TWI516329B - Solder ball presses - Google Patents

Description

Tin ball printing machine

The present invention relates to an apparatus for printing a solder ball on an electrode formed on a substrate surface.

In the conventional solder ball printing machine, a filling head having a doctor blade or the like is used to fill the opening of the mask in order to disperse the solder balls. For example, Patent Document 1 discloses that a solder ball is dispersedly disposed on a rotating supply roller surface, and a supply roller is rotated while moving in a horizontal direction, so that a solder ball dispersed on a roller surface is dropped to a mask surface. A scraper having a structure in which a plurality of fibrous members are finely arranged and fixed at both ends, and a solder ball is pressed by a belly portion of the wire, and the blade is moved horizontally while being pressed against the mask surface. The structure of the opening of the mask.

Further, Patent Document 2 discloses that the center axis of the filling head is formed by a cavity, thereby supplying the solder ball to the mask surface, and rotating the central axis, so that a plurality of blades provided on the disk are on the mask surface. A device in which the solder ball is horizontally moved while being horizontally rotated, and the solder ball is filled in the opening portion of the mask.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] JP-A-2005-183423

[Patent Document 2] JP-A-2007-157992

In the configuration of Patent Document 1, the solder ball cannot be smoothly supplied by the supply roller, and an opening in which the solder ball is not filled is likely to occur. Therefore, it is necessary to reciprocate the solder ball supply device and the filling head, and the filling head is provided with a blade that fills the supplied solder ball to the opening of the mask. Further, there is a possibility that excess solder balls remain on the mask surface, and when the mask is separated by the substrate, the excess solder ball may fall off the opening portion and cause defects such as double balls.

Further, in the configuration of Patent Document 2, the filling head cannot be enlarged, and a large filling time is required for printing of a large-area substrate, and the solder balls overflowing the filling head may remain.

An object of the present invention is to solve the above problems and to provide a solder ball printer which can fill a solder ball with a solder ball and which does not leave a solder ball on the mask surface.

In order to achieve the above object, there is provided a solder ball filling head for printing a solder ball through a mask for a plurality of electrode portions formed on a surface of a substrate coated with a flux, and the solder ball filling head is a filling portion Each of the mounting members is fixed to each of the surfaces of the polygonal rotating shaft having a shape of 6 or more and 12 or more, and the filling portion mounting member is formed by a plurality of wires so as to have a specific angle with respect to the direction in which the solder ball filling head is performed. a filling member formed on the side of the mask side of the filling portion mounting member and the above-mentioned wire The space is formed in a space therebetween, and a driving portion that rotates at a desired speed while contacting the mask surface with the solder ball while the solder ball is filled, and the filling portion is oriented downward so that the filling portion faces downward.

The solder ball filling head is configured as above, and the effect is that when the solder ball is filled on the opening surface of the mask, the solder ball can be filled with a small pressing force, and the residual solder ball can be reduced. The amount of cover.

Recently, a method of printing a solder ball on an electrode portion has been proposed. In particular, the distance between printed objects tends to be smaller from 40 μm to 150 μm, and the size of the solder balls is also used. 20~ Smaller size of 100 μm. Therefore, a smaller solder ball can also be provided with a device that performs printing with good precision.

Hereinafter, a preferred embodiment of the solder ball printing apparatus of the present invention will be described with reference to the drawings.

Fig. 1 is a view showing a schematic overall configuration of a solder ball printing machine for printing a solder ball. Fig. 1(a) shows a state in which the mask and the substrate are positioned, and Fig. 1(b) shows a state in which the solder ball is printed on the substrate.

The solder ball printing machine 1 is provided with a printing platform 21 having a driving unit 22 that is movable in the above manner. Further, the printing platform 21 is configured by an XYθ platform so as to be movable in the XYθ direction. A magnet 33 is placed on the printing platform 21, and the substrate 20 is placed thereon. Further, the surface of the mask 8 mounted on the side of the printer main body 1 via the mask frame 9 and the substrate 20 On the other hand, the camera 18 (two-view camera) is used to image the image of the positioning mark individually set, and the control unit (not shown) performs image processing to obtain the positional shift of the mark. The control unit performs driving control in the horizontal direction (XYθ direction) on the printing stage 21 on which the substrate 20 is placed, and performs positioning using the obtained offset amount so that the mark positions are aligned. A camera moving frame 24 for moving the camera 18 is provided between the printing platform 21 and the back side of the mask 8. The camera moving frame 24 is movably disposed in the front and rear directions of FIG.

