TWI506848B - Method for manufacturing waveguide with high aspect ratio microchannel - Google Patents

Method for manufacturing waveguide with high aspect ratio microchannel Download PDF

Info

Publication number
TWI506848B
TWI506848B TW102141734A TW102141734A TWI506848B TW I506848 B TWI506848 B TW I506848B TW 102141734 A TW102141734 A TW 102141734A TW 102141734 A TW102141734 A TW 102141734A TW I506848 B TWI506848 B TW I506848B
Authority
TW
Taiwan
Prior art keywords
electroforming mold
waveguide
aspect ratio
high aspect
electroforming
Prior art date
Application number
TW102141734A
Other languages
Chinese (zh)
Other versions
TW201519502A (en
Original Assignee
Metal Ind Res &Development Ct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metal Ind Res &Development Ct filed Critical Metal Ind Res &Development Ct
Priority to TW102141734A priority Critical patent/TWI506848B/en
Publication of TW201519502A publication Critical patent/TW201519502A/en
Application granted granted Critical
Publication of TWI506848B publication Critical patent/TWI506848B/en

Links

Description

具有高深寬比微溝槽的導波管的製造方法Method for manufacturing waveguide tube with high aspect ratio microgroove

本發明係有關於一種導波管的製造方法,特別是有關於一種具有高深寬比微溝槽的導波管的製造方法。The present invention relates to a method of fabricating a waveguide, and more particularly to a method of fabricating a waveguide having a high aspect ratio microchannel.

導波管為微波傳導的主要零件,其用途包含軍事應用的雷達(Radar)探測與通訊;工業及民生應用的微波爐(加熱、乾燥、解凍)、微波萃取(萃取、提純、環境去污)、微波雷達(如:測速、測距、測向、測高、防撞)、通訊(手機通訊、WLAN、衛星通訊),可應用於橡膠工業、食品工業、窯業、陶瓷工業、化學工業、木材、紙工業、纖維工業、印刷等產業;醫學上應用的:產生之高週波來治療關節炎(arthritis),以及舒緩頭痛、癌腫瘤疼痛等。利用微波之極高熱療法(hyperthermia)來做攝護腺癌;科學及太空研究上之應用的通訊、GPS等。The waveguide is the main component of microwave conduction, and its uses include radar (Radar) detection and communication for military applications; microwave ovens (heating, drying, thawing) for industrial and residential applications, microwave extraction (extraction, purification, environmental decontamination), Microwave radar (such as: speed measurement, ranging, direction finding, height measurement, collision avoidance), communication (mobile communication, WLAN, satellite communication), can be applied to the rubber industry, food industry, kiln industry, ceramic industry, chemical industry, wood, Paper industry, fiber industry, printing and other industries; medically applied: high frequency to produce arthritis, as well as relieve headache, cancer and tumor pain. Microwave hyperthermia is used for prostate cancer; communication and GPS for scientific and space research applications.

目前的導波管製造技術如圖1所示之美國專利文獻US5329086A公開一種適於安裝於烹飪室之壁上之導波管10,在磁控管之天線及該壁中所設之一開口之間,並包含大體管形之一金屬匣,由一蓋體及一底部構成,該蓋體包含:一上長壁,其前區域延伸於壁上方,其後區域延伸於磁控管上方;二側壁及;二橫向前及後壁;底部包含一底壁,穿有一孔,供天線通過;並開口與該開口相對;該蓋體係可由模鍛及彎曲一金屬板而獲得。A current waveguide manufacturing technique, as shown in FIG. 1, is disclosed in US Pat. No. 5,229,086 A, which discloses a waveguide 10 adapted to be mounted on a wall of a cooking chamber, and an opening in the antenna of the magnetron and the wall. And comprising a metal tube of a general tubular shape, comprising a cover body and a bottom portion, the cover body comprising: an upper long wall, the front region extending above the wall, the rear region extending above the magnetron; the second side wall And two lateral front and rear walls; the bottom portion includes a bottom wall through which a hole is passed for the antenna to pass; and an opening is opposite to the opening; the cover system can be obtained by swaging and bending a metal plate.

