TWI517773B - Method for resetting the reflow position of a circuit board for a probe card - Google Patents

Description

Method for resetting the reflow position of a circuit board for a probe card

The present invention relates to a circuit board for a probe card, and more particularly to a method of resetting a reflow position of a circuit board for a probe card.

The probe card usually includes a circuit board for directly connecting to the signal transmission terminal of the test machine, and a space converter disposed on the lower surface of the circuit board. The upper surface of the space transformer has a plurality of conductive contacts with a large spacing for electrically connecting to the circuit board; the lower surface of the space converter is provided with a plurality of conductive contacts having a small spacing for abutting Most probes (e.g., vertical probes) allow the probes to maintain a relatively small pitch, while spotting conductive contacts on the wafer with relatively small spacing.

The circuit board and the space converter of the probe card are usually electrically connected to each other by reflow soldering, that is, the lower surface of the circuit board has a plurality of conductive contact positions with the upper surface of the space transformer. Corresponding conductive contacts, and the corresponding upper and lower conductive contacts are electrically connected to each other by a solder ball (such as a solder ball) disposed therebetween.

The off-the-shelf circuit board is used to reduce the cost of manufacturing the probe card by directly applying the ready-to-use board to the probe card instead of using a dedicated circuit board for the probe card. The surface to which the converter is connected needs to be redesigned to meet the requirements for reflow. For example, a wafer manufacturer may provide its existing circuit board to a probe card manufacturer, which may have been used in a final test (final test; FT for short) test interface, for example, In a test interface that includes a socket, but the original conductive contacts of the board do not fully conform to the conductive contacts of the space converter to which they are to be connected, if the board is used to connect to a space converter The redesign of the surface reflow position can be applied to the probe card used for chip probing (CP) before wafer packaging.

The main object of the present invention is to provide a method for resetting the reflow position of a circuit board for a probe card, which can redesign the reflow position of the ready-made circuit board so that the circuit board can be applied to the probe card and Reduce the manufacturing cost of the probe card.

In order to achieve the above object, the method for resetting the reflow position of a circuit board for a probe card provided by the present invention is for redefining a plurality of reflow positions on a mounting surface of a circuit board, the circuit board The mounting surface has a plurality of conductive contacts, and the circuit board further has a test surface opposite to the mounting surface, the test surface is for electrically connecting with a test; the resetting method comprises the following steps: a. in the circuit The mounting surface of the board is provided with a layered structure covering the conductive contacts, the layered structure having an upper surface and a lower surface facing in opposite directions, the lower surface being attached to the mounting surface of the circuit board; and b. The layered structure forms a plurality of reflow holes that conform to the reflow locations and are open on the upper surface, and the reflow holes are respectively configured to provide a solder ball, and each of the reflow holes has a The conductive block in which the solder ball is electrically connected to the conductive contact of the circuit board.

Therefore, by designing the layered structure according to the difference between the original conductive contacts of the ready-made circuit board and the re-deformed reflow position to be redefined, the above method can be used to form a conformal structure on the circuit board. The reflow hole of the welding requirement, so that the circuit board that could not be applied to the probe card can be applied to the probe card after redefining the reflow position, thereby reducing the manufacturing cost of the probe card.

In an embodiment of the invention, the step a may be to apply an insulating photoresist layer to the mounting surface of the circuit board to form the layered structure. The step b may include the following steps: b1. Exposing the layered structure to a mask opposite to the upper surface of the layered structure, the mask having a pattern conforming to the reflow holes, and each reflow hole being electrically connected to at least one of the conductive contacts a portion of the dots overlap; and b2. developing the layered structure to form the reflow holes, each of the reflow holes extending through the upper surface and the lower surface of the layered structure, so that the corresponding conductive contacts are at least A portion is exposed to form conductive segments in each of the reflow holes.

In other words, a portion of each of the reflow holes overlaps with the conductive contacts of the circuit board, and the conductive blocks in the reflow holes are located at the overlapping portions; thereby, the solder balls disposed in the reflow holes are The conductive block is contacted and electrically connected to the conductive contact of the circuit board.

