TWI514044B - Display device - Google Patents
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- TWI514044B TWI514044B TW101109469A TW101109469A TWI514044B TW I514044 B TWI514044 B TW I514044B TW 101109469 A TW101109469 A TW 101109469A TW 101109469 A TW101109469 A TW 101109469A TW I514044 B TWI514044 B TW I514044B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0026—Wavelength selective element, sheet or layer, e.g. filter or grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/36—Micro- or nanomaterials
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- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Planar Illumination Modules (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Description
本發明係主張關於2011年03月22日申請之韓國專利案號No.10-2011-0025531之優先權。藉以引用的方式併入本文用作參考。The present invention claims priority to Korean Patent No. 10-2011-0025531, filed on March 22, 2011. This is incorporated herein by reference.
本發明係關於一種顯示裝置。The present invention relates to a display device.
近年來,平面顯示裝置(flat display devices),如一液晶顯示器(liquid crystal display,LCD)、一電漿顯示面板(plasma display panel,PDP)、或一有機發光二極體(organic light emitting diode,OLED),取代了傳統陰極射線管(cathode ray tubes,CRTs),而蓬勃發展。In recent years, flat display devices, such as a liquid crystal display (LCD), a plasma display panel (PDP), or an organic light emitting diode (OLED) ), replacing traditional cathode ray tubes (CRTs), and flourishing.
其中,該LCD係包括:一液晶顯示面板,具有一薄膜電晶體基板(thin film transistor substrate);一彩色濾光基板(color filter substrate)、及注入該薄膜電晶體基板與該彩色濾光基板之間的一液晶。因該液晶顯示面板係為一非發射型裝置(non-emissive device),故一背光單元(backlight unit)係被提供於該薄膜電晶體基板之下方,以提供光。自該背光單元所發出之光的穿透率(transmittance)係依據該液晶之配向態(alignment state)而做調整。The LCD system includes a liquid crystal display panel having a thin film transistor substrate, a color filter substrate, and a thin film transistor substrate and the color filter substrate. A liquid crystal between. Since the liquid crystal display panel is a non-emissive device, a backlight unit is provided under the thin film transistor substrate to provide light. The transmittance of light emitted from the backlight unit is adjusted in accordance with the alignment state of the liquid crystal.
該背光單元係依據其一光源之位置而被分為一側發光式背光 單元(edge-illumination type backlight unit)以及一直下式背光單元(direct-illumination type backlight unit)。在側發光式背光單元中,光源係位於一導光板(light guide plate)之一側。The backlight unit is divided into one-side illumination backlight according to the position of one of the light sources An edge-illumination type backlight unit and a direct-illumination type backlight unit. In the side-lit backlight unit, the light source is located on one side of a light guide plate.
直下式背光單元係隨著LCD之尺寸漸大而被發展出來。在直下式背光單元中,至少一光源係被裝設於液晶顯示面板之下方,以提供光給該液晶顯示面板之整體區域。The direct type backlight unit has been developed as the size of the LCD has grown. In the direct type backlight unit, at least one light source is disposed under the liquid crystal display panel to provide light to the entire area of the liquid crystal display panel.
當與側發光式背光單元相比較時,直下式背光單元可應用一大數目的光源,以達到高亮度。但相對地,直下式背光單元便需要比側發光式背光單元更厚的厚度,來確保其亮度均勻性(brightness uniformity)。When compared with a side-lit backlight unit, the direct-lit backlight unit can apply a large number of light sources to achieve high brightness. In contrast, the direct-lit backlight unit requires a thicker thickness than the side-lit backlight unit to ensure its brightness uniformity.
為求解決上述問題,具有複數個可將藍光轉換成紅光或綠光之量子點(quantum dots)之一量子點帶(quantum dot bar)係被設置於發出藍光之一藍光LED之前方。據此,當藍光被照射至量子點帶之上時,藍光、紅光、及綠光係被混合,且該混合光係入射於導光板,進而產生白光。In order to solve the above problem, a quantum dot bar having a plurality of quantum dots capable of converting blue light into red light or green light is disposed before a blue light emitting blue light LED. Accordingly, when blue light is irradiated onto the quantum dot band, blue light, red light, and green light are mixed, and the mixed light is incident on the light guide plate, thereby generating white light.
若該白光係使用該量子點帶而被提供給導光板,則可實現高色彩再現(color reproduction)。If the white light is supplied to the light guide plate using the quantum dot tape, high color reproduction can be achieved.
該背光單元係可包括:一軟性印刷電路板(flexible printed circuit board,FPCB),提供於該藍光LED之一側,以提供信號及電力給該LED;以及形成於該FPCB之底面下方的一接合件 (bonding member)。The backlight unit may include: a flexible printed circuit board (FPCB) provided on one side of the blue LED to provide signals and power to the LED; and an interface formed under the bottom surface of the FPCB Piece (bonding member).
在藍光自藍光LED發出時,使用經該量子點帶提供給導光板之白光來顯示各種影像之顯示裝置係被廣泛地使用。When blue light is emitted from a blue LED, a display device that displays various images using white light supplied to the light guide plate through the quantum dot tape is widely used.
本發明實施例係提供一種具有製造簡易且具有改良之可靠度(reliability)的顯示裝置。Embodiments of the present invention provide a display device that is simple to manufacture and has improved reliability.
一種根據本發明一實施例之顯示裝置係包括:一光源;一波長轉換裝置(wavelength conversion member),以轉換自該光源所產生之光的一波長;以及一導光件,以導引由該波長轉換裝置所轉換之光;其中,該波長轉換裝置係被設置於形成在該導光件內之一插入孔(insertion hole)中。A display device according to an embodiment of the invention includes: a light source; a wavelength conversion member for converting a wavelength of light generated by the light source; and a light guide for guiding The light converted by the wavelength conversion device; wherein the wavelength conversion device is disposed in one of the insertion holes formed in the light guide.
一種根據本發明一實施例之顯示裝置係包括:一光源;一波長轉換裝置,以轉換自該光源所產生之光的一波長;一導光部(light guide section),以導引由該波長轉換裝置所轉換之光;一後支撐部,與該導光部相連接;以及一顯示面板,設置於該導光部之上;其中,該波長轉換裝置係被設置為介於該導光部與該後支撐部之間。A display device according to an embodiment of the invention includes: a light source; a wavelength conversion device for converting a wavelength of light generated by the light source; and a light guide section for guiding the wavelength a light converted by the conversion device; a rear support portion connected to the light guide portion; and a display panel disposed on the light guide portion; wherein the wavelength conversion device is disposed between the light guide portion Between the rear support portion and the rear support portion.
一種根據本發明一實施例之顯示裝置係包括:一導光件,具有一第一插入孔以及與該第一插入孔相鄰之一第二插入孔;一顯示面板,設置於該導光件之上;一波長轉換裝置,對準於該第一插入孔之中;以及一光源對準於該第二插入孔之中。A display device according to an embodiment of the invention includes: a light guiding member having a first insertion hole and a second insertion hole adjacent to the first insertion hole; a display panel disposed on the light guide member a wavelength conversion device aligned in the first insertion hole; and a light source aligned in the second insertion hole.
根據本發明實施例之顯示裝置中,該光源與該波長轉換裝置係被設置於該導光件之插入孔內。也就是說,根據本發明實施例之顯示裝置中,該光源與該波長轉換裝置可被插入於該插入孔內。據此,該光源與該波長轉換裝置可在不進行接合程序(bonding process)之狀況下,與該導光件耦接。In the display device according to the embodiment of the invention, the light source and the wavelength conversion device are disposed in the insertion hole of the light guide. That is, in the display device according to the embodiment of the invention, the light source and the wavelength conversion device can be inserted into the insertion hole. Accordingly, the light source and the wavelength conversion device can be coupled to the light guide without performing a bonding process.
因此,該光源、該波長轉換裝置、與該導光件可由一簡單的組裝程序彼此耦接在一起。因此,根據本發明實施例之顯示裝置之製造非常簡易。Therefore, the light source, the wavelength conversion device, and the light guide can be coupled to each other by a simple assembly procedure. Therefore, the manufacture of the display device according to the embodiment of the present invention is very simple.
此外,該光源係被插入於該導光件之插入孔,以將該光源牢固地固定在該導光件上。據此,可避免該光源與該導光件分離。也就是說,自該光源所產生之光係有效地入射於該波長轉換裝置中,然後由該波長轉換裝置所轉換過之光可有效地入射於該導光件中。據此,根據本發明實施例之顯示裝置可具有改良之可靠度。Further, the light source is inserted into the insertion hole of the light guiding member to firmly fix the light source to the light guiding member. Accordingly, the light source can be prevented from being separated from the light guide. That is to say, the light generated from the light source is effectively incident on the wavelength conversion device, and then the light converted by the wavelength conversion device can be efficiently incident on the light guide. Accordingly, the display device according to an embodiment of the present invention can have improved reliability.
