TWI523713B - Printed circuit board drilling machine - Google Patents
Printed circuit board drilling machine Download PDFInfo
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- TWI523713B TWI523713B TW100103615A TW100103615A TWI523713B TW I523713 B TWI523713 B TW I523713B TW 100103615 A TW100103615 A TW 100103615A TW 100103615 A TW100103615 A TW 100103615A TW I523713 B TWI523713 B TW I523713B
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- presser foot
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- circuit board
- printed circuit
- vent hole
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B47/00—Constructional features of components specially designed for boring or drilling machines; Accessories therefor
- B23B47/26—Liftable or lowerable drill heads or headstocks; Balancing arrangements therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B47/00—Constructional features of components specially designed for boring or drilling machines; Accessories therefor
- B23B47/34—Arrangements for removing chips out of the holes made; Chip- breaking arrangements attached to the tool
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
本發明係有關於一種印刷電路板鑽孔機,其中在心軸組中包括一可以在中心部任意回轉之心軸,並利用配置於心軸組前端的壓腳(電路板壓腳),而在施壓於工件之加壓狀態下,進行工件之加工。The present invention relates to a printed circuit board drilling machine in which a spindle which can be arbitrarily rotated at a center portion is included in a spindle group, and a presser foot (circuit board presser foot) disposed at a front end of the spindle group is used. The workpiece is processed by applying pressure to the workpiece under pressure.
在印刷電路板上進行加工之場合,是先將複數片印刷電路板予以積層後,再同時在複數片的印刷電路板上進行加工,以便能提昇作業效率。還有,為了防止加工完後在孔之入口部產生毛頭,通常是積層後在印刷電路板之最上層配置上板。在以下是將組合後之印刷電路板和上板一起稱為印刷電路板。多數時候印刷電路板之板厚並不完全一致,故積層完後會在印刷電路板之上下方向產生間隙。在此種場合時,可能會伴隨著鑽頭之鑽切而使得印刷電路板朝上下方向移動,並因此造成鑽頭折斷之情況。故,事先利用壓腳來施壓於印刷電路板上加工部之周邊,而在將印刷電路板按壓於工作台上之狀態下,進行鑽頭的鑽切作業。In the case of processing on a printed circuit board, a plurality of printed circuit boards are laminated first, and then processed on a plurality of printed circuit boards to improve work efficiency. Further, in order to prevent the hair from being generated at the entrance of the hole after the processing, the upper plate is usually placed on the uppermost layer of the printed circuit board after lamination. In the following, the combined printed circuit board and upper board are collectively referred to as a printed circuit board. Most of the time, the board thickness of the printed circuit board is not completely uniform, so a gap will be generated in the lower direction of the printed circuit board after the layer is stacked. In such a case, the printed circuit board may be moved in the up and down direction along with the drilling of the drill bit, and thus the drill bit may be broken. Therefore, the presser foot is used to press the periphery of the processed portion on the printed circuit board in advance, and the drill bit is drilled while the printed circuit board is pressed against the table.
此外,壓腳與心軸組間所形成之空間(以下稱為「壓腳內空間」)是連接至集塵機,將外氣經由設置於壓腳上用來讓鑽頭貫穿之孔(以下稱為鑽頭用孔)中抽出,並將加工中所產生之鑽切粉從印刷電路板上予以回收。在印刷電路板鑽孔機之場合,因為加工時之稼動時間(Tact)較短,故在印刷電路板之加工期間,集塵機是經常在作動中。Further, a space formed between the presser foot and the mandrel group (hereinafter referred to as "inner foot inner space") is connected to the dust collector, and the outside air is passed through a hole provided on the presser foot for the drill bit to pass through (hereinafter referred to as a drill bit) The hole is taken out and the drilled powder produced in the process is recovered from the printed circuit board. In the case of a printed circuit board drilling machine, since the processing time (Tact) during processing is short, the dust collector is often in operation during processing of the printed circuit board.
在將鑽頭移動至下一處加工位置之時,如將印刷電路板與壓腳間距離予以縮短,即縮短空切削時間的話,就能提昇加工效率。但是在將壓腳靠近印刷電路板時,會因為集塵機之吸引力讓上板往上浮起,而將兼具有空氣流入口功能之鑽頭用孔阻塞住,導致無法將鑽切粉全部排出。When the drill bit is moved to the next processing position, if the distance between the printed circuit board and the presser foot is shortened, that is, the empty cutting time is shortened, the machining efficiency can be improved. However, when the presser foot is brought close to the printed circuit board, the upper plate is lifted upward due to the attraction of the dust collector, and the drill hole having the air inflow function is blocked by the hole, so that the drill cutting powder cannot be completely discharged.
