TWI522023B - Spindle descending distance information detection mechanism and assembly of mandrel down distance information detection mechanism of the substrate processing device - Google Patents

Description

Mandrel falling distance information detecting mechanism and substrate processing device assembled with mandrel falling distance information detecting mechanism Field of invention

The present invention relates to a mandrel descent distance information detecting mechanism which uses a substrate processing apparatus in which a mandrel having a drill bit at a tip end is assembled, and a multi-layer structure printed circuit board, particularly when performing blind hole processing or countersink processing The position of the tip end of the drill bit can be grasped and reliably processed to the desired inner layer conductor layer of the printed circuit board of the multilayer structure.

Background of the invention

Conventionally, a processing of a printed circuit board (hereinafter simply referred to as a "substrate") for a substrate processing apparatus (hereinafter simply referred to as "device") in which a mandrel is assembled is generally known as a through hole. Processing or peripheral processing. In addition, the through-hole processing refers to a substrate material of a wiring pattern disposed on the substrate before the etching process, and a hole for connecting a through hole or a through-hole of the wiring pattern and the back of the substrate. The processor, in addition, the outer peripheral processing refers to a processor that performs the outer periphery of the substrate, the substrate mounting hole, and the deformed hole.

However, in recent years, the substrate itself is composed of a plurality of insulating layers and The multilayered substrate formed on the surface or between the conductor layers is subjected to through hole processing or wiring pattern etching, etc., and blind hole processing is performed as the multilayer substrate is processed. Or countersunk hole processing. Further, the term "blind hole processing" refers to a process of removing only a part of the through hole to the desired inner layer conductor layer, thereby removing the excess wiring, and the so-called countersink processing means that one part of the printed circuit board is buried. The hole is processed to the desired inner layer conductor layer, and the electronic component is mounted thereon, or a processor for bending the substrate is performed by leaving only one layer of the back surface conductor.

Here, the so-called desired inner layer conductor layer means that in a multilayer structure substrate having an inner layer conductor layer sandwiched between a plurality of insulating layers and the insulator layer, the processor desires to perforate the insulating layer. The inner conductor layer is exposed.

However, as shown in FIG. 3, in the blind hole processing or countersink processing, in the multilayer substrate including three insulating layers, the desired inner conductor layer is the first inner conductor layer 9, and the first insulation is used. The side of the layer 14 (hereinafter referred to as "surface side", and the side of the third insulating layer 16 on the opposite side is referred to as "back side"). After the countersink processing is performed up to the first inner conductor layer 9, it can be assembled to a processing apparatus. The drill at the tip end of the mandrel is opened toward the first insulating layer 14, but in this case, the thickness of the first insulating layer 14 is 50 to 100 μm, and the first inner layer 14 is formed into the first inner insulating layer 14 to form the first inner portion. Since the layer conductor layer 9 has a thickness of 12 to 25 μm, the thickness of the first inner conductor layer 9 must be from a position beyond the first insulating layer 14 to a thickness of the first inner conductor layer 9, that is, less than 25 μm. To stop the perforation of the drill bit. Moreover, the conductor layer is also electrically conductive for its stability, and needs to be completed. Since the first insulating layer 14 can be perforated, the perforation of the drill bit is stopped at the appropriate position, and the detection accuracy of the drill height position in the machining is required to be approximately ±2 μm.

Therefore, as an apparatus or method for detecting the processing of the punching position of the spindle bit, conventionally, the following apparatus will be considered. In the first embodiment, for example, when the substrate described in FIG. 3 is to be countersunk from the front side to the first inner conductor layer 9, the substrate is mounted on the pedestal in the multilayer substrate, and the countersink is used for processing. When the first inner conductor layer 9 is exposed, the electrode is pulled out and the electrode is pulled out, and one of the power sources is connected to the spindle bit of the substrate processing apparatus (or the rotor integrated therewith) a probe is disposed at the other end of the power source to be in contact with the pull-out electrode, whereby the drill bit is perforated from the surface side and reaches the first inner conductor layer 9, by the front end of the drill and the first inner conductor layer 9 contact, the electrical circuit will become a closed circuit, the current from the power supply will flow, thereby signalling it to control the rotation of the drill bit.

Further, although the contact between the drill and the desired inner conductor layer is electrically detected in the same manner, in order to avoid the disadvantage of the first device, one of the poles of the power source and the spindle bit of the substrate processing apparatus are connected (or As a second device, as a second device, as follows, it is practical to apply a high-frequency current and detect a change in current through the electrostatic capacitance by the presence of an electrostatic capacitance between the rotor on which the drill is attached and the spindle body. By. That is, as shown in FIG. 4, the GDN line 23 is connected to the casing 36 of the substrate processing apparatus B via the coaxial cable 19 from the high-frequency power source 18, and the output line 24 and the converter 39 are connected. Input one end of the winding wire 40, and then The other end of the input winding 40 is connected to the spindle body 1. At this time, the mandrel main body 1 is provided to the casing 36 in insulation by the insulator 37. There is a certain electrostatic capacity p between the rotor 3 on which the drill 5 is mounted and the spindle body 1. Further, the output winding 42 of the current transformer 39 is connected to the detector 22 via the detector circuit 21.

