TWI531519B - Feeding device - Google Patents
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- TWI531519B TWI531519B TW103130134A TW103130134A TWI531519B TW I531519 B TWI531519 B TW I531519B TW 103130134 A TW103130134 A TW 103130134A TW 103130134 A TW103130134 A TW 103130134A TW I531519 B TWI531519 B TW I531519B
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Description
本發明係提供一種供料裝置,尤指一種適用於多層料盤的供料裝置。 The present invention provides a feeding device, and more particularly to a feeding device suitable for a multi-layer tray.
傳統的供料機台包含鍊條式料倉與非鍊條式料倉兩種樣式。由於自動化設備商的常用料盤通常為質地偏軟且易扭曲變形的塑膠材質,若使用非鍊條式料倉,大量料盤堆積時容易造成結構變形而互相卡合,造成自動化設備無法快速順暢的進行供料,需透過人工作業去分離卡住的料盤。若使用的是鍊條式料倉,雖然能解決多個料盤在非鍊條式料倉亦卡合的缺點,但是鍊條式料倉不能提供可支撐機械手臂的操作平台,設備商需另行配置機械手臂在鍊條式料倉的旁側,需耗費較大的設備空間,降低供料取料整體設備的稼動率。 Traditional feeders include both chain and non-chain silos. Since the common trays of the automation equipment manufacturers are usually made of plastic materials which are soft in texture and easy to be distorted, if a non-chain type silo is used, a large number of trays are likely to cause structural deformation and mutual engagement, resulting in rapid and smooth automation equipment. For feeding, manual work is required to separate the jammed trays. If the chain type silo is used, although the disadvantages of multiple trays being engaged in the non-chain silo can be solved, the chain silo cannot provide an operating platform capable of supporting the robot arm, and the equipment manufacturer needs to separately configure the robot arm. On the side of the chain silo, it takes a lot of equipment space and reduces the utilization rate of the overall equipment for feeding and reclaiming.
本發明係提供一種適用於多層料盤的供料裝置,以解決上述之問題。 The present invention provides a feeding device suitable for a multi-layer tray to solve the above problems.
本發明之申請專利範圍係揭露一種供料裝置,其包含支撐架、升降模組、抵擋模組、分離模組以及控制器。升降模組設置於支撐架。升降模組能夠承載多層料盤,並使多層料盤能夠相對支撐架移動至初始位置或取料位置。抵擋模組設置於支撐架。抵擋模組包含至少一抵擋板,能夠抵擋位於取料位置之多層料盤之第一層料盤之上表面。分離模組設置於支撐架且位於 升降模組及抵擋模組之間。分離模組能夠相對支撐架移動至操作位置或非操作位置。分離模組包含分離件。當多層料盤位於取料位置且分離模組位於操作位置時,分離件能夠插入多層料盤之第一層料盤及第二層料盤之間,並承載第一層料盤之下表面。控制器耦接升降模組、抵擋模組及分離模組。當分離模組位於非操作位置時,控制器驅動升降模組,使多層料盤自初始位置移動至取料位置。控制器驅動分離模組移動至操作位置,使分離件承載第一層料盤之下表面。控制器驅動升降模組,使剩餘的多層料盤自取料位置向下移動至初始位置,以將第一層料盤自多層料盤中分離。 The patent application scope of the present invention discloses a feeding device comprising a support frame, a lifting module, a resisting module, a separating module and a controller. The lifting module is disposed on the support frame. The lifting module is capable of carrying a multi-layer tray and enabling the multi-layer tray to be moved relative to the support frame to an initial position or a take-up position. The resisting module is disposed on the support frame. The resisting module includes at least one abutting baffle capable of resisting the upper surface of the first layer of the multi-layer tray located at the reclaiming position. The separation module is disposed on the support frame and located Between the lifting module and the resisting module. The separation module can be moved relative to the support frame to an operating position or a non-operating position. The separation module includes a separate piece. When the multi-layer tray is in the reclaiming position and the separation module is in the operating position, the separating member can be inserted between the first layer tray and the second layer tray of the multi-layer tray and carry the lower surface of the first layer tray. The controller is coupled to the lifting module, the resisting module and the separating module. When the separation module is in the non-operating position, the controller drives the lifting module to move the multi-layer tray from the initial position to the reclaiming position. The controller drives the separation module to move to the operating position such that the separating member carries the lower surface of the first layer of tray. The controller drives the lifting module to move the remaining multi-layer tray downward from the take-up position to the initial position to separate the first layer tray from the multi-layer tray.
