TWI529828B - Apparatus and method for controlling movement of die bonding head - Google Patents

Description

Device and method for regulating movement of die bond joint

The present invention relates to a die bonding machine, and more particularly to an apparatus and method for regulating a die bond joint of a die bonding machine.

Generally, a semiconductor packaging process is as follows: cutting a wafer into a plurality of semiconductor wafers; bonding a semiconductor wafer (or a die) to a glass panel; and bonding the die to the connection pad of the glass substrate by a wire. (connection pads); encapsulating the die itself and the periphery of the die with a thermosetting resin; stamping the desired typeface and pattern on the surface of the thermoplastic resin for encapsulation; and dividing the glass substrate to form a plurality of semiconductor packages.

In the die attach operation of the above semiconductor packaging process, the wafer is firstly subjected to precise detection by several detecting devices in the semiconductor process, and only the crystal grains conforming to the standard are picked up in the die on the wafer (picked up) And carried to a transport rail. The conveyor track is used to move the glass panels to a die attach position. Therefore, when each of the dies is bonded to the glass substrate at the die bonding position, the die bonding unit presses the dies onto the glass panel.

The related operation mode of the die bonding machine for performing die bonding will be additionally described in the specification with reference to FIG. Figure 1 is a partial schematic view of a standard die bonder. As shown in FIG. 1 , the X-axis direction is defined as a direction in which a glass panel is transported along a transport track to a die bonding position, and the Z-axis is defined as a vertical direction in which a die bond 110 moves up and down, and The Y-axis is defined as a die bond 110 between the transfer track and a wafer platform at another location.

Referring to FIG. 1 , the die bonder 100 is used to bond a single die to a corresponding one of the glass substrates. The die bonding machine 100 includes a die bonding head 110, and first to third conveying units 120, 130, and 140, and the first to third conveying units 120, 130, and 140 are respectively used to The die bond joint 110 is conveyed in the X-axis, Y-axis, and Z-axis directions.

The die adhesion joint 110 takes a die from a wafer on the wafer platform, transports the topped die to the die bonding position on the transport track, and then bonds the die to the transport track. Conveyed on the glass panel. For example, the die attach joint 110 includes a suction unit to draw the die from the wafer platform. The suction unit has a vacuum line that sucks the die by a vacuum force provided by the outside. However, the suction unit is not a technical feature to be emphasized by the present invention. Therefore, the detailed description and operation mode of the suction unit will not be repeated here.

At the same time, the die bond 110 must be able to move vertically (Z-axis) above the wafer platform to pick up the die on the wafer, which can also move vertically (Z-axis) above the transport track so that The die is bonded to the glass panel. The first conveying unit 120 controls the movement of the die attaching joint 110 in the vertical direction (Z axis). The first conveying unit 120 can be implemented by a combination of a motor 150 and a ball screw 160.

In addition, the die attach tab 110 must be able to move back and forth between the wafer platform and the transport track to guide the die bond actuation. In this regard, the second transport unit 130 is configured to move the die bond 110 from the wafer platform to the transport track or from the transport track to the wafer platform. The second transport unit 130 can be implemented by a combination of a motor 150 and a ball screw 160. The third conveying unit 140 is configured to convey the die bonding joint 110 in the direction in which the conveying rail is located (the X-axis direction). The third conveying unit 140 can be implemented by a combination of a motor 150 and a ball screw 160.

In the die bonding machine 100 as described above, the die bond 110 is moved in the X-axis, Y-axis, and Z-axis directions by the motor 150 and the ball screw 160 to guide the die bonding operation. However, in the case where the motor is driven at a high speed and subjected to a long time of operation, the ball screw 160 may be deformed. In detail, after a period of movement of the die attaching joint 110 in the X-axis, Y-axis, and Z-axis directions, the temperature of each of the ball screws 160 gradually rises above room temperature. The increased temperature of the ball screw 160 causes expansion of the ball screw 160, thereby causing a change in the die take-up position and die bond position. According to the test results, when the ball screw 160 is actuated for a period of time, the die attaching joint 110 is offset from the correct topping or bonding position by 20 μm to 50 μm on the x and y coordinates. As a result, if the die bond 110 is deviated from the correct pick-up or bonding position by 20 μm to 50 μm due to thermal expansion of the ball screw 160, the jacking or bonding operation cannot be performed normally. Therefore, a method must be provided to compensate for the error caused by the thermal expansion of the ball screw 160.