On the other hand, the substrate 7 shown in FIG. 3 is used as a detection target, and the first inner conductor layer 9 is used as a desired inner conductor layer, and the substrate 7 is fixed to an insulating processing table in the casing 36. At the same time, the mandrel a is positioned at a predetermined position above the detection target substrate 7. In addition, a high-frequency current of 1 MHz is applied from the high-frequency oscillator 18 to rotate the drill 5, and the spindle a is lowered, and the substrate 7 is punctured, and the front end of the drill 5 and the first inner conductor layer 9 are copper. When the foil is in contact, the mandrel a connected to the input winding 40 passes through the electrostatic capacitance p between the rotor 3 and the spindle body 1, and current flows to the rotor 3, the drill 5, and the first inner conductor layer 9. Further, the electrostatic capacitance r between the first inner conductor layer 9 and the casing 36 flows through the casing 36, and returns to the high frequency oscillator 18. Further, with the newly generated current, magnetic flux is generated in the iron core 41 of the current transformer 39, a new current is generated in the output winding 42, and a newly generated current is passed through the detecting circuit 21, and is detected by the detector 22. It is possible to detect the case where the drill bit 5 perforates the first insulating layer 14 and the front end thereof has reached the first inner conductor layer 9. The detection result is transmitted as a signal to a control unit (not shown), and the control unit issues an instruction necessary to stop the rotation of the drill 5 or the like. Thereby, it is possible to determine the height position of the first inner conductor layer 9 which is the desired inner conductor layer of the detection target substrate 7 fixed on the processing table of the substrate processing apparatus B from the processing table, in order to accurately perforate the substrate. It is desirable that the inner conductor layer, that is, the first inner conductor layer 9, starts from the mandrel a before processing How much distance should be dropped from the initial position as information (this information is called "down distance information").

However, when the tip end of the drill 5 is simply in contact with the first inner conductor layer 9, the electric circuit becomes a closed circuit, and a current from the power source flows, whereby the first device in the signal is actually formed. There is a disadvantage that it is necessary to form a mandrel of one of the power sources and the substrate processing apparatus, and it is necessary to form a very difficult configuration in which a high-speed rotating drill or a rotor integrated therewith is formed to form a closed circuit.

Further, in the apparatus using the second high frequency described above, there are also the following disadvantages. That is, first, the mandrel body must be electrically insulated from the casing, but the insulation method thereof is extremely difficult in construction and high in cost. Second, even if the mandrel main body is electrically insulated from the casing by the insulator, and the electronic component such as the motor winding wire in the mandrel is passed through, the electrostatic capacitance t exists between the mandrel main body and the casing, even if the mandrel is present. The front end of the drill bit is not in contact with the desired inner conductor layer. When the electrostatic capacitance t is transmitted, current flows, and the current thereof becomes an external influence factor when the current is detected by the detector. It is difficult to determine whether the front end of the drill bit and the desired inner conductor layer are There is contact, which reduces the accuracy of the judgment. Thirdly, when it is desired that the area of the inner conductor layer, that is, the copper foil itself is small, the electrostatic capacity r between the inner conductor layer and the casing is desired to be small, so that the front end of the drill 5 and the first inner conductor The layer 9 is the copper foil contact, so the newly generated current is also weak, and the current change thereof is buried in the external influence factor, even if the output current 42 of the converter 39 is to detect the newly generated current, the determination accuracy is changed. Since it is low, it is necessary to adjust the determination reference value depending on the type of each substrate. Therefore, it can be said that the time required for processing becomes long. Fourth, the rotor has to use air bearings to Supporters, with ceramic bearings to support, but in the mandrel for machining or router processing, mainly using ceramic bearings. However, compared with the electrostatic capacity of the ceramic bearing (that is, the electrostatic capacity between the spindle body and the rotor when the ceramic bearing is used) is about 200 pF, the electrostatic capacity of the air bearing (ie, the mandrel body and the rotor when the air bearing is used) The electrostatic capacitance between them is about 1000 pF. When a ceramic bearing is used, the electrostatic capacity between the main body and the rotor is approximately one-fifth, and therefore, between the main body and the rotor. In the method of changing the current of the electrostatic capacitance, the amount of change is very small, and it is difficult to determine the presence or absence of the change, and the determination accuracy is lowered. Fifthly, in the processing of the substrate, the high precision is required, and as described in the second to fourth embodiments, the determination accuracy is lowered. For example, when the same countersink processing is applied to a large number of substrates having the same size and structure, In order to maintain the machining accuracy, it is necessary to adjust the determination reference value for each piece, so that there is a disadvantage that the processing time becomes long. Sixth, as described in the first aspect, since the mandrel main body must be insulated from the casing, the mandrel cannot be connected to the ground wire, and the mandrel becomes a so-called ungrounded metal. Therefore, in order to ensure safety, individual correspondence is required. And incur increased costs.

