TWI508650B - Heat sink - Google Patents
Heat sink Download PDFInfo
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- TWI508650B TWI508650B TW100130413A TW100130413A TWI508650B TW I508650 B TWI508650 B TW I508650B TW 100130413 A TW100130413 A TW 100130413A TW 100130413 A TW100130413 A TW 100130413A TW I508650 B TWI508650 B TW I508650B
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- Prior art keywords
- heat sink
- flap
- upper flap
- fin
- heat
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明涉及一種散熱裝置,特別是一種具有除塵結構的散熱裝置。 The invention relates to a heat dissipating device, in particular to a heat dissipating device having a dust removing structure.
近年來隨著電子產業的發展,電子元件的性能不斷提升,產生的熱量也越來越多,因此必須對電子元件進行散熱。傳統的散熱裝置散熱時,散熱風扇會從空氣中吸入毛屑及粉塵吹向散熱片組。隨著散熱裝置的長期使用,毛屑及粉塵會堆積在散熱片組上,導致風扇無法將風吹進散熱片組內,影響散熱裝置的散熱效能。 In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, and the amount of heat generated has also increased. Therefore, it is necessary to dissipate heat from electronic components. When the conventional heat sink dissipates heat, the heat sink fan draws dust and dust from the air to the heat sink group. With the long-term use of the heat sink, the dust and dust will accumulate on the heat sink group, causing the fan to blow the wind into the heat sink group, which affects the heat dissipation performance of the heat sink.
因此,有必要提供一種能有效防止散熱片組積塵的散熱裝置。 Therefore, it is necessary to provide a heat sink that can effectively prevent dust from collecting from the heat sink.
一種散熱裝置,包括散熱片組、風扇以及固定散熱片組與風扇的外殼,散熱片組由相隔設置的第一散熱片和第二散熱片交替組成,相鄰的第一散熱片與第二散熱片之間形成氣流通道,散熱片組包括一入風口,風扇轉動產生的氣流由散熱片組的入風口吹入散熱片組內,其中,第二散熱片在靠近入風口的位置處開設有開槽,開槽開口朝向入風口,相鄰的氣流通道在入風口處通過開槽連通從而增加孔徑。 A heat dissipating device includes a heat sink group, a fan, and a casing for fixing the heat sink group and the fan, wherein the heat sink group is composed of a first heat sink and a second heat sink which are alternately arranged, and the adjacent first heat sink and the second heat sink An air flow passage is formed between the sheets, and the heat sink group includes an air inlet. The airflow generated by the rotation of the fan is blown into the heat sink group by the air inlet of the heat sink group, wherein the second heat sink is opened at a position close to the air inlet. The slot, the slotted opening faces the air inlet, and the adjacent airflow passage communicates through the slot at the air inlet to increase the aperture.
由於入風口處的氣流通道孔徑得到拓寬,則當氣流攜帶毛屑及粉塵吹向散熱片組時,不會產生阻擋,毛屑和粉塵可順利進入散熱 片組內並可沿著氣流在散熱片組內的流動並流出散熱片組。開槽還有助於毛屑和粉塵更容易地流出散熱片組。 Since the airflow passage aperture at the air inlet is widened, when the airflow carries the dust and dust to the heat sink group, no blockage occurs, and the dust and dust can smoothly enter the heat dissipation. The sheet group can flow along the airflow within the heat sink group and out of the heat sink group. Slotting also helps the dander and dust to flow out of the heat sink set more easily.
10‧‧‧散熱裝置 10‧‧‧heating device
20‧‧‧散熱片組 20‧‧‧ Heat sink set
201‧‧‧入風口 201‧‧‧Air inlet
202‧‧‧凹槽 202‧‧‧ Groove
21‧‧‧第一散熱片 21‧‧‧First heat sink
210、220‧‧‧本體 210, 220‧‧‧ ontology
211、221‧‧‧下折板 211, 221‧‧‧ lower folding board
212、222‧‧‧上折板 212, 222‧‧‧Upper folding board
2123‧‧‧第三上折板 2123‧‧‧ third upper folding board
2122、2222‧‧‧第二上折板 2122, 2222‧‧‧ second upper folding board
2121、2221‧‧‧第一上折板 2121, 2221‧‧‧ first upper folding board
22‧‧‧第二散熱片 22‧‧‧second heat sink
2201‧‧‧開槽 2201‧‧‧ slotting
2202‧‧‧鉤狀槽 2202‧‧‧ hook groove
30‧‧‧熱管 30‧‧‧heat pipe
40‧‧‧風扇 40‧‧‧Fan
50‧‧‧外殼 50‧‧‧ Shell
501‧‧‧底板 501‧‧‧floor
502‧‧‧側板 502‧‧‧ side panels
51‧‧‧螺孔 51‧‧‧ screw holes
52‧‧‧固定部 52‧‧‧Fixed Department
53‧‧‧卡扣 53‧‧‧ buckle
54‧‧‧扣板 54‧‧‧ 扣板
圖1示出了本發明散熱裝置的立體圖。 Figure 1 shows a perspective view of a heat sink of the present invention.