In view of the above problems in the prior art, it is an object of the present invention to provide a device for regulating the movement of a die bond joint of a die bonder for moving a die bond joint. The deviation of the pick-up position or the bonding position caused by the thermal expansion of the conveying unit can be correctly completed by picking up or bonding a die, and a method is also provided for adjusting the die bond joint of the device. mobile.

Another object of the present invention is to provide a device for regulating the die bond joint, which can directly deviate from the pick-up position or the adhesive position due to thermal expansion of the transport unit for moving the die bond joint. Compensation, while providing a method to adjust the movement of the die bond joint with the device.

In order to achieve the above object, in an embodiment of the invention, a device is provided for regulating a die bond joint, comprising: at least one temperature sensing unit, detecting a plurality of temperatures of the plurality of transport units, and the plurality of transport units are different Moving the die bond joint in the axial direction; a compensation unit compensates for the displacement of the die bond joint according to the temperature detected by the temperature sensing unit; and a drive control unit of the transport unit is adjusted according to the compensation value calculated by the compensation unit The conveying unit moves the die bond to a correct pick-up position or a bonding position.

In another embodiment of the present invention, a device is provided for regulating die bond joint movement, including: a wafer platform, one of which is to be topped on a wafer platform; and a transport track In the Y-axis direction, the wafer platform is separately disposed, wherein the transport track transports the die along an X-axis direction to a corresponding glass panel, and the die bond joint picks up the die from the wafer platform, and the transport is taken up. The die is bonded to a die on the transport track, and the die is bonded to the glass panel conveyed by the transport track; an X-axis ball screw moves the die bond in a horizontal direction in a direction, The direction is the same as the conveying direction of one of the conveying glass panels of the conveying track; a Y-axis ball screw, which moves the die bonding joint horizontally in one direction, and the direction is between the top picking position of the die and the conveying track a Z-axis ball screw, which is a vertical moving die bond joint; at least one temperature sensing unit detects a temperature of at least one of the X-axis ball screw, the Y-axis ball screw, and the Z-axis ball screw; Compensation unit The temperature measured by the sensing unit compensates for displacement of at least one of the X-axis ball screw, the Y-axis ball screw and the Z-axis ball screw; and the driving control unit of the conveying unit calculates one of the X-axis compensation values according to the compensation unit At least one of a ball screw, a Y-axis ball screw and a Z-axis ball screw to move the die bonding unit to a correct pick-up position or a bonding position.

In one embodiment, the present invention further provides a method for controlling the movement of a die bond joint of a die bonder, wherein the die bonder has a plurality of transfer units for moving the die in more than one direction The adhesive joint method includes: instantly detecting the temperature of the conveying unit; determining a compensation value according to the detected temperature to compensate the displacement of the die bonding joint to set the die bonding joint to the correct one of the topping positions Or a bonding position; and controlling the operation of the conveying unit according to the determined compensation value.

As described above, in a device for regulating a die bond joint of the present invention, the temperature of the transport unit for moving the die bond joint can be detected immediately. When the measured temperature is within a range that causes the thermal expansion of the transport unit, the device will compensate for the offset of the die lift or die bond position due to thermal expansion. Therefore, the accuracy of the die picking and die bonding operation can be improved.

Furthermore, in the present invention, the compensation operation provided by the thermal displacement caused by the offset of the die-carrying position or the die-bonding position of the die-bonding joint can be achieved by reading the compensation value, wherein the compensation is achieved. The values are based on the measured temperature changes. In this way, the offset of the die pick-up position or the die bond position can be quickly compensated.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a device and a method for regulating the movement of a die bond joint according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. In the above, a detailed description of the known function or structure of the die-bonded joint is not intended to be emphasized by the present invention, and will be omitted.

