TWI526575B - Method for forming metal layer on board - Google Patents

Method for forming metal layer on board Download PDF

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TWI526575B
TWI526575B TW103119106A TW103119106A TWI526575B TW I526575 B TWI526575 B TW I526575B TW 103119106 A TW103119106 A TW 103119106A TW 103119106 A TW103119106 A TW 103119106A TW I526575 B TWI526575 B TW I526575B
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plating
metal
layer
sheet material
producing
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TW103119106A
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TW201544627A (en
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陳政欣
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欣泉光印股份有限公司
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Description

板材表面金屬生成製造方法 Sheet metal forming manufacturing method

本發明係有關於一種於板材表面生成金屬的製造方法。 The present invention relates to a method of producing a metal on the surface of a sheet.

習知板材表面生成金屬層的製程中,係先將板材浸於硫酸槽中進行酸洗以將板材表面侵蝕增加附著力,再以電鍍方式將板材表材鍍上一層金屬層。 In the process of forming a metal layer on the surface of the plate, the plate is first immersed in a sulfuric acid tank for pickling to increase the adhesion of the surface of the plate, and then the plate material is plated with a metal layer by electroplating.

然而,酸洗的步驟會造成相當大的污染,且酸洗步驟必然使整個板材均會受到電鍍作用而形成金屬層,因此若要在板材表面形成圖樣或文字,必須再經過顯影或蝕刻等步驟,相當耗時耗力且成本過高。 However, the pickling step causes considerable contamination, and the pickling step inevitably causes the entire sheet to be plated to form a metal layer. Therefore, if a pattern or text is to be formed on the surface of the sheet, it must be subjected to development or etching. It is quite time consuming and costly.

本發明之主要目的在於提供一種板材表面金屬生成製造方法,能避免習用酸洗造成的污染,並形成所需圖樣或文字的金屬層。 The main object of the present invention is to provide a method for producing metal on the surface of a sheet material, which can avoid contamination caused by conventional pickling and form a metal layer of a desired pattern or text.

為達成上述目的,本發明提供一種板材表面金屬生成製造方法,包含以下步驟:備料:製備一板材;被覆油墨:將一含有金屬的導電觸媒油墨被覆於該板材至少部分表面形成一油墨層;烘乾:將該油墨層烘乾使油墨與板材結合固定;化鍍:將該板材浸入一化鍍槽中進行化學電鍍,該化鍍槽中裝有一化鍍溶液,該化鍍溶液的成分包含水、鹼、銅離子以及醛類 化合物,銅離子受到該油墨層的催化而被還原為銅原子附著於該板材上形成一化鍍銅層。 In order to achieve the above object, the present invention provides a method for producing a metal surface on a sheet material, comprising the steps of: preparing a sheet; coating the ink: coating a metal-containing conductive catalyst ink on at least part of the surface of the sheet to form an ink layer; Drying: drying the ink layer to fix the ink and the plate; and plating: immersing the plate in a plating tank for chemical plating, wherein the plating bath is provided with a plating solution, and the composition of the plating solution comprises Water, alkali, copper ions and aldehydes The compound, copper ions are catalyzed by the ink layer and reduced to copper atoms attached to the plate to form a copper plating layer.

藉此,油墨層僅被覆於板材上特定表面,且僅有油墨層會進行電鍍反應而能形成特定圖樣或文字的金屬層,且可避免酸洗造成的污染。 Thereby, the ink layer is only coated on a specific surface of the board, and only the ink layer is subjected to an electroplating reaction to form a metal layer of a specific pattern or character, and contamination by pickling can be avoided.

S1‧‧‧備料 S1‧‧‧ Preparation

S2‧‧‧被覆油墨 S2‧‧‧coated ink

S3‧‧‧烘乾 S3‧‧‧Drying

S4‧‧‧清洗 S4‧‧‧ cleaning

S5‧‧‧化鍍 S5‧‧‧ plating

S6‧‧‧電鍍 S6‧‧‧ plating

S7‧‧‧上漆 S7‧‧‧ Painted

S8‧‧‧研磨 S8‧‧‧ grinding

S9‧‧‧上保護漆 S9‧‧‧protective paint

圖1係本發明之步驟流程圖。 Figure 1 is a flow chart of the steps of the present invention.