中國專利文獻CN200810024584.0公開了一種微波爐導波管 的沖壓成形方法:首先將導波管拉深毛坯製成為圓形,在機械壓力機上,利用成形與校正一次成形模具,將工件拉深並整形成型。Chinese patent document CN200810024584.0 discloses a microwave oven waveguide The stamping forming method: firstly, the waveguide is drawn into a round shape, and on the mechanical press, the workpiece is drawn and deepened by shaping and correcting the primary forming mold.

中華民國專利M278076複材導波管接頭,公開一種複材導波管接頭方法,經過複材模具、複材初胚、金屬鍍層複雜程序始完成導波管之接頭,可具有較好的導波效果。The Republic of China patent M278076 composite material waveguide tube joint discloses a composite material waveguide tube joint method. After the complex mold, the composite initial embryo, and the metal plating complex program, the joint of the waveguide is completed, which can have a good guided wave. effect.

惟,由於導波管具有週期性齒型結構設計,用以達到阻波之作用,而基本上導波管的齒型週期性結構與其導波效率呈正比,而上述的習知技術所揭示的導波管製造方法較無法製成複雜且精密的齒型結構,因而無法更提高導波效率。However, since the waveguide has a periodic tooth structure design to achieve the effect of the wave blocking, substantially the toothed periodic structure of the waveguide is proportional to its waveguide efficiency, and the above-mentioned prior art discloses The waveguide manufacturing method is incapable of making a complicated and precise tooth structure, and thus the waveguide efficiency cannot be improved.

本發明的目的在於提供一種應用3D列印技術或微製造技術(Micromanufacturing),與電鑄結合的工法,製造具有高深寬比微溝槽的導波管。It is an object of the present invention to provide a waveguide having a high aspect ratio microgroove by applying a 3D printing technique or a micromanufacturing technique in combination with electroforming.

為達成前述目的,本發明提供的導波管的製造方法的步驟包括:製作具有高深寬比(High Aspect Ratio)之多個立體的齒型的一第一電鑄模具,其中心形成有一通孔;將第一電鑄模具套接於第二電鑄模具,以組合為一組合電鑄模具,該第二電鑄模具包含一軸桿,該軸桿表面係對應於該通孔的形狀並與之緊密接合;以組合電鑄模具電鑄成形一包含組合電鑄模具的導波管組合件;之後再去除導波管組合件中的該組合電鑄模具部分,以形成一導波管,且其對應於第二電鑄模具處的結構形成導波管之一軸孔、對應於第一電鑄模具的高深寬比之立體齒型天線處的結構處則形成了開口面向該軸孔的多個高深寬比微溝槽。In order to achieve the above object, the method for manufacturing a waveguide of the present invention comprises the steps of: fabricating a first electroforming mold having a plurality of three-dimensional tooth profiles having a high aspect ratio, wherein a through hole is formed in the center thereof. The first electroforming mold is sleeved to the second electroforming mold to be combined into a combined electroforming mold, the second electroforming mold comprising a shaft, the shaft surface corresponding to the shape of the through hole and Tightly joining; forming a waveguide assembly comprising a combined electroforming mold by electroforming a combined electroforming mold; and then removing the combined electroforming mold portion of the waveguide assembly to form a waveguide, and Corresponding to the structure at the second electroforming mold, forming a shaft hole of the waveguide, the structure at the three-dimensional tooth antenna corresponding to the high aspect ratio of the first electroforming mold forms a plurality of high depths of the opening facing the shaft hole Aspect ratio micro-groove.

在一實施例中,第一電鑄模具、第二電鑄模具或組合電鑄模具係具有導電性或使該組合電鑄模具進行表面金屬化處理。In one embodiment, the first electroforming mold, the second electroforming mold, or the combined electroforming mold is electrically conductive or subject to the surface electroforming of the combined electroforming mold.

在一實施例當中,該第一電鑄模具之該通孔為喇叭狀造形。In one embodiment, the through hole of the first electroforming mold is flared.