本發明之供料裝置係利用升降模組上升或下移托盤來進行上料與下料作業。托盤移到預定的取料位置時,由抵擋模組的抵擋板抵擋在托盤上料盤的上表面提供限位,並透過感測器的定位訊號通知升降模組停止移動托盤。這樣一來,定位在取料位置的料盤可利用抓取模組進行取料,具有較佳的使用便利性。取料完成後,分離模組的分離件插入最上層料盤與其下一層料盤之間的縫隙;此時升降模組帶動托盤下降,最上層料盤被抵擋板與分離件而可維持在取料位置,最上層料盤以外的其它料盤則會隨著托盤下降而分離於作業完的料盤(意即最上層料盤),故可有效避免托盤上的複數個料盤在移動過程中錯位互相卡住,提高供料裝置的操作精確度及運作效率。 The feeding device of the present invention uses the lifting module to raise or lower the tray for loading and unloading operations. When the tray is moved to the predetermined reclaiming position, the resisting plate of the resisting module resists the upper surface of the tray on the tray to provide a limit, and the positioning signal of the sensor notifies the lifting module to stop moving the tray. In this way, the tray positioned at the reclaiming position can be taken by the gripping module, which has better convenience of use. After the reclaiming is completed, the separating piece of the separating module is inserted into the gap between the uppermost layer tray and the lower layer tray; at this time, the lifting module drives the tray to descend, and the uppermost tray is held against the baffle and the separating member. At the material position, the other trays other than the uppermost tray are separated from the finished tray (ie, the uppermost tray) as the tray is lowered, so that multiple trays on the tray can be effectively prevented from moving during the movement. The misalignment is stuck to each other, improving the operation accuracy and operational efficiency of the feeding device.
10‧‧‧供料裝置 10‧‧‧Feeding device
12‧‧‧支撐架 12‧‧‧Support frame
14‧‧‧托盤 14‧‧‧Tray
16‧‧‧升降模組 16‧‧‧ Lifting module
18‧‧‧抵擋模組 18‧‧‧Resistance module
20‧‧‧分離模組 20‧‧‧Separation module
22‧‧‧控制器 22‧‧‧ Controller
24‧‧‧料盤 24‧‧‧Tray
24A‧‧‧第一層料盤 24A‧‧‧First layer tray
24B‧‧‧第二層料盤 24B‧‧‧Second layer tray
26‧‧‧感測器 26‧‧‧Sensor
28‧‧‧抵擋板 28‧‧‧Resist the baffle
30‧‧‧移動機構 30‧‧‧Mobile agencies
32‧‧‧分離件 32‧‧‧Separate parts
34‧‧‧側推機構 34‧‧‧Pushing mechanism
36‧‧‧抓取模組 36‧‧‧Grab module
38‧‧‧把手 38‧‧‧Hands
40‧‧‧門板 40‧‧‧ Door panel
42‧‧‧第一層料盤的上表面 42‧‧‧ Upper surface of the first layer tray
44‧‧‧第一層料盤的下表面 44‧‧‧The lower surface of the first layer of tray
P1‧‧‧初始位置 P1‧‧‧ initial position
P2‧‧‧取料位置 P2‧‧‧Receiving position
P3‧‧‧操作位置 P3‧‧‧Operational position
P4‧‧‧非操作位置 P4‧‧‧Non-operating position
第1圖為本發明實施例之供料裝置將料盤定位於初始位置之示意圖。 Figure 1 is a schematic view showing the feeding device positioning the tray at an initial position according to an embodiment of the present invention.
第2圖為本發明實施例之供料裝置將料盤移往取料位置之示意圖。 Figure 2 is a schematic view showing the feeding device of the embodiment of the present invention moving the tray to the take-up position.
第3圖為本發明實施例之抵擋模組與分離模組分別位於抵擋位置和非操作位置之部分結構示意圖。 FIG. 3 is a partial structural diagram of the resisting module and the separating module respectively located at the resisting position and the non-operating position according to the embodiment of the present invention.
