TWI509252B - - Google Patents

Info

Publication number
TWI509252B
TWI509252B TW104101720A TW104101720A TWI509252B TW I509252 B TWI509252 B TW I509252B TW 104101720 A TW104101720 A TW 104101720A TW 104101720 A TW104101720 A TW 104101720A TW I509252 B TWI509252 B TW I509252B
Authority
TW
Taiwan
Application number
TW104101720A
Other versions
TW201530150A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW104101720A priority Critical patent/TW201530150A/zh
Publication of TW201530150A publication Critical patent/TW201530150A/zh
Application granted granted Critical
Publication of TWI509252B publication Critical patent/TWI509252B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW104101720A 2014-01-20 2015-01-19 應用於探針測試裝置的支撐結構及其製作方法 TW201530150A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104101720A TW201530150A (zh) 2014-01-20 2015-01-19 應用於探針測試裝置的支撐結構及其製作方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103102000 2014-01-20
TW104101720A TW201530150A (zh) 2014-01-20 2015-01-19 應用於探針測試裝置的支撐結構及其製作方法

Publications (2)

Publication Number Publication Date
TW201530150A TW201530150A (zh) 2015-08-01
TWI509252B true TWI509252B (zh) 2015-11-21

Family

ID=53545481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101720A TW201530150A (zh) 2014-01-20 2015-01-19 應用於探針測試裝置的支撐結構及其製作方法

Country Status (4)

Country Link
US (1) US9643271B2 (zh)
CN (1) CN104793026B (zh)
SG (1) SG10201500394QA (zh)
TW (1) TW201530150A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107664715A (zh) * 2016-07-27 2018-02-06 上海太阳能工程技术研究中心有限公司 电池片印刷银浆电阻测试方法
IT201700046645A1 (it) 2017-04-28 2018-10-28 Technoprobe Spa Scheda di misura per un’apparecchiatura di test di dispositivi elettronici
CN110531125B (zh) * 2018-05-23 2022-05-17 旺矽科技股份有限公司 空间转换器、探针卡及其制造方法
TWI679427B (zh) * 2018-10-01 2019-12-11 巨擘科技股份有限公司 探針卡裝置
JP7142604B2 (ja) * 2019-05-15 2022-09-27 日本特殊陶業株式会社 配線基板およびその製造方法
TWI712800B (zh) * 2019-05-31 2020-12-11 旺矽科技股份有限公司 探針卡及切換模組
TWI750552B (zh) * 2019-12-16 2021-12-21 旺矽科技股份有限公司 可定位之探針卡及其製作方法
CN111366839B (zh) * 2020-03-28 2022-04-12 深圳中科系统集成技术有限公司 一种晶圆测试用探针转接板及其制作方法
TWI798027B (zh) * 2022-03-14 2023-04-01 巨擘科技股份有限公司 探針卡裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200409582A (en) * 2002-06-24 2004-06-01 Nanonexus Inc Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US20080142946A1 (en) * 2006-12-13 2008-06-19 Advanced Chip Engineering Technology Inc. Wafer level package with good cte performance
US20080237828A1 (en) * 2007-03-30 2008-10-02 Advanced Chip Engineering Technology Inc. Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for wlp and method of the same
TW200908249A (en) * 2007-03-08 2009-02-16 Advanced Chip Eng Tech Inc Structure of semiconductor device package and the method of the same
TW201323884A (zh) * 2011-12-08 2013-06-16 Mpi Corp 探針測試裝置與使用在其中之緩衝塊的製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69410168T2 (de) * 1993-06-24 1998-11-05 Toshiba Kawasaki Shi Kk Elektronische Schaltungsanordnung
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6570396B1 (en) * 2000-11-24 2003-05-27 Kulicke & Soffa Investment, Inc. Interface structure for contacting probe beams
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
EP1959260B1 (en) * 2005-12-05 2019-05-29 NHK Spring Company Limited Probe card
KR101551898B1 (ko) * 2007-10-05 2015-09-09 신꼬오덴기 고교 가부시키가이샤 배선 기판, 반도체 장치 및 이들의 제조 방법
US7688089B2 (en) * 2008-01-25 2010-03-30 International Business Machines Corporation Compliant membrane thin film interposer probe for intergrated circuit device testing
CN102914673B (zh) * 2011-08-03 2015-09-30 旺矽科技股份有限公司 探针测试装置
TWI431282B (zh) 2011-08-03 2014-03-21 Mpi Corp 探針測試裝置
TWM442506U (en) 2012-07-17 2012-12-01 Mpi Corp Probe testing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200409582A (en) * 2002-06-24 2004-06-01 Nanonexus Inc Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US20080142946A1 (en) * 2006-12-13 2008-06-19 Advanced Chip Engineering Technology Inc. Wafer level package with good cte performance
TW200908249A (en) * 2007-03-08 2009-02-16 Advanced Chip Eng Tech Inc Structure of semiconductor device package and the method of the same
US20080237828A1 (en) * 2007-03-30 2008-10-02 Advanced Chip Engineering Technology Inc. Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for wlp and method of the same
TW201323884A (zh) * 2011-12-08 2013-06-16 Mpi Corp 探針測試裝置與使用在其中之緩衝塊的製造方法

Also Published As

Publication number Publication date
CN104793026B (zh) 2018-09-28
SG10201500394QA (en) 2015-08-28
US20150206850A1 (en) 2015-07-23
CN104793026A (zh) 2015-07-22
TW201530150A (zh) 2015-08-01
US9643271B2 (en) 2017-05-09

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