In another embodiment of the present invention, the step a may include the following steps: a1. Configuring a first insulating photoresist layer on the mounting surface of the circuit board by using photolithography, the first insulating photoresist layer a top surface and a bottom surface facing in opposite directions, and a plurality of first through holes penetrating the top surface and the bottom surface, the bottom surface being the lower surface of the layer structure, each of the first perforation system positions corresponding to the conductive a contact, wherein at least a portion of each of the conductive contacts is exposed to the corresponding first through hole; a2. forming a first conductive block in the first through holes, such that each of the first conductive blocks and the first conductive block a conductive connection electrically connected to a through hole; and a3. a second insulating photoresist layer disposed on a top surface of the first insulating photoresist layer, the second insulating photoresist layer having a top surface facing in an opposite direction And a bottom surface, the bottom surface of the second insulating photoresist layer is attached to the top surface of the first insulating photoresist layer.

If the reflow hole is to be disposed on the second insulating photoresist layer, the solder ball can be indirectly connected to the conductive contact of the circuit board by the first conductive block. In the step a3, the first The second insulating photoresist layer covers the first conductive blocks, and the top surface of the second insulating photoresist layer is the upper surface of the layered structure; the step b includes the following steps: b1. Exposing the second insulating photoresist layer to the reticle opposite to the top surface of the second insulating photoresist layer, the reticle having a pattern conforming to the reflow holes, and the positions of the reflow holes are at least a portion of the first conductive block overlaps; and b2. developing the second insulating photoresist layer to form the reflow holes, each of the reflow holes extending through the second insulating photoresist layer The top surface and the bottom surface expose at least a portion of the corresponding first conductive block to form conductive blocks in each of the reflow holes.

In other words, a portion of each of the reflow holes overlaps with the first conductive block, and the conductive blocks in each of the reflow holes are located at the overlapping portion; thereby, the solder balls disposed in each of the reflow holes contact the conductive region And electrically connected to the conductive contacts of the circuit board through the conductive blocks that are in contact.

Preferably, each of the first conductive blocks has an extension that does not correspond to the position of the conductive contacts of the circuit board, and the conductive blocks in each of the reflow holes are completely located in the extension of the first conductive block. Thereby, the reflow hole can be completely staggered from the conductive contacts of the circuit board.

Alternatively, the step a3 may further form the second insulating photoresist layer by using a lithography process, the second insulating photoresist layer having a plurality of second through holes penetrating the top surface and the bottom surface thereof, each of the second The perforation system position corresponds to a first conductive block, so that all or at least a portion of each of the first conductive blocks is exposed to the corresponding second perforation; the step a further comprises the following steps: a4. Forming a second conductive block respectively, such that each of the second conductive blocks is electrically connected to the first conductive block corresponding to the second through hole; and a5. setting a top surface of the second insulating photoresist layer The third insulating photoresist layer has a top surface and a bottom surface facing in opposite directions, and a bottom surface of the third insulating photoresist layer is attached to a top surface of the second insulating photoresist layer.

Thereby, the reflow holes can be disposed on the third insulating photoresist layer, so that the solder balls can be indirectly electrically connected to the conductive contacts of the circuit board via the first conductive block and the second conductive block. Next, in the step a5, the third insulating photoresist layer covers the second conductive blocks, and the top surface of the third insulating photoresist layer is the upper surface of the layered structure; the step b includes The following steps: b1. exposing the light to the third insulating photoresist layer via a photomask opposite to the top surface of the third insulating photoresist layer, the mask having a pattern conforming to the reflow holes And each of the reflow holes is overlapped with at least a portion of the second conductive block; and b2. developing the third insulating photoresist layer to form the reflow holes, each of the reflow holes The top surface and the bottom surface of the third insulating photoresist layer are penetrated, and at least a portion of the corresponding second conductive block is exposed to form a conductive block in each of the reflow holes.

Preferably, each of the first conductive blocks is completely located on a conductive contact corresponding to the first through hole where the first conductive block is located.

Preferably, each of the second conductive blocks has an extension that does not correspond to the position of the conductive contacts of the circuit board, and the conductive blocks in each of the reflow holes are completely located in the extension of the second conductive block.