2 is a system for regulating the movement of a die bonding head (hereinafter, simply referred to as a "head movement control apparatus") according to an embodiment of the present invention. Block diagram. The mechanical structure of the adhesive joint movement control device is shown in Figure 1.

Referring to FIG. 2, in the embodiment of the present invention, the adhesive joint movement regulating device includes a die bonding joint 110 and first to third conveying units 120, 130 and 140, and first to third conveying units 120. , 130 and 140 are used to transport the die bond 110 along the X, Y and Z axes.

The die attach tab 110 takes a die from a wafer placed on the wafer platform 170. Subsequently, the die bond joint 110 transports the topped die to a die bond location on a transfer track 180. The die attach joint 110 then bonds the die to a glass panel 190 that is transported through the transport track 180.

For example, the wafer platform 170 is a location where a wafer is placed, and the wafer has a die to be taken. Wafer platform 170 is preferably located on the Y-axis and is positioned differently than the body position of the adhesive joint movement control device. In one embodiment, the wafer platform 170 is integrated with the adhesive joint movement control device. The transport track 180 is also located at a location on the Y-axis that is different from the wafer platform 170. The transport track 180 is used to transport the glass panel 190 to which the die is bonded in the X-axis direction.

In addition to this, the die bond 110 must be transported in the vertical direction to pick up the die. Furthermore, the die bond 110 must be transported in the vertical direction to guide the die bond. The first conveying unit 120 is responsible for conveying the die attaching joint 110 in the vertical direction (Z-axis direction). As shown in FIG. 1, the first transport unit 120 is implemented by a combination of a motor 150 and a ball screw 160.

In addition, the die attach tab 110 must be able to move back and forth between the wafer platform 170 and the transport track 180 to guide the die bond actuation. In this regard, the second transport unit 130 is configured to transport the die bond 110 from the wafer platform 170 to the transport track 180 or from the transport track 180 to the wafer platform 170 in the Y-axis direction.

The second transport unit 130 can also be implemented by a combination of a motor 150 and a ball screw 160. Of course, the third conveying unit 140 can also be implemented by a combination of a motor and a ball screw. The third conveying unit 140 is configured to convey the die bonding joint 110 in the direction in which the conveying rail 180 is located (X-axis direction).

In an embodiment of the invention, the structure of the adhesive joint movement control device as described above further comprises more than one temperature sensing unit 200 and 210, a compensation unit 220 and a transport unit drive control unit (transport-unit-drive- Control unit) 230. The temperature sensing units 200 and 210 are respectively configured to detect the temperatures of the second and third conveying units 130 and 140, wherein the second and third conveying units 130 and 140 are used along different axial directions (X-axis and Y). The die bond joint 110 is conveyed on the shaft. The compensation unit 220 compensates for the displacement of the die bonding joint 110 according to the temperature of the second and third conveying units 130 and 140 measured by the temperature sensing units 200 and 210. The conveying unit driving control unit 230 adjusts the first, second and third conveying units 120, 130 and 140 according to the compensation value calculated by the compensation unit 220, and moves the die bonding joint 110 to the correct one of the picking positions or Bonding position.

In detail, the temperature sensing units 200 and 210 respectively detect the temperatures of the ball screws 160 of the second and third conveying units 130 and 140, respectively. Each of the temperature sensing units 200 and 210 can be implemented by an infrared temperature sensor that detects the corresponding ball screw 160 in a non-contact manner or by a thermocouple. The temperature of the ball screw 160 is detected by contact. In addition, since the ball screw 160 of each of the conveying units 130 and 140 is sleeved on a mounting unit, the temperature sensing units 200 and 210 can detect the temperature of the mounting unit to compensate the die adhesion. The displacement of the joint 110.

