TWI538292B - Signal coupler and signal transmission conductive structure included therein - Google Patents

Description

Signal coupler and signal transmission wire layer structure therein

The present invention relates to a signal coupler and a signal transmission wire layer structure thereof, and more particularly to a signal coupler applicable to a high frequency microwave circuit and a signal transmission wire layer structure therein.

With the evolution of the communication era, high-frequency microwave circuits have gradually attracted attention because of their wide range of uses, and the demand for applications in the electronics industry has skyrocketed. In industrial applications, the design requirements for high-frequency microwave circuits tend to be compact and the manufacturing cost is low. Therefore, if the circuit size and cost can be reduced and the circuit characteristics are good, it is definitely the goal pursued by today's circuit designers.

A common signal coupler in a high-frequency microwave circuit can have a phase shift effect of the passed high-frequency microwave signal, and the transmitted signal is divided into preset ratios for transmission. Signal couplers are often designed with different circuits, such as power dividers, power combiners, power amplifiers, Butler matrices, array antennas, and more. Signal couplers can be implemented primarily using a variety of microwave line structures, such as microstrip lines, strip lines, coplanar waveguides, and waveguides.

Please refer to FIG. 1 , which is a schematic diagram of a conventional equivalent circuit of a rat-ring coupler, wherein each transmission line 11 represents a phase shift of 90 degrees (or a quarter wavelength). The transmission line of the impedance characteristic, so when the actual circuit of the rat-type ring-couple coupler with four outputs 埠P1, P2, P3 and P4 is completed, it is often necessary to have six segments. The impedance is Z=70.7Ω and the phase shift angle =90 ̊ transmission line (Z, ) to complete the three-phase phase shift angle of 90 ̊ and a transmission line with impedance of Z'=70.7Ω and phase shift angle of 270 degrees (Z', '), however the phase shift angle The physical length of the transmission line with '=270 degree impedance characteristics is too long, which will greatly increase the area of the circuit, making the circuit difficult to shrink and failing to meet the needs of today's and tomorrow's electronics industries.

Therefore, this case mainly uses the equivalent method to change the design of the transmission line with a phase shift of 270 degrees, thereby reducing the circuit area occupied by the transmission line of this section, and also equivalently transforming the three transmission lines with a phase shift of 90 degrees to make the overall circuit area. Greatly reduced.

A main object of the present invention is to provide a signal coupler comprising: a substrate; a ground conductor layer disposed on a first surface of the substrate; and a signal transmission wire layer disposed on a second surface of the substrate The signal transmission wire layer includes: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected to form a first node, the first The second wire structure is connected to the third wire structure to form a second node. The first wire structure, the second wire structure and the third wire structure have at least one wire structure including: a first sub-wire structure, a first sub-wire structure and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure and the open stub are connected to a third node; The fourth wire structure includes a first capacitor, a second capacitor and a ground transmission line, wherein the first end of the first capacitor is connected to the first end of the second capacitor Forming a fourth node and a fifth node to the first wire structure and the third wire structure, and connecting the second end of the first capacitor to the second end of the second capacitor and the ground transmission line And a sixth node, and the ground transmission line is electrically connected to the ground conductor layer.

According to the above concept, the signal coupler of the present invention, wherein the substrate is made of a dielectric material, and the equivalent characteristic impedance of the first wire structure, the second wire structure, the third wire structure and the fourth wire structure are both The phase of the first wire structure, the second wire structure and the third wire structure may each be 90 degrees, and the phase delay of the fourth wire structure may be 270 degrees. The fourth wire structure may be 70.7 Ω. The first node is electrically connected to a first signal input and output end, the fourth node is electrically connected to a second signal input and output end, and the fifth node is electrically connected to a third signal input and output. The second node is electrically connected to a fourth signal input and output end.

According to the above concept, the signal coupler of the present invention, wherein the first conductor structure, the second conductor structure and the third conductor structure have equal equivalent characteristic impedances and phase delays, and each includes a corresponding one. a sub-wire structure, the second sub-wire structure, and the first open stub.

According to the above concept, the signal coupler of the present invention, wherein the first capacitor of the fourth wire structure has the same capacitance value as the second capacitor, and the ground transmission line passes through a through hole of the substrate and is electrically Connected to the ground conductor layer on the first surface, the ground transmission line, the first sub-wire structure, the second sub-wire structure, and the first open stub have substantially equal wire widths.

