TWI532128B - Electronic device package structure and manufacturing method thereof - Google Patents

Description

Electronic component package structure and manufacturing method thereof

The present disclosure relates to a package structure, and more particularly to a package structure for an environmentally sensitive electronic component.

The component design in electronic products is becoming more and more sophisticated, and the demand for moisture/oxygen barrier capability is also increasing. Generally used to determine the water vapor / oxygen barrier capacity indicators are Water Vapor Transmission Rate (WVTR) and Oxygen Transmission Rate (OTR). For the structure of a flexible or flexible substrate, the requirements for infiltrating the barrier layer are quite severe. Therefore, for flexible packaging technology, it is important to have a structure or material that can achieve high water resistance and gas barrier requirements.

The present disclosure provides an electronic component package structure including a first substrate, a second substrate, and at least one electronic component. The first substrate has a first surface and a second surface opposite to the first surface, and the electronic component is disposed on the first surface of the first substrate On the surface. The electronic component package structure further includes a glue material disposed on the first substrate and covering the first surface of the electronic component and the first substrate. The second substrate has a third surface and a fourth surface opposite to the third surface, and the second substrate is disposed on the first substrate and the glue. At least one of the first substrate and the second substrate has a gas barrier structure embedded therein, and the first substrate and the second substrate are followed by the glue, so that the electronic component and the gas barrier structure are located Between the first substrate and the second substrate.

The present disclosure provides a method of manufacturing an electronic component package. First, a carrier is provided, and a first substrate is disposed on the carrier, and the first substrate has a first gas barrier layer on the first substrate. . Providing a second substrate disposed on the first gas barrier layer, wherein the second substrate has a second gas barrier layer on the second substrate, and the second substrate and the second gas barrier layer are formed There are multiple ditches. After forming a first gas barrier structure to fill the trenches, an electronic component is disposed on the second gas barrier layer. Next, a cover is provided having a second gas barrier structure projecting from the surface of the cover. A glue material is disposed on the cover plate such that the area of the glue material is the same as the cover plate. The second substrate and the cover plate are followed, the second gas barrier structure of the cover plate is in contact with the first gas barrier structure of the second substrate, and the electronic component is placed on the cover plate and the second substrate between.

The above described features and advantages of the present invention will be more apparent from the following description.

10,12,14,16‧‧‧Electronic component packaging structure

100‧‧‧First substrate

110, 970, 9100‧‧‧ glue

120‧‧‧second substrate

100a, 120a, 160a‧‧‧ upper surface

100b, 120b‧‧‧ lower surface

140‧‧‧Additional substrate

150, 950‧‧‧ electronic components

160‧‧‧hard coating

1100, 5100, 5100B, 5100C, 5100D, 6100, 7100, 8100, 9800‧‧‧ gas barrier structure

5110, 7110‧‧‧ soft core

5120, 7120‧‧‧ flex protection layer

5130, 7130‧‧‧ soft layer

5140, 7140‧‧‧ suction layer

600, 700, 800, 804, 900, 920‧‧‧ substrates

600A‧‧‧Component setting area

70, 80, 90‧‧‧ Vehicles

702, 802‧‧‧ photoresist layer

702a, 802a‧‧‧ patterned photoresist layer

810, 910, 930‧‧‧ gas barrier

980‧‧‧Upper cover

S‧‧‧ Ditch

1A-1E are schematic cross-sectional views showing an electronic component package structure of an embodiment of the present disclosure.

2A-2E are schematic cross-sectional views showing an electronic component package structure according to an embodiment of the present disclosure.

3A-3E are schematic cross-sectional views showing an electronic component package structure according to an embodiment of the present disclosure.

4A-4D are cross-sectional views showing an electronic component package structure according to an embodiment of the present disclosure.

5A-5E are partial enlarged views of a cross section of a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure.

6A-6F are schematic top views of a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure.

7A-7D are schematic cross-sectional views showing respective steps of a method of fabricating a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure.

8A-8D are schematic cross-sectional views showing respective steps of a method of fabricating a substrate having a lateral gas barrier structure according to another embodiment of the present disclosure.

9A-9E are cross-sectional views showing the steps of a method of fabricating a package structure having a lateral gas barrier structure substrate according to an embodiment of the present disclosure.

1A is a cross-sectional view showing an electronic component package structure according to an embodiment of the present disclosure. Figure. This embodiment is described in terms of a flexible or flexible substrate design, but the substrate is not limited to being a flexible or flexible substrate. The electronic component package structure 10 includes at least one first substrate 100, an electronic component 150 disposed on the first substrate 100, a glue 110 disposed on the first substrate 100, and a second substrate 120. The second substrate 120 is disposed on the first substrate 100 and the adhesive material 110. The electronic component 150 is located between the second substrate 120 and the first substrate 100, and the second substrate 120 and the first substrate are disposed. 100 is adhered to the glue 110 and the electronic component 150 is enclosed within the glue 110. The electronic component 150 can be an environmentally sensitive electronic component, such as an active or passive organic light emitting diode (OLED) component, and can be an OLED component that emits light upward or downward.