The detailed construction, features, assembly or use of the method of resetting the reflow position of the circuit board for the probe card provided by the present invention will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

10‧‧‧ boards

12‧‧‧Installation surface

122‧‧‧Electrical contacts

124‧‧‧Insulation

14‧‧‧Test surface

21, 22, 23‧‧‧ circuit boards

30, 30', 30" ‧ ‧ layered structure

31‧‧‧ upper surface

32‧‧‧ lower surface

33‧‧‧Insulating photoresist layer

34‧‧‧First insulating photoresist layer

342‧‧‧ top surface

344‧‧‧ bottom

346‧‧‧First perforation

35‧‧‧First conductive block

352‧‧‧Connection section

354‧‧‧Extension

36‧‧‧Second insulating photoresist layer

362‧‧‧ top surface

364‧‧‧ bottom

366‧‧‧Second perforation

37‧‧‧Second conductive block

372‧‧‧ Corresponding paragraph

374‧‧‧Extension

38‧‧‧ Third insulating photoresist layer

382‧‧‧ top surface

384‧‧‧ bottom

40‧‧‧Reflow holes

42‧‧‧ conductive block

50‧‧‧ solder balls

60‧‧‧Photomask

62‧‧‧ pattern

P‧‧‧Reflow position

1 to 4 are schematic cross-sectional views showing a process of resetting a reflow position of a circuit board for a probe card according to a first preferred embodiment of the present invention; 1 is a top view of the circuit board shown in FIG. 6; FIG. 6 is a top plan view of the circuit board shown in FIG. 4; and FIG. 7 to FIG. 11 are cross-sectional views showing a second preferred embodiment of the present invention. The process of the method for resetting the reflow position of the circuit board for the probe card provided by the embodiment; and the 12th to 17th views are schematic cross-sectional views showing the third preferred embodiment of the present invention. The process of resetting the reflow position of the circuit board of the probe card.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below.

Please refer to FIG. 1 to FIG. 4 , a method for resetting the reflow position of a circuit board for a probe card according to a first preferred embodiment of the present invention, which is used as shown in FIG. 1 . The ready-made circuit board 10 is transformed into a circuit board 21 as shown in FIG. 4 to redefine the plurality of reflow positions P on one of the mounting faces 12 of the circuit board 10, so that the circuit board 21 can be applied in accordance with the application. The specific reflow job requirements required for the probe card. The circuit board 10 further has a test surface 14 opposite to the mounting surface 12, and the test surface 14 is used with a test machine when testing the object to be tested by using the probe card made of the circuit board 21. Not shown in the electrical connection.

For example, the circuit board 10 may have been originally used by the wafer manufacturer for the final test (FT) circuit board, the top view of which is shown in FIG. 5, and the circuit board 10 is provided to the probe card manufacturer for application. In the probe card used for the bare crystal test (CP), the mounting surface 12 of the circuit board 10 needs to be reflowed to interface with a space converter (not shown) to form a probe card. The mounting surface 12 of the circuit board 10 originally has a plurality of conductive contacts 122. However, the conductive contacts 122 are not disposed to interface with the space converter. Therefore, the positional distribution of the conductive contacts 122 does not conform to the probe. The welding position of the reflow operation with the space converter during card manufacture. The method for resetting the reflow position of the circuit board for a probe card provided by the present invention is for defining a reflow position P according to requirements on the circuit board 21, for example, a top view of the circuit board 21. The aspect shown in Figure 6 is presented. In other words, the circuit board 10 may be before the reflow position P is defined. (but not limited to) a circuit board used in a test interface for final testing after completion of chip packaging, the test interface may have a socket and is used to electrically connect the tester and the object to be tested (packaged wafer) The test interface, and after the circuit board 10 defines the reflow locations P, that is, into the circuit board 21, it can be used, but not limited to, for the bare crystal test before the wafer package. In the probe card.

It should be noted that only the conductive contacts 122 and the three reflow positions P are shown in FIGS. 1 to 4 in order to clearly show the probe card provided in the embodiment. The method of resetting the reflow position of the board. In fact, the mounting surface 12 of the circuit board 10 generally has a relatively large number of conductive contacts 122, and finally a considerable number of reflow locations P are defined, such as those shown in Figures 5 and 6, but the conductive connections The number, shape and position of the point 122 and the reflow position P are not limited.

As shown in FIG. 4, the method for resetting the reflow position of the circuit board for the probe card provided in this embodiment is mainly used to define that the conductive contacts 122 do not coincide but partially overlap. Reflow position P, which includes the following steps:

As shown in FIG. 2, a layered structure 30 covering the conductive contacts 122 is disposed on the mounting surface 12 of the circuit board 10, and the layered structure 30 has an upper surface 31 and a lower surface facing in opposite directions. 32. The lower surface 32 is attached to the mounting surface 12 of the circuit board 10.

