TWI504070B - An improved ethernet module having a reduced host pcb footprint and dimensioned to correspond to a rear face of an rj connector jack - Google Patents

An improved ethernet module having a reduced host pcb footprint and dimensioned to correspond to a rear face of an rj connector jack Download PDF

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TWI504070B
TWI504070B TW099113453A TW99113453A TWI504070B TW I504070 B TWI504070 B TW I504070B TW 099113453 A TW099113453 A TW 099113453A TW 99113453 A TW99113453 A TW 99113453A TW I504070 B TWI504070 B TW I504070B
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ethernet
circuit module
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circuit board
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TW201138221A (en
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Dmitry Slepov
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具減少主印刷電路板覆蓋區且大小與連接器插座後側面相應之以太網路模組An Ethernet circuit module having a size that reduces the footprint of the main printed circuit board and corresponds to the rear side of the connector socket

本發明大體上與一種以太網路模組有關,其含有串列對以太網路(serial-to-Ethernet)轉換器模組以及可程式化的以太網路模組。更特定言之,本發明與一種節省空間的以太網路模組創新架構有關,其在已完備的以太網路裝置之主電路板上佔用的面積較少,且其尺寸係設計成與一般RJ連接器插座的後表面對應。The present invention is generally related to an Ethernet circuit module that includes a serial-to-Ethernet converter module and a programmable Ethernet circuit module. More specifically, the present invention relates to a space-saving Ethernet circuit module innovation architecture, which occupies less area on the main circuit board of a completed Ethernet circuit device, and its size is designed to be compared with a general RJ. The rear surface of the connector socket corresponds.

以太網路模組係為業界所熟知之裝置,這類模組係用於新產品之設計以及用於翻新具有以太網路介面之現有產品的應用中。Ethernet circuit modules are well-known devices in the industry for the design of new products and for retrofitting existing products with Ethernet interface.

以太網路模組通常用以使其主機產品具有「連網(network-enabled)」的功能,代表建置在主機產品中的以太網路模組會提供給主機產品一個網路介面(以以太網路介面之形式)。為求明確之故,文中係將整合有以太網路模組之主機產品稱為「已完備的」以太網路裝置。Ethernet circuit modules are usually used to make their host products have a "network-enabled" function. The Ethernet circuit modules built into the host products provide a network interface to the host products. The form of the network interface). For the sake of clarity, the main product in which the Ethernet circuit module is integrated is called a "completed" Ethernet device.

在以太網路模組的各種種類中,串列對以太網路轉換器模組係特別普遍,其原因在於需要連網功能的大部分產品皆會具有一中央處理單元(Central Processing Unit,CPU)或微控制器,且多數的CPU及微控制器係配備有用於串列通訊之通用非同步接收發送器(Universal Asynchronous Receiver and Transmitter,UART)電路。Among the various types of Ethernet circuit modules, serial-to-Ethernet converter modules are particularly popular because most products that require networking functions have a Central Processing Unit (CPU). Or a microcontroller, and most CPUs and microcontrollers are equipped with Universal Asynchronous Receiver and Transmitter (UART) circuits for serial communication.

串列對以太網路轉換器模組可使這類配備有CPU或微控制器之產品藉由串列資料與以太網路(TCP/IP)資料之間的無縫式轉換而快速、便宜地達到連網效果。The serial-to-Ethernet converter module enables such products equipped with CPUs or microcontrollers to be quickly and inexpensively converted by seamless conversion between serial data and Ethernet (TCP/IP) data. Reach the network effect.

另一種類型的以太網路模組則稱為可程式化以太網路模組。這類模組讓開發者可以將客製化的軟體程式(應用程式)載入模組中,該模組之後可作為已完備以太網路裝置的智能處理區塊,因而減輕了、或甚至完全省略該裝置的主要CPU或微控制器的負載。Another type of Ethernet circuit module is called a programmable Ethernet circuit module. This type of module allows developers to load custom software programs (applications) into modules that can then be used as intelligent processing blocks for completed Ethernet devices, thus reducing, or even completely The load of the main CPU or microcontroller of the device is omitted.

就本發明之訴求與目標而言,「以太網路模組」一詞同樣可應用到含有串列對以太網路轉換器模組與可程式化以太網路模組的所有模組種類。For the purposes and objectives of the present invention, the term "Ethernet Circuit Module" is equally applicable to all types of modules that include a serial pair Ethernet converter module and a programmable Ethernet circuit module.

第一圖表示了一典型的以太網路模組以及整合有該模組的已完備以太網路裝置的簡要區塊圖。The first figure shows a brief block diagram of a typical Ethernet road module and a completed Ethernet circuit device incorporating the module.