圖2示出了圖1散熱裝置的散熱片組的放大圖。 2 is an enlarged view of a heat sink group of the heat sink of FIG. 1.
圖3示出了圖2散熱片組的部分拆解圖。 Figure 3 is a partial exploded view of the heat sink assembly of Figure 2.
圖4示出了圖2散熱片組其中一片散熱片的放大圖。 Figure 4 is an enlarged view of one of the fins of the heat sink group of Figure 2.
圖5示出了圖2散熱片組另外一片散熱片的放大圖。 Fig. 5 is an enlarged view showing another heat sink of the heat sink group of Fig. 2.
請參閱圖1,示出了本發明的散熱裝置10的立體圖,其包括一散熱片組20、若干熱管30、一風扇40以及固定散熱片組20與風扇40的外殼50。熱管30的冷凝段搭載在散熱片組20上。散熱片組20靠近風扇40的一側有一入風口201。外殼50包括一底板501、一側邊502以及一頂板(圖未示),底板501與側邊502為一體成型或焊接在一起。風扇40安裝在外殼50內。外殼50大致呈一圓弧並外擴形。風扇40安裝在外殼50的圓弧部分,外殼50的圓弧的半徑比風扇40的半徑大。外殼圓弧的前端向散熱片組20的最前一片散熱片處延伸,外殼圓弧的後端向散熱片組20的最後一片散熱片處延伸。外殼50朝向散熱片組20的開口剛好與入風口201匹配。底板501與散熱片組20的底面連接,側邊502的兩端分別與散熱片組20的最前面一片以及最後面一片散熱片相連,使散熱片組20與外殼50固定成一體。風扇40固定在底板501上,風扇40產生的風從入風口201吹入散熱片組20內部。側邊502上包含若干螺孔51用以將頂 板(圖未示)固定在側邊502上。側邊502還包含若干固定部52、卡扣53、及扣板54,用以將散熱裝置10與其他部件扣合。風扇40通電後轉動產生風,由於外殼50只留有面向散熱片組20的開口,所以風扇40產生的風均由入風口201吹入散熱片組20內。 Referring to FIG. 1, a perspective view of a heat sink 10 of the present invention is shown, including a heat sink assembly 20, a plurality of heat pipes 30, a fan 40, and a housing 50 for securing the heat sink assembly 20 and the fan 40. The condensation section of the heat pipe 30 is mounted on the fin group 20. The side of the heat sink set 20 adjacent to the fan 40 has an air inlet 201. The outer casing 50 includes a bottom plate 501, a side edge 502, and a top plate (not shown). The bottom plate 501 and the side edges 502 are integrally formed or welded together. The fan 40 is mounted within the outer casing 50. The outer casing 50 has a substantially circular arc and is flared. The fan 40 is mounted on a circular arc portion of the outer casing 50, and the radius of the circular arc of the outer casing 50 is larger than the radius of the fan 40. The front end of the outer arc of the casing extends toward the foremost fin of the fin group 20, and the rear end of the arc of the outer casing extends toward the last fin of the fin group 20. The opening of the outer casing 50 toward the fin group 20 just matches the air inlet 201. The bottom plate 501 is connected to the bottom surface of the heat sink group 20, and the two ends of the side edge 502 are respectively connected to the frontmost one and the last heat sink of the heat sink group 20, so that the heat sink group 20 and the outer casing 50 are integrally fixed. The fan 40 is fixed to the bottom plate 501, and the wind generated by the fan 40 is blown into the inside of the fin group 20 from the air inlet 201. The side 502 includes a plurality of screw holes 51 for the top A plate (not shown) is secured to the side 502. The side 502 further includes a plurality of fixing portions 52, a buckle 53, and a gusset 54 for engaging the heat sink 10 with other components. When the fan 40 is energized and rotated, wind is generated. Since the outer casing 50 only has an opening facing the fin group 20, the wind generated by the fan 40 is blown into the fin group 20 by the air inlet 201.