As shown in FIG. 2, although the two temperature sensing units 200 and 210 are used to detect only the temperature of the ball screw 160 of the second and third conveying units 130 and 140, an additional temperature sense can be set. The measuring unit is configured to detect the temperature of the first conveying unit 120.

In addition, the compensation unit 220 includes a memory in which a value for converting to a position compensation value is detected, and the temperature of the temperature sensing unit 200 and 210 is detected, and the die bonding joint 110 is based on the compensation value at the X. Move in the direction of the axis and Y axis. In a variation of an embodiment, the compensation unit 220 obtains a compensation by calculating a difference between a reference temperature (eg, room temperature 27 ° C) and the temperature measured by the temperature sensing units 200 and 210. The compensation constants are multiplied by the base coordinate data (x, y) and finally the compensation values are obtained.

For example, the position compensation values stored in the memory are listed in the following table.

As shown in the above table, it can be seen that when the ball screw is measured to be 27 ° C, it is not necessary to compensate for the topping position and the bonding position. If the measured ball screw is 30 °C, for the top take position, the corresponding reference position (x, y coordinate is (0,0)), -15 μm on the X axis, and -30 on the Y axis coordinate Mm. In this way, corresponding to the measured temperature, the compensation values required for the offset position and the bonding position are listed and stored in the memory, by reading the compensation value corresponding to the measured temperature and according to the compensation value. The moving die bond joint 110 can quickly compensate for the displacement of the die picking position and the die bonding position.

On the other hand, the calculation of the compensation value is to obtain a compensation constant corresponding to the difference between the reference temperature (for example, room temperature 27 ° C) and the temperature measured by the temperature sensing units 200 and 210, when the compensation constant is based on Multiplying the coordinate data (x, y) can reduce the amount of data stored, but the compensation constant must be added to the base coordinate data separately, thus increasing the load of the compensation unit 220.

Please refer to the above table again, and after drawing the conclusions, the x and y coordinate systems of the topping position and the bonding position will change regularly with every 1 °C. In this regard, the base coordinate data (x, y) of the pick-up position is set to (-5, -10), and the base coordinate data (x, y) of the sticking position is set to (-2, -10). Next, the difference between the temperature measured by the temperature and temperature sensing units 200 and 210 is referred to as a compensation constant, and the compensation constant is multiplied by the preset base coordinate data to obtain a compensation value to be offset.

The related operation of the adhesive joint movement control device having the above structure will be further described with reference to FIG.

FIG. 3 is a flow chart of a method for compensating a pick-up position and a bonding position of a die bond joint 110 according to an embodiment of the invention.

Referring to FIG. 3, assuming that the adhesive joint movement regulating device is normally operated, the wafer platform 170 is located in the Y-axis direction with respect to the die bonding joint 110, and by the second conveying unit 130, the die bonding joint 110 The system is moved to a pick-up position on the wafer platform 170. The topping position is a preset value stored in the conveying unit driving regulation unit 230. After the die bond joint 110 is successfully moved to the jacking position, the die bond joint 110 is moved by the first transport unit 120 in the Z-axis direction, that is, moved downward, and then a die is taken up, as by step S10.

The die bonding die 110 of the top picking die is further moved by the second conveying unit 130 to the bonding position on the conveying rail 180, and the conveying rail 180 is disposed substantially in the Y-axis direction with respect to the die bonding joint 110. The die attach tabs 110 above the transport track 180 are spaced a predetermined distance from the glass panel 190 on the transport track 180. After the die bonding joint 110 is completely moved to the bonding position on the conveying rail 180, the die bonding joint 110 is further moved downward by the first conveying unit 120 by a predetermined distance. Thus, after the die bond 110 is moved downward by a predetermined distance, the die can be bonded to the glass panel 190 through a predetermined pressure.

After the die-bonding die bonding joint 110 is completed, the die bonding joint 110 is repeatedly placed in the vertical direction (Z-axis direction) and the horizontal direction (X-axis direction and Y by the first conveying unit 120 and the second conveying unit 130). Move in the direction of the axis, repeat the same topping and bonding action.