The second substrate 120 or the first substrate 100 is, for example, a flexible substrate. The material of the flexible substrate may be polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polymethyl. Polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI) or metal foil. The material of the rubber material 110 is, for example, an acrylic resin, an epoxy resin or a silicone rubber, and the type of the rubber material 110 is, for example, a pressure sensitive adhesive material, a filled adhesive material, a heat curing adhesive material or ultraviolet light irradiation. Curing the glue.

The package structure 10 of the electronic component may be a double-sided illumination type device in which the first substrate is transparent. If the package structure 10 is designed as a single-sided illumination type device, at least one substrate (ie, either the first or second substrate) is transparent, and the other substrate may be Transparent, non-transparent or provided with a reflective layer or the like, the light generated by the electronic component 150 can be emitted from one of the first substrate 100 and the second substrate 120.

The first substrate 100 has a lateral gas barrier structure 1100 disposed in the first substrate 100, that is, embedded in the first substrate 100, and when the second substrate 120 is adhered to the first substrate 100, The lateral gas barrier structure 1100 is located below the electronic component 150 between the second substrate 120 and the first substrate 100.

1B-1E are cross-sectional views showing an electronic component package structure according to an embodiment of the present disclosure. The electronic component package structure shown in Figs. 1B-1E is a modification of Fig. 1A. The electronic component package structure 10 further includes an additional substrate 140, which is a functional substrate having functions such as touch, color filter, color conversion, and/or polarization. As shown in FIG. 1B , the additional substrate 140 of the electronic component package structure 10 is located above the upper surface 120 a of the second substrate 120 . The additional substrate 140 is located above the second substrate 120 and the electronic component 150 .

As shown in FIG. 1C, the additional substrate 140 of the electronic component package structure 10 is located on the lower surface 120b of the second substrate 120, between the second substrate 120 and the glue 110, and above the electronic component 150.

As shown in FIG. 1D, the additional substrate 140 of the electronic component package structure 10 is located on the upper surface 100a of the first substrate 100 under the adhesive material 110 and the electronic component 150.

As shown in FIG. 1E, the additional substrate 140 of the electronic component package structure 10 is located on the lower surface 100b of the first substrate 100, under the electronic component 150, and under the first substrate 100.

The additional substrate 140 can be attached to the second substrate 120 or the first substrate 100 through a glue material (not shown). In general, the additional substrate 140 is attached to the second substrate or the first substrate structure, and the additional substrate 140 has an area comparable to the substrate to which it is attached.

The electronic component package structure 10 is designed such that at least the first substrate has a lateral gas barrier structure 1100 embedded in the substrate in a three-dimensional structure, that is, the gas barrier structure 1100 does not protrude from the upper surface 100a of the first substrate 100. It does not protrude from the lower surface 100b, but the buried gas barrier structure 1100 can effectively provide the effect of blocking gas.

2A is a cross-sectional view showing an electronic component package structure according to an embodiment of the present disclosure. This embodiment is described in terms of a flexible or flexible substrate design, but the substrate is not limited to being a flexible or flexible substrate. The difference between the electronic component package structure 12 of FIG. 2A and the package structure 10 of FIG. 1A is mainly that the second substrate 120 has a lateral gas barrier structure 1100 disposed in the second substrate 120, that is, embedded in the second substrate. After the second substrate 120 is adhered to the first substrate 100, the lateral gas barrier structure 1100 is located above the electronic component 150 between the second substrate 120 and the first substrate 100.

Similarly, FIGS. 2B-2E are cross-sectional views showing the electronic component package structure of the embodiment of the present disclosure. The electronic component package structure shown in Figs. 2B-2E is a variation of Fig. 2A. The electronic component package structure 12 further includes an additional substrate 140, which is a functional substrate having functions such as touch, color filter, color conversion, and/or polarization. As shown in FIG. 2B, the additional substrate 140 of the electronic component package structure 12 is located on the upper surface 120a of the second substrate 120. The additional substrate 140 is located on the second substrate 120 and the electronic component 150.

As shown in FIG. 2C, the additional substrate 140 of the electronic component package structure 12 is located on the lower surface 120b of the second substrate 120, between the second substrate 120 and the glue 110, and above the electronic component 150.

As shown in FIG. 2D, the additional substrate 140 of the electronic component package structure 12 is located on the upper surface 100a of the first substrate 100 under the adhesive material 110 and the electronic component 150.

As shown in FIG. 2E, the additional substrate 140 of the electronic component package structure 12 is located on the lower surface 100b of the first substrate 100, under the electronic component 150, and under the first substrate 100.