In this embodiment, the step a is applied to the mounting surface 12 of the circuit board 10 to apply an insulating photoresist layer 33 to form the layer structure 30. That is, the layer structure 30 only includes the insulating photoresist. The layer 33, the upper surface and the lower surface 31, 32 of the layered structure 30 are the top and bottom surfaces of the insulating photoresist layer 33.

b. As shown in FIGS. 3 and 4, a plurality of reflow holes 40 are formed in the layered structure 30 in conformity with the reflow positions P and open on the upper surface 31, and the reflow holes 40 are formed. The solder balls 50 are respectively disposed, and each of the reflow holes 40 has a conductive block 42 for electrically connecting the solder balls 50 to the conductive contacts 122 of the circuit board 10.

In this embodiment, the step b includes the following steps:

B1. As shown in FIG. 3, the layered structure 30 is exposed by illuminating the light through a mask 60 opposite the upper surface 31 of the layered structure 30. The mask 60 has a reflow conformance The pattern of the holes 40 is pattern 62, and the positions of the respective reflow holes 40 overlap each other at least with a portion of one of the conductive contacts 122.

B2. Developing the layer structure 30 to form the reflow holes 40, each of the reflow holes 40 extending through the upper surface 31 and the lower surface 32 of the layer structure 30, and the respective conductive contacts 122 At least a portion of the conductive block 42 may be formed in the reflow hole 40, that is, the conductive block 42 in each of the reflow holes 40 is a portion of the conductive contact 122.

In other words, the exposure and development process described above is used to remove the blocks of the insulating photoresist layer 33 at the reflow locations P to form a reflow hole 40 at the reflow locations P, respectively. A portion of the soldering hole 40 overlaps with the conductive contact 122 of the circuit board 10, and the so-called "conductive block 42 in each of the reflow holes 40" in the present invention is the overlapping portion in this embodiment ( The conductive contacts 122 are exposed to portions of the reflow holes 40, whereby the solder balls 50 disposed in the reflow holes 40 are directly in contact with the conductive contacts 122 of the circuit board 10 to be electrically connected to each other.

Referring to FIG. 7 to FIG. 11 , a method for resetting a reflow position of a circuit board for a probe card according to a second preferred embodiment of the present invention is to be used as shown in FIG. 1 . The circuit board 10 is converted into a circuit board 22 as shown in FIG. 11 to define a plurality of reflow positions P, and the reflow positions P are not in conformity with the conductive contacts 122 and are located. It does not correspond at all.

In other words, the method for resetting the reflow position of the circuit board for the probe card provided by the embodiment is mainly for forming a reflow hole 40 which is completely offset from the conductive contacts 122, and the same includes The foregoing steps a and b, that is, forming a layered structure 30' (as shown in FIG. 9), and forming the reflow holes 40 (as shown in FIG. 11), but this embodiment The contents of steps a and b are slightly different from the first preferred embodiment described above, and are described in detail below.

In this embodiment, the step a includes the following steps:

A1. As shown in FIG. 7, a first insulating photoresist layer 34 is disposed on the mounting surface 12 of the circuit board 10 by photolithography, and the first insulating photoresist layer 34 has a top in the opposite direction. a surface 342 and a bottom surface 344, and a plurality of first through holes 346 extending through the top surface 342 and the bottom surface 344, the bottom surface 344 is the lower surface 32 of the layered structure 30', and the positions of the first through holes 346 are corresponding to The conductive contact 122 is such that at least a portion of the conductive contact 122 is exposed to the first via 346. In other words, this step includes a coating photoresist, exposure, development, and the like to form the first insulating photoresist layer 34.

A2. As shown in FIG. 8, a first conductive block 35 is formed in the first through holes 346, so that the first conductive blocks 35 are electrically connected to the conductive contacts 122 corresponding to the first through holes 346. The connection, that is, at least a portion of the first conductive block 35 overlaps and is directly connected to the conductive contacts 122. The first conductive blocks 35 can be formed by depositing a metal material in the first through holes 346 by electroplating, evaporation or sputtering.

A3. As shown in FIG. 9, a second insulating photoresist layer 36 is disposed on the top surface 342 of the first insulating photoresist layer 34. The second insulating photoresist layer 36 has a top surface 362 facing in the opposite direction and A bottom surface 364 of the second insulating photoresist layer 36 is attached to the top surface 342 of the first insulating photoresist layer 34.

