TWI534946B - Plasma processing device - Google Patents

Description

Plasma processing device

The present invention is for firmly fixing a substrate tray inside a plasma processing apparatus, and more particularly to a plasma processing apparatus which can be applied to a plasma processing apparatus in which plasma is formed in a lower portion of a chamber, and the substrate tray is fixed in a room.

In general, in wafers for semiconductors and in precision film processing steps, etching and deposition methods using plasma are used to improve the precision of the article.

The plasma processing apparatus that generates plasma in this manner is composed of a chamber that forms an outer shape, an antenna that is attached to the outside of the chamber, and a chuck that places the wafer on the inside of the chamber.

Thereby, the antenna is supplied with a high frequency, and plasma is formed inside the chamber by high frequency, and the wafer placed on the chuck is processed.

In the conventional plasma processing apparatus, plasma is formed in the upper portion of the chamber, and the tray is fixed in the lower portion, and the wafer (substrate) placed on the tray is etched by plasma. This has a problem in that the by-products generated in the upper portion of the chamber fall on the substrate by gravity. Therefore, the processing by-products affect the processing of the substrate, and the etching operation cannot be smoothly performed, so that defects occur.

In order to solve such a problem, a proposal has been made to fix a tray at the upper portion of the chamber and to form a plasma at the lower portion. Thereby, the problem that the processing by-products fall on the substrate is eliminated, but the substrate faces the lower side in the conventional direction, but faces downward, and there is a problem in that the tray is firmly fixed to the upper portion of the chamber.

A conventional "mounting rack processing apparatus and method" is proposed in Japanese Laid-Open Patent Publication No. 2004-285469 A. However, in this prior art, it is only disclosed that high frequency power is supplied between parallel plate electrodes and plasma is generated, and the engineering gas is started by the plasma, and the predetermined film forming process is performed at a lower temperature. Or the etching process is not disclosed for the means for firmly fixing the substrate tray inside the room.

The matters described in the background art are merely for the purpose of promoting an understanding of the background of the invention, and are not to be considered as a prior art known to those skilled in the art.

Prior art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-285469 A

The present invention has been made to solve such a problem, and an object of the present invention is to provide a plasma processing apparatus which is capable of firmly fixing a substrate tray in an interior portion of a plasma processing apparatus in which a plasma is formed in a lower portion of a chamber. The peripheral processing environment of the substrate tray is uniform, minimizing errors during etching operations.

A plasma processing apparatus according to the present invention for achieving the object includes a chamber having a space for generating a power supply slurry, a chuck fixed at a lower end of the upper end wall portion, and a first clamp assembly mounted at an upper end of the chamber The wall portion is provided with a first jig for placing on the substrate tray, and is arranged to be vertically movable in the vertical direction of the chamber, so that the substrate tray contacts the chuck and is fixed when the operation is performed upward; and the second jig assembly is mounted The upper end wall portion of the chamber is disposed so as to be movable up and down in the vertical direction inside the chamber, and is formed to surround the first jig and the substrate tray. When the jig is raised, the substrate tray is brought into close contact with the chuck by the first jig.

According to still another aspect of the invention, the chamber has a chuck fixed to the upper end wall portion, the engineering gas is supplied upward from the lower end wall portion, the upper side of the side end wall portion, and the antenna is disposed on the lower side.

According to still another aspect of the invention, the first jig assembly includes: a first length adjusting portion that is fixedly attached to an upper end of an upper end wall portion of the chamber, and has a length that is variable in a vertical direction; and a first operating portion that is located at the The first length adjusting portion is connected to the upper side of the first length adjusting portion, and is vertically moved by the first length adjusting portion. The first supporting portion is extended downward from the first operating portion, and the upper end wall of the through chamber is connected. At the extended end, a first jig for placing the substrate tray inside the chamber is provided.

The first length adjusting portion includes a cylinder that is fixed to the upper end wall portion of the chamber, and a piston rod that is disposed to move up and down in the cylinder and is connected to the first operating portion.

According to still another aspect of the present invention, the first operating portion and the upper end wall portion of the chamber are horizontally disposed, and the first length adjusting portion is connected to the center, and is formed radially extending from the center to form the same length and equiangular At least two or more first connecting arms are connected to the first supporting portion.

According to still another aspect of the invention, the first connecting arm of the first operating portion is formed to be elastically bendable.

According to still another aspect of the present invention, the first operating portion is formed to have three first connecting arms extending radially from the center.

According to still another aspect of the invention, one end of the first support portion is connected to the first connecting arm of the first operating portion, and the other end is extended downward, and the end thereof is located below the chuck of the indoor portion, and the other end is at the other end. A first jig that is extended toward the center of the chamber in a flange shape is disposed.

According to still another aspect of the invention, each of the first support portions connected to the plurality of first connecting arms is connected to an outer circumference of a connecting ring formed in a ring shape.

According to still another aspect of the invention, the connecting ring is connected to an upper end of the first support portion above the first jig.

Another feature of the present invention is that a guide support portion is formed in the chamber, and the guide support portion is fixedly attached to an upper end of the upper end wall portion, and is extended upward to connect the first jig assembly and the second clamp assembly, thereby The first clamp unit and the second clamp unit are moved up and down in the same direction, and a fixed panel is disposed at the extended end.

The second clamp unit includes a second length adjustment unit that is fixedly attached to a lower end of the fixed panel and has a length that is variable in a vertical direction, and a second operation unit that is located below the second length adjustment unit and that is connected The second length adjusting portion is moved up and down by the second length adjusting portion, and the second supporting portion is extended downward from the second operating portion, and the upper end wall portion of the through chamber is provided at the extended end. The inside of the first jig and the second jig of the substrate tray are surrounded by the inside.