在實施例的描述中,應予理解,當提及一基板、一框架、一片體、一層、或一圖案是在另一基板、另一框架、另一片體、另一層、或另一圖案「之上/下」或「之上方/下方」,則其可以是直接在另一基板、另一框架、另一片體、另一層、或另一圖案「之上/下」或「之上方/下方」,或者存在一或多個介入層(intervening layers)。參照附圖說明如此之位置。在圖示中,為求清楚與方便說明,各層厚度及尺寸可能被加以誇大、省略、或為概略性地描繪。另,組成元件的尺寸亦不完全反映實際元件之大小。In the description of the embodiments, it is to be understood that when referring to a substrate, a frame, a piece, a layer, or a pattern is on another substrate, another frame, another sheet, another layer, or another pattern. "Up/Down" or "Top/Lower", which may be directly on another substrate, another frame, another sheet, another layer, or another pattern "above/below" or "above/below" Or, there are one or more intervening layers. Such a position will be described with reference to the drawings. In the drawings, the thickness and size of each layer may be exaggerated, omitted, or schematically depicted for clarity and convenience. In addition, the size of the constituent elements does not fully reflect the size of the actual components.
圖1係根據本發明第一實施例,繪示有一LCD之一立體分解圖;圖2係繪示有沿圖1中A-A’線之一剖面圖;圖3係根據本發明第一實施例,繪示有一波長轉換裝置之一立體圖;圖4係繪示有沿圖3中B-B’線之一剖面圖;圖5、6係繪示有插入於一導光板之一發光二極體以及一波長轉換裝置。1 is an exploded perspective view of an LCD according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view taken along line AA' of FIG. 1; and FIG. 3 is a first embodiment of the present invention. For example, a perspective view of a wavelength conversion device is shown; FIG. 4 is a cross-sectional view taken along line BB' of FIG. 3; and FIGS. 5 and 6 are diagrams showing one of the light-emitting diodes inserted into a light guide plate. Body and a wavelength conversion device.
參閱圖1至6,根據本實施例之LCD係包括:一模框10(mold frame);一背光組件20(backlight assembly);以及一液晶面板30(liquid crystal panel)。Referring to FIGS. 1 through 6, the LCD system according to the present embodiment includes: a mold frame 10; a backlight assembly 20; and a liquid crystal panel 30.
模框10係容納背光組件20及液晶面板30於其中。模框10係具有一矩形框架之形狀,且可包括塑膠或強化塑膠(reinforced plastic)。The mold frame 10 houses the backlight assembly 20 and the liquid crystal panel 30 therein. The mold frame 10 has the shape of a rectangular frame and may include plastic or reinforced plastic (reinforced Plastic).
此外,一底座(chassis)可被設置於模框10之下方。該底座係環繞模框10,並支撐背光組件20。該底座亦可被設置於模框10之一側面。In addition, a chassis can be disposed below the mold frame 10. The base surrounds the mold frame 10 and supports the backlight assembly 20. The base may also be disposed on one side of the mold frame 10.
背光組件20係被設置於模框10之內,以提供往液晶面板30之光。背光組件20係包括:一反射片100(reflective sheet);一導光板200;一光源,例如複數個發光二極體300;一波長轉換裝置400;複數個光學片500(optical sheets);以及一軟性印刷電路板600(flexible printed circuit board,FPCB)。The backlight assembly 20 is disposed within the mold frame 10 to provide light to the liquid crystal panel 30. The backlight assembly 20 includes: a reflective sheet 100; a light guide plate 200; a light source, such as a plurality of light emitting diodes 300; a wavelength conversion device 400; a plurality of optical sheets 500; Flexible printed circuit board 600 (FPCB).
反射片100係將自發光二極體300所產生之光向上反射。The reflection sheet 100 reflects the light generated by the self-luminous diode 300 upward.
導光板200係被設置於反射片100之上。導光板200係經由反射、折射(refracting)、及散射(scattering),以將來自發光二極體300之光導引向上。導光板200係為一導光件,用以導引來自發光二極體300之光。The light guide plate 200 is disposed on the reflective sheet 100. The light guide plate 200 is guided to reflect light from the light-emitting diode 300 upward through reflection, refraction, and scattering. The light guide plate 200 is a light guide member for guiding light from the light emitting diode 300.
一插入孔201係形成於導光板200中。插入孔201可形成為穿透導光板200者。發光二極體300與波長轉換裝置400係被插入於插入孔201之內。也就是說,發光二極體300與波長轉換裝置400係被設置於插入孔201之內。An insertion hole 201 is formed in the light guide plate 200. The insertion hole 201 may be formed to penetrate the light guide plate 200. The light emitting diode 300 and the wavelength conversion device 400 are inserted into the insertion hole 201. That is, the light-emitting diode 300 and the wavelength conversion device 400 are disposed inside the insertion hole 201.
如圖1、2、5、6所示,導光板200係包括:一導光部210(light guide section);以及一後支撐部220(rear support section)。As shown in FIGS. 1, 2, 5, and 6, the light guide plate 200 includes a light guide section (210) and a rear support section 220 (rear support section).
導光部210係接收來自發光二極體300之光,並經由反射、折射、及散射,將該光導引向上。導光部210係包括一入射表面211,面對著發光二極體300。也就是說,入射表面211係為插入孔201之其中一內表面。The light guiding unit 210 receives the light from the light emitting diode 300 and directs the light upward through reflection, refraction, and scattering. The light guiding portion 210 includes an incident surface 211 facing the light emitting diode 300. That is, the incident surface 211 is one of the inner surfaces of the insertion hole 201.
後支撐部220係與導光部210相連接。詳細來說,後支撐部220可與導光部210為一體成型者。若後支撐部220與導光部210為整體成型者,則導光板之強度可被提升。此外,可藉由進行一次性射出成形程序,來使後支撐部220與導光部210成為一體成型。The rear support portion 220 is connected to the light guiding portion 210. In detail, the rear support portion 220 may be integrally formed with the light guiding portion 210. If the rear support portion 220 and the light guiding portion 210 are integrally formed, the strength of the light guide plate can be improved. Further, the rear support portion 220 and the light guiding portion 210 can be integrally molded by performing a one-time injection molding process.
後支撐部220係支撐發光二極體300。後支撐部220可與發光二極體300相接觸。後支撐部220可支撐發光二極體300之一後表面,該後表面係與發光二極體300之一出射表面(exit surface)相對。The rear support portion 220 supports the light emitting diode 300. The rear support portion 220 can be in contact with the light emitting diode 300. The rear support portion 220 may support a rear surface of the light emitting diode 300, which is opposite to an exit surface of one of the light emitting diodes 300.
發光二極體300與波長轉換裝置400係介入於後支撐部220與導光部210之間。詳細而言,後支撐部220與導光部210彼此相對,並將發光二極體300與波長轉換裝置400夾入於其間。此外,後支撐部220與導光部210可圍繞發光二極體300與波長轉換裝置400。The light-emitting diode 300 and the wavelength conversion device 400 are interposed between the rear support portion 220 and the light guiding portion 210. Specifically, the rear support portion 220 and the light guiding portion 210 face each other, and the light emitting diode 300 and the wavelength conversion device 400 are sandwiched therebetween. In addition, the rear support portion 220 and the light guiding portion 210 may surround the light emitting diode 300 and the wavelength conversion device 400.
又,發光二極體300與波長轉換裝置400可以壓緊契合方式(press-fitted)固定於插入孔201之中。據此,後支撐部220與 導光部210可施加預設之壓力於發光二極體300與波長轉換裝置400上,以固定發光二極體300與波長轉換裝置400。Further, the light-emitting diode 300 and the wavelength conversion device 400 can be press-fitted and fixed in the insertion hole 201. According to this, the rear support portion 220 and The light guiding portion 210 can apply a predetermined pressure to the light emitting diode 300 and the wavelength conversion device 400 to fix the light emitting diode 300 and the wavelength conversion device 400.
發光二極體300可被設置於插入孔201之中。詳細而言,發光二極體300可被插入於插入孔201之中。The light emitting diode 300 can be disposed in the insertion hole 201. In detail, the light emitting diode 300 can be inserted into the insertion hole 201.
