分鐘。之後,將反應溫度升溫至115℃,繼續反應1.5小時。一旦冷卻至室溫後,投入甲基丙烯酸縮水甘油酯50.0份、6-第三丁基-2,4-二甲苯酚0.10份、三乙胺0.30份,並將氧濃度調整至7%之氮、空氣混合氣體加以起泡同時升溫至110℃,並進行反應16小時,以與實施例1相同之方式使反應結束,然後冷卻至室溫,獲得聚合物溶液。 To a separable flask equipped with a cooling tube as a reaction vessel, 100 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) and 50 parts of propylene glycol monomethyl ether (PGME) were added, and after nitrogen substitution, the temperature was raised to 90 °C. On the other hand, 15.0 parts of N-benzylmaleimide, 37.2 parts of acrylic acid, 2.0 parts of tert-butyl peroxy-2-ethylhexanoate, 56 parts of PGMEA, and 24 parts of PGME were mixed in the dropping tank 1. Further, 47.8 parts of vinyl toluene (mixture of m-vinyltoluene and p-vinyltoluene of 60 to 40) and 3.0 parts of n-dodecylmercaptan were mixed in the dropping tank 2. While maintaining the reaction temperature at 90 ° C, the mixture was dropped from the dropping tanks 1 and 2 at a constant rate to the reaction vessel at 4.0 hours. After completion of the dropwise addition, the mixture was kept at 90 ° C for 30 minutes, and then 0.5 part of perbutyl 2-ethylhexanoate was added, and the reaction was further continued at 90 ° C for 30 minutes. Thereafter, the reaction temperature was raised to 115 ° C, and the reaction was continued for 1.5 hours. After cooling to room temperature, 50.0 parts of glycidyl methacrylate, 0.10 parts of 6-t-butyl-2,4-xylenol, 0.30 parts of triethylamine, and a nitrogen concentration of 7% were adjusted. The air mixture was bubbled while raising the temperature to 110 ° C, and the reaction was carried out for 16 hours. The reaction was terminated in the same manner as in Example 1, and then cooled to room temperature to obtain a polymer solution.

所得之聚合物溶液之重量平均分子量為13000,固體成分濃度為36.1%,單位固體成分之酸價為80mgKOH/g。進行與實施例1相同之調配,形成塗膜,到膜溶解於PGMEA為止之時間為16秒。 The obtained polymer solution had a weight average molecular weight of 13,000, a solid content concentration of 36.1%, and an acid value per unit solid content of 80 mgKOH/g. The same preparation as in Example 1 was carried out to form a coating film, and the time until the film was dissolved in PGMEA was 16 seconds.

又,硬化膜以TG-DTA法所測定之以230℃保持30分鐘時之重量減少率為0.6%。 Further, the cured film was reduced in weight by 0.6% at 230 ° C for 30 minutes as measured by the TG-DTA method.

又,以UV曝光裝置(Topcon公司製TME-150RNS),透過線寬15μm之線與間隔光罩(line & space mask),將塗膜曝光50mJ/cm2之UV光,並於90℃乾燥3分鐘後,用史賓顯影機(actes公司製ADE-3000S),以0.01之KOH水溶液進行20秒顯影。圖1係表示將曝光後之塗膜鹼顯影後之玻璃基板狀態。 Further, the coating film was exposed to UV light of 50 mJ/cm 2 through a UV exposure apparatus (TME-150 RNS manufactured by Topcon Co., Ltd.) through a line having a line width of 15 μm and a line & space mask, and dried at 90 ° C. After a minute, development was carried out for 20 seconds with a 0.01 KOH aqueous solution using a Spiegel developing machine (ADE-3000S manufactured by Actes Co., Ltd.). Fig. 1 is a view showing the state of a glass substrate obtained by alkali-developing a coating film after exposure.

圖1中,位於上部之格子狀部分(矩形圖案)為透過光罩所曝光之曝光部,其周圍為光罩所保護之未曝光部。如圖1所示,於曝光部因塗膜硬化而形成有完整之圖案,未曝光部則塗膜溶解,確認不到溶解剩下之殘渣。 In Fig. 1, the lattice portion (rectangular pattern) located at the upper portion is an exposed portion exposed through the reticle, and the periphery thereof is an unexposed portion protected by the reticle. As shown in Fig. 1, a complete pattern was formed in the exposed portion due to curing of the coating film, and the coating film was dissolved in the unexposed portion, and it was confirmed that the remaining residue was not dissolved.