After positioning by the camera 18, the positioning camera 18 is retracted, and as shown in Fig. 1(b), the driving unit 22 is actuated to raise the printing stage 21 on which the substrate 20 is placed, and the mask 8 provided on the upper portion is raised. Contact the surface of the substrate 20. Thereafter, the head up-and-down driving mechanism 5 is driven to lower the filling head 2 (or the pressing head 2) to the mask surface side, and a filling member composed of a plurality of wires constituting the filling member of the filling portion 3 ( Hereinafter, there is also referred to as a slit scraper 12 (refer to FIG. 2), which is in contact with the mask surface with a specific pressing force. Further, the filling member 12 is made equal to or larger than the width direction of the printed substrate, and the filling head 2 is moved once in the horizontal direction (longitudinal direction of the substrate), and the solder ball can be filled in the opening of the mask. Actually, the filling head is reciprocated in the longitudinal direction of the substrate and is surely filled in the opening of the mask. When the filling head moves in the horizontal direction, the driving mechanism 13 (see FIG. 5) provided in the filling portion 3 is actuated to rotate the filling portion 3. The filling portion 3 is rotated at a relatively low speed of 1 to 5 rotations per second. When the wire constituting the slit scraper 12 is rotated at a high speed, the filled solder ball may be cut to cause a volume defect, or the unnecessary vibration of the mask may be added to become a double ball ( Double ball). Next, the head driving unit (motor) 2g is driven to rotate the ball screw 2b, and the filling head 2 is moved in the horizontal direction. Further, as shown in FIG. 1, during the movement of the filling head 2, the filling portion 3 is in the same direction as the direction in which the filling head 2 is moved by the contact portion with the mask surface (the ball 11 is swept out). , rotates with a specific number of rotations. In this manner, the solder ball is filled in the opening of the mask, and the solder ball 11 does not remain on the mask surface and is collectively scraped. As described above, by rotating the rotating shaft of the filling member to the parallel position of the mask surface, the pressing force of the slit blade 12 against the mask surface can be reduced, and the uniform ball can be filled over a wide range along the rotating shaft. .

Further, the rotation speed of the filling portion 3 can be made low, and the scattering of the solder balls 11 accompanying the rotation becomes small. Further, the rotation speed of the filling portion 3 can be changed depending on the size and amount of the solder ball 11, and it is preferable to use a variable speed motor. Further, in the present apparatus, the cleaning mechanism 25 for cleaning the back surface of the mask is provided in the camera moving frame 24, and the camera 18 is configured to be movable in the horizontal direction. Further, the cleaning head 26 is disposed laterally of the filling head 2. The cleaning head 26 is configured such that after the filling head 2 is operated and the filling of the solder ball 11 is completed, a small amount of the solder ball remaining on the mask surface is swept out of the printing area. The details of the sweeping head 26 will be described later.

2 and 3 are schematic views showing the overall configuration of the filling head and the sweeping head. Fig. 2 shows a state in which the filling head is moved to the left side. Moreover, Fig. 3 shows a state in which the filling head is moved to the right side.

As shown in FIG. 2, the filling portion 3 of the filling head 2 is housed in the lid portion 4, and the piston rod 6a provided in the cylinder 5a is coupled to the lid portion supporting member. 10, the lid portion 4 can be moved up and down simultaneously by driving the air cylinder 5a. The receiving portion of the piston rod 6b is disposed on the end side of the cover supporting member 10. The piston rod 6b is shorter than the piston rod 6a provided in the cylinder 5b, and the stopping position of the piston rod 6b is defined by driving the cylinder 5b. When the solder ball filling portion 3 is pushed up to the upper side, the rising height of the filling head 2 is defined. Further, the cover portion 4 can prevent the unfilled solder balls 11 from scattering to the outside of the cover portion 4 due to the rotation of the filling portion 3. Further, in the printing state (when the filling portion 3 contacts the mask surface), a gap is formed between the lid portion 4 and the surface of the mask 8. Further, an air supply unit 4a is provided in front of and behind the lid portion 4, and the air supply unit 4a is provided with a portion in which the air is blown into the lid portion from the lower portion of the lid portion so that the solder ball does not remain on the mask surface outside the lid portion. In the manner, the air supply port for air blowing is applied to the lower end portion of the cover portion. The air blown into the lid portion 4 by the air supply portion is discharged by the exhaust port 4n provided in the lid portion supporting member 10. A mesh-shaped filter 4f is provided in the exhaust port 4n so that the solder ball 11 is not scattered by the inside of the cover portion 4 to the outside.

