TWI513856B - - Google Patents
Info
- Publication number
- TWI513856B TWI513856B TW103145589A TW103145589A TWI513856B TW I513856 B TWI513856 B TW I513856B TW 103145589 A TW103145589 A TW 103145589A TW 103145589 A TW103145589 A TW 103145589A TW I513856 B TWI513856 B TW I513856B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410557082.XA CN105590824B (zh) | 2014-10-20 | 2014-10-20 | 一种等离子体加工设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI513856B true TWI513856B (tr) | 2015-12-21 |
TW201615887A TW201615887A (zh) | 2016-05-01 |
Family
ID=55407859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103145589A TW201615887A (zh) | 2014-10-20 | 2014-12-25 | 電漿體加工設備 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105590824B (tr) |
TW (1) | TW201615887A (tr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI633572B (zh) * | 2015-12-31 | 2018-08-21 | 大陸商中微半導體設備(上海)有限公司 | Plasma processing device |
TWI820374B (zh) * | 2020-12-23 | 2023-11-01 | 台灣積體電路製造股份有限公司 | 感應耦合電漿設備及其操作方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102330098B1 (ko) * | 2017-04-24 | 2021-11-23 | 주성엔지니어링(주) | 기판 처리 장치 |
CN109994359B (zh) * | 2017-12-29 | 2022-11-18 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理腔室 |
CN108768335A (zh) * | 2018-05-25 | 2018-11-06 | 张琴 | 气密性声表面波元件封装结构及制作方法 |
CN110231063A (zh) * | 2019-05-30 | 2019-09-13 | 江阴市富仁高科股份有限公司 | 一种检测油气的气体流量计 |
CN113808898B (zh) * | 2020-06-16 | 2023-12-29 | 中微半导体设备(上海)股份有限公司 | 耐等离子体腐蚀零部件和反应装置及复合涂层形成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI292440B (tr) * | 2005-09-23 | 2008-01-11 | Atomic Energy Council | |
TWI319594B (en) * | 2004-10-12 | 2010-01-11 | Applied Materials Inc | Magnetic-field concentration in inductively coupled plasma reactors |
US20100109532A1 (en) * | 2006-07-12 | 2010-05-06 | Jacques Pelletier | Device and method for producing and/or confining a plasma |
TW201132783A (en) * | 2010-03-26 | 2011-10-01 | Univ Nat Sun Yat Sen | Magnetron sputtering apparatus |
EP1675139B1 (en) * | 2004-12-23 | 2014-07-23 | Lincoln Global, Inc. | High Frequency Transformer and Plasma Device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3077623B2 (ja) * | 1997-04-02 | 2000-08-14 | 日本電気株式会社 | プラズマ化学気相成長装置 |
CN1907514A (zh) * | 2005-03-22 | 2007-02-07 | 巨佰-雪莱公司 | 具有用于磁起动开关的窗口的磁屏蔽aimd外壳 |
US20110207332A1 (en) * | 2010-02-25 | 2011-08-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thin film coated process kits for semiconductor manufacturing tools |
CN202164352U (zh) * | 2011-06-10 | 2012-03-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种半导体加工设备 |
US20140262044A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Mu metal shield cover |
-
2014
- 2014-10-20 CN CN201410557082.XA patent/CN105590824B/zh active Active
- 2014-12-25 TW TW103145589A patent/TW201615887A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI319594B (en) * | 2004-10-12 | 2010-01-11 | Applied Materials Inc | Magnetic-field concentration in inductively coupled plasma reactors |
EP1675139B1 (en) * | 2004-12-23 | 2014-07-23 | Lincoln Global, Inc. | High Frequency Transformer and Plasma Device |
TWI292440B (tr) * | 2005-09-23 | 2008-01-11 | Atomic Energy Council | |
US20100109532A1 (en) * | 2006-07-12 | 2010-05-06 | Jacques Pelletier | Device and method for producing and/or confining a plasma |
TW201132783A (en) * | 2010-03-26 | 2011-10-01 | Univ Nat Sun Yat Sen | Magnetron sputtering apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI633572B (zh) * | 2015-12-31 | 2018-08-21 | 大陸商中微半導體設備(上海)有限公司 | Plasma processing device |
TWI820374B (zh) * | 2020-12-23 | 2023-11-01 | 台灣積體電路製造股份有限公司 | 感應耦合電漿設備及其操作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105590824B (zh) | 2017-11-03 |
CN105590824A (zh) | 2016-05-18 |
TW201615887A (zh) | 2016-05-01 |