又,即使將和上述相同之步驟中顯影時間定為30秒來進行,亦沒有圖案缺陷。 Further, even if the development time in the same step as described above was carried out for 30 seconds, there was no pattern defect.

比較例1 Comparative example 1

如表1所示,使用甲基丙烯酸芐酯取代乙烯基甲苯,除此之外,係進行與實施例1相同之操作。塗膜之溶解時間為10秒,於230℃,30分鐘之重量減少率為3.5%。 The same operation as in Example 1 was carried out, except that benzyl methacrylate was used in place of vinyltoluene as shown in Table 1. The dissolution time of the coating film was 10 seconds, and the weight reduction rate at 230 ° C for 30 minutes was 3.5%.

比較例2 Comparative example 2

如表1所示,使用苯乙烯取代乙烯基甲苯,除此之外,係進行與實施例1相同之操作。塗膜之溶解時間為24秒,較實施例1慢。又,於230℃,加熱30分鐘之重量減少率為1.4%。 The same operation as in Example 1 was carried out, except that styrene was used instead of vinyltoluene as shown in Table 1. The dissolution time of the coating film was 24 seconds, which was slower than that of Example 1. Further, the weight reduction rate at 230 ° C for 30 minutes was 1.4%.

比較例3 Comparative example 3

如表1所示,使用苯乙烯取代乙烯基甲苯,除此之外,係進行與實施例3相同之操作。塗膜溶解至PGMEA之溶解時間為30秒,較實施例3 長。 The same operation as in Example 3 was carried out, except that styrene was used instead of vinyltoluene as shown in Table 1. The dissolution time of the coating film dissolved into PGMEA was 30 seconds, compared with Example 3. long.

硬化膜在230℃保持30分鐘之重量減少率為1.1%。 The weight reduction rate of the cured film at 230 ° C for 30 minutes was 1.1%.

與實施例3相同之條件下進行鹼顯影。圖2係表示將曝光後之塗膜鹼顯影後之玻璃基板狀態,係與圖1相同,形成了曝光部與未曝光部。如圖2所示,曝光部雖形成有圖案。未曝光部則塗膜溶解不完,而確認到溶解剩下之顯影殘渣。 Alkali development was carried out under the same conditions as in Example 3. Fig. 2 is a view showing a state of a glass substrate obtained by alkali-developing a coating film after exposure, and is formed in the same manner as in Fig. 1 to form an exposed portion and an unexposed portion. As shown in FIG. 2, the exposure portion is formed with a pattern. In the unexposed portion, the coating film was not dissolved, and it was confirmed that the remaining development residue was dissolved.

又,若於與上述相同之步驟中將顯影時間定為30秒,則未曝光部之殘渣消失,但於圖案的一部份見到缺陷。由上可知,苯乙烯與乙烯基甲苯相比,顯影時間之容許幅度,亦即顯影界限非常狹窄,且鹼顯影性差。 Further, if the development time was set to 30 seconds in the same procedure as described above, the residue of the unexposed portion disappeared, but defects were observed in a part of the pattern. From the above, it is known that the allowable range of development time, that is, the development limit of styrene and vinyl toluene is very narrow, and the alkali developability is poor.

由上述之實施例以及比較例可知,本發明之聚合物重量減少率小且耐熱分解性優異,同時溶劑溶解性、鹼顯影性亦優異。 As is apparent from the above examples and comparative examples, the polymer of the present invention has a small weight reduction rate and is excellent in thermal decomposition resistance, and is also excellent in solvent solubility and alkali developability.

本發明之聚合物本質的技術特徵在於:就形成其之單體成分來說,使用於聚合物中會具有環結構之單體以及具有酸基之單體之外,係使用乙烯基甲苯。 The technical essence of the polymer of the present invention is that vinyltoluene is used in addition to the monomer having a ring structure and the monomer having an acid group in the monomer component formed.

