JP5807863B2 - A substrate processing apparatus incorporating a spindle lowering distance information detection mechanism and a spindle lowering distance information detection mechanism - Google Patents

Description

  The present invention grasps the position of the tip of the drill by performing the drilling process or the counterbore processing on the printed circuit board having a multilayer structure by a substrate processing apparatus incorporating a spindle provided with a drill at the tip. The present invention relates to a spindle lowering distance information detection mechanism that enables accurate processing to a desired inner conductor layer of a printed board.

Conventionally, as processing for a printed circuit board (hereinafter simply referred to as “substrate”) by a substrate processing apparatus (hereinafter simply referred to as “apparatus”) incorporating a spindle, through-hole processing or peripheral processing is generally performed. Are known. In addition, the through hole processing is a hole processing such as a through hole for component mounting and a via hole for connecting the front and back of the wiring pattern to the substrate raw material before the etching processing for the wiring pattern arranged on the substrate. In addition, the peripheral processing is processing of the outer periphery of the substrate, the substrate mounting hole, and the irregular hole.
However, in recent years, with the substrate itself becoming a multilayered substrate comprising a plurality of insulating layers and a conductor layer provided on or between the insulating layers, through-hole processing, wiring pattern etching processing, etc. have been completed. In this state, blind hole processing, counterbore processing, and the like have been performed as processing on the multilayered substrate. Blind hole processing is to remove unnecessary wiring by removing only part of the via hole to the desired inner conductor layer surface, and counterbore processing is part of the printed circuit board. Is processed until the desired inner layer conductor layer surface is counterbored, an electronic component is mounted on that portion, or only one layer of the back surface conductor is left so that the substrate can be bent there.
Here, the desired inner layer conductor layer refers to a multilayer substrate having a plurality of insulating layers and an inner layer conductor layer sandwiched between appropriate positions of the insulator layers, and is exposed when a worker drills the insulating layer. It refers to the inner conductor layer desired to be made.

  However, in these blind hole processing and counterbore processing, for example, in a multilayered substrate composed of three insulating layers as shown in FIG. 3, it is assumed that the desired inner conductor layer is the first inner conductor layer 9 and The counterbore processing is performed from one insulating layer 14 side (hereinafter referred to as “front surface side” and the opposite third insulating layer 16 side is referred to as “back surface side”) to the first inner conductor layer 9. For example, a drill at the tip of the spindle incorporated in the processing apparatus is used to make a hole in the first insulating layer 14. At this time, the thickness of the first insulating layer 14 is 50 to 100 μm. The first inner conductor layer 9 is formed in a shape that penetrates into one insulating layer 14, and the thickness of the first inner conductor layer 9 is 12 to 25 μm, so that it exceeds the first insulating layer 14. 25 μm which is the thickness of the first inner conductor layer 9 Them below, it is necessary to stop drilling by the drill. Moreover, since the conductor layer needs to remain as much as possible for its stable electrical conduction, in order to stop drilling of the drill at an appropriate position after the first insulating layer 14 is drilled. As a detection accuracy of the height position of the drill being processed, a detection accuracy of approximately ± 2 μm is required.

  Therefore, the following apparatuses have been conventionally considered as an apparatus or method for controlling machining by detecting the drilling position of the spindle with a drill. That is, as the first apparatus, for example, when the counterbore processing is to be performed from the surface side to the first inner conductor layer 9 in the substrate shown in FIG. 3, the counterbore processing of the multilayered substrates mounted on the pedestal is performed. The electrode is drawn out from the first inner conductor layer 9 to be exposed by means of the above, and an extraction electrode is provided, and one pole of the power source is connected to a spindle drill (or a rotor integrated therewith) of the substrate processing apparatus. By providing a probe on the other electrode and making contact with the extraction electrode, the drill is drilled from the surface side to reach the first inner layer conductor layer 9, and the tip of the drill and the first inner layer conductor layer 9 are By contacting, the electric circuit becomes a closed circuit, and the current from the power source flows, so that it is signaled and the rotation of the drill is controlled.

  Still further, the contact between the drill and the desired inner conductor layer is also electrically detected. However, one of the disadvantages of the first apparatus is that one pole of the power source and the drill of the spindle of the substrate processing apparatus (or integrated with it). In order to avoid the difficulty of connecting to the rotor), as the second device, using the fact that there is a capacitance between the rotor to which the drill is attached and the spindle body, as follows, A device that detects a change in current via a capacitance by applying a high-frequency current has been put into practical use. That is, as shown in FIG. 4, the GDN line 23 is connected to the housing 36 of the substrate processing apparatus B from the high frequency oscillator 18 that is a high frequency power source through the coaxial cable 19, and the output line 24 is input to the current transformer 39. Connected to one end of the winding 40, and the other end of the input winding 40 and the spindle body 1 are connected. At that time, the spindle main body 1 is installed insulated from the casing 36 by an insulator 37. A certain capacitance p exists between the rotor 3 to which the drill 5 is attached and the spindle body 1. Further, the output winding 42 of the current transformer 39 is connected to the detector 22 via the detection circuit 21.