Further, as shown in FIG. 2, when the filling head 2 moves in the left direction of the drawing, the filling portion 3 rotates clockwise as shown in the drawing. Further, when the filling head 2 is moved in the right direction of the drawing as shown in FIG. 3, the filling portion 3 is configured to rotate in the counterclockwise direction. As described above, the rotation direction of the filling portion 3 is set so as to be swept out to the side where the filling head 2 is swept in accordance with the moving direction, and the air is blown by the lid portion 4a, tin. The scattering of the ball 11 prevents the filling amount of the opening of the mask from being surely controlled, and the excess solder ball remaining on the mask surface can be minimized. Further, it is possible to delay the solder ball by blowing nitrogen gas or the like into the lid portion 4 instead of the air. 11 oxidized gas.

The filling portion 3 is supported at both end portions of the lid portion 4 in the longitudinal direction. The lid portion 4 is supported by a piston rod 6a constituting the cylinder 5a provided on the upper portion of the head mounting frame 7 via the lid portion supporting member 10. The head mounting frame 7 is configured such that the ball screw 2b provided in the main body of the printing machine is rotationally driven by a motor 2g as shown in Fig. 1, and is reciprocated in a horizontal direction on a linear rail (not shown). Further, a mask holding portion for holding the mask frame 9 is provided on the main body side of the solder ball printing machine 1, and a mask 8 having a plurality of openings is attached to the mask frame 9. The object to be printed, that is, the substrate 20 is held on the surface of the magnet 33, and the magnet 33 is placed on the printing stage 21 which is provided on the body of the solder ball printer and movable in the XYθ and Z directions. Moreover, the magnet 33 provided on the printing platform is used to make the substrate 20 and the mask 8 in close contact with each other, and the mask 8 is formed of a magnetic material such as nickel, and when the printing platform rises and comes into contact with the mask surface, The magnetic force can further improve the adhesion between the substrate 20 and the mask 8.

Further, the cleaning head 26 provided in parallel with the filling head 2 is attached to a ball screw or a timing belt (not shown). The sweeping head 26 is attached to the sweep mounting frame 29 in the same manner as the filling head. A drive source, that is, a cylinder 5c is provided on the upper portion of the sweeping mounting frame 29, and the sweeping portion 27 of the sweeping head 26 can be moved up and down. The cleaning support portion 4s of the cleaning portion 27 is attached to the cleaning support member 10s, and the cleaning member 12s is attached to the end portion of the cleaning support portion 4s. The cleaning member 12s basically has substantially the same configuration as the filling member used in the above-described solder ball filling head, and will be described later in detail. Further, the driving portion of the cleaning head 26 is provided in the same manner as the filling head 2 The cylinder 5d for defining the rising height of the sweeping head 26 and the piston shaft 6d.

Fig. 4 is a view showing the state in the action of the sweeping head. The cleaning head 26 is used to move the filling head 2 to the end of the mask 8 after the filling head 2 fills the opening of the mask surface with the solder ball 11. Next, the cleaning head 26 that is standing on the mask surface at the standby position is moved in the arrow direction (the right direction in FIG. 4), and the solder ball 11 remaining on the mask surface is collected to the filling head 2 of the mask surface. Standby side. Thereafter, in a state where the cleaning head is lowered, and the printing platform is lowered, the mask is separated from the substrate surface. The detailed printing operation will be described later.

Next, the schematic structure of the filling unit 3 will be described. Fig. 5 is a front view of the filling portion, and Fig. 6 is a cross-sectional view taken along line A-A of Fig. 5. Fig. 7 is a plan view showing the filling member, that is, before the installation of the slit scraper, and Fig. 8 is a view showing a state in which the slit scraper is fixed to the blade supporting portion.