According to the above concept, the signal coupler of the present invention, wherein at least one of the ground transmission line, the first sub-wire structure, the second sub-wire structure, and the first open stub has a turn greater than or equal to a right angle.

Another aspect of the present invention is a signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected And forming a first node, the second wire structure is connected with the third wire structure to form a second node, and the first wire structure, the second wire structure and the third wire structure have at least one wire structure The first sub-wire structure, a second sub-wire structure, and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure, and the open end Each of the first capacitors is connected to a third node The first end is connected to the first wire structure and the third wire structure respectively to form a fourth node and a fifth node, and the second end of the first capacitor and the second end of the second capacitor And the grounding Lines are connected to a sixth node, and the transmission ground line is electrically connected to a ground conductor layer, and spaced apart from the ground conductor layer through a dielectric material with such conductor structures.

According to the above concept, the signal transmission wire layer structure of the present invention, wherein the first wire structure, the second wire structure, the third wire structure and the fourth wire structure have an equivalent characteristic impedance of 70.7 Ω, and The phase difference between the first wire structure, the second wire structure and the third wire structure is 90 degrees, the phase delay of the fourth wire structure is 270 degrees, and the first node is electrically connected to a first signal The fourth node is electrically connected to a second signal input and output end, the fifth node is electrically connected to a third signal input and output end, and the second node is electrically connected to a fourth Signal output terminal.

According to the above concept, the signal transmission wire layer structure of the present invention, wherein the impedance of the first wire structure, the second wire structure and the third wire structure are equal to each other, and each of the first wire structure has a corresponding first a sub-wire structure, the second sub-wire structure, and the first open stub.

According to the above concept, the signal transmission wire layer structure of the present invention, wherein the first capacitance of the fourth wire structure and the second capacitance have the same capacitance value, and the ground transmission line passes through one of the dielectric materials And electrically connected to the ground conductor layer, the ground transmission line, the first sub-wire structure, the second sub-wire structure and the first open stub have substantially equal conductor widths.

According to the above concept, the signal transmission wire layer structure of the present invention, wherein at least one of the ground transmission line, the first sub-wire structure, the second sub-wire structure, and the first open stub has a turn greater than or equal to a right angle .

A further aspect of the present invention is a signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected Forming a first node, the second wire structure is connected to the third wire structure to form a second node; and a fourth wire structure including a first capacitor, a second capacitor and a ground transmission line The first end of the first capacitor and the first end of the second capacitor are respectively connected to the first wire structure and the third wire structure to form a fourth node and a fifth node, and the The second end of the first capacitor and the second end of the second capacitor and the ground transmission line are both connected to a sixth node, and the ground transmission line is electrically connected to a ground conductor layer, and the ground conductor layer is transmitted through a The dielectric material is spaced apart from the conductor structures, and the first conductor structure, the second conductor structure, the third conductor structure and the fourth conductor structure have equal equivalent characteristic impedances, and the first conductor structure The phase of the second conductor structure and the third conductor structure are all delayed by 90 degrees, the fourth wire structure phase delay is 270 degrees.

A further aspect of the present invention is a signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected And forming a first node, the second wire structure is connected with the third wire structure to form a second node, and the first wire structure, the second wire structure and the third wire structure have at least one wire structure The first sub-wire structure, a second sub-wire structure, and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure, and the open end The stubs are all connected to a third node; and a fourth wire structure is identical to the first wire structure, the second wire structure, and the third wire structure, and the first wire is The phase delay of the structure, the second wire structure and the third wire structure are both 90 degrees, and the phase delay of the fourth wire structure is 270 degrees.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and the drawings are in the nature of the description and are not intended to limit the present invention.

Please refer to FIG. 2, which is an equivalent circuit diagram of a rat-ring type coupler developed in order to improve the lack of conventional skills. As noted above, the coupler can be implemented primarily using a variety of microwave line structures, such as microstrip lines, strip lines, coplanar waveguides, and waveguides. Among them, the microstrip line has the advantages of small size, light weight and wide frequency band of use. Therefore, the microstrip line is used in the present embodiment for description. Of course, the concept of the present invention can also be completed by using other microwave circuit structures.