第4圖為本發明實施例之抵擋模組與分離模組分別位於抵擋位置和操作位置之部分結構示意圖。 FIG. 4 is a partial structural diagram of the resisting module and the separating module respectively located at the resisting position and the operating position according to the embodiment of the present invention.
第5圖為本發明實施例之分離模組與料盤分別位於操作位置和初始位置之部分結構示意圖。 FIG. 5 is a partial structural diagram of the separation module and the tray respectively in an operation position and an initial position according to an embodiment of the present invention.
請參閱第1圖至第5圖,第1圖為本發明實施例之供料裝置10將料盤24定位於初始位置P1之示意圖,第2圖為本發明實施例之供料裝置10將料盤24移往取料位置P2之示意圖,第3圖為本發明實施例之抵擋模組18與分離模組20分別位於抵擋位置和非操作位置之部分結構示意圖,第4圖為本發明實施例之抵擋模組18與分離模組20分別位於抵擋位置和操作位置之部分結構示意圖,第5圖為本發明實施例之分離模組20與料盤24分別位於操作位置和初始位置P1之部分結構示意圖。 Please refer to FIG. 1 to FIG. 5 . FIG. 1 is a schematic view showing the feeding device 10 positioning the tray 24 at the initial position P1 according to an embodiment of the present invention, and FIG. 2 is a feeding device 10 according to an embodiment of the present invention. FIG. 3 is a schematic structural view of a portion of the resisting module 18 and the separating module 20 in the resisting position and the non-operating position, respectively. FIG. 4 is a schematic structural view of the embodiment of the present invention. The structure of the resisting module 18 and the separating module 20 are respectively located at the resisting position and the operating position. FIG. 5 is a partial structure of the separating module 20 and the tray 24 respectively located at the operating position and the initial position P1 according to the embodiment of the present invention. schematic diagram.
供料裝置10包含支撐架12、托盤14、升降模組16、抵擋模組18、分離模組20以及控制器22。托盤14結合於升降模組16,用來放置至少一個料盤24、或彼此堆疊的複數個料盤24。升降模組16設置於支撐架12,升降模組16能夠承載多層料盤24,並使該多層料盤24能夠相對支撐架12移動至初始位置P1或取料位置P2。抵擋模組18設置於支撐架12。抵擋模組18包含感測器26、抵擋板28及移動機構30。感測器26位於抵擋板28之一側表面(例如下表面)且與抵擋板28一同設置於移動機構30上。感測器26用以產生感測訊號。移動機構30用以驅動抵擋板28移動並抵擋位於取料位置P2之多層料盤24之第一層料盤24A的上表面42。第一層料盤24A為位於多層料盤24中最上層的料盤。抵擋板28的數量可為至少一個或多個,能夠抵擋位於取料位置P2之多層料盤24之第一層料盤24A的上表面42。感測器26可以僅設置在其中一個抵擋板28的下表面、或設置在每一個抵擋板28的下表面,然不限於此,端視實際需求而定 The feeding device 10 includes a support frame 12, a tray 14, a lifting module 16, a resisting module 18, a separating module 20, and a controller 22. The tray 14 is coupled to the lift module 16 for placing at least one tray 24, or a plurality of trays 24 stacked on each other. The lifting module 16 is disposed on the support frame 12, and the lifting module 16 can carry the multi-layer tray 24, and can move the multi-layer tray 24 relative to the support frame 12 to the initial position P1 or the reclaiming position P2. The resisting module 18 is disposed on the support frame 12 . The resisting module 18 includes a sensor 26, a baffle 28 and a moving mechanism 30. The sensor 26 is located on one side surface (for example, the lower surface) of the abutting shutter 28 and is disposed on the moving mechanism 30 together with the abutting shutter 28. The sensor 26 is used to generate a sensing signal. The moving mechanism 30 is configured to drive the damper 28 to move and resist the upper surface 42 of the first layer of trays 24A of the multi-layer tray 24 at the take-up position P2. The first layer tray 24A is the uppermost tray located in the multilayer tray 24. The number of the abutment baffles 28 can be at least one or more that can withstand the upper surface 42 of the first layer of trays 24A of the multi-layer tray 24 at the take-up position P2. The sensor 26 may be disposed only on the lower surface of one of the abutment baffles 28 or on the lower surface of each of the abutment baffles 28, but is not limited thereto, depending on actual needs.
