TWI505157B - Touch device and method for fabricating the same - Google Patents

Description

Touch panel and manufacturing method thereof

The present invention relates to a touch technology, and more particularly to a touch panel and a method of fabricating the same.

With the rapid advancement of technology, the use of consumer electronics has become more diverse. For example, many portable electronic products (such as personal digital assistants (PDAs) or mobile phones) have widely used touch. Touch panel.

The shielding layer of the touch panel has the function of shielding the peripheral components, so that the user does not perceive the presence of the peripheral components. In addition, the shielding layer can be designed with different colors depending on the design of the actual electronic product. However, it can be understood that the shielding layer often needs a certain thickness to achieve the shielding effect, but the height formed by the shielding layer being too thick will cause the sensing electrode layer to fail to climb the upper shielding layer when extending to the shielding layer. Form an open circuit. Therefore, the design of the shielding layer is one of the important factors affecting the yield in the whole process of manufacturing the touch panel, and it is necessary to design and improve.

In view of the above, the present invention is directed to improving the shielding layer structure of the touch panel, so that the shielding layer of the touch panel is not affected by the change in color design requirements. The shadowing effect is sounded, and the sensing electrode layer is also smoothly extended to the shielding layer.

The present invention provides a touch panel comprising: a first shielding layer disposed on a first region of a surface of a substrate; a second shielding layer disposed on the first shielding layer and having a via hole; a sensing electrode layer is disposed on a second region of the surface of the substrate, and further extending between the first shielding layer and the second shielding layer, wherein a portion of the sensing electrode layer is exposed by the via hole; And a conductive filling layer disposed in the via hole and electrically connected to the sensing electrode layer.

The invention further provides a method for manufacturing a touch device, comprising the steps of: forming a first shielding layer on a first region of a surface of a substrate; forming a sensing electrode layer on a second region of the surface of the substrate And extending on the first shielding layer; forming a second shielding layer with a via hole on the first shielding layer and the sensing electrode layer in the forming region of the first shielding layer, wherein the conducting The sensing electrode layer of the exposed portion of the hole; and a conductive filling layer is formed in the via hole for electrically connecting the sensing electrode layer.

100‧‧‧ touch panel

100A‧‧‧Sensor area

100B‧‧‧ surrounding area

110‧‧‧Substrate

120‧‧‧First masking layer

121‧‧‧First shadow layer substructure layer

122‧‧‧First shadowing substructure layer

130‧‧‧Induction electrode layer

1301‧‧‧ Sensing part

1302‧‧‧Extension

140‧‧‧Second shelter

141‧‧‧Second shadow layer substructure layer

142‧‧‧Second shadow substructure layer

143‧‧‧Second shadow substructure layer

150, 151, 152‧‧‧ vias

1501‧‧‧first via

1502‧‧‧Second via

1503‧‧‧3rd via hole

160‧‧‧ Conductive filling layer

170‧‧‧Signal transmission layer

Fig. 1 is a cross-sectional view showing a touch panel according to a first embodiment of the present invention.

FIG. 2 shows a method of manufacturing the touch panel of FIG. 1 by a cross-sectional view of each manufacturing stage of the touch panel.

Fig. 3 is a cross-sectional view showing a touch panel of a second embodiment of the present invention.

Fig. 4 is a cross-sectional view showing a touch panel of a third embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a touch panel of a fourth embodiment of the present invention.

Figure 6 is a cross-sectional view showing a touch panel of a fifth embodiment of the present invention.

In the following various embodiments, repeated reference numerals or signs may be used. These repetitions are merely for the purpose of simplicity and clarity of the present invention and do not represent any of the various embodiments and/or structures discussed. Furthermore, when a first material layer is referred to or on a second material layer, the first material layer is in direct contact with or separated from the second material layer by one or more other material layers. In the drawings, the shape or thickness of the embodiments may be enlarged to simplify or highlight the features. Furthermore, elements not shown or described in the figures may be in any form known to those of ordinary skill in the art.

