TWI542278B - Display device - Google Patents

Description

Display device

The present invention relates to a display device, and more particularly to a display device having an electrostatic protection mechanism.

Electromagnetic interference (EMI) and Electrostatic discharge (ESD) often damage components in the display device and even cause the display device to malfunction. To this end, a display mechanism is provided with a protective mechanism for reducing electrostatic discharge. For example, one of the protection mechanisms allows the bottom case to directly abut the ground contact on the flexible circuit board of the display panel when the display panel of the display device is assembled with the bottom case to achieve a gap between the bottom case and the ground contact. Electrically conductive.

However, when the display panel is assembled to the bottom case, if the rebound force of the ground pad of the flexible circuit board is too large, deformation of the outside of the display device may occur, thereby causing defects such as light leakage of the display panel. In addition, since the rebound force of the ground pad of the flexible circuit board is too large, the bottom case cannot be tightly assembled with the display panel, which will result in poor physical contact between the bottom case and the ground contact, thereby reducing the bottom case and the bottom case. Electrical continuity between ground contacts.

It can be seen that the above display device still has inconveniences and defects, and needs to be further improved. Therefore, how can we effectively solve the above inconvenience Defects are one of the most important research and development topics at present, and it has become an urgent target for improvement in related fields.

In view of the above, it is an object of the present invention to provide a display device for solving the inconveniences and drawbacks mentioned in the prior art.

In order to achieve the above object, in accordance with an embodiment of the present invention, the display device includes a display panel, a circuit substrate, and a conductive shell. The circuit substrate is electrically connected to the display panel, and the circuit substrate has a ground pad and a cutting slit. The ground pad is located on the circuit substrate. The slit is penetrated through the ground pad and the circuit substrate, and the slit is defined on the ground pad to define a plurality of contacts. The conductive case has a projection that presses the cutting slit and bends the contact portions such that the bent contact portion is attached to the projection.

Therefore, since the circuit substrate and the ground pad of the display device of the present invention are provided with a slit, when the conductive shell and the display panel are assembled with each other, so that the protruding portion presses the ground pad toward the cutting slit, the circuit substrate and the ground pad can be reduced relative to each other. The resilience generated by the oppression of the outlet further reduces the chance of light leakage from the display panel. In addition, since the bent contact portion is attached to the surface of the protruding portion in a conformable manner, the grounding pad can be stably positioned on the protruding portion without being easily separated from the protruding portion.

In one or more embodiments of the present invention, when the number of the slits is plural, the slits intersect each other. The positions at which the slits intersect each other are aligned with one of the projections.

In one or more embodiments of the invention, the number of these contacts It is 2*N, and the protrusion includes a plurality of contact faces, and the number of these contact faces is 2*N, where N is a positive integer.

In one or more embodiments of the present invention, when the number of the slits is plural, the slits intersect each other. The projection has a half sphere and includes a single contact surface, wherein the positions at which the slits are staggered are aligned with one of the arc vertices of the hemisphere.

In one or more embodiments of the invention, the projections pass through the cutting seam.

In one or more embodiments of the invention, the projections do not pass through the slit.

In one or more embodiments of the invention, the ground pad further has a consistent aperture. The through hole is located on the cutting seam, the cutting seam is closed, and one of the projections is aligned.

In one or more embodiments of the present invention, the protrusion is at least one of a cylinder, a pyramid, a frustum and a half sphere.

In one or more embodiments of the present invention, the presentation pattern of the slit is "one", "ten", "X", "*", "m" or "Y". Font type.

In one or more embodiments of the present invention, the display device further includes a front frame. The front frame has a recess. The ground pad is located between the conductive shell and the front frame, and the protruding portion and the contact portion protrude into the recess.