分離模組20設置於支撐架12且位於升降模組16及抵擋模組18 之間。分離模組20能夠相對支撐架12移動至操作位置P3或非操作位置P4。分離模組20包含分離件32及側推機構34,分離件32設置在側推機構34上。側推機構34用以驅動分離件32能夠插入多層料盤24之第一層料盤24A及第二層料盤24B之間,並承載第一層料盤24A之下表面44。分離件32的數量可為一個或多個,可以鄰近地位於托盤14的單側邊,或分別位於托盤14的對稱側邊,不限於前述實施例所示。當多層料盤24位於取料位置P2且分離模組20位於操作位置P3時,分離件32能夠插入多層料盤24之第一層料盤24A及第二層料盤24B之間,並承載第一層料盤24A之下表面44。控制器22耦接升降模組16、抵擋模組18與分離模組20。當分離模組20位於非操作位置P4時,控制器22驅動升降模組16,使多層料盤24自初始位置P1移動至取料位置P2;接著控制器22驅動分離模組20移動至操作位置P3,使分離件32承載第一層料盤24A之下表面44。控制器22另可驅動升降模組16,使剩餘的多層料盤24自取料位置P2向下移動至初始位置P1,以將第一層料盤24A自多層料盤24中分離,避免複數個料盤24因大量堆積而產生非預期性的錯誤卡合。當分離件32承載第一層料盤24A之下表面44,且控制器22驅動升降模組16移動,使剩餘的多層料盤24移動至初始位置P1,則第一層料盤24A自多層料盤24中分離,抓取模組36能夠抓取第一層料盤24A上的物體。 The separation module 20 is disposed on the support frame 12 and located in the lifting module 16 and the resisting module 18 between. The separation module 20 is movable relative to the support frame 12 to the operating position P3 or the inoperative position P4. The separation module 20 includes a separating member 32 and a side pushing mechanism 34, and the separating member 32 is disposed on the side pushing mechanism 34. The side push mechanism 34 is used to drive the separating member 32 to be inserted between the first layer tray 24A and the second layer tray 24B of the multilayer tray 24 and to carry the lower surface 44 of the first layer tray 24A. The number of the separating members 32 may be one or more, may be adjacently located on one side of the tray 14, or respectively located on the symmetrical side of the tray 14, and is not limited to the foregoing embodiment. When the multi-layer tray 24 is located at the take-up position P2 and the separation module 20 is located at the operation position P3, the separating member 32 can be inserted between the first layer tray 24A and the second layer tray 24B of the multilayer tray 24, and carries the first A lower surface 44 of the tray 24A. The controller 22 is coupled to the lifting module 16 , the resisting module 18 and the separating module 20 . When the separation module 20 is in the non-operating position P4, the controller 22 drives the lifting module 16 to move the multi-layer tray 24 from the initial position P1 to the reclaiming position P2; then the controller 22 drives the separation module 20 to move to the operating position. P3, the separating member 32 carries the lower surface 44 of the first layer tray 24A. The controller 22 can further drive the lifting module 16 to move the remaining multi-layer tray 24 downward from the take-up position P2 to the initial position P1 to separate the first layer tray 24A from the multi-layer tray 24, avoiding plural Unexpected mis-engagement of the tray 24 due to a large accumulation. When the separating member 32 carries the lower surface 44 of the first layer tray 24A, and the controller 22 drives the lifting module 16 to move, and moves the remaining multilayer tray 24 to the initial position P1, the first layer tray 24A is self-multilayered. Separating from the disk 24, the gripping module 36 is capable of grasping objects on the first layer of trays 24A.