The electronic component package structure 12 is designed such that the second substrate has a lateral gas barrier structure 1100 embedded in the second substrate 120 in a three-dimensional structure, that is, the gas barrier structure 1100 does not protrude below the second substrate 120. The surface 120b does not protrude from the upper surface 120a, but the buried gas barrier structure 1100 can effectively provide the effect of gas barrier.

3A-3E are cross-sectional views showing an electronic component package structure according to an embodiment of the present disclosure. The difference between the electronic component package structure 14 in FIGS. 3A-3E is mainly in that the first substrate 100 and the second substrate 120 have lateral directions as compared with the package structure 10 of FIGS. 1A-1E or the package structure 12 of FIGS. 2A-2E. The gas barrier structure 1100 is disposed in the lower and second substrates 100, 120, that is, embedded in the first substrate 100 and embedded in the second substrate 120, and when the second substrate 120 and the first substrate 100 are After being adhered, the lateral gas barrier structure 1100 is provided with a barrier above and below the electronic component 150 between the second substrate 120 and the first substrate 100, as shown in FIG. 3A.

As shown in FIG. 3B, an additional substrate 140 is further included, which is a functional substrate having functions such as touch, color filter, color conversion and/or polarization. As shown in FIG. 3B, the additional substrate 140 of the electronic component package structure 14 is located on the upper surface 120a of the second substrate 120. The additional substrate 140 is located above the second substrate 120 and the electronic component 150.

As shown in FIG. 3C, the additional substrate 140 of the electronic component package structure 14 is located on the lower surface 120b of the second substrate 120, between the second substrate 120 and the glue 110, and above the electronic component 150.

As shown in FIG. 3D, the additional substrate 140 of the electronic component package structure 14 is located on the upper surface 100a of the first substrate 100, under the adhesive material 110 and the electronic component 150, and above the first substrate 100.

As shown in FIG. 3E, the additional substrate 140 of the electronic component package structure 14 is located on the lower surface 100b of the first substrate 100, under the electronic component 150, and under the first substrate 100.

The package structure 14 of the electronic component may be a double-sided illumination type device in which the first substrate is transparent. If the package structure 14 is designed as a single-sided illumination type device, at least one substrate (ie, either the first or second substrate) is transparent, and the other substrate may be transparent, non-transparent or provided with a reflective layer, etc. Light generated by the electronic component 150 may be emitted from one of the first substrate 100 and the second substrate 120.

In addition, similar to the electronic component package structure 10 of FIG. 1A, FIGS. 4A-4D are cross-sectional views showing the electronic component package structure of the embodiment of the present disclosure. The electronic component package structure shown in Figures 4A-4D is a simplified version of Figure 1A. Electronic component package structure 16 The method includes a first substrate 100, an electronic component 150 disposed on the first substrate 100, and a glue 110 disposed on the first substrate 100. Compared to the package structure 12 of Figures 2A-2E, the electronic component package structure 16 does not have a second substrate. The electronic component 150 is disposed on the first substrate 100 , between the adhesive material 110 and the first substrate 100 , and the electronic component 150 is encapsulated within the adhesive material 110 . The first substrate 100 has a lateral gas barrier structure 1100 disposed within the first substrate 100, that is, embedded in the first substrate 100. The lateral gas barrier structure 1100 is located under the electronic component 150. The glue 110 is interposed between the first substrate 100. The electronic component package structure 16 further includes a hard coat layer 160 coated on the glue 110 to increase the hardness of the multilayer film package. The material of the hard coat layer 160 is, for example, a colloidal lacquer.

Similarly, the electronic component package structure shown in FIGS. 4B-4D is a structural change of FIG. 4A. The electronic component package structure 16 further includes an additional substrate 140, which is a functional substrate having functions such as touch, color filter, color conversion, and/or polarization. As shown in FIGS. 4B-4D, the additional substrate 140 of the electronic component package structure 16 is located on the upper surface 160a of the hard coat layer 160 on the adhesive material 110 (FIG. 4B), and the additional substrate 140 is located on the first substrate 100. Above the upper surface 100a and between the first substrate 100 and the electronic component 150 (FIG. 4C), or the additional substrate 140 is located above the lower surface 100b of the first substrate 100 and under the electronic component 150 (Fig. 4D).

5A-5E are partial enlarged views of a cross section of a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure. The substrate 100 or 120 has at least one gas barrier structure 5100 It is disposed in the substrate 100 or 120. The gas barrier structure 5100 is a structure in which a plurality of layers of different kinds of materials are stacked. As shown in FIG. 5A, the gas barrier structure 5100 includes at least one soft core 5110 and a flexural protective layer 5120 and a soft layer 5130 which are alternately stacked with each other. The flexural protective layer 5120 and the soft layer 5130 which are alternately stacked are conformally covered by the soft core. Above the 5110, the cross-section is, for example, a slightly trapezoidal three-dimensional structure, and the disclosure is not limited thereto.