請再參閱圖2-3,示出了圖1散熱裝置10的散熱片組20的放大圖及部分拆解圖。散熱片組20由多片第一散熱片21及多片第二散熱片22相隔排列而成。散熱片組20頂面形成一凹槽202,熱管30的冷凝段搭載在凹槽202內。在本實施例中,散熱裝置10包含三根熱管30。凹槽202的寬度比所述三根熱管30的總寬度大。第一散熱片21和第二散熱片22均為金屬鈑金沖件,二者相隔緊挨扣合成散熱片組20。 Referring again to FIGS. 2-3, an enlarged view and a partially disassembled view of the heat sink assembly 20 of the heat sink 10 of FIG. 1 are illustrated. The heat sink group 20 is formed by arranging a plurality of first heat sinks 21 and a plurality of second heat sinks 22 apart. A groove 202 is formed on the top surface of the heat sink group 20, and the condensation section of the heat pipe 30 is mounted in the groove 202. In the present embodiment, the heat sink 10 includes three heat pipes 30. The width of the groove 202 is larger than the total width of the three heat pipes 30. The first heat sink 21 and the second heat sink 22 are both metal sheet metal stampings, and the two are fastened together to form the heat sink group 20 .
請再參閱圖4,示出了圖2散熱片組20的第一散熱片21的放大圖。第一散熱片21包括一本體210、一遠離所述頂面的下折板211和一靠近所述頂面的上折板212。在本實施例中,本體210厚度為0.2mm,下折板211寬度為1.2mm。本體210左側邊為一由上至下向遠離右側邊的方向延伸的斜邊,其在靠近下邊界處形成一圓角(圖未標)。本體210的右邊界垂直下邊界,上邊界呈一中間凹陷的曲線狀,對應散熱片組20的凹槽202。下折板211從本體210的下邊界垂直本體210水平延伸。上折板212由左至右分成第一上折板2121、第二上折板2122以及第三上折板2123三段。第一上折板2121、第二上折板2122以及第三上折板2123均垂直本體210延伸,第一上折板2121和第二上折板2122的寬度等於下折板211的寬度,第三上折板2123的寬度等於下折板211的寬度的兩倍。第一上折板2121與下折板211平行,比第二上折板2122及第三上折板 2123略高。第二上折板2122位於本體210的上邊界的凹陷處,沿著凹陷的形狀垂直本體210延伸。第二上折板2122靠近第一上折板2121左端以一圓角平滑向上延伸,其靠近第一上折板2121的右端,但二者不接觸,即第二上折板2122的左端比第一上折板2121略矮。第二上折板2122中部及右端沿著本體210的凹陷處水平延伸。第二上折板2122右端連接第三上折板2123。第三上折板2123左端與第二上折板2122水平連接,其中部及右端往右邊界斜向上延伸。第三上折板2123的右端與第一上折板2121高度相等,即上折板212的左右兩端在同一高度,中間凹陷。第一散熱片21整體呈一中部位置往下凹陷,右端開口放大的形狀。 Referring to FIG. 4 again, an enlarged view of the first heat sink 21 of the heat sink group 20 of FIG. 2 is shown. The first heat sink 21 includes a body 210, a lower flap 211 away from the top surface, and an upper flap 212 adjacent to the top surface. In the present embodiment, the body 210 has a thickness of 0.2 mm and the lower flap 211 has a width of 1.2 mm. The left side of the body 210 is a bevel extending from a top to a bottom away from the right side, and a rounded corner is formed near the lower boundary (not shown). The right boundary of the body 210 is perpendicular to the lower boundary, and the upper boundary has a curved shape with an intermediate depression corresponding to the groove 202 of the heat sink group 20. The lower flap 211 extends horizontally from the lower boundary of the body 210 to the vertical body 210. The upper folding plate 212 is divided into a first upper folding plate 2121, a second upper folding plate 2122, and a third upper folding plate 2123 from left to right. The first upper folding plate 2121, the second upper folding plate 2122, and the third upper folding plate 2123 all extend perpendicular to the body 210. The width of the first upper folding plate 2121 and the second upper folding plate 2122 is equal to the width of the lower folding plate 211. The width of the upper upper flap 2123 is equal to twice the width of the lower flap 211. The first upper flap 2121 is parallel to the lower flap 211, than the second upper flap 2122 and the third upper flap 2123 is slightly higher. The second upper flap 2122 is located at a recess of the upper