First, in order to be equivalent to Z = 70.7 Ω in Figure 1; The first wire structure 21 and the second wire structure 22 are connected to form a first node N1, and the second wire structure 22 is connected with the third wire structure 23 to form a second The node N2, any one of the first wire structure 21, the second wire structure 22 and the third wire structure 23 of the present invention can utilize the first sub-wire structure 211, the second sub-wire structure 212 and the open stub 213 The first end 2111 of the first sub-wire structure 211, the first end 2121 of the second sub-wire structure 212, and the open stub 213 are all connected to the third node N3. The value representing the phase delay of each sub-wire structure (211, 212) can be given first. The choice of the best is to give a less than 90 先 first So that the length of each sub-wire structure (211, 212) in its equivalent circuit can be shortened, for example, given first =35 ̊, and =35 ̊ Substituting (1) to derive the value representing the characteristic impedance of each sub-wire structure 21 . ...............Formula (1) and by the above formula =35 ̊, =100.9Ω, then will versus Substituting equation (2), and then obtaining characteristic admittance . ........................... (2) In this case, the structure of the open-circuit stub 213 is selected to obtain the equivalent characteristic admittance. , so first set the characteristic impedance of the open stub Substituting the following formula (3), and because the width of the microstrip line is related to the characteristic impedance, it is made to make the line width uniform, so this example is selected. =100Ω to = 100.9Ω corresponds to, of course, other suitable widths can be selected to meet the needs of the design at the time. ................................. (3) In this case, selected by Characteristic admittance Substituting into equation (3) will find the electrical length representing the phase delay of the open stub. =35.9 ̊. Thus, Z = 70.7 Ω shown in Figure 1; The traditional microstrip transmission line of =90 将 will be available in two segments ( =35 ̊, a microstrip transmission line of =100.9 Ω (the first sub-conductor structure 211 and the second sub-conductor structure 212) and a segment ( =35.9 ̊, The microstrip transmission line open block 213 of =100 Ω is equivalently completed.

As can be seen from the above design flow, by specifying the line width or line length of the microstrip transmission line in advance, the corresponding line length or line width can be estimated by the formula, so the designer can appropriately adjust according to the environmental demand. The line width and line length of the equivalent required microstrip transmission line can meet the requirements of the application environment for layout area and shape.

Then, in this case, the capacitor is combined with the transmission line grounding structure to equate the one shown in Figure 1. =70.7Ω; =270 微 microstrip transmission line (fourth wire structure 24), so will be given versus First enter the following formula (4), and obtain .................................(4) Using the ground transmission line 240 for an equivalent replacement, first the characteristic impedance of the ground transmission line 240 is given. =100Ω, which is consistent with the line width of the above layout, and is convenient to manufacture. Next, will =100Ω is substituted into equation (5), and equation (5) is as follows: .................................(5) The electrical length of the transmission line that will be grounded in this way =35.26 ̊, then substituting the operating frequency of the wireless local area network f=2.45GHz into equation (6), the following equation (6): .............................. (6) Find the equivalent capacitance value C = 0.918pF. The two capacitors C of the fourth wire structure 24 are respectively connected to the first wire structure 21 and the third wire structure 23 to form a fourth node N4 and a fifth node N5, and the two capacitors C The two ends and the grounding transmission line 240 are both connected to a sixth node N6, and the grounding transmission line 240 is electrically connected to a grounding conductor layer (not shown in the figure), and the grounding conductor layer is transmitted through a dielectric material (this figure is not Shown) separated from the conductor structures 21-24. The first node N1 is electrically connected to the first signal input/output terminal P1, and the fourth node N4 is electrically connected to a second signal input/output terminal P2. The fifth node N5 is electrically connected to the first node. The third signal is input to the terminal P3, and the second node N2 is electrically connected to a fourth signal input/output terminal P4.

Referring to FIG. 3a, it is a cross-sectional view of the signal coupler of the embodiment, which mainly includes a substrate 30 and a ground conductor layer 31. The ground conductor layer 31 is disposed on the first surface 301 of the substrate 30, and the signal transmission wire layer 32 is mainly disposed on one of the second surfaces 302 of the substrate 30. The substrate 30 can be selected from common FR-4 (usually composed of Woven glass and/or epoxy resin) double panel (thickness (h)=1.6 mm, relative dielectric constant (εr)=4.3). As a base material, of course, other dielectric materials are also available.

