TWI514954B - Baffle device and mezzanine card assembly - Google Patents
Baffle device and mezzanine card assembly Download PDFInfo
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- TWI514954B TWI514954B TW101142903A TW101142903A TWI514954B TW I514954 B TWI514954 B TW I514954B TW 101142903 A TW101142903 A TW 101142903A TW 101142903 A TW101142903 A TW 101142903A TW I514954 B TWI514954 B TW I514954B
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Description
本發明是有關於一種阻流裝置以及夾層卡組合,特別是有關於一種應用於電腦系統中的阻流裝置以及夾層卡組合。The present invention relates to a flow blocking device and a sandwich card combination, and more particularly to a flow blocking device and a mezzanine card combination for use in a computer system.
近年來,為實現經濟效益的最大化,市場上一直在追求高效益的伺服器。為了在伺服器內有限的空間中盡可能提高伺服器的處理能力,就導致了伺服器內部的電子元件密度不斷增加,散熱負擔不斷加重。In recent years, in order to maximize economic benefits, the market has been pursuing highly efficient servers. In order to maximize the processing power of the server in a limited space within the server, the density of electronic components inside the server is continuously increased, and the heat dissipation burden is continuously increased.
眾所周知,在刀鋒伺服器內,其每兩片“刀片”之間的空間非常狹小,且每片“刀片”的主機板上的夾層卡(mezzanine car,例如為擴充顯卡),通常只能平行於主機板設置。而為了合理且有效地利用夾層卡的面積並使其性能最大化,通常會在夾層卡的正反兩面都設置如記憶體晶片一類的電子元件。此作法大幅增加了夾層卡的發熱量,並增加了夾層卡的散熱難度。同時,刀鋒伺服器內散熱風流在經過夾層卡之前,通常會先經過CPU散熱裝置的預熱,使得為夾層卡散熱的風流溫度偏高。因此,若刀鋒伺服器內沒有任何導流結構將散熱風流導引至夾層卡的主要發熱位置,夾層卡將無法有效地解熱。As we all know, in the blade server, the space between each two "blades" is very narrow, and the mezzanine car (for example, the expansion graphics card) on the motherboard of each "blade" can usually only be parallel to Motherboard settings. In order to reasonably and effectively utilize the area of the mezzanine card and maximize its performance, electronic components such as a memory chip are usually disposed on both sides of the mezzanine card. This method greatly increases the heat generation of the mezzanine card and increases the difficulty of dissipating the mezzanine card. At the same time, the cooling airflow in the blade servo is usually preheated by the CPU heat sink before passing through the mezzanine card, so that the airflow temperature for the heat dissipation of the mezzanine card is high. Therefore, if there is no flow guiding structure in the blade servo to guide the heat dissipation airflow to the main heating position of the mezzanine card, the mezzanine card will not be able to effectively dissipate heat.
本發明提供一種阻流裝置,其係應用至夾層卡。夾層 卡包含電路板。阻流裝置包含卡合件、阻流板以及彈性件。卡合件用以卡合電路板。阻流板樞接至卡合件,藉以相對卡合件轉動於收合位置與展開位置之間。彈性件壓縮於卡合件與阻流板之間,用以使阻流板相對卡合件朝向展開位置轉動。The present invention provides a flow blocking device that is applied to a mezzanine card. Mezzanine The card contains a circuit board. The flow blocking device comprises a snap member, a spoiler and an elastic member. The snap member is used to engage the circuit board. The spoiler is pivotally connected to the engaging member, thereby rotating relative to the engaging member between the folded position and the deployed position. The elastic member is compressed between the engaging member and the spoiler for rotating the spoiler relative to the engaging member toward the deployed position.
於本發明的一實施方式中,上述的電路板具有相連且不平行的第一邊緣以及第二邊緣。卡合件包含基座、第一卡合部以及第二卡合部。基座用以抵靠電路板的底面。第一卡合部連接基座,用以於第一邊緣上卡合電路板的頂面。第二卡合部連接基座,用以於第二邊緣上卡合電路板的頂面。In an embodiment of the invention, the circuit board has a first edge and a second edge that are connected and not parallel. The engaging member includes a base, a first engaging portion and a second engaging portion. The base is used to abut the bottom surface of the circuit board. The first engaging portion is connected to the base for engaging the top surface of the circuit board on the first edge. The second engaging portion is connected to the base for engaging the top surface of the circuit board on the second edge.