1 is a cross-sectional view showing a touch panel according to a first embodiment of the present invention. As shown in FIG. 1 , the touch panel 100 is defined with a sensing area 100A and a peripheral area 100B. In actual design, the peripheral area 100B can be located, for example, on at least one side of the sensing area 100A to form a relative position. relationship. The touch panel 100 of the present embodiment includes a substrate 110, a first shielding layer 120, a sensing electrode layer 130, a second shielding layer 140, and a conductive filling layer 160. The material of the substrate 110 is, for example, glass, quartz, polyethylene terephthalate (PET), polycarbonate (PC) or polymethylmethacrylate (PMMA). Moreover, the substrate 110 of the present embodiment can be further strengthened by a strengthening process, and in fact, in addition to the components for carrying the sensing electrode layer 130 and the first shielding layer 120, the function of protecting the sensing electrode layer 130 is provided.

The first shielding layer 120 is disposed on a portion of the surface of the substrate 110. More specifically, the setting region of the first shielding layer 120 of the embodiment is The peripheral area 100B of the touch panel 100 is defined, and the area other than the set area of the first shielding layer 120 is relatively defined as the sensing area 100A of the touch panel 100. The second shielding layer 140 is disposed on the first shielding layer 120 and has a via hole 150 .

The sensing electrode layer 130 is disposed on another portion of the surface of the substrate 110 to be correspondingly located in the sensing region 100A, and the sensing electrode layer 130 is further disposed between the first shielding layer 120 and the second shielding layer 140 to correspond to the peripheral region 100B. . Wherein, in the sensing electrode layer 130 located in the peripheral region 100B, a portion of the sensing electrode layer 130 is exposed by the via hole 150 of the second shielding layer 140. More specifically, the sensing electrode layer 130 of the present embodiment includes a sensing portion 1301 and an extending portion 1302. The sensing portion 1301 is corresponding to a portion of the sensing region 100A disposed on the surface of the substrate 110, and the extending portion 1302 is It is correspondingly located in the peripheral area 100B and disposed on the first shielding layer 120. As a result, a portion of the extended portion 1302 disposed between the first shielding layer 120 and the second shielding layer 140 is exposed by the via 150 of the second shielding layer 140.

The conductive filling layer 160 is disposed in the via hole 150 and electrically connected to the sensing electrode layer 130. Therefore, in addition to the function of providing signal transmission, the conductive filling layer 160 of the present embodiment further forms a shielding structure of the touch panel 100 with the first shielding layer 120 and the second shielding layer 140. It is worth mentioning that, since the thickness of the sensing electrode layer 130 is only about 250 Å to 300 Å in actual design, when the sensing electrode layer 130 is extended on the first shielding layer 120, the height of the climbing slope is limited. If the height of the climbing is too high, the circuit is easily broken and the circuit is broken. Therefore, the thickness of the first shielding layer 120 of the embodiment is less than or equal to 25 um.

The touch panel 100 of this embodiment further includes a signal transmission layer 170. The signal transmission layer 170 is disposed on the second shielding layer 140 and electrically connected to the conductive filling layer 160. The signal transmission layer 170 can be further electrically connected to a controller (not shown) via a flexible printed circuit board (not shown) for signal transmission.

As described above, the present embodiment is designed by the lamination of the first shielding layer 120 and the second shielding layer 130, and the through holes 150 of the second shielding layer 130 and the conductive filling layer 160 filled in the via 150. When the sensing electrode layer 130 is extended from the sensing region 100A to the peripheral region 100B, it is only necessary to climb to the first shielding layer 120 to smoothly connect the signal transmission layer 170 through the conductive filling layer 160, and the sensing electrode layer 130 is lowered by the climbing. The risk of being too high and prone to breakage. In addition, considering the optical factors such as the absorption of light and the reflectivity of the object, it is assumed that the optical density value of the first shielding layer 120 is D1, the optical density value of the second shielding layer 140 is D2, and the optical density value of the conductive filling layer 160. For D3, the shielding structure of this embodiment is designed to satisfy D1+D2 3 and D1+D3 The shielding condition of 3 allows the shielding structure of the touch panel 100 to provide sufficient shielding effect to shield all peripheral components (such as the signal transmission layer 170, etc.) corresponding to the peripheral region 100B.