As shown in FIG. 3b, the schematic diagram of the layout of the signal transmission wire layer 32 mainly includes a first wire structure 321, a second wire structure 322 and a third wire structure 323, wherein the first wire structure 321 and the first The two wire structures 322 are connected to each other to form a first node N1. The second wire structure 322 is connected to the third wire structure 323 to form a second node N2. The first wire structure 321 and the second wire structure 322 are formed. The at least one wire structure of the third wire structure 323 includes: a first sub-wire structure 3211, a second sub-wire structure 3212, and a first open-circuit stub 3213, wherein the first sub-wire structure 3211 is at one end, the second sub- One end of the wire structure 3212 and the open circuit segment 3213 are both connected to the third node N3. The fourth conductor structure 3214 may include a first capacitor C1, a second capacitor C2, and a ground transmission line 32140, wherein the first end of the first capacitor C1 and the first end of the second capacitor C2 are respectively connected to The first wire structure 321 and the third wire structure 323 form a fourth node N4 and a fifth node N5, and the second end of the first capacitor C1 and the second end of the second capacitor C2 are The grounding transmission line 32140 is connected to a sixth node N6, and the grounding transmission line 32140 is electrically connected to the grounding conductor layer 31 shown in FIG. 3a through the grounding through hole 299. This example is mainly to realize the layout size of the circuit on the FR-4 double-sided circuit board (thickness (h)=1.6mm, relative dielectric constant (εr)=4.3). The design is mainly to reduce the circuit area, so Many windings have a turning point to optimize the circuit area, so at least one of the ground transmission line 32140, the first sub-conductor structure 3211, the second sub-conductor structure 3212, and the first open stub 3213 in this example has a structure greater than or equal to a right angle. The turning point. The lengths of the segments L1~L11 and width W in each wire structure are: L1=3.15mm; L2=7.82mm; L3=3.78mm; L4=1.72mm; L5=0.78mm; L6=5mm; L7=1.6mm ; L8 = 9.4mm; L9 = 5.4mm; L10 = 3.25mm; W = 0.71mm; G = 0.4mm (G is the gap distance between the metal at both ends of the surface mount technology (SMT) capacitor position); C = 0.9 pF.

The final completed circuit size occupies an area of 2.9cm * 1.8cm. The physical schematic diagram can be seen in Figure 4 and Figure 7. It can be clearly seen from the figure that the case can effectively reduce the circuit area. Of course, the above-mentioned winding size is not immutable, but can be adjusted according to the demand, but the circuit designed by the concept of the present case can be reduced in size to a certain extent, thereby achieving the purpose of improving the lack of conventional means. The selection of the double panel of the FR-4 and the thickness setting are all due to the convenience of the material, but in fact it is not limited to such specifications and dimensions.

As for Fig. 5 and Fig. 6, it is shown that the above design is measured by a network analyzer and the simulation results are obtained, and the two have good consistency. From Fig. 5, we can see that the S-parameters of the passbands |S21| and |S41| are measured and measured, the measured sizes are -3.48dB and -3.1dB, and the measured phase ∠S21= -166 ̊; ∠S41= -145 ̊ phase The difference is 21 ̊, the results of |S23| and |S43| shown in Fig. 5 are -3.5dB and -3.5dB, the phase is ∠S23=8.3 ̊; ∠S43= -166 ̊ phase difference 185 ̊. As for the reflection parameter |S11| and the isolation parameter |S31| shown in Fig. 6, all of them are lower than -10 dB, and it can be verified that the design method can effectively reduce the circuit area and have good circuit characteristics.

In summary, this paper proposes a reduced-sized mouse-ring coupler design that can be applied to the WiFi band, in which the 3/4 wavelength (phase delay 270-degree) transmission line in the mouse-ring coupler can occupy a large circuit area. Improvements can also reduce the transmission line of each 1/4 wavelength (phase delay 90 degrees). The design method uses the T-type equivalent of the lumped element, the open circuit break and the mixed line under the transmission line, so that the impedance of the transmission line in the circuit and the length of the similar electrical device will cause the low impedance discontinuity. In the example, the overall circuit area can be reduced by 77.9%. . In addition, the present invention has been modified by those skilled in the art, and is not intended to be protected by the scope of the patent application.