於本發明的一實施方式中,上述的電路板進一步具有通孔。卡合件進一步包含第三卡合部。第三卡合部連接基座,用以經由通孔穿過電路板並卡合電路板的頂面。In an embodiment of the invention, the circuit board further has a through hole. The engaging member further includes a third engaging portion. The third engaging portion is connected to the base for passing through the circuit board through the through hole and engaging the top surface of the circuit board.
於本發明的一實施方式中,上述的基座具有限位部。當阻流板相對卡合件轉動至抵靠限位部時,阻流板係位於展開位置。In an embodiment of the invention, the susceptor has a limiting portion. When the spoiler rotates relative to the engaging member against the limiting portion, the spoiler is located at the deployed position.
本發明另外提供一種夾層卡組合,其係應用於電腦系統中。電腦系統包含殼體。殼體包含底板。夾層卡組合包含第一夾層卡以及阻流裝置。第一夾層卡可拆卸地設置於殼體中。第一夾層卡包含電路板。電路板分隔地位於底板上方。電路板與底板之間具有通道。阻流裝置包含卡合件、阻流板以及彈性件。卡合件用以卡合電路板。阻流板樞接至卡合件,藉以相對卡合件轉動於收合位置與展開位置之間。彈性件壓縮於卡合件與阻流板之間,用以使阻流板相 對卡合件朝向展開位置轉動。轉動至展開位置之阻流板係阻擋通道。The present invention further provides a mezzanine card assembly for use in a computer system. The computer system includes a housing. The housing includes a bottom plate. The mezzanine card combination includes a first mezzanine card and a flow blocking device. The first mezzanine card is detachably disposed in the housing. The first mezzanine card contains a circuit board. The boards are separated above the bottom plate. There is a channel between the board and the backplane. The flow blocking device comprises a snap member, a spoiler and an elastic member. The snap member is used to engage the circuit board. The spoiler is pivotally connected to the engaging member, thereby rotating relative to the engaging member between the folded position and the deployed position. The elastic member is compressed between the engaging member and the spoiler for making the spoiler phase The engaging member is rotated toward the deployed position. The spoiler that is rotated to the deployed position blocks the passage.
於本發明的一實施方式中,上述的第一夾層卡沿一拆裝方向可拆卸地設置於殼體中。阻流板沿一軸向相對卡合件轉動。拆裝方向與軸向垂直。In an embodiment of the invention, the first interlayer card is detachably disposed in the housing in a dismounting direction. The spoiler rotates relative to the engaging member along an axial direction. The disassembly direction is perpendicular to the axial direction.
於本發明的一實施方式中,上述的夾層卡組合進一步包含第二夾層卡。第二夾層卡用以沿拆裝方向通過阻流裝置以進入通道,進而可拆卸地設置於殼體中。阻流板位於電路板與第二夾層卡之間,並抵靠第二夾層卡。In an embodiment of the invention, the mezzanine card combination further includes a second mezzanine card. The second interlayer card is used to pass through the flow blocking device in the disassembly direction to enter the passage, and is further detachably disposed in the housing. The spoiler is located between the circuit board and the second mezzanine card and abuts the second mezzanine card.
因此,本發明的阻流裝置以及夾層卡組合的優點,在於阻流裝置可有效地將電腦系統之殼體內的散熱風流導引至夾層卡的主要發熱位置,使得夾層卡的解熱效率獲得提升。並且,當電腦系統內僅設置一張夾層卡時,阻流裝置的彈性件可使阻流板自動地轉動至展開位置並阻擋夾層卡與殼體之間的通道。當電腦系統內設置兩張夾層卡時,阻流裝置的阻流板也可簡單地收納於兩張夾層卡之間。此外,阻流裝置係以卡合的方式組裝至夾層卡的電路板上,因此並不影響電路板上的線路配置,也更利於產線組裝。Therefore, the flow blocking device and the sandwich card combination of the present invention have the advantage that the flow blocking device can effectively guide the heat dissipation airflow in the casing of the computer system to the main heat generating position of the mezzanine card, so that the heat dissipation efficiency of the sandwich card is improved. Moreover, when only one mezzanine card is provided in the computer system, the elastic member of the flow blocking device can automatically rotate the spoiler to the deployed position and block the passage between the sandwich card and the housing. When two mezzanine cards are installed in the computer system, the baffle of the choke device can also be simply stored between the two mezzanine cards. In addition, the choke device is assembled to the circuit board of the mezzanine card in a snap-fit manner, so that the circuit configuration on the circuit board is not affected, and the production line assembly is more favorable.