以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。 The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

請參考圖1,本發明提供一種板材表面金屬生成製造方法,包含以下步驟:備料S1:製備一板材,其中該板材的材料係選自由聚酯與鋼砂混製之材料、PET塑料、ABS塑膠、PC塑料、矽酸鈣板、塑膠薄膜、陶瓷玻璃纖維板以及碳纖維材所組成的群組。 Referring to FIG. 1 , the present invention provides a method for producing metal on the surface of a sheet material, comprising the following steps: preparing S1: preparing a sheet, wherein the material of the sheet is selected from the group consisting of polyester and steel sand, PET plastic, ABS plastic. , PC plastic, calcium silicate board, plastic film, ceramic fiberglass board and carbon fiber material group.

被覆油墨S2:將一含有金屬的導電觸媒油墨被覆於該板材至少部分表面形成一油墨層,更明確來說,該導電觸媒油墨係以噴、塗、淋膜或印刷的方式被覆於該板材表面,該導電觸媒油墨包含鈀金屬粒子。特別要說明的是,該導電觸媒油墨可僅被被覆於該板材表面的部分位置以呈現特殊花紋或文字。 Coating ink S2: coating a metal-containing conductive catalyst ink on at least part of the surface of the plate to form an ink layer, more specifically, the conductive catalyst ink is sprayed, coated, coated or printed On the surface of the sheet, the conductive catalyst ink contains palladium metal particles. In particular, the conductive catalyst ink may be applied only to a portion of the surface of the sheet to present a special pattern or text.

烘乾S3:將該油墨層烘乾使油墨與板材結合固定,於本發明主要實施例中,係於攝氏80至150度的溫度下烘乾。 Drying S3: drying the ink layer to bond the ink to the board, and in the main embodiment of the invention, drying at a temperature of 80 to 150 degrees Celsius.

清洗S4:以水將該板材的表面清洗乾淨,其中用於清洗的 水中可添加約0.1%的還原劑已加速後續還原速度。 Cleaning S4: clean the surface of the board with water, which is used for cleaning The addition of about 0.1% of reducing agent to the water has accelerated subsequent reduction rates.

化鍍S5:將該板材浸入一化鍍槽中進行化學電鍍,該化鍍槽中裝有一化鍍溶液,該化鍍溶液的成分包含水、鹼、銅離子以及醛類化合物,銅離子受到該油墨層的催化而被還原為銅原子附著於該板材上形成一化鍍銅層,於本實施例中,該醛類化合物為甲醛,其中銅離子係於鹼環境下受到鈀金屬的催化而被甲醛還原為銅金屬而沉積於該基板上,該化鍍銅層的厚度能藉浸泡時間來控制。 S5: the plate is immersed in a plating bath for chemical plating, and the plating bath is provided with a plating solution, the composition of the plating solution comprises water, alkali, copper ions and aldehyde compounds, and the copper ions are subjected to The oxidization of the ink layer is reduced to copper atoms attached to the plate to form a copper plating layer. In this embodiment, the aldehyde compound is formaldehyde, wherein the copper ions are catalyzed by palladium metal in an alkaline environment. The formaldehyde is reduced to copper metal and deposited on the substrate, and the thickness of the copper plating layer can be controlled by the soaking time.

電鍍S6:將該板材浸入一電解槽中並通電進行電鍍使電解 槽中的金屬離子附著於該化鍍銅層之上而形成一電鍍金屬層,該電鍍槽中裝有一電鍍溶液,於本實施例中,該電鍍溶液的成分包含硫酸銅(約175-220g/L)、硫酸(約90-110g/L)、氯離子(約60-80ppm)與水,藉此電鍍溶液,能於該化鍍銅層上形成另一電鍍銅層,以加強銅金屬的硬度、耐磨度與金屬色澤。 Electroplating S6: immersing the plate in an electrolytic cell and energizing it for electrolysis Metal ions in the groove are attached to the copper plating layer to form a plating metal layer. The plating bath is filled with a plating solution. In this embodiment, the composition of the plating solution contains copper sulfate (about 175-220 g/ L), sulfuric acid (about 90-110g / L), chloride ion (about 60-80ppm) and water, by which a plating solution can form another electroplated copper layer on the copper plating layer to strengthen the hardness of the copper metal , wear resistance and metallic color.

