TWI513544B - 具有孔洞之拋光墊 - Google Patents

具有孔洞之拋光墊 Download PDF

Info

Publication number
TWI513544B
TWI513544B TW101125451A TW101125451A TWI513544B TW I513544 B TWI513544 B TW I513544B TW 101125451 A TW101125451 A TW 101125451A TW 101125451 A TW101125451 A TW 101125451A TW I513544 B TWI513544 B TW I513544B
Authority
TW
Taiwan
Prior art keywords
polishing
hole
polishing pad
groove
side wall
Prior art date
Application number
TW101125451A
Other languages
English (en)
Chinese (zh)
Other versions
TW201313398A (zh
Inventor
William C Allison
Diane Scott
Rajeev Bajaj
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of TW201313398A publication Critical patent/TW201313398A/zh
Application granted granted Critical
Publication of TWI513544B publication Critical patent/TWI513544B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW101125451A 2011-07-15 2012-07-13 具有孔洞之拋光墊 TWI513544B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/184,395 US8920219B2 (en) 2011-07-15 2011-07-15 Polishing pad with alignment aperture

Publications (2)

Publication Number Publication Date
TW201313398A TW201313398A (zh) 2013-04-01
TWI513544B true TWI513544B (zh) 2015-12-21

Family

ID=46516885

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104129817A TWI586484B (zh) 2011-07-15 2012-07-13 拋光基板及製造拋光墊之方法
TW101125451A TWI513544B (zh) 2011-07-15 2012-07-13 具有孔洞之拋光墊

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW104129817A TWI586484B (zh) 2011-07-15 2012-07-13 拋光基板及製造拋光墊之方法

Country Status (5)

Country Link
US (2) US8920219B2 (ko)
KR (3) KR101576054B1 (ko)
CN (1) CN103796797B (ko)
TW (2) TWI586484B (ko)
WO (1) WO2013012608A2 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US10537973B2 (en) 2016-03-09 2020-01-21 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing
TWI629297B (zh) * 2016-07-05 2018-07-11 智勝科技股份有限公司 研磨層及其製造方法以及研磨方法
EP3571009A4 (en) * 2017-01-20 2021-01-20 Applied Materials, Inc. THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS
JP6985587B2 (ja) * 2017-03-30 2021-12-22 富士紡ホールディングス株式会社 研磨パッド
JP6989752B2 (ja) * 2017-03-30 2022-02-03 富士紡ホールディングス株式会社 研磨パッド
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10586708B2 (en) * 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
CN108655948B (zh) * 2018-07-06 2024-02-23 湖北鼎龙控股股份有限公司 抛光垫及研磨设备
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
US11298794B2 (en) * 2019-03-08 2022-04-12 Applied Materials, Inc. Chemical mechanical polishing using time share control
CN111834438B (zh) * 2019-04-18 2024-05-31 西部数据技术公司 半导体部件背侧上用于减轻堆叠封装中的分层的孔结构
KR102636521B1 (ko) * 2020-07-16 2024-02-15 한국생산기술연구원 다공성 돌출 패턴을 포함하는 화학-기계적 연마 패드 및 그 제조 방법
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN113414706A (zh) * 2021-06-26 2021-09-21 东莞市中微纳米科技有限公司 一种用于半导体超精细研磨专用垫
KR102623920B1 (ko) * 2021-07-27 2024-01-10 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN113547450B (zh) * 2021-09-22 2022-01-07 湖北鼎汇微电子材料有限公司 抛光垫、研磨设备及半导体器件的制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
TW550693B (en) * 2001-06-15 2003-09-01 Ebara Corp Polishing apparatus and polishing pad and method of manufacturing same
US20060068088A1 (en) * 2004-09-28 2006-03-30 Hae-Do Jeong Chemical mechanical polishing pad with micro-mold and production method thereof
TWI276504B (en) * 2003-09-19 2007-03-21 Cabot Microelectronics Corp Polishing pad with recessed window
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
TWI311512B (en) * 2005-04-25 2009-07-01 Cabot Microelectronics Corporatio Multi-layer polishing pad material for cmp
TWI321141B (en) * 2005-01-26 2010-03-01 Applied Materials Inc Multi-layer polishing pad for low-pressure polishing
TW201100196A (en) * 2009-04-30 2011-01-01 Applied Materials Inc Method of making and apparatus having windowless polishing pad and protected fiber

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
TW550693B (en) * 2001-06-15 2003-09-01 Ebara Corp Polishing apparatus and polishing pad and method of manufacturing same
TWI276504B (en) * 2003-09-19 2007-03-21 Cabot Microelectronics Corp Polishing pad with recessed window
US20060068088A1 (en) * 2004-09-28 2006-03-30 Hae-Do Jeong Chemical mechanical polishing pad with micro-mold and production method thereof
TWI321141B (en) * 2005-01-26 2010-03-01 Applied Materials Inc Multi-layer polishing pad for low-pressure polishing
TWI311512B (en) * 2005-04-25 2009-07-01 Cabot Microelectronics Corporatio Multi-layer polishing pad material for cmp
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
TW201100196A (en) * 2009-04-30 2011-01-01 Applied Materials Inc Method of making and apparatus having windowless polishing pad and protected fiber

Also Published As

Publication number Publication date
US20150079878A1 (en) 2015-03-19
KR101619100B1 (ko) 2016-05-10
KR20150092362A (ko) 2015-08-12
KR101744581B1 (ko) 2017-06-08
CN103796797B (zh) 2017-07-21
TW201313398A (zh) 2013-04-01
KR101576054B1 (ko) 2015-12-09
WO2013012608A3 (en) 2013-05-10
KR20140028140A (ko) 2014-03-07
CN103796797A (zh) 2014-05-14
TWI586484B (zh) 2017-06-11
WO2013012608A2 (en) 2013-01-24
KR20160056325A (ko) 2016-05-19
TW201545837A (zh) 2015-12-16
US20130017764A1 (en) 2013-01-17
US8920219B2 (en) 2014-12-30
US9597770B2 (en) 2017-03-21

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