In FIGS. 5B-5E, the gas barrier structure includes a soft core 5110 and a flexural protective layer 5120 and a soft layer 5130 which are alternately stacked, and the gas barrier structure further includes at least one getter layer 5140. As shown in the gas barrier structure 5100B of FIG. 5B, the flexible core 5110 may be, for example, sequentially stacked the flexural protective layer 5120, the soft layer 5130, the gettering layer 5140, the soft layer 5130 and the flexural protective layer 5120, and the gettering layer 5140 is located at two softnesses. Between layers 5130, and flex protection layer 5120 can be the outermost layer.

As shown in the gas barrier structure 5100C of FIG. 5C, the gettering layer 5140, the soft layer 5130, the flexural protective layer 5120, the soft layer 5130 and the flexural protective layer 5120 may be stacked, for example, in sequence, and the gettering layer 5140 is located at the soft core. 5110 and soft layer 5130, and flex protection layer 5120 can be the outermost layer.

As shown in the gas barrier structure 5100D of FIG. 5D, the gettering layer 5140, the soft layer 5130, the gettering layer 5140, the soft layer 5130 and the flexural protective layer 5120 may be stacked, for example, in sequence, and the gettering layer 5140 is located at the soft core 5110. Between the soft layer 5130 or the two soft layers 5130, and the flexural protective layer 5120 can be the outermost layer.

The lateral gas barrier structure may also include two different stack designs, as shown in FIG. 5E, the lateral gas barrier structure design includes the three-dimensional structure of the gas barrier structure 5100 of FIG. 5A and The three-dimensional structure of the 5D gas barrier structure 5100D can be alternately arranged at intervals. This design can be adjusted or changed for the difference in gas barrier requirements for different locations of the package structure (eg, the distance from the location where the wafer or electronic component is located or whether it is near the edge, etc.). The lateral gas barrier structure can effectively block the direct transmission of moisture and oxygen to the electronic component, at least prolong the path of contact between the water vapor and the oxygen to the electronic component, and the water gas is not easily penetrated.

In the above, the material of the soft core 5110 or the soft layer 5130 may be small molecular materials, organic oligomers (Oligomers), organic-inorganic metal co-evaporation materials or inorganic metal compound materials. The above organic small molecule compound has a molecular weight of between about 10 g/mol and 2,000 g/mol, such as tris(8-hydroxyquinoline-aluminum, Alq3), N, N'- Bis(naphthalen-1-yl)-N,N'-diphenylbenzidine (N,N'-di(naphthalene-1-y1)-N,N'-diphenyl-benzidine, NPB) or copper phthalocyanine (Phthalocyanine copper complex, CuPc). The organic oligomer has a molecular weight of between about 500 g/mol and 3,000 g/mol, such as Phenylene vinylene oligomers, Fluorene oligomers. The organic-inorganic metal co-evaporation material may be obtained by co-evaporation of the organic material and the metal material, and the molecular weight of the organic-inorganic metal co-evaporation material is between about 3 g/mol and 500 g/mol.

The metal material is, for example, Al, Ag, Au, Be, Cr, Cu, Co, Fe, Ge, Ir, In, Mo, Mn, Mg, Ni, Nb, Pb, Pd, Pt, Ru, Rh, Sn, Si, Sb, Se, Ti, Ta, Te, V, W, Zr, Zn, Mg/Ag, Al/Ag, Al/Si, Al/Si/Cu, Au/Ge, Au/Be, Au/Ge/Ni, Ni/Cr, Pb/Sn or In/Sn.

The inorganic metal compound material is, for example, Al ₂ O ₃ , AlN, BaTiO ₃ , CeO ₂ , Cr ₂ O ₃ , CuO, Dy ₂ O ₃ , Er ₂ O ₃ , Eu ₂ O ₃ , Ga ₂ O ₃ , GeO ₂ , HfO. ₂ , Ho ₂ O ₃ , In ₂ O ₃ , indium tin oxide (ITO), PbTiO ₃ , MgO, MnO ₂ , Nd ₂ O ₃ , NiO, Nb ₂ O ₅ , Pr ₂ O ₃ , Sm ₂ O ₃ , SiO ₂ , SiO, Ta ₂ O ₅ , ThO ₂ , SnO ₂ , TiO ₂ , Y ₂ O ₃ , ZnO, ZrO ₂ , CdTe, ZnTe, CdSe, CdS, ZnS, MoS ₂ , BaF ₂ , MgF ₂ , CaF ₂ Li , MgP, LiF, Li ₂ O, CaO or MgO.