在一實施例當中,該第一電鑄模具係由3D列印(3D Printing)技術製成或由微製造技術(Micromanufacturing)以非金屬材料製成的。而製成該第一電鑄模具的該3D列印的成型材料為具有導電金屬極性的複合材料,該複合材料包含導電金屬粉末、高分子材料及膠黏劑,並在施加能量在膠黏劑後,使膠黏劑產生反應而固化該導電金屬粉末和高分子材料。In one embodiment, the first electroformed mold is made of 3D printing technology or made of a non-metallic material by micromanufacturing. The 3D printed molding material of the first electroforming mold is a composite material having a conductive metal polarity, the composite material comprising a conductive metal powder, a polymer material and an adhesive, and applying energy in the adhesive. Thereafter, the adhesive is reacted to cure the conductive metal powder and the polymer material.

在另一實施中,該第一電鑄模具與該第二電鑄模具的組合是採用膠合工法,且該去除該組合電鑄模具的步驟包括:以適合的溶劑分離該第一電鑄模具與該第二電鑄模具之間的膠合材料;移除該第二電鑄模具;以及以適合的溶劑分解該第一電鑄模具。In another implementation, the combination of the first electroforming mold and the second electroforming mold is a gluing method, and the step of removing the combined electroforming mold comprises: separating the first electroforming mold with a suitable solvent and a bonding material between the second electroforming molds; removing the second electroforming mold; and decomposing the first electroforming mold with a suitable solvent.

本發明的特點至少有:本發明的成形方法適用於特殊且複雜結構的導波管的製造,在其採用3D列印技術與電鑄結合工法時,使用3D列印之積層加工法可以節省傳統模具與高昂加工費用,降低製造成本。而本發明應用積層製造之3D列印方法可進行傳統加工方法無法成形的微型尺寸與形狀,結構設計上相對具有彈性(如高深寬比的微溝槽與微溝槽間不同的間距)3D高深寬比微溝槽的結構可提升導波傳導效率。The invention has at least the following features: the forming method of the invention is suitable for the manufacture of a special and complicated structure of the waveguide, and when the 3D printing technique and the electroforming combination method are used, the 3D printing layer processing method can save the tradition. Molds and high processing costs reduce manufacturing costs. The 3D printing method using the laminated manufacturing method of the present invention can perform the micro size and shape which cannot be formed by the conventional processing method, and the structure design is relatively elastic (such as the difference between the micro-grooves and the micro-grooves with high aspect ratio) 3D high depth. The structure of the aspect ratio micro-trench improves the waveguide conduction efficiency.

10‧‧‧導波管10‧‧‧wave tube

20‧‧‧導波管20‧‧‧guide tube

21‧‧‧軸孔21‧‧‧Axis hole

22‧‧‧微溝槽22‧‧‧ micro-groove

221‧‧‧開口221‧‧‧ openings

30‧‧‧第一電鑄模具30‧‧‧First electroforming mould

31‧‧‧通孔31‧‧‧through hole

32‧‧‧立體齒型32‧‧‧Three-dimensional tooth type

40‧‧‧第二電鑄模具40‧‧‧Second electroforming mould

41‧‧‧軸桿41‧‧‧ shaft

50‧‧‧組合電鑄模具50‧‧‧Combined electroforming mould

60‧‧‧導波管組合件60‧‧‧guide tube assembly

S10~S40‧‧‧導波管的製造步驟流程S10~S40‧‧‧Producer flow of the waveguide

S41~S43‧‧‧去除導波管組合件中的組合電鑄模具部分的方法步驟流程S41~S43‧‧‧Removal of the method steps of the combined electroforming mold part in the waveguide assembly

圖1為先前技術之以沖壓技術成形的導波器立體圖;圖2為本發明一實施例之具有高深寬比微溝槽的導波管的製造方法流程圖;圖3至圖6為本發明之圖2實施例的結構流程圖;以及圖7為本發明一實施例之去除該組合電鑄模具的方法流程圖。1 is a perspective view of a waveguide of a prior art formed by a stamping technique; FIG. 2 is a flow chart of a method for manufacturing a waveguide having a high aspect ratio microgroove according to an embodiment of the present invention; FIG. 3 to FIG. 2 is a flow chart of the structure of the embodiment of the present invention; and FIG. 7 is a flow chart of a method for removing the combined electroforming mold according to an embodiment of the present invention.