Further, in view of the specifications of the shielding structure of the embodiment, in the color portion, the colors of the first shielding layer 120, the second shielding layer 140, and the conductive filling layer 160 may be various colors such as black, white, gray, silver, and yellow. The first shielding layer 120, the second shielding layer 140 and the conductive filling layer 160 are not limited to adopt the same or different colors, and may be adjusted and matched according to actual design requirements if necessary. Under the condition that the shielding structure of the touch panel 100 can shield the peripheral components, if the second shielding layer 140 and the conductive filling layer 160 are different from the color of the first shielding layer 120, the first shielding layer 120 can be limited. Thick Adjusting and matching the color selection of the second shielding layer 140 and the conductive filling layer 160, so that the first shielding layer 120 can shield the second shielding layer 140 and the conductive filling layer 160 from being different from the first shielding layer 120. Different color problem.

In the material portion, the materials of the first shielding layer 120 and the second shielding layer 140 may be, for example, ink or photoresist. Of course, in the shielding structure of the touch panel 100 of the present embodiment, the second shielding layer 140 is used to assist and reinforce the shielding effect of the first shielding layer 120. Therefore, in actual design, the second shielding layer 140 can be further Designed as a high reflectivity layer, such as a resin layer, to provide high reflectivity and low light transmission. The material of the conductive filling layer 160 includes a metal material, a non-metal material or a mixture of a metal material and a non-metal material, wherein the metal material is, for example, silver (Ag), gold (Au), copper (Cu), aluminum (A1) or the like. The non-metallic material is, for example, a conductive ink, which is mainly composed of a pigment, a binder, and additives.

In addition, the thickness of the second shielding layer 140 and the conductive filling layer 160 may be correspondingly increased or decreased because the aforementioned shielding conditions are satisfied, except that the thickness limitation of the first shielding layer 120 is less than or equal to 25 um.

Some embodiments are used to illustrate the specification between the first shielding layer 120, the second shielding layer 140, and the conductive filling layer 160. In particular, the colors used in the following examples are merely for the purpose of presenting a larger contrast and convenience of description and are not intended to limit the invention.

In one embodiment, it is assumed that the first shielding layer 120 and the second shielding layer 140 are designed with a white ink, and the conductive filling layer 160 is designed with a black conductive ink. Based on the optical factors such as the absorption and reflection of light by the black conductive ink, it is known from experiments that the problem of the color difference caused by the black conductive ink can be masked when the optical density of the white ink is greater than or equal to 1 OD. Among them, the increase rate of the optical density value of the white ink is about 0.05 OD/um; and the increase rate of the optical density value of the black conductive ink is about 0.5 OD/um. Therefore, the thickness of the first shielding layer 120 of the embodiment is greater than or equal to 20 um and less than or equal to 25 um. In other words, the optical density value (D1) of the first shielding layer 120 of the embodiment ranges from 1 to 1. D1 1.25.

In order to satisfy the aforementioned shielding conditions: the optical density value (D1) of the first shielding layer 120 + the optical density value (D2) of the second shielding layer 140 3. The optical density value (D2) of the second shielding layer 140 of the present embodiment is in the range of D2. 2. After the conversion, the thickness of the second shielding layer 140 is greater than or equal to 40 um. In addition, in order to satisfy the aforementioned shielding conditions: the optical density value (D1) of the first shielding layer 120 + the optical density value (D3) of the conductive filling layer 160 3. The optical density value (D3) of the conductive filling layer 160 of the present embodiment is in the range of D3. 2. After conversion, the thickness of the conductive filling layer 160 is greater than or equal to 4 um.