The material of the flexural protective layer 5120 may be an inorganic metal vapor material or a metal material. The metal material is, for example, an Al, Ag, Mg, Mg-Ag or Mg-Al alloy. The inorganic metal oxide material may be, for example, indium tin oxide (ITO), zinc aluminum oxide (AZO), zinc indium oxide (IZO), WO ₃ , MoO ₃ , SiOx, SiNx, SiOxNy, Al ₂ O ₃ . The material of the gettering layer 5140 may be an alkali metal/alkaline earth metal halide such as lithium fluoride (LiF), sodium fluoride (NaF), cesium fluoride (CsF), magnesium fluoride (MgF ₂ ), calcium fluoride. (CaF ₂ ), sodium chloride (NaCl), potassium chloride (KCl), barium chloride (RbCl), magnesium chloride (MgCl ₂ ) or calcium chloride (CaCl ₂ ); alkali metal/alkaline earth metal oxides such as oxidation Lithium (Li ₂ O), cerium oxide (Cs ₂ O), magnesium oxide (MgO), calcium oxide (CaO), LiBO ₂ or K ₂ SiO ₃ ; alkali metal/alkaline earth metal carbonate such as lithium carbonate (Li ₂ CO ₃ ), sodium carbonate (Na ₂ CO ₃ ) or cesium carbonate (Cs ₂ CO ₃ ); or an alkali metal carbonate compound: CH ₃ COOM (M=Li, Na, K, Rb or Cs).

6A-6F are top views of a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure. The gas barrier structure 6100 can be designed with a specific pattern to be embedded in the substrate 600. 6A, 6C and 6E, when the gas barrier structure 6100 is placed on the carrier When the substrate of the element is disposed, the gas barrier structure 6100 is disposed around the component setting region 600A, and the gas barrier structure 6100 is disposed at the peripheral portion of the substrate 600 where the component mounting region 600A is located at the center. The gas barrier structure 6100 of FIG. 6A is, for example, a chevron (top view), arranged outwardly in the substrate 600 at equal or unequal intervals in a concentric manner, and surrounding the component placement region 600A located in the middle. The gas barrier structure 6100 of FIG. 6C is, for example, a discontinuous lattice shape (top view) disposed around the substrate 600 to surround the component placement region 600A located in the middle. The gas barrier structure 6100 of FIG. 6E is, for example, undulating (top view) disposed around the substrate 600 to surround the component placement region 600A located in the middle. Compared with FIGS. 6A, 6C and 6E, FIGS. 6B, 6D and 6F are similar designs, and can be distributed on the entire substrate without the substrate carrying the electronic component or without considering the component mounting region, so as to achieve high resistance. The effect of high gas barrier. The gas barrier structures 6100 of FIGS. 6B and 6E are, for example, square ring-shaped (frame-like) or wavy annular rings arranged outwardly in the substrate 600 at equal or unequal intervals in a concentric manner. The gas barrier structure 6100 of FIG. 6D is disposed, for example, in a discontinuous lattice shape (top view) disposed in the substrate 600, and the gas barrier structure has a size range of, for example, 1 mm to 100 mm.

The gas barrier structure 6100 of the present embodiment is disposed, for example, around the component setting region 600A, thereby effectively improving the ability of the package structure of the electronic component to block moisture and oxygen on all sides. Accordingly, the package structure of the electronic component can have a good ability to block moisture and oxygen. In this embodiment, the gas barrier structure surrounds the periphery of the component mounting region, but according to the spirit of the present invention, in other embodiments, the gas barrier structure may also surround only at least one side of the component setting region (for example, two sides or three Side) setting, end Depending on the requirements of the package structure design.

The gas barrier structure design of the present disclosure is not limited to the geometry, size or number shown. The gas barrier structure of the present embodiment is exemplified by a gas barrier structure having a continuous barrier pattern, but in other embodiments, the gas barrier structure may be composed of a plurality of discontinuous gas barrier structures connected or adjacently arranged. . In addition, in this embodiment, the one or more gas barrier structures are taken as an example for illustration, and the design may be adjusted depending on the position or the packaged electronic components. Even for a plurality of different electronic component package structures, different stack structures (different sections may be adopted). Structure), any combination of different pattern designs (different top view patterns).

7A-7D are schematic cross-sectional views showing respective steps of a method of fabricating a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure. As shown in FIG. 7A, a substrate 700 is provided first. Here, the substrate 700 is, for example, a flexible substrate (such as a polyimide substrate) and is carried on the carrier 70. A photoresist layer 702 is formed on the substrate 700.

As shown in FIG. 7B, the photoresist layer 702 is patterned, for example, by photolithography to form a patterned photoresist layer 702a. Referring to FIG. 7C, the substrate 700 is etched by using the patterned photoresist layer 702a as an etching mask to form a plurality of trenches S. The etching method may include dry etching or wet etching. The depth of the trench S is, for example, 200 to 300 μm, and the interval between the trenches S is, for example, 200 to 300 μm.