因此一種利用加壓於工件之時,讓壓腳及心軸組能相對移動的印刷電路板鑽孔機相關之提案被提出(專利文獻1)。亦即,僅在進行工件加工之時,將用來讓壓腳內空間能連通至外氣之通氣孔,配置在位於與心軸組對向之壓腳側面,並在加工之時將壓腳內空間與外氣隔離,並在將鑽頭移動至下一處加工位置之時,讓壓腳內空間可以連接至外氣。Therefore, a proposal relating to a printed circuit board drilling machine that allows relative movement of the presser foot and the mandrel group when the workpiece is pressed is proposed (Patent Document 1). That is, only when the workpiece is processed, the vent hole for connecting the space inside the presser foot to the outside air is disposed on the side of the presser foot opposite to the mandrel group, and the presser foot is processed at the time of processing. The inner space is isolated from the outside air and allows the space inside the presser foot to be connected to the outside air as the bit is moved to the next machining position.
利用印刷電路板鑽孔機加工所得之孔徑,通常是0.1~6.4mm,為了能輕易的進行心軸之高度方向定位,是將從心軸前端至鑽頭前端(刃先)為止的距離(以下稱為鑽頭突出長度)設定成一定值(例如,25mm),而與鑽頭之公稱外徑無關。因此,採用專利文獻1之技術,可以確實的將鑽切粉排出,並防止在鑽頭移動至下一處加工位置之時產生上板的浮起。The aperture obtained by the printed circuit board drilling machine is usually 0.1 to 6.4 mm. In order to easily position the spindle in the height direction, it is the distance from the front end of the spindle to the front end of the drill (first edge) (hereinafter referred to as The length of the drill bit is set to a constant value (for example, 25 mm) regardless of the nominal outer diameter of the drill bit. Therefore, according to the technique of Patent Document 1, it is possible to surely discharge the drill cutting powder and prevent the floating of the upper plate from occurring when the drill bit moves to the next processing position.
專利文獻1:特開2008-80433號公報。Patent Document 1: JP-A-2008-80433.
在細孔徑鑽切之場合,會有因高速回轉時的鑽頭前端振動所造成的加工精度不佳現象。在此場合,如將鑽頭突出長度予以縮短(例如,15mm),則可以提昇加工精度。以下將利用與傳統長度同樣之鑽頭突出長度所進行之加工稱為「通常加工」,及將利用長度縮短後之鑽頭突出長度來進行加工之場合稱為「高精度加工」。還有,相較於在通常加工時之心軸組的組裝位置,在進行高精度加工之場合,是相對於用來固持心軸組之夾頭而降低心軸組的組裝位置,來縮短鑽頭突出長度。In the case of a fine-diameter drilling, there is a problem that the machining accuracy is poor due to the vibration of the tip end of the drill at the time of high-speed rotation. In this case, if the length of the drill bit is shortened (for example, 15 mm), the machining accuracy can be improved. Hereinafter, the processing by the length of the drill having the same length as the conventional length is referred to as "normal processing", and the case where the length of the drill having the length shortened is used for processing is referred to as "high-precision machining". Further, in the case of performing high-precision machining in comparison with the assembly position of the mandrel group at the time of normal processing, the assembly position of the mandrel group is lowered with respect to the chuck for holding the mandrel group, and the bit is shortened. Prominent length.
第6圖所示係說明採用專利文獻1技術之場合所產生的問題點,其中(a)為將通氣孔位置配置在適用通常加工的位置而進行高精度加工之場合,(b)為將通氣孔位置配置在適用高精度加工的位置而進行通常加工之場合。Fig. 6 is a view showing a problem occurring in the case of using the technique of Patent Document 1, wherein (a) is a case where the position of the vent hole is placed at a position suitable for normal machining, and high-precision machining is performed, and (b) is a pass. The position of the air holes is placed in a position where normal machining is performed at a position where high-precision machining is applied.