Therefore, through the above calculation, the present embodiment can obtain the thickness of the first shielding layer 120, the second shielding layer 140, and the conductive filling layer 160 correspondingly designed according to the selected color and material specifications. Incidentally, since the black conductive ink used in the conductive filling layer 160 of the present embodiment has a better shielding effect (a larger rate of increase in optical density value) than the white ink, the conductive filling is performed. The thickness of the layer 160 can be designed to be thinner than the thickness of the second shielding layer 140 to achieve the desired shielding effect, but the conductive filling layer 160 of the present embodiment is designed to be filled in the via hole 150 of the second shielding layer 140. Therefore, for the convenience of the process, the filling height of the conductive filling layer 160 is correspondingly designed according to the actual thickness of the second shielding layer 140 (greater than or equal to 40 um).

In another embodiment, if the first shielding layer 120 and the second shielding layer 140 and the conductive filling layer 160 are respectively designed with different colors, then the thickness of the first shielding layer 120 will be determined according to the second shielding layer 140 and the conductive filling layer 160 which will cause a large color problem, let the first The masking layer 120 can surely cover a person who causes a small color problem under the condition that it can cover a problem that causes a large color difference. For example, it is assumed that the first shielding layer 120 is a yellow ink, the second shielding layer 140 is a silver ink, and the conductive filling layer 160 is a black conductive ink. Generally, under the yellow ink, the black conductive ink will cause a yellow ink compared to the silver ink. The problem of a large heterochromatic color, so the thickness of the first shielding layer 120 of the present embodiment will be designed according to the thickness of the conductive filling layer 160 (black conductive ink), but the thickest is 25 um.

In addition, the foregoing conductive filling layer 160 is filled in the via hole 150 of the second shielding layer 140. For the convenience of the process, the final height formed by the second shielding layer 140 and the conductive filling layer 160 is preferably uniform. Therefore, under the above-mentioned shielding condition, the second shielding layer 140 and the conductive filling layer 160 are based on the fact that the thickness of the optical density value is smaller (the thickness required is thicker) is the final height.

In order to further explain the touch panel of the present invention in detail, please refer to FIG. 2 based on the architecture of FIG. 1 , and the manufacturing method of the touch panel of FIG. 1 is shown by a cross-sectional view of each manufacturing stage of the touch panel. The touch panel 100 of the present embodiment is used to define the peripheral area 100B of the touch panel 100 and the opposite sensing area 100A.

The material of the first shielding layer 120 includes ink or photoresist. If an ink is used, the method of forming the first shielding layer 120 includes spin coating, bar coating, dip coating, roll coating, and spray coating. (spray coating), gravure coating Gravure coating, ink jet printing, slot coating or blade coating. If a photoresist is used, the first masking layer 120 is formed by photolithography, and the photolithography process includes photoresist coating, soft baking, mask alignment. (mask aligning), exposure, post-exposure, developing photoresist, and hard baking, which are well known to those skilled in the art and will not be described herein. .

Next, the sensing electrode layer 130 is formed on another partial region of the surface of the substrate 110, and is formed to extend on the first shielding layer 120. Specifically, the sensing portion 1301 of the sensing electrode layer 130 is formed on the surface of the substrate 110 and located in the sensing region 100A, and the extending portion 1302 of the sensing electrode layer 130 is formed on the first shielding layer 120 and located in the peripheral region 100B. .

The transparent conductive material used for the sensing electrode layer 130 includes indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), and aluminum zinc (aluminum zinc). Oxide, AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide (CdO), hafnium oxide (HfO), indium gallium Zinc oxide, InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO). The method of forming the sensing electrode layer 130 may deposit a transparent conductive material by a chemical vapor deposition method or a sputtering method, and then perform a patterning process to form a feeling by using a photolithography process. Electrode layer 130.