11‧‧‧ transmission line
P1, P2, P3 and P4‧‧‧ four outputs
21‧‧‧First wire structure
22‧‧‧Second wire structure
N1‧‧‧ first node
N2‧‧‧ second node
211‧‧‧First sub-wire structure
212‧‧‧Second sub-wire structure
213‧‧‧Open road segment
2111‧‧‧ the first end of the first sub-wire structure 211
2121‧‧‧ the first end of the second sub-wire structure 212
N3‧‧‧ third node
23‧‧‧ Third wire structure
240‧‧‧ Grounding transmission line
jB0‧‧‧Feature Admittance
L1~L11‧‧‧ length
W‧‧‧Width
C‧‧‧ capacitor
24‧‧‧Fourth wire structure
N4‧‧‧ fourth node
N5‧‧‧ fifth node
N6‧‧‧ sixth node
30‧‧‧Substrate
31‧‧‧ Grounding conductor layer
301‧‧‧ first surface
32‧‧‧Signal transmission wire layer
302‧‧‧ second surface
321‧‧‧First wire structure
322‧‧‧Second wire structure
323‧‧‧ Third wire structure
3211‧‧‧First sub-wire structure
3212‧‧‧Second sub-wire structure
3213‧‧‧The first open road segment
3214‧‧‧4th wire structure
C1‧‧‧first capacitor
C2‧‧‧second capacitor
299‧‧‧ Grounding through hole
32140‧‧‧ Grounding transmission line

FIG. 1 is a schematic diagram of a conventional equivalent circuit of a rat-ring type ring signal coupler. FIG. 2 is an equivalent circuit diagram of the rat ring type ring coupler developed in the present case to improve the lack of conventional skills. Figure 3a is a schematic cross-sectional view of the signal coupler of the present embodiment. Figure 3b is a schematic diagram showing the layout dimensions of the circuit implemented on the FR-4 double-sided circuit board. Figure 4 is a schematic diagram showing the implementation of the circuit on the FR-4 double-sided circuit board in this embodiment. FIG. 5 is a schematic diagram showing the comparison of the results of the simulation results with the network analyzer in the present embodiment. Fig. 6 is a schematic view showing another comparison of the results of the present embodiment and the simulation results by the network analyzer. FIG. 7 is a schematic diagram showing the comparison between the entity completed by the embodiment and the entity completed by the conventional technology.

21‧‧‧First wire structure

22‧‧‧Second wire structure

N1‧‧‧ first node

N2‧‧‧ second node

211‧‧‧First sub-wire structure

212‧‧‧Second sub-wire structure

213‧‧‧Open road segment

2111‧‧‧ the first end of the first sub-wire structure 211

2121‧‧‧ the first end of the second sub-wire structure 212

N3‧‧‧ third node

Claims (12)