According to still another aspect of the invention, the second length adjusting unit includes a cylinder that is fixed to the second operating unit, and a piston rod that is disposed to be vertically moved up and down in the cylinder and connected to the fixed panel.

According to still another aspect of the present invention, the second operation portion and the upper end wall portion of the chamber are horizontally arranged, and the second length adjustment portion is connected to the center, and is formed to be radially extended from the center to form the same length and equiangular angle. At least two or more second connecting arms are connected to the second supporting portion.

According to still another aspect of the invention, the second connecting arm of the second operating portion is formed to be elastically bendable.

Another feature of the present invention is that the second support portion is connected to the second end at one end. The second connecting arm of the operating portion has the other end extended downward, and the distal end thereof is located below the first jig, and a second jig that is formed in a ring shape and surrounds the first jig and the substrate tray is disposed at the other end.

According to still another aspect of the invention, the second jig is formed in a ring shape, and an insertion groove for accommodating the first jig and a support groove for placing the substrate tray are formed on the outer circumference.

According to another aspect of the invention, the fixed panel of the guide support portion is formed with a stop portion that extends downward and is located on the upper side of the first operation portion, so that the first operation portion contacts the stop portion when excessively moves upward. And limit the movement.

Another feature of the present invention is further provided with a box module having a symmetrical plate on both sides of the bottom surface, and having a plurality of sections formed on the two boards in the up and down direction and protruding toward each other. a support frame; the placement frame is placed on the support frame, and at the central portion, a transfer groove is formed on an outer circumference smaller than the outer circumference of the substrate tray, and the front side is opened in contact with the transfer groove, along the transfer groove A mounting groove for mounting on the substrate tray is formed on the outer circumference, and a transfer unit that transfers the substrate tray placed on the placement frame to the chamber and is placed on the first jig assembly.

According to another feature of the present invention, the cartridge module is provided with a sensor portion attached to the support frame, and the sensor portion determines the presence or absence of a substrate tray placed on the support frame.

According to still another aspect of the invention, the transfer unit is formed in a plane so as to be in contact with the lower surface of the substrate tray, and a rubber pad for preventing the substrate tray from sliding is disposed on the outer circumference, and a dispersion hole for dispersing the load is formed at the center.

On the other hand, the wafer fixing device of the present invention, which is intended to achieve the above object, includes a first jig assembly in which a first jig for placing a substrate tray is disposed, and is disposed in a room. The inside is raised and lowered in the up and down direction, so that when operating, the substrate tray is brought into contact with the chuck in the room and fixed; and the second clamp assembly is independent of the first clamp assembly The floor is placed so as to be vertically movable in the vertical direction of the chamber, and includes a second jig formed to surround the first jig and the substrate tray, and the substrate tray and the first jig are brought into close contact with the chuck in the room during operation.

In the plasma processing apparatus configured as described above, the plasma processing apparatus of the type in which the plasma is formed in the lower portion of the chamber is firmly fixed to the inside of the chamber so that the peripheral processing environment of the substrate tray is uniform, during the etching operation. Minimize error implementation.

Further, a cartridge as a means for transferring the substrate tray to the indoor portion is provided, so that it is easy to transfer the substrate tray loaded in the cartridge to the inside of the chamber, thereby improving work efficiency.

Room 100‧‧

120‧‧‧Upper wall

122‧‧‧ chuck

140‧‧‧ Side wall

142‧‧‧Antenna

160‧‧‧ lower end wall

180‧‧‧Guidance support

182‧‧‧Fixed panels

184‧‧‧Departure

200‧‧‧1st clamp assembly

220‧‧‧1st length adjustment department

222‧‧‧ cylinder

224‧‧‧ piston rod

240‧‧‧1st operation department

242‧‧‧1st connecting arm

260‧‧‧1st support

262‧‧‧1st fixture

264‧‧‧Connecting ring

300‧‧‧2nd clamp assembly

320‧‧‧2nd length adjustment department

322‧‧‧cylinder

324‧‧‧ piston rod

340‧‧‧2nd operation department

342‧‧‧2nd connecting arm

360‧‧‧2nd support

362‧‧‧2nd fixture

364‧‧‧insert slot

366‧‧‧Support slot

400‧‧‧Box module

420‧‧‧ board

422‧‧‧Support frame

440‧‧‧Place rack

442‧‧‧Transfer trough

460‧‧‧Transfer components

462‧‧‧ rubber mat

464‧‧‧Dispersed holes

W‧‧‧Substrate tray

A‧‧‧ Plasma generation space

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a plasma processing apparatus according to a preferred embodiment of the present invention will be examined with reference to the accompanying drawings.

Fig. 1 is a view showing a plasma processing apparatus according to an embodiment of the present invention.

2 to 3 are views showing an operational state of the plasma processing apparatus shown in Fig. 1.

Fig. 4 is a perspective view showing a first jig assembly of the plasma processing apparatus shown in Fig. 1;

Fig. 5 is a perspective view showing a second jig assembly of the plasma processing apparatus shown in Fig. 1;

Fig. 6 is a perspective view showing a cartridge of a plasma processing apparatus according to an embodiment of the present invention.

7 to 8 are views for explaining the cartridge of the plasma processing apparatus shown in Fig. 6.

9 to 14 are views for explaining the transfer and fixing operation of the substrate tray of the plasma processing apparatus according to the embodiment of the present invention.

Hereinafter, a plasma processing apparatus according to a preferred embodiment of the present invention will be examined with reference to the accompanying drawings. check.

1 is a view showing a plasma processing apparatus according to an embodiment of the present invention, FIGS. 2 to 3 are views showing an operational state of the plasma processing apparatus shown in FIG. 1, and FIG. 4 is a view showing the plasma processing apparatus shown in FIG. FIG. 5 is a perspective view showing a second jig assembly of the plasma processing apparatus shown in FIG. 1.