As shown in FIGS. 5 and 6, the filling portion 3 is provided on each side of the octagonal fixing member 15 provided on the rotating shaft 16, and the filling portion mounting member 14 is screwed by the bolts 17 (hereinafter also referred to as The blade support unit) is fixed. Further, the fixing member 15 is not limited to an octagonal shape, and may have a polygonal shape of a hexagonal shape to a 12-angle shape. Both end sides of the rotary shaft 16 are supported by the cover portion 4 via bearings. A drive mechanism 13 is provided at one end of the rotary shaft 16, and the motor constituting the drive mechanism 13 is driven to rotate by a specific number of revolutions. As shown in FIG. 5, the filling portion 3 is formed such that the direction in which the filling head 2 is moved is increased in the direction perpendicular to the width direction of the substrate. This length is formed to be longer than the width of the substrate 20 on which the solder balls are printed. So, Basically, the solder ball filling head 2 can fill the entire surface of the electrode portion of the substrate 20 with the solder ball 11 by only one movement on the mask surface in the horizontal direction. The length of the filling member 12 is set to the length of Lj as shown, and the width Lm of the mask is made larger than the Lj, and the width Lt of the substrate is made smaller than the width Lm of the mask and the width Lj of the filling member. That is, it has a relationship of Lm ≧ Lj ≧ Lt.

As shown in Fig. 6, a slit scraper 12 composed of a plurality of wires as shown in Fig. 7 is attached to the blade supporting portion 14. The cross section of the blade supporting portion 14 is a trapezoidal shape as shown in the drawing, and the long side is a quadrangular shape. Install the short side of the trapezoid toward the center axis. The slit scraper can be effectively mounted on the circular shape by setting the cross-sectional shape to a trapezoidal shape. Moreover, as shown in FIG. 8, the magnet 31 is embedded in the rectangular portion of the blade supporting portion 14 at a predetermined interval in the longitudinal direction. The magnet 31 is used to fix the slit scraper 12 to the blade support portion. Further, a pin 32 for positioning is provided between the magnet and the magnet, and the pin is fitted to the insertion hole 12H provided in the fixing portion 12P, and the fixing portion 12P is provided at both end portions in the width direction of the slit blade 12. As shown in Fig. 7, the slit scraper 12 is made of a steel plate having a thickness of 0.05 to 0.1 mm, and is provided with a gap of 0.1 mm to 0.3 mm by the slit 12S, and is inclined at a line width of 0.1 mm and θ = 5 degrees to 35 degrees. A portion other than the portion 12P is etched to form a plurality of wires 12L together. The fixing portions 12 provided at both end portions in the width direction are fixed to both sides of the blade supporting portion 14.

Next, a method of attaching the slit scraper to the blade supporting portion will be described using FIG. Fig. 8(a) is a perspective view, and Fig. 8(b) is a cross-sectional view.

The plurality of positioning pins are arranged at a predetermined interval on the blade supporting portion 14 32. A magnet 31 is embedded between the positioning pin 32 and the positioning pin 32. The slit scraper 12 is attached to each of the blade supporting portions 14, and the positioning pins 32 provided on both sides of the blade supporting portion 14 are inserted into the insertion holes 12H of the slit scraper 12, respectively. Thereafter, the positioning pin 32 is inserted into the insertion hole 30H provided in the blade pressing plate 30 formed of a magnetic material, and can be fixed to the pressing plate 30 by the action of the magnetic force. As described above, the positioning can be easily performed, and the gap scraper 12 can be easily attached and detached. Moreover, the fixing space can be reduced by this configuration, and the distance between the blade supporting portions 14 can be reduced. The wire for constituting the slit scraper 12 is attached so as to be inclined in a specific direction with respect to the longitudinal direction and to form a space with the blade supporting portion 14. That is, the slit scraper is formed of a semi-spiral wire in the longitudinal direction. Further, as shown in FIG. 5, the inclination direction of the constituent wire for the slit scraper 12 is attached in the opposite direction in accordance with each adjacent blade support portion 14. As described above, by alternately changing the inclination direction of the slit blade 12, it is possible to effectively collect the excess solder balls remaining on the mask surface without being filled in the mask opening portion to the filling portion side.

Next, a series of actions of the solder ball printing will be described with reference to Figs.

First, the substrate 20 on which the flux is printed on the electrode portion is carried into a solder ball printer and placed on the magnet 33 on the printing table 21. A plurality of adsorption ports for supplying a negative pressure are provided on the printing stage 21 and the magnet 33, and a negative pressure is supplied thereto so that the substrate 20 is not moved on the magnet 33 and held.

Next, the positioning mark provided on the surface of the substrate 20 and the positioning mark provided on the mask 8 are imaged using the positioning camera 18. The photographic data is transmitted to a control unit (not shown), and image processing is performed here to obtain a positional deviation. According to the result, the amount of shift causes the printing platform 21 to move in the direction of the correction offset by a horizontal direction moving mechanism (not shown).