本發明之特徵之一係:N取代馬來醯亞胺單體及/或上述通式(1)所表示之醚二聚物系單體會形成環結構,並藉由此種結構而展現聚合物之耐熱性。由上述之該等化學結構可明瞭:上述實施例中所使用之單體係上述單體群之一例,只要是稱為N取代馬來醯亞胺單體以及/或醚二聚物系單體之範疇的單體即可展現本發明效果。 One of the features of the present invention is that the N-substituted maleimide monomer and/or the ether dimer monomer represented by the above formula (1) form a ring structure and exhibits polymerization by such a structure. The heat resistance of the object. It is clear from the above chemical structures that one of the above-mentioned monomer groups of the single system used in the above examples is only referred to as an N-substituted maleimide monomer and/or an ether dimer monomer. The monomer of the category can exhibit the effects of the present invention.

又,就形成聚合物之單體成分來說,係藉由使用上述3成分而可使結構中實質上不具有酯鍵結,因此,耐熱性便提高。本發明本質之特徴在於:在苯乙烯、乙烯基甲苯等不具有酯鍵結之單體中,使用乙烯基甲苯,此可由上述實施例、比較例證明。 Further, in the case where the monomer component of the polymer is formed, since the above-described three components are used, the structure can be substantially free of ester bonds, and therefore heat resistance is improved. The essence of the present invention is that vinyltoluene is used in a monomer having no ester bond such as styrene or vinyl toluene, which can be exemplified by the above examples and comparative examples.

此外,上述實施例中亦證明了上述3成分之比例若在本說明書中所記載之較佳範圍內則本發明可達到有利之效果。 Further, in the above embodiment, it has been confirmed that the ratio of the above three components can achieve an advantageous effect if it is within the preferred range described in the present specification.

(產業利用性) (industrial use)

本發明之聚合物係有用於作為液晶顯示器、印刷配線基板等感光性樹脂組成物之黏結劑高分子、熱硬化性樹脂、各種塗佈材料。 The polymer of the present invention is a binder polymer, a thermosetting resin, and various coating materials used as a photosensitive resin composition such as a liquid crystal display or a printed wiring board.

本申請案係以2007年7月18日於日本所申請之日本專利申請第2007-186577號「新穎聚合物」作為基礎,主張優先權。該申請之內容係全部援用於本申請案中作為參考。 The present application claims priority based on Japanese Patent Application No. 2007-186577, "New Polymer", filed on Jan. 18, 2007. The contents of this application are hereby incorporated by reference in its entirety.

Claims (5)

一種聚合物,其特徵在於:係以(a)於總單體成分中為2~60質量%之以烷基或芳香族基取代的N取代馬來醯亞胺單體、(b)於總單體成分中為5~80質量%之乙烯基甲苯、以及(c)於總單體成分中為5~40質量%之(甲基)丙烯酸作為必須成分共聚合而成者,總單體成份中之(甲基)丙烯酸酯之含有比例為聚合物中20質量%以下。 A polymer characterized by (a) 2 to 60% by mass of an N-substituted maleimide monomer substituted with an alkyl group or an aromatic group in the total monomer component, and (b) total 5 to 80% by mass of vinyl toluene in the monomer component, and (c) 5 to 40% by mass of (meth)acrylic acid as a necessary component in the total monomer component, total monomer component The content ratio of the (meth) acrylate in the polymer is 20% by mass or less based on the polymer. 如申請專利範圍第1項之聚合物,其進一步於側鏈含有聚合性雙鍵。 The polymer of claim 1, further comprising a polymerizable double bond in the side chain. 如申請專利範圍第1或2項之聚合物,其中,N取代馬來醯亞胺單體係選自N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、以及N-芐基馬來醯亞胺所構成群中之至少一種。 The polymer of claim 1 or 2, wherein the N-substituted maleimide monosystem is selected from the group consisting of N-phenylmaleimide, N-cyclohexylmaleimide, and N- At least one of the group consisting of benzyl maleimide. 如申請專利範圍第1或2項之聚合物,其中,(c)(甲基)丙烯酸係丙烯酸。 A polymer according to claim 1 or 2, wherein (c) (meth)acrylic acrylic acid. 如申請專利範圍第2項之聚合物,其雙鍵當量為500~3000。 For example, the polymer of the second application of the patent scope has a double bond equivalent of 500 to 3,000.
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