以下將以圖式揭露本發明的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結 構與元件在圖式中將以簡單示意的方式繪示。The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some conventional knots are used to simplify the schema. The components and elements are shown in the drawings in a simplified schematic manner.
請參照第1A圖以及第1B圖。第1A圖為繪示依照本發明一實施方式之夾層卡組合組裝至電腦系統(圖未示)之殼體10中的局部側視圖,其中殼體10以剖面表示,且第二夾層卡16尚未設置於殼體10內。第1B圖為繪示第1圖的另一局部側視圖,其中第二夾層卡16已設置於殼體10內。Please refer to Figure 1A and Figure 1B. 1A is a partial side elevational view of a mezzanine card assembly assembled to a computer system (not shown) in accordance with an embodiment of the present invention, wherein the housing 10 is shown in cross section and the second mezzanine card 16 has not been It is disposed in the housing 10. FIG. 1B is another partial side view showing FIG. 1 in which the second mezzanine card 16 has been disposed in the housing 10.
如第1A圖與第1B圖所示,於本實施方式中,夾層卡組合包含第一夾層卡12、阻流裝置14以及第二夾層卡16。夾層卡組合的第一夾層卡12包含電路板120,並可拆卸地設置於殼體10中,使得第一夾層卡12的電路板120分隔地位於殼體10的底板100上方。因此,第一夾層卡12的電路板120與殼體10的底板100之間具有通道11。於本實施方式中,第一夾層卡12的電路板120與殼體10的底板100相互平行,但本發明並不以此為限。於另一實施方式中,第一夾層卡12的電路板120與殼體10的底板100可不相互平行。As shown in FIGS. 1A and 1B, in the present embodiment, the mezzanine card combination includes the first mezzanine card 12, the flow blocking device 14, and the second mezzanine card 16. The first mezzanine card 12 of the mezzanine card combination includes a circuit board 120 that is detachably disposed in the housing 10 such that the circuit board 120 of the first mezzanine card 12 is spaced apart above the bottom plate 100 of the housing 10. Therefore, the circuit board 120 of the first mezzanine card 12 has a channel 11 with the bottom plate 100 of the housing 10. In the present embodiment, the circuit board 120 of the first mezzanine card 12 and the bottom board 100 of the housing 10 are parallel to each other, but the invention is not limited thereto. In another embodiment, the circuit board 120 of the first mezzanine card 12 and the bottom board 100 of the housing 10 may not be parallel to each other.
請參照第2圖,其係繪示第1A圖中之第一夾層卡12與阻流裝置14的立體圖,其中阻流板142相對卡合件140轉動至展開位置。Referring to FIG. 2, a perspective view of the first mezzanine card 12 and the flow blocking device 14 in FIG. 1A is illustrated, wherein the spoiler 142 is rotated relative to the engaging member 140 to the deployed position.