Advanced technical literature Patent literature

[Patent Document 1] Japanese Laid-Open Patent Publication No. 61-131804

[Patent Document 2] Japanese Patent Laid-Open No. Hei 8-130379

Summary of invention

The problem to be solved is that in the case of using a conventional high-frequency AC device, the absolute amount of current change detected is less in the presence of external influence factors, so that sufficient accuracy cannot be obtained, and therefore, there is a high The problem of processing with high precision and long processing time requires the problem that the mandrel body is insulated from the casing and thus has a high cost.

In the invention of the present invention, the same processing is applied to a large number of substrates having the same size and structure during the processing of the substrate. Therefore, the substrate to be detected is made into two groups, and one of the groups is interactively used as a comparison object. Before the processing, there is no current generated on the output winding side of the converter, and one of the spindle drills will fall and contact with the desired conductor layer, thereby flowing current from the new substrate to the drill bit and the rotor, and then passing through the rotor. The electrostatic capacity between the main body and the main body of the mandrel, the rotor, the main body, and the casing have a current flowing, thereby using the current thereof to detect the current generated by the output winding side of the converter, and thereby detecting the falling distance of the drill bit. . Therefore, when it is connected to the desired conductor layer of each of the substrates which are input from the high-frequency AC power source through the converter and is connected to one of the groups, the input winding current of the converter is connected to the converter. The magnetic fluxes offset each other.

The present invention is a mandrel drop distance information detecting mechanism that detects a falling distance of a spindle bit of a substrate processing apparatus in which a mandrel is assembled, and has two high-frequency AC power sources and two input winding wires having the same number of windings, and A high-frequency current transformer for one or more output coils is provided, and the object to be detected and the object to be compared with the same substrate are individually and independently insulated from the casing of the substrate processing apparatus. And fixed In the case of processing on the processing table in the casing, one of the high-frequency AC power supply outputs is connected to the casing, and the other is transmitted through the two input winding wires of the current transformer, and is present in each of the two substrates. It is desirable that the conductor layers are connected such that the respective input winding currents cancel each other in the direction of the magnetic flux generated by the current transformer, and the change in current generated by the contact between the front end of the spindle bit and the desired conductor layer of the object substrate is taken as The change in current output from the converter is detected using a detector.

Therefore, in a state in which the drill of the mandrel and the two substrates are not in contact with each other, the current flowing toward the two input winding wires and proportional to the electrostatic capacitance between the substrate and the casing is the same, and therefore, the current is generated. The magnetic fluxes are offset from each other. Obviously, as there is no electrostatic capacity between the desired conductor layer and the casing of each substrate, no output current is generated at the output winding of the converter, and the output on the output winding side becomes " 0". However, when the spindle bit is in contact with the substrate to be inspected, the current flowing toward the input winding on the side of the contact by the drill bit only increases the current component fixed in proportion to the electrostatic capacity of the rotor and the spindle body of the drill. Therefore, the current flowing to the two input windings will become different, and the magnetic flux generated by the current will not be offset due to the different components of the current, so there will be an output current generated in the output winding. . The output current is detected by a detector to determine contact with a desired conductor layer present between the drill and the substrate. As described above, the presence or absence of the contact can be detected by the "1" or "0" signal. Therefore, the presence or absence of the contact can be measured accurately and accurately at low cost, and after assembling the mandrel drop distance information detecting mechanism, In the assembled substrate processing apparatus in which the mandrel is assembled, it is also possible for the so-called unevenness of the substrate or the consumption of the drill bit, the temperature change of the drill bit or It is desirable to change the size of the expansion or contraction of the conductor layer, and to perform the blind hole machining or the countersink processing correctly, and the mandrel is a small electrostatic capacitance between the rotor and the mandrel body using the fixed mandrel bit. Ceramic bearing.

Further, as a different configuration, the spindle falling distance information detecting means detects the falling distance of the spindle bit of the substrate processing apparatus in which the spindle is assembled, and has two high-frequency AC power sources and two input windings having the same number of windings. A high-frequency converter including one or more output windings, and a dummy substrate circuit in which a capacitor and a switch arranged in series are arranged in a group and the capacitor and the switch are arranged in parallel, and the detection is performed. The object substrate is insulated from the casing of the substrate processing apparatus, and when it is fixed to the processing table in the casing, one of the high-frequency AC power supply outputs is connected to the casing, and is connected to one of the terminals of the analog substrate circuit. The other side is connected to the desired conductor layer existing in the substrate to be detected and the other terminal of the analog substrate circuit through the two input winding wires of the current transformer, and the switch of the analog substrate circuit is adjusted to be The electrostatic capacitance generated between the desired conductor layer of the object substrate and the casing is substantially equal, thereby making each input winding current The magnetic fluxes generated by the current transformers are offset from each other, and the change in current generated by the contact of the front end of the spindle bit with the desired conductor layer is detected by a detector as a change in current output from the converter.

Thereby, the electrostatic capacitance generated between the casing and the desired conductor layer of the substrate to be inspected is measured beforehand, and the switch of the analog substrate circuit is operated to have substantially the same electrostatic capacitance as that, whereby the object to be compared can be used. Use this analog substrate circuit instead, in order to detect the spindle bit The descending distance information can be accurately processed only for the purpose of fixing the substrate to be inspected to the processing table in the casing, so that processing of a large number of substrates can be performed in a shorter time.

