TWI521409B - Touch panel structure and method for manufacturing the same - Google Patents

Touch panel structure and method for manufacturing the same Download PDF

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Publication number
TWI521409B
TWI521409B TW103140275A TW103140275A TWI521409B TW I521409 B TWI521409 B TW I521409B TW 103140275 A TW103140275 A TW 103140275A TW 103140275 A TW103140275 A TW 103140275A TW I521409 B TWI521409 B TW I521409B
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Taiwan
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transparent electrode
electrode layer
touch panel
substrate
panel structure
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TW103140275A
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Chinese (zh)
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TW201616302A (en
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郭南村
謝嘉銘
匡巧
林子祥
黃彥衡
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業成光電(深圳)有限公司
英特盛科技股份有限公司
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Publication of TW201616302A publication Critical patent/TW201616302A/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Description

觸控面板結構與其製造方法 Touch panel structure and manufacturing method thereof

本發明是有關於一種觸控面板結構與其製造方法。 The invention relates to a touch panel structure and a manufacturing method thereof.

觸控技術將電子裝置的螢幕與輸入模組結合,使用者只需使用手指在螢幕的相對應影像上按壓即可操作,十分直觀容易。觸控技術可分為電阻式、電容式以及光學式。 The touch technology combines the screen of the electronic device with the input module, and the user can operate by pressing the finger on the corresponding image of the screen, which is very intuitive and easy. Touch technology can be divided into resistive, capacitive and optical.

電容式觸控技術為在透明面板上設置透明電極,當使用者使用手指觸碰螢幕時,透明電極與人體之間的靜電結合並形成一耦合電容,於是產生電容變化。從耦合電容所產生之誘導電流,手指觸碰螢幕的位置便能被計算求出。電容式觸控面板擁有透光率高、反應速度快、耐用性佳等優點,另外亦可具有多點觸控的功能。 The capacitive touch technology is to provide a transparent electrode on the transparent panel. When the user touches the screen with a finger, the static electricity between the transparent electrode and the human body combines to form a coupling capacitor, thereby generating a capacitance change. The induced current generated by the coupling capacitor can be calculated by the position where the finger touches the screen. The capacitive touch panel has the advantages of high light transmittance, fast response speed, and good durability, and can also have multi-touch function.

為了使觸控面板具有多點觸控功能,設置於面板上的透明電極必須具有轉角設計,然而轉角結構在經歷生產過程中的高低溫差時,將會因為冷熱縮漲不均,而使透明電極的轉角結構產生裂痕,因而損害透明電極的效能。 In order to make the touch panel have multi-touch function, the transparent electrode disposed on the panel must have a corner design. However, when the corner structure is subjected to high and low temperature difference in the production process, the transparent electrode will be uneven due to uneven heat and cold. The corner structure creates cracks that impair the effectiveness of the transparent electrode.

本發明提供一種觸控面板結構與其製造方法,用以避免圖案化透明電極層的轉角結構產生裂痕而避免損害圖案化透明電極層的效能。 The invention provides a touch panel structure and a manufacturing method thereof, in order to avoid cracking of a corner structure of a patterned transparent electrode layer and avoid damage to the performance of the patterned transparent electrode layer.

根據本發明一實施方式,一種觸控面板結構的製造方法,包含提供基板,形成透明電極層於基板上,以及圖案化透明電極層並形成圖案化透明電極層,其中圖案化透明電極層的轉角結構為圓弧角結構。 According to an embodiment of the present invention, a method of fabricating a touch panel structure includes providing a substrate, forming a transparent electrode layer on the substrate, and patterning the transparent electrode layer to form a patterned transparent electrode layer, wherein a corner of the patterned transparent electrode layer is patterned The structure is a circular arc structure.

於本發明之一或多個實施方式中,觸控面板結構的製造方法更包含形成金屬線路層於基板上,以及固化金屬線路層,其中固化金屬線路層之固化溫度為約85℃~100℃。 In one or more embodiments of the present invention, the method for manufacturing a touch panel structure further includes forming a metal wiring layer on the substrate, and curing the metal wiring layer, wherein the curing metal wiring layer has a curing temperature of about 85 ° C to 100 ° C. .