On the other hand, Fig. 6 is a perspective view showing a cartridge of a plasma processing apparatus according to an embodiment of the present invention, and Figs. 7 to 8 are views for explaining a cartridge of the plasma processing apparatus shown in Fig. 6.

9 to 14 are views for explaining the transfer and fixing operation of the substrate tray of the plasma processing apparatus according to the embodiment of the present invention.

As shown in Fig. 1, the plasma processing apparatus of the present invention includes a chamber 100 having a space a for generating a power supply slurry, a chuck 122 fixed to a lower end of the upper end wall portion 120, and a first clamp assembly 200 mounted to the chamber The upper end wall portion 120 of the chamber 100 is provided with a first jig 262 on which the substrate tray W is placed, and is arranged to be vertically movable in the vertical direction of the chamber 100, so that the substrate tray W contacts the chuck when the operation is performed upward. And the second clamp unit 300 is attached to the upper end wall portion 120 of the chamber 100, and is provided with a second jig 362 that surrounds the first jig 262 and the substrate tray W, and is disposed in the chamber 100. The inside is raised and lowered in the vertical direction so that the substrate tray W and the first jig 200 are in close contact with the chuck 122 during the ascending operation.

A chuck 122 is fixedly mounted on the upper end wall portion 120, the substrate tray W is fixed to the upper portion, and engineering gas is supplied from the lower end wall portion 160 so that plasma is formed in the lower portion of the chamber 100, in the plasma processing apparatus of this type. In the present invention, the substrate tray W is fixed on the upper portion, and plasma is formed in the lower portion, thereby having the advantage of minimizing the influence of processing by-products, and at the same time, the substrate tray W is firmly fixed inside the chamber 100 so that the periphery of the substrate tray W The processing environment is uniform, Prevent errors during the etching process.

The chamber 100 may have a chuck 122 fixed to the upper end wall portion 120, and the engineering gas is supplied upward from the lower end wall portion 160. A vacuum pump (not shown) is connected to the upper side of the side end wall portion 140, and an antenna is connected to the lower side. 142.

Referring to Fig. 1, a chamber 120 of the present invention has a chuck 122 fixed to an upper end wall portion 120, and an engineering gas is supplied upward from a lower end wall portion 160. The engineering gas introduced into the chamber 100 is disposed on the lower side of the side end wall portion 140. The high frequency supplied from the antenna 142 is dissociated, so that the etching of the substrate tray W is performed. Particularly in the present invention, a vacuum pump (not shown) is connected to the upper end side wall portion 140 of the chamber 100, so that it is possible to prevent the vacuum pump (not shown) from being attached to the lower portion of the chamber 100. The separated substance of the gas is formed close to a vacuum pump (not shown) located at the lower portion of the chamber 100, and thus, the separated substance of the engineering gas to be transferred to the side of the substrate tray W is sucked into a vacuum pump (not shown) to the substrate. The problem of the amount of substance transferred on the W side of the tray is reduced. Thereby, the shape of the initial target of the substrate tray W can be sufficiently formed, and the error is reduced and the quality is improved.

On the other hand, in the present invention, the first jig assembly 200 capable of moving up and down in the vertical direction is attached to the upper end wall portion 120 of the chamber 100, and the substrate holder W is placed in the chamber 100 in the first jig unit 200. The first jig 262 placed. In the first jig assembly 200, the substrate tray W placed on the first jig 262 contacts the chuck 122 during the ascending operation, and the position is fixed.

Further, in the upper end wall portion 120 of the chamber 100, a second jig assembly 300 that can be raised and lowered in the vertical direction is attached to the first jig assembly 200. In the second jig unit 300, the second jig 362 that surrounds the first jig 262 and the substrate tray W in the chamber 100 is disposed, and when the operation is increased, the substrate tray W is in close contact with the first jig 262. Chuck 122.

1 to 3, the substrate tray W is fixed to the chuck 122 at a time by the first clamp unit 200, and the second clamp unit 300 is used for secondary pressurization, so that the substrate tray W can be completely fixed, so that the substrate holder W can be completely fixed. No shaking occurs in the chuck 122.

If the clamp assembly of the present invention for fixing the substrate tray W in the chamber 100 is specifically described, the first clamp assembly 200 may include a first length adjustment portion 220 that is fixedly mounted on the upper end of the chamber 100. The upper end of the wall portion 120 has a length that is variable in the vertical direction. The first operating portion 240 is located above the first length adjusting portion 220, and is connected to the first length adjusting portion 220, and is moved up and down by the first length adjusting portion 220. The first support portion 260 is extended downward from the first operation portion 240, and the upper end wall portion 120 of the penetration chamber 100 is placed at the end of the chamber 100 to be placed on the substrate tray W. Fixture 262.

In other words, as shown in FIG. 4, the first operation unit 240 is disposed in the first clamp unit 200, and the first operation unit 240 is connected to the first length adjustment unit 220 that is arranged to have a variable length up and down, and moves up and down. When the length adjusting unit 220 is operated, the first supporting unit 260 connected thereto moves up and down as the first operating unit 240 moves up and down. In the first support portion 260, the first jig 262 in which the substrate tray W is placed inside the chamber 100 is disposed. When the first support portion 260 is moved upward, the first jig 262 faces the chuck 122 in the chamber 100. Moving upwards makes contact with the chuck 122. Therefore, the substrate tray W placed on the first jig 262 is positioned between the chuck 122 and the first jig 262 at the upper portion of the chamber 100.