As shown in FIG. 7D, different gas barrier materials are sequentially deposited, and the gas barrier materials include materials used for the gettering layer, the soft layer, the flexural protective layer and the like described in the foregoing embodiments, and depending on the requirements of different materials, Such different gas barrier materials are formed by techniques such as chemical deposition, vapor deposition, and the like. The multilayer deposition of the different gas barrier materials is conformal to the trench S The shape and fills the trenches S to form a gas barrier structure 7100. According to the pattern and depth of the trenches S, the pattern and size of the gas barrier structure 7100 can be determined. For example, the step of forming the gas barrier structure 7100 to fill the trenches S includes conformally depositing at least one flexural protective layer 7120, conformally depositing at least one soft layer 7130 and depositing to form a soft core 7110 to form the gas barrier structure. 7100. The step of forming the gas barrier structure 7100 to fill the trenches S further includes depositing at least one gettering layer 7140, and the flexural protective layer 7120 and the soft layer 7130 are stacked on top of the soft core. The subsequent steps may further include forming a flat layer (not shown) covering the uppermost portion of the gas barrier structure to achieve the effect of planarization. The formation of the flat layer is a common step in the process for the flattening, so the subsequent omission will not be repeated.

8A-8D are schematic cross-sectional views showing respective steps of a method of fabricating a substrate having a lateral gas barrier structure according to an embodiment of the present disclosure. As shown in FIG. 8A, a substrate 800 is provided first. Here, the substrate 800 is, for example, a flexible substrate (such as a polyimide substrate) and is carried on the carrier 80. A gas barrier layer 810 (for example, an SiOx layer or a SiNx layer) is formed on the substrate 800 and a photoresist layer 802 is formed on the gas barrier layer 810. Here, the gas barrier layer 810 may be a composite material in which a plurality of layers of different gas barrier materials are stacked, or may be a single material layer. The technical content of the formation of the gas barrier layer can be referred to the foregoing embodiment.

As shown in FIG. 8B, the photoresist layer 802 is patterned, for example, by photolithography to form a patterned photoresist layer 802a. Referring to FIG. 8C, the gas barrier layer 810 is patterned by etching the photoresist layer 810 to form a gas barrier layer 810 to form a gas barrier structure 8100. As shown in FIG. 8D, another substrate 804 is formed over the substrate 800 to enclose the gas barrier structure 8100 between the substrates 800 and 804. The substrate 804 is for example It is a flexible substrate (such as a polyimide substrate).

9A-9E are schematic cross-sectional views showing the steps of a method of fabricating a package structure having a lateral gas barrier structure substrate according to an embodiment of the present disclosure. As shown in FIG. 9A, a substrate 900 is first provided on the carrier 90. A gas barrier layer 910 (for example, an SiOx layer or a SiNx layer), another substrate 920 and another gas barrier layer 930 (for example, an SiOx layer or a SiNx layer) are formed on the substrate 900, and the other substrate 920 and another gas barrier are formed. Layer 930 has a plurality of trenches S formed therein. Here, the substrates 900, 920 are, for example, a flexible substrate (such as a polyimide substrate), which can be directly formed by coating and re-solidification. The gas barrier layers 910 and 930 can be stacked with different gas barrier materials. The composite material can also be a single material layer. The substrate 920 and the gas barrier layer 930 may be patterned by photolithography to form the trenches S. For example, a photoresist pattern (not shown) may be formed on the gas barrier layer 930, and the photoresist pattern is used as a mask to etch the gas barrier layer 930 and the substrate 920 to form a plurality of trenches S. The gas barrier layer 930 formed with the trenches S after patterning can be regarded as a gas barrier structure. The technical content of the formation of the gas barrier layer can be referred to the foregoing embodiment. The lithography, etching steps and fabrication methods are common techniques in the art and are therefore not described here.

Referring to Figure 9B, a glue 9100 is formed that partially or substantially fills the trenches S. The subsequent step may further include forming a flat layer (not shown) covering the uppermost portion of the gas barrier structure to achieve the effect of planarization. Next, an electronic component 950 is disposed over the substrate 920 and the gas barrier layer 930 (in the component mounting region). The electronic component 950 is, for example, an active environmentally sensitive display component, such as an Active Matrix Organic Light Emitting Diode (AMOLED), or a passive environmentally sensitive device. The electronic component display component is, for example, a passive organic light emitting diode (PM-OLED).

As shown in Figure 9C, an upper cover 980 is provided having a lateral gas barrier structure 9800 projecting from its surface 980a. The upper cover 980 is, for example, a flexible substrate, and the gas barrier structure 9800 is protrudedly formed on the surface 980a thereof. Unlike the foregoing embodiment, the gas barrier structure 9800 is not embedded in the upper cover 980. Rather, it protrudes from the surface of the upper cover 980, but otherwise, the gas barrier structure 9800 is not significantly different from other structures, so the pattern structure, material, and formation technique can be referred to the foregoing embodiments. In addition, a glue 970 is disposed on the upper cover 980, and the area thereof can be about the same as the upper cover 980.