以太網路模組10一般係裝設在已完備的以太網路裝置11的主電路板(未示出)上,該以太網路模組10中整合有一CPU或微控制器12、資料匯流排13、以太網路控制器14、以及其他硬體15。該所述的其他硬體15包括隨機存取記憶體(Random Access Memory,RAM)、快閃記憶體、以及以太網路模組10運作所需的其他周邊裝置。這些周邊裝置的明細係與本發明之範疇和精神無關。The Ethernet circuit module 10 is generally installed on a main circuit board (not shown) of the completed Ethernet circuit device 11, and a CPU or a microcontroller 12 and a data bus are integrated in the Ethernet circuit module 10. 13. Ethernet path controller 14, and other hardware 15. The other hardware 15 includes a random access memory (RAM), a flash memory, and other peripheral devices required for the operation of the Ethernet circuit module 10. The details of these peripheral devices are not related to the scope and spirit of the present invention.

值得注意的是,現今市面上的某些CPU與微控制器都整合有以太網路控制器,因此功能區塊12與14可以被視為是一內部存有資料匯流排13的單一積體電路。It is worth noting that some CPUs and microcontrollers on the market today integrate Ethernet controllers, so functional blocks 12 and 14 can be considered as a single integrated circuit with data bus 13 stored therein. .

以太網路模組10具有數個接腳(引線)16,藉以耦合至主電路板及/或已完備的以太網路裝置11上的其他組件。更具體言之,以太網路模組10係耦合至RJ連接器插座17、以太網路狀態LED 20、模組狀態LED 26、以及外部(相對於以太網路模組10而言)硬體22。The Ethernet circuit module 10 has a plurality of pins (leads) 16 that are coupled to the main circuit board and/or other components on the completed Ethernet circuit device 11. More specifically, the Ethernet circuit module 10 is coupled to the RJ connector socket 17, the Ethernet path status LED 20, the module status LED 26, and the external (relative to the Ethernet path module 10) hardware 22 .

以太網路控制器14與RJ連接器插座17係藉由接收(Rx)與發送(Tx)線路對18而連結。此外,其中還具有一以太網路狀態LED控制線路19來驅動RJ連接器插座17的以太網路狀態LED 20。The Ethernet path controller 14 and the RJ connector socket 17 are connected by a receiving (Rx) and transmitting (Tx) line pair 18. In addition, there is also an Ethernet path status LED control line 19 for driving the Ethernet path status LED 20 of the RJ connector socket 17.

以太網路狀態LED 20一般係用於指示以太網路控制器14目前的連結狀態及連結模式。在上述的兩個LED中,一個一般是綠色的,另一個一般是黃色的。The Ethernet path status LED 20 is generally used to indicate the current connection status and connection mode of the Ethernet path controller 14. Of the two LEDs described above, one is generally green and the other is generally yellow.

雖然在圖中僅繪示有兩個單色的以太網路狀態LED 20,然應瞭解RJ連接器插座17中可建置更多的LED及(或)多色LED。或者,以太網路狀態LED 20可與該RJ連接器插座17分開實施、或完全不實施。所有這類的變化都與本發明之範疇及精神無關。Although only two monochrome Ethernet state LEDs 20 are shown in the figure, it should be understood that more LEDs and/or multi-color LEDs can be built into the RJ connector socket 17. Alternatively, the Ethernet way status LED 20 can be implemented separately from the RJ connector socket 17, or not at all. All such variations are not related to the scope and spirit of the invention.

以太網路模組10與外部硬體22係藉由輸入/輸出(I/O)線路21而連結。在部分場合中,該外部硬體22僅含有簡易的非智能型組件,如繼電器、光絕緣輸入器、類比-數位轉換器(Analog-to-digital Converter,ADC)或數位-類比轉換器(Digital-to-analog Converter,DAC)。這類非智慧型組件係由CPU或微控制器12加以控制。The Ethernet circuit module 10 and the external hardware 22 are connected by an input/output (I/O) line 21. In some cases, the external hardware 22 contains only simple, non-intelligent components such as relays, optically isolated inputs, analog-to-digital converters (ADCs), or digital-to-analog converters (Digital). -to-analog Converter, DAC). Such non-intelligent components are controlled by the CPU or microcontroller 12.

在其他的例子中,外部硬體22可能包含了一第二CPU或微控制器23,其通常為已完備的以太網路裝置11的主要(「主控(master)」)CPU或微控制器。In other examples, the external hardware 22 may include a second CPU or microcontroller 23, which is typically the primary ("master") CPU or microcontroller of the completed Ethernet device 11. .

I/O線路21可以多種的方式來實施,且其採用適合特定外部硬體22組的介面技術。該所述之I/O線路21可包含簡單的數位輸入/輸出線路、ADC與DAC線路、脈寬調變(Pulse-width Modulated,PWM)訊號線路等。The I/O line 21 can be implemented in a variety of ways, and it employs an interface technology that is suitable for a particular set of external hardware 22. The I/O line 21 can include a simple digital input/output line, an ADC and DAC line, a Pulse-Width Modulated (PWM) signal line, and the like.