上漆S7:係於該電鍍金屬層至少部分塗布、噴灑或形成一黑漆層。 Lacquering S7: at least partially coating, spraying or forming a black lacquer layer on the electroplated metal layer.

研磨S8:以手動或動力工具對該黑漆層進行研磨,使該電鍍金屬層與該化鍍銅層部分顯露,銅金屬與黑漆混合而使該板材顯露較為自然的古銅色澤。 Grinding S8: grinding the black lacquer layer with a manual or power tool to partially expose the plated metal layer and the copper plated layer, and mixing the copper metal with the black lacquer to expose the plate to a more natural bronze color.

上保護漆S9:於該板材上被覆一保護漆以避免該化鍍銅層與該電鍍金屬層氧化,其中該保護漆為一透明亮漆。 The upper protective paint S9: a protective paint is coated on the plate to avoid oxidation of the copper plating layer and the plating metal layer, wherein the protective paint is a transparent lacquer.

經過上述步驟,即可提供一具有特定花紋或文字古銅金屬層的板材,其鍍層細緻且無空隙,且無須經過酸洗浸泡而可避免污染,較為 環保,且電解槽中的溶液經過電解還可將金屬還原出來以利重複利用。 Through the above steps, a plate with a specific pattern or a letter bronze metal layer can be provided, which is finely plated and has no voids, and can be prevented from being contaminated by pickling soaking. Environmentally friendly, and the solution in the electrolytic cell can be reduced by electrolysis to facilitate recycling.

S1‧‧‧備料 S1‧‧‧ Preparation

S2‧‧‧被覆油墨 S2‧‧‧coated ink

S3‧‧‧烘乾 S3‧‧‧Drying

S4‧‧‧清洗 S4‧‧‧ cleaning

S5‧‧‧化鍍 S5‧‧‧ plating

S6‧‧‧電鍍 S6‧‧‧ plating

S7‧‧‧上漆 S7‧‧‧ Painted

S8‧‧‧研磨 S8‧‧‧ grinding

S9‧‧‧上保護漆 S9‧‧‧protective paint

Claims (10)