於本發明之一或多個實施方式中,金屬線路層之材料包含銀。 In one or more embodiments of the invention, the material of the metal wiring layer comprises silver.

於本發明之一或多個實施方式中,金屬線路層之固化時間為90分鐘。 In one or more embodiments of the invention, the metal line layer has a cure time of 90 minutes.

根據本發明另一實施方式,一種觸控面板結構,包含基板、圖案化透明電極層以及金屬線路層。圖案化透明電極層設置於基板上,其中圖案化透明電極層的轉角結構為圓弧角結構。金屬線路層設置於基板上。 According to another embodiment of the present invention, a touch panel structure includes a substrate, a patterned transparent electrode layer, and a metal wiring layer. The patterned transparent electrode layer is disposed on the substrate, wherein the corner structure of the patterned transparent electrode layer is a circular arc angle structure. The metal wiring layer is disposed on the substrate.

於本發明之一或多個實施方式中,轉角結構之圓弧半徑為約50微米。 In one or more embodiments of the invention, the radius of the arc of the corner structure is about 50 microns.

於本發明之一或多個實施方式中,圖案化透明電極層之線寬與線距分別至少為約50微米。 In one or more embodiments of the invention, the patterned transparent electrode layer has a line width and a line pitch of at least about 50 microns, respectively.

於本發明之一或多個實施方式中,轉角結構之圓弧 半徑為約100微米。 In one or more embodiments of the present invention, the arc of the corner structure The radius is about 100 microns.

於本發明之一或多個實施方式中,圖案化透明電極層之線寬與線距分別至少為約100微米。 In one or more embodiments of the invention, the patterned transparent electrode layer has a line width and a line pitch of at least about 100 microns, respectively.

於本發明之一或多個實施方式中,金屬線路層之材料包含銀。 In one or more embodiments of the invention, the material of the metal wiring layer comprises silver.

本發明上述實施方式藉由藉由將圖案化透明電極層的轉角結構設置為圓弧角結構,緩衝觸控面板結構因冷熱縮漲不均而產生的內應力,因而避免圖案化透明電極層的轉角結構產生裂痕,以避免損害圖案化透明電極層的效能。另外,相較於傳統觸控面板,由於觸控面板結構僅將圖案化透明電極層的轉角結構變換設計,所以觸控面板結構的整體光學特性及功能性將不受影響。 In the above embodiment of the present invention, by setting the corner structure of the patterned transparent electrode layer to a circular arc angle structure, the internal stress generated by the uneven heating and contraction of the touch panel structure is buffered, thereby avoiding patterning of the transparent electrode layer. The corner structure creates cracks to avoid damaging the performance of the patterned transparent electrode layer. In addition, compared with the conventional touch panel, since the touch panel structure only transforms the corner structure of the patterned transparent electrode layer, the overall optical characteristics and functionality of the touch panel structure are not affected.

10~50‧‧‧步驟 10~50‧‧‧Steps

100‧‧‧觸控面板結構 100‧‧‧Touch panel structure

110‧‧‧基板 110‧‧‧Substrate

111‧‧‧顯示區 111‧‧‧ display area

112‧‧‧周邊區 112‧‧‧The surrounding area

120‧‧‧透明電極層 120‧‧‧Transparent electrode layer

122‧‧‧圖案化透明電極層 122‧‧‧ patterned transparent electrode layer

124‧‧‧轉角結構 124‧‧‧ Corner structure

126‧‧‧直線結構 126‧‧‧Linear structure

130‧‧‧金屬線路層 130‧‧‧metal circuit layer

第1圖繪示依照本發明一實施方式的觸控面板結構的製造方法流程圖。 FIG. 1 is a flow chart showing a method of manufacturing a touch panel structure according to an embodiment of the invention.

