TWI523064B - 可切換式多視角偵測器與用於其之光學器件及其操作方法 - Google Patents
可切換式多視角偵測器與用於其之光學器件及其操作方法 Download PDFInfo
- Publication number
- TWI523064B TWI523064B TW103123813A TW103123813A TWI523064B TW I523064 B TWI523064 B TW I523064B TW 103123813 A TW103123813 A TW 103123813A TW 103123813 A TW103123813 A TW 103123813A TW I523064 B TWI523064 B TW I523064B
- Authority
- TW
- Taiwan
- Prior art keywords
- aperture
- signal
- aperture opening
- detecting
- particle
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000002245 particle Substances 0.000 claims description 135
- 238000001514 detection method Methods 0.000 claims description 84
- 230000003287 optical effect Effects 0.000 claims description 27
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000010894 electron beam technology Methods 0.000 description 64
- 239000011163 secondary particle Substances 0.000 description 38
- 238000003384 imaging method Methods 0.000 description 18
- 238000000926 separation method Methods 0.000 description 17
- 239000011164 primary particle Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 238000012552 review Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012876 topography Methods 0.000 description 4
- 238000005421 electrostatic potential Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/21—Means for adjusting the focus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13177207.1A EP2827136B1 (en) | 2013-07-19 | 2013-07-19 | Switchable multi perspective detector, optics therefore and method of operating thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201511064A TW201511064A (zh) | 2015-03-16 |
| TWI523064B true TWI523064B (zh) | 2016-02-21 |
Family
ID=48874128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103123813A TWI523064B (zh) | 2013-07-19 | 2014-07-10 | 可切換式多視角偵測器與用於其之光學器件及其操作方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8963083B2 (enExample) |
| EP (1) | EP2827136B1 (enExample) |
| JP (1) | JP5805831B2 (enExample) |
| TW (1) | TWI523064B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9805908B2 (en) * | 2015-02-18 | 2017-10-31 | Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Signal charged particle deflection device, signal charged particle detection system, charged particle beam device and method of detection of a signal charged particle beam |
| US10643819B2 (en) | 2015-03-24 | 2020-05-05 | Kla-Tencor Corporation | Method and system for charged particle microscopy with improved image beam stabilization and interrogation |
| KR102441581B1 (ko) | 2015-06-03 | 2022-09-07 | 삼성전자주식회사 | 표면 검사 방법 및 이를 이용한 포토 마스크의 검사 방법 |
| US10103004B2 (en) * | 2015-07-02 | 2018-10-16 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | System and method for imaging a secondary charged particle beam with adaptive secondary charged particle optics |
| CN108738343B (zh) * | 2015-11-30 | 2022-02-01 | Asml荷兰有限公司 | 多个带电粒子束的设备 |
| CN112055886A (zh) * | 2018-02-27 | 2020-12-08 | 卡尔蔡司MultiSEM有限责任公司 | 带电粒子多束系统及方法 |
| JP7085258B2 (ja) * | 2018-04-13 | 2022-06-16 | 株式会社ホロン | 超高速電子検出器および該検出器を組み込んだ走査型電子ビーム検査装置 |
| US20230112447A1 (en) * | 2020-03-11 | 2023-04-13 | Asml Netherlands B.V. | Systems and methods for signal electron detection |
| CN111948697B (zh) * | 2020-07-08 | 2022-11-08 | 中国科学院国家空间科学中心 | 一种星载中能电子探测器 |
| US20230377831A1 (en) * | 2020-09-22 | 2023-11-23 | Asml Netherlands B.V. | Anti-scanning operation mode of secondary-electron projection imaging system for apparatus with plurality of beamlets |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818851A (ja) * | 1981-07-24 | 1983-02-03 | Hitachi Ltd | 反射電子検出装置 |
| JPH0614453B2 (ja) * | 1983-06-30 | 1994-02-23 | 三菱電機株式会社 | カラ−受像管 |
| US4894212A (en) | 1987-07-20 | 1990-01-16 | Mobil Oil Corp. | Synthesis of crystalline silicate ZSM-11 |
| JPH0547334A (ja) * | 1991-08-12 | 1993-02-26 | Shimadzu Corp | ２次元電子分光装置 |
| US5892224A (en) * | 1996-05-13 | 1999-04-06 | Nikon Corporation | Apparatus and methods for inspecting wafers and masks using multiple charged-particle beams |
| JP3767341B2 (ja) * | 2000-07-21 | 2006-04-19 | 株式会社日立製作所 | 電子線を用いたパターン検査方法及びその装置 |
| EP1271605A4 (en) * | 2000-11-02 | 2009-09-02 | Ebara Corp | ELECTRON BEAM APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE COMPRISING SAID APPARATUS |
| JP3906866B2 (ja) * | 2005-08-18 | 2007-04-18 | 株式会社日立製作所 | 荷電粒子ビーム検査装置 |
| EP2654069B1 (en) * | 2012-04-16 | 2016-02-24 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Multi channel detector, optics therefore and method of operating thereof |
| EP2654068B1 (en) * | 2012-04-16 | 2017-05-17 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Switchable multi perspective detector, optics therefore and method of operating thereof |
-
2013
- 2013-07-19 EP EP13177207.1A patent/EP2827136B1/en active Active
- 2013-08-06 US US13/960,393 patent/US8963083B2/en active Active
-
2014
- 2014-07-10 TW TW103123813A patent/TWI523064B/zh active
- 2014-07-18 JP JP2014147844A patent/JP5805831B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150021474A1 (en) | 2015-01-22 |
| JP2015023032A (ja) | 2015-02-02 |
| JP5805831B2 (ja) | 2015-11-10 |
| TW201511064A (zh) | 2015-03-16 |
| EP2827136A1 (en) | 2015-01-21 |
| EP2827136B1 (en) | 2020-02-26 |
| US8963083B2 (en) | 2015-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI523064B (zh) | 可切換式多視角偵測器與用於其之光學器件及其操作方法 | |
| TWI650550B (zh) | 用於高產量電子束檢測（ｅｂｉ）的多射束裝置 | |
| KR102179897B1 (ko) | 시료를 검사하기 위한 방법 및 하전 입자 다중-빔 디바이스 | |
| EP2654068B1 (en) | Switchable multi perspective detector, optics therefore and method of operating thereof | |
| US10522327B2 (en) | Method of operating a charged particle beam specimen inspection system | |
| KR102295389B1 (ko) | 1차 하전 입자 빔렛들의 어레이를 이용하여 시료를 검사하기 위한 방법, 1차 하전 입자 빔렛들의 어레이를 이용한 시료의 검사를 위한 하전 입자 빔 디바이스, 및 시료의 검사를 위한 다중-컬럼 현미경 | |
| US8618500B2 (en) | Multi channel detector, optics therefor and method of operating thereof | |
| JP4309886B2 (ja) | 高電流密度粒子ビームシステム | |
| KR102207766B1 (ko) | 이차 전자 광학계 ＆ 검출 디바이스 | |
| US10103004B2 (en) | System and method for imaging a secondary charged particle beam with adaptive secondary charged particle optics | |
| US9305740B2 (en) | Charged particle beam system and method of operating thereof |