TWI508333B - Led frame structure and led unit having the same - Google Patents

Description

Light-emitting diode support structure and light-emitting diode unit thereof

The invention relates to a stent structure, in particular to a light-emitting diode support structure and a light-emitting diode unit thereof.

Light-emitting diodes (LEDs) have many advantages such as power saving, fast response, and mass production. Therefore, the current lighting equipment using light-emitting diodes as a light source continues to be researched and developed, and its market is positive. Continue to flourish.

A commercially available light-emitting diode product has a main structure in which a light-emitting diode element is fixed on a wire holder, and the light-emitting diode element and the wire holder are covered by a package case. However, the wire holders are mostly made of metal, and the package housings are mostly made of plastic. If the combination of the two is insufficient, the package housing may fall off from the wire holder, especially when the product is affected by high temperature environment or other external force. There may be a gap between the wire holder and the wire holder, which may cause external moisture to penetrate into the package case, causing the LED to be damaged, resulting in a yield or reliability problem; as shown in FIG. The light-emitting diode product of 20', wherein the wire holder 12' is covered by the package housing 11'; and FIG. 1A shows that after the high-temperature process of the light-emitting diode product, the two materials are due to thermal stress. The effect of the gap G between the wire holder 12' and the package housing 11' which are originally attached to each other causes a problem of insufficient product reliability.

The main object of the present invention is to provide a light-emitting diode support structure and a light-emitting diode unit thereof, which can utilize the bottom width structure design of the lead frame to limit the degree of heat extension of the lead frame, thereby improving the metal lead frame and the package. The bonding strength between the plastics can avoid gaps in the structure of the bracket to improve the reliability and stability of the product structure.

The invention provides a light emitting diode support structure, comprising: a package housing; at least one lead frame, the lead frame is wrapped in the package housing, wherein the lead frame comprises at least a buried section, and a The buried section extends the formed pin section, the bottom surface of the pin section is exposed on the bottom surface of the package housing, and the bottom surface of the pin section has a first end portion and a portion exposed to the package housing The two ends have a width that is less than a width of the first end.

The invention further provides a light emitting diode unit, a package housing; a light emitting diode support structure wrapped in the package housing, having at least two lead frames and a wafer carrying lead frame, each wire The shelf includes at least a buried section and a pin section extending from the embedded section, the bottom surface of the leg section being exposed on a bottom surface of the package housing, the bottom surface of the pin section having a first end portion and a second end portion having a width smaller than a width of the first end portion; at least one light emitting diode disposed on the wafer carrying lead frame, the light emitting diode system being electrically connected to the second end portion The buried section of the two lead frames.

Therefore, by changing the width of the pin segments exposed on the bottom surface of the package housing, the package housing and the lead frame can form a mutual blocking manner in the deformation direction, thereby preventing the LED unit from being heated. The deformation caused by the external force causes a gap between the two.

The invention provides a light-emitting diode support structure and a light-emitting diode unit thereof, which can effectively increase the bonding strength between the lead frame and the package housing, and avoid gaps between the two due to process or other factors.

2, FIG. 2A and FIG. 4, FIG. 2 is a side view showing a structure of a light-emitting diode support according to a specific embodiment of the present invention, and FIG. 2A is a bottom view showing a structure of a light-emitting diode support according to a specific embodiment of the present invention. The light-emitting diode support structure of the present invention is composed of at least a package housing 11 and at least one lead frame 12, in particular, the lead frame 12 is wrapped in the package housing 11, and the lead frame 12 is at least The bottom portion 1221 of the pin segment 122 is exposed on the bottom surface 112 of the package housing 11 and the bottom surface 1221 of the pin segment 122 has a first portion. The one end portion 1221A and a portion are protruded and exposed to the second end portion 1221B of the package housing 11, and the width of the second end portion 1221B is smaller than the width of the first end portion 1221A (ie, D1>D2), thereby 2A, the step structure formed by the width of the first end portion 1221A and the second end portion 1221B can resist the deformation force caused by factors such as high temperature or external force of the package housing 11 and the lead frame 12.

In the present embodiment, the present invention provides a down-set light-emitting diode support structure, but not limited thereto, wherein the package housing 11 can be a plastic such as thermoplastic or thermoset. Plastics, for example, in the process of molding the package casing 11 by thermoplastic molding, the main component may be poly(p-phenylene terephthalamide) (PPA) or Polyamide (PA) and other thermoplastics, but not limited to this.

As shown in FIG. 2A, the LED housing structure can include four lead frames 12 and a wafer carrying lead frame 13, and the lead frame 12 and the wafer carrying lead frame 13 can be substantially encapsulated by the package 11. Covering, in a specific process, the lead frame 12 can be correspondingly disposed around the wafer carrying lead frame 13, and the pin segments 122 of the lead frame 12 are disposed away from the wafer carrying lead frame 13, and the lead frame 12 and the wafer carrying lead frame 13 is placed in a mold, and then the aforementioned plastic is injected into the mold to cover the combination of the lead frame 12 and the wafer carrying lead frame 13 to form the package housing 11 and to make each lead frame 12 The pin segments 122 expose the sides of the package housing 11, in other words, the pin segments 122 of each lead frame 12 partially protrude from the package housing 11.