第2圖繪示依照本發明一實施方式的基板的上視示意圖。 FIG. 2 is a schematic top view of a substrate according to an embodiment of the invention.

第3A~3C圖繪示依照本發明一實施方式之觸控面板結構的製程各步驟的剖面圖,其中剖面位置為第2圖的線段3。 3A-3C are cross-sectional views showing the steps of the process of the touch panel structure according to an embodiment of the present invention, wherein the cross-sectional position is the line segment 3 of FIG.

第4圖繪示依照本發明一實施方式的觸控面板結構的局部上視圖。 4 is a partial top view of a touch panel structure in accordance with an embodiment of the present invention.

第5圖繪示依照本發明另一實施方式的觸控面板結構的製造方法流程圖。 FIG. 5 is a flow chart showing a method of manufacturing a touch panel structure according to another embodiment of the present invention.

第6圖繪示依照本發明另一實施方式之觸控面板結構的製程其中一步驟的剖面圖,其中剖面位置為第2圖的線段3。 FIG. 6 is a cross-sectional view showing a step of the process of the touch panel structure according to another embodiment of the present invention, wherein the cross-sectional position is the line segment 3 of FIG.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

第1圖繪示依照本發明一實施方式的觸控面板結構100的製造方法流程圖。第2圖繪示依照本發明一實施方式的基板110的上視示意圖。第3A~3C圖繪示依照本發明一實施方式之觸控面板結構100的製程各步驟的剖面圖,其中剖面位置為第2圖的線段3。本發明不同實施方式提供一種觸控面板結構100的製造方法,觸控面板結構100主要為應用於電容式觸控面板。 FIG. 1 is a flow chart showing a method of manufacturing the touch panel structure 100 according to an embodiment of the invention. FIG. 2 is a schematic top view of a substrate 110 according to an embodiment of the invention. 3A-3C are cross-sectional views showing various steps of the process of the touch panel structure 100 according to an embodiment of the present invention, wherein the cross-sectional position is the line segment 3 of FIG. Different embodiments of the present invention provide a method for manufacturing the touch panel structure 100. The touch panel structure 100 is mainly applied to a capacitive touch panel.

如第1圖、第2圖以及第3A圖所繪示,步驟10為提供基板110,其中基板110具有顯示區111與周邊區112,周邊區112圍繞顯示區111,且周邊區112可以作為觸控面板結構100的邊框區域。 As shown in FIG. 1 , FIG. 2 and FIG. 3A , step 10 is to provide a substrate 110 , wherein the substrate 110 has a display area 111 and a peripheral area 112 , the peripheral area 112 surrounds the display area 111 , and the peripheral area 112 can serve as a touch. The border area of the panel structure 100.

在本實施方式中,基板110為軟質基板。具體而言,基板110為聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)基板,但並不限於此。在其他實施方式中,基板110可為硬質基板或其他種類的軟質基板,硬質基板可為例如玻璃基板,軟質基板可為例如聚醯亞胺(Polyimide,PI)基板。 In the present embodiment, the substrate 110 is a flexible substrate. Specifically, the substrate 110 is a polyethylene terephthalate (PET) substrate, but is not limited thereto. In other embodiments, the substrate 110 may be a rigid substrate or other type of flexible substrate, the rigid substrate may be, for example, a glass substrate, and the flexible substrate may be, for example, a Polyimide (PI) substrate.

如第1圖與第3B圖所繪示,步驟20為形成透明電極層120於基板110上。 As shown in FIG. 1 and FIG. 3B, step 20 is to form a transparent electrode layer 120 on the substrate 110.

透明電極層120之材料可以為氧化銦錫(Indium Tin Oxide,ITO)。應了解到,以上所舉之透明電極層120之材料僅為例示,並非用以限制本發明,本發明所屬技術領域中具有通常知識者,應視實際需要,彈性選擇透明電極層120之材料。 The material of the transparent electrode layer 120 may be Indium Tin Oxide (ITO). It should be understood that the materials of the transparent electrode layer 120 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select the material of the transparent electrode layer 120 according to actual needs.