Specifically, the first length adjusting portion 220 may include a cylinder 222 fixed to the upper end wall portion 120 of the chamber 100, and a piston rod 224 configured to be vertically moved up and down in the cylinder 222 for the first operating portion 240. connection. As shown in Fig. 1, the cylinder 222 of the first length adjusting portion 220 is fixedly attached to the chamber 100, and the piston rod 224 that moves in the vertical direction in the cylinder 222 is connected to the first transport. In the rotating portion 240, when the piston rod 224 of the cylinder 222 is raised, the first operating portion 240 connected thereto rises together. Among them, the cylinder 222 and the piston rod 224 may be configured to perform a lifting operation using compressed air, and various means for moving the piston rod 224 in the cylinder 222 may be applied.

On the other hand, the first operation unit 240 may be horizontally disposed with the upper end wall portion 120 of the chamber 100, and the first length adjustment unit 220 may be connected to the center, and the same length and the like may be formed radially from the center. At least two or more first connecting arms 242 of the corners are connected to the first supporting portion 260.

Of course, the first operation unit 240 is configured to move in the vertical direction by the first length adjustment unit 220, and can be applied in a simple circular form. However, the first operation unit 240 is connected to the first length adjustment unit 220 at the center, so that the load that acts in accordance with the lifting operation of the first length adjustment unit 220 is not biased to one side, and the first connection arm 242 is radiated from the center. The shape is equiangular and elongated, so that the weight can be reduced as compared with the case of simply forming in a circular shape.

Further, the first operation unit 240 is formed of the same length and the same angle from the first extension arm 242 that is extended from the center, so that when the first operation unit 240 moves up and down, the same load is distributed to each of the first connection arms 242.

In particular, the first connecting arm 242 of the first operating portion 240 is formed to be elastically bendable, so that the load is less likely to be broken when the load acts on the first connecting arm 242. In other words, as the first length adjustment unit 220 performs the ascending operation, the first operation unit 240 and the first support unit 260 connected thereto rise, and the substrate tray W placed on the first jig 262 contacts the chuck 122, in order to The substrate tray W strongly contacts the chuck 122, and the lifting force of the first length adjusting portion 220 strongly acts.

At this time, in the first operation unit 240, the lift force is in the first length adjustment unit. When the center of the first support portion 260 is hooked to the chuck 122, the first operation portion 240 including the first link arm 242 is elastically bent to prevent the first link arm 242 from being slid. When the end portion is broken, the first operating portion 240 is elastically bent together with the rising force of the first length adjusting portion 220, so that the substrate tray W placed on the first jig 262 can be firmly fixed to the chuck 122.

The first operation unit 240 can form three first connection arms 242 radially extending from the center. Of course, when the number of the first connecting arms 242 extended from the first operating unit 240 is increased, the overall rigidity of the first operating unit 240 is increased. However, in the present invention, the substrate tray W enters and is placed by the side surface of the first jig unit 200. As the number of the first connecting arms 242 increases, the interval between the first connecting arms 242 decreases, and it is difficult to secure the substrate. The space in which the tray W enters. Therefore, it is preferable that the first connecting arms 242 extending from the first operating unit 240 are formed at equal intervals, and three or so are formed to ensure the space in which the substrate tray W enters, and the first operating unit 240 is ensured to be appropriate. rigidity.

The number of such first connecting arms 242 can be set to an appropriate number in consideration of the entrance space and overall rigidity of the substrate tray W.

On the other hand, one end of the first support portion 260 is connected to the first link arm 242 of the first operation portion 240, and the other end thereof is extended downward, and the distal end thereof is located below the chuck 122 inside the chamber 100, and at the other end. A first jig 262 that is extended toward the center of the chamber 100 in a flange shape may be disposed.

As described above, the first support portion 260 is connected to the first link arm 242 at one end, and moves up and down together with the first link arm 242 when the first length adjustment unit 220 is operated, and the other end is extended downward and is located in the chamber 100. In particular, at the other end of the first support portion 260, a facing chamber is disposed. The first jig 262 in the center of 100 is extended in the form of a flange, and the substrate tray W can be placed inside the chamber 100.

In the present invention, the first jig unit 200 is used to fix the substrate tray W at a time, and the first jig 262 disposed on the first support portion 260 is formed in a flange shape so that the substrate tray W is placed on the upper end. Preferably, the first jig 262 is extended in the form of a flange, and a boss is formed in the extended portion, so that the substrate tray W placed thereon can be prevented from moving or escaping. At this time, a boss corresponding to the boss of the first jig 262 can also be formed on the substrate tray W.

Further, the extension length of the first jig 262 can be set to support the outer circumference of the substrate tray W, and is attached to the chuck 122 when moving upward, so that the substrate tray W contacts the chuck 122 so that the position is fixed.

On the other hand, each of the first support portions 260 connected to the plurality of first connecting arms 242 can be connected to the outer circumference of the connecting ring 264 formed in a ring shape.

As shown in FIG. 4, in the present invention, a plurality of first connecting arms 242 are extended in the first operating portion 240, and a first supporting portion 260 is connected to each of the plurality of first connecting arms 242. Further, the first support portion 260 is extended downward from the first link arm 242, and when the first operation portion 240 moves up and down, the first support portion 240 is shaken by the operation shock.

Therefore, the first support portions 260 extended from the first connecting arm 242 are all connected by the connecting ring 264 formed in a ring shape, so that the shaking of the first supporting portion 260 can be reduced, so that the first jig can be placed on the first jig. The substrate tray W of 262 is stably supported. Further, one end of the first support portion 260 is connected to the first connecting arm 242, and the other end is connected by the connecting ring 264, so that the structure can be stabilized. Such a connecting ring 264 is not only circular but also applied in a four-sided ring shape depending on the form of the chuck 122.

Preferably, the connecting ring 264 is connected to the upper end of the first support portion 260 at an upper end than the first jig 262. In this way, the connection ring 264 is connected to the upper side than the first jig 262, so that the substrate tray W entering from the side can be moved to the space between the connection ring 264 and the first jig 262. Thereby, the structure of the first support portion 260 can be stabilized, and the entry of the substrate tray W can be smoothly performed.