Further, this is a substrate processing apparatus in which a mandrel provided with any one of the mandrel descent distance information detecting means is incorporated, and the mandrel is controlled in accordance with the falling distance information detected by the mandrel descent distance information detecting means. The body of the action is the body.

The operation of the mandrel is controlled based on the information detected by the falling distance information detecting means, whereby the processing of a large number of substrates can be performed in a short time and accurately.

The mandrel descent distance information detecting mechanism of the invention of the present application is one of the following excellent effects, and the "1" and "0" signals can be used to detect the presence or absence of the contact thereof, so that the mandrel of the rotor is supported by a ceramic bearing, Even if the mandrel with a small electrostatic capacitance between the rotor and the main body of the mandrel can correctly detect whether the tip end of the drill bit is in contact with the desired conductor layer, and the external influence factor can be eliminated, the high-precision detection can be surely performed. The presence or absence of contact. Therefore, blind hole processing, countersink processing, and the like can be performed stably and correctly even for variations in the substrate, the consumption of the drill bit, the change in temperature, or the change in the size of the expansion or contraction of the desired conductor layer. Further, it is an excellent effect that the surface of the desired conductor layer can be surely exposed by the operation of the mandrel by controlling the movement of the mandrel and accurately piercing the insulating layer by the drill bit, based on the falling distance information detected by the detecting means. , the desired conductor layer will not be unnecessarily removed, and the performance of the substrate itself will not be damaged, and thus, The mandrel body must be insulated from the casing, and the unnecessary cost for insulation is not required. Moreover, the mandrel body can be grounded, and it is also non-destructive and safe.

Further, in the invention described in the first aspect, the substrate having the same size and structure is used as one of two sets, and one of the substrates is used as the other comparative object. Therefore, even if the detection is changed, In the same manner, after changing the type of the target substrate, the substrate having the same size and structure can be used as one of the two substrates, and one of them can be used as the other comparative object. Therefore, it is not necessary to change the substrate. The determination reference value for judging whether or not the tip of the drill bit is in contact with the desired conductor layer is adjusted, and the processing time can be shortened, thereby reducing the processing cost.

Further, the substrate processing apparatus provided with the mandrel of the mandrel drop distance information detecting means is equipped with the following excellent effects, and the mandrel descent distance information detected by the mandrel descent distance information detecting means is used to control the mandrel. Therefore, when the same processing is applied to a large number of identical substrates, it can be processed correctly in a short time.

1, 2‧‧‧ spindle body

3, 4‧‧‧ rotor

5, 6‧‧‧ drill bit

7, 8‧‧‧ substrate

9, 10‧‧‧1st inner conductor layer

11‧‧‧2nd inner conductor layer

12‧‧‧ surface conductor layer

13‧‧‧back conductor layer

14‧‧‧1st insulation layer

15‧‧‧2nd insulation layer

16‧‧‧3rd insulation layer

17‧‧‧Detection device

18‧‧‧High Frequency Oscillator

19‧‧‧ coaxial cable

20‧‧‧Converter

21‧‧‧Detection circuit

22‧‧‧Detector

23‧‧‧ GND line

24‧‧‧Output line

25‧‧‧1st input winding

26‧‧‧2nd input winding

27‧‧‧ iron core

28‧‧‧ Output winding

29‧‧‧Simulated substrate circuit

30‧‧‧Detection device

31‧‧‧Dip switch

32‧‧‧ capacitor

33‧‧‧ terminals

34‧‧‧ terminals

35‧‧‧Toggle switch

36‧‧‧Shell

37‧‧‧Insulator

38‧‧‧Detection device

39‧‧‧Converter

40‧‧‧Input winding

41‧‧‧ iron core

42‧‧‧ Output winding

t‧‧‧Electrostatic capacity

A, A'‧‧‧ substrate processing equipment

B‧‧‧Substrate processing equipment

a, b‧‧‧ mandrel

K. 1‧‧‧Drop distance information testing agency

K. 2‧‧‧Drop distance information testing agency

P, q, r, s‧‧‧ electrostatic capacity

Fig. 1 is a schematic view showing the configuration of a mandrel drop distance information detecting mechanism. (Example 1)

Fig. 2 is a schematic view showing the configuration of a different mandrel falling distance information detecting mechanism. (Example 2)

FIG. 3 is a schematic view showing a structure of a substrate to be detected.

FIG. 4 is a schematic view of a conventional example.

This is the purpose of improving the detection accuracy with low cost, which is When the same substrate is used as two sets, and the input winding wire that passes through the converter from the output side of the high-frequency AC power source is connected to a desired conductor layer of each of the substrates of the group, the connection is changed. The input winding current of the flow device is achieved by canceling the direction of the magnetic flux generated by the converter. In other words, this is because there is an influencing factor in the comparison object substrate, so there is no output current on the output side of the converter due to the difference between the two, and the front end of the drill is It is desirable that the conductor layer is in contact, and a residual current flows toward the substrate of the detection object. Due to the remaining current, the input winding current of the converter cannot be completely offset in the direction of the magnetic flux generated by the converter, but is in the variable current. An output current is generated on the output winding side of the device, and this is detected by the detector, thereby detecting the object substrate to determine the contact between the tip end of the drill and the desired conductor layer, and detecting the position or distance thereof.