如同圖(a)中所示,在通常加工中將心軸組1水平移動至下一處加工位置之時,被定位成適用高精度加工之心軸組1,會將設置於壓腳7上之通氣孔8阻塞住,造成壓腳內空間31之壓力無法升高,而發生上板浮起現象。此外,如同圖(b)中所示,在高精度加工中當鑽頭6之前端接觸到工件20之上端之時,被定位成適用通常加工之心軸組1會離開通氣孔8,故外氣會經由通氣孔8而流入壓腳內空間31,造成壓腳內空間31之壓力無法降下,而發生集塵能力不足現象。As shown in (a), when the mandrel group 1 is horizontally moved to the next machining position in the normal machining, the spindle group 1 positioned for high-precision machining is set on the presser foot 7 The vent hole 8 is blocked, so that the pressure in the space 31 in the presser foot cannot be raised, and the upper plate floats. Further, as shown in (b), in the high-precision machining, when the front end of the drill bit 6 comes into contact with the upper end of the workpiece 20, the mandrel group 1 positioned to be suitable for normal processing leaves the vent hole 8, so the outside air The pressure in the presser foot 8 flows into the presser foot inner space 31, so that the pressure in the presser foot space 31 cannot be lowered, and the dust collecting ability is insufficient.
本發明之目的是為了解決上述之課題,提供一種印刷電路板鑽孔機,不論是進行通常加工或是高精度加工都能減少空切削量,而提昇加工效率。SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide a printed circuit board drilling machine which can reduce the amount of air cutting and improve the machining efficiency regardless of whether it is normal machining or high-precision machining.
為了解決上述之課題,本發明之印刷電路板鑽孔機中包括:心軸組,被固持於夾頭上,用來固持工具並可以讓工具任意的回轉;以及壓腳,被支持於前述夾頭上並可以沿著前述工具之軸線方向而任意的滑動,且是如同覆蓋住前述心軸組前端般的嵌合於前述心軸組上。在前述壓腳之側面設置通氣孔,讓由前述壓腳與前述心軸組所形成之空間得以連通至外氣,同時將前述空間連接至負壓源,再經由前述壓腳施壓於工件上,並在前述通氣孔為閉塞之狀態下,利用前述工具而在前述工件上進行加工,其特徵在於:將前述工具固持在相對於前述夾頭而位於最靠近工件側之前述心軸組中,當該工具之前端接觸到前述工件的上面之時,前述通氣孔是配置於讓前述空間與外氣相互連通之位置,同時並設置板狀之遮閉器,在當前述壓腳之前端未與前述工件接觸之時,該遮閉器之一端是被定位在,當前述壓腳之前端未與前述工件接觸之時,從開口位於前述壓腳外面之前述通氣孔的下端而朝向上方一定距離之位置,且該距離是相等於當前述壓腳之前端未與前述工件接觸之時從前述壓腳之前端至前述工具之前端為止的距離,且遮閉器之它端,是固持在前述夾頭上,又,當前述工具之前端接觸到前述工件的上面之時,是利用前述遮閉器將前述空間與外氣隔離。In order to solve the above problems, the printed circuit board drilling machine of the present invention comprises: a mandrel set held on the collet for holding the tool and allowing the tool to rotate arbitrarily; and a presser foot supported on the collet And it is arbitrarily slid along the axial direction of the tool, and is fitted to the mandrel group as if covering the front end of the mandrel group. Providing a vent hole on a side surface of the presser foot to allow a space formed by the presser foot and the mandrel group to communicate with external air, and simultaneously connecting the space to a negative pressure source, and then pressing the workpiece through the presser foot And processing the workpiece on the workpiece by the tool in a state in which the vent hole is occluded, wherein the tool is held in the spindle group closest to the workpiece side with respect to the chuck, When the front end of the tool contacts the upper surface of the workpiece, the vent hole is disposed at a position where the space and the outside air communicate with each other, and a plate-shaped shutter is disposed at the front end of the presser foot. When the workpiece is in contact, one end of the shutter is positioned such that when the front end of the presser foot is not in contact with the workpiece, a certain distance is upward from the lower end of the vent hole whose opening is outside the presser foot Position, and the distance is equal to the distance from the front end of the presser foot to the front end of the tool when the front end of the presser foot is not in contact with the workpiece, and the shutter It end, is held in the chuck, but also, the aforementioned tip tool into contact to the top of the workpiece, using the shutter will isolate the air space outside.
不論是通常加工或是高精度加工之時,在加工期間都能讓壓腳內空間保持負壓狀態,亦能防止在心軸組上升或水平移動之時工件的浮起,故可以提昇加工效率。此外,由於裝置構造簡單,亦可以降低操作成本。Whether it is normal machining or high-precision machining, the space inside the presser foot can be kept under negative pressure during machining, and the workpiece can be prevented from floating when the mandrel group is raised or moved horizontally, so that the machining efficiency can be improved. In addition, due to the simple construction of the device, the operating cost can also be reduced.