如第1圖所示,托盤14及其料盤24處於初始位置P1(位置較低),分離模組20的分離件32處於非操作位置P4,意即分離件32遠離且不接觸料盤24,使用者可透過把手38開啟門板40,以將一個或多個料盤24放上或移出托盤14。如第2圖與第3圖所示,料盤24放進托盤14後,控制器22驅動升降模組16,使升降模組16可帶動托盤14上移,因為分離件32仍位於非操作位置P4,托盤14不會和分離件32產生結構干涉,故托盤14及多層料盤24自初始位置P1可直接被移動到取料位置P2。抵擋模組18移到抵 擋位置且料盤24接觸抵擋模組18時,抵擋板28抵擋位於取料位置P2之多層料盤24之第一層料盤24A的上表面42。與此同時,感測器26感測到第一層料盤24A,感測器26產生感測信號並經由控制器22傳遞至升降模組16,以使升降模組16停止移動使多層料盤24位於取料位置P2。 As shown in Fig. 1, the tray 14 and its tray 24 are in the initial position P1 (lower position), and the separating member 32 of the separation module 20 is in the non-operating position P4, meaning that the separating member 32 is away from the tray 24. The user can open the door panel 40 through the handle 38 to place one or more trays 24 on or off the tray 14. As shown in Figures 2 and 3, after the tray 24 is placed in the tray 14, the controller 22 drives the lifting module 16 so that the lifting module 16 can move the tray 14 up because the separating member 32 is still in the inoperative position. P4, the tray 14 does not interfere with the structure of the separating member 32, so the tray 14 and the multi-layer tray 24 can be directly moved to the take-up position P2 from the initial position P1. The resisting module 18 is moved to arrive In the blocking position and when the tray 24 contacts the resisting module 18, the abutting shutter 28 abuts against the upper surface 42 of the first layer tray 24A of the multilayer tray 24 at the take-up position P2. At the same time, the sensor 26 senses the first layer tray 24A, and the sensor 26 generates a sensing signal and transmits it to the lifting module 16 via the controller 22 to stop the lifting module 16 from moving to make the multilayer tray 24 is located at the take-up position P2.
抓取模組36完成取料動作後,控制器22可驅動分離模組20從第3圖所示的非操作位置P4移到第4圖所示的操作位置P3,使得分離件32能夠插入多層料盤24之第一層料盤24A及一第二層料盤24B之間,使得分離件32承載該第一層料盤24A的下表面44;另外,控制器22還會驅使升降模組16帶動托盤14相對支撐架12下降,意即將剩餘的多層料盤24移動離開取料位置P2。如此一來,第一層料盤24A的上表面42與下表面44分別被抵擋板28和分離件32抵接夾持而可懸空位於取料位置P2,第一層料盤24A以外的剩餘的多層料盤24因重力作用隨著托盤14離開取料位置P2(例如移往初始位置P1),故第一層料盤24A可以輕易地分離於其它下層料盤24,複數個料盤24不會發生互相卡住的現象。 After the gripping module 36 completes the reclaiming operation, the controller 22 can drive the separating module 20 to move from the non-operating position P4 shown in FIG. 3 to the operating position P3 shown in FIG. 4, so that the separating member 32 can be inserted into the multi-layer. Between the first layer tray 24A of the tray 24 and a second layer tray 24B, the separating member 32 carries the lower surface 44 of the first layer tray 24A; in addition, the controller 22 also drives the lifting module 16 The tray 14 is lowered relative to the support frame 12, meaning that the remaining multi-layer tray 24 is moved away from the take-up position P2. As a result, the upper surface 42 and the lower surface 44 of the first layer tray 24A are respectively abutted against the baffle plate 28 and the separating member 32, and can be suspended at the reclaiming position P2, and the remaining portion other than the first layer tray 24A. The multi-layer tray 24 moves away from the take-up position P2 by gravity (for example, to the initial position P1), so the first layer tray 24A can be easily separated from the other lower trays 24, and the plurality of trays 24 are not The phenomenon of mutual jamming occurs.