In addition, in order to accurately detect the falling distance information of the mandrel even with one substrate, the analog substrate circuit is used instead of the same substrate as the two substrates in the same substrate.

Further, in order to apply the processing to the same large number of substrates for a short period of time, the substrate processing apparatus incorporating the mandrel is provided with the falling distance information detecting means based on the mandrel and the detected falling distance information. The mechanism of the movement of the mandrel.

[Example 1]

Fig. 1 is a schematic view showing a first embodiment of the invention of the present application. a is a mandrel, and is provided on the side of the object substrate 7 to be detected, and is composed of a rotor 3 supported by a mandrel main body 1 and the mandrel body 1 by a ceramic bearing, and a drill bit for supporting the countersink hole of the rotor 3. 5 is composed, b is the same mandrel, most It is initially provided on the side of the comparison object substrate 8, and is composed of a rotor 4 supported by a ceramic bearing in the spindle main body 2, and a drill 6 for supporting countersinking of the rotor 4. A is a substrate processing apparatus that performs countersink processing or the like using the mandrel axes a and b. Moreover, the mandrel drop distance information detecting mechanism of the invention of the present application K. 1 is composed of two sets of substrates 7 and 8 which are described later, two sets of spindles a and b, and a detecting device 17, and an electric circuit that connects these lines. Further, in the present embodiment, the case where the mandrels a and b are two is displayed. However, the substrates 7 and 8 are alternately used as the object to be detected and the object to be compared, whereby the respective substrates 7 and 8 are individually detected and lowered. Distance information. Moreover, usually, one processing device is provided with a mandrel of a multiple of two, so at this time, the mandrel of the present embodiment can be lowered by the distance detecting mechanism K. 1 Set one set of the mandrel to one set. However, although the two mandrels a and b are not shown, they are configured to be interlocked with the casing 36 of the substrate processing apparatus A in the X-axis direction of the horizontal direction (the horizontal direction of the paper). The direction of the Z-axis is driven individually. On the other hand, in the Y-axis direction in the backward direction, the substrates 7 and 8 fixed thereto are driven by the processing table. Further, the mandrels a and b are electrically connected to the casing 36 individually. However, the rotors 3 and 4 of the two mandrels a and b are individually supported by the mandrel bodies 1 and 2 by ceramic bearings, so that the mandrels 1 and 2 and the rotors 3 and 4 are insulated from each other. However, since the electrostatic capacitances p and q exist between the respective mandrels 1 and 2 and the respective rotors 3 and 4, it can be said that the capacitances are high-frequency (also, in order to show the existence of electrostatic capacitances p and q in Fig. 1) The mandrel main bodies 1 and 2 are connected to the respective rotors 3 and 4 through a capacitor by a broken line, but the description is simply shown schematically between the respective mandrel bodies 1 and 2 and the rotors 3 and 4. The electrostatic capacitances p and q exist in the description, and actually There are no connections or components present. The connection of the capacitors described by the dashed lines is also the same. ). On the other hand, in each of the mandrels a and b, the respective rotors 3 and 4 and the respective drills 5 and 6 are electrically connected to each other.

However, the substrate 7 to be detected is electrically insulated from the ground of the casing 36, and is fixed to a processing table (not shown) that is driven in the Y-axis direction as described above, and the object substrate 8 is also compared. The ground of the same casing 36 is fixed to the electrically insulated processing table, and the two substrates 7 and 8 are also insulated. The two substrates 7 and 8 are substrates having a multilayer structure having the same structure and size as described later, and the Z-axis direction (height direction) of the substrate processing apparatus A is located at the same position as the X-axis direction (paper surface lateral direction), and is fixed to the processing table. It can be linked and moved with respect to the Y-axis direction (the direction in which the paper faces backward). Further, as shown in FIG. 3, the internal structures of the two substrates 7, 8 become a multilayer structure, and the insulating layers 14, 15, 16 which are three layers and the surface and back conductor layers 12, 13, and the first one are sandwiched. The first inner conductor layers 9 and 10 between the insulating layer 14 and the second insulating layer 15 and the second inner conductor layer sandwiching between the second insulating layer 15 and the third insulating layer 16 11 to form. The conductor layers 9, 10, 11, 12, 13 are all copper foils having a thickness of 12 to 25 μm. Further, each of the insulating layers 14, 15, 16 is made of a thermoplastic resin, and the individual thickness is 50 to 100 μm. Further, in the present embodiment, it is an object to perforate the surface of the first inner conductor layer 9 by the mandrel a, and detect the drop of the mandrel a required to expose the surface of the first inner conductor layer 9. Since the first inner conductor layer 9 is a desired inner conductor layer, in FIGS. 1 and 2 and 4, the internal structures of the substrates 7 and 8 are omitted, and as a desired conductor layer, only The first inner conductor layers 9, 10 to be turned on are roughly described. And within the first of each of the substrates 7, 8 The electrostatic capacitances r and s exist individually between the layer conductor layers 9, 10 and the casing 36.