透明電極層120可藉由沈積製程形成,其中沈積製程可為電漿強化化學蒸鍍法(Plasma Enhanced Chemical Vapor Deposition,PECVD)、物理氣相蒸鍍法(Physical Vapor Deposition)、濺鍍或是其他的沉積製程。 The transparent electrode layer 120 can be formed by a deposition process, wherein the deposition process can be Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition, sputtering, or the like. Deposition process.

第4圖繪示依照本發明一實施方式的觸控面板結構100的局部上視圖。如第1圖、第3C圖以及第4圖所繪示,步驟30為圖案化透明電極層120並形成圖案化透明電極層122於顯示區111,其中圖案化透明電極層122具有轉角結構124與直線結構126,且轉角結構124為圓弧角結構。 FIG. 4 is a partial top view of the touch panel structure 100 in accordance with an embodiment of the present invention. As shown in FIG. 1 , FIG. 3C and FIG. 4 , step 30 is to pattern the transparent electrode layer 120 and form a patterned transparent electrode layer 122 on the display region 111 , wherein the patterned transparent electrode layer 122 has a corner structure 124 and The linear structure 126 has a rounded corner structure.

具體而言,圖案化透明電極層122可藉由微影及蝕刻製程形成,但並不限於此。在其他實施方式中,圖案化 透明電極層122可藉由其他合適的製程形成,例如:網印、旋轉塗佈、噴墨等等。 Specifically, the patterned transparent electrode layer 122 can be formed by a lithography and etching process, but is not limited thereto. In other embodiments, patterning The transparent electrode layer 122 can be formed by other suitable processes such as screen printing, spin coating, ink jetting, and the like.

由於在生產過程中,觸控面板結構100可能會經歷高低溫差,因而使觸控面板結構100產生冷熱縮漲不均的情況,於是圖案化透明電極層122的轉角結構124將會產生裂痕,損害圖案化透明電極層122的效能。藉由將圖案化透明電極層122的轉角結構124設置為圓弧角結構,將可緩衝觸控面板結構100因冷熱縮漲不均而產生的內應力,因而避免圖案化透明電極層122的轉角結構124產生裂痕,以避免損害圖案化透明電極層122的效能。另外,相較於傳統觸控面板,由於觸控面板結構100僅將圖案化透明電極層122的轉角結構124變換設計,所以觸控面板結構100的整體光學特性及功能性將不受影響。 Since the touch panel structure 100 may experience high and low temperature difference during the production process, the touch panel structure 100 may be unevenly heated and contracted, so that the corner structure 124 of the patterned transparent electrode layer 122 will be cracked and damaged. The effectiveness of the transparent electrode layer 122 is patterned. By setting the corner structure 124 of the patterned transparent electrode layer 122 to an arc angle structure, the internal stress generated by the uneven shrinkage of the touch panel structure 100 can be buffered, thereby avoiding the corner of the patterned transparent electrode layer 122. The structure 124 creates cracks to avoid damaging the performance of the patterned transparent electrode layer 122. In addition, compared with the conventional touch panel, since the touch panel structure 100 only transforms the corner structure 124 of the patterned transparent electrode layer 122, the overall optical characteristics and functionality of the touch panel structure 100 will not be affected.

具體而言,此處所指的冷熱漲縮不均主要有兩個成因。其一為當基板110為軟質基板時,基板110為由薄膜捲筒中滾出,因此基板110在縱向(Machine Direction,MD)與在橫向(Transverse Direction,TD)的特性將會不一致,因而導致基板110在經歷高低溫差時的漲縮幅度將會不一致。其二為觸控面板結構100在具有圖案化透明電極層122的區域和不具有圖案化透明電極層122的區域的冷熱漲縮幅度不一致。 Specifically, there are two main causes of the uneven heat and cold shrinkage referred to here. One is that when the substrate 110 is a flexible substrate, the substrate 110 is rolled out of the film roll, so the characteristics of the substrate 110 in the longitudinal direction (MD) and the transverse direction (TD) will be inconsistent, thus causing the substrate The magnitude of the ups and downs of 110 when experiencing high and low temperature differences will be inconsistent. The second is that the touch panel structure 100 has inconsistent cold and heat expansion and contraction in the region having the patterned transparent electrode layer 122 and the region not having the patterned transparent electrode layer 122.