發光二極體300係被使用作為一光源,以產生光。詳細而言,發光二極體300係將光發射往波長轉換裝置400。The light emitting diode 300 is used as a light source to generate light. In detail, the light emitting diode 300 emits light to the wavelength conversion device 400.
發光二極體300可包括:一藍色發光二極體,以發出藍光;或者一紫外光發光二極體,以發出紫外光。詳細而言,發光二極體300可發出具有波長帶落在約430 nm至約470 nm之範圍內之藍光,或者具有波長帶落在約300 nm至約400 nm之範圍內之紫外光。The light emitting diode 300 may include: a blue light emitting diode to emit blue light; or an ultraviolet light emitting diode to emit ultraviolet light. In detail, the light emitting diode 300 may emit blue light having a wavelength band falling within a range of about 430 nm to about 470 nm, or ultraviolet light having a wavelength band falling within a range of about 300 nm to about 400 nm.
發光二極體300係被裝設於FPCB 600之上。發光二極體300可被設置於FPCB 600之下方。發光二極體300係藉由接收通過FPCB 600之一驅動信號(driving signal)來驅動之。The light emitting diode 300 is mounted on the FPCB 600. The light emitting diode 300 can be disposed under the FPCB 600. The light emitting diode 300 is driven by receiving a driving signal through one of the FPCBs 600.
波長轉換裝置400係被設置於插入孔201之中。詳細來說,波長轉換裝置400係被設置為與導光部210之入射表面211相鄰。波長轉換裝置400係介入於發光二極體300與導光部210之間。The wavelength conversion device 400 is disposed in the insertion hole 201. In detail, the wavelength conversion device 400 is disposed adjacent to the incident surface 211 of the light guiding portion 210. The wavelength conversion device 400 is interposed between the light emitting diode 300 and the light guiding portion 210.
波長轉換裝置400可直接與導光部210之入射表面211接觸。此外,波長轉換裝置400可直接與發光二極體300之出射表面接觸。The wavelength conversion device 400 can directly contact the incident surface 211 of the light guiding portion 210. Further, the wavelength conversion device 400 can be directly in contact with the exit surface of the light emitting diode 300.
波長轉換裝置400係接收自發光二極體300所發出之光,以轉換該光之波長。舉例而言,波長轉換裝置400可將自發光二極體300所入射之藍光轉換為綠光及紅光。詳細來說,波長轉換裝置400可將一部分的藍光轉換為具有波長落在約520 nm至約560 nm之範圍內的綠光,並將一部分的藍光轉換為具有波長落在約630 nm至約660 nm之範圍內的紅光。The wavelength conversion device 400 receives the light emitted from the light emitting diode 300 to convert the wavelength of the light. For example, the wavelength conversion device 400 can convert the blue light incident from the self-luminous diode 300 into green light and red light. In detail, the wavelength conversion device 400 can convert a portion of the blue light into green light having a wavelength falling within a range of about 520 nm to about 560 nm, and convert a portion of the blue light to have a wavelength falling from about 630 nm to about 660. Red light in the range of nm.
此外,波長轉換裝置400可將自發光二極體300所發出之紫外光轉換為藍光、綠光、及紅光。詳細來說,波長轉換裝置400可將一部分的紫外光轉換為具有波長落在約430 nm至約470 nm之藍光;將一部分的紫外光轉換為具有波長落在約520 nm至約560 nm之範圍內的綠光;並將一部分的紫外光轉換為具有波長落在約630 nm至約660 nm之範圍內的紅光。In addition, the wavelength conversion device 400 can convert the ultraviolet light emitted from the self-luminous diode 300 into blue light, green light, and red light. In detail, the wavelength conversion device 400 can convert a portion of the ultraviolet light into a blue light having a wavelength falling from about 430 nm to about 470 nm; converting a portion of the ultraviolet light to have a wavelength falling in the range of about 520 nm to about 560 nm. Green light inside; and converts a portion of the ultraviolet light into red light having a wavelength falling within the range of about 630 nm to about 660 nm.
因此,通過波長轉換裝置400之光以及被波長轉換裝置400所轉換之光可產生為白光。詳細來說,藍光、綠光、及紅光係彼此組合,以使白光可入射於導光板200。Therefore, the light passing through the wavelength conversion device 400 and the light converted by the wavelength conversion device 400 can be generated as white light. In detail, the blue light, the green light, and the red light are combined with each other such that white light can be incident on the light guide plate 200.
如圖2至4所示,波長轉換裝置400係包括:一管體410(tube);一密封件420(sealing member);複數個波長轉換粒子430(波長);以及一基質440(matrix)。As shown in FIGS. 2 to 4, the wavelength conversion device 400 includes: a tube 410; a sealing member 420; a plurality of wavelength converting particles 430 (wavelength); and a matrix 440 (matrix).
管體410係容納密封件420、波長轉換粒子430、以及基質440於其中。也就是說,管體410可被用作為一容器(receptacle), 以容納密封件420、波長轉換粒子430、以及基質440於其中。管體410係延伸於一方向。The tube 410 houses a seal 420, wavelength converting particles 430, and a substrate 440 therein. That is, the tube 410 can be used as a container (receptacle), To accommodate the seal 420, the wavelength converting particles 430, and the substrate 440 therein. The tube 410 extends in one direction.
管體410可具有一矩形管體之形狀。詳細而言,管體410之一截面(與管體410之長度方向相垂直者)可具有矩形形狀。管體410可具有一寬度為約0.6 mm以及一高度為約0.2 mm。也就是說,管體410可包括一毛細管體(capillary tube)。The tube body 410 can have the shape of a rectangular tube. In detail, one cross section of the pipe body 410 (which is perpendicular to the longitudinal direction of the pipe body 410) may have a rectangular shape. Tube 410 can have a width of about 0.6 mm and a height of about 0.2 mm. That is, the tube body 410 may include a capillary tube.
管體410係為透明。管體410可包括玻璃。詳細而言,管體410可包括一玻璃毛細管體。The tube 410 is transparent. Tube 410 can include glass. In detail, the tube body 410 may include a glass capillary body.
密封件420係被設置於管體410之內。密封件420係被排列於管體410之一端,以密封管體410。密封件420可包括環氧樹脂(epoxy resin)。The seal 420 is disposed within the tubular body 410. The seal 420 is arranged at one end of the pipe body 410 to seal the pipe body 410. Seal 420 can include an epoxy resin.
波長轉換粒子430係被提供於管體410之內。詳細而言,波長轉換粒子430係均勻地散佈於被裝設於管體410內之基質440中。Wavelength converting particles 430 are provided within the tube body 410. In detail, the wavelength converting particles 430 are uniformly dispersed in the matrix 440 installed in the tube body 410.
波長轉換粒子430係轉換自發光二極體300所發出之光的波長。詳細而言,來自發光二極體300所發出之光係入射於波長轉換粒子430,然後波長轉換粒子430係轉換該入射光之波長。舉例而言,波長轉換粒子430可將自發光二極體300所發出之藍光轉換為綠光及紅光。也就是說,一部分的波長轉換粒子430可將藍光轉換為具有一波長落在約520 nm至約560 nm之範圍內的綠光, 而一部分的波長轉換粒子430可將藍光轉換為具有一波長落在約630 nm至約660 nm之範圍內的紅光。The wavelength converting particles 430 are converted into wavelengths of light emitted from the light emitting diode 300. In detail, the light emitted from the light-emitting diode 300 is incident on the wavelength-converting particles 430, and then the wavelength-converting particles 430 convert the wavelength of the incident light. For example, the wavelength converting particles 430 can convert the blue light emitted by the self-luminous diode 300 into green light and red light. That is, a portion of the wavelength converting particles 430 can convert blue light into green light having a wavelength falling within the range of about 520 nm to about 560 nm. A portion of the wavelength converting particles 430 can convert the blue light into red light having a wavelength falling within the range of about 630 nm to about 660 nm.
此外,波長轉換粒子430可將自發光二極體300所發出之紫外光轉換為藍光、綠光、及紅光。也就是說,一部分的波長轉換粒子430可將紫外光轉換為具有一波長落在約430 nm至約470 nm之藍光;一部分的波長轉換粒子430可將紫外光轉換為具有一波長落在約520 nm至約560 nm之範圍內的綠光。又,一部分的波長轉換粒子430可將紫外光轉換為具有一波長落在約630 nm至約660 nm之範圍內的紅光。Further, the wavelength converting particles 430 can convert ultraviolet light emitted from the self-luminous diode 300 into blue light, green light, and red light. That is, a portion of the wavelength converting particles 430 can convert ultraviolet light into a blue light having a wavelength falling between about 430 nm and about 470 nm; a portion of the wavelength converting particles 430 can convert the ultraviolet light to have a wavelength falling at about 520. Green light in the range of nm to about 560 nm. Also, a portion of the wavelength converting particles 430 can convert the ultraviolet light into red light having a wavelength falling within the range of about 630 nm to about 660 nm.