On the other hand, a guide support portion 180 may be formed in the chamber 100, and is fixedly attached to the upper end of the upper end wall portion 120, and is extended upward, and the first clamp unit 200 and the second clamp unit 300 are connected to each other. The clamp assembly 200 and the second clamp assembly 300 are lifted and lowered in the same direction, and a fixed panel 182 is disposed at the extended end.

The guide support portion 180 is fixedly attached to the upper end wall portion 120 of the chamber 100, and is elongated upward in the form of a rod. Such a guide support portion 180 may be formed in plurality. In particular, the first clamp unit 200 and the second clamp unit 300 are connected to the guide support portion 180, and the first clamp unit 200 and the second clamp unit 300 are guided to move in the vertical direction along with the guide support unit 180. The first clamp unit 200 and the second clamp unit 300 are caused to perform a stable lifting operation in the same direction.

The first clamp unit 200 and the second clamp unit 300 are disposed above and below the upper end wall portion 120 of the chamber 100, and the first guide unit 200 can be configured to be connected to the first clamp unit 200. The operation unit 240 is connected to the second operation unit 340 of the second jig unit 300 to be described below.

Further, a fixed panel 182 may be connected to the extended end of the guide support portion 180. As for the fixing panel 182, a portion to be mounted as the second jig assembly 300 to be described below may be formed in a plane, and when the guiding support portion 180 is formed in plurality, the guiding branches are connected The struts 180 are structurally stabilized.

Specifically, the second clamp unit 300 may include a second length adjustment unit 320 that is fixedly attached to the lower end of the fixed panel 182 and has a variable length in the vertical direction. The second operation unit 340 is 340. The second length adjustment unit 320 is connected to the lower side of the second length adjustment unit 320, and is moved upward and downward by the second length adjustment unit 320. The second support unit 360 is operated from the second operation unit. The portion 340 is extended downward, and the upper end wall portion 120 of the penetration chamber 100 includes a second jig 362 that surrounds the first jig 262 and the substrate tray W together in the interior of the chamber 100 at the extended end.

In other words, as shown in FIG. 5, the second clamp unit 300 is disposed with the second operation unit 340, and the second operation unit 340 is connected to the second length adjustment unit 320 whose length is variable up and down, and moves up and down. When the second length adjustment unit 320 is operated, the second support unit 360 is moved up and down as the second operation unit 340 moves up and down. In the second support portion 360, the second jig 362 that is placed on the substrate tray W inside the chamber 100 is provided, so that when the second support portion 360 is moved upward, the second jig 362 faces the chuck 122 in the chamber 100. Move upward to contact the chuck 122. In particular, the second jig 362 disposed on the second support portion 360 is formed so as to surround the first jig 262 and the substrate tray W, so that the first jig 262 and the substrate tray W placed on the first jig 262 are in the chamber 100. The upper portion is in close contact with the chuck 122. As described above, the first jig assembly 200 together with the second jig assembly 300 causes the substrate tray W to contact the chuck 122, and the position is fixed, so that the position of the substrate tray W can be fixed more firmly and safely.

Specifically, the second length adjustment unit 320 may include a cylinder 322 that is fixed to the second operation unit 340 and a piston rod 324 that is disposed to be vertically moved up and down in the cylinder 322 and connected to the fixed panel 182.

As shown in Fig. 1, the cylinder 322 of the second length adjusting portion 320 is fixedly attached to the second operating portion 340, and the piston rod 324 that moves in the vertical direction in the cylinder 322 is connected to the fixed panel 182, so that if the piston rod of the cylinder 322 When the downward movement is performed at 324, the cylinder 322 is raised and the second operation portion 340 is raised.

The connection between the cylinder 322 and the piston rod 324 can be interchanged and mounted on the fixed panel 182 or the second running portion 340. The cylinder 322 and the piston rod 324 can be configured to perform lifting operation using compressed air, and can be applied to the piston rod 324. Various means of moving in the cylinder 322.

On the other hand, the second operation portion 340 may be horizontally disposed with the upper end wall portion 120 of the chamber 100, and the second length adjustment portion 320 may be connected to the center, and may be formed radially extending from the center to form the same length and the like. At least two or more second connecting arms 342 of the corners are connected to the second supporting portion 360.

As shown in FIG. 5, the second operating portion 340 has the second length adjusting portion 320 connected to the center, so that the load that acts as the lifting operation of the second length adjusting portion 320 is not biased to one side, and the second connecting arm The 342 is radially extended from the center to form an equiangular extension, so that the weight can be reduced as compared with the case of simply forming in a circular shape.

Further, the second operation portion 340 is formed of the same length and the same angle from the second extension arm 342 that is extended from the center, so that when the second operation portion 340 moves up and down, the same load is distributed to each of the second connection arms 342.

The second connecting arm 342 of the second operating portion 340 is formed to be elastically bendable. In other words, since the second length adjusting unit 320 is connected to the center of the second operating unit 340, the lifting force acts, and the second connecting arm 342 is attached to the chuck 122 as the second holding unit 362 of the second supporting unit 360 is attached to the chuck 122. The second operating portion 340 is elastically bent to prevent the end of the second connecting arm 342 In the damage, the second operating portion 340 is elastically bent together with the rising force of the second length adjusting portion 320, so that the substrate tray W surrounded by the second jig 362 can be firmly fixed to the chuck 122.

The second operating portion 340 may have a second connecting arm 342 extending radially from the center, and the number of the second connecting arms 342 may be extended by the same number as the number of the insertion grooves 364 to be described later.

On the other hand, one end of the second support portion 360 is connected to the second connecting arm 342 of the second operating portion 340, and the other end thereof is extended downward, and the distal end thereof is located below the first jig 262, and the other end can be disposed at the other end. The second jig 362 which is formed in a ring shape and surrounds the first jig 262 and the substrate tray W.