The first, second, and third transfer units 120, 130, and 140 are deformed by thermal expansion during continuous actuation of the die and bonding.

In order to solve the problem of the deformation of the ball screw, in an embodiment of the invention, in step S14, the temperature sensing units 200 and 210 immediately detect the corresponding ball screw 160. During the operation of the die topping and bonding, the temperature of the ball screw 160 is immediately detected via the temperature sensing units 200 and 210 and the data is transmitted to the compensation unit 220. In step S16, the temperature of the ball screw 160 is detected according to the temperature sensing units 200 and 210, so that the compensation unit 220 determines a compensation value to position the die bonding joint 110 at a correct jacking position or bonding position, and then The determined compensation value is transmitted to the transport unit drive regulation unit 230. For example, if the temperature sensing unit 200 measures that the temperature of the ball screw 160 of the second conveying unit 130 is 30 ° C, as shown in the table, the compensation value of the picking position and the bonding position read by the compensation unit 220 is (-15/30) and (-6/30), and these compensation values are transmitted to the transport unit drive regulation unit 230.

Next, in step S18, the transport unit driving control unit 230 determines that the die attaching joint 110 performs the die topping action or the die attaching action, and selects the compensation value as (-15/30) or (-6) according to the determination result. /-30), and then compensate the position of the die bond joint 110 according to the selected compensation value.

For example, if the die bonding joint 110 is to perform the die topping operation, the conveying unit driving control unit 230 selects the compensation value for compensating the topping position from the received compensation value (-15/- 30). Thereafter, the transport unit driving control unit 230 regulates the second transport unit 130 and the third transport unit 140 such that the die attaching joint 110 offsets the compensation value (-15/-30) from the preset top take-off point (0, 0). Move to another point later.

In this way, when the die pick-up position or the die bonding position is compensated, the ball screw 160 of the second and third conveying units 130 and 140 is caused by thermal expansion, that is, the die picking or The problem of the error in the adhesion actuation can be significantly improved. For example, when the device in the embodiment of the present invention is in operation, the die topping step S10, the die bonding step S12, the instantaneous temperature detecting step S14, the determining position compensation value step S16, and the position compensation step S18 are repeatedly carried out.

As described above, in the apparatus for regulating the movement of the die bond joint of the present invention, the temperature of the transport unit responsible for moving the die bond joint is detected instantaneously. When the measured temperature is within the range of thermal expansion of the conveying unit, the adhesive joint movement control device compensates for the deviation of the crystal picking position and the grain bonding position caused by thermal expansion. Therefore, the accuracy of the die topping operation and the die bonding operation can be improved.

In addition, in the present invention, compensation for the offset of the grain pick-up position or the die-bonding position of the die-bonded joint caused by thermal expansion can be obtained by reading the compensation value corresponding to the measured temperature transition. To implement. Therefore, the die pick-up position or the die bond position can be quickly compensated.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

100. . . Die bonding machine

110‧‧‧ die bonded joint

120‧‧‧First conveyor unit

130‧‧‧Second transport unit

140‧‧‧ Third transport unit

150‧‧‧Motor

160‧‧‧Ball screw

170‧‧‧ Wafer Platform

180‧‧‧Transportation track

190‧‧‧glass panel

200, 210‧‧‧ Temperature Sensing Unit

220‧‧‧Compensation unit

230‧‧‧Conveyor unit drive control unit

S10~S20‧‧‧Steps

Figure 1 is a partial schematic view of a standard die bonding machine;

2 is a system block diagram of an apparatus for regulating a die bond joint according to an embodiment of the present invention;

3 is a flow chart of an embodiment of a method for compensating for a pick-up position and a bonding position of a die bond joint according to an embodiment of the invention.