以下根據圖式來針對本發明之實施例加以說明。Embodiments of the present invention will be described below based on the drawings.
第1圖係本發明相關印刷電路板鑽孔機之機頭部的正面局部剖面圖,圖中所示為心軸組被定位在高精度加工位置之場合。第2圖為第1圖中之箭頭A方向視圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front partial cross-sectional view of the head of a related printed circuit board drilling machine of the present invention, showing the mandrel set being positioned at a high precision machining position. Fig. 2 is a view in the direction of arrow A in Fig. 1.
如第1圖所示,具有圓柱狀外形之心軸組1是固定於夾頭2上。而夾頭2又固定於鞍座3上。在夾頭2之下側兩端部配置一對的軸承4。鞍座3是由滑座5所支持並可以沿著上下方向(Z方向)任意的予以定位。滑座5是由未顯示於圖中之機柱所支持,並可以沿著圖之左右方向(Y方向)而任意的予以定位。經由以上之構成,能將心軸組1沿著圖之上下及左右方向而任意的予以定位。鑽頭6是由心軸組1之前端所支持並能以任意回轉。圖中所示之心軸組1場合,是在前端部形成45度之倒角。As shown in Fig. 1, a mandrel set 1 having a cylindrical outer shape is fixed to the collet 2. The collet 2 is fixed to the saddle 3 again. A pair of bearings 4 are disposed at both ends of the lower side of the chuck 2. The saddle 3 is supported by the carriage 5 and can be positioned arbitrarily in the up and down direction (Z direction). The carriage 5 is supported by a machine column not shown in the drawing, and can be positioned arbitrarily in the left-right direction (Y direction) of the figure. According to the above configuration, the mandrel group 1 can be positioned arbitrarily in the upper and lower directions of the drawing. The drill bit 6 is supported by the front end of the mandrel set 1 and can be arbitrarily rotated. In the case of the mandrel group 1 shown in the drawing, a chamfer of 45 degrees is formed at the front end portion.
杯狀的壓腳7是嵌合在心軸組1之前端部上並可以任意的滑動。心軸組1與壓腳7間之徑向方向間隙是約為直徑0.1mm左右。一對支撐桿15是固定在壓腳7之兩端,由軸承4所支持著,並分別連結至撓性聯軸節16之一端。而撓性聯軸節16之它端則是分別連結至一對汽缸17之一端。汽缸17之它端又被分別固定在支座18上。並再分別將支座18固定於鞍座3上。又汽缸17是不斷的朝圖的下方而施壓於壓腳7上。The cup-shaped presser foot 7 is fitted to the front end of the mandrel group 1 and can be arbitrarily slid. The radial direction gap between the mandrel group 1 and the presser foot 7 is about 0.1 mm in diameter. A pair of support rods 15 are fixed to both ends of the presser foot 7, supported by the bearing 4, and respectively coupled to one end of the flexible coupling 16. The other end of the flexible coupling 16 is coupled to one end of a pair of cylinders 17, respectively. The other ends of the cylinders 17 are again fixed to the holders 18, respectively. The support 18 is then fixed to the saddle 3 respectively. Further, the cylinder 17 is continuously pressed against the presser foot 7 toward the lower side of the figure.
在壓腳7之左側面上配置著通氣孔8。關於通氣孔8之大小及高度方向之位置是如後所述。A vent hole 8 is disposed on the left side surface of the presser foot 7. The position of the vent hole 8 in the size and height direction is as will be described later.
如第2圖中所示,在壓腳7側面用來配置通氣孔8之部分是形成一平坦的面7a。此外,亦在夾頭2之側面上形成與面7a相同的面2a。As shown in Fig. 2, a portion of the side of the presser foot 7 for arranging the vent hole 8 is formed with a flat surface 7a. Further, the same surface 2a as the surface 7a is also formed on the side surface of the chuck 2.
遮閉器50之材質是如不銹鋼等的金屬,並形成具有板厚t的方形平板。在遮閉器50下端之51a側是密貼在面7a上,並利用2支螺絲51而固定在面2a上。The material of the shutter 50 is a metal such as stainless steel, and forms a square flat plate having a plate thickness t. The side 51a of the lower end of the shutter 50 is adhered to the surface 7a, and is fixed to the surface 2a by two screws 51.