本案亦可以其他方式進行取料,當升降模組16停止移動使多層料盤24位於取料位置P2時,控制器22可驅動分離模組20從第3圖所示的非操作位置P4移到第4圖所示的操作位置P3,使得分離件32能夠插入多層料盤24之第一層料盤24A及第二層料盤24B之間,則分離件32承載第一層料盤24A的下表面44,接著控制器22驅動升降模組16移動,使剩餘的多層料盤24移動至初始位置P1,則第一層料盤24A自多層料盤24中分離,接著抓取模組36再抓取第一層料盤24A上的物體以完成取料動作,其中第一層料盤24A為位於多層料盤24中最上層的料盤。 In this case, the material can be reclaimed in other ways. When the lifting module 16 stops moving and the multi-layer tray 24 is located at the reclaiming position P2, the controller 22 can drive the separation module 20 to move from the non-operating position P4 shown in FIG. The operation position P3 shown in Fig. 4 enables the separating member 32 to be inserted between the first layer tray 24A and the second layer tray 24B of the multilayer tray 24, and the separating member 32 carries the lower portion of the first layer tray 24A. The surface 44, then the controller 22 drives the lifting module 16 to move, and the remaining multi-layer tray 24 is moved to the initial position P1, and the first layer tray 24A is separated from the multilayer tray 24, and then the grab module 36 is grasped again. The object on the first layer tray 24A is taken to complete the take-up action, wherein the first layer tray 24A is the uppermost tray located in the multilayer tray 24.
在本發明實施例中,供料裝置係利用升降模組上升或下移托盤來 進行上料與下料作業。托盤移到預定的取料位置時,由抵擋模組的抵擋板抵擋在托盤上料盤的上表面提供限位,並透過感測器的定位訊號通知升降模組停止移動托盤。這樣一來,定位在取料位置的料盤可利用抓取模組進行取料,具有較佳的使用便利性。取料完成後,分離模組的分離件插入第一層料盤與其下一層料盤之間的縫隙;此時升降模組帶動托盤下降,第一層料盤被抵擋板與分離件而可維持在取料位置,第一層料盤以外的其它料盤則會隨著托盤下降而分離於作業完的料盤(意即第一層料盤),故可有效避免托盤上的複數個料盤在移動過程中錯位互相卡住,提高供料裝置的操作精確度及運作效率。 In the embodiment of the present invention, the feeding device uses the lifting module to raise or lower the tray. Carrying and unloading operations. When the tray is moved to the predetermined reclaiming position, the resisting plate of the resisting module resists the upper surface of the tray on the tray to provide a limit, and the positioning signal of the sensor notifies the lifting module to stop moving the tray. In this way, the tray positioned at the reclaiming position can be taken by the gripping module, which has better convenience of use. After the reclaiming is completed, the separating member of the separating module is inserted into the gap between the first layer tray and the lower layer tray; at this time, the lifting module drives the tray to descend, and the first layer tray is held against the baffle and the separating member to maintain In the reclaiming position, the trays other than the first layer tray are separated from the finished tray (ie, the first layer tray) as the tray descends, so that multiple trays on the tray can be effectively avoided. In the process of moving, the misalignment is stuck with each other, which improves the operation accuracy and operational efficiency of the feeding device.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10‧‧‧供料裝置 10‧‧‧Feeding device
12‧‧‧支撐架 12‧‧‧Support frame
14‧‧‧托盤 14‧‧‧Tray
16‧‧‧升降模組 16‧‧‧ Lifting module
18‧‧‧抵擋模組 18‧‧‧Resistance module
20‧‧‧分離模組 20‧‧‧Separation module
22‧‧‧控制器 22‧‧‧ Controller
24‧‧‧料盤 24‧‧‧Tray
28‧‧‧抵擋板 28‧‧‧Resist the baffle
32‧‧‧分離件 32‧‧‧Separate parts
36‧‧‧抓取模組 36‧‧‧Grab module
38‧‧‧把手 38‧‧‧Hands
40‧‧‧門板 40‧‧‧ Door panel
P2‧‧‧取料位置 P2‧‧‧Receiving position
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW103130134A TWI531519B (en) | 2014-09-01 | 2014-09-01 | Feeding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW103130134A TWI531519B (en) | 2014-09-01 | 2014-09-01 | Feeding device |
Publications (2)
Publication Number | Publication Date |
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TW201609519A TW201609519A (en) | 2016-03-16 |
TWI531519B true TWI531519B (en) | 2016-05-01 |
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Application Number | Title | Priority Date | Filing Date |
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TW103130134A TWI531519B (en) | 2014-09-01 | 2014-09-01 | Feeding device |
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TW (1) | TWI531519B (en) |
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2014
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