茲配合圖式說明本發明之實施例如下。The embodiment of the present invention will be described with reference to the drawings.

如圖2所繪示的本發明一實施例之具有高深寬比微溝槽的導波管的製造方法流程圖、圖3至圖6繪示的本發明之圖2實施例的結構流程圖。本實施例中的導波管20的製造方法包括下列步驟:步驟S10,首先預先提供一第一電鑄模具30,該第一電鑄模具30的中心形成一通孔31,該第一電鑄模具30表面具有多個高深寬比(High Aspect Ratio)的立體齒型32。FIG. 2 is a flow chart showing a method of manufacturing a waveguide having a high aspect ratio microgroove according to an embodiment of the present invention, and FIG. 3 to FIG. 6 is a structural flowchart of the embodiment of FIG. 2 of the present invention. The manufacturing method of the waveguide 20 in this embodiment includes the following steps: Step S10, firstly providing a first electroforming mold 30, a center of the first electroforming mold 30 forming a through hole 31, the first electroforming mold The surface of the 30 has a plurality of high aspect ratios of the three-dimensional tooth type 32.

步驟S20,其次,將第一電鑄模具30套接在一第二電鑄模具40上,該第二電鑄模具40係包含一軸桿41,該軸桿41表面形狀係對應於該第一電鑄模具30的通孔31的形狀,且該第一電鑄模具30該通孔31與第二電鑄模具40的軸桿41互相接合(可應用膠合工法,但不限於此接合方式)後組成一組合電鑄模具50。Step S20, secondly, the first electroforming mold 30 is sleeved on a second electroforming mold 40, the second electroforming mold 40 includes a shaft 41, and the surface shape of the shaft 41 corresponds to the first electric The shape of the through hole 31 of the mold 30, and the through hole 31 of the first electroforming mold 30 and the shaft 41 of the second electroforming mold 40 are joined to each other (may be applied by a bonding method, but not limited to the joining method) A combined electroforming mold 50.

步驟S30,再其次,以組合成的該組合電鑄模具50為基材,應用電鑄技術,將該組合電鑄模具50置入一盛有適合的電鑄液的容器(圖中未示出)內,在該組合電鑄模具50表面沉積金屬鍍膜,使其成形為一包含該組合電鑄模具50的導波管組合件60。Step S30, and secondly, using the combined electroforming mold 50 as a substrate, applying the electroforming technology, placing the combined electroforming mold 50 into a container containing a suitable electroforming liquid (not shown in the drawing) Inside, a metal plating film is deposited on the surface of the combined electroforming mold 50 to form a waveguide assembly 60 including the combined electroforming mold 50.

步驟S40,續再「去除」該導波管組合件60當中的該組合電鑄模具50的部分(如何去除組合電鑄模具50容後敘述),使餘下的部分形成導波管20,且該導波管20原來(已去除)的該第二電鑄模具40的位置,遂對應形成了該導波管20之一軸孔21、該導波管20原來(已去除)的該第一電鑄模具30的高深寬比之立體齒型32位置的結構則對應於形成了該導波管20之多個高深寬比的微溝槽22,該些微溝槽22的開口221面向該軸孔21,且其空間互相連通,該些微溝槽22的高深寬比較佳是介於16:1至1:1之間、該些微溝槽22的間距為0.2mm至2.0mm之間,但不以此為限。Step S40, continuing to "remove" the portion of the combined electroforming mold 50 in the waveguide assembly 60 (how to remove the combined electroforming mold 50), so that the remaining portion forms the waveguide 20, and The position of the second electroforming mold 40 (which has been removed) of the waveguide 20 is corresponding to the formation of one of the shaft holes 21 of the waveguide 20, and the first electroforming of the waveguide 20 (removed) The high aspect ratio of the three-dimensional toothed 32-position structure of the mold 30 corresponds to a plurality of high-aspect ratio micro-grooves 22 forming the waveguide 20, and the openings 221 of the micro-grooves 22 face the shaft hole 21, And the space of the micro-grooves 22 is preferably between 16:1 and 1:1, and the pitch of the micro-grooves 22 is between 0.2 mm and 2.0 mm, but not limit.