在壓腳7之下部固定著樹脂或是金屬製的襯套9。在襯套9之下端部上形成用來連接至外氣及鑽頭用孔10之十字狀的溝11。還有,由於實質上壓腳7與襯套9是作出一體的構成,在以下是將襯套9之下端面以壓腳7之下端面7b來稱呼。A resin or metal bushing 9 is fixed to the lower portion of the presser foot 7. A cross-shaped groove 11 for connecting to the outer air and the drill hole 10 is formed at the lower end portion of the bushing 9. Further, since the presser foot 7 and the bushing 9 are integrally formed integrally, the lower end face of the bushing 9 is referred to as the lower end face 7b of the presser foot 7 in the following.
設置於壓腳7之下端側的孔30,是將由壓腳7及心軸組1所包圍形成的壓腳內空間31與管接頭32予以連接。管33是連接在管接頭32上,又管33之另一端則連接至未顯示於圖中之集塵機。The hole 30 provided on the lower end side of the presser foot 7 is connected to the pipe joint 32 by the presser foot inner space 31 formed by the presser foot 7 and the mandrel group 1. The tube 33 is attached to the pipe joint 32, and the other end of the pipe 33 is connected to a dust collector not shown in the drawing.
作為工件之印刷電路板20被載置於工作台21上。工作台21是可以任意的沿著與紙面垂直的前後方向(X方向)而定位。The printed circuit board 20 as a workpiece is placed on the table 21. The table 21 can be positioned arbitrarily in the front-rear direction (X direction) perpendicular to the plane of the paper.
經由以上的構成,當沿著心軸組1之軸線O方向而相對於夾頭2來改變心軸組1之固定位置時,就會改變壓腳內空間31之軸線O方向長度。With the above configuration, when the fixed position of the mandrel group 1 is changed with respect to the chuck 2 in the direction of the axis O of the mandrel group 1, the length in the axis O direction of the space inside the presser foot 31 is changed.
接下來針對通氣孔8之高度方向配置位置加以說明。Next, the position in the height direction of the vent hole 8 will be described.
第3圖係顯示壓腳7之前端周邊的放大示意圖,其中分別(a)所示為壓腳7之下端面7b接觸到印刷電路板20之上面之時,(b)所示為鑽頭6之前端接觸到印刷電路板20之上面之時。還有,心軸組1是設定在高精度加工用之高度。Fig. 3 is an enlarged schematic view showing the periphery of the front end of the presser foot 7, wherein (a) shows the lower end face 7b of the presser foot 7 contacting the upper surface of the printed circuit board 20, and (b) shows the drill bit 6 When the front end contacts the upper side of the printed circuit board 20. Further, the mandrel group 1 is set at a height for high-precision machining.
此處,是在壓腳7之下端面7b離開印刷電路板20之場合,接觸到印刷電路板20之時,將心軸組1的前端1a與壓腳7之下端面7b間之距離設定為L,並將通常加工時的距離L定為Ln,高精度加工時的距離L定為Lk,則Ln>Lk。但是,不論壓腳7是在距離Ln或是距離Lk之場合,鑽頭6之前端都是被定位在下端面7b之上方一定距離h之處(通常是2~3mm,在此處是設定為2mm)。因此,在本實施例之場合,當壓腳7之下端面7b接觸到印刷電路板20之上面之時,心軸組1的前端1a與壓腳7之下端面7b間之距離為Lk,且鑽頭6之前端是位在離下端面7b距離h之位置。Here, when the lower end surface 7b of the presser foot 7 leaves the printed circuit board 20, when the printed circuit board 20 is touched, the distance between the front end 1a of the mandrel group 1 and the lower end surface 7b of the presser foot 7 is set to L, and the distance L at the time of normal processing is Ln, and the distance L at the time of high-precision machining is Lk, Ln>Lk. However, regardless of whether the presser foot 7 is at a distance Ln or a distance Lk, the front end of the drill bit 6 is positioned at a certain distance h above the lower end surface 7b (usually 2 to 3 mm, here set to 2 mm) . Therefore, in the case of the present embodiment, when the lower end surface 7b of the presser foot 7 comes into contact with the upper surface of the printed circuit board 20, the distance between the front end 1a of the mandrel group 1 and the lower end surface 7b of the presser foot 7 is Lk, and The front end of the drill bit 6 is located at a distance h from the lower end surface 7b.