一種板材表面金屬生成製造方法,包含以下步驟:備料:製備一板材;被覆油墨:將一含有金屬的導電觸媒油墨被覆於該板材至少部分表面形成一油墨層;烘乾:將該油墨層烘乾使油墨與板材結合固定;化鍍:將該板材浸入一化鍍槽中進行化學電鍍,該化鍍槽中裝有一化鍍溶液,該化鍍溶液的成分包含水、鹼、銅離子以及醛類化合物,銅離子受到該油墨層的催化而被還原為銅原子附著於該板材上形成一化鍍銅層;其中於「烘乾」步驟後另經過一「清洗」的步驟再繼續進行「化鍍」之步驟,其中於「清洗」步驟中,係以水將該板材的表面清洗乾淨。 A method for manufacturing a metal surface of a sheet material comprises the steps of: preparing a sheet; preparing a sheet; coating the ink: coating a conductive catalyst ink containing metal on at least part of the surface of the sheet to form an ink layer; drying: drying the ink layer Drying and fixing the ink and the plate; plating: immersing the plate in a plating tank for chemical plating, the plating bath is provided with a plating solution, and the composition of the plating solution comprises water, alkali, copper ions and aldehyde a compound, copper ions are catalyzed by the ink layer and reduced to copper atoms attached to the plate to form a copper plating layer; wherein after the "drying" step, a "cleaning" step is followed by further "chemical" The step of plating, wherein in the "cleaning" step, the surface of the plate is cleaned with water. 如請求項1所述之板材表面金屬生成製造方法,其中該板材的材料係選自由聚酯與鋼砂混製之材料、PET塑料、ABS塑料、PC塑料、塑膠薄膜、矽酸鈣板、陶瓷玻璃纖維板以及碳纖維材所組成的群組。 The method for producing a surface metal of a sheet material according to claim 1, wherein the material of the sheet material is selected from the group consisting of polyester and steel sand mixed materials, PET plastic, ABS plastic, PC plastic, plastic film, calcium silicate board, ceramic. A group of fiberglass sheets and carbon fiber. 如請求項1所述之板材表面金屬生成製造方法,其中於「化鍍」步驟後更經過一「電鍍」之步驟,於「電鍍」的步驟中,係將該板材浸入一電解槽中並通電進行電鍍使電解槽中的金屬離子附著於該化鍍銅層之上而形成一電鍍金屬層。 The method for producing a metal surface of a sheet material according to claim 1, wherein after the step of "plating", a step of "plating" is performed, and in the step of "plating", the sheet is immersed in an electrolytic bath and energized. Electroplating is performed to adhere metal ions in the electrolytic cell to the copper plating layer to form a plated metal layer. 如請求項3所述之板材表面金屬生成製造方法,其中該電鍍槽中裝有一電鍍溶液,該電鍍溶液的成分包含硫酸銅、硫酸、氯離子與水。 The method for producing a surface metal of a sheet material according to claim 3, wherein the plating bath is provided with a plating solution, and the composition of the plating solution comprises copper sulfate, sulfuric acid, chloride ions and water. 如請求項3所述之板材表面金屬生成製造方法,其中於「電鍍」步驟後 更經過一「上漆」之步驟,於「上漆」的步驟中,係於該電鍍金屬層至少部分塗布、噴灑或形成一黑漆層。 The method for producing a surface metal of a sheet material according to claim 3, wherein after the "electroplating" step Further, in a "painting" step, in the "painting" step, at least a portion of the electroplated metal layer is coated, sprayed or formed into a black lacquer layer. 如請求項5所述之板材表面金屬生成製造方法,其中於「上漆」步驟後更經過一「研磨」之步驟,於「研磨」的步驟中,係以手動或動力工具對該黑漆層進行研磨,使該電鍍金屬層與該化鍍銅層部分顯露。 The method for producing a metal surface of a sheet material according to claim 5, wherein after the "painting" step, a "grinding" step is performed, and in the step of "grinding", the black lacquer layer is manually or powered. Grinding is performed to partially expose the plated metal layer and the copper plated layer. 如請求項6所述之板材表面金屬生成製造方法,其中於「研磨」步驟後更經過一「上保護漆」之步驟,於「上保護漆」的步驟中,係於該板材上被覆一保護漆以避免該化鍍銅層與該電鍍金屬層氧化。 The method for producing a metal surface of a sheet material according to claim 6, wherein after the "grinding" step, a step of "top protective paint" is applied, and in the step of "top protective paint", the sheet is covered with a protection. The paint prevents oxidation of the copper plating layer and the plating metal layer. 如請求項1所述之板材表面金屬生成製造方法,其中於「被覆油墨」的步驟中,該導電觸媒油墨係以噴、塗、淋膜或印刷的方式被覆於該板材表面。 The method for producing a surface metal of a sheet material according to claim 1, wherein in the step of "coating the ink", the conductive catalyst ink is sprayed, coated, coated or printed on the surface of the sheet. 如請求項1所述之板材表面金屬生成製造方法,其中該導電觸媒油墨包含鈀金屬粒子。 The method for producing a surface metal of a sheet material according to claim 1, wherein the conductive catalyst ink comprises palladium metal particles. 如請求項1所述之板材表面金屬生成製造方法,其中於「烘乾」的步驟中,係於攝氏80至150度的溫度之下進行。 The method for producing a surface metal of a sheet material according to claim 1, wherein the step of "drying" is carried out at a temperature of 80 to 150 degrees Celsius.
TW103119106A 2014-05-30 2014-05-30 Method for forming metal layer on board TWI526575B (en)

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