如第2圖所示,於本實施方式中,夾層卡組合的阻流裝置14包含卡合件140、阻流板142以及彈性件144。阻流裝置14的卡合件140用以卡合第一夾層卡12的電路板120。阻流裝置14的阻流板142樞接至卡合件140,藉以相對卡合件140轉動於收合位置(如第1B圖所示)與展開位 置(如第1A圖所示)之間。阻流裝置14的彈性件144壓縮於卡合件140與阻流板142之間,用以使阻流板142相對卡合件140朝向展開位置轉動。轉動至展開位置之阻流板142係阻擋第一夾層卡12的電路板120與殼體10的底板100之間的通道11。藉此,夾層卡組合的阻流裝置14可有效地將殼體10內的散熱風流導引至第一夾層卡12的主要發熱位置,使得第一夾層卡12的解熱效率獲得提升。As shown in FIG. 2, in the present embodiment, the flow blocking device 14 of the sandwich card combination includes the engaging member 140, the spoiler 142, and the elastic member 144. The engaging member 140 of the flow blocking device 14 is used to engage the circuit board 120 of the first mezzanine card 12. The spoiler 142 of the flow blocking device 14 is pivotally connected to the engaging member 140, thereby rotating relative to the engaging member 140 at the folding position (as shown in FIG. 1B) and the unfolding position. Between (as shown in Figure 1A). The elastic member 144 of the flow blocking device 14 is compressed between the engaging member 140 and the spoiler 142 for rotating the spoiler 142 relative to the engaging member 140 toward the deployed position. The spoiler 142 that is rotated to the deployed position blocks the passage 11 between the circuit board 120 of the first mezzanine card 12 and the bottom plate 100 of the housing 10. Thereby, the flow blocking device 14 of the mezzanine card combination can effectively guide the heat dissipation airflow in the casing 10 to the main heat generating position of the first mezzanine card 12, so that the desorption efficiency of the first mezzanine card 12 is improved.
夾層卡組合的第二夾層卡16可沿著拆裝方向A通過阻流裝置14以進入通道11,進而可拆卸地設置於殼體10中。在組裝時,夾層卡組合的第二夾層卡16會先推擠阻流裝置14的阻流板142,使得阻流板142相對卡合件140由展開位置朝向收合位置轉動。在夾層卡組合的第二夾層卡16組裝至殼體10中之後,第二夾層卡16會填補通道11的空間(亦即,位於第一夾層卡12的電路板120與殼體10的底板100之間)。並且,阻流裝置14的阻流板142位於第一夾層卡12的電路板120與第二夾層卡16之間,並抵靠第二夾層卡16。此時,阻流裝置14的阻流板142相對卡合件140的位置可視為上述的收合位置。第二夾層卡16亦具有電路板160,且第二夾層的電路板160平行第一夾層卡12的電路板120與殼體10的底板100,但本發明並不以此為限。The second mezzanine card 16 of the mezzanine card combination can pass through the flow blocking device 14 along the disassembly direction A to enter the channel 11 and be detachably disposed in the housing 10. When assembled, the second mezzanine card 16 of the mezzanine card combination will first push the spoiler 142 of the flow blocking device 14 such that the spoiler 142 is rotated relative to the engaging member 140 from the deployed position toward the collapsed position. After the second mezzanine card 16 of the mezzanine card combination is assembled into the housing 10, the second mezzanine card 16 fills the space of the channel 11 (i.e., the circuit board 120 of the first mezzanine card 12 and the bottom plate 100 of the housing 10). between). Moreover, the baffle 142 of the flow blocking device 14 is located between the circuit board 120 of the first mezzanine card 12 and the second mezzanine card 16 and abuts against the second mezzanine card 16. At this time, the position of the baffle plate 142 of the flow blocking device 14 with respect to the engaging member 140 can be regarded as the above-mentioned folding position. The second mezzanine card 16 also has a circuit board 160, and the circuit board 160 of the second interlayer is parallel to the circuit board 120 of the first mezzanine card 12 and the bottom board 100 of the housing 10. However, the invention is not limited thereto.
需注意的是,阻流板142位於收合位置時相對第一夾層卡12的電路板120的夾角並不受第1B圖所限制,可依據第一夾層卡12與第二夾層卡16之間的距離而改變。舉例來說,若第一夾層卡12與第二夾層卡16之間的距離減 少,則阻流板142位於收合位置時相對第一夾層卡12的電路板120的夾角也會變小。相反地,若第一夾層卡12與第二夾層卡16之間的距離增加,則阻流板142位於收合位置時相對第一夾層卡12的電路板120的夾角也會變大。It should be noted that the angle of the spoiler 142 relative to the circuit board 120 of the first mezzanine card 12 when in the folded position is not limited by FIG. 1B, and may be between the first mezzanine card 12 and the second mezzanine card 16. The distance changes. For example, if the distance between the first mezzanine card 12 and the second mezzanine card 16 is reduced If there is little, the angle between the spoiler 142 and the circuit board 120 of the first mezzanine card 12 will also become smaller when the blocking plate 142 is in the folded position. Conversely, if the distance between the first mezzanine card 12 and the second mezzanine card 16 is increased, the angle between the obstruction plate 142 and the circuit board 120 of the first mezzanine card 12 is also increased when the blocking plate 142 is in the folded position.