On the other hand, 17 is a detecting device composed of a high frequency oscillator 18, a coaxial cable 19, a converter 20, a detecting circuit 21, and a detector 22, and the high frequency oscillator 17 outputs a height of approximately 0.5 to 2 MHz. The alternating current of the frequency, the high frequency alternating current of the output passes through the coaxial cable 19, the GND line 23 of which is connected to the casing 36, and the other output line 24 and the input winding of the same number of coils of the converter 20 That is, the first input winding 25 and the second input winding 26, which are connected to each other, are connected to each other. The two input winding wires 25, 26 are wound to the right from the side indicated by m, and the same number of windings are wound. When the first input winding 25 is wound up, the first input winding 25 is connected to the beginning of the winding of the second input winding 26, and the above output is connected thereto. Line 24. Further, the end portion of the first winding wire 25 at the beginning of the winding wire is connected to the first inner conductor layer 9 which is a desired conductor layer of the detection target substrate 7, and the end portion of the winding end point of the second input winding wire 26 is The first inner conductor layer 10 of the object substrate 8 is compared and connected. In the case where the two input windings 25, 26 of the converter 20 are of the same number of windings, the output line 24 is connected to the middle of the two input windings 25, 26, so that the input windings 25, 26 become opposite volumes. The coils of the same number of windings are wound, and the magnetic flux directions generated by the iron cores 27 of the current transformers 20 cancel each other, and no current is generated on the output winding 28 side. Further, both ends of the output winding 28 of the converter 20 are connected to the detector circuit 21 composed of four diodes, and the detector circuit 21 is connected to the detector 22.

As described above, the mandrel falling distance information detecting mechanism K. 1. When the substrate 7 to be detected and the substrate 8 to be compared are the same structure and the same shape and size, they are individually insulated from the casing 36 and fixed on the processing table of the same height. From the high frequency oscillator 18 will When there is a high-frequency alternating current of 1 MHz, one of them is connected to the high-frequency oscillator 18, the coaxial cable 19, the output line 24, the first input winding 25, and the first inner conductor layer 9 of the substrate 7, It is separated from the output line 24, and is connected to the second input winding 26 and the first inner conductor layer 10 of the substrate 8, and the other is connected to the high frequency oscillator 18, the coaxial cable 19, the GND line 23, and the housing. 36 to connect. Further, the electrostatic capacitances r and s which are present between the first inner conductor layers 9, 10 and the casing 36, which are desired conductor layers of the respective substrates 7, 8 and the area of each of the first inner conductor layers 9, 10 Since the distance between each of the first inner conductor layers 9, 10 and the casing 36 is equal, it is generally a value between about 100 and 2000 pF and becomes the same value. Therefore, the drills 5 and 6 of either of the two mandrels a and b are in contact with the first inner conductor layers 9 and 10 of the respective substrates 7 and 8 and are directed to the first input winding 25 and A current proportional to the capacitance r between the input winding 25 and the casing 36 flows, and a current proportional to the electrostatic capacitance s between the second input winding 26 and the casing 36 is applied to the second input winding 26. When the electrostatic capacitances r and s of the both sides are equal, the number of windings of the first input winding 25 and the second input winding 26 is the same and is wound in the opposite direction, so that the iron of the converter 20 The alternating magnetic flux generated by the core 27 is offset, and no output current is generated at the output winding 28 of the converter 20, and the detector 22 does not detect the current.

Therefore, in the first step, the mandrels a and b are individually provided on the same plane, and the distance from the tip end of the drill 5 of the spindle a to the detection target substrate 7 and the tip of the drill 6 from the spindle b to the comparison object are obtained. When the distances from the substrate 8 are equal, the mandrel a is operated, and the drill 5 is perforated from the surface side of the substrate 7 to the first inner conductor layer 9 which is a desired conductor layer, and the first inner conductor layer 9 When the layer conductor layer 9 is in contact, not only the electrostatic capacitance r between the first inner conductor layer 9 and the casing 36, but a new circuit is formed, and the circuit is a high frequency oscillator 18, a coaxial cable 19, and an output line. 24. The first input winding 25, the first inner conductor layer 9 of the substrate 7, the drill 5, the rotor 3, the rotor 3, and the electrostatic capacitance p existing between the spindle body 1, the spindle body 1, the housing 36, and the GND The wire 23, the coaxial cable 19, and the return to the high frequency oscillator 18 (again, generally, the electrostatic capacitance p between the insulated rotor 3 and the spindle body 1 is about 100 to 400 pF.), and according to the static electricity thereof Capacity p to increase the current flowing. Therefore, the current flowing through the first input winding 25 increases, and the current flowing between the first input winding 25 and the second input winding 26 differs, and the magnetic flux generated by the two input windings 25 and 26 cannot be offset. pin. As a result, an output current is generated at the output winding 28 of the converter 20, and the detector 22 is used to detect the output current rectified by the detector circuit 21. The detector 22 is set to output a signal as a detection signal when the output current from the detector circuit 21 exceeds a certain set value.