在圖示之場合,通氣孔8是作成直徑為m之圓形。此外,在通氣孔8面向外氣側之上端8oa,與面向壓腳內空間31側之上端8ia,具有相同的Z方向高度。而下端8ib,則是定位在當鑽頭6之前端接觸到印刷電路板20之上面之時,可以讓壓腳內空間31與外氣連通的位置。亦即,在如圖中所示當心軸組1之前端形成倒角部之場合,是將下端8ib配置在較倒角部之上側1j更為下側之位置。以下之設定是,m=3mm。在本實施例中,雖然是將通氣孔8之形狀作成圓形,亦可以是將通氣孔8作成小判狀之長圓孔。In the case of the illustration, the vent hole 8 is formed in a circular shape having a diameter of m. Further, the vent hole 8 faces the outer air side upper end 8oa and has the same Z-direction height as the upper end 8ia facing the presser foot inner space 31 side. The lower end 8ib is positioned to allow the space 31 in the presser foot to communicate with the outside air when the front end of the drill bit 6 comes into contact with the upper surface of the printed circuit board 20. That is, when the chamfered portion is formed at the front end of the mandrel group 1 as shown in the figure, the lower end 8ib is disposed at a position lower than the upper side 1j of the chamfered portion. The following setting is m=3mm. In the present embodiment, although the shape of the vent hole 8 is circular, the vent hole 8 may be an oblong hole having a small shape.
遮閉器50之下端50a,是在壓腳7之下端面7b離開(或是在接觸到)印刷電路板20的上面之時,位於由通氣孔8之下端80b算起距離為h之處,並將遮閉器50固定在夾頭2上面。還有,遮閉器50之寬度,是其各側都較通氣孔8之寬度(口徑)m的兩端長出約2mm以上的長度,並具有1~2mm之板厚t。還有,在同圖(a)中所示之距離H,是在壓腳7之下端面7b離開印刷電路板20之上面時(或者是在壓腳7之下端面7b接觸到印刷電路板20的上面之時),由壓腳7之下端面7b至遮閉器50之下端50a為止的距離。The lower end 50a of the shutter 50 is located at a distance h from the lower end 80b of the vent hole 8 when the lower end surface 7b of the presser foot 7 is separated (or is in contact with) the upper surface of the printed circuit board 20. The shutter 50 is fixed to the upper side of the collet 2. Further, the width of the shutter 50 is such that each side thereof has a length of about 2 mm or more longer than both ends of the width (caliber) m of the vent hole 8, and has a plate thickness t of 1 to 2 mm. Further, the distance H shown in the same figure (a) is when the lower end surface 7b of the presser foot 7 is separated from the upper surface of the printed circuit board 20 (or the lower end surface 7b of the presser foot 7 contacts the printed circuit board 20). The upper side is the distance from the lower end surface 7b of the presser foot 7 to the lower end 50a of the shutter 50.
接下來針對本發明之動作加以說明。Next, the operation of the present invention will be described.
在心軸組1沿著水平方向移動之場合,壓腳7之下端面7b是離開印刷電路板20,而通氣孔8中從下端面8ob到與遮閉器50之下端50a相對向之位置為止,是與外氣相連通。此外,由於鑽頭用孔10亦是開放狀態,故外氣就通過通氣孔8及鑽頭用孔10而流入壓腳內空間31內。其結果,鑽頭用孔10周邊之壓力是與大氣壓力接近,就不會發生印刷電路板20之浮起現象。When the mandrel group 1 is moved in the horizontal direction, the lower end surface 7b of the presser foot 7 is away from the printed circuit board 20, and the vent hole 8 is from the lower end surface 8ob to the position opposite to the lower end 50a of the shutter 50, It is connected to the outer gas phase. Further, since the drill hole 10 is also in an open state, the outside air flows into the presser foot space 31 through the vent hole 8 and the drill hole 10. As a result, the pressure around the drill hole 10 is close to the atmospheric pressure, and the floating phenomenon of the printed circuit board 20 does not occur.
從下端面7b接觸到印刷電路板20至鑽頭6之前端接觸到印刷電路板20為止期間,遮閉器50及鑽頭6(亦即心軸組1)是整體同時下降。故,在下端面7b接觸到印刷電路板20至鑽頭6之前端接觸到印刷電路板20為止期間,會因為遮閉器50的下降而使得通氣孔8之實質截面積逐漸的減小,當鑽頭6之前端接觸到印刷電路板20時,就會如第3圖(b)所示,經由遮閉器50而將通氣孔8與外氣隔離,讓通氣孔8之實質截面積成為0。因此,在進行加工之時,壓腳內空間31是保持著負壓狀態。The shutter 50 and the drill bit 6 (i.e., the spindle group 1) are simultaneously lowered as a whole while the lower end surface 7b is in contact with the printed circuit board 20 until the front end of the drill bit 6 contacts the printed circuit board 20. Therefore, during the period in which the lower end surface 7b contacts the printed circuit board 20 to the front end of the drill bit 6 and contacts the printed circuit board 20, the substantial cross-sectional area of the vent hole 8 is gradually reduced due to the lowering of the shutter 50, when the drill bit 6 is lowered. When the front end contacts the printed circuit board 20, as shown in Fig. 3(b), the vent hole 8 is isolated from the outside air via the shutter 50, and the substantial cross-sectional area of the vent hole 8 becomes zero. Therefore, at the time of processing, the space inside the presser foot 31 is maintained in a negative pressure state.