  On the other hand, the substrate 7 shown in FIG. 3 is used as a detection target, the first inner conductor layer 9 is used as a desired inner conductor layer, and the substrate 7 is fixed on an insulated processing table in the housing 36, and The spindle a is positioned at a predetermined position above the substrate 7 to be detected. Then, the spindle 5 is lowered while rotating the drill 5 while applying a high frequency current of 1 MHz from the high frequency oscillator 18 to start drilling the substrate 7, and the tip of the drill 5 is the first inner conductor layer. 9, the rotor 3, the drill 5, and the first inner layer conductor from the spindle a connected to the input winding 40 through the electrostatic capacitance p between the rotor 3 and the spindle body 1. A current flows to the layer 9, and further, a current flows to the housing 36 via the electrostatic capacitance r between the first inner conductor layer 9 and the housing 36, and returns to the high-frequency oscillator 18. Then, a magnetic flux is generated in the iron core 41 of the current transformer 39 by this newly generated current, a new current is generated in the output winding 42, and the newly generated current is detected via the detection circuit 21. Detected by the vessel 22, it becomes possible to detect that the drill 5 has drilled the first insulating layer 14 and that the tip has reached the first inner conductor layer 9. The detection result is sent as a signal to a control unit (not shown), and the control unit issues a necessary instruction such as stopping the rotation of the drill 5. As a result, the height position of the first inner layer conductor layer 9 which is a desired inner layer conductor layer of the substrate 7 as the detection target fixed on the processing table of the substrate processing apparatus B from the processing table is determined. In order to accurately perform drilling up to the first inner conductor layer 9, which is a desired inner conductor layer, information on how much distance should be lowered from the initial position of the spindle a before processing is acquired as information. (This information is referred to as “falling distance information”).

However, in the first device in which the electric circuit becomes a closed circuit by simply contacting the tip of the drill 5 and the first inner layer conductor layer 9, and the current from the power source flows to signal it, In fact, it has the drawback of having a very difficult configuration in which a closed circuit must be formed by connecting one pole of the power source and a drill that rotates at high speed in the spindle of the substrate processing apparatus or a rotor integrated therewith. there were.
In addition, the apparatus using the second high frequency has the following drawbacks. That is, first, it is necessary to electrically insulate the spindle body from the housing, but the insulation method is structurally difficult and expensive. Second, even if the spindle main body is electrically insulated from the housing by an insulator, there is a capacitance t between the spindle main body and the housing via an electric component such as a motor winding in the spindle. Even if the drill tip of the spindle is not in contact with the desired inner conductor layer, a current flows through this capacitance t, and this current becomes a disturbance factor when detecting the current with the detector. It is difficult to determine whether or not the drill tip is in contact with the desired inner conductor layer, and the determination accuracy is low. Third, when the area of the copper foil, which is the desired inner layer conductor layer, is small, the capacitance r between the desired inner layer conductor layer and the housing is also small. The current newly generated by contact with the copper foil which is one inner conductor layer 9 is also weak, and the change in the current is buried in the disturbance factor, so that the output winding 42 of the current transformer 39 is newly added. Even if an attempt is made to detect the current generated in the substrate, the determination accuracy is lowered, and therefore, the determination reference value must be adjusted for each type of substrate, which has the disadvantage that the time required for processing becomes longer. Fourthly, the rotor is supported by an air bearing and the one supported by a ceramic bearing. However, a ceramic bearing is mainly used in a spindle for counterbore processing or router processing. However, the capacitance of the ceramic bearing (that is, the capacitance between the spindle body and the rotor when the ceramic bearing is used) is about 200 pF, whereas the capacitance of the air bearing (that is, the air bearing). (Capacitance between the spindle body and the rotor when the motor is used) is about 1000 pF, and when ceramic bearings are used, the static capacity between the body and the rotor is less than that using air bearings. Since the electric capacity is approximately 1/5, the method using the change in current through the electrostatic capacity between the spindle body and the rotor has a very small amount of change, and the presence or absence of the change is determined. This is difficult, and the determination accuracy is lowered. Fifth, high accuracy is required in substrate processing, but the determination accuracy is low as described in the second to fourth aspects. Therefore, for example, the same for a large number of substrates having the same size and structure. Even when this counterbore process is performed, in order to maintain the process accuracy, the determination reference value must be adjusted for each sheet, which has a drawback that the time required for the process becomes longer. Sixth, since it is necessary to insulate the spindle main body from the housing as described in the first, it is impossible to connect a ground to the spindle, and the spindle becomes a so-called floating metal. Therefore, a separate response is required, which leads to an increase in cost.