The initial position before the start of the machining operation of the spindle a and the height of the machining table fixed to the detection target substrate 7 are set to a fixed position beforehand, and the drill 5 and the desired conductor layer which are the spindles a are detected by machining. The inner conductor layer 9 is in contact with each other, whereby the height from the surface of the stage to the position of the first inner conductor layer 9 of the substrate 7 (hereinafter referred to as "the desired conductor layer height") is measured. It is found that the falling distance from the initial position at which the mandrel a is processed to the first inner conductor layer 9 of the substrate 7 can be stored in the control portion of the substrate processing apparatus A.

Next, in step 2, the object to be detected 7 in step 1 is used as a comparison object, and conversely, the object to be compared 8 in step 1 is made. In the same manner as in step 1, the mandrel b is operated this time, and the same operation as when the mandrel a is operated is performed, thereby detecting the first inner conductor layer of the object substrate 8 to be detected. The height from the 10th position is determined by the falling distance from the initial position of the mandrel b to the first inner conductor layer 10 of the substrate 8, so that it can be stored in the control unit of the substrate processing apparatus A.

Next, as step 3, the respective falling distances of the mandrels a and b are controlled by the information stored in the above, and the substrates 5, 6 of the mandrels a and b are used to punch the substrate, and then the holes can be accurately and quickly It is desirable that the conductor layer be exposed.

Further, more practically, the substrate itself or the desired conductor layer thereof is liable to be slightly distorted or skewed, so that the same detection is performed on a single object substrate 7 (and 8). , determining the height of the desired conductor layer at each detection point, and taking the average value as the height of the desired conductor layer, and determining the falling distance of the mandrels a and b, and dropping the distance information memory The punching process of the substrates of the drills 5 and 6 of the spindles a and b is controlled by the control unit of the processing apparatus A.

As described above, in the case where the same substrate is used in two sets, the high-frequency alternating current applied to the two substrates 7, 8 is used in the converter having two input windings 25, 26. 20 The magnetic flux directions generated are offset each other, so that the external influence factors other than the electrostatic capacity p (or q) of the rotor 3 (or 4) and the spindle body 1 (or 2) can be completely removed. The presence or absence of contact between the drill bit 5 of the mandrel a and the desired conductor layer (or the presence or absence of contact of the drill bit 6 of the mandrel b with the desired conductor layer) does not vary with current, but according to the rotor 3 (or 4) and the heart The electrostatic capacity p (or q) between the shaft bodies 1 (or 2), and detected by whether there is a signal of "1" or "0" of current flow, the rotor is like a countersunk hole supported by a ceramic bearing in the spindle body The mandrel for processing or router processing can be easily judged even when it is a mandrel with a small electrostatic capacitance. Further, it is not necessary to completely electrically insulate the mandrels 1 and 2 from the casing 36, and the mandrels 1 and 2 can be grounded to improve safety.

Further, when the substrates 7 and 8 of the mandrels a and b are processed, the correct falling distance information of the mandrels a and b can be obtained, so that the same amount as the substrates 7 and 8 can be obtained based on the falling distance information. The substrate is processed correctly, and as a result, it can be processed at low cost.

[Embodiment 2]

Figure 2 shows K. 2 is another embodiment in which the falling distance information detecting means for the mandrel is displayed. In the first embodiment, two sets of the substrate, the number of the mandrels, and one of the detecting devices are set as one set, and the object substrates 7 and 8 are detected. It is desirable that the position of the conductor layer is detected by the steps 1 and 2, and the composition and characteristics of the conductor layer are left, and the occurrence of the processing speed due to the shifting time and the processing of the same large number of substrates is prevented. In the second embodiment, one object of the detection target substrate, one mandrel, and one detection device are one set, and the analog substrate circuit 29 is assembled instead of the comparison target substrate 8 to be the detection target substrate 7. For the detection device 30. That is, the analog substrate circuit 29 individually arranges the eight capacitors 32 and the eight finger switches 31 in series, and sets the capacitors 32 and the finger switches 31 arranged in series as one set, and these eight sets are arranged in parallel. These capacitors 32 are individually of different capacities, and 10pF, 22pF, 48pF, 100pF, 220pF, 470pF, 1000pF, respectively, are used here. 2200pF capacity. The high-frequency oscillator 18 is connected to the coaxial cable 19, the output line 24, the first input winding 25, and the first inner conductor layer 9 of the substrate 7 as the detection target, and the output line 24 starts from the output line 24. The second input winding 26 is connected to the terminal 33 of the analog substrate circuit 29. Further, in order to be used in the same manner as in the first embodiment, it is branched in the middle of the connection from the second input winding 26 to the dummy substrate circuit 29, and is made to face the first inner conductor layer 10 of the substrate 8 which is a comparative object. connection. Further, the high-frequency oscillator 18 is branched in the middle of the GND line 23 that continues to be connected to the coaxial cable 19, the GND line 23, and the casing 36, and is connected to the other terminal 34 of the analog board circuit 29.