加工結束,鑽頭6之前端從印刷電路板20離開後,由於遮閉器50會相對於通氣孔8上昇,而使得通氣孔8之實質截面積逐漸的增加,當壓腳7之下端面7b從印刷電路板20之上面離開之時,壓腳內空間31之壓力值就接近大氣壓。因此,印刷電路板20就不會往上浮起。經過確認,當通氣孔8之直徑大於3mm時就能達到此種效果。After the processing ends, after the front end of the drill bit 6 is separated from the printed circuit board 20, since the shutter 50 will rise relative to the vent hole 8, the substantial cross-sectional area of the vent hole 8 is gradually increased, when the lower end surface 7b of the presser foot 7 is When the upper surface of the printed circuit board 20 is separated, the pressure value of the space 31 in the presser foot is close to atmospheric pressure. Therefore, the printed circuit board 20 does not float upward. It has been confirmed that this effect can be achieved when the diameter of the vent hole 8 is larger than 3 mm.
雖然通常加工時的距離Ln較高精度加工時的距離Lk為大,由於在通常加工之場合夾頭2之位置並無改變,僅心軸組1之位置有所改變,故在動作上是與上述之高精度加工的場合相同。Although the distance Ln during machining is usually high and the distance Lk at the time of machining is large, since the position of the chuck 2 does not change in the case of normal machining, only the position of the mandrel group 1 is changed, so the action is The above-mentioned high-precision machining is the same.
還有,遮閉器50之材質亦可以是採用具有較大剛性的合成樹脂。Further, the material of the shutter 50 may be a synthetic resin having a large rigidity.
此外,就以上述之例子而言,基於以下的理由是以m≧h為佳。Further, in the above examples, m≧h is preferable for the following reasons.
1.如按照上述將h設定為約2mm以下時,因為h變小後加工上亦變的較為困難,故h較大時通氣孔8會較容易加工。1. When h is set to be about 2 mm or less as described above, since it becomes difficult to change the processing after h becomes small, the vent hole 8 is easier to process when h is large.
2.為了提昇遮閉器50之氣密性能,而在通氣孔8之入口裝上例如是密封墊等之場合,則可能會在壓腳7之表面上造成段差,當m≧h之時,因為從一開始就可以將遮閉器50覆蓋在密封墊上,在動作當中遮閉器50不會與密封墊等之端緣發生干涉,而能夠讓遮閉器50滑順的動作。2. In order to improve the airtight performance of the shutter 50, when a gasket or the like is attached to the inlet of the vent hole 8, a step may be caused on the surface of the presser foot 7, when m≧h, Since the shutter 50 can be covered on the gasket from the beginning, the shutter 50 does not interfere with the edge of the gasket or the like during the operation, and the shutter 50 can be smoothly slid.
因此,在不發生如上所述之問題,並能確保有充足截面積之場合,亦可以是作成m<h。Therefore, in the case where the above problem does not occur and it is ensured that there is a sufficient cross-sectional area, m<h may be created.
第4圖係顯示本發明之衍生例示意圖。如上所述,由於即使將本發明相關之通氣孔8作成相對較小的口徑(m)亦同樣具有效果,故如通氣孔8之口徑在5mm以下之時就算不設置上述之平坦面,亦不易發生遮閉器50與密封墊等之端緣干涉的問題。因此,就可以如本圖中所示的,直接在壓腳7之圓筒狀側壁上穿孔作出通氣孔8。在此場合,可以設置複數個小口徑的通氣孔8,同時亦可以設置一體成形的一個或是分別設置個別的遮閉器50。Figure 4 is a schematic view showing a derivative of the present invention. As described above, even if the vent hole 8 according to the present invention is made to have a relatively small diameter (m), it is also effective. Therefore, if the vent hole 8 has a diameter of 5 mm or less, the flat surface is not provided. The problem that the shutter 50 interferes with the edge of the gasket or the like occurs. Therefore, the vent hole 8 can be made by directly perforating the cylindrical side wall of the presser foot 7 as shown in the figure. In this case, a plurality of small-diameter vent holes 8 may be provided, and one of the integrally formed ones may be provided or an individual shutter 50 may be separately provided.