In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the above technical solutions, considerable technological progress can be achieved, and industrially widely used value, which has at least The following advantages: 1. Improve the assembly convenience of the display device, thereby reducing the assembly time of the display device; 2. Increasing the contact area of the conductive shell and the ground pad, thereby reducing the conduction resistance of the conductive shell and the ground pad and improving the conductive shell and grounding The conduction performance of the pad; and 3. Improve the positioning of the conductive shell and the ground pad, thereby reducing the chance of the ground pad being separated from the protrusion.

The above description will be described in detail in the following embodiments, and further explanation of the technical solutions of the present invention will be provided.

100, 101, 102‧‧‧ display devices

110‧‧‧ display panel

120‧‧‧ circuit board

130, 230, 330, 430, 530, 630, 730‧‧‧ grounding pads

131, 231, 331, 431, 531, 631, 731‧‧‧ cutting seams

132, 232, 332, 432, 532, 632, 732 ‧ ‧ contact

733‧‧‧Tongkong

140‧‧‧ Conductive shell

150, 250, 350, 450, 550, 650, 750 ‧ ‧ projections

151, 251, 351, 451, 551, 651, 751 ‧ ‧ contact surface

152, 252, 352, 452, 552, 652, 752 ‧ ‧ extremely convex

253‧‧‧through road

160, 260‧‧‧ front box

161, ‧ ‧ ‧ recessed

A‧‧‧ curve

B‧‧‧ Curve

A1~A3, B1~B3‧‧‧

M1, M2‧‧‧ local

A-A‧‧‧ hatching

1 is an exploded view of a display device in accordance with a first embodiment of the present invention.

Fig. 2 is a partial cross-sectional view showing the portion M1 of Fig. 1 after assembly.

Fig. 3 is a front elevational view showing the projection of Fig. 1.

4A is a front elevational view of a ground pad in accordance with a second embodiment of the present invention.

Fig. 4B is a front elevational view showing the projection according to the second embodiment of the present invention.

FIG. 4C is a cross-sectional view along line AA of FIG. 4B.

Figure 5A is a front elevational view of a ground pad in accordance with a third embodiment of the present invention.

Fig. 5B is a front elevational view showing the projection according to the third embodiment of the present invention.

Figure 5C shows a side view of Figure 5B.

6A is a front elevational view of a ground pad in accordance with a fourth embodiment of the present invention.

Fig. 6B is a front elevational view showing the projection according to the fourth embodiment of the present invention.

Fig. 7A is a front elevational view showing a ground pad according to a fifth embodiment of the present invention.

Fig. 7B is a front elevational view showing the projection according to the fifth embodiment of the present invention.

8A is a front elevational view of a ground pad in accordance with a sixth embodiment of the present invention.

Fig. 8B is a side view showing the projection according to the sixth embodiment of the present invention.

Figure 9 is a front elevational view of a ground pad in accordance with a seventh embodiment of the present invention.

10A is an exploded view of a display device in accordance with an eighth embodiment of the present invention.

FIG. 10B is a partial cross-sectional view showing the portion M2 of FIG. 10A after assembly.

11 is a partial cross-sectional view showing a display device according to a ninth embodiment of the present invention, the cross-sectional position of which is the same as that of FIG. 10B.

FIG. 12 is a graph showing the rebound force test data of the ground pad of the display device according to the first embodiment of the present invention and the ground pad of the conventional display device.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

First embodiment

1 is an exploded view of a display device 100 in accordance with a first embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing the assembled portion M1 of the display device 100 of FIG. 1 . As shown in FIG. 1 and FIG. 2 , the display device 100 includes a display panel 110 , a circuit substrate 120 , a grounding pad 130 , and a conductive shell 140 . The conductive shell 140 has a projection 150. The ground pad 130 is located on the circuit substrate 120. The circuit substrate 120 is electrically connected to the display panel 110. At least one cutting slit 131 is formed on the circuit substrate 120 and the ground pad 130. The cutting slit 131 penetrates the ground pad 130 and the circuit substrate 120 at the same time, and the cutting slit 131 defines a plurality of contact portions 132 on the ground pad 130.