In this case, the static electricity between the first inner conductor layer 9 and the casing 36, which is the desired conductor layer of the substrate 7 in a state where the substrate 7 to be detected is placed on the processing table of the substrate processing apparatus A', can be used. The detection of the capacity r is completed, and the eight finger switches 31 of the analog substrate circuit 29 are appropriately energized to have substantially the same electrostatic capacitance. As a result, the electrostatic capacitance generated in the dummy substrate circuit 29 becomes a substitute for the comparison target substrate 8. As in the case of the first embodiment, when the spindle a is operated and the drill 5 is in contact with the detection target substrate 7, When the first inner conductor layer 9 is passed, a current flows through the electrostatic capacitance p between the mandrel main body 1 and the rotor 3 of the mandrel a which has been operated, so that two inputs are made in the converter 20. The magnetic fluxes generated by the winding wires 25, 26 are not offset each other, and magnetic flux is generated on the side of the output winding 28, and a current is generated. Therefore, the presence of the current is detected by the detector 22, thereby identifying the drill bit 5 of the mandrel a. It is in contact with the first inner conductor layer 9 which is a desired conductor layer of the substrate 7. Further, the subsequent processing based on the contact information is the same as in the case of the first embodiment.

Moreover, in the second embodiment, eight dip switches of the analog substrate circuit 29 are made. When all 31 are OFF, the comparison target substrate 8 is fixed to the processing stage, and the second input winding 26 is connected to the first inner conductor layer 10 which is a desired conductor layer of the substrate 8, and may be an embodiment. The detection device of 1 is used.

The falling distance information detecting mechanism shown in Embodiment 2 is K. 2 After the two groups are equipped, as in the first embodiment, the steps of the steps 1 and 2 are not followed, but the falling distance information of the two substrates can be simultaneously obtained, and the processing speed can be improved. However, in the second embodiment, unlike the first embodiment, the type of the substrate is changed, and the electrostatic capacitance between the substrate and the casing of the object to be processed is changed, and the setting of the eight dip switches 31 of the analog substrate circuit 29 must be changed. .

Further, it is needless to say that not only the inner conductor layer but also the mandrel fall distance information for detecting the surface or the back conductor layer can be used in Examples 1 and 2.

Industrial availability

Therefore, by applying a high-frequency alternating current to detect a change in current generated by one of the electrostatic capacitances, it is determined whether or not the contact between the two conductors is present, and therefore, not only the substrate processing of the spindle bit but also It can be widely applied to the purpose of determining the presence or absence of contact of a conductor during processing of a mechanical device.

1, 2‧‧‧ spindle body

3, 4‧‧‧ rotor

5, 6‧‧‧ drill bit

7, 8‧‧‧ substrate

9, 10‧‧‧1st inner conductor layer

17‧‧‧Detection device

18‧‧‧High Frequency Oscillator

19‧‧‧ coaxial cable

20‧‧‧Converter

21‧‧‧Detection circuit

22‧‧‧Detector

23‧‧‧ GND line

24‧‧‧Output line

25‧‧‧1st input winding

26‧‧‧2nd input winding

27‧‧‧ iron core

28‧‧‧ Output winding

36‧‧‧Shell

Claims (3)

A mandrel drop distance information detecting mechanism detects a falling distance of a spindle bit of a substrate processing apparatus in which a mandrel is assembled, and has two high-frequency AC power sources and two input winding wires having the same number of windings, and one or more A high-frequency current transformer for the winding wire is outputted, and the object substrate to be detected and the object to be compared with the same substrate are separately formed as two sheets, and are individually insulated from the casing of the substrate processing apparatus and fixed to the substrate. In the case of the processing table in the casing, one of the high-frequency AC power supply outputs is connected to the casing, and the other is transmitted through the two input winding wires of the current transformer, and is individually required to exist in each of the two substrates. The conductor layers are connected such that the respective input winding currents cancel each other in the direction of the magnetic flux generated by the current transformer, and the change in current generated by the contact between the front end of the spindle bit and the desired conductor layer of the object substrate is taken as The change in current output from the converter is detected using a detector. A mandrel descent distance information detecting means for detecting a falling distance of a spindle bit of a substrate processing apparatus incorporating a mandrel, comprising: a high-frequency AC power supply and two input windings having the same number of windings, and having one or more outputs A high-frequency current transformer for winding a wire, and a dummy substrate circuit in which a capacitor and a switch arranged in series are arranged in a group and the capacitor and the switch are arranged in parallel, and the object substrate to be detected is processed from the substrate processing device. The casing is insulated, and when the casing is fixed to the processing table, one of the high-frequency AC power supply outputs is connected to the casing, and is connected to one of the terminals of the analog substrate circuit, and the other is connected The two input winding wires of the current transformer are individually connected to a desired conductor layer existing in the substrate to be detected and the other terminal of the analog substrate circuit, and the switch of the analog substrate circuit is adjusted to be detected with the object to be detected. The electrostatic capacitance generated between the desired conductor layer of the substrate and the housing is substantially equal, whereby the magnetic flux generated by each of the input winding currents in the current transformer is offset from each other and is provided by the front end of the spindle bit and the desired conductor layer. The change in the current generated by the contact is detected by a detector as a change in the current output from the converter. A substrate processing apparatus equipped with a mandrel, comprising the mandrel falling distance information detecting mechanism of claim 1 or 2, and being provided with the action of controlling the mandrel according to the falling distance information detected by the mandrel descent distance information detecting mechanism The body is made.