更具體地說,當基板110為聚對苯二甲酸乙二酯基板時,基板110在經歷150℃/60分鐘的高溫製程後,基板110的縱向會收縮0.4~1.0%,基板110的橫向會收縮0.2 ~0.5%。於是,基板110的冷熱縮漲不均情況可能導致圖案化透明電極層122的轉角結構124產生裂痕。 More specifically, when the substrate 110 is a polyethylene terephthalate substrate, after the substrate 110 is subjected to a high temperature process of 150 ° C / 60 minutes, the longitudinal direction of the substrate 110 shrinks by 0.4 to 1.0%, and the lateral direction of the substrate 110 Contraction 0.2 ~0.5%. Thus, the uneven heat and cold shrinkage of the substrate 110 may cause cracks in the corner structure 124 of the patterned transparent electrode layer 122.

第5圖繪示依照本發明另一實施方式的觸控面板結構100的製造方法流程圖。第6圖繪示依照本發明另一實施方式之觸控面板結構100的製程其中一步驟的剖面圖,其中剖面位置為第2圖的線段3。本實施方式與前述之實施方式大致相同,以下主要介紹其相異處。 FIG. 5 is a flow chart of a method of manufacturing the touch panel structure 100 according to another embodiment of the present invention. FIG. 6 is a cross-sectional view showing a step of the process of the touch panel structure 100 according to another embodiment of the present invention, wherein the cross-sectional position is the line segment 3 of FIG. This embodiment is substantially the same as the above-described embodiment, and the differences will be mainly described below.

如第2圖、第3A圖以及第5圖所繪示,步驟10為提供基板110,其中基板110具有顯示區111與周邊區112,周邊區112圍繞顯示區111,且周邊區112可以作為觸控面板結構100的邊框區域。 As shown in FIG. 2, FIG. 3A and FIG. 5, step 10 is to provide a substrate 110, wherein the substrate 110 has a display area 111 and a peripheral area 112, the peripheral area 112 surrounds the display area 111, and the peripheral area 112 can serve as a touch. The border area of the panel structure 100.

如第3B圖與第5圖所繪示,步驟20為形成透明電極層120於基板110上。 As shown in FIG. 3B and FIG. 5, step 20 is to form a transparent electrode layer 120 on the substrate 110.

如第3C圖、第4圖以及第5圖所繪示,步驟30為圖案化透明電極層122並形成圖案化透明電極層122於顯示區111,其中圖案化透明電極層122的轉角結構124為圓弧角結構。 As shown in FIG. 3C, FIG. 4, and FIG. 5, step 30 is to pattern the transparent electrode layer 122 and form a patterned transparent electrode layer 122 on the display region 111, wherein the corner structure 124 of the patterned transparent electrode layer 122 is Arc angle structure.

如第5圖與第6圖所繪示,步驟40為形成金屬線路層130於基板110上。具體而言,形成金屬線路層130於周邊區112。金屬線路層130用以電連接位於顯示區111的圖案化透明電極層122與外部的控制模組(例如軟性電路板),或者用以電連接外部的地線(例如軟性電路板的地線),以達成靜電防護之功效。 As shown in FIGS. 5 and 6, the step 40 is to form the metal wiring layer 130 on the substrate 110. Specifically, the metal wiring layer 130 is formed in the peripheral region 112. The metal circuit layer 130 is used to electrically connect the patterned transparent electrode layer 122 located in the display area 111 with an external control module (such as a flexible circuit board), or to electrically connect an external ground wire (such as a ground circuit of a flexible circuit board). To achieve the effect of static protection.