也就是說,當發光二極體300可為發出藍光之藍色發光二極體時,可使用用以將藍光轉換為紅光及綠光之波長轉換粒子430。另外,當發光二極體300可為發出紫外光之紫外光發光二極體時,可使用用以將紫外光轉換為藍光、綠光、及紅光之波長轉換粒子430。That is to say, when the light emitting diode 300 can be a blue light emitting diode that emits blue light, wavelength converting particles 430 for converting blue light into red light and green light can be used. In addition, when the light emitting diode 300 can be an ultraviolet light emitting diode that emits ultraviolet light, wavelength converting particles 430 for converting ultraviolet light into blue light, green light, and red light can be used.
波長轉換粒子430可包括複數個量子點(quantum dots)。該量子點可包括:核心奈米晶體(core nano-crystals);以及包圍該核心奈米晶體之外殼奈米晶體(shell nano-crystals)。此外,該量子點可包括有機配位體(organic ligands),接合於該外殼奈米晶體。又,該量子點可包括一有機塗覆層(organic coating layer),包圍該外殼奈米晶體。The wavelength converting particles 430 can include a plurality of quantum dots. The quantum dots may include: core nano-crystals; and shell nano-crystals surrounding the core nanocrystals. Additionally, the quantum dots can include organic ligands bonded to the outer shell nanocrystals. Also, the quantum dots may include an organic coating layer surrounding the outer shell nanocrystals.
該外殼奈米晶體可被準備為至少兩層。該外殼奈米晶體係形成於該核心奈米晶體之表面上。藉由使用該外殼奈米晶體形成一殼層(shell layer),該量子點可拉長入射於該核心奈米晶體之光的波長,進而提升光效率。The outer shell nanocrystals can be prepared in at least two layers. The outer shell nanocrystal system is formed on the surface of the core nanocrystal. By using the outer shell nanocrystal to form a shell layer, the quantum dot can lengthen the wavelength of light incident on the core nanocrystal, thereby improving light efficiency.
該量子點可包括一II族化合物半導體、一III族化合物半導體、一V族化合物半導體、以及一VI族化合物半導體其中至少一者。更詳細來說,該核心奈米晶體可包括硒化鎘(Cdse)、磷化銦鎵(InGaP)、碲化鎘(CdTe)、硫化鎘(CdS)、晒化鋅(ZnSe)、碲化鋅(ZnTe)、硫化鋅(ZnS)、碲化汞(HgTe)、或硫化汞(HgS)。此外,該外殼奈米晶體可包括硫化銅鋅(CuZnS)、硒化鎘( CdSe)、碲化鎘(CdTe)、硫化鎘(CdS)、晒化鋅(ZnSe)、碲化鋅(ZnTe)、硫化鋅(ZnS)、碲化汞(HgTe)、或硫化汞(HgS)。該量子點可具有一直徑為約1nm至約10nm。The quantum dot may include at least one of a Group II compound semiconductor, a Group III compound semiconductor, a Group V compound semiconductor, and a Group VI compound semiconductor. In more detail, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, Zinc (ZnSe), Zinc Telluride. (ZnTe), zinc sulfide (ZnS), mercury telluride (HgTe), or mercury sulfide (HgS). In addition, the outer shell nano crystal may include copper zinc sulfide (CuZnS), cadmium selenide ( CdSe), cadmium telluride (CdTe), cadmium sulfide (CdS), zinc nitride (ZnSe), zinc telluride (ZnTe), Zinc sulfide (ZnS), mercury telluride (HgTe), or mercury sulfide (HgS). The quantum dots can have a diameter of from about 1 nm to about 10 nm.
從該量子點射出的光之波長可根據量子點的尺寸或分子簇化物(molecular cluster compound)以及合成程序(synthesis process)中的奈米顆粒前驅物(nano-particle precursor)之間的莫耳比(molar ratio)來調整。該有機配位體可包括砒啶(pyridine)、氫硫基乙醇(mercapto alcohol)、硫基(thiol)、磷化氫(phosphine)、及膦氧化物(phosphine oxide)。該有機配位體可穩定在執行合成程序後不安定的量子點。懸空鍵(dangling bonds)可形成於價能帶(valence band),且該量子點可因該懸空鍵而不穩定。然而,因為該有機配位體一端係為未連結狀態(non-bonding state),該有機配位體之一端係與該懸空鍵連結,藉此以穩定該量子點。The wavelength of light emitted from the quantum dots may be based on the size of the quantum dots or the molecular cluster compound and the molar ratio between the nano-particle precursors in the synthesis process. (molar ratio) to adjust. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, and phosphine oxide. The organic ligand stabilizes quantum dots that are unstable after performing the synthesis procedure. Dangling key Bonds can be formed in a valence band, and the quantum dots can be unstable due to the dangling bonds. However, since one end of the organic ligand is in a non-bonding state, one end of the organic ligand is linked to the dangling bond, thereby stabilizing the quantum dot.
特別是,當量子點之大小係小於藉由以光、電激發一電子和電洞所構成之一激子(exciton)的波耳半徑(Bohr radius)時,可能發生一量子侷限效應(quantum confinement effect),使得該量子點可具有分立能階(discrete energy level)。據此,能帶間隙(energy gap)的大小係被改變。此外,電荷(charges)係被侷限於該量子點中,以改善發光效率。In particular, when the size of the equivalent sub-point is smaller than the Bohr radius of an exciton formed by exciting one electron and a hole by light or electricity, a quantum confinement may occur. The result is such that the quantum dot can have a discrete energy level. Accordingly, the size of the energy gap is changed. In addition, charges are confined to the quantum dots to improve luminous efficiency.
與一般螢光顏料(fluorescent pigments)不同,量子點之螢光波長可根據其粒子尺寸而變化。詳細而言,當粒子尺寸逐漸變小時,光的波長越短;如此,可藉由調整粒子尺寸,來產生具有可見光波長之螢光。此外,由於量子點表現出的消光係數(extinction coefficient)係以約100倍至約1,000倍大於一般螢光顏料所表現出的消光係數,且與一般螢光顏料相比,具有絕佳的量子產率(quantum yield),故可產生強螢光。Unlike general fluorescent pigments, the fluorescence wavelength of a quantum dot can vary depending on its particle size. In detail, as the particle size gradually becomes smaller, the wavelength of light is shorter; thus, fluorescence having a wavelength of visible light can be generated by adjusting the particle size. In addition, since the quantum dots exhibit an extinction coefficient which is about 100 times to about 1,000 times larger than the extinction coefficient exhibited by general fluorescent pigments, and has excellent quantum yield compared with general fluorescent pigments. The quantum yield produces strong fluorescence.
該量子點可藉由一化學濕蝕刻方法(chemical wet scheme)來合成。根據該化學濕蝕刻方法,其係包括將前驅物材料浸漬(immersing)於有機溶劑(organic solvent)中,以成長粒子。該 化學濕蝕刻方法可合成量子點。The quantum dots can be synthesized by a chemical wet scheme. According to the chemical wet etching method, the precursor material is immersed in an organic solvent to grow particles. The Chemical wet etching methods can synthesize quantum dots.
基質440係圍繞波長轉換粒子430。詳細而言,波長轉換粒子430係均勻地散佈於基質440中。基質440係包括高分子聚合物(polymer)。基質440係為透明的。也就是說,基質440係包括透明高分子聚合物。Substrate 440 surrounds wavelength converting particles 430. In detail, the wavelength converting particles 430 are uniformly dispersed in the matrix 440. The matrix 440 includes a polymer. Substrate 440 is transparent. That is, the matrix 440 includes a transparent high molecular polymer.
基質440係被設置於管體410內。詳細而言,基質440係完全地被填充於管體410之內。基質440可黏著於管體410之一內表面上。The substrate 440 is disposed within the tube 410. In detail, the matrix 440 is completely filled within the tubular body 410. The substrate 440 can be adhered to the inner surface of one of the tubes 410.
一空氣層450係形成於密封部420和基質440之間。空氣層450係填充有氮氣(nitrogen)。空氣層450係被用作為密封部420和基質440之間一緩衝阻尼功能(damping function)。An air layer 450 is formed between the sealing portion 420 and the substrate 440. The air layer 450 is filled with nitrogen. The air layer 450 is used as a damping function between the sealing portion 420 and the substrate 440.