As such, when the conductive case 140 is assembled on the circuit substrate 120 and the protruding portion 150 presses the ground pad 130 toward the cutting slit 131, the protruding portion 150 The cutting slits 131 are opened and the contact portions 132 are bent, so that the contact portions 132 are attached to the surface of the protruding portion 150 in a conforming manner, thereby reducing the rebound caused by the pressing of the circuit substrate 120 and the grounding pad 130 relative to the protruding portion 150. The force reduces the chance of light leakage of the display panel 110 due to deformation of the exterior of the display device 100.

As shown in FIG. 1 and FIG. 2 , the protruding portion 150 is disposed on one surface of the conductive shell 140 facing the circuit substrate 120 , and the protruding portion 150 is disposed corresponding to the ground pad 130 , and the protruding portion 150 is electrically connected to the conductive shell 140 . As such, when assembled, the protrusion 150 directly contacts the pressure ground pad 130 such that the charge of the ground pad 130 is guided to the conductive case 140 via the protrusion 150. Specifically, the conductive shell 140 is a metal shell. The projection 150 is a convex hull formed by stamping the conductive shell 140, that is, the convex hull is integrally formed on the conductive shell 140. However, the present invention is not limited thereto, and the protruding portion may also be a detachable object assembled to the conductive shell, such as a metal stud or the like, or the conductive shell and the protruding portion may also be products processed through the plating.

Figure 3 is a front elevational view of the projection 150 of Figure 1. 2 and 3, in the first embodiment, the projection 150 is a frustum, for example, a quadrangular frustum. However, the present invention is not limited to the number of corners. The protrusion 150 includes a plurality of contact faces 151 that are arranged obliquely around and electrically connected to the conductive case 140. During assembly, when the protruding portion 150 touches the ground pad 130, and then presses the cutting slit 131 and bends the contact portion 132, the bent contact portion 132 contacts the contact surface 151 of the protruding portion 150, respectively, so that the charge of the ground pad 130 is via These contact faces 151 are guided onto the conductive shell 140. Since the bent contact portion 132 directly attaches to the contact surface The surface of the 151 can increase the contact area between the conductive shell 140 and the ground pad 130, thereby improving the electrical conduction performance of the conductive shell 140 and the ground pad 130. In addition, since the contact portions 132 after the bending are respectively attached to the contact surfaces 151 in accordance with the inclination of the surface of the contact surface 151 of the protruding portion 150, the positioning of the conductive shell 140 and the grounding pad 130 can be further improved, thereby helping to reduce The opportunity for the ground pad 130 to disengage from the projection 150.

In the first embodiment, as in Fig. 2, the number of the slits 131 is two (Fig. 1), and the slits 131 intersect with each other, and the positions at which the slits 131 intersect each other are aligned with one pole of the projection 150. Convex 152. The pole protrusion 152 is not limited to a top surface, a line side or a vertex. In the first embodiment, the pole protrusion 152 is a top surface. The top surface simultaneously connects all of the contact faces 151 of the projections 150. Thus, when assembled, since the pole projections 152 of the projections 150 align with the positions where the slits 131 intersect each other, it is more helpful that the projections 150 are pressed into the slits 131 at positions where the slits 131 intersect each other so that Make the assembly process more labor-saving and smooth.

As shown in FIG. 2, when the protruding portion 150 touches the ground pad 130, the convex portion 152 of the protruding portion 150 is located in the cutting slit 131, and is kept away from the ground pad 130, that is, the convex portion 152 of the protruding portion 150 is 152. Does not touch the ground pad 130. At this time, the projection 150 does not pass through the slit 131, that is, the pole projection 152 of the projection 150 does not protrude from the circuit board 120 facing away from one side of the conductive shell 140. In this manner, since the protruding portion 152 of the protruding portion 150 does not protrude from the circuit board 120 facing away from one side of the ground pad 130, the electronic component disposed corresponding to the circuit substrate 120 facing away from one side of the conductive shell 140 does not need to be a bit design. It helps to simplify the design and the overall thickness of the display device.