JP 61-131804 A JP-A-8-130379

  The problem to be solved is that, in the conventional apparatus using high frequency alternating current, there is a disturbance factor and the absolute amount of change in current to be detected is small, and therefore sufficient accuracy cannot be obtained. In addition to the problem that the processing time is increased for high-precision processing, the spindle main body has to be insulated from the casing, resulting in high costs.

  In the present invention, when processing a substrate, the same processing is applied to a large number of substrates having the same size and structure, so that two substrates to be detected are set as one set, and one of the sets is alternated. As a comparison object, before machining, current is not generated on the output winding side of the current transformer, and the drill of one spindle descends and contacts the desired conductor layer to newly drill from the board. , Current flows between the rotor and spindle, and the current flowing between the rotor, spindle main body, and housing through the capacitance between the rotor and spindle main body, thereby detecting the current generated on the output winding side of the current transformer. By doing so, the descending distance of the drill is detected. For this reason, each input winding current of the current transformer is generated in the current transformer upon connection from the high-frequency AC power source through the input winding of the current transformer to the desired conductor layer of each set of boards. The magnetic fluxes to be canceled are connected so as to cancel each other.

  The present invention is a spindle lowering distance information detecting mechanism for detecting the lowering distance of a spindle drill in a substrate processing apparatus incorporating a spindle, and includes a high frequency AC power source, two input windings having the same number of turns, and one or more. A high-frequency current transformer having a plurality of output windings, and a substrate as a detection object and a substrate as a comparison object identical to the same substrate as a set of two pieces, each independently from the housing of the substrate processing apparatus Insulated and fixed on a processing table in a casing, one of the high-frequency AC power supply outputs is connected to the casing, and the other is connected to the two sheets via two input windings of the current transformer. Are connected to a desired conductor layer existing in each substrate so that magnetic fluxes generated by the input winding currents in the current transformers cancel each other, and the desired tip conductor of the substrate serving as the object to be detected and the drill tip of the spindle Caused by contact with the layer The change in current is made is detected by the detector as a change in current output from the current transformer.

  As a result, when the spindle drill is not in contact with either of the two substrates, the current proportional to the capacitance between the substrate and the casing flowing through the two input windings is the same. Therefore, the magnetic fluxes generated by the currents cancel each other, and it appears that there is no capacitance between the desired conductor layer of each board and the housing, and the current winding output winding No output current is generated, and the output on the output winding side is “0”. However, when the spindle drill comes into contact with the substrate that is the object to be detected, the current that flows through the input winding on the contacted side due to the contact with the drill causes a static current between the rotor on which the drill is fixed and the spindle body. Since the current increases in proportion to the capacitance, the currents flowing in the two input windings are not the same, and the magnetic flux generated by the currents remains without being canceled out by the difference between the currents. An output current will be generated. This output current is detected by a detector to determine contact between the drill and a desired conductor layer on the substrate. As described above, since the presence / absence of the contact can be detected by the “1” and “0” signals, the presence / absence of the contact can be accurately and accurately measured at a low cost. Incorporating an information detection mechanism, even in substrate processing equipment that incorporates a spindle using a ceramic bearing with a small capacitance between the rotor that fixes the spindle drill and the spindle body, due to substrate variations, drill wear, and temperature changes Blind hole machining, counterbore machining, etc. can be performed accurately and stably even when the drill or desired conductor layer expands or contracts.

  Another configuration is a high-frequency AC power source, two input windings having the same number of turns, a high-frequency current transformer having one or more output windings, and a pair of capacitors and switches arranged in series. And having a simulated substrate circuit in which a plurality of sets of the capacitor and the switch are arranged in parallel, insulating the substrate as a detection target from the housing of the substrate processing apparatus, and fixing it on the processing table in the housing, One of the high-frequency AC power supply outputs is connected to the housing and connected to one terminal of the simulated board circuit, and the other is a board that is a detection object via two input windings of the current transformer. Connect the desired conductor layer existing inside and the other terminal of the simulated substrate circuit, and switch the simulated substrate circuit so that the capacitance generated between the desired conductor layer of the substrate as the detection target and the housing is substantially equal. By adjusting each input winding The direction of the magnetic flux generated by the current in the current transformer cancels each other, and the change in current caused by the contact between the spindle drill tip and the desired conductor layer is defined as the current output from the current transformer. It is detected by a detector.

  As a result, the capacitance generated between the housing and the desired conductor layer of the detection target substrate is measured in advance, and the simulated substrate circuit switch is operated so that the capacitance is substantially the same. In order to detect the descending distance information of the spindle drill, it is only necessary to fix the substrate to be detected on the processing table in the housing. The target processing can be accurately performed, and processing on a large number of substrates can be performed in a shorter time.