另外,於本實施方式中,轉動至展開位置的阻流板142相對第一夾層卡12的電路板夾120一夾角θ,且夾角θ為75~80度。Further, in the present embodiment, the spoiler 142 rotated to the unfolded position is at an angle θ with respect to the board clamp 120 of the first mezzanine card 12, and the included angle θ is 75 to 80 degrees.
請參照第3圖以及第4圖。第3圖為繪示第2圖中之阻流裝置14的立體圖。第4圖為繪示第3圖中之阻流裝置14的局部放大圖。Please refer to Figure 3 and Figure 4. Fig. 3 is a perspective view showing the flow blocking device 14 in Fig. 2. Fig. 4 is a partially enlarged view showing the flow blocking device 14 in Fig. 3.
如第1A圖與第3圖所示,於本實施方式中,阻流裝置14的阻流板142沿一軸向B相對卡合件140轉動。上述的拆裝方向A平行第一夾層卡12的電路板120以及殼體10的底板100,並與軸向B垂直。As shown in FIGS. 1A and 3, in the present embodiment, the spoiler 142 of the flow blocking device 14 is rotated relative to the engaging member 140 in an axial direction B. The above-described disassembly direction A is parallel to the circuit board 120 of the first mezzanine card 12 and the bottom plate 100 of the casing 10, and is perpendicular to the axial direction B.
再回到第2圖,於本實施方式中,第一夾層卡12的電路板120具有相連且不平行的第一邊緣E1以及第二邊緣E2。阻流裝置14的卡合件140包含基座140a、第一卡合部140b、第二卡合部140c以及第三卡合部140d。卡合件140的基座140a用以抵靠第一夾層卡12的電路板120的底面。卡合件140的第一卡合部140b連接基座140a,用以於第一邊緣E1上卡合電路板120的頂面。卡合件140的第二卡合部140c連接基座140a,用以於第二邊緣E2上卡合電路板120的頂面。Returning to Fig. 2, in the present embodiment, the circuit board 120 of the first mezzanine card 12 has a first edge E1 and a second edge E2 that are connected and not parallel. The engaging member 140 of the flow blocking device 14 includes a base 140a, a first engaging portion 140b, a second engaging portion 140c, and a third engaging portion 140d. The base 140a of the engaging member 140 is for abutting against the bottom surface of the circuit board 120 of the first mezzanine card 12. The first engaging portion 140b of the engaging member 140 is coupled to the base 140a for engaging the top surface of the circuit board 120 on the first edge E1. The second engaging portion 140c of the engaging member 140 is coupled to the base 140a for engaging the top surface of the circuit board 120 on the second edge E2.
此外,第一夾層卡12的電路板120具有通孔120a。卡合件140的第三卡合部140d連接基座140a,用以經由 通孔120a穿過第一夾層卡12的電路板120並卡合電路板120的頂面。卡合件140的第一卡合部140b與第三卡合部140d可以達到防止阻流裝置14沿第一卡合部140b與第三卡合部140d的連線方向移動。同樣地,卡合件140的第二卡合部140c與第三卡合部140d亦可以達到防止阻流裝置14沿第二卡合部140c與第三卡合部140d的連線方向移動。藉此,第一夾層卡12之電路板120與阻流裝置14之間的固定強度具有較高的可靠度(reliability)。Further, the circuit board 120 of the first mezzanine card 12 has a through hole 120a. The third engaging portion 140d of the engaging member 140 is coupled to the base 140a for The through hole 120a passes through the circuit board 120 of the first mezzanine card 12 and engages the top surface of the circuit board 120. The first engaging portion 140b and the third engaging portion 140d of the engaging member 140 can prevent the flow blocking device 14 from moving along the connecting direction of the first engaging portion 140b and the third engaging portion 140d. Similarly, the second engaging portion 140c and the third engaging portion 140d of the engaging member 140 can also prevent the flow blocking device 14 from moving along the connecting direction of the second engaging portion 140c and the third engaging portion 140d. Thereby, the fixing strength between the circuit board 120 of the first mezzanine card 12 and the flow blocking device 14 has a high reliability.