As shown in FIG. 9D, the upper cover 980 is mated with the substrate 920, the upper cover 980 is followed by the substrate 920 by the adhesive 970, and the protruding gas barrier structure 9800 of the upper cover 980 is inserted into the adhesive of the substrate 920. In 9100, electronic component 950 is placed between substrate 920 and upper cover 980.

Next, as shown in FIG. 9E, the carrier 90 is removed.

The electronic component package structure of the present disclosure can be electrically connected to a flexible circuit board or a printed circuit board.

In summary, the electronic component package structure of the present disclosure includes a three-dimensional barrier structure of a buried surrounding component mounting region, and the electronic component is disposed in the component setting region, and the barrier structure can effectively block moisture and oxygen transmission, thereby Effectively extend the life of electronic components. In addition, the electronic component package structure of the present disclosure further strengthens the package structure week by matching a rubber material and/or other flexible substrate having a gas barrier function. The gas barrier capability of the edge thus effectively extends or blocks moisture and oxygen from entering the transmission path of the electronic component located in the component placement area. In this way, the life of the electronic component can be effectively extended.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the patent application.

10‧‧‧Electronic component packaging structure

100‧‧‧First substrate

110‧‧‧Stained materials

120‧‧‧second substrate

150‧‧‧Electronic components

1100‧‧‧ gas barrier structure

Claims (30)