  Furthermore, the substrate processing apparatus incorporates a spindle provided with any one of the spindle lowering distance information detection mechanisms, and controls the operation of the spindle based on the lowering distance information detected by the spindle lowering distance information detection mechanism. The mechanism which performs is provided.

  By controlling the operation of the spindle based on the information detected by the descending distance information detection mechanism, it is possible to perform processing on a large number of substrates in a short time and accurately.

Since the spindle lowering distance information detecting mechanism according to the present invention can detect the presence or absence of the contact by the “1” and “0” signals, the spindle is supported between the rotor and the spindle body like a spindle in which the rotor is supported by a ceramic bearing. Even with a spindle having a small electrostatic capacity, it is possible to accurately detect whether or not the tip of the drill is in contact with a desired conductor layer, and since it is possible to eliminate disturbance elements, it is possible to accurately detect the presence or absence of the contact. Therefore, it is possible to stably perform blind hole machining, counterbore machining, etc. stably even with changes in the size of drill or desired conductor layer expansion or contraction due to substrate variations, drill wear, and temperature changes. It has an excellent effect. Further, by controlling the operation of the spindle based on the descending distance information detected by this detection mechanism, the insulating layer can be accurately drilled by a drill, and the surface of the desired conductor layer can be accurately exposed, Without unnecessary removal of the conductor layer, the performance of the board itself is not impaired, and further, since the spindle body does not need to be insulated from the housing, there is an extra cost for insulation. In addition, the spindle main body can be grounded, and the safety is not impaired.
Furthermore, in the invention according to claim 1, since two substrates of the same size and structure are used as one set and one is used as the other comparison object, even if the type of the detection object is changed, Even after the change, it is determined whether or not the drill tip is in contact with the desired conductor layer because two substrates of the same size and structure are used as one set and one is used as the other comparison object. Therefore, it is not necessary to adjust the determination reference value for each change, and in this respect, the processing time can be shortened and the processing cost can be reduced.

  Further, in the substrate processing apparatus incorporating the spindle provided with the spindle lowering distance information detection mechanism, the operation of the spindle is controlled by the spindle lowering distance information detected by the spindle lowering distance information detection mechanism. In the case where the same processing is performed on this substrate, it has an excellent effect of enabling accurate processing in a short time.

FIG. 1 is a schematic diagram showing a configuration of a spindle lowering distance information detection mechanism. (Example 1) FIG. 2 is a schematic diagram showing the configuration of another spindle lowering distance information detection mechanism. (Example 2) FIG. 3 is a schematic diagram showing a structure of a substrate as a detection target. FIG. 4 is a schematic diagram of a conventional example.

  The purpose of improving the detection accuracy at low cost is to use two identical boards as one set, and each board as one set from the output side of the high frequency AC power supply through the input winding of the current transformer When connecting to the desired conductor layer, each of the input winding currents of the current transformer is connected so that the directions of magnetic fluxes generated in the current transformer cancel each other. That is, since there is a similar disturbance factor in the substrate as a comparison object, there is no output current on the output winding side of the current transformer caused by the difference between the two, and the tip of the drill contacts the desired conductor layer. As a result, excess current flows through the substrate that is the detection target, and the direction of the magnetic flux generated by each input winding current of the current transformer in the current transformer is not canceled out by the excess current. An output current is generated on the output winding side of the detector, and this is detected by the detector to determine that the tip of the drill has contacted the desired conductor layer on the substrate that is the object to be detected. It is to detect.

  In addition, in order to enable accurate detection of spindle lowering distance information with only one substrate, a simulated substrate circuit is used instead of the substrate to be compared when two identical substrates are used as one set. It is what.

  Furthermore, in order to be able to accurately and accurately process a large number of substrates in a short time, the substrate processing apparatus incorporating the spindles is provided with a mechanism for detecting the descending distance information of these spindles and their detection. A mechanism for controlling the operation of the spindle based on the descending distance information is provided.