在本實施方式中,金屬線路層130之材料包含銀。 具體而言,金屬線路層130之材料為銀膠。應了解到,以上所舉之金屬線路層130之材料僅為例示,並非用以限制本發明,本發明所屬技術領域中具有通常知識者,應視實際需要,彈性選擇金屬線路層130之材料。 In the present embodiment, the material of the metal wiring layer 130 contains silver. Specifically, the material of the metal wiring layer 130 is silver paste. It should be understood that the materials of the metal circuit layer 130 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select the material of the metal circuit layer 130 according to actual needs.

在本實施方式中,金屬線路層130藉由印刷方式形成,但並不限於此。在其他實施方式中,金屬線路層130可以藉由塗佈方式形成。 In the present embodiment, the metal wiring layer 130 is formed by printing, but is not limited thereto. In other embodiments, the metal wiring layer 130 can be formed by coating.

步驟50為固化金屬線路層130。具體而言,固化金屬線路層130之固化溫度為約85℃~100℃,固化時間為約90分鐘。應了解到,以上所舉之固化金屬線路層130之具體實施方式僅為例示,並非用以限制本發明,本發明所屬技術領域中具有通常知識者,應視實際需要,彈性選擇固化金屬線路層130之具體實施方式。 Step 50 is curing the metal wiring layer 130. Specifically, the curing temperature of the cured metal wiring layer 130 is about 85 ° C to 100 ° C, and the curing time is about 90 minutes. It should be understood that the specific embodiments of the cured metal circuit layer 130 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should flexibly select a solidified metal circuit layer according to actual needs. 130 is a specific implementation.

藉由將原來固化金屬線路層130之高溫製程(約130℃)轉換為低溫製程,觸控面板結構100經歷到的溫差變小,因而減輕觸控面板結構100的冷熱縮漲不均情況。於是,高低溫差所導致的觸控面板結構100產生冷熱縮漲不均的情況將會減少,從而避免圖案化透明電極層122的轉角結構124產生裂痕,以避免損害圖案化透明電極層122的效能。 By converting the high temperature process (about 130 ° C) of the original cured metal circuit layer 130 into a low temperature process, the temperature difference experienced by the touch panel structure 100 becomes small, thereby reducing the uneven heat and cold shrinkage of the touch panel structure 100. Therefore, the uneven heat and cold shrinkage caused by the touch panel structure 100 caused by the high and low temperature difference will be reduced, thereby preventing the corner structure 124 of the patterned transparent electrode layer 122 from being cracked to avoid damaging the performance of the patterned transparent electrode layer 122. .

如第2圖、第4圖以及第6圖所繪示,本發明又一實施方式提供一種觸控面板結構100。觸控面板結構100包含基板110、圖案化透明電極層122以及金屬線路層130。圖案化透明電極層122設置於基板110上,其中圖案 化透明電極層122的轉角結構124為圓弧角結構。金屬線路層130設置於基板110上。 As shown in FIG. 2, FIG. 4 and FIG. 6, another embodiment of the present invention provides a touch panel structure 100. The touch panel structure 100 includes a substrate 110 , a patterned transparent electrode layer 122 , and a metal wiring layer 130 . The patterned transparent electrode layer 122 is disposed on the substrate 110, wherein the pattern The corner structure 124 of the transparent electrode layer 122 has a circular arc angle structure. The metal wiring layer 130 is disposed on the substrate 110.

具體而言,圖案化透明電極層122設置於顯示區111,金屬線路層130設置於周邊區112。 Specifically, the patterned transparent electrode layer 122 is disposed on the display region 111 , and the metal wiring layer 130 is disposed in the peripheral region 112 .