在外部硬體22包含第二CPU或微控制器23的場合中,I/O線路21通常會含有串列埠線路;在此例中,CPU或微控制器12及第二CPU或微控制器23會使用串列通訊來與彼此互動。Where the external hardware 22 includes a second CPU or microcontroller 23, the I/O line 21 will typically contain a serial port; in this example, the CPU or microcontroller 12 and the second CPU or microcontroller 23 will use serial communication to interact with each other.

須注意在多數的設計中,這類串列通訊會符合RS232介面的時序,但其實體線路卻會是CMOS(Complementary Metal-Oxide Semiconductor,互補式金氧半導體)或TTL(Transistor-Transistor Logic,電晶體-電晶體邏輯)的形式。大部分現代的CPU與微控制器都會含有一或多個UART功能區塊24,因此其可在不具備任何額外的「黏合」(glue)元件條件下使CPU或微控制器12的UART 24與第二CPU或微控制器23的UART 24直接互連。It should be noted that in most designs, this type of serial communication will conform to the timing of the RS232 interface, but the physical line will be CMOS (Complementary Metal-Oxide Semiconductor) or TTL (Transistor-Transistor Logic). Form of crystal-transistor logic). Most modern CPUs and microcontrollers contain one or more UART function blocks 24, so they can make the UART 24 of the CPU or microcontroller 12 without any additional "glue" components. The UART 24 of the second CPU or microcontroller 23 is directly interconnected.

發明中亦可能採行其他的串列埠配置方式,舉例而言,CPU或微控制器12可能並未含有或未使用UART 24,而是由其他硬體15來含括此種UART。第二CPU或微控制器23的情形亦然。這類變化概與本發明之精神和範疇無關。Other serial port configurations may also be employed in the invention. For example, the CPU or microcontroller 12 may not include or use the UART 24, but other hardware 15 may include such a UART. The same is true for the second CPU or microcontroller 23. Such variations are not related to the spirit and scope of the present invention.

以太網路模組10通常含有數個模組狀態LED控制線路25,其驅動一組模組狀態LED 26用以指示以太網路模組目前的狀態。The Ethernet circuit module 10 typically includes a plurality of module status LED control lines 25 that drive a set of module status LEDs 26 to indicate the current state of the Ethernet circuit module.

模組狀態LED 26的功能並不會與以太網路狀態LED 20的功能混淆,以太網路狀態LED 20顯示了以太網路控制器14目前的連結狀態與連結模式;而模組狀態LED 26則提供了以太網路模組10整體狀態的指示。The function of the module status LED 26 is not confused with the function of the Ethernet status LED 20, which displays the current connection status and connection mode of the Ethernet controller 14, and the module status LED 26 An indication of the overall status of the Ethernet path module 10 is provided.

舉例而言,模組狀態LED 26可以指示以太網路模組10目前是處於閒置狀態、或是正以設定模式運行、或是已與網路上的另一裝置建立了TCP/IP連結等。For example, the module status LED 26 can indicate that the Ethernet path module 10 is currently idle, or is operating in a set mode, or has established a TCP/IP connection with another device on the network.

在實體上,典型的以太網路模組係可以如電路板的態樣來實行,其具有接腳或引線以裝設在已完備的以太網路裝置的主電路板上;這類模組的簡圖係繪示於第二圖中。Physically, a typical Ethernet circuit module can be implemented as a board, with pins or leads to be mounted on the main circuit board of a completed Ethernet device; The diagram is shown in the second figure.

以太網路模組10的特徵在於其包含一電路板100,其與裝設該電路板100之主電路板(未示出)大致平行。該電路板100具有兩個相對側101與102,且該兩側皆可用於裝設電子組件。The Ethernet circuit module 10 is characterized in that it includes a circuit board 100 that is substantially parallel to a main circuit board (not shown) on which the circuit board 100 is mounted. The circuit board 100 has two opposite sides 101 and 102, and both sides can be used to mount electronic components.

第二圖中表示了兩個這類的組件:CPU或微控制器12、以及以太網路控制器14。電路板100一般也會含有其他的硬體(未示出),如圖所示,裝置上有兩列接腳(引線)16將以太網路模組10連接至主電路板。該圖中所繪示的是通孔類型的接腳(引線),但例中也可使用其他形狀的SMT及接腳(引線)。Two such components are shown in the second figure: CPU or microcontroller 12, and Ethernet path controller 14. The circuit board 100 will also typically include other hardware (not shown). As shown, the device has two rows of pins (leads) 16 that connect the Ethernet circuit module 10 to the main circuit board. The figure shows a through-hole type of pin (lead), but other shapes of SMT and pins (leads) can be used in the example.