  FIG. 1 is a schematic diagram showing a first embodiment according to the present invention. a is a spindle, which is provided on the side of the substrate 7 to be detected first, and is supported by the spindle body 1, the rotor 3 supported by the ceramic body with ceramic bearings, and the rotor 3. It comprises a counterbored drill 5, and b is the same spindle, which is first provided on the side of the substrate 8 to be compared, and supported by a ceramic bearing with respect to the spindle body 2, and the rotor 4 comprises a drill 6 for counterboring supported by 4. A is a substrate processing apparatus that performs counterbore processing or the like by the spindles a and b. The spindle descending distance information detecting mechanism K · 1 according to the present invention is configured by connecting a pair of substrates 7 and 8 to be described later, two spindles a and b, a detecting device 17, and a line. It is constituted by an electric circuit. In this embodiment, the case where there are two spindles a and b is shown. However, when the substrates 7 and 8 are alternately set as detection objects and comparison objects, the lowering distances of both the boards 7 and 8 are obtained. Information will be detected. In addition, since a spindle having a multiple of 2 is usually provided in one processing apparatus, the spindle descending distance information detection mechanism K · 1 according to this embodiment is set to two spindles as one set. One piece may be provided. By the way, although the two spindles a and b are not shown in the drawing, they are linked to the housing 36 of the substrate processing apparatus A in the horizontal (horizontal direction) X-axis direction, and the vertical Z-axis direction. Are configured to be individually driven. On the other hand, with respect to the Y-axis direction in the depth direction, when the processing table is driven, the substrates 7 and 8 fixed thereto are interlocked. In addition, the spindles a and b are electrically connected to the housing 36, respectively. By the way, since the rotors 3 and 4 in the spindles a and b are supported by ceramic bearings with respect to the spindle bodies 1 and 2, respectively, the spindle bodies 1 and 2 and the rotors 3 and 4 are insulated from each other. Has been. However, since the capacitances p and q exist between the spindle bodies 1 and 2 and the rotors 3 and 4, respectively, it can be said that they are electrically connected at high frequencies (in FIG. In order to indicate the presence of the electric capacities p and q, the spindle main bodies 1 and 2 and the rotors 3 and 4 are indicated by dotted lines so that they are connected via capacitors. It is only described to schematically show that the capacitances p and q exist between the main bodies 1 and 2 and the rotors 3 and 4, and there are actually some connections and parts. Other than this, the connection through the capacitor indicated by the dotted line has the same meaning.) On the other hand, in each spindle a and b, the rotors 3 and 4 and the drills 5 and 6 are electrically connected.

  By the way, the substrate 7 as the detection object is electrically insulated from the floor surface of the housing 36 and fixed on the processing table (not shown) that is driven in the Y-axis direction as described above. The substrate 8 as a comparison object is also fixed on a processing table which is also electrically insulated from the floor surface of the housing 36, and both the substrates 7 and 8 are also insulated. Both substrates 7 and 8 are multi-layered substrates having the same structure, shape and size as will be described later, and are Z-axis direction (height direction) and X-axis direction (paper surface lateral direction) of substrate processing apparatus A. Are fixed on the processing table so that they can move in conjunction with the Y-axis direction (the depth direction of the paper). Further, the internal structure of both the substrates 7 and 8 is a multilayer structure as shown in FIG. 3, and the insulating layers 14, 15, and 16 formed in three layers, the front and back conductor layers 12 and 13, and the first layers The first inner conductor layers 9 and 10 sandwiched in a part between the insulating layer 14 and the second insulating layer 15, and a part between the second insulating layer 15 and the third insulating layer 16 The second inner conductor layer 11 is sandwiched between the second inner conductor layers 11. The conductor layers 9, 10, 11, 12, and 13 are all copper foils, and the thickness thereof is 12 to 25 μm. Each of the insulating layers 14, 15, 16 is made of a thermoplastic resin and has a thickness of 50 to 100 μm. In the present embodiment, the spindle a is drilled to the surface of the first inner conductor layer 9, and the descending distance information of the spindle a necessary for exposing the surface of the first inner conductor layer 9 is detected. For this purpose, the first inner conductor layer 9 is a desired inner conductor layer. In FIGS. 1, 2 and 4, the internal structure of each of the substrates 7 and 8 is omitted, and the desired conductor is omitted. Only the first inner-layer conductor layers 9 and 10 that are to be conductive as layers are greatly illustrated. Capacitances r and s exist between the first inner conductor layers 9 and 10 of the substrates 7 and 8 and the housing 36, respectively.

  On the other hand, 17 is a detection device comprising a high-frequency oscillator 18, a coaxial cable 19, a current transformer 20, a detection circuit 21, and a detector 22. The high-frequency oscillator 17 outputs a high-frequency alternating current of approximately 0.5 to 2 MHz. Then, the output high-frequency alternating current passes through the coaxial cable 19, the GND line 23 is connected to the housing 36, and the other output line 24 is the two input windings of the current transformer 20 with the same number of turns. That is, each end is connected between the first input winding 25 and the second input winding 26 that are connected to each other. Both input windings 25 and 26 are wound in the clockwise direction from the side designated m, and the winding end of the first input winding 25 and the winding start of the second input winding 26 are connected, The output line 24 is connected there. The winding start end of the first input winding 25 is connected to the first inner layer conductor layer 9 which is a desired conductor layer of the substrate 7 as the detection target, and the second input winding 26 The end of the winding end is connected to the first inner conductor layer 10 of the substrate 8 as a comparison object. Since the two input windings 25 and 26 of the current transformer 20 have the same number of turns, and the output line 24 is connected between the two input windings 25 and 26, each input winding 25 , 26 become coils of the same number of reverse turns, the directions of the magnetic flux generated in the iron core 27 of the current transformer 20 cancel each other, and no current is generated on the output winding 28 side. Then, both ends of the output winding 28 of the current transformer 20 are connected to a detection circuit 21 composed of four diodes, and the detection circuit 21 is connected to a detector 22.