Next, in the formation region of the first shielding layer 120, that is, in the peripheral region 100B, a second shielding layer 140 having via holes 150 is formed on the first shielding layer 120 and the sensing electrode layer 130, and the via holes 150 are formed. A portion of the sensing electrode layer 130 is exposed. Wherein, since the portion of the sensing electrode layer 130 formed between the first shielding layer 120 and the second shielding layer 140 in the peripheral region 100B belongs to the extending portion 1302, the via hole 150 is an extended portion 1302 corresponding to the exposed portion. The material and the forming method of the second shielding layer 140 can be the same as the first shielding layer 120 in the actual design and the forming method, and will not be further described herein.

Finally, a conductive filling layer 160 is formed in the via hole 150 for electrically connecting the sensing electrode layer 130, and a signal transmission layer 170 is further formed on the second shielding layer 140 for electrically connecting the conductive filling layer 160 to allow signals. The transmission layer 170 is electrically connected to the sensing electrode layer 130 through the conductive filling layer 160. It should be noted that, if the signal transmission layer 170 and the conductive filling layer 160 are designed by the same material, the conductive filling layer 160 and the signal transmission layer 170 may be formed in the same process step, which is not limited by this embodiment.

It is to be noted that the first shielding layer 120 and the second shielding layer 140 of the touch panel 100 of the present invention may be respectively designed as a composite layer structure, that is, the first shielding layer 120 and/or the second shielding layer 140 may be It is made up of two or more substructure layers. The number of layers of the sub-structure layer and the color material of each layer are not limited according to the actual design. The design of the composite layer structure can make the frame of the touch panel 100 more colorful, and the design of the frame is also More flexible. The following embodiments will further illustrate the architectural aspects of other embodiments of the touch panel 100. In addition, since the touch panel architecture of the following embodiments is substantially the same The touch panel 100 of FIG. 1 has the same structure, and the difference lies only in the design of the composite layer structure adopted by the first shielding layer 120 and/or the second shielding layer 140, so that the structure and function of the entire touch panel are not The description will be repeated and will be described first.

Referring to FIG. 3, a cross-sectional view of a touch panel according to a second embodiment of the present invention is shown. In this embodiment, the first shielding layer 120 is a composite layer structure, and the sub-structure layer 121 and the sub-structure layer 122 are stacked, and the second shielding layer 140 is still designed with a single-layer structure. Wherein, the overall thickness of the first shielding layer 120 of the composite layer structure is still designed to meet the limitation of less than or equal to 25 um. Of course, the thickness distribution of the sub-structure layer 121 and the sub-structure layer 122 is determined according to design requirements. There are no restrictions.

In addition, the calculation of the optical density value (D1) of the first shielding layer 120 of the present embodiment is performed by summing the optical density values of the sub-structure layer 121 and the optical density values of the sub-structure layer 122. In general, the shielding structure of the touch panel 100 of the present embodiment is still designed to satisfy the optical density value (D1) of the first shielding layer 120 + the optical density value (D2) of the second shielding layer 140. 3 OD; and the optical density value (D1) of the first shielding layer 120 + the optical density value of the conductive filling layer 160 (D3) 3 OD shielding conditions.

Referring to FIG. 4, a cross-sectional view of a touch panel according to a third embodiment of the present invention is shown. In this embodiment, the first shielding layer 120 is designed with a single layer structure, and the second shielding layer 140 is designed by a composite layer structure, and the sub-structure layer 141 and the sub-structure layer 142 are stacked. The sub-structure layer 141 and the sub-structure layer 142 are designed to have corresponding via holes 151 and 152 for stacking the via holes 150 constituting the second shielding layer 140.

In addition, the calculation of the optical density value (D2) of the second shielding layer 140 of the present embodiment is performed by summing the optical density values of the substructure layer 141 and the optical density values of the substructure layer 142. In general, the shielding structure of the touch panel 100 of the present embodiment is still designed to satisfy the optical density value (D1) of the first shielding layer 120 + the optical density value (D2) of the second shielding layer 140. 3; and the optical density value (D1) of the first shielding layer 120 + the optical density value (D3) of the conductive filling layer 160 3 shade conditions.