在進一步的實施例中,第一電鑄模具30、第二電鑄模具40 或組合電鑄模具50之任一係具有導電性,或是,該第二電鑄模具40可為電導體金屬材料製成,或是,第一電鑄模具30、第二電鑄模具40組成該組合電鑄模具50後,在進行電鑄作業前預先在組合電鑄模具50進行表面金屬化處理,以利遂行電鑄成形作業。In a further embodiment, the first electroforming mold 30 and the second electroforming mold 40 Or the combination of the electroforming mold 50 is electrically conductive, or the second electroforming mold 40 may be made of an electrical conductor metal material, or the first electroforming mold 30 and the second electroforming mold 40 may be After the electroforming mold 50 is combined, the surface metallization treatment is performed in advance on the combined electroforming mold 50 before the electroforming operation is performed to facilitate the electroforming operation.

請對照圖3所示,另一方面,為方便後續製程中,更容易將導波管組合件60中的該第二電鑄模具40去除(移除),該第二電鑄模具40之該軸桿41(或者說,該第一電鑄模具30之該通孔31)為喇叭狀造形,以形成一導引角度。Referring to FIG. 3, on the other hand, in order to facilitate the subsequent process, it is easier to remove (remove) the second electroforming mold 40 in the waveguide assembly 60, and the second electroforming mold 40 The shaft 41 (or the through hole 31 of the first electroforming mold 30) is flared to form a guiding angle.

值得一提的是,在一實施例中,第一電鑄模具30係由3D列印(3D Printing)技術製成,而製成該3D列印的成型材料可為塑膠材料,也可為具有導電金屬極性的複合材料,該複合材料可包含有導電金屬粉末、高分子材料及膠黏劑,並在施予膠黏劑能量後固化該導電金屬粉末和高分子材料。It is worth mentioning that, in an embodiment, the first electroforming mold 30 is made by a 3D printing technology, and the molding material for forming the 3D printing may be a plastic material or may have A conductive metal polar composite material, which may include a conductive metal powder, a polymer material, and an adhesive, and cure the conductive metal powder and the polymer material after applying the adhesive energy.

另一方面,該第一電鑄模具30係由微製造技術(Micromanufacturing)以非金屬材料製成的,以兼具微型的立體齒型32的加工成形及後續便利於該導波管組合件60中去除第一電鑄模具30之進行。On the other hand, the first electroforming mold 30 is made of a non-metallic material by micromanufacturing to form a micro-three-dimensional tooth type 32 and is subsequently facilitated by the waveguide assembly 60. The progress of the first electroforming mold 30 is removed.

請參見圖7繪示的本發明一實施例之去除該電鑄模具的方法流程圖。在進一步實施例中,去除該組合電鑄模具50的步驟包括:步驟S41,根據第一電鑄模具30與第二電鑄模具40的膠合材料,選用適合的溶劑以分離該第一電鑄模具30與該第二電鑄模具40。Please refer to FIG. 7 for a flow chart of a method for removing the electroforming mold according to an embodiment of the invention. In a further embodiment, the step of removing the combined electroforming mold 50 includes: in step S41, selecting a suitable solvent to separate the first electroforming mold according to the bonding material of the first electroforming mold 30 and the second electroforming mold 40. 30 and the second electroforming mold 40.

步驟S42,自該導波管組合件60移除該第二電鑄模具40。In step S42, the second electroforming mold 40 is removed from the waveguide assembly 60.

步驟S43,根據第一電鑄模具30材料選用適合的溶劑,以分解該第一電鑄模具30,具體的做法之一是,將該第一電鑄模具30的膠黏劑固化作用解除,以使該第一電鑄模具30形成粉體或流體,並由移除後的該 第二電鑄模具40位置排出。Step S43, selecting a suitable solvent according to the material of the first electroforming mold 30 to decompose the first electroforming mold 30. One of the specific methods is to remove the curing effect of the first electroforming mold 30. The first electroforming mold 30 is formed into a powder or a fluid, and the removed The second electroforming mold 40 is discharged at a position.