如第2圖與第3圖所示,於本實施方式中,卡合件140的基座140a的兩側分別具有限位部140a1。當阻流裝置14的阻流板142相對卡合件140轉動至抵靠限位部140a1時,阻流板142係位於展開位置。藉此,當阻流裝置14的彈性件144使阻流板142相對卡合件140朝向展開位置轉動時,阻流板142最多僅會轉動至展開位置而不超過。As shown in FIGS. 2 and 3, in the present embodiment, the base 140a of the engaging member 140 has a stopper portion 140a1 on both sides. When the spoiler 142 of the flow blocking device 14 is rotated relative to the engaging member 140 to abut against the limiting portion 140a1, the spoiler 142 is located at the deployed position. Thereby, when the elastic member 144 of the flow blocking device 14 rotates the spoiler 142 relative to the engaging member 140 toward the deployed position, the spoiler 142 can only rotate to at most the deployed position without exceeding.
由以上對於本發明的具體實施方式的詳述,可以明顯地看出,本發明的阻流裝置以及夾層卡組合的優點,在於阻流裝置可有效地將電腦系統之殼體內的散熱風流導引至夾層卡的主要發熱位置,使得夾層卡的解熱效率獲得提升。並且,當電腦系統內僅設置一張夾層卡時,阻流裝置的彈性件可使阻流板自動地轉動至展開位置並阻擋夾層卡與殼體之間的通道。當電腦系統內設置兩張夾層卡時,阻流裝置的阻流板也可簡單地收納於兩張夾層卡之間。此外,阻流裝置係以卡合的方式組裝至夾層卡的電路板上,因此並不影響電路板上的線路配置,也更利於產線組裝。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the flow blocking device and the sandwich card combination of the present invention have the advantage that the flow blocking device can effectively guide the heat dissipation airflow in the casing of the computer system. To the main heating position of the mezzanine card, the heat dissipation efficiency of the mezzanine card is improved. Moreover, when only one mezzanine card is provided in the computer system, the elastic member of the flow blocking device can automatically rotate the spoiler to the deployed position and block the passage between the sandwich card and the housing. When two mezzanine cards are installed in the computer system, the baffle of the choke device can also be simply stored between the two mezzanine cards. In addition, the choke device is assembled to the circuit board of the mezzanine card in a snap-fit manner, so that the circuit configuration on the circuit board is not affected, and the production line assembly is more favorable.
雖然本發明已以實施方式揭露如上,然其並不用以限 定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not limited thereto. The scope of the present invention is defined by the scope of the appended claims, unless otherwise claimed.
10‧‧‧殼體10‧‧‧shell
100‧‧‧底板100‧‧‧floor
11‧‧‧通道11‧‧‧ channel
12‧‧‧第一夾層卡12‧‧‧First Mezzanine Card
120‧‧‧電路板120‧‧‧ boards
120a‧‧‧通孔120a‧‧‧through hole
14‧‧‧阻流裝置14‧‧‧Flow blocking device
140‧‧‧卡合件140‧‧‧Cards
140a‧‧‧基座140a‧‧‧Base
140a1‧‧‧限位部140a1‧‧‧Limited
140b‧‧‧第一卡合部140b‧‧‧First Joint Department
140c‧‧‧第二卡合部140c‧‧‧Second engagement
140d‧‧‧第三卡合部140d‧‧‧The third joint
142‧‧‧阻流板142‧‧‧Baffle
144‧‧‧彈性件144‧‧‧Flexible parts
16‧‧‧第二夾層卡16‧‧‧Second mezzanine card
160‧‧‧電路板160‧‧‧ boards
A‧‧‧拆裝方向A‧‧‧Disassembly direction
B‧‧‧軸向B‧‧‧Axial
E1‧‧‧第一邊緣E1‧‧‧ first edge
E2‧‧‧第二邊緣E2‧‧‧ second edge
θ‧‧‧夾角Θ‧‧‧ angle
第1A圖為繪示依照本發明一實施方式之夾層卡組合組裝至電腦系統之殼體中的局部側視圖,其中殼體以剖面表示,且第二夾層卡尚未設置於殼體內。1A is a partial side elevational view showing the assembly of a mezzanine card assembly in a housing of a computer system in accordance with an embodiment of the present invention, wherein the housing is shown in cross section and the second mezzanine card is not disposed in the housing.