boundary of the body 210 and extends perpendicular to the body 210 along the shape of the recess. The second upper folding plate 2122 is adjacent to the left end of the first upper folding plate 2121 and extends smoothly upwardly with a rounded corner. The second upper folding plate 2122 is adjacent to the right end of the first upper folding plate 2121, but the two are not in contact with each other, that is, the left end of the second upper folding plate 2122 is smaller than the first end. The upper flap 2121 is slightly shorter. The middle and right ends of the second upper flap 2122 extend horizontally along the recess of the body 210. The right upper end of the second upper folding plate 2122 is connected to the third upper folding plate 2123. The left end of the third upper folding plate 2123 is horizontally connected to the second upper folding plate 2122, and the middle portion and the right end thereof extend obliquely upward to the right boundary. The right end of the third upper folding plate 2123 is equal to the height of the first upper folding plate 2121, that is, the left and right ends of the upper folding plate 212 are at the same height, and are recessed in the middle. The first fin 21 is entirely recessed in a central position, and the right end is enlarged in shape.
請再參閱圖5,示出了圖2散熱片組20的第二散熱片22的放大圖。第二散熱片22包括一本體220,一遠離所述頂面的下折板221以及一靠近所述頂面的上折板222。本體220厚度為0.2mm,下折板221及上折板222寬度均1.2mm。本體220左端形狀與第一散熱片21的本體210一樣,左側邊也是一由上至下向遠離右側邊的方向延伸的斜邊。第二散熱片22的下折板221與第一散熱片21的下折板211形狀結構相同。相對比於第一散熱片21的上折板212,第二散熱片22的上折板222只包括第一上折板2221和第二上折板2222,且形狀結構相同。本體220開有一開口向右的開槽2201。開槽2201的側面呈一鑰匙形狀。開槽2201的開口向右擴大並終止於上折板222及下折板221。第二散熱片22的本體220的開槽2201開口的上端終止於對應第一散熱片21的第二上折板2122與第三上折板2123連接的位置處。開槽2201開口的下端於下邊界221的終止位置相比其上端的終止位置更靠右。開槽2201裏面有一凸向下折板221的鉤狀槽2202。 Referring again to FIG. 5, an enlarged view of the second heat sink 22 of the heat sink assembly 20 of FIG. 2 is shown. The second heat sink 22 includes a body 220, a lower flap 221 away from the top surface, and an upper flap 222 adjacent the top surface. The body 220 has a thickness of 0.2 mm, and the lower flap 221 and the upper flap 222 have a width of 1.2 mm. The left end of the body 220 has the same shape as the body 210 of the first fin 21, and the left side is also a bevel extending from the top to the bottom in a direction away from the right side. The lower flap 221 of the second fin 22 has the same shape as the lower flap 211 of the first fin 21. The upper flap 222 of the second fin 22 includes only the first upper flap 2221 and the second upper flap 2222, and has the same shape and structure, as compared with the upper flap 212 of the first fin 21 . The body 220 has a slot 2201 opening to the right. The side of the slot 2201 has a key shape. The opening of the slot 2201 is enlarged to the right and terminates at the upper flap 222 and the lower flap 221 . The upper end of the opening of the slot 2201 of the body 220 of the second heat sink 22 terminates at a position where the second upper flap 2122 of the first heat sink 21 is connected to the third upper flap 2123. The lower end of the opening of the slot 2201 is at the right end of the lower boundary 221 to the right of the upper end. The slot 2201 has a hook-shaped slot 2202 protruding downwardly from the flap 221.