As described above, the second support portion 360 is connected to the second link arm 342 at one end, and moves up and down together with the second link arm 342 when the second length adjustment unit 320 is operated, and the other end is extended downward and is located in the chamber 100. In particular, at the other end of the second support portion 360, a second jig 362 that is formed in a ring shape and surrounds the second jig 362 and the substrate tray W is disposed, so that the first jig 262 and the substrate tray W can be fixed to the chuck. 122.

The second jig 362 is formed in a ring shape, and an insertion groove 364 for accommodating the first jig 262 and a support groove 366 for mounting on the substrate tray W can be formed on the outer circumference.

In the present invention, the second jig unit 300 is used to more firmly fix the substrate tray W that is fixed once by the first jig unit 200, and the second jig 362 disposed on the second support unit 360 can be formed in a ring shape. So as to surround the outer periphery of the substrate tray W. The second jig 362 can be formed in a circular ring shape or a quadrangular ring shape depending on the shape of the substrate tray W, and can be formed in accordance with the shape of the substrate tray W.

Further, the second jig 362 may be formed to be accommodated by the first jig 262 In the insertion groove 364, a support groove 366 is formed in the outer peripheral shape of the substrate tray W, and a support groove 366 on which the substrate tray W is placed is formed. When the second jig 362 is raised, the first jig 262 is inserted into the insertion groove 364, and the substrate tray W is inserted into the support groove 366, and the first jig 262 is surrounded by the second jig 362 so that the processing environment is performed in the same manner. The operation prevents an error in the etching process, that is, when the substrate tray W is fixed only by the first jig 262, an error occurs in the fixed portion and the unfixed portion during the etching process due to different processing environments.

Further, in the second jig 362, the first jig 262 is inserted through the insertion groove 364, and the substrate tray W is inserted and placed by the support groove 366, thereby preventing the substrate tray W from moving, and the substrate tray W firmly contacts the chuck 122, and the position is fixed.

On the other hand, the fixed panel 182 of the guide support portion 180 is formed with a stop portion 184 that extends downward and is located above the first operation portion 240, so that the first operation portion 240 is stopped when it is excessively moved upward. Part 184 and restrict movement.

As described above, the stop portion 184 extended from the fixed panel 182 prevents the first operation portion 240 from excessively moving as the first length adjustment portion 220 is excessively operated, thereby preventing damage of the first jig 262. As described above, the first jig 262 is elongated in the form of a flange, and is easily broken when a force equal to or greater than the strength is applied. Therefore, in the fixed panel 182, the stop portion 184 is extended downward and is located above the first operation portion 240, and the first operation portion 240 that has been raised by the first length adjustment portion 220 is hooked to the stop portion 184. 1 After the jig 262 contacts the chuck 122, it does not break due to excessive rise. The second jig 362 contacts the chuck 122 after surrounding the substrate tray W and the first jig 262, and the ascending operation is restricted, and no additional stopping means is required.

On the other hand, as shown in FIG. 6 to FIG. 8 , a box module 400 may be further disposed. The box module 400 has a board 420 symmetrically on both sides of the bottom surface, and has: along the two boards 420 a support frame 422 which is formed in a plurality of stages in the up-and-down direction and which protrudes toward each other; a placement frame 440 is placed on the support frame 422, and a transfer groove is formed in the center portion at a smaller outer circumference than the outer circumference of the substrate tray W. 442, the front side is open to be in contact with the transfer groove 442, and a mounting groove 444 on which the substrate tray W is placed is formed along the outer circumference of the transfer groove 442. The transfer unit 460 is placed on the placement frame 440. The substrate tray W is transferred into the chamber 100 and placed on the first jig assembly 200.

The cassette module 400 is configured to store and store the substrate tray W before transferring the substrate tray W into the chamber 100.

The cartridge module 400 is symmetrically disposed with the plate 420 on both sides of the bottom surface so as to be open at the front and rear sides. On the two plates 420, the support frame 422 is formed in a plurality of stages in the up and down direction.

A placement stand 440 on which the substrate tray W is placed is disposed on the support frame 422. In the placement frame 440, the upper substrate tray W is placed, and at the center portion, a transfer groove 442 is formed on the outer circumference of the outer circumference of the substrate tray, and the front portion is opened to be in contact with the transfer groove 442, so that the transfer will be described below. The assembly 460 is capable of lifting the substrate tray W placed on the placement rack 440. Further, the transfer groove 442 is formed in the placement frame 440, so that the placement frame 440 can be prevented from contacting the electrode of the substrate tray W to cause electrode damage. Further, in the placement frame 440, a boss is formed in a portion where the substrate tray W is placed, and the movement of the substrate tray W can be prevented.

The transfer unit 460 is a device for transferring the substrate tray W placed on the placement rack 440 into the chamber 100. Recently, with the mechanization of the processing of the work, the transfer of the wafer is performed by the robot. In the present invention, the transfer unit 460 can be attached to the robot as a means for holding the substrate tray W. That is, by the operation of the robot, the transfer unit 460 can hold the substrate tray W placed on the placement frame 440, transfer it to the chamber 100, and place it in the first folder. With component 200.

On the other hand, the cartridge module 400 can be mounted with a sensor portion 480 on the support frame 422, and the sensor portion 480 determines whether or not the substrate tray W is placed on the support frame 422.

When the substrate tray W is transferred to the chamber 100, in the cassette module 400, the placement frame 440 is left, and only the substrate tray W is transferred to the chamber 100. Therefore, in the cassette module 400, it is necessary to confirm whether or not the substrate tray W exists. Rather than confirming the presence of the shelf 440.