具體而言,轉角結構124之圓弧半徑可為約50微米。相對應地,圖案化透明電極層122之線寬與線距可分別至少為約50微米。又或者,轉角結構124之圓弧半徑可為約100微米。相對應地,圖案化透明電極層122之線寬與線距可分別至少為約100微米。於是圖案化透明電極層122的直線結構126與轉角結構124可以有良好的搭配,而不會有轉角結構124所需的設置空間不足等無法匹配的問題。 In particular, the radius of the arc of the corner structure 124 can be about 50 microns. Correspondingly, the line width and line pitch of the patterned transparent electrode layer 122 can be at least about 50 microns, respectively. Alternatively, the radius of the arc of the corner structure 124 can be about 100 microns. Correspondingly, the patterned transparent electrode layer 122 may have a line width and a line pitch of at least about 100 microns, respectively. Therefore, the linear structure 126 of the patterned transparent electrode layer 122 and the corner structure 124 can be well matched without the problem that the required installation space of the corner structure 124 is insufficient.

以下將針對第4圖與第6圖所繪示的實施方式,揭露本發明兩個實施例(即固化金屬線路層130之固化溫度為85℃,固化時間為90分鐘;轉角結構124之圓弧半徑為50微米或100微米)的測試情況,藉此說明上述實施方式之觸控面板結構100,確實能夠提供所需要的性能。應瞭解到,在以下敘述中,已經在上述實施方式中提到的參數將不再重複贅述,僅就需進一步界定者加以補充,合先敘明。 Hereinafter, for the embodiments illustrated in FIGS. 4 and 6 , two embodiments of the present invention are disclosed (ie, the curing temperature of the cured metal wiring layer 130 is 85° C., the curing time is 90 minutes; and the arc of the corner structure 124 is 124 The test case of a radius of 50 micrometers or 100 micrometers, thereby illustrating the touch panel structure 100 of the above embodiment, can indeed provide the required performance. It should be understood that in the following description, the parameters that have been mentioned in the above embodiments will not be repeated, and will be supplemented only if further definitions are needed.

首先,兩個實施例的觸控面板結構100分別經過下述三個信賴性測試。信賴性測試分別為溼熱循環(Damp Heat Cyclic,即觸控面板結構100處於相對溼度為93±3%,溫度為30℃~65℃循環變化的環境中經歷18次循環,每次循環為8小時)、冷熱衝擊(Thermal Shock,即觸控面板結 構100處於溫度為-40℃~85℃循環變化的環境中經歷50次循環,在一個循環中,環境維持-40℃的時間為30分鐘,環境維持85℃的時間為30分鐘,溫度從-40℃改變到85℃或者85℃改變到-40℃的時間小於3分鐘,)以及高溫高濕(High Temperature And High Humidity,即觸控面板結構100處於相對溼度為95%,溫度為30℃~60℃循環變化的環境中經歷30次循環,每個循環為8小時,在一個循環中,環境維持60℃的時間為4小時,降溫的時間為1.5小時,維持30℃的時間為1小時,升溫的時間為1.5小時)。在經過以上三個信賴性測試測試後,使用光學顯微鏡分別觀察兩個實施例的觸控面板結構100,其圖案化透明電極層122的轉角結構124確認沒有產生裂痕。 First, the touch panel structures 100 of the two embodiments pass the following three reliability tests. The reliability test is Damp Heat Cyclic (Tamp Heat Cyclic), that is, the touch panel structure 100 is subjected to 18 cycles in an environment with a relative humidity of 93±3% and a temperature of 30° C. to 65° C., and each cycle is 8 hours. ), thermal shock (thermal shock) The structure 100 is subjected to 50 cycles in an environment with a temperature change of -40 ° C to 85 ° C. In one cycle, the environment is maintained at -40 ° C for 30 minutes, the environment is maintained at 85 ° C for 30 minutes, and the temperature is from - 40 ° C changed to 85 ° C or 85 ° C changed to -40 ° C for less than 3 minutes,) and high temperature and high humidity (High Temperature And High Humidity, that is, the touch panel structure 100 is at 95% relative humidity, temperature is 30 ° C ~ The cycle was changed to 60 cycles in a 60 ° C cycle, each cycle was 8 hours. In one cycle, the environment was maintained at 60 ° C for 4 hours, the cooling time was 1.5 hours, and the temperature was maintained at 30 ° C for 1 hour. The heating time is 1.5 hours). After the above three reliability test tests, the touch panel structures 100 of the two embodiments were separately observed using an optical microscope, and the corner structure 124 of the patterned transparent electrode layer 122 confirmed that no cracks were generated.