  Since the spindle descending distance information detection mechanism K · 1 is configured in this way, the substrate 7 as the detection object and the substrate 8 as the comparison object have the same structure, the same shape and size, and are independent of each other. Since the high frequency alternating current of 1 MHz is applied from the high frequency oscillator 18, the high frequency oscillator 18, the coaxial cable 19, and the output line 24 are isolated from the casing 36 and fixed on the processing table having the same height. The first input winding 25 is connected to the first inner layer conductor layer 9 of the substrate 7 and is separated from the output line 24 to be separated from the second input winding 26 and the first inner layer conductor layer 10 of the substrate 8. The other is connected to the high-frequency oscillator 18, the coaxial cable 19, the GND line 23, and the housing 36. Further, the capacitances r and s existing between the first inner conductor layers 9 and 10 which are desired conductor layers of the substrates 7 and 8 and the housing 36 are respectively determined by the first inner conductor layers 9 and 9. 10 and the distance between each of the first inner conductor layers 9 and 10 and the housing 36 are generally equal to each other between about 100 to 2000 pF. Therefore, when the drills 5 and 6 of both spindles a and b are not in contact with the first inner layer conductor layers 9 and 10 of the substrates 7 and 8, respectively, A current proportional to the capacitance r between the first input winding 25 and the housing 36 flows, and the second input winding 26 has a second input winding 26 and a housing 36. A current proportional to the capacitance s between the two flows, but both the capacitances r and s are equal, and the number of turns of the first input winding 25 and the second input winding 26 is the same and opposite to each other. Since the winding is wound in the direction, the alternating magnetic flux generated in the iron core 27 of the current transformer 20 is canceled out, no output current is generated in the output winding 28 of the current transformer 20, and the detector 22 Will not be detected.

  Therefore, in Step 1, the distances from the tip of the drill 5 of the spindle a to the substrate 7 that is the object to be detected are equal to the distance from the tip of the drill 6 of the spindle b to the substrate 8 that is the object to be compared. In this way, the spindle a is operated and the drill 5 drills from the surface side of the substrate 7 to the first inner conductor layer 9 which is a desired conductor layer, and the first inner conductor layer 9 , The high frequency oscillator 18, the coaxial cable 19, the output line 24, the first input winding 25, and the substrate 7 are newly added in addition to the capacitance r between the first inner conductor layer 9 and the housing 36. To the first inner conductor layer 9, the drill 5, the rotor 3, the capacitance p existing between the rotor 3 and the spindle body 1, the spindle body 1, the housing 36, the GND line 23, the coaxial cable 19, and the high-frequency oscillator 18. A return circuit is formed (note that the capacitance p between the insulated rotor 3 and the spindle body 1 is generally about 100 to 400 pF), depending on the capacitance p. The current flowing through increases. For this reason, the current flowing through the first input winding 25 increases, and a difference occurs in the current flowing through each of the first input winding 25 and the second input winding 26. , 26 cannot cancel each other. As a result, an output current is generated in the output winding 28 of the current transformer 20, and the output current rectified by the detection circuit 21 is detected by the detector 22. The detector 22 is set to output a signal as a detection signal when the output current from the detection circuit 21 exceeds a certain set value.

  The initial position of the spindle a before the processing operation is started and the height of the processing table on which the substrate 7 to be detected is fixed are set to a predetermined position in advance, and the drill 5 of the spindle a is desired by the processing. By detecting contact with the first inner conductor layer 9 which is a conductor layer, the height from the surface of the base to the position of the first inner conductor layer 9 on the substrate 7 (hereinafter referred to as “desired conductor”). The height of the layer ") is measured, and the descending distance from the initial position of the spindle a that processes the layer to the first inner conductor layer 9 of the substrate 7 is determined, and the control of the substrate processing apparatus A is performed. Can be stored.

  Next, as step 2, the substrate 7 that was the detection target in step 1 is set as the comparison target, and conversely in step 1, the substrate 8 that was the comparison target is set as the detection target. Is to operate the spindle b and perform the same operation as when the spindle a is operated to measure the height to the position of the first inner conductor layer 10 of the substrate 8 as the detection target, The descending distance from the initial position of the spindle b for processing it to the first inner conductor layer 10 of the substrate 8 can be determined and stored in the control unit of the substrate processing apparatus A.