Therefore, in the cartridge module 400, the sensor portion 480 for judging whether or not the substrate tray W is present can be mounted so that the substrate tray W stacked on the cartridge module 400 is found and accurately transferred when the robot is automated.

The sensor portion 480 can be mounted, for example, on the support frame 422, and a hole is formed on the placement frame 440 at a position corresponding to the light-transmitting sensor, so that the substrate tray W is placed on the substrate. The rack 440 can determine whether or not the light passes through the hole of the rack 440, and judge whether or not the substrate tray W is present.

On the other hand, as shown in FIG. 8, the transfer unit 460 may be formed in a plane so as to be in contact with the lower surface of the substrate tray W, and a rubber pad 462 for preventing the substrate tray W from sliding is disposed on the outer circumference, and is formed at the center for dispersion. Loaded dispersion holes 464.

As described above, the transfer unit 460 can be formed in a plane to stably support the substrate tray W, and the rubber pad 462 is formed on the end surface in contact with the substrate tray W, so that the substrate tray W placed on the transfer unit 460 can be prevented from slipping off. In addition, a dispersion hole 464 is formed in the center of the transfer unit 460, so that the transfer unit 460 can sufficiently support the weight of the substrate tray W.

The wafer fixing device as a means for fixing the substrate tray W The first jig unit 200 may be disposed, and the first jig 262 placed on the substrate tray W may be disposed so as to be vertically movable in the vertical direction inside the chamber 100, so that the substrate tray W contacts the chamber 100 during operation. The second chuck assembly 300 is disposed independently of the first clamp unit 200 so as to be movable up and down in the vertical direction inside the chamber 100, and is disposed to surround the first clamp 262 and the substrate tray. The second jig 362 formed in the W region is operated such that the first jig 262 and the substrate tray W are brought into close contact with the chuck 122 in the chamber 100; the substrate tray W is firmly fixed in the chamber 100.

The operation of the present invention will be described below with reference to the drawings.

As shown in FIG. 9, the placement frame 440 is placed on the support frame 422 of the cartridge module 400, and the substrate tray W is placed on the placement frame 440, and the substrate tray W stands by before being transferred to the chamber 100.

As shown in FIG. 10, when the corresponding substrate tray W is transferred to the chamber 100, the transfer unit 460 lifts only the substrate tray W placed on the placement rack 440, and performs transfer to the chamber 100.

The substrate tray W thus transferred is transferred to the wafer fixing device in the chamber 100 shown in FIGS. 11 to 12, and the substrate tray W is placed on the first jig 262 of the first jig assembly 200.

When the substrate tray W is placed on the first jig 262, as shown in FIG. 13 , as the first length adjusting unit 220 of the first jig unit 200 is moved upward, the first operating unit 240 moves upward and is connected to the first one. The support portion 260 is raised, and the first jig 262 is raised. Therefore, the substrate tray W placed on the first jig 262 is moved and brought into contact with the chuck 122, so that the position is fixed once.

In this state, as shown in FIG. 14 , as the second length adjustment unit 320 of the second clamp unit 300 moves upward, the second operation unit 340 moves upward and is connected to the second support. The portion 360 rises and the second jig 362 rises. As a result, the second jig 362 pushes the first jig 262 and the substrate tray W upward together, so that the substrate tray W is firmly fixed to the chuck 122 twice.

In the plasma processing apparatus in which the plasma is formed in the lower portion of the chamber 100, the plasma processing apparatus configured as described above firmly fixes the substrate tray W inside the chamber 100, so that the peripheral processing environment of the substrate tray W is uniform. Minimize error implementation during etching operations.

Further, a cartridge as a means for transferring the substrate tray W to the inside of the chamber 100 is provided, so that it is easy to transfer the substrate tray W loaded in the cartridge into the chamber 100, thereby improving work efficiency.

The present invention has been illustrated and described with respect to the specific embodiments thereof, and the present invention may be variously modified and changed without departing from the scope of the technical scope of the present invention provided by the following claims. The personnel are self-evident.

Room 100‧‧

120‧‧‧Upper wall

122‧‧‧ chuck

140‧‧‧ Side wall

142‧‧‧Antenna

160‧‧‧ lower end wall

180‧‧‧Guidance support

182‧‧‧Fixed panels

184‧‧‧Departure

200‧‧‧1st clamp assembly

220‧‧‧1st length adjustment department

222‧‧‧ cylinder

224‧‧‧ piston rod

240‧‧‧1st operation department

260‧‧‧1st support

262‧‧‧1st fixture

300‧‧‧2nd clamp assembly

320‧‧‧2nd length adjustment department

322‧‧‧cylinder

324‧‧‧ piston rod

340‧‧‧2nd operation department

360‧‧‧2nd support

362‧‧‧2nd fixture

A‧‧‧ Plasma generation space

Claims (21)