第一散熱片21與第二散熱片22組合時,第一散熱片21位於第二散熱片22的後面,即上折板221與下折板222彎折延伸的反方向。每一第一散熱片21與相鄰的第二散熱片22之間形成一寬度為1.0mm的氣流通道。由於第一散熱片21的第三上折板2123延伸的寬度為下折板211寬度的兩倍,所以組合後的第二散熱片22的第二上折板2222剛好卡入第一散熱片21的第三上折板2123的左端部,共同形成凹槽202。第一散熱片21與第二散熱片22相隔扣合成散熱片組20。散熱片組20內每片散熱片的間距為1.0mm,由於開槽2201的開口向右擴大至上下折板222、221處,因此散熱片組20入風口201位置處相鄰的氣流通道連通而使總寬度增加到2.2mm。由於入風口201的氣流通道的孔徑較大,則當氣流帶動毛屑和粉塵經過散熱片組20的入風口201時,不會產生阻擋,毛屑和粉塵可順利進入散熱片組20內並可沿著氣流在散熱片組20內的流動並流出散熱片組20。開槽2201有助於毛屑和粉塵更容易地流出散熱片組20。 When the first heat sink 21 is combined with the second heat sink 22, the first heat sink 21 is located behind the second heat sink 22, that is, the opposite direction in which the upper flap 221 and the lower flap 222 are bent and extended. An air flow passage having a width of 1.0 mm is formed between each of the first fins 21 and the adjacent second fins 22. Since the width of the third upper flap 2123 of the first fin 21 extends twice the width of the lower flap 211, the second upper flap 2222 of the combined second fin 22 just snaps into the first fin 21 The left end portion of the third upper flap 2123 collectively forms a groove 202. The first heat sink 21 and the second heat sink 22 are separated from each other to form a heat sink group 20 . The distance between each fin of the heat sink group 20 is 1.0 mm. Since the opening of the slot 2201 is expanded to the right to the upper and lower flaps 222 and 221, the adjacent airflow passages at the position of the air inlet 201 of the heat sink group 20 are connected. Increase the total width to 2.2mm. Since the airflow passage of the air inlet 201 has a large aperture, when the airflow drives the dust and dust through the air inlet 201 of the heat sink group 20, no blocking occurs, and the dust and dust can smoothly enter the heat sink group 20 and The flow in the fin group 20 along the airflow flows out of the fin group 20. The slot 2201 helps the dander and dust to flow out of the heat sink set 20 more easily.
由於風扇40產生的氣流帶來的毛屑和粉塵能順利地進入且流出散熱片組20,所以此種設計的散熱片組20不會造成毛屑和粉塵在入風口201的堆積,散熱裝置10的散熱性能得到有效維持。 Since the dust and dust generated by the airflow generated by the fan 40 can smoothly enter and flow out of the heat sink group 20, the heat sink group 20 of such design does not cause the accumulation of dust and dust at the air inlet 201, and the heat sink 10 The heat dissipation performance is effectively maintained.
201‧‧‧入風口 201‧‧‧Air inlet
202‧‧‧凹槽 202‧‧‧ Groove
21‧‧‧第一散熱片 21‧‧‧First heat sink
22‧‧‧第二散熱片 22‧‧‧second heat sink
Claims (9)
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CN201110241379.1A CN102958320B (en) | 2011-08-22 | 2011-08-22 | Heat abstractor |
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TW201311125A TW201311125A (en) | 2013-03-01 |
TWI508650B true TWI508650B (en) | 2015-11-11 |
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TW100130413A TWI508650B (en) | 2011-08-22 | 2011-08-25 | Heat sink |
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US (1) | US20130048255A1 (en) |
CN (1) | CN102958320B (en) |
TW (1) | TWI508650B (en) |
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TWI643547B (en) * | 2017-11-17 | 2018-12-01 | 神基科技股份有限公司 | Heat dissipation device |
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SG11201401659TA (en) * | 2011-11-02 | 2014-05-29 | Univ Singapore | A heat sink assembly apparatus |
CN105090102B (en) * | 2014-04-28 | 2018-03-13 | 富瑞精密组件(昆山)有限公司 | Fan |
US20160123637A1 (en) * | 2014-10-29 | 2016-05-05 | Alliance For Sustainable Energy, Llc | Two-phase heat exchanger for cooling electrical components |
CN109874264A (en) * | 2017-12-01 | 2019-06-11 | 神讯电脑(昆山)有限公司 | Radiator |
CN114505411B (en) * | 2022-01-21 | 2024-07-09 | 东莞汉旭五金塑胶科技有限公司 | Tightly-matched riveting structure and riveting method for heat conduction pipe and radiating fin group in series |
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CN102958320A (en) | 2013-03-06 |
CN102958320B (en) | 2017-09-08 |
US20130048255A1 (en) | 2013-02-28 |
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