In this embodiment, the step includes only applying a photoresist to form the second insulating photoresist layer 36 covering the first conductive blocks 35, and the top surface of the second insulating photoresist layer 36 362 is the upper surface 31 of the layered structure 30'.

The layered structure 30' of the present embodiment includes the first and second insulating photoresist layers 34, 36, and the first conductive blocks 35 by the foregoing steps a1 to a3. Step b of this embodiment includes the following steps:

B1. As shown in FIG. 10, the second insulating photoresist layer 36 is exposed by illuminating the light through a mask 60 opposite to the top surface 362 of the second insulating photoresist layer 36. The mask 60 has A pattern 62 conforming to the reflow holes 40 is formed, and the positions of the respective reflow holes 40 overlap at least a portion of one of the conductive blocks 35.

B2. As shown in FIG. 11, the second insulating photoresist layer 36 is developed to form the reflow holes 40, and each of the reflow holes 40 extends through the top surface of the second insulating photoresist layer 36. 362 and the bottom surface 364, and at least a portion of each of the conductive blocks 35 can be exposed, and the conductive block 42 is formed in the reflow hole 40. In other words, in this embodiment, the so-called "conductive block 42 in each reflow hole 40" is a part of the first conductive block 35 (the conductive block 35 is exposed in the reflow hole 40). In addition, the solder balls 50 disposed in the reflow holes 40 are electrically connected to the conductive contacts 122 of the circuit board 10 indirectly through the conductive blocks 35.

As shown in FIG. 11, since the reflow hole 40 to be formed in this embodiment is completely offset from the conductive contact 122 of the circuit board 10, each of the first conductive blocks 35 extends from a conductive contact 122. The insulating portion 124 of the mounting surface 12, that is, each of the first conductive blocks 35 has a connecting portion 352 connected to the conductive contact 122, and a position corresponding to the conductive contact 122 The extension 354 is configured such that each of the reflow holes 40 can be disposed on the extension 354 and does not correspond to the position of the conductive contact 122. The conductive block 42 in each reflow hole 40 is completely located in the extension of the first conductive block 35. 354.

In the foregoing second preferred embodiment, since each of the first conductive blocks 35 is directly connected to the conductive contacts 122 of the circuit board 10, and generally requires a large area, if the conductive contacts of the mounting surface 12 are If the 122 is relatively dense, the first conductive blocks 35 may be more difficult to configure. In this case, the method provided by a third preferred embodiment of the present invention may be used as follows.

Referring to FIG. 12 to FIG. 17, the resetting method for the reflow position of the circuit board for the probe card provided by the third preferred embodiment of the present invention also includes the method as described in the first preferred embodiment. Step a and step b, and step a of the embodiment also includes steps a1 to a3 as described in the second preferred embodiment, except that the first conductive block 35 formed by steps a1 and a2 has a small area ( As shown in FIG. 12, each of the first conductive blocks 35 is completely located on the conductive contacts 122 corresponding to the first through holes 346. In addition, step a3 of the embodiment forms the second insulating photoresist layer 36 by using a lithography process (as shown in FIG. 13), that is, the step a3 is not only coated with a photoresist, but also has a procedure of exposure and development. The second insulating photoresist layer 36 has a plurality of second through holes 366 extending through the top surface 362 and the bottom surface 364, and each of the second through holes 366 is corresponding to a first conductive block 35, so that the first conductive block 35 Complete (or at least a portion) of the second perforations 366 are exposed. Furthermore, step a of the embodiment further comprises the following steps:

As shown in FIG. 14, a second conductive block 37 is formed in each of the second through holes 366, so that each of the second conductive blocks 37 is electrically connected to the first conductive block 35 corresponding to the second through hole 366. Sexual connection. The second conductive blocks 37 can be formed by depositing a metal material in the second through holes 366 by electroplating, evaporation or sputtering.

A5. As shown in FIG. 15, a third insulating photoresist layer 38 is disposed on the top surface 362 of the second insulating photoresist layer 36. The third insulating photoresist layer 38 has a top surface 382 facing in an opposite direction. A bottom surface 384 of the third insulating photoresist layer 38 is attached to the top surface 362 of the second insulating photoresist layer 36. This step includes only the process of coating the photoresist to form the third insulating photoresist layer 38 covering the second conductive blocks 37, and the top surface 382 of the third insulating photoresist layer 38 is the embodiment. The layered structure 30" upper surface 31.