An electronic component package structure includes: a first substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the first substrate; a glue material disposed on the first surface a first substrate on the substrate and covering the first surface of the first substrate; and a second substrate disposed on the first substrate and the adhesive material, wherein the second substrate has a third surface and opposite to the a fourth surface of the third surface; wherein at least one of the first substrate and the second substrate has a gas barrier structure buried in the first substrate or the second substrate, and the first substrate is The second substrate is followed by the adhesive material, and the electronic component and the gas barrier structure are located between the first substrate and the second substrate, and the electronic component is disposed on the gas barrier structure. The electronic component package structure of claim 1, further comprising at least one functional substrate on the second surface of the first substrate under the electronic component and below the first substrate, wherein the function The substrate is a touch function substrate, a color filter function substrate, a color conversion function substrate, or a polarizing function substrate. The electronic component package structure of claim 1, further comprising at least one functional substrate on the first surface of the first substrate, under the electronic component and above the first substrate, wherein the function The substrate is a touch function substrate, a color filter function substrate, a color conversion function substrate, or a polarizing function substrate. The electronic component package structure of claim 1, further comprising at least one functional substrate on the fourth surface of the second substrate, located in the electronic component The functional substrate is a touch function substrate, a color filter function substrate, a color conversion function substrate or a polarizing function substrate. The electronic component package structure of claim 1, further comprising at least one functional substrate on the third surface of the second substrate, above the electronic component and the adhesive material, and located on the second substrate The functional substrate is a touch function substrate, a color filter function substrate, a color conversion function substrate or a polarizing function substrate. The electronic component package structure of claim 1, wherein the electronic component comprises an active organic light emitting diode (OLED) component or a passive organic light emitting diode (OLED) component. The electronic component package structure of claim 1, wherein the first substrate or the second substrate is a flexible substrate, and the material of the first substrate or the second substrate is selected from the group consisting of polyethylene to benzene. Polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, polyarylene Polyimide or metal foil. The electronic component package structure according to claim 1, wherein the material of the glue material is an acrylic resin, an epoxy resin or a silicone rubber. The electronic component package structure of claim 1, wherein the gas barrier structure comprises at least a soft core and at least one flexural protective layer interleaved with each other and at least one soft layer conformally over the soft core. The three-dimensional structure formed, The gas barrier structure is buried in the first substrate and/or the second substrate. The electronic component package structure of claim 9, wherein the gas barrier structure further comprises at least one gettering layer and the flexure protective layer and the soft layer are stacked on the soft core. The electronic component package structure according to claim 9, wherein the soft core or the soft layer material is a small molecular material, an organic oligomer (Oligomers), and an organic-inorganic metal co-steamed. Plating material or inorganic metal compound material. The electronic component encapsulation structure according to claim 11, wherein the organic small molecule compound is selected from the group consisting of tris (8-hydroxyquinoline-aluminum, Alq3), N, N. '-Bis(naphthalen-1-yl)-N,N'-diphenylbenzidine (N,N'-bis(naphthalene-1-y1)-N,N'-diphenyl-benzidine, NPB) or phthalocyanine Copper salt (Phthalocyanine copper complex, CuPc). The electronic component encapsulation structure according to claim 11, wherein the organic oligopolymer is Phenylene vinylene oligomers or Fluorene oligomers. The electronic component package structure according to claim 11, wherein the organic-inorganic metal co-evaporation material has a molecular weight of between 3 g/mol and 500 g/mol. The electronic component package structure according to claim 11, wherein the inorganic metal compound material is Al ₂ O ₃ , AlN, BaTiO ₃ , CeO ₂ , Cr ₂ O ₃ , CuO, Dy ₂ O ₃ , Er ₂ O ₃ , Eu ₂ O ₃ , Ga ₂ O ₃ , GeO ₂ , HfO ₂ , Ho ₂ O ₃ , In ₂ O ₃ , indium tin oxide (ITO), PbTiO ₃ , MgO, MnO ₂ , Nd ₂ O ₃ , NiO , Nb ₂ O ₅ , Pr ₂ O ₃ , Sm ₂ O ₃ , SiO ₂ , SiO, Ta ₂ O ₅ , ThO ₂ , SnO ₂ , TiO ₂ , Y ₂ O ₃ , ZnO, ZrO ₂ , CdTe, ZnTe, CdSe , CdS, ZnS, MoS ₂ , BaF ₂ , MgF ₂ , CaF ₂ Li, MgP, LiF, Li ₂ O, CaO or MgO. The electronic component package structure of claim 9, wherein the material of the flexural protective layer is selected from the group consisting of aluminum, silver, magnesium, magnesium silver alloy, magnesium aluminum alloy, indium tin oxide (ITO), and zinc aluminum oxide. (AZO), indium zinc oxide (IZO), WO ₃ , MoO ₃ , SiOx, SiNx, SiOxNy or Al ₂ O ₃ . The electronic component package structure of claim 9, wherein the gas barrier structure comprises a continuous pattern continuously disposed around the electronic component setting region. The electronic component package structure of claim 17, wherein the pattern of the gas barrier structure is a frame pattern, a curved pattern or a combination thereof. The electronic component package structure of claim 9, wherein the pattern of the gas barrier structure is a discontinuous lattice pattern disposed around the electronic component setting region or disposed in a discontinuous lattice pattern. Or a second substrate. A method of manufacturing an electronic component package structure, comprising: providing a substrate on a carrier; forming a plurality of trenches in the substrate; forming a gas barrier structure to fill the first trenches; and forming an electronic component Above the gas barrier structure. The method for manufacturing an electronic component package structure according to claim 20, wherein the trenches have a depth of 200 to 300 micrometers, and between the trenches The interval is between 200 and 300 microns. The method of manufacturing an electronic component package structure according to claim 20, wherein the substrate is a flexible substrate, and the material of the substrate is selected from the group consisting of polyethylene terephthalate and poly. Polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, polyimide or metal foil . The method of manufacturing an electronic component package structure according to claim 20, wherein the step of forming the gas barrier structure to fill the trenches comprises conformally depositing at least one flexural protective layer, conformally depositing at least one soft layer and Depositing a soft core to form the gas barrier structure, so the gas barrier structure comprises a three-dimensional structure formed by the flexible core and the flexural protective layer and the soft layer which are mutually staggered and conformally coated on the soft core. The gas barrier structure is buried in the trenches of the substrate. The method of manufacturing an electronic component package structure according to claim 23, wherein the step of forming the gas barrier structure to fill the trenches further comprises depositing at least one gettering layer, and the flexural protective layer and the soft The layers are stacked on top of each other to coat the soft core. A method of manufacturing an electronic component package structure includes: providing a first substrate on a carrier; forming a first gas barrier layer on the first substrate; forming a plurality of trenches in the first gas barrier layer and Defining a first gas barrier structure on the first substrate; Forming a second substrate covering the first substrate and the first gas barrier structure, the second substrate filling the trenches of the first gas barrier layer; and forming an electronic component on the first gas barrier structure. The method of manufacturing an electronic component package structure according to claim 25, wherein the step of forming a plurality of trenches in the gas barrier layer comprises etching through the first gas barrier layer and removing a portion of the first substrate to form The trenches are disposed in the first substrate, the method further comprising: filling a first adhesive material into the trenches; disposing the electronic component on the first substrate; providing a cover plate having a second gas barrier The structure protrudes from the surface of the cover plate; a second adhesive material is disposed on the cover plate; the first substrate and the cover plate are followed by the electronic component, the first gas barrier structure and the second gas barrier structure Between the cover plate and the first substrate. The method of manufacturing an electronic component package structure according to claim 26, wherein the electronic component comprises an active organic light emitting diode (OLED) component or a passive organic light emitting diode (OLED) component. The method of manufacturing an electronic component package structure according to claim 25, wherein the first substrate or the second substrate is a flexible substrate, and the material of the first substrate or the second substrate is selected from the group consisting of Polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, Polyimide or Metal foil. The method of manufacturing an electronic component package structure according to claim 26, wherein the material of the first or second adhesive material is an acrylic resin, an epoxy resin or a silicone rubber. The method of manufacturing an electronic component package structure according to claim 25, further comprising a third gas barrier layer on the other side of the first substrate relative to the first gas barrier layer.