  Next, in step 3, if the substrate is drilled by the drills 5 and 6 of the spindles a and b while controlling the descending distances of the spindles a and b based on the stored information, the desired result can be obtained accurately and quickly. The conductor layer can be exposed.

  More practically, since there is a slight twist or distortion in one substrate itself or its desired conductor layer, the same applies to each substrate 7 (and 8) that is a detection target. Several detections are made, the height of the desired conductor layer at each detection point is measured, the average value is taken as the height of the desired conductor layer, and it is recognized that it is the descending distance of the spindles a and b. The descending distance information may be stored in the control unit of the processing apparatus A to control the drilling of the substrate by the drills 5 and 6 of the spindles a and b.

In this way, the same substrate is used as a pair, and is generated in a current transformer 20 having two input windings 25 and 26 by high-frequency alternating current applied to the two substrates 7 and 8. Since the directions of the magnetic flux to be canceled out, all disturbances other than the capacitance p (or q) between the rotor 3 (or 4) and the spindle body 1 (or 2) can be canceled, and the drill 5 of the spindle a The presence or absence of contact with the desired conductor layer (or the presence or absence of contact between the drill 6 of the spindle b and the desired conductor layer) is not a change in current, but between the rotor 3 (or 4) and the spindle body 1 (or 2). Based on the capacitance p (or q), it can be detected by a signal of “1” or “0” indicating whether or not a current has flowed, and the counterbore is supported by a ceramic bearing on the spindle body. As in the spindle for engineering or router processing, even if the spindle capacitance thereof is small, thereby facilitating the determination. Furthermore, it is not necessary to completely insulate the spindles 1 and 2 from the housing 36, and the spindles 1 and 2 can be grounded, thereby improving safety.
In addition, when the substrates 7 and 8 are processed by the spindles a and b, accurate information on the descending distances of the spindles a and b can be obtained. Based on the descending distance information, a number of substrates identical to the substrates 7 and 8 can be accurately obtained. As a result, it can be processed at low cost.

  K · 2 shown in FIG. 2 shows another embodiment of the spindle lowering distance information detection mechanism. In the first embodiment, two substrates, two spindles, and one detection device are detected as one set. While the position of the desired conductor layer on the substrate 7 or 8 is detected by shifting the time as in Step 1 and Step 2, the same occurs by shifting the time while leaving the configuration and characteristics. Thus, it is possible to prevent a reduction in processing speed or the like that occurs when processing a large number of substrates. In the second embodiment, one substrate, which is a detection target, one spindle, and one detection device, is used as a set, and a simulated substrate circuit 29 is provided in place of the substrate 8 which is a comparison target of the substrate 7 which is a detection target. It is incorporated in the detection device 30. That is, in the simulated circuit board 29, eight capacitors 32 and eight dip switches 31 are arranged in series, respectively. The capacitor 32 and the dip switch 31 arranged in series are one set, and these eight sets are arranged in parallel. It is made up of. These capacitors 32 have different capacities, and here, capacitors of 10 pF, 22 pF, 48 pF, 100 pF, 220 pF, 470 pF, 1000 pF, 2200 pF are used. The high-frequency oscillator 18 is connected to the coaxial cable 19, the output line 24, the first input winding 25, and the first inner conductor layer 9 of the substrate 7 that is the detection target, and from the output line 24 The second input winding 26 is connected to the terminal 33 of the simulated substrate circuit 29. Further, in order to be able to be used in the same manner as in the first embodiment as necessary, it is branched in the middle of the connection from the second input winding 26 to the simulated board circuit 29, and the second board 8 which is a comparison object. Connection to one inner conductor layer 10 is made possible. The high-frequency oscillator 18 branches in the middle of the connection GND line 23 that continues to the coaxial cable 19, the GND line 23, and the housing 36, and is connected to the other terminal 34 of the simulated substrate circuit 29.

In this way, the first inner conductor layer 9 as the desired conductor layer of the substrate 7 and the housing in a state where the substrate 7 as the detection target is fixed on the processing table of the substrate processing apparatus A ′ in advance. The capacitance r between the bodies 36 is measured, and the eight dip switches 31 of the simulation board circuit 29 are appropriately energized so that the capacitances are substantially the same. As a result, the capacitance generated in the simulated substrate circuit 29 becomes an alternative to the substrate 8 that is the comparison target, and the spindle a is operated to activate the first of the substrate 7 that is the detection target as in the first embodiment. When the drill 5 comes into contact with the inner conductor layer 9, a current flows through the capacitance p between the spindle body 1 and the rotor 3 of the activated spindle a, and therefore both input windings in the current transformer 20. Since the magnetic flux generated in 25 and 26 does not cancel each other and a magnetic flux is generated on the output winding 28 side to generate a current, the presence of the current is detected by the detector 22, so that the drill 5 of the spindle a is moved to the substrate 7. It is found that the first inner conductor layer 9 which is the desired conductor layer is in contact with the first inner conductor layer 9. Subsequent processing based on this contact information is the same as in the first embodiment.
In the second embodiment, all the eight dip switches 31 of the simulated board circuit 29 are turned off, and the board 8 as a comparison object is fixed on the processing table, and the second input winding 26 and If the first inner conductor layer 10 which is a desired conductor layer of the substrate 8 is connected, it can also be used as the detection apparatus of the first embodiment.