承上所述,本發明的優點至少有:本發明結合3D列印技術與電鑄成形工法,十分適合用於特殊且複雜結構的導波管的製造、本發明應用積層成形之3D列印方法可進行傳統加工方法無法成形的微型尺寸與形狀,在其結構設計上相對具有彈性,例如可作出具高深寬比的微溝槽與微溝槽間不同的間距,立體式的高深寬比微溝槽的結構可提升導波傳導效率。另外,使用3D列印之積層加工法可以節省傳統模具與高昂加工費用,降低製造成本。In view of the above, the advantages of the present invention are at least: the present invention is compatible with the 3D printing technology and the electroforming forming method, and is very suitable for the manufacture of a waveguide tube of a special and complicated structure, and the 3D printing method for applying the laminated layer of the present invention. The micro-size and shape that can not be formed by the conventional processing method are relatively elastic in the structural design, for example, the difference between the micro-groove and the micro-groove having a high aspect ratio can be made, and the stereoscopic high aspect ratio microgroove can be formed. The structure of the groove can improve the waveguide conduction efficiency. In addition, the use of 3D printing lamination processing can save traditional molds and high processing costs, and reduce manufacturing costs.

前述本發明所採用的技術手段之實施方式或實施例,並非用來限定本創作專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利範圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。The embodiments or examples of the technical means adopted by the present invention are not intended to limit the scope of implementation of the present patent. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.

S10~S40‧‧‧導波管的製造步驟流程S10~S40‧‧‧Producer flow of the waveguide

Claims (12)