The layered structure 30" of the present embodiment includes the first, second and third insulating photoresist layers 34, 36, 38, and the first and second conductive blocks 35, 37 by the aforementioned steps a1 to a5. Step b of the embodiment includes the following steps:

B1. As shown in FIG. 16, the third insulating photoresist layer 38 is exposed by illuminating the light through a mask 60 opposite to the top surface 382 of the third insulating photoresist layer 38. The mask 60 has A pattern 62 conforming to the reflow holes 40 is formed, and the positions of the respective reflow holes 40 overlap at least a portion of one of the second conductive blocks 37.

B2. As shown in FIG. 17, the third insulating photoresist layer 38 is developed to form the reflow holes 40, and each of the reflow holes 40 extends through the top surface of the third insulating photoresist layer 38. 382 and the bottom surface 384, and at least a portion of each of the second conductive blocks 37 may be exposed, and the conductive block 42 is formed in the reflow hole 40. In other words, in this embodiment, the so-called "conductive block 42 in each reflow hole 40" is a part of the second conductive block 37 (the second conductive block 37 is exposed to the reflow hole 40). And the solder balls 50 disposed in the reflow holes 40 are electrically connected to the conductive contacts of the circuit board 10 through the second conductive blocks 37 and the first conductive blocks 35. 122.

As shown in FIG. 17, since the reflow hole 40 to be formed in this embodiment is completely offset from the conductive contact 122 of the circuit board 10, each of the second conductive blocks 37 has a first insulating photoresist layer. 34 and the first conductive block 35 are located corresponding to the corresponding segments 372 of the conductive contacts 122 of the circuit board 10, and one does not correspond to the position of the conductive contacts 122 (ie, across the first insulating photoresist layer 34) An extension 374 of the insulating portion 124) of the face 12 should be mounted, and the conductive segments 42 in each of the reflow holes 40 are completely located in the extension 374 of the second conductive block 37.

It can be seen from the foregoing that the method provided by the present invention can redefine the reflow position on the off-the-shelf circuit board, that is, form a reflow hole conforming to the reflow requirement of the probe card, as long as it is ready-made. The layered structure is designed according to the difference between the original conductive contact of the circuit board and the re-deformed reflow position to be redefined, and the layered structure may adopt the aspect provided by any of the foregoing embodiments according to the situation, or may Layered structures of different patterns are applied on the same circuit board.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧ boards

12‧‧‧Installation surface

122‧‧‧Electrical contacts

14‧‧‧Test surface

21‧‧‧ boards

30‧‧‧Layered structure

31‧‧‧ upper surface

32‧‧‧ lower surface

40‧‧‧Reflow holes

42‧‧‧ conductive block

50‧‧‧ solder balls

P‧‧‧Reflow position

Claims (12)