波長轉換裝置400可使用下述方法來準備。The wavelength conversion device 400 can be prepared using the following method.
首先,波長轉換粒子430係均勻地被散佈於一樹脂組成物(resin composition)中。該樹脂組成物係為透明。該樹脂組成物可具有光硬化特性(photo-curable property)。First, the wavelength converting particles 430 are uniformly dispersed in a resin composition. The resin composition is transparent. The resin composition may have a photo-curable property.
然後,具有一散射圖案411(scattering pattern)之管體410,其內部壓力係被降低,且管體410之一入口(inlet)係被浸漬於散佈了波長轉換粒子430之樹脂組成物中,進而提升環境壓力(ambient pressure)。因此,具有波長轉換粒子430之樹脂組成物係被引入管體410之內。Then, the internal pressure of the tube body 410 having a scattering pattern 411 is lowered, and an inlet of the tube body 410 is immersed in the resin composition in which the wavelength converting particles 430 are dispersed, thereby further Increase ambient pressure. Therefore, the resin composition having the wavelength converting particles 430 is introduced into the tube body 410.
接著,被引入管體410中的樹脂組成物之一部分係被去除,使管體410之入口淨空。Next, a portion of the resin composition introduced into the tube body 410 is removed, leaving the inlet of the tube body 410 clear.
然後,被引入管體410中的樹脂組成物係被紫外光所硬化,以形成基質440。Then, the resin composition introduced into the tube body 410 is hardened by ultraviolet light to form a matrix 440.
再來,環氧樹脂組成物(epoxy resin composition)係被引入管體410之入口內。該環氧樹脂組成物係被硬化,以形成密封件420。形成密封件420之程序係在氮大氣壓力(nitrogen atmosphere)下進行,故包括氮氣之一空氣層係形成於密封件420與基質440之間。Further, an epoxy resin composition is introduced into the inlet of the tube body 410. The epoxy resin composition is cured to form a seal 420. The procedure for forming the seal 420 is performed under a nitrogen atmosphere, so that an air layer including nitrogen is formed between the seal 420 and the substrate 440.
光學片500係被設置於導光板之上,以改善通過光學片500之光的光學性質。The optical sheet 500 is disposed over the light guide plate to improve optical properties of light passing through the optical sheet 500.
FPCB 600係與發光二極體300電性連接。發光二極體300可被裝設於FPCB 600之上。FPCB 600係被安裝於模框10之內,並排列於導光板200之上。The FPCB 600 is electrically connected to the LED 300. The light emitting diode 300 can be mounted on the FPCB 600. The FPCB 600 is mounted within the mold frame 10 and arranged above the light guide plate 200.
FPCB 600可接合於導光板200。也就是說,一雙面膠帶610(dual-side tape)係夾入於FPCB 600與導光板200之間,以將FPCB 600接合於導光板200。The FPCB 600 can be bonded to the light guide plate 200. That is, a double-sided tape 610 is sandwiched between the FPCB 600 and the light guide plate 200 to bond the FPCB 600 to the light guide plate 200.
模框10與背光組件20係構成該背光單元。亦即,該背光單元係包括:模框10以及背光組件20。The mold frame 10 and the backlight assembly 20 constitute the backlight unit. That is, the backlight unit includes a mold frame 10 and a backlight assembly 20.
液晶面板30係被安裝於模框10之中,並排列於光學片500 之上。The liquid crystal panel 30 is mounted in the mold frame 10 and arranged in the optical sheet 500. Above.
液晶面板30係藉由調整通過該液晶面板30之光的強度(intensity),來顯示影像。亦即,液晶面板30係為一顯示面板,用以顯示影像。液晶面板30係包括:一薄膜電晶體基板(TFT substrate);一彩色濾光片基板;介於該薄膜電晶體基板與該彩色濾光片基板之間的一液晶層;以及偏振濾光器(polarizing filters)。The liquid crystal panel 30 displays an image by adjusting the intensity of light passing through the liquid crystal panel 30. That is, the liquid crystal panel 30 is a display panel for displaying images. The liquid crystal panel 30 includes: a thin film transistor substrate (TFT substrate); a color filter substrate; a liquid crystal layer interposed between the thin film transistor substrate and the color filter substrate; and a polarizing filter ( Polarizing filters).
如圖5、6所示,發光二極體300與波長轉換裝置400係被插入於插入孔201之中。另外,FPCB 600係接合於導光板200之一頂面上。As shown in FIGS. 5 and 6, the light-emitting diode 300 and the wavelength conversion device 400 are inserted into the insertion hole 201. In addition, the FPCB 600 is bonded to one of the top surfaces of the light guide plate 200.
發光二極體300與波長轉換裝置400可以壓緊契合方式固定於插入孔201之中。也就是說,在後支撐部220與導光部210之間的一間隙(gap)被稍微擴大之後,發光二極體300與波長轉換裝置400係被插入於該間隙。接著,後支撐部220與導光部210之間的間隙又變窄。The light-emitting diode 300 and the wavelength conversion device 400 can be fixed in the insertion hole 201 in a press-fit manner. That is, after a gap between the rear support portion 220 and the light guiding portion 210 is slightly enlarged, the light emitting diode 300 and the wavelength conversion device 400 are inserted into the gap. Then, the gap between the rear support portion 220 and the light guiding portion 210 is narrowed again.
因此,後支撐部220與導光部210可牢固地固定發光二極體300與波長轉換裝置400。Therefore, the rear support portion 220 and the light guiding portion 210 can firmly fix the light emitting diode 300 and the wavelength conversion device 400.
此外,根據本實施例之LCD中,不需要進行額外的接合程序,發光二極體300與波長轉換裝置400便可被固定於導光板200。因此,根據本實施例之LCD可具有很簡易之製造程序。Further, in the LCD according to the present embodiment, the light-emitting diode 300 and the wavelength conversion device 400 can be fixed to the light guide plate 200 without performing an additional bonding process. Therefore, the LCD according to the present embodiment can have a very simple manufacturing process.
又,因發光二極體300係被插入於插入孔201中,並被牢固地固定於導光板200,故可避免發光二極體300與導光板200分離。據此,由發光二極體300所發出之光可有效地入射於波長轉換裝置400,且由波長轉換裝置400所轉換之光可有效地入射於導光板200。另外,自發光二極體300所發出之光的方向可不偏離導光板200。Further, since the light-emitting diode 300 is inserted into the insertion hole 201 and is firmly fixed to the light guide plate 200, the light-emitting diode 300 can be prevented from being separated from the light guide plate 200. Accordingly, the light emitted by the light emitting diode 300 can be efficiently incident on the wavelength conversion device 400, and the light converted by the wavelength conversion device 400 can be efficiently incident on the light guide plate 200. In addition, the direction of the light emitted from the self-luminous diode 300 may not deviate from the light guide plate 200.
因此,根據本實施例之LCD可具有改良之可靠度。Therefore, the LCD according to the present embodiment can have improved reliability.
圖7係根據本發明第二實施例,繪示有一LCD之一剖面圖;圖8係根據本發明第二實施例,繪示有一波長轉換裝置之一立體圖;圖9係繪示有沿圖7中C-C’線之一剖面圖。在下文中,將額外說明一黏著件(adhering member)。另外,本實施例之說明大致上可配合上述實施例之說明作為參照。7 is a cross-sectional view of a second embodiment of the present invention; FIG. 8 is a perspective view of a wavelength conversion device according to a second embodiment of the present invention; FIG. 9 is a cross-sectional view of FIG. A section of the C-C' line. In the following, an adhering member will be additionally explained. In addition, the description of the present embodiment can be roughly referred to in the description of the above embodiments.
參閱圖6、7,黏著件460係被設置於波長轉換裝置400之一外表面上。黏著件460係均勻地塗覆於波長轉換裝置400之整體外表面上。亦即,黏著件460係圍繞著波長轉換裝置400。Referring to Figures 6 and 7, the adhesive member 460 is disposed on an outer surface of one of the wavelength conversion devices 400. The adhesive member 460 is uniformly applied to the entire outer surface of the wavelength conversion device 400. That is, the adhesive member 460 surrounds the wavelength conversion device 400.
波長轉換裝置400係包括:一第一表面401;一第二表面402;一頂面403;以及一底面404。The wavelength conversion device 400 includes a first surface 401, a second surface 402, a top surface 403, and a bottom surface 404.