110. . . Die bonding joint

120. . . First conveying unit

130. . . Second conveying unit

140. . . Third conveying unit

170. . . Wafer platform

180. . . Transport track

190. . . Glass panel

200, 210. . . Temperature sensing unit

220. . . Compensation unit

230. . . Conveyor unit drive control unit

Claims (9)

The device for regulating the movement of a die bond joint comprises: at least one temperature sensing unit detecting a plurality of transport units, wherein the transport units move in different axial directions with respect to the die bond joint, wherein the transport The unit includes a motor and a ball screw, and the temperature sensing unit detects a temperature of the ball screw, and the ball screw moves the die bond joint in one of an X axis, a Y axis and a Z axis; a compensation unit that compensates for the displacement of the die bond joint according to the temperature detected by the temperature sensing unit; and a transport unit drive control unit that calculates the compensation value according to the compensation unit The unit moves the die bond to the correct pick-up position or a bond position. The device of claim 1, wherein the die bond is disposed in a die bonder, the die bonder picks up a die and mounts the die on a transport a glass panel of a track, the apparatus further comprising: an X-axis ball screw that moves the die bond joint horizontally in one direction, the direction being the same as the direction of transport of the glass panel along one of the transport tracks; a shaft ball screw that moves the die bond in a horizontal direction in a direction between a picking position of the die and the transport track; a Z-axis ball screw that vertically moves the die Adhesive joint; The temperature sensing unit detects a temperature of the Y-axis ball screw. The device of claim 1, wherein the compensation unit comprises a memory, and the complex compensation value in the memory corresponds to the measured complex temperature, and the compensation values are converted according to the temperature, so that The die bond joint moves in the X-axis direction and the Y-axis direction. A device for regulating movement of a die bond joint includes: a wafer platform on which a die is to be placed on the wafer platform; and a transport track coupled to the Y-axis direction and the crystal The circular platform is separately disposed, and the conveying track conveys a glass panel bonded to the die along an X-axis direction, the die bonding joint takes the die from the wafer platform, and conveys the die that is taken up to Located in a die bonding position of the conveying track, and the die is bonded to the glass panel conveyed by the conveying track; an X-axis ball screw that moves the die bonding joint horizontally in one direction, the direction And the glass panel is transported in the same direction along one of the transport rails; a Y-axis ball screw that horizontally moves the die bond joint between the wafer platform and the transport track; a Z-axis ball screw, which is vertical Moving the die bond joint; at least one temperature sensing unit detecting a temperature of at least one of the X-axis ball screw, the Y-axis ball screw, and the Z-axis ball screw; and a compensation unit sensing the temperature The temperature measured by the unit, the compensation The compensation element X axis ball screw, the ball screw and the Y-axis of the Z-axis ball screw displacement of one of at least one; and a driving control unit of the conveying unit, wherein the compensation unit calculates a compensation value to adjust at least one of the X-axis ball screw, the Y-axis ball screw and the Z-axis ball screw to move the die bonding unit to the correct one A top picking position or a bonding position. The device of claim 4, wherein the temperature sensing unit detects a temperature of the Y-axis ball screw. The device of claim 5, wherein the Y-axis ball screw is disposed on a body of the device by a mounting unit, and the temperature sensing unit detects a temperature of the mounting unit. A method for controlling a die bonding joint of a die bonding machine, wherein the die bonding machine has a plurality of conveying units for moving the die bonding joints in one direction or more, wherein the conveying units are respectively The method includes: detecting a temperature of one of the ball screws of each of the conveying units; determining a compensation value according to the detected temperatures to compensate a position of the die bonding joint Positioning the die bonder in a correct pick-up position or a bonding position, and moving the die screw in one of an X-axis, a Y-axis, and a Z-axis; and The compensation value determined determines the actuation of the conveyor unit. The method of claim 7, wherein the determining the compensation value comprises reading the compensation value corresponding to the measured temperature in a memory, and the compensation value in the memory is corresponding. The temperature conversion causes the die bond joint to move along the X axis and the Y axis. The method of claim 7, wherein the determining the compensation value comprises calculating the compensation value, wherein the reference temperature and the complex difference between the temperatures correspond to a complex compensation constant, and the compensation constants are multiplied Take the base coordinate data (x, y).