Further, as shown in FIGS. 1 and 3, if the number of the slits 131 is N, the number of the contact portions 132 of the ground pad 130 is 2*N (FIG. 1), and the contact faces of the projections 150 are The number of 151 is 2*N (Fig. 3), where N is a positive integer. Taking the present embodiment as an example, the presentation pattern of the slit 131 is a "ten" shape, that is, the number of the slits 131 is two, the number of the contact portions 132 is four, and the number of the contact faces 151 is four. Thus, referring to FIG. 2, since the contact portions 132 are in contact with the contact faces 151 one by one, it means that there is no gap between the protruding portion 150 and the ground pad 130, and the circuit substrate 120 and the conductive shell 140 can be further reduced. The distance between them further helps to reduce the overall thickness of the display device.

However, the present invention is not limited to the number of the slits 131, the intersection of the slits 131, the shape of the projections 150, and the number of the contact faces 151, and the present invention is not limited to the number of the slits 131 to be in contact with the projections 150. The number of 151 is the same, and the shape of the projection 150 is not necessarily matched to the shape formed by the slit 131 in the ground pad 130. The implementation changes will be exemplified below. In addition, although the number of the contact portions 132 of the ground pad 130 of the present embodiment is the same as the number of the contact faces 151 of the protruding portion 150, the present invention is not limited to the number of the contact slits 131 that must be in contact with the protruding portion 150. The number of 151 is the same. For example, the presentation pattern of the slit can also be a "Y" shape (not shown), that is, the number of the slits is three, and the protrusion can be a hemisphere, that is, the contact surface of the protrusion is a spherical surface.

Second embodiment

4A is a front view of the ground pad 230 according to the second embodiment of the present invention. Figure. 4B is a front elevational view of the projection 250 in accordance with the second embodiment of the present invention. As shown in FIGS. 4A and 4B, the display device of the second embodiment is substantially the same as the display device of the first embodiment, and the difference is that the presentation pattern of the slit 231 is "one", that is, The number of the slits 231 is only one. The slit 231 is linearly formed on the ground pad 230 and the circuit substrate 120 such that the number of the contact portions 232 of the ground pad 230 is two (2*1). The number of contact faces 251 of the projections 250 is two (2*1). In the second embodiment, the pole protrusion 252 is a line edge which is the intersection of the two contact faces 251 of the protrusion 250. Therefore, when the assembly, the position of the single cutting slit 231 is aligned with the convex portion 252 of the protruding portion 250, and the contact portion 232 of the grounding pad 230 is further adhered to the two contact surfaces 251 of the protruding portion 250, so that The assembly process is more labor-saving and smooth.

FIG. 4C is a cross-sectional view along line AA of FIG. 4B. As shown in FIG. 4C, when the protrusion 250 of the second embodiment is fabricated, only an object having an inverted V-shaped cross section is punched out to the conductive case 140, so that the two contact faces 251 of the protrusion 250 are There is a channel 253 in between.

Third embodiment

FIG. 5A is a front elevational view of the ground pad 330 in accordance with the third embodiment of the present invention. FIG. 5B is a front elevational view of the projection 350 according to the third embodiment of the present invention. Figure 5C shows a side view of Figure 5B. As shown in FIGS. 5A and 5B, the display device of the third embodiment is substantially the same as the display device of the first embodiment, and the difference is that the presentation pattern of the slit 331 is "X"-shaped, that is, cutting. The number of slits 331 is two, making the grounding pad The number of contact portions 332 of 330 is four (2*2). The projection 350 is a pyramid, for example, a quadrangular pyramid, however, the invention is not limited to the number of corners. The number of contact faces 351 of the projections 350 is four (2*2). In the third embodiment, the pole projection 352 is a pointed apex. The pointed apex is the intersection of the four contact faces 351 of the projections 350. Thus, as shown in FIGS. 5A and 5C, when assembled, whether or not the convex portion 352 of the projection 350 is aligned with the position at which the two slits 331 intersect each other, due to the convex portion 352 of the projection 350. For the tip point, the projections 350 can smoothly extend into the cutting slit 331 to make the assembly process more labor-saving and smooth.