本發明上述實施方式藉由藉由將圖案化透明電極層122的轉角結構124設置為圓弧角結構,緩衝觸控面板結構100因冷熱縮漲不均而產生的內應力,因而避免圖案化透明電極層122的轉角結構124產生裂痕,以避免損害圖案化透明電極層122的效能。另外,相較於傳統觸控面板,由於觸控面板結構100僅將圖案化透明電極層122的轉角結構124變換設計,所以觸控面板結構100的整體光學特性及功能性將不受影響。 In the above embodiment of the present invention, by setting the corner structure 124 of the patterned transparent electrode layer 122 to a circular arc angle structure, the internal stress generated by the uneven heating and contraction of the touch panel structure 100 is buffered, thereby avoiding pattern transparency. The corner structure 124 of the electrode layer 122 creates cracks to avoid damaging the performance of the patterned transparent electrode layer 122. In addition, compared with the conventional touch panel, since the touch panel structure 100 only transforms the corner structure 124 of the patterned transparent electrode layer 122, the overall optical characteristics and functionality of the touch panel structure 100 will not be affected.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

10~30‧‧‧步驟 10~30‧‧‧Steps

Claims (8)

一種觸控面板結構的製造方法,包含:提供一基板;形成一透明電極層於該基板上;圖案化該透明電極層並形成一圖案化透明電極層,其中該圖案化透明電極層的一轉角結構為圓弧角結構;形成一金屬線路層於該基板上;以及固化該金屬線路層,其中固化該金屬線路層之固化溫度為約85℃。 A method for manufacturing a touch panel structure includes: providing a substrate; forming a transparent electrode layer on the substrate; patterning the transparent electrode layer and forming a patterned transparent electrode layer, wherein a corner of the patterned transparent electrode layer The structure is a circular arc structure; a metal wiring layer is formed on the substrate; and the metal wiring layer is cured, wherein the curing temperature of the metal wiring layer is about 85 ° C. 如請求項1所述之製造方法,其中該金屬線路層之材料包含銀。 The manufacturing method of claim 1, wherein the material of the metal wiring layer contains silver. 如請求項2所述之製造方法,其中該金屬線路層之固化時間為約90分鐘。 The manufacturing method according to claim 2, wherein the metal wiring layer has a curing time of about 90 minutes. 一種觸控面板結構,包含:一基板;一圖案化透明電極層,設置於該基板上,其中該圖案化透明電極層的一轉角結構為圓弧角結構,其中該轉角結構之圓弧半徑為約50微米;以及一金屬線路層,設置於該基板上。 A touch panel structure includes: a substrate; a patterned transparent electrode layer disposed on the substrate, wherein a corner structure of the patterned transparent electrode layer is an arc angle structure, wherein a radius of the arc of the corner structure is About 50 microns; and a metal circuit layer disposed on the substrate. 如請求項4所述之觸控面板結構,其中該圖案化透 明電極層之線寬與線距分別至少為約50微米。 The touch panel structure of claim 4, wherein the pattern is transparent The line width and line pitch of the bright electrode layer are each at least about 50 microns. 如請求項4所述之觸控面板結構,其中該轉角結構之圓弧半徑為約100微米。 The touch panel structure of claim 4, wherein the corner structure has a radius of a circle of about 100 microns. 如請求項6所述之觸控面板結構,其中該圖案化透明電極層之線寬與線距分別至少為約100微米。 The touch panel structure of claim 6, wherein the patterned transparent electrode layer has a line width and a line pitch of at least about 100 micrometers. 如請求項4所述之觸控面板結構,其中該金屬線路層之材料包含銀。 The touch panel structure of claim 4, wherein the material of the metal wiring layer comprises silver.
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