After the positioning is completed, the raising mechanism 22 that drives the printing platform 21 raises the printing platform 21 to contact the back surface of the mask 8. At this time, the mask 8 can be adhered to the substrate 20 by the magnet 33 on the stage 21.

Then, the solder ball 11 is supplied to the front side portion of the surface of the mask 8 at the initial position (printing start position) of the filling head 2 by a solder ball supply device (not shown). Thereafter, the filling head 2 is horizontally moved to the printing start position and lowered to the mask surface. Further, at this time, the filling portion 3 is lowered to a position where a specific pressing force acts on the mask surface.

Next, as shown in (1) of FIG. 9, the filling portion 3 is rotated in the clockwise direction. Thereafter, the solder ball filling head 2 is horizontally moved on the mask surface toward the left direction of the arrow in the figure. At this time, the air supply unit 4a moves while blowing air toward the inside of the cover portion 4 at the slit blade position. Further, as described above, the solder ball 11 is pressed into the opening portion at the opening of the mask by the rotation of the filling portion 3, and the flux adhering to the substrate 20 is filled with tin in the portion other than the opening portion. The ball 11 is moved to the direction in which the mask faces. After the filling portion 3 reaches the end portion of the substrate, the rotation of the filling portion 3 is stopped, and the air supply to the air supply portion 4a is stopped, and the filling portion 3 is raised. Thereafter, as shown in (2), the filling head 2 is moved in the left direction. In this way, by the movement of the filling head, the filling head 2 can be positioned at the rear side with respect to the position of the next solder ball 11 to be filled. After the end of the movement, the filling portion 3 is again lowered to a position where the specific contact is pressed against the mask surface. As shown in (3) of Fig. 9, the air supply unit starts the cover again. While the supply of air is being performed in the inside, the filling portion 3 is rotated counterclockwise, and the filling head 2 is moved to the right side of the drawing. When the position near the end of the substrate is reached, the supply of air to the air supply unit is stopped, and as shown in Fig. 9 (4), the filling portion 3 of the filling head 2 is raised, and the filling head 2 is further moved to the right side, as shown in Fig. 9. (5) The lowered filling portion 3 is shown such that the position of the remaining solder balls 11 is located on the left side of the filling portion 3. Thereafter, the standby state is set in a state where the filling portion is lowered onto the mask surface. As described above, in the present embodiment, the filling ball 2 is reciprocated once, and the solder ball is filled in the opening of the mask, so that the filling can be surely performed.

In the construction of (1) to (4) of Fig. 9, the cleaning head 26 is placed in a standby state in which the cleaning portion 27 is lowered to the surface of the mask 8. Next, as shown in Fig. 9 (6), the cleaning head 26 is moved to the right side of the drawing (the standby side of the filling head 2). Move to the vicinity of the standby position of the filling head 2. As shown in (7) of FIG. 10, after the cleaning head 26 moves to the vicinity of the filling head 2, the cleaning portion 27 is raised to be separated by the mask surface. The sweep head 26 is returned to the initial standby position. After returning to the standby position as shown in (8) of FIG. 10, the sweeping portion 27 is again lowered to the mask surface to make contact with a specific contact pressure. The mask surface is again moved to the vicinity of the standby position of the filling head 2 as shown in (9) of FIG. By this movement, the solder balls 11 remaining on the mask surface can be completely collected to a position offset from the substrate surface. After the cleaning is completed, the filling head 2 and the cleaning head 26 are brought into contact with the mask surface, and the printing platform 21 is lowered to separate the substrate 20 from the mask surface.

Moreover, although this description explains that the cleaning head 26 is operated twice, it is possible to surely move the residual tin ball on the mask surface by a plurality of operations. Move to the part away from the substrate position.

Moreover, in the embodiment of the present invention, after the solder ball 11 is filled in the opening of the mask by the filling head 2, the cleaning head 26 is actuated, and the residual solder ball on the mask surface is covered in a range covering the mask surface away from the substrate. Cleaning is carried out, but as long as the filling head of the embodiment is used, almost no tin balls remain on the mask surface, so that it is not necessary to clean, and it is not necessary to provide a sweeping head. Alternatively, the filling head 2 and the sweeping head 26 may be used as one head.

Further, in the works of Figs. (6) to (9), when the filling head 2 is in standby, air or nitrogen may be blown toward the inside of the lid portion 4 by the air supply portion 4a. In this way, the solder ball 11 can be prevented from leaking out of the cover portion, and the oxidation of the solder ball 11 can be delayed.