Fourth embodiment

6A is a front elevational view of a ground pad 430 in accordance with a fourth embodiment of the present invention. FIG. 6B is a front elevational view of the projection 450 according to the fourth embodiment of the present invention. As shown in FIGS. 6A and 6B, the display device of the fourth embodiment is substantially the same as the display device of the first embodiment, and the difference is that the presentation pattern of the slit 431 is "*", that is, cutting. The number of the slits 431 is three, so that the number of the contact portions 432 of the ground pad 430 is six (2*3). The projection 450 is a pyramid, for example, a hexagonal pyramid, however, the invention is not limited to the number of corners. The number of contact faces 451 of the projections 450 is six (2*3). In the fourth embodiment, the pole convex portion 452 is a pointed apex. The pointed apex is the intersection of the six contact faces 451 of the projection 450. Thus, when assembled, the projection 45 has more contact faces 451 to contact the contact portion 432 of the ground pad 430 than the quadrangular pyramid; and, since the pole projection 452 of the hexagonal pyramid is less sharp, the hexagonal pyramid Extremely convex 452 will not hurt The circuit board 120 faces away from the components disposed on one side of the ground pad 430.

Fifth embodiment

FIG. 7A is a front elevational view of a ground pad 530 in accordance with a fifth embodiment of the present invention. Fig. 7B is a front elevational view showing the projection 550 according to the fifth embodiment of the present invention. As shown in FIGS. 7A and 7B, the display device of the fifth embodiment is substantially the same as the display device of the first embodiment, and the difference is that the presentation pattern of the slit 531 is "m", that is, cutting. The number of slits 531 is four, so that the number of contact portions 532 of the ground pad 530 is eight (2*8). The projection 550 is a pyramid, for example, an octagonal pyramid, however, the invention is not limited to the number of corners. In the fifth embodiment, the number of contact faces 551 of the projections 550 is eight (2*4). The pole convex portion 552 is a pointed apex. The pointed apex is the intersection of the eight contact faces 551 of the projection 550. Since the advantages of the fifth embodiment are similar to those of the fourth embodiment, they are not described herein again.

Sixth embodiment

8A is a front elevational view of a ground pad 630 in accordance with a sixth embodiment of the present invention. Figure 8B is a side elevational view of the projection 650 in accordance with a sixth embodiment of the present invention. As shown in FIGS. 8A and 8B, the display device of the sixth embodiment is substantially the same as the display device of the first embodiment, and the difference is that the number of the slits 631 is more than four (eg, six). The number of contact portions 632 of the ground pad 630 is made greater than eight (e.g., twelve). The projection 650 is a hemisphere. The contact surface 651 of the projection 650 is a spherical surface.

In the sixth embodiment, the pole convex portion 152 of the hemisphere is an arc apex. Thus, when assembled, the projections 650 need not only align with the positions where the cutting slits 631 intersect each other, but the spherical surface of the projections 650 can contact all the contact portions 632 of the grounding pad 630; Since the very convex portion 652 of the hemisphere is not sharp, the components of the circuit substrate 120 facing away from one side of the ground pad 630 are not damaged.

Seventh embodiment

Figure 9 is a front elevational view of a ground pad 730 in accordance with a seventh embodiment of the present invention. As shown in FIGS. 9 and 2, the display device of the seventh embodiment is substantially the same as the display device of the first embodiment, and the difference is that the ground pad 730 has a uniform hole 733, and the through hole 733 is located at the slit 731. Upper, the through hole 733 is connected to the cutting slit 731, and the through hole 733 is aligned with the convex portion 152 of the projection 150. More specifically, the through hole 733 is located, for example, at a position where the cutting slits 731 intersect each other, and the diameter of the through hole 733 is smaller than the maximum sectional area of the protruding portion 150. As such, when the protrusion 150 touches the ground pad 730, the protrusion 150 can still bend the contact portion 732 of the ground pad 730 such that the contact portion 732 of the ground pad 730 can still contact the contact surface 151 of the protrusion 150.