第1B圖為繪示第1圖的另一局部側視圖,其中第二夾層卡已設置於殼體內。FIG. 1B is another partial side view showing the first panel, wherein the second mezzanine card has been disposed in the housing.
第2圖為繪示第1A圖中之第一夾層卡與阻流裝置的立體圖,其中阻流板相對卡合件轉動至展開位置。2 is a perspective view showing the first mezzanine card and the flow blocking device in FIG. 1A, wherein the spoiler is rotated relative to the engaging member to the deployed position.
第3圖為繪示第2圖中之阻流裝置的立體圖。Fig. 3 is a perspective view showing the flow blocking device of Fig. 2.
第4圖為繪示第3圖中之阻流裝置的局部放大圖。Fig. 4 is a partially enlarged view showing the flow blocking device of Fig. 3.
12‧‧‧第一夾層卡12‧‧‧First Mezzanine Card
120‧‧‧電路板120‧‧‧ boards
120a‧‧‧通孔120a‧‧‧through hole
14‧‧‧阻流裝置14‧‧‧Flow blocking device
140‧‧‧卡合件140‧‧‧Cards
140a‧‧‧基座140a‧‧‧Base
140a1‧‧‧限位部140a1‧‧‧Limited
140b‧‧‧第一卡合部140b‧‧‧First Joint Department
140c‧‧‧第二卡合部140c‧‧‧Second engagement
140d‧‧‧第三卡合部140d‧‧‧The third joint
142‧‧‧阻流板142‧‧‧Baffle
144‧‧‧彈性件144‧‧‧Flexible parts
E1‧‧‧第一邊緣E1‧‧‧ first edge
E2‧‧‧第二邊緣E2‧‧‧ second edge
Claims (8)
Priority Applications (1)
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TW101142903A TWI514954B (en) | 2012-11-16 | 2012-11-16 | Baffle device and mezzanine card assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101142903A TWI514954B (en) | 2012-11-16 | 2012-11-16 | Baffle device and mezzanine card assembly |
Publications (2)
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TW201422119A TW201422119A (en) | 2014-06-01 |
TWI514954B true TWI514954B (en) | 2015-12-21 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10154606B1 (en) | 2018-02-09 | 2018-12-11 | Wistron Corporation | Server unit and server |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM265821U (en) * | 2004-10-12 | 2005-05-21 | E Move Technology Co Ltd | Clipping type connector structure |
TWM332244U (en) * | 2007-09-12 | 2008-05-11 | Wistron Corp | Flipping and portable hard disk casing |
US20110228474A1 (en) * | 2009-09-15 | 2011-09-22 | Leibowitz Mark E | Advanced mezzanine card for hosting a pmc or xmc |
-
2012
- 2012-11-16 TW TW101142903A patent/TWI514954B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM265821U (en) * | 2004-10-12 | 2005-05-21 | E Move Technology Co Ltd | Clipping type connector structure |
TWM332244U (en) * | 2007-09-12 | 2008-05-11 | Wistron Corp | Flipping and portable hard disk casing |
US20110228474A1 (en) * | 2009-09-15 | 2011-09-22 | Leibowitz Mark E | Advanced mezzanine card for hosting a pmc or xmc |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10154606B1 (en) | 2018-02-09 | 2018-12-11 | Wistron Corporation | Server unit and server |
TWI675286B (en) * | 2018-02-09 | 2019-10-21 | 緯創資通股份有限公司 | Server unit and server |
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TW201422119A (en) | 2014-06-01 |
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