第一表面401係面對發光二極體300,而第二表面402係面對該導光板。此外,頂面403係自第一表面401之一外週緣部分延伸至第二表面402之一外週緣部分;而底面404係面對頂面403。 黏著件460係被設置於第一表面401、第二表面402、頂面403、以及底面404之上。The first surface 401 faces the light emitting diode 300, and the second surface 402 faces the light guide plate. Further, the top surface 403 extends from an outer peripheral portion of the first surface 401 to an outer peripheral portion of the second surface 402; and the bottom surface 404 faces the top surface 403. The adhesive member 460 is disposed on the first surface 401, the second surface 402, the top surface 403, and the bottom surface 404.
黏著件460可被設置於波長轉換裝置400之頂面403與底面404之上。亦即,黏著件460可被設置於波長轉換裝置400與FPCB 600之間。又,黏著件460可被設置於波長轉換裝置400與導光部210之間。另,黏著件460可被設置於波長轉換裝置400與發光二極體300之間。The adhesive member 460 can be disposed over the top surface 403 and the bottom surface 404 of the wavelength conversion device 400. That is, the adhesive member 460 can be disposed between the wavelength conversion device 400 and the FPCB 600. Further, the adhesive member 460 may be disposed between the wavelength conversion device 400 and the light guiding portion 210. In addition, the adhesive member 460 may be disposed between the wavelength conversion device 400 and the light emitting diode 300.
黏著件460係為透明。黏著件460可黏著於波長轉換裝置400之外表面。另外,黏著件460可黏著於發光二極體300與導光板200。詳細而言,黏著件460可黏著於發光二極體300之出射表面與導光板200之入射表面211。Adhesive 460 is transparent. The adhesive member 460 can be adhered to the outer surface of the wavelength conversion device 400. In addition, the adhesive member 460 can be adhered to the light emitting diode 300 and the light guide plate 200. In detail, the adhesive member 460 can adhere to the exit surface of the light emitting diode 300 and the incident surface 211 of the light guide plate 200.
因此,因為黏著件460之存在,空氣層不會形成於發光二極體300與波長轉換裝置400之間。又,因為黏著件460之存在,空氣層不會形成於波長轉換裝置400與導光板200之間。Therefore, the air layer is not formed between the light emitting diode 300 and the wavelength conversion device 400 because of the presence of the adhesive member 460. Moreover, the air layer is not formed between the wavelength conversion device 400 and the light guide plate 200 because of the presence of the adhesive member 460.
黏著件460係被用作為波長轉換裝置400與導光板200之間的光學阻尼作用(optical damping function)。也就是說,黏著件460係可防止波長轉換裝置400與發光二極體300之出射表面之間、以及波長轉換裝置400與導光部210之入射表面211之間形成空氣層。此外,黏著件460可具有與波長轉換裝置400之管體、發光二極體300之填充物(filler)、以及導光板200相近之 折射率。因此,黏著件460可縮小波長轉換裝置400與發光二極體300之出射表面、以及波長轉換裝置400與導光板200之間的折射率差異。The adhesive member 460 is used as an optical damping function between the wavelength conversion device 400 and the light guide plate 200. That is, the adhesive member 460 prevents an air layer from being formed between the wavelength conversion device 400 and the exit surface of the light emitting diode 300, and between the wavelength conversion device 400 and the incident surface 211 of the light guiding portion 210. In addition, the adhesive member 460 may have a similarity to the tube of the wavelength conversion device 400, the filler of the light emitting diode 300, and the light guide plate 200. Refractive index. Therefore, the adhesive member 460 can reduce the refractive index difference between the wavelength conversion device 400 and the exit surface of the light emitting diode 300, and between the wavelength conversion device 400 and the light guide plate 200.
因黏著件460之作用,自發光二極體300所發出之光以及被波長轉換裝置400所轉換之光可有效地入射於導光板200。Due to the action of the adhesive member 460, the light emitted from the light-emitting diode 300 and the light converted by the wavelength conversion device 400 can be efficiently incident on the light guide plate 200.
據此,根據本實施例之LCD可具有改良之亮度。Accordingly, the LCD according to the present embodiment can have improved brightness.
又,黏著件460係具有彈性(elasticity)。而正因黏著件460具有彈性,故黏著件460在波長轉換裝置400與導光板200之間、以及波長轉換裝置400與發光二極體300之間可執行機械阻尼功能(mechanical damping function)。Further, the adhesive member 460 has elasticity. Because the adhesive member 460 has elasticity, the adhesive member 460 can perform a mechanical damping function between the wavelength conversion device 400 and the light guide plate 200 and between the wavelength conversion device 400 and the light-emitting diode 300.
特別是,黏著件460係被塗覆於波長轉換裝置400之外表面上,發光二極體300與波長轉換裝置400係被以壓緊契合方式固定於導光板200之插入孔201中。此時,因黏著件460具有彈性,故在波長轉換裝置400被插入於插入孔201中的時候,黏著件460可有效地保護波長轉換裝置400。In particular, the adhesive member 460 is applied to the outer surface of the wavelength conversion device 400, and the light-emitting diode 300 and the wavelength conversion device 400 are fixed in the insertion hole 201 of the light guide plate 200 in a press-fit manner. At this time, since the adhesive member 460 has elasticity, the adhesive member 460 can effectively protect the wavelength conversion device 400 when the wavelength conversion device 400 is inserted into the insertion hole 201.
特別是,若波長轉換裝置400之管體係由玻璃所製成,則黏著件460可防止管體破裂。In particular, if the tube system of the wavelength conversion device 400 is made of glass, the adhesive member 460 can prevent the tube from being broken.
據此,根據本實施例之LCD之組裝簡易,且可具有改良之機械強度。Accordingly, the LCD according to the present embodiment is easy to assemble and can have improved mechanical strength.
圖10、11係根據本發明第三實施例,繪示有一LCD製造程序 之剖面圖。在下文中,將額外說明一填充件(filling member)。另外,本實施例之說明大致上可配合上述實施例之說明作為參照。10 and 11 illustrate an LCD manufacturing process according to a third embodiment of the present invention. Sectional view. In the following, a filling member will be additionally explained. In addition, the description of the present embodiment can be roughly referred to in the description of the above embodiments.
參閱圖10,發光二極體300與波長轉換裝置400係被插入導光板200之插入孔201中。此時,一預設空間可維持在發光二極體300與波長轉換裝置400之間、以及波長轉換裝置400與導光部210之間。也就是說,發光二極體300與波長轉換裝置400可不需以壓緊契合方式來固定於插入孔201中。Referring to FIG. 10, the light-emitting diode 300 and the wavelength conversion device 400 are inserted into the insertion holes 201 of the light guide plate 200. At this time, a predetermined space can be maintained between the light emitting diode 300 and the wavelength conversion device 400, and between the wavelength conversion device 400 and the light guiding portion 210. That is to say, the light-emitting diode 300 and the wavelength conversion device 400 can be fixed in the insertion hole 201 without being press-fitted.
接著,可硬化樹脂(意指一光硬化樹脂組成物及/或一熱固性樹脂組成物471)係被注入波長轉換裝置400與導光部210之間的空間內。樹脂組成物471可包括環氧樹脂。Next, a curable resin (meaning a photo-curable resin composition and/or a thermosetting resin composition 471) is injected into the space between the wavelength conversion device 400 and the light guiding portion 210. The resin composition 471 may include an epoxy resin.
參閱圖11,將紫外光及/或熱施加於被注入插入孔201中的樹脂組成物471,以硬化樹脂組成物471,進而形成填充件470於插入孔201中。Referring to Fig. 11, ultraviolet light and/or heat is applied to the resin composition 471 injected into the insertion hole 201 to harden the resin composition 471, thereby forming the filler member 470 in the insertion hole 201.
填充件470所進行之功能係與黏著件460大致上相同。The function performed by the filler 470 is substantially the same as the adhesive 460.
根據本實施例之LCD中,可降低波長轉換裝置400之機械性損壞,改善亮度,並增強機械性質。According to the LCD of the present embodiment, mechanical damage of the wavelength conversion device 400 can be reduced, brightness can be improved, and mechanical properties can be enhanced.
圖12係根據本發明第四實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一立體圖;圖13係根據本發明第四實施例,繪示有光源、導光板、以及波長轉換裝置之一剖面圖。在下文中,本實施例之說明大致上可配合上述實施例之說明作為參照。12 is a perspective view showing a light source, a light guide plate, and a wavelength conversion device according to a fourth embodiment of the present invention; FIG. 13 is a diagram showing a light source, a light guide plate, and a wavelength according to a fourth embodiment of the present invention. A cross-sectional view of one of the conversion devices. In the following, the description of the present embodiment can be substantially referred to in the description of the above embodiments.