In addition, when the protruding portion 150 touches the ground pad 730, the pole protrusion 152 of the protruding portion 150 is exposed from the through hole 733 to one side of the circuit substrate 120 facing away from the ground pad 730. It should be understood that the shape of the protrusion of the seventh embodiment is not limited to a cylinder, a pyramid, a frustum and a hemisphere.

Eighth embodiment

FIG. 10A is an exploded view of the display device 100 according to the eighth embodiment of the present invention. FIG. 10B is a partial cross-sectional view showing a portion M2 of FIG. 10A. As shown in FIGS. 10A and 10B, the display device 101 of the eighth embodiment is substantially the same as the display device of the first embodiment, and the difference is that the display device 100 of the eighth embodiment further includes a front frame 160. The circuit substrate 120 (including the ground pad 130) is located between the conductive shell 140 and the front frame 160. Specifically, after the front frame 160 and the conductive case 140 are assembled to each other, the display panel 110 and the circuit substrate 120 are fixed between the front frame 160 and the conductive case 140. One of the front frame 160 facing the circuit substrate 120 has a recess 161 corresponding to the ground pad 130 and the protrusion 150. As such, when the protruding portion 150 touches the ground pad 130 during assembly, the protruding portion 150 and the contact portion 132 protrude into the recess portion 161. Since the depressed portion 161 accommodates the protruding portion 150 and the contact portion 132, the overall thickness of the display device 100 is not increased.

Ninth embodiment

11 is a partial cross-sectional view showing a display device 102 according to a ninth embodiment of the present invention, the cross-sectional position of which is the same as that of FIG. 10B. As shown in FIG. 11, the display device 102 of the ninth embodiment is substantially the same as the display device of the eighth embodiment, and the difference is that the protruding portion 750 of the ninth embodiment passes through the slit 131, that is, convex The pole protrusion 752 of the outlet portion 750 has protruded from the circuit substrate 120 facing away from one side of the conductive shell 140.

In view of the high cost of forming the projections on the conductive shell by the stamping process, a person having ordinary knowledge in the art to which the present invention pertains can simply select a metal stud as the above-mentioned projection 750. By the protrusion 750 The metal stud is fixed on the conductive shell 140 such that the protruding portion 750 (ie, the metal stud) is electrically connected to the conductive shell 140, and when the protruding portion 750 touches the grounding pad 130, the protruding portion 750 can be The contact portion 132 of the ground pad 130 is bent such that the contact portion 132 of the ground pad 130 contacts the contact surface 751 of the projection 750 (ie, the metal stud) (ie, the circumferential surface of the stud). Since the front frame 260 has a recessed portion 261 facing one surface of the circuit substrate 120, even if the protruding portion 750 (ie, the metal stud) passes through the cutting slit 131 and passes through the circuit substrate 120, the recessed portion 261 can still receive the end of the metal stud. .

FIG. 12 is a graph showing the rebound force test data of the ground pad of the display device according to the first embodiment of the present invention and the ground pad of the conventional display device. As can be seen from Fig. 12, the curve A is a change in the rebound force feedback of a conventional circuit substrate after being tested. The ground pad of the conventional circuit substrate does not have a slit. Curve B is a change in the rebound force fed back by the circuit substrate of the first embodiment after being tested.