Each lead frame 12 is a bent metal piece. For example, the embedded section 121 can be formed by extending the pin section 122 by two bending. Specifically, the lead frame 12 can include the embedded section 121. The connecting section 123 which is bent obliquely by the embedded section 121 and the pin section 122 which is bent and formed by the connecting section 123; and the wafer carrying lead frame 13 may include the carrying portion 131 and the side portion 132, as shown in the figure, The side portions 132 are located on both sides of the carrying portion 131 and are formed by obliquely extending upward from the carrying portion 131. Therefore, the wafer carrying lead frame 13 can substantially form a reflective cup-like structure.

In addition, the top surface of the pin segment 122 has at least one groove 1222. For example, the pin segment 122 is provided with two V-shaped grooves 1222 on the top surface of the bottom surface 1221, and the plastic of the package housing 11 can be filled. The V-shaped groove 1222 is inserted into the V-shaped groove 1222, so that when the external moisture is invaded by the interface formed by the pin segment 122 of the package housing 11 and the package housing 11, the packaged housing 11 can be covered. V-shaped groove 12 The structure formed by 22 extends the path of water vapor intrusion, so it can effectively slow the intrusion of water vapor and avoid the influence of water vapor on the light-emitting element 10 (such as the light-emitting diode).

After the package housing 11 is covered with the lead frame 12 and the wafer carrying lead frame 13 and solidified, the bottom surface 112 of the package housing 11, the bottom surface 1221 of the pin segment 122 of the lead frame 12 and the wafer carrying lead frame 13 The bottom surface 1311 of the carrying portion 131 is substantially in the same plane, whereby the bottom surface 1221 of the pin segment 122 and the bottom surface 1311 of the carrying portion 131 are exposed on the bottom surface 112 of the package housing 11 for subsequent electrical connection process. As described above, the bottom surface 1221 of the exposed pin segment 122 can substantially define the first end portion 1221A and the second end portion 1221B, and the second end portion 1221B can be defined as an end that protrudes from the side of the package housing 11. The first end portion 1221A can be defined as being close to one end of the carrying portion 131 (ie, an end near the inner side of the package housing 11) by using a step structure formed by the width of the first end portion 1221A and the second end portion 1221B. The gap between different materials (metal lead frame 12 and plastic wafer carrying lead frame 13) can be avoided. For example, when the light-emitting diode support structure of the present invention enters a high-temperature process, since the amount of thermal deformation of the lead frame 12 and the package housing 11 is different, stress is generated between the lead frame 12 and the package housing 11, such as a lead frame. The heat is extended and deformed in a direction away from the package housing 11 (arrow S as shown in FIG. 2B). However, the present invention can utilize the wider first end portion 1221A to be blocked by the package housing 11 to restrict deformation. To the extent that, in other words, the package housing 11 can be filled with a stepped structure formed by the first end portion 1221A and the second end portion 1221B to form a stopper portion 113, the stopper portion 113 is in phase with the above-described stepped structure In cooperation, a blocking force (arrow F as shown in FIG. 2B) can be provided to resist the extension force formed by the lead frame 12 being heated.

Furthermore, the package housing 11 has a recessed area 111 corresponding to the wafer carrying lead frame 13. For example, the recessed area 111 of the package housing 11 corresponds to the carrying portion 131 of the wafer carrying lead frame 13 to form a light-emitting efficiency. Structure.

Accordingly, the LED array structure of the present invention can utilize a difference in width between the bottom surface 1221 of the pin segment 122 exposed on the bottom surface 112 of the package housing 11 to make the wider first end portion 1221A and the narrower portion. The stepped structure formed by the second end portion 1221B exerts a resisting force with the package housing 11 to limit the amount of deformation of the lead frame 12 and the package housing 11 to thereby avoid a gap between the two due to an external force or a thermal effect.

The present invention further provides a light emitting diode unit having the above-described light emitting diode support structure. For example, the light emitting diode support structure has at least two lead frames 12 and a wafer carrying lead frame covered by the package housing 11. 13. The at least one light-emitting element 10 (such as a light-emitting diode) is disposed on the wafer-carrying lead frame 13 and the light-emitting element 10 is electrically connected to the buried portion 121 of the lead frame 12.

Referring to FIG. 3, a cross-sectional view of a light emitting diode unit is shown. As shown, the light emitting element 10, such as a light emitting diode system, is fixed to the carrying portion of the wafer carrying lead frame 13 by die attaching. On the 131, the positive and negative poles of the LED are electrically connected to the buried section 121 of the lead frame 12 on both sides by a wire bonding method, and are filled into the recessed area 111 of the package housing 11 by using the transparent colloid 14 to Covering the light-emitting element 10, the wafer-carrying lead frame 13 and the buried section 121 of the lead frame 12; further, the completed combination can be electrically connected by using the bonding pad 21 or the like The connection structure is connected to a substrate 20, and more specifically, the pad 21 is disposed on the bottom surface 1221 of the pin segment 122 and the bottom surface 1311 of the carrier portion 131, so that the control signal, the power supply, and the like can be used by the substrate by the bonding pad 21. 20 is transmitted to the light emitting diode unit of the present invention.