參閱圖12、13,波長轉換裝置400係被插入形成於導光板200內之一插入孔202中。此時,發光二極體300係被設置於導光板200之一側。也就是說,發光二極體300係被設置於後支撐部220之側。Referring to FIGS. 12 and 13, the wavelength conversion device 400 is inserted into one of the insertion holes 202 formed in the light guide plate 200. At this time, the light-emitting diode 300 is provided on one side of the light guide plate 200. That is, the light emitting diode 300 is disposed on the side of the rear support portion 220.
詳細而言,後支撐部220係被夾在波長轉換裝置400與發光二極體300之間。In detail, the rear support portion 220 is sandwiched between the wavelength conversion device 400 and the light emitting diode 300.
插入孔202可具有一寬度,對應於波長轉換裝置400之一厚度。詳細而言,插入孔202之寬度係與波長轉換裝置400之厚度相等。The insertion hole 202 may have a width corresponding to a thickness of one of the wavelength conversion devices 400. In detail, the width of the insertion hole 202 is equal to the thickness of the wavelength conversion device 400.
發光二極體300所發出之光係經由後支撐部220而入射於波長轉換裝置400。詳細來說,自發光二極體300所發出之光係在光被擴散通過後支撐部220以後,入射於波長轉換裝置400。The light emitted from the light-emitting diode 300 is incident on the wavelength conversion device 400 via the rear support portion 220. In detail, the light emitted from the self-luminous diode 300 is incident on the wavelength conversion device 400 after the light is diffused through the support portion 220.
據此,自發光二極體300所發出之光可不被匯聚於波長轉換裝置400之一局部部分上。因光不被匯聚於波長轉換裝置400之局部部分上,故可避免被包含於波長轉換裝置400中之波長轉換粒子的局部退化(local degradation)。Accordingly, the light emitted from the self-luminous diode 300 may not be concentrated on a partial portion of the wavelength conversion device 400. Since light is not concentrated on a partial portion of the wavelength conversion device 400, local degradation of the wavelength-converting particles included in the wavelength conversion device 400 can be avoided.
此外,後支撐部220係將發光二極體300與波長轉換裝置400相隔開。由此,可防止因發光二極體300所產生之熱能而導致波長轉換粒子之退化。Further, the rear support portion 220 separates the light emitting diode 300 from the wavelength conversion device 400. Thereby, deterioration of the wavelength-converting particles due to thermal energy generated by the light-emitting diode 300 can be prevented.
又,因發光二極體300係與導光板組裝在一起,而與波長轉 換裝置400分開,故根據本實施例之LCD可具有簡易的製造程序。Moreover, since the light-emitting diode 300 is assembled with the light guide plate, and the wavelength is turned The changing device 400 is separated, so that the LCD according to the present embodiment can have a simple manufacturing process.
圖14係根據本發明第五實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一剖面圖;圖15係根據本發明第六實施例,繪示有一LCD之一剖面圖。在下文中,本實施例之說明大致上可配合上述實施例之說明作為參照。Figure 14 is a cross-sectional view showing a light source, a light guide plate, and a wavelength conversion device according to a fifth embodiment of the present invention; and Figure 15 is a cross-sectional view showing a LCD according to a sixth embodiment of the present invention. In the following, the description of the present embodiment can be substantially referred to in the description of the above embodiments.
參閱圖14,導光板200係包括:導光部210;後支撐部220;以及一下部支撐部230。下部支撐部230係被設置於波長轉換裝置400之下方。亦即,下部支撐部230係構成形成於導光板200中的插入孔202底部。Referring to FIG. 14 , the light guide plate 200 includes a light guiding portion 210 , a rear support portion 220 , and a lower portion supporting portion 230 . The lower support portion 230 is disposed below the wavelength conversion device 400. That is, the lower support portion 230 constitutes the bottom of the insertion hole 202 formed in the light guide plate 200.
下部支撐部230可支持波長轉換裝置400之下部。下部支撐部230係直接地與波長轉換裝置400之下部相接觸。下部支撐部230係自導光部210延伸至後支撐部220。下部支撐部230、導光部210、及後支撐部220可為整體成型。此外,導光部210、後支撐部220、及下部支撐部230可圍繞波長轉換裝置400。The lower support portion 230 can support the lower portion of the wavelength conversion device 400. The lower support portion 230 is in direct contact with the lower portion of the wavelength conversion device 400. The lower support portion 230 extends from the light guiding portion 210 to the rear support portion 220. The lower support portion 230, the light guiding portion 210, and the rear support portion 220 may be integrally formed. Further, the light guiding portion 210, the rear supporting portion 220, and the lower supporting portion 230 may surround the wavelength conversion device 400.
又,參閱圖15,下部支撐部230可支撐發光二極體300之下部。詳細而言,發光二極體300與波長轉換裝置400係同步地插入於插入孔201中。此時,下部支撐部230可同步地支撐發光二極體300與波長轉換裝置400之下部。也就是說,下部支撐部230、導光部210、及後支撐部220可同步地圍繞發光二極體300與波長轉換裝置400。Also, referring to FIG. 15, the lower support portion 230 can support the lower portion of the light emitting diode 300. In detail, the light emitting diode 300 is inserted into the insertion hole 201 in synchronization with the wavelength conversion device 400. At this time, the lower support portion 230 can synchronously support the light emitting diode 300 and the lower portion of the wavelength conversion device 400. That is, the lower support portion 230, the light guiding portion 210, and the rear support portion 220 may synchronously surround the light emitting diode 300 and the wavelength conversion device 400.
因下部支撐部230之作用,波長轉換裝置400可輕易地被固定於插入孔202中。亦即,因下部支撐部230支撐波長轉換裝置400,波長轉換裝置400可精確地對準插入孔202。另外,因下部支撐部230之作用,發光二極體300可精確地被固定於插入孔202中。Due to the action of the lower support portion 230, the wavelength conversion device 400 can be easily fixed in the insertion hole 202. That is, since the lower support portion 230 supports the wavelength conversion device 400, the wavelength conversion device 400 can accurately align the insertion hole 202. In addition, the light-emitting diode 300 can be accurately fixed in the insertion hole 202 due to the action of the lower support portion 230.
圖16係根據本發明第七實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一立體圖;圖17係根據本發明第七實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一剖面圖。在下文中,本實施例之說明大致上可配合上述實施例之說明作為參照。16 is a perspective view showing a light source, a light guide plate, and a wavelength conversion device according to a seventh embodiment of the present invention; FIG. 17 is a view showing a light source, a light guide plate, and A cross-sectional view of a wavelength conversion device. In the following, the description of the present embodiment can be substantially referred to in the description of the above embodiments.
參閱圖16、17,導光板200係包括:一第一插入孔202;以及一第二插入孔203。波長轉換裝置400係對準於第一插入孔202,且發光二極體300係對準於第二插入孔203。Referring to FIGS. 16 and 17, the light guide plate 200 includes: a first insertion hole 202; and a second insertion hole 203. The wavelength conversion device 400 is aligned with the first insertion hole 202, and the light emitting diode 300 is aligned with the second insertion hole 203.
第一及第二插入孔202、203可延伸於彼此平行之一方向。此外,第一及第二插入孔202、203可彼此平行。The first and second insertion holes 202, 203 may extend in one of the directions parallel to each other. Further, the first and second insertion holes 202, 203 may be parallel to each other.
導光板200係包括一間隔件240(spacer)。間隔件240係被設置於導光部與後支撐部220之間。又,間隔件240係對準於第一及第二插入孔202、203之間。據此,間隔件240係被設置於發光二極體300與波長轉換裝置400之間。也就是說,發光二極體300係以間隔件240而與波長轉換裝置400彼此相隔而設。The light guide plate 200 includes a spacer 240. The spacer 240 is disposed between the light guiding portion and the rear supporting portion 220. Further, the spacer 240 is aligned between the first and second insertion holes 202, 203. Accordingly, the spacer 240 is disposed between the light emitting diode 300 and the wavelength conversion device 400. That is, the light-emitting diodes 300 are provided apart from the wavelength conversion device 400 by the spacers 240.