一種具有高深寬比微溝槽的導波管的製造方法,其步驟包括:提供具有高深寬比之多個立體齒型的一第一電鑄模具,該第一電鑄模具中心形成一通孔;將該第一電鑄模具套接於一第二電鑄模具,該第二電鑄模具包含一軸桿,該軸桿表面係對應於該通孔的形狀並與之接合而組成一組合電鑄模具;以該組合電鑄模具電鑄成形一包含該組合電鑄模具的導波管組合件;以及去除該導波管組合件中的該組合電鑄模具部分,以形成該導波管,且其對應於該第二電鑄模具處的結構形成該導波管之一軸孔、對應於該第一電鑄模具的高深寬比之立體齒型的結構處則形成了該導波管之多個高深寬比微溝槽,該些微溝槽的開口面向該軸孔且其空間互相連通。A method for manufacturing a waveguide having a high aspect ratio microgroove, the method comprising: providing a first electroforming mold having a plurality of three-dimensional tooth profiles having a high aspect ratio, wherein a center of the first electroforming mold forms a through hole; The first electroforming mold is sleeved on a second electroforming mold, and the second electroforming mold comprises a shaft surface corresponding to the shape of the through hole and joined thereto to form a combined electroforming mold Forming a waveguide assembly comprising the combined electroforming mold by electroforming the combined electroforming mold; and removing the combined electroforming mold portion of the waveguide assembly to form the waveguide, and Corresponding to the structure at the second electroforming mold, forming a shaft hole of the waveguide, and a structure corresponding to the high aspect ratio of the first electroforming mold, forming a plurality of high depths of the waveguide The aspect ratio micro-grooves, the openings of the micro-grooves face the shaft holes and their spaces communicate with each other. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該第一電鑄模具、該第二電鑄模具或該組合電鑄模具係具有導電性。The method for manufacturing a waveguide having a high aspect ratio microgroove according to the first aspect of the invention, wherein the first electroforming mold, the second electroforming mold or the combined electroforming mold has conductivity . 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該組合電鑄模具在進行電鑄作業前預先進行表面金屬化處理。A method of manufacturing a waveguide having a high aspect ratio microgroove according to the first aspect of the invention, wherein the combined electroforming mold is subjected to surface metallization treatment before performing an electroforming operation. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該第一電鑄模具之該通孔及該第二電鑄模具之該軸桿為喇叭狀造形。The method for manufacturing a waveguide having a high aspect ratio microgroove according to the first aspect of the invention, wherein the through hole of the first electroforming mold and the shaft of the second electroforming mold are horns Shaped shape. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該些微溝槽的高深寬比介於16:1至1:1之間。The method for manufacturing a waveguide having a high aspect ratio microgroove according to claim 1, wherein the microchannels have a high aspect ratio of between 16:1 and 1:1. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該些微溝槽的間距為0.2mm至2.0mm之間。The method for manufacturing a waveguide having a high aspect ratio microgroove according to the first aspect of the invention, wherein the microgrooves have a pitch of between 0.2 mm and 2.0 mm. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該第一電鑄模具係由3D列印(3D Printing)技術製成。A method of manufacturing a waveguide having a high aspect ratio microgroove as described in claim 1, wherein the first electroforming mold is made by a 3D printing technique. 如申請專利範圍第7項所述的具有高深寬比微溝槽的導波管的製造方法,其中,製成該第一電鑄模的該3D列印的成型材料為塑膠材料。The method for manufacturing a waveguide having a high aspect ratio microgroove according to claim 7, wherein the 3D printed molding material of the first electroforming mold is a plastic material. 如申請專利範圍第7項所述的具有高深寬比微溝槽的導波管的製造方法,其中,製成該第一電鑄模具的該3D列印的成型材料為具有導電金屬極性的複合材料。The method for manufacturing a waveguide having a high aspect ratio microgroove according to claim 7, wherein the 3D printed molding material of the first electroforming mold is a composite having a conductive metal polarity. material. 如申請專利範圍第9項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該複合材料更包含導電金屬粉末、高分子材料及膠黏劑,並在施予膠黏劑能量後固化該導電金屬粉末和高分子材料。The method for manufacturing a waveguide having a high aspect ratio microgroove according to claim 9, wherein the composite further comprises a conductive metal powder, a polymer material, and an adhesive, and is applied to the adhesive. The agent energy post-cures the conductive metal powder and the polymer material. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該第一電鑄模具係由微製造技術(Micromanufacturing)以非金屬材料製成的。A method of manufacturing a waveguide having a high aspect ratio microgroove as described in claim 1, wherein the first electroforming mold is made of a non-metallic material by micromanufacturing. 如申請專利範圍第1項所述的具有高深寬比微溝槽的導波管的製造方法,其中,該第一電鑄模具與該第二電鑄模具的組合是採用膠合工法,且該去除該組合電鑄模具的步驟包括:以適合的溶劑作用於該第一電鑄模具與該第二電鑄模具的膠合材料,使該第一電鑄模具與該第二電鑄模具彼此分離;移除該第二電鑄模具;以及以適合的溶劑分解該第一電鑄模具。The method for manufacturing a waveguide having a high aspect ratio microgroove according to the first aspect of the invention, wherein the combination of the first electroforming mold and the second electroforming mold is a gluing method, and the removing The step of combining the electroforming mold includes: applying a suitable solvent to the bonding material of the first electroforming mold and the second electroforming mold to separate the first electroforming mold from the second electroforming mold; In addition to the second electroforming mold; and decomposing the first electroforming mold with a suitable solvent.
TW102141734A 2013-11-15 2013-11-15 Method for manufacturing waveguide with high aspect ratio microchannel TWI506848B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102141734A TWI506848B (en) 2013-11-15 2013-11-15 Method for manufacturing waveguide with high aspect ratio microchannel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102141734A TWI506848B (en) 2013-11-15 2013-11-15 Method for manufacturing waveguide with high aspect ratio microchannel

Publications (2)

Publication Number Publication Date
TW201519502A TW201519502A (en) 2015-05-16
TWI506848B true TWI506848B (en) 2015-11-01

Family

ID=53721063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102141734A TWI506848B (en) 2013-11-15 2013-11-15 Method for manufacturing waveguide with high aspect ratio microchannel

Country Status (1)