  If two sets of the descent distance information detection mechanism K · 2 shown in the second embodiment are installed, the descent distance information of the two substrates can be simultaneously obtained without following the procedure of steps 1 and 2 as in the first embodiment. It can be obtained and the processing speed can be improved. However, in the second embodiment, unlike the first embodiment, when the type of the substrate is changed, the eight dip switches 31 of the simulated substrate circuit 29 are matched with the capacitance between the substrate to be processed and the housing. It is self-evident that you need to change your settings.

  Needless to say, both the first and second embodiments can be used to detect not only the inner conductor layer but also the descending distance information of the spindle to the front or back conductor layer.

  By applying a high-frequency alternating current, it detects the change in the current that occurs in one of the ones with the same capacitance, and determines whether or not the two conductors are in contact. In addition, the present invention can be widely applied to uses for determining the presence or absence of contact of conductors during processing by a mechanical device.

A, A ′ Substrate processing device B Substrate processing device a, b Spindle p, q, r, s Capacitance K · 1 Descent distance information detection mechanism K · 2 Descent distance information detection mechanism 1, 2 Spindle body 3, 4 Rotor 5, 6 Drill 7, 8 Substrate 9, 10 First inner conductor layer 11 Second inner conductor layer 12 Front conductor layer 13 Back conductor layer 14 First insulating layer 15 Second insulating layer 16 Third insulating layer DESCRIPTION OF SYMBOLS 17 Detection apparatus 18 High frequency oscillator 19 Coaxial cable 20 Current transformer 21 Detection circuit 22 Detector 23 GND line 24 Output line 25 1st input winding 26 2nd input winding 27 Iron core 28 Output winding 29 Simulation board circuit DESCRIPTION OF SYMBOLS 30 Detection apparatus 31 Dip switch 32 Capacitor 33 Terminal 34 Terminal 35 Changeover switch switch 36 Case 37 Insulator 38 Detection apparatus 39 Current transformer 40 Input winding 41 Iron 42 output winding t capacitance

Claims (3)

  A spindle lowering distance information detection mechanism for detecting the lowering distance of a spindle drill in a substrate processing apparatus incorporating a spindle, comprising a high-frequency AC power source, two input windings having the same number of turns, and one or more output windings Insulating from the housing of the substrate processing apparatus independently as a set of two substrates that are the detection target and a substrate that is the same comparison target as the substrate, In addition to being fixed on a processing table in the casing, one of the high-frequency AC power output is connected to the casing, and the other is connected to each of the two substrates via two input windings of the current transformer. Are connected so that the directions of magnetic fluxes generated by the input winding currents in the current transformers cancel each other, and the drill tip of the spindle and the desired conductor layer of the substrate as the detection object Current generated by contact The changes made are detected by the detector as a change in current output from the current transformer, the spindle descends a distance information detecting mechanism. A spindle lowering distance information detection mechanism for detecting the lowering distance of a spindle drill in a substrate processing apparatus incorporating a spindle, comprising a high-frequency AC power source, two input windings having the same number of turns, and one or more output windings A high-frequency current transformer and a simulated substrate circuit in which a plurality of capacitors and switches arranged in series are arranged in parallel, and a substrate as a detection object is a substrate Insulated from the housing of the processing apparatus, fixed on the processing table in the housing, and one of the high-frequency AC power output is connected to the housing and connected to one terminal of the simulated substrate circuit, the other is The desired conductor layer existing in the substrate as the detection target and the other terminal of the simulated circuit board are connected via the two input windings of the current transformer, and the desired conductor of the substrate as the detection target. layer By adjusting the switches of the simulated circuit board circuit so that the capacitance generated between the casings is approximately equal, the magnetic flux generated by the current transformer in each input winding current cancels each other, and the spindle tip of the spindle A spindle descent distance information detection mechanism, in which a change in current caused by contact between a current transformer and a desired conductor layer is detected by a detector as a change in current output from a current transformer.   A spindle having a spindle lowering distance information detecting mechanism according to claim 1 or 2, and comprising a mechanism for controlling the operation of the spindle based on the lowering distance information detected by the spindle lowering distance information detecting mechanism. Embedded substrate processing equipment.

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