Similarly, by the structural design of the wider first end portion 1221A and the narrower second end portion 1221B of the pin segment 122, when the light emitting diode unit enters a high temperature process such as a reflow oven, the pin segment 122 The amount of heat extension is limited by the above structure, so that the problem of the gap between the lead frame 12 and the package housing 11 can be avoided.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.

[Practical]

11'‧‧‧Package housing

12'‧‧‧Wire bracket

20'‧‧‧ substrate

G‧‧‧ gap

【this invention】

10‧‧‧Lighting elements

11‧‧‧Package housing

111‧‧‧ recessed area

112‧‧‧ bottom

113‧‧‧stops

12‧‧‧ lead frame

121‧‧‧ buried section

122‧‧‧ pin section

1221‧‧‧ bottom

1221A‧‧‧ first end

1221B‧‧‧second end

1222‧‧‧ trench

123‧‧‧Connection section

13‧‧‧ wafer carrying lead frame

131‧‧‧Loading Department

1311‧‧‧ bottom

132‧‧‧ side

14‧‧‧Translucent colloid

20‧‧‧Substrate

21‧‧‧ solder pads

D1, D2‧‧‧ width

S, F‧‧‧ arrows

Figure 1 is a schematic diagram showing a conventional light emitting diode product.

1A is an enlarged view of a portion A of FIG. 1, showing a schematic view of a gap between a wire holder and a package housing.

Fig. 2 is a schematic view showing the structure of a light-emitting diode support of the present invention.

Fig. 2A is a bottom plan view showing the structure of the light-emitting diode of the present invention.

Fig. 2B is a partial enlarged view of Fig. 2A.

Fig. 3 is a schematic view showing a light emitting diode unit of the present invention.

Fig. 4 is a bottom perspective view showing the structure of the light-emitting diode of the present invention.

11‧‧‧Package housing

112‧‧‧ bottom

12‧‧‧ lead frame

122‧‧‧ pin section

1221‧‧‧ bottom

1221A‧‧‧ first end

1221B‧‧‧second end

13‧‧‧ wafer carrying lead frame

1311‧‧‧ bottom

D1, D2‧‧‧ width

Claims (15)

A light-emitting diode support structure includes a package housing; at least one lead frame, the lead frame is wrapped in the package housing, wherein the lead frame includes at least a buried portion, and a buried portion An extended forming pin segment, the bottom surface of the pin segment being exposed on a bottom surface of the package housing, the bottom surface of the pin segment having a first end portion and a portion exposed at a second end of the package housing The first end portion is defined as an end of the pin segment adjacent to the inner side of the package housing, and the second end portion is defined as an end of the pin portion protruding from a side of the package housing, and the second end portion is The width is less than the width of the first end. The illuminating diode support structure of claim 1, wherein the burying section is formed by two bending to extend the pin section. The illuminating diode support structure of claim 1, wherein the top surface of the pin segment has at least one groove. The light-emitting diode support structure of claim 1, wherein the pin segment partially protrudes from the package housing. The light-emitting diode support structure of claim 1, further comprising a wafer-carrying lead frame. The light-emitting diode support structure according to claim 5, wherein the wafer-carrying lead frame comprises a bearing portion and a side portion. The light-emitting diode support structure according to claim 6, wherein the bottom surface of the bearing portion is exposed on a bottom surface of the package housing. A light emitting diode unit comprising: a package housing; a light-emitting diode support structure wrapped in the package housing, having at least two lead frames and a wafer-carrying lead frame, each lead frame including at least one buried portion and a The bottom portion of the pin portion is exposed to the bottom surface of the package housing, and the bottom surface of the pin portion has a first end portion and a second end portion, wherein the first end portion The second end is defined as an end of the pin segment protruding from the side of the package housing, and the width of the second end portion is smaller than the first portion. a width of the one end portion; at least one light emitting diode disposed on the wafer carrying lead frame, the light emitting diode system being electrically connected to the buried portion of the two lead frames. The illuminating diode unit of claim 8, wherein the burying section is formed by two bending to extend the pin section. The light-emitting diode unit of claim 8, wherein the wafer-carrying lead frame has a carrying portion and a side portion on both sides of the carrying portion, the side portion being formed by obliquely extending upward from the carrying portion. The light-emitting diode unit of claim 10, wherein a bottom surface of the bearing portion is exposed on a bottom surface of the package housing. The light emitting diode unit of claim 8, wherein the package housing has a pair of recessed regions that should carry the lead frame on the wafer. The light-emitting diode unit of claim 12, further comprising a light-transmitting colloid filled in the recessed area. The illuminating diode unit of claim 8, wherein the top surface of the pin segment has at least one groove. The light-emitting diode unit of claim 8, wherein the pin segment protrudes partially from the package housing.