Country Link
TW (1) TWI506848B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6552636B1 (en) * 1999-07-23 2003-04-22 Alps Electric Co., Ltd. Small-sized cylindrical waveguide bend having low reflection characteristic
TWM278076U (en) * 2005-04-28 2005-10-11 Chung Shan Inst Of Science Joint of composite waveguide
CN200947459Y (en) * 2006-09-06 2007-09-12 郑振诚 Split structure guided-wave tube
CN100544853C (en) * 2008-03-27 2009-09-30 南京工业职业技术学院 Microwave oven waveguide stamping forming method
US20110205136A1 (en) * 2010-02-22 2011-08-25 Viasat, Inc. System and method for hybrid geometry feed horn
WO2012031426A1 (en) * 2010-09-07 2012-03-15 京信通信系统(中国)有限公司 Microwave antenna with ultra-high performance and feed source assembly thereof
CN102931493A (en) * 2012-11-07 2013-02-13 京信通信系统(中国)有限公司 Antenna and feed source assembly thereof
CN102184826B (en) * 2011-04-18 2013-06-05 中国计量学院 Slow wave structure based on semiconductor-filled metal waveguide structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6552636B1 (en) * 1999-07-23 2003-04-22 Alps Electric Co., Ltd. Small-sized cylindrical waveguide bend having low reflection characteristic
TWM278076U (en) * 2005-04-28 2005-10-11 Chung Shan Inst Of Science Joint of composite waveguide
CN200947459Y (en) * 2006-09-06 2007-09-12 郑振诚 Split structure guided-wave tube
CN100544853C (en) * 2008-03-27 2009-09-30 南京工业职业技术学院 Microwave oven waveguide stamping forming method
US20110205136A1 (en) * 2010-02-22 2011-08-25 Viasat, Inc. System and method for hybrid geometry feed horn
WO2012031426A1 (en) * 2010-09-07 2012-03-15 京信通信系统(中国)有限公司 Microwave antenna with ultra-high performance and feed source assembly thereof
CN102184826B (en) * 2011-04-18 2013-06-05 中国计量学院 Slow wave structure based on semiconductor-filled metal waveguide structure
CN102931493A (en) * 2012-11-07 2013-02-13 京信通信系统(中国)有限公司 Antenna and feed source assembly thereof

Also Published As

Publication number Publication date
TW201519502A (en) 2015-05-16

Similar Documents

Publication Publication Date Title
EP3227111B1 (en) Composite material, shell for mobile device, their manufacturing methods, and mobile device
EP3013021B1 (en) Housing, electronic device using same, and method for making same
CN105849055B (en) For making the molding device of substrate of glass
TW201633875A (en) Housing, electronic device using the same and method for manufacturing the housing
CN104562024B (en) The complex and its manufacture method of metal and resin
JP2016103476A5 (en)
TWI553288B (en) Vapor chamber and method for manufacturing same
TWI555454B (en) Mobile device, component and method for forming component
TW201618643A (en) Housing, electronic device using the same and method for manufacturing the housing
CN103993340A (en) Metal sheet as well as metal resin composite and preparation method thereof
CN110351971A (en) A kind of shell, production method and electronic device
US20110209338A1 (en) Patch antenna and method of making the same
KR100738502B1 (en) Deformable sandwich panel using bended truss core and manufacturing method thereof
JP2016092004A5 (en)
TWI506848B (en) Method for manufacturing waveguide with high aspect ratio microchannel
JP2011525437A5 (en)
US7049561B1 (en) Far infrared tubular porous ceramic heating element
CN105491801A (en) Multifunctional FPC reinforcement rotating platform
CN103973081B (en) The stack bus bar of injection mo(u)lding
CN104816429A (en) Metal surface and plastic integral injection molding and firm adhering process
KR101954631B1 (en) Mother ceramic substrate, ceramic substrate, mother module component, module component, and manufacturing method for mother ceramic substrate
CN205961566U (en) A copper billet for burying copper billet board
KR101283200B1 (en) Composite of different materials and the method therefor
CN104218296A (en) Multilayer printing technology based waveguide and preparation method thereof
JP6393681B2 (en) Non-aqueous electrolyte secondary battery electrode and method for producing non-aqueous electrolyte secondary battery electrode