Furthermore, if the second shielding layer 140 is to further provide high reflectivity to assist and reinforce the shielding effect of the first shielding layer 140, the embodiment may, for example, at least design the sub-structure layer 141 or the sub-structure layer 142 to have high reflectivity. The layer achieves the effect of providing high reflectivity and low light transmittance.

Referring to FIG. 5, a cross-sectional view of a touch panel according to a fourth embodiment of the present invention is shown. In this embodiment, the first shielding layer 120 and the second shielding layer 140 are both designed by using a composite layer structure. The first shielding layer 120 is formed by stacking the sub-structure layer 121 and the sub-structure layer 122. The second shielding layer 140 is formed. The substructure layer 141, the substructure layer 142, and the substructure layer 143 are three laminated. Wherein, the overall thickness of the first shielding layer 120 of the composite layer structure is still designed to meet the limit of less than or equal to 25 um. The substructure layer 141, the substructure layer 142, and the substructure layer 143 of the second shielding layer 140 are designed to have corresponding via holes 151, 152, 153 for stacking the via holes 150 constituting the second shielding layer 140.

In addition, the calculation of the optical density value (D1) of the first shielding layer of the present embodiment is obtained by summing the optical density values of the sub-structure layer 121 and the optical density values of the sub-structure layer 122, and the optical density of the second shielding layer 140. The value (D2) is calculated by summing the optical density value of the substructure layer 141, the optical density value of the substructure layer 142, and the optical density value of the substructure layer 143. In general, the shielding structure of the touch panel 100 of the present embodiment is still designed to satisfy the optical density value (D1) of the first shielding layer 120 + the optical density value (D2) of the second shielding layer 140. 3 OD; and the optical density value (D1) of the first shielding layer 120 + the optical density value of the conductive filling layer 160 (D3) 3 OD shielding conditions.

Furthermore, if the second shielding layer 140 is to further provide high reflectivity to assist and reinforce the shielding effect of the first shielding layer 140, the embodiment may, for example, substructure layer 141, substructure layer 142, and substructure layer 143. At least one of them is designed as a high reflectivity layer to achieve high reflectivity and low light transmittance.

Referring to FIG. 6, a cross-sectional view of a touch panel according to a fifth embodiment of the present invention is shown. The composite layer structure design of the first shielding layer 120 and the second shielding layer 140 in this embodiment is substantially the same as that of the embodiment of FIG. 5, and the further difference is that the conductive vias 150 in the second shielding layer 140 are different in appearance. The aperture of the via hole 150 of the present embodiment varies according to the height position of the second shielding layer 140. Specifically, the aperture of the via hole 150 of the embodiment adjacent to the sensing electrode layer 130 is greater than the adjacent signal. The aperture at the location of the transport layer 170, and if viewed in a stacked configuration of the three substructure layers 141, 142, and 143, the minimum aperture of the first via 1501 in the substructure layer 141 is greater than that in the substructure layer 142. The largest aperture of the second via 1502, the smallest aperture of the second via 1502 in the substructure layer 142 is greater than the largest aperture of the third via 1503 in the substructure layer 143.

In a preferred embodiment, the first via hole 1501 in the substructure layer 141, the second via hole 1502 in the substructure layer 142, and the via hole third 1503 in the substructure layer 143 may be staggered from each other and electrically conductive. The filling layer 160 is filled in the first via hole 1501, the second via hole 1502, and the third via hole 1503, respectively, and is electrically connected to each other.

Of course, in actual design, the aspect of the via 150 is not limited thereto, and only the signal transmission layer 170 is required to pass the conductive filled in the via 150. The filling layer 160 may be electrically connected to the sensing electrode layer 130.

Incidentally, the via hole 150 in the second shielding layer 140 is adjacent to the signal transmission layer 130 except that the conductive filling layer 160 may have a problem of color difference due to the color difference from the first shielding layer 120. The size of the aperture may also be affected, and the aperture is too large to easily visualize the color of the conductive filling layer 160 filled in the via 150. Therefore, in addition to the limited thickness adjustment of the first shielding layer 120 and the color selection of the second shielding layer 140 and the conductive filling layer 160, in an embodiment, the via hole 150 may be adjacent to the signal transmission layer 130. The cross-sectional area is designed to be 0.0625 mm ² to 0.25 mm ² , and this design can further avoid the problem of causing the color difference without affecting the alignment accuracy of the via hole 150 and the sensing electrode layer 130.