Next, the presence or absence of the defect is detected by the printing state of the substrate 20 printed by the camera. After the detection of the defect is completed, the cleaning mechanism 25 is driven to clean the back of the mask. Further, when there is a defect, the substrate 20 is transferred to the repairing portion, and the defective portion is repaired. After the defective portion is repaired, the substrate is transferred to the reflow portion, and the solder ball is melted and fixed.

In the above, the printing process of the solder ball is roughly described, and the repairing portion or the reflowing portion and the above device are independent devices, and therefore will not be described in detail.

In this project, by using the solder ball supply head of the present invention, a tiny diameter solder ball can be surely supplied to the flux from the opening of the mask.

1‧‧‧ solder ball printing machine

2‧‧‧Filling head

3‧‧‧Filling Department

4‧‧‧ Cover

5‧‧‧ head up and down drive mechanism

7‧‧‧ head mounting frame

8‧‧‧ mask

10‧‧‧Filling support member

10a‧‧‧Sweeping support components

11‧‧‧Fixed components

12‧‧‧Gap scraper

14‧‧‧Filling part mounting member (scraper support part)

16‧‧‧Rotary axis

18‧‧‧ camera

20‧‧‧Substrate

21‧‧‧Printing platform

31‧‧‧ magnet

32‧‧‧Locating pin

33‧‧‧ magnet

Fig. 1 is a schematic overall view of a solder ball printer.

[Fig. 2] A filling head and a sweeping head that move the filling head in the left direction ( Schematic diagram of the sweeper head).

[Fig. 3] A schematic configuration diagram of a filling head and a sweeping head in which the filling head is moved in the right direction.

[Fig. 4] A state diagram in the movement of the sweep head.

Fig. 5 is a front view of a filling portion.

Fig. 6 is a cross-sectional view taken along line A-A of Fig. 5.

[Fig. 7] A plan view of a slit squeegee before installation.

Fig. 8 is a view showing a state in which a slit scraper is fixed to a blade supporting portion.

Fig. 9 is an explanatory view of the operation of the filling head and the cleaning head.

[Fig. 10] The operation of the filling head and the sweeping head is illustrated.

2‧‧‧Filling head

3‧‧‧Filling Department

4‧‧‧ Cover

4a‧‧‧Air Supply Department

4n‧‧‧Exhaust port

4s‧‧‧Sweeping Support Department

5a, 5b, 5c, 5d‧‧‧ cylinder

6a, 6b‧‧‧ piston rod

6d‧‧‧Piston shaft

7‧‧‧ head mounting frame

8‧‧‧ mask

9‧‧‧ mask frame

10‧‧‧Filling support member

10s‧‧‧Sweeping support components

11‧‧‧Fixed components

12s‧‧‧sweeping components

20‧‧‧Substrate

26‧‧‧Sweeping head

27‧‧‧Sweeping Department

29‧‧‧Sweeping installation box

Claims (5)

A solder ball printing machine is a solder ball printing machine for printing a solder ball through a mask on a plurality of electrode portions formed on a surface of a substrate coated with a flux, and is characterized in that: a filling head is provided for: The solder ball is filled in the opening provided in the mask; and the filling portion constituting the filling head is respectively provided by the blade supporting portion on each of the polygonal fixing members provided on the outer surface of the rotating shaft having a hexagonal shape to a 12-degree angle Fixing, in the above-mentioned blade supporting portion, a slit scraper formed of a plurality of wires is present between the surface of the mask surface of the blade supporting portion and the wire so as to have a specific angle with respect to the direction in which the filling head is performed. Install it in a way that is space. The solder ball printing machine according to claim 1, wherein the slit blade attached to the blade supporting portion is inclined in a direction opposite to an oblique direction of the slit blade attached to the adjacent blade supporting portion. Is installed. The solder ball printing machine of claim 1, wherein when the filling head moves in a horizontal direction on the mask surface, the moving direction of the contact portion of the filling member is rotated in the same direction with respect to the moving direction. axis. The solder ball printing machine according to the first aspect of the invention, wherein the cleaning head is provided with a cleaning head in parallel with the filling head, and the cleaning head is configured by attaching a cleaning member having the same shape as the slit blade to a cleaning support portion. In the cleaning of the mask surface by the above-mentioned cleaning head, the above The filling head is in standby state in contact with the state of the mask surface. A solder ball printing machine according to claim 1, wherein the air is blown from the outer side of the filling head toward the inner side or the oxidized gas is retarded to prevent the solder ball from leaking to the outside of the filling head.