第5圖係顯示本發明之其它衍生例示意圖。在加工深度K之孔的場合,是如第4圖所示鑽頭6是下降K。由於此時遮閉器50之下端50a亦同時是下降K,故必須事先確保(H-h)≧K。亦即如同圖中所示的,如將通氣孔8之軸線作成左側較高之形式,就可以讓通氣孔8之下端8ob的位置相較於下端8ib的位置為高,而能夠輕易的實現(H-h)≧K。Figure 5 is a schematic diagram showing other examples of the invention. In the case of machining the hole of the depth K, the drill 6 is lowered K as shown in Fig. 4. Since the lower end 50a of the shutter 50 is also lowered K at the same time, it is necessary to ensure (H-h) ≧K in advance. That is, as shown in the figure, if the axis of the vent hole 8 is made higher in the left side, the position of the lower end 8ob of the vent hole 8 can be made higher than that of the lower end 8ib, and can be easily realized ( Hh) ≧K.
1‧‧‧心軸組 1‧‧‧Heart Group
2‧‧‧夾頭 2‧‧‧ chuck
6‧‧‧工具(鑽頭) 6‧‧‧Tools (drills)
7‧‧‧壓腳 7‧‧‧Foot press
8‧‧‧通氣孔 8‧‧‧Ventinel
20‧‧‧工件 20‧‧‧Workpiece
31‧‧‧壓腳內空間 31‧‧‧Inside the presser foot space
50‧‧‧遮閉器 50‧‧‧ occlusion device
第1圖係本發明相關印刷電路板鑽孔機之機頭部的正面局部剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front partial sectional view showing the head of a machine for a related circuit board drilling machine of the present invention.
第2圖係第1圖中之箭頭A方向視圖。 Fig. 2 is a view in the direction of arrow A in Fig. 1.
第3圖(a)、(b)顯示第1圖中壓腳7前端周邊之放大示意圖。 Fig. 3 (a) and (b) are enlarged views showing the periphery of the front end of the presser foot 7 in Fig. 1.
第4圖係顯示本發明之衍生例示意圖。 Figure 4 is a schematic view showing a derivative of the present invention.
第5圖係顯示本發明之其它衍生例示意圖。 Figure 5 is a schematic diagram showing other examples of the invention.
第6圖(a)、(b)係說明習知技術及課題之示意圖。Fig. 6 (a) and (b) are schematic diagrams showing conventional techniques and problems.
1...心軸組1. . . Mandrel group
2...夾頭2. . . Chuck
3...鞍座3. . . Saddle
4...軸承4. . . Bearing
5...滑座5. . . Slide
6...工具(鑽頭)6. . . Tool (drill)
7...壓腳7. . . Presser foot
8...通氣孔8. . . Vent
9...襯套9. . . bushing
11...十字狀的溝11. . . Cross-shaped groove
15...支撐桿15. . . Support rod
16...撓性聯軸節16. . . Flexible coupling
17...汽缸17. . . cylinder
18...支座18. . . Support
20...工件20. . . Workpiece
21...工作台twenty one. . . Workbench
30...孔30. . . hole
31...壓腳內空間31. . . Inside the presser foot
32...管接頭32. . . Pipe joint
33...管33. . . tube
50...遮閉器50. . . Hatch
50a...下端50a. . . Lower end
51...螺絲51. . . Screw
2a...面2a. . . surface
Claims (1)
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JP2010080388A JP5601865B2 (en) | 2010-03-31 | 2010-03-31 | Printed circuit board drilling machine |
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TWI523713B true TWI523713B (en) | 2016-03-01 |
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KR (1) | KR101934307B1 (en) |
CN (1) | CN102248198B (en) |
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JP7046684B2 (en) * | 2017-06-23 | 2022-04-04 | ビアメカニクス株式会社 | Drilling equipment and drilling method |
CN107457824B (en) * | 2017-08-23 | 2023-03-21 | 苏州市吴通电子有限公司 | PCB pore slag remover |
CN113414834A (en) * | 2021-08-20 | 2021-09-21 | 苏州维嘉科技股份有限公司 | Automatic pressing plate method of drilling machine and drilling machine |
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JP2008080433A (en) * | 2006-09-27 | 2008-04-10 | Hitachi Via Mechanics Ltd | Printed board punching machine |
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