In summary, it should be noted that those skilled in the art can change the number of layers of the composite layer of the first shielding layer and/or the second shielding layer to meet different masking and appearance color diversity according to the needs of practical applications. In addition to providing a good shielding effect, the shielding layer of the touch panel provided by the present invention can meet the requirements of diversifying the color of the shielding layer. In addition, the design of the present invention can also avoid the problem that the sensing electrode layer is broken when extending to the shielding layer, and effectively increase the yield of the touch panel.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

100‧‧‧ touch panel

100A‧‧‧Sensor area

100B‧‧‧ surrounding area

110‧‧‧Substrate

120‧‧‧First masking layer

130‧‧‧Induction electrode layer

1301‧‧‧ Sensing part

1302‧‧‧Extension

140‧‧‧Second shelter

150‧‧‧through hole

160‧‧‧ Conductive filling layer

170‧‧‧Signal transmission layer

Claims (18)

A touch panel includes: a first shielding layer disposed on a first region of a surface of a substrate; a second shielding layer disposed on the first shielding layer and having a via hole; and a sensing electrode a layer is disposed on a second partial region of the surface of the substrate, and further extending between the first shielding layer and the second shielding layer, wherein a portion of the sensing electrode layer is exposed by the via hole; and A conductive filling layer is disposed in the via hole and electrically connected to the sensing electrode layer. The touch panel of claim 1, wherein the first shielding layer has an optical density value D1, the second shielding layer has an optical density value D2, and the conductive filling layer has an optical density value D3. Meet D1+D2 3 and D1+D3 3 shade conditions. The touch panel of claim 1, wherein the first shielding layer has a thickness of less than or equal to 25 um. The touch panel of claim 1, wherein the conductive filling layer material comprises a metal material, a non-metal material or a mixture thereof. If the application of the touch panel of patentable scope of item 1, wherein the cross-sectional area of vias 0.0625mm ² ~ 0.25mm ^2. The touch panel of claim 1, wherein the first shielding layer is a composite layer structure. The touch panel of claim 6, wherein the first shielding layer has a thickness of less than or equal to 25 um. The touch panel of claim 1 or 6, wherein the second shielding layer is a composite layer structure. The touch panel of claim 1, wherein the second shielding layer is a high reflectivity layer. The touch panel of claim 9, wherein the high reflectivity layer is a resin layer. The touch panel of claim 1, further comprising a signal transmission layer disposed on the second shielding layer and electrically connected to the conductive filling layer. The touch panel of claim 11, wherein the sensing electrode layer comprises a sensing portion and an extending portion, wherein the sensing portion is disposed on the second portion of the surface of the substrate, the extending portion is disposed On the first shielding layer. A method for manufacturing a touch panel includes the steps of: forming a first shielding layer on a first region of a surface of a substrate; forming a sensing electrode layer on a second region of the surface of the substrate, and extending and forming On the first shielding layer, a second shielding layer having a via hole is formed on the first shielding layer and the sensing electrode layer, wherein the via hole is exposed The sensing electrode layer; Forming a conductive filling layer in the via hole for electrically connecting the sensing electrode layer. The method of manufacturing a touch panel according to claim 13, wherein the first shielding layer has a thickness of less than or equal to 25 um. The method of manufacturing a touch panel according to claim 13, wherein the first shielding layer is a composite layer structure. The method of manufacturing a touch panel according to claim 15, wherein the thickness of the first shielding layer is less than or equal to 25 um. The method of manufacturing a touch panel according to claim 13 or 15, wherein the second shielding layer is a composite layer structure. The method for manufacturing a touch panel according to claim 13 further includes forming a signal transmission layer on the second shielding layer and electrically connecting the conductive filling layer.