A plasma processing apparatus comprising: a chamber having a space for generating a power supply slurry, a chuck being fixed to a lower end of the upper end wall portion; and a first clamp assembly mounted on an upper end wall portion of the chamber The first jig to be placed on the substrate tray is arranged to be vertically movable in the vertical direction of the chamber, so that the substrate tray contacts the chuck and fixed during the upward operation; and the second jig assembly is mounted to the chamber The upper end wall portion is disposed to be movable up and down in the vertical direction of the chamber, and when the second jig that surrounds the first jig and the substrate tray is moved upward, the substrate tray is brought into close contact with the first jig; The first jig assembly includes a first length adjusting portion that is fixedly attached to an upper end of the upper end wall portion of the chamber, and has a length that is variable in a vertical direction, and a first operating portion that is located above the first length adjusting portion. The first length adjusting portion is connected and moved up and down by the first length adjusting portion. The first supporting portion is extended downward from the first operating portion, and the upper end wall portion of the through chamber is at the extended end. have Interior of the chamber for placing a substrate tray according to the first jig. The plasma processing apparatus according to claim 1, wherein the chamber has a chuck fixed to the upper end wall portion, the engineering gas is supplied upward from the lower end wall portion, and a vacuum pump is connected to the upper side of the side end wall portion. An antenna is arranged on the side. The plasma processing apparatus according to claim 1, wherein the first length adjusting portion includes a cylinder fixed to the upper end wall portion of the chamber, and a piston rod configured to move up and down in the cylinder. And the first operation unit is connected. The plasma processing apparatus according to claim 1, wherein the first operation portion and the upper end wall portion of the chamber are horizontally arranged, and the first length adjustment portion is connected to the center, and is radially radiated from the center. At least two or more first connecting arms constituting the same length and an equal angle are formed to be extended, and the first supporting portion is connected. The plasma processing apparatus according to claim 4, wherein the first connecting arm of the first operating portion is formed to be elastically bendable. The plasma processing apparatus according to claim 4, wherein the first operation unit is formed by radially extending from the center to form three first connecting arms. The plasma processing apparatus according to claim 4, wherein one end of the first support portion is connected to the first connecting arm of the first operating portion, and the other end is extended downward and the end is located closer to the interior portion. The chuck is placed on the lower side, and a first jig that is extended toward the center of the chamber in a flange shape is disposed at the other end. The plasma processing apparatus according to claim 4, wherein each of the first support portions connected to the plurality of first connecting arms is connected to an outer circumference of a connecting ring formed in a ring shape. The plasma processing apparatus according to claim 8, wherein the connecting ring is connected to the upper end of the first support portion at an upper end than the first jig. The plasma processing apparatus according to claim 1, wherein a guide support portion is formed in the chamber, and the guide support portion is fixedly attached to an upper end of the upper end wall portion and extended upward, and the first connection is made. The clamp assembly and the second clamp assembly move the first clamp assembly and the second clamp assembly in the same direction, and a fixed panel is disposed at the extended end. A plasma processing apparatus according to claim 10, wherein The second clamp unit includes a second length adjustment unit that is fixedly attached to a lower end of the fixed panel and has a length that is variable in a vertical direction, and a second operation unit that is located below the second length adjustment unit. The second length adjusting portion is connected and moved up and down by the second length adjusting portion. The second supporting portion is extended downward from the second operating portion, and the upper end wall portion of the through chamber is provided at the extended end. The second jig of the first jig and the substrate tray is surrounded by the inside of the chamber. The plasma processing apparatus according to claim 11, wherein the second length adjusting unit includes a cylinder that is fixed to the second operating unit, and a piston rod that is arranged to move up and down in the cylinder. Connect to the fixed panel. The plasma processing apparatus according to claim 11, wherein the second operation portion and the upper end wall portion of the chamber are horizontally arranged, and the second length adjustment portion is connected to the center, and is radially radiated from the center. At least two or more second connecting arms constituting the same length and an equal angle are formed to be extended, and the second supporting portion is connected. The plasma processing apparatus according to claim 13, wherein the second connecting arm of the second operating portion is formed to be elastically bendable. The plasma processing apparatus according to claim 13, wherein one end of the second support portion is connected to the second connecting arm of the second operating portion, and the other end is extended downward and the end thereof is located more than the first jig. On the lower side, a second jig that is formed in a ring shape and surrounds the first jig and the substrate tray is disposed at the other end. The plasma processing apparatus according to claim 15, wherein the second jig is formed in a ring shape, and an insertion groove for accommodating the first jig is formed on the outer circumference. And a support groove for the substrate tray. The plasma processing apparatus according to claim 10, wherein the fixed panel of the guide support portion is formed with a stop portion extending downward and located on the upper side of the first operation portion, so that the first operation portion is Touch the stop when moving excessively upwards and restrict movement. The plasma processing apparatus according to claim 1, wherein a cartridge module is further disposed, the cartridge module having a symmetrical plate on both sides of the bottom surface, and having: a plurality of segments formed on the two plates in the up and down direction And a support frame protruding toward the mutually facing direction; the placement frame is placed on the support frame, and at the central portion, a transfer groove is formed on the outer circumference smaller than the outer circumference of the substrate tray, and the front side is connected to the transfer groove The method is open, and a mounting groove for loading the substrate tray is formed along the outer circumference of the transfer groove; and a transfer unit that transfers the substrate tray placed on the placement frame to the chamber and is placed on the first clamp assembly . The plasma processing apparatus of claim 18, wherein the cartridge module is provided with a sensor portion mounted on the support frame, and the sensor portion determines the substrate tray loaded on the support frame There is no. The plasma processing apparatus according to claim 18, wherein the transfer unit is formed in a plane so as to be in contact with a lower surface of the substrate tray, and a rubber pad for preventing the substrate tray from sliding is disposed on the outer circumference, and is formed at the center for Disperse the dispersed pores of the load. A plasma processing apparatus comprising: a first jig unit in which a first jig for placing on a substrate tray is disposed, and is arranged to be vertically movable in a vertical direction inside the chamber, so that the substrate tray is operated when operated Contact the chuck in the room And the second jig assembly is disposed independently of the first jig assembly so as to be movable up and down in the vertical direction inside the chamber, and includes a second jig formed to surround the first jig and the substrate tray, and is operated. When the substrate tray is brought into close contact with the chuck in the chamber together with the first jig; the first clamp assembly includes: a first length adjusting portion that is fixedly mounted on the upper end of the upper end wall portion of the chamber, and the length is variable in the up and down direction The first operation unit is located above the first length adjustment unit, and is connected to the first length adjustment unit, and moves up and down by the first length adjustment unit. The first support unit operates from the first length. The portion is extended downward, and the upper end wall portion of the through-chamber has a first jig that is placed on the substrate tray inside the chamber at the extended end.