A signal coupler comprising: a substrate; a ground conductor layer disposed on a first surface of the substrate; and a signal transmission wire layer disposed mainly on a second surface of the substrate, the signal transmission The wire layer includes: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected to form a first node, the second wire structure Connecting with the third wire structure to form a second node, the first wire structure, the second wire structure and the third wire structure have at least one wire structure including: a first sub-wire structure, a second a sub-wire structure and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure and the open stub are connected to a third node; a fourth wire structure including a first capacitor, a second capacitor, and a ground transmission line, wherein the first end of the first capacitor and the second One of the first ends is connected to the first wire structure and the third wire structure to form a fourth node and a fifth node, and one of the second ends of the first capacitor and the second capacitor The second end and the ground transmission line are both connected to a sixth node, and the ground transmission line is electrically connected to the ground conductor layer. The signal coupler of claim 1, wherein the substrate is made of a dielectric material, the first wire structure, the second wire structure, the third wire structure and the fourth wire structure are equivalent The characteristic impedance is 70.7 Ω, and the phase delay of the first wire structure, the second wire structure and the third wire structure are both 90 degrees, and the phase delay of the fourth wire structure is 270 degrees, the fourth wire structure The first node is electrically connected to a first signal input and output end, the fourth node is electrically connected to a second signal input and output end, and the fifth node is electrically connected to a third signal input and output. The second node is electrically connected to a fourth signal input and output end. The signal coupler of claim 1, wherein the first wire structure, the second wire structure and the third wire structure have equal equivalent characteristic impedances and phase delays, and each of them has a corresponding one. The first sub-wire structure, the second sub-wire structure, and the first open stub. The signal coupler of claim 1, wherein the first capacitor of the fourth wire structure has the same capacitance value as the second capacitor, and the ground transmission line passes through a through hole of the substrate. Electrically connected to the ground conductor layer on the first surface, the ground transmission line, the first sub-wire structure, the second sub-wire structure, and the first open stub have substantially equal wire widths. The signal coupler of claim 1, wherein the ground transmission line, the first sub-wire structure, the second sub-wire structure, and at least one of the first open stubs have a turn greater than or equal to a right angle . A signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected to form a first node, The second wire structure is connected to the third wire structure to form a second node. The first wire structure, the second wire structure and the third wire structure have at least one wire structure including: a first sub wire a first sub-wire structure and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure, and the open stub are connected to a first a third node; and a fourth wire structure comprising a first capacitor, a second capacitor and a ground transmission line, wherein the first end of the first capacitor and the first end of the second capacitor are respectively connected to The first wire structure and the third wire structure form a fourth node and a fifth node, and the second end of the first capacitor and the second end of the second capacitor are connected to the ground transmission line At a sixth node, and the transmission ground line is electrically connected to a ground conductor layer, and spaced apart from the ground conductor layer through a dielectric material with such conductor structures. The signal transmission wire layer structure of claim 6, wherein the first wire structure, the second wire structure, the third wire structure and the fourth wire structure have an equivalent characteristic impedance of 70.7 Ω, And the phase delay of the first wire structure, the second wire structure and the third wire structure are both 90 degrees, the phase delay of the fourth wire structure is 270 degrees, and the first node is electrically connected to the first a signal output terminal, the fourth node is electrically connected to a second signal input and output end, the fifth node is electrically connected to a third signal input and output end, and the second node is electrically connected to the first node The fourth signal is input to the input terminal. The signal transmission wire layer structure of claim 6, wherein the first wire structure, the second wire structure and the third wire structure have equal impedance and phase delays, and each of the corresponding a first sub-wire structure, the second sub-wire structure, and the first open stub. The signal transmission wire layer structure of claim 6, wherein the first capacitance of the fourth wire structure and the second capacitance have the same capacitance value, and the ground transmission line passes through one of the dielectric materials. The ground via, the first sub-wire structure, the second sub-wire structure, and the first open stub have substantially equal wire widths. The signal transmission wire layer structure according to claim 6, wherein at least one of the ground transmission line, the first sub-wire structure, the second sub-wire structure, and the first open stub has a greater than or equal to a right angle The turning point. A signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected to form a first node, The second wire structure is connected to the third wire structure to form a second node; and a fourth wire structure includes a first capacitor, a second capacitor and a ground transmission line, wherein the first capacitor a first end and a first end of the second capacitor are respectively connected to the first wire structure and the third wire structure to form a fourth node and a fifth node, and the first capacitor is a second The second end of the second capacitor and the ground transmission line are both connected to a sixth node, and the ground transmission line is electrically connected to a ground conductor layer, and the ground conductor layer transmits a dielectric material and the wires The structure is separated, and the first wire structure, the second wire structure, the third wire structure and the fourth wire structure have equal equivalent characteristic impedances, and the first wire structure, the second wire Phase line structure and the third conductor structure are all delayed by 90 degrees, the fourth wire structure phase delay is 270 degrees. A signal transmission wire layer structure, comprising: a first wire structure, a second wire structure and a third wire structure, wherein the first wire structure and the second wire structure are connected to form a first node, The second wire structure is connected to the third wire structure to form a second node. The first wire structure, the second wire structure and the third wire structure have at least one wire structure including: a first sub wire a first sub-wire structure and a first open-circuit stub, wherein the first end of the first sub-wire structure, the first end of the second sub-wire structure, and the open stub are connected to a first a three-node structure; and a fourth wire structure, which has the same equivalent characteristic impedance as the first wire structure, the second wire structure, and the third wire structure, and the first wire structure and the second wire structure The phase delay with the third wire structure is 90 degrees, and the phase delay of the fourth wire structure is 270 degrees.