A method for resetting a reflow position of a circuit board for a probe card for redefining a plurality of reflow positions on a mounting surface of a circuit board, the mounting surface of the circuit board having a plurality of conductive contacts The circuit board further has a test surface relative to the mounting surface, the test surface is for electrically connecting with a test; the method for resetting the reflow position of the circuit board for the probe card comprises the following steps: a layered structure covering the conductive contacts on the mounting surface of the circuit board, the layer structure having an upper surface and a lower surface facing in opposite directions, the lower surface being attached to the mounting surface of the circuit board And b. forming, in the layered structure, a plurality of reflow holes conforming to the reflow locations and being open on the upper surface, the reflow holes being respectively used to set a solder ball, and each of the reflows The hole has a conductive block capable of electrically connecting the solder ball to the conductive contact of the circuit board. The method for resetting a reflow position of a circuit board for a probe card according to claim 1, wherein the step a is to apply an insulating photoresist layer to the mounting surface of the circuit board to become the layer. The step b includes the following steps: b1. exposing the light to the layer structure through a mask opposite to the upper surface of the layer structure, the mask having a reflow hole a pattern, wherein each of the reflow holes is overlapped with at least a portion of the one of the conductive contacts; and b2. the layer structure is developed to form the reflow holes, each of the reflow holes being through The upper surface and the lower surface of the layered structure, so that the corresponding guide At least a portion of the electrical contacts are exposed to form conductive segments within each of the reflow holes. The method for resetting a reflow position of a circuit board for a probe card according to claim 1, wherein the step a comprises the following steps: a1. using photolithography on the circuit board. a first insulating photoresist layer is disposed on the mounting surface, the first insulating photoresist layer has a top surface and a bottom surface facing in opposite directions, and a plurality of first through holes penetrating the top surface and the bottom surface, wherein the bottom surface is the layer a lower surface of the structure, each of the first perforation lines corresponding to a conductive contact, wherein at least a portion of each of the conductive contacts is exposed to the corresponding first through hole; a2. respectively in the first through holes Forming a first conductive block such that each of the first conductive blocks is electrically connected to a conductive contact corresponding to the first through hole; and a3. providing a second insulating light on a top surface of the first insulating photoresist layer The second insulating photoresist layer has a top surface and a bottom surface facing in opposite directions, and a bottom surface of the second insulating photoresist layer is attached to a top surface of the first insulating photoresist layer. The method for resetting a reflow position of a circuit board for a probe card according to claim 3, wherein in the step a3, the second insulating photoresist layer covers the first conductive blocks, and The top surface of the second insulating photoresist layer is the upper surface of the layered structure; the step b includes the following steps: b1. traversing the light through a mask opposite to the top surface of the second insulating photoresist layer And exposing the second insulating photoresist layer, the photomask has a compliance with the Refining the pattern of the holes, and each of the reflow holes is overlapped with at least a portion of the first conductive block; and b2. developing the second insulating photoresist layer to form the reflow holes, Each of the reflow holes penetrates the top surface and the bottom surface of the second insulating photoresist layer, so that at least a portion of the corresponding first conductive block is exposed to form a conductive block in each of the reflow holes. The method for resetting a reflow position of a circuit board for a probe card according to claim 4, wherein each of the first conductive blocks has an extension that does not correspond to a position of a conductive contact of the circuit board. The conductive blocks in each of the reflow holes are completely located in the extension of the first conductive block. The method for resetting a reflow position of a circuit board for a probe card according to claim 3, wherein the step a3 forms the second insulating photoresist layer by using a lithography process, the second insulating light The resisting layer has a plurality of second through holes extending through the top surface and the bottom surface, each of the second punching line positions corresponding to a first conductive block, so that at least a portion of each of the first conductive blocks is exposed to the corresponding second through hole; The step a further includes the following steps: a4. forming a second conductive block in the second through holes, such that each of the second conductive blocks is electrically connected to the first conductive block corresponding to the second through hole; And a5. a third insulating photoresist layer is disposed on the top surface of the second insulating photoresist layer, the third insulating photoresist layer has a top surface and a bottom surface facing in opposite directions, and the third insulating photoresist layer The bottom surface is attached to the top surface of the second insulating photoresist layer. The method for resetting a reflow position of a circuit board for a probe card according to claim 6, wherein in the step a5, the third insulating photoresist layer covers the second conductive blocks, and The top surface of the third insulating photoresist layer is the upper surface of the layered structure; the step b includes the following steps: b1. traversing the light through a mask opposite to the top surface of the third insulating photoresist layer And exposing the third insulating photoresist layer, the photomask has a pattern conforming to the reflow holes, and the positions of the reflow holes are overlapped with at least a portion of the second conductive block; and b2. Developing the third insulating photoresist layer to form the reflow holes, each of the reflow holes penetrating the top surface and the bottom surface of the third insulating photoresist layer, so that the corresponding second conductive block has at least a portion Exposed to form conductive blocks in each of the reflow holes. The method for resetting a reflow position of a circuit board for a probe card according to claim 7, wherein each of the first conductive blocks is completely located on a conductive contact corresponding to the first through hole thereof . The method for resetting a reflow position of a circuit board for a probe card according to claim 7, wherein each of the second conductive blocks has an extension that does not correspond to a position of a conductive contact of the circuit board. The conductive blocks in each of the reflow holes are completely located in the extension of the second conductive block. A method of resetting a reflow position of a circuit board for a probe card according to claim 7, wherein in step a3, each of the first conductive blocks is completely exposed to the corresponding second perforation. A method for resetting a reflow position of a circuit board for a probe card according to claim 1, wherein the circuit board defines the reflow position Before being placed, it can be used in the test interface of the final test after the wafer package is completed. After defining the reflow locations, the board can be used for the bare crystal test before the wafer package. In the probe card. The method for resetting a reflow position of a circuit board for a probe card according to claim 11, wherein the test interface of the final test is a test having a socket and electrically connected to the final test. The test interface of the packaged wafer after the machine and chip package are completed.