When the conventional circuit substrate and the circuit substrate of the first embodiment are respectively pressed (ie, the amount of interference) is 1.0 mm (mm), see point A1 and point B1 of FIG. 12, and the feedback of the conventional circuit substrate is tested. The rebound force is 1.073 kg force (kgf); in contrast, the rebound force fed back by the circuit substrate of the first embodiment is almost 0 kg force (kgf). When each circuit board is pressed down (ie, the amount of interference) is 2.2 mm (mm), see point A2 and point B2 of Fig. 12. The feedback force of the conventional circuit board is 3.7 kg force (kgf). In contrast, the rebound force fed back by the circuit substrate of the first embodiment after being tested is 0.3 kg force (kgf). When the conventional circuit substrate is pressed (ie, the amount of interference) is 2.9 mm (mm), see point A3 of Figure 12, The conventional circuit substrate is under pressure and has been peeled off from its adhesive layer, and the rebound force fed back after the test is 5.3 kg force (kgf); on the other hand, when the circuit substrate of the first embodiment is pressed (ie, the amount of interference) After 3.0 mm (mm), see point B3 of Fig. 12, the circuit substrate of the first embodiment is unbearably depressed, has been peeled off from its adhesive layer, and the rebound force fed back after the test is 0.7 kg force (kgf). .

Thus, by referring to FIG. 12, it can be seen that the rebounding force fed back by the circuit substrate of the first embodiment is much smaller than that of the conventional circuit substrate after being tested, compared to the conventional circuit substrate without the slit. The repulsive force, which represents the cutting slit formed on the grounding pad, can reduce the repulsive force generated by the pressing of the grounding pad of the circuit substrate relative to the protruding portion, and reduce the chance of light leakage of the display panel due to deformation of the external portion of the display device.

In addition, when a person assembles a conventional display device and performs impedance test on a ground pad of a conventional circuit device of one of the conventional display devices, since the ground pad of the conventional circuit substrate does not have a slit, the obtained The impedance value is 0.5 ohms. On the other hand, when the person assembles the display device of the first embodiment and performs impedance test on the ground pad of the circuit substrate of the first embodiment, the impedance value obtained is 0.32 ohm. Therefore, compared with the conventional circuit substrate in which the ground pad does not have a slit, the display device of the present invention has a grounding pad of a slit to provide a lower impedance value, thereby improving the conduction performance of the conductive shell and the ground pad.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧ display device

110‧‧‧ display panel

120‧‧‧ circuit board

130‧‧‧Grounding mat

131‧‧‧cutting seam

132‧‧‧Contacts

140‧‧‧ Conductive shell

150‧‧‧protrusion

M1‧‧‧ partial

Claims (9)

A display device includes: a display panel; a circuit substrate electrically connected to the display panel, the circuit substrate having a ground pad and at least one cutting slit, the ground pad is located on the circuit substrate, and the at least one cutting slit runs through the a ground pad and the circuit substrate, and defining a plurality of contact portions on the ground pad; and a conductive shell having a protrusion that presses the slits and bends the contacts, and the bends The rear contact portion is attached to the protruding portion, wherein when the number of the slits is plural, the cutting slits intersect each other, wherein the positions at which the cutting slits intersect each other are aligned with one of the projections. The display device of claim 1, wherein the number of the slits is N, the number of the contacts is 2*N, and the protrusions comprise a plurality of contact faces, the number of the contact faces being 2* N, where N is a positive integer. The display device of claim 1, wherein the protrusion has a half sphere and comprises a single contact surface, the pole protrusion of the protrusion being an arc vertex of the hemisphere, wherein the cutting seams are mutually The staggered position aligns the arc apex of the hemisphere. The display device of claim 1, wherein the projection passes through the slit. The display device of claim 1, wherein the protrusion does not pass through the cutting Seam. The display device of claim 1, wherein the ground pad further has a uniform hole, the through hole is located on the cutting slit, the cutting slit is turned on, and the pole convex portion of the protruding portion is aligned. The display device of claim 1, wherein the protrusion is a cylinder, a pyramid, a frustum or a half sphere. The display device according to claim 1, wherein the at least one slit has a presentation pattern of "one", "ten", "X", "*", "Y" or "M" type. The display device of claim 1, further comprising: a front frame having a recessed portion, wherein the ground pad is located between the conductive shell and the front frame, and the protruding portion and the contact portions extend into the Inside the depression.