因此,間隔件240可避免被包含於波長轉換裝置400中之波長轉換粒子的退化。若發光二極體300係與波長轉換裝置400相鄰,則包含於波長轉換裝置400中之波長轉換粒子可能會因發光二極體300所產生之熱而退化。根據本實施例,發光二極體300係以間隔件240而與波長轉換裝置400彼此相隔而設,故可防止包含於波長轉換裝置400中之波長轉換粒子退化。Therefore, the spacer 240 can avoid degradation of the wavelength-converting particles included in the wavelength conversion device 400. If the light-emitting diode 300 is adjacent to the wavelength conversion device 400, the wavelength-converting particles included in the wavelength conversion device 400 may be degraded by the heat generated by the light-emitting diode 300. According to the present embodiment, the light-emitting diodes 300 are provided apart from the wavelength conversion device 400 by the spacers 240, so that the wavelength-converting particles included in the wavelength conversion device 400 can be prevented from deteriorating.
因此,根據本實施例之LCD可具有改良之可靠度與耐久性(durability)。Therefore, the LCD according to the present embodiment can have improved reliability and durability.
在本說明書中所提到的“一實施例”、“實施例”、“範例實施例”等任何的引用,代表本發明之至少一實施例中包括關於該實施例的一特定特徵、結構或特性。此類用語出現在文中多處但不盡然要參考相同的實施例。此外,在特定特徵、結構或特性的描述關係到任何實施例中,皆認為在熟習此技藝者之智識範圍內其利用如此的其他特徵、結構或特徵來實現其它實施例。Any reference to "an embodiment", "an embodiment", "an example embodiment" or the like in this specification means that a particular feature, structure or structure of the embodiment is included in at least one embodiment of the invention. characteristic. Such terms appear in many places in the text but do not necessarily refer to the same embodiment. In addition, in the description of a particular feature, structure, or characteristic, it is contemplated that such other features, structures, or characteristics may be utilized to implement other embodiments within the scope of those skilled in the art.
雖然參考實施例之許多說明性實施例來描述實施例,但應理解,熟習此項技藝者可想出將落入本發明之原理的精神及範疇內的眾多其他修改及實施例。更特定言之,在本發明、圖式及所附申請專利範圍之範疇內,所主張組合配置之零部件及/或配置的各種變化及修改為可能的。對於熟悉此項技術者而言,除了零部件及/或配置之變化及修改外,替代用途亦將顯而易見。While the invention has been described with respect to the embodiments of the embodiments of the present invention More particularly, various variations and modifications are possible in the component parts and/or arrangements of the claimed combinations. For those skilled in the art, alternative uses will be apparent in addition to variations and modifications in parts and/or configurations.
根據本發明實施例之顯示裝置可被使用於顯示器領域。A display device according to an embodiment of the present invention can be used in the field of displays.
10‧‧‧模框10‧‧‧Template
20‧‧‧背光組件20‧‧‧Backlight assembly
30‧‧‧液晶面板30‧‧‧LCD panel
100‧‧‧反射片100‧‧‧reflector
200‧‧‧導光板200‧‧‧Light guide plate
201‧‧‧插入孔201‧‧‧ insertion hole
202‧‧‧第一插入孔202‧‧‧First insertion hole
203‧‧‧第二插入孔203‧‧‧Second insertion hole
204‧‧‧間隔件204‧‧‧ spacers
210‧‧‧導光部210‧‧‧Light Guide
211‧‧‧入射表面211‧‧‧ incident surface
220‧‧‧後支撐部220‧‧‧Back support
230‧‧‧下部支撐部230‧‧‧lower support
240‧‧‧間隔件240‧‧‧ spacers
300‧‧‧發光二極體300‧‧‧Lighting diode
400‧‧‧波長轉換裝置400‧‧‧wavelength conversion device
401‧‧‧第一表面401‧‧‧ first surface
402‧‧‧第二表面402‧‧‧ second surface
403‧‧‧底面403‧‧‧ bottom
404‧‧‧頂面404‧‧‧ top surface
410‧‧‧管體410‧‧‧ tube body
420‧‧‧密封件420‧‧‧Seal
430‧‧‧波長轉換粒子430‧‧‧wavelength conversion particles
440‧‧‧基質440‧‧‧Material
450‧‧‧空氣層450‧‧‧ air layer
460‧‧‧黏著件460‧‧‧Adhesive parts
470‧‧‧填充件470‧‧‧Filling parts
471‧‧‧樹脂471‧‧‧Resin
500‧‧‧光學片500‧‧‧ optical film
600‧‧‧軟性印刷電路板600‧‧‧Soft printed circuit board
610‧‧‧雙面膠帶610‧‧‧Double-sided tape
圖1係根據本發明第一實施例,繪示有一LCD之一立體分解圖;圖2係繪示有沿圖1中A-A’線之一剖面圖;圖3係根據本發明第一實施例,繪示有一波長轉換裝置之一立體圖;圖4係繪示有沿圖3中B-B’線之一剖面圖;圖5、6係繪示有插入於一導光板之一發光二極體以及一波長轉換裝置;圖7係根據本發明第二實施例,繪示有一LCD之一剖面圖;圖8係根據本發明第二實施例,繪示有一波長轉換裝置之一立體圖;圖9係繪示有沿圖7中C-C’線之一剖面圖;圖10、11係根據本發明第三實施例,繪示有一LCD製造程序之剖面圖;圖12係根據本發明第四實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一立體圖; 圖13係根據本發明第四實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一剖面圖;圖14係根據本發明第五實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一剖面圖;圖15係根據本發明第六實施例,繪示有一LCD之一剖面圖;圖16係根據本發明第七實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一立體圖;以及圖17係根據本發明第七實施例,繪示有一光源、一導光板、以及一波長轉換裝置之一剖面圖。1 is an exploded perspective view of an LCD according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view taken along line AA' of FIG. 1; and FIG. 3 is a first embodiment of the present invention. For example, a perspective view of a wavelength conversion device is shown; FIG. 4 is a cross-sectional view taken along line BB' of FIG. 3; and FIGS. 5 and 6 are diagrams showing one of the light-emitting diodes inserted into a light guide plate. FIG. 7 is a cross-sectional view showing an LCD according to a second embodiment of the present invention; FIG. 8 is a perspective view showing a wavelength conversion device according to a second embodiment of the present invention; 1 is a cross-sectional view taken along line C-C' of FIG. 7; FIGS. 10 and 11 are cross-sectional views showing a manufacturing process of an LCD according to a third embodiment of the present invention; and FIG. 12 is a fourth embodiment of the present invention. For example, a perspective view of a light source, a light guide plate, and a wavelength conversion device is shown; FIG. 13 is a cross-sectional view showing a light source, a light guide plate, and a wavelength conversion device according to a fourth embodiment of the present invention; FIG. 14 is a view showing a light source and a light guide plate according to a fifth embodiment of the present invention; And a cross-sectional view of a wavelength conversion device; FIG. 15 is a cross-sectional view showing a LCD according to a sixth embodiment of the present invention; and FIG. 16 is a view showing a light source and a light guide plate according to a seventh embodiment of the present invention. And a perspective view of a wavelength conversion device; and FIG. 17 is a cross-sectional view showing a light source, a light guide plate, and a wavelength conversion device according to a seventh embodiment of the present invention.
10‧‧‧模框10‧‧‧Template
20‧‧‧背光單元20‧‧‧Backlight unit
30‧‧‧液晶面板30‧‧‧LCD panel
100‧‧‧反射片100‧‧‧reflector
200‧‧‧導光板200‧‧‧Light guide plate
300‧‧‧發光二極體300‧‧‧Lighting diode
400‧‧‧波長轉換裝置400‧‧‧wavelength conversion device
500‧‧‧光學片500‧‧‧ optical film
600‧‧‧軟性印刷電路板600‧‧‧Soft printed circuit board
Claims (11)
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KR101251738B1 (en) | 2011-03-22 | 2013-04-05 | 엘지이노텍 주식회사 | Dispaly device |
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KR101294415B1 (en) * | 2011-07-20 | 2013-08-08 | 엘지이노텍 주식회사 | Optical member and display device having the same |
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KR102110271B1 (en) * | 2014-02-05 | 2020-05-14 | 삼성디스플레이 주식회사 | Container of quantum dot bar and backlight unit comprising the same |
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US20160041327A1 (en) | 2016-02-11 |
WO2012128554A3 (en) | 2013-03-14 |
TW201248259A (en) | 2012-12-01 |
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CN107015304A (en) | 2017-08-04 |
US20160202406A1 (en) | 2016-07-14 |
WO2012128554A2 (en) | 2012-09-27 |
EP2689290A2 (en) | 2014-01-29 |
KR20120107795A (en) | 2012-10-04 |
CN107015304B (en) | 2020-02-14 |
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US9551822B2 (en) | 2017-01-24 |
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