以太網路模組10係含有一外殼或殼體(未示出),其至少部分覆蓋住該電路板100以供裝飾、保護或散熱之用。The Ethernet circuit module 10 includes a housing or housing (not shown) that at least partially covers the circuit board 100 for decoration, protection or heat dissipation.

就本發明之訴求與目標而言,「以太網路模組」一詞同樣可應用在不具有外殼的以太網路模組、以及具有外殼的以太網路模組上。For the purposes and objectives of the present invention, the term "Ethernet Circuit Module" can also be applied to an Ethernet circuit module without a housing and an Ethernet circuit module having a housing.

以太網路模組在實體實作上有多種其他的變化例。舉例而言,美國第6,881,096號專利中揭露了一種直接整合在RJ連接器插座上的以太網路模組。There are many other variations of the Ethernet path module in physical implementation. For example, U.S. Patent No. 6,881,096 discloses an Ethernet circuit module that is directly integrated into an RJ connector socket.

在本發明中,典型的RJ連接器插座17架構對本發明而言特別重要。In the present invention, a typical RJ connector socket 17 architecture is particularly important to the present invention.

RJ連接器現今普遍地用在電信、數據連網設備、以及可連接至資料網路的裝置上。RJ連接器係採行一個公連接器插頭以及一個母連接器插座之設計。RJ connectors are commonly used today in telecommunications, data networking equipment, and devices that can be connected to data networks. The RJ connector is designed with a male connector plug and a female connector socket.

對於已完備的以太網路裝置而言,其母連接器插座一般係裝設在連網裝置上,且其以可供公連接器插頭插置之方式裸露出來。第三圖表示了一典型的連接器插座簡圖。For a completed Ethernet circuit device, the female connector socket is generally mounted on the networking device, and is exposed in such a manner that the male connector plug can be inserted. The third figure shows a typical connector socket schematic.

RJ連接器插座17的特徵在於其包含一大致呈矩形的介電外殼200,該外殼200具有一前表面201與一底表面203,該前表面201上具有一插座202以容置公連接器插頭(未示出),而該底表面203係用來裝設在主電路板(未示出)上。外殼200亦定義出一右表面204、左表面205、後表面206與頂表面207。The RJ connector socket 17 is characterized in that it comprises a substantially rectangular dielectric housing 200 having a front surface 201 and a bottom surface 203 having a socket 202 for receiving a male connector plug (not shown), and the bottom surface 203 is for mounting on a main circuit board (not shown). The outer casing 200 also defines a right surface 204, a left surface 205, a rear surface 206, and a top surface 207.

前表面201通常會含有或露出一對以太網路狀態LED 20。The front surface 201 will typically contain or expose a pair of Ethernet path status LEDs 20.

插座202含有閂鎖肩部208,其與插頭(未示出)上之閂鎖肩部一起構成該插頭與插座間可靠的接合機制。The receptacle 202 includes a latch shoulder 208 that, together with the latch shoulder on the plug (not shown), forms a secure engagement mechanism between the plug and the receptacle.

RJ連接器插座17亦整合有接腳或引線209。這些接腳或引線會在插座與主電路板之間傳導電性訊號。The RJ connector receptacle 17 also incorporates pins or leads 209. These pins or leads conduct electrical signals between the socket and the main board.

許多RJ連接器插座亦都具有包住外殼200的法拉第屏蔽體210。該屏蔽體210通常具有彈性偏載的接地片211位於其右表面204、左表面205以及頂表面207。該接地片211藉由與已完備的以太網路裝置殼體接觸之方式將法拉第屏蔽體連接至底盤(地表)接地。接地片會從插座的右側、左側與頂側突出,且稍微增加了插座的大小。Many RJ connector sockets also have a Faraday shield 210 that encases the outer casing 200. The shield 210 typically has a resiliently biased ground lug 211 on its right surface 204, left surface 205, and top surface 207. The grounding strip 211 connects the Faraday shield to the chassis (surface) ground by contacting the completed Ethernet circuit device housing. The grounding lugs protrude from the right, left, and top sides of the socket and slightly increase the size of the socket.

在建構上,RJ連接器插座的高度H1 與寬度W1 無法實質上加以減少是一個無可避免的事實,即使現代科技的快速進步已使其他電子組件大幅縮小。這是因為公連接器插頭具有其標準的尺寸,此即決定了插座可能的最小尺寸。In construction, it is an inevitable fact that the height H 1 and width W 1 of the RJ connector socket cannot be substantially reduced, even though the rapid advancement of modern technology has greatly reduced other electronic components. This is because the male connector plug has its standard size, which determines the smallest possible size of the socket.

現今業界已有數種作法來多少縮小RJ連接器插座的整體尺寸,這些作法多數著重於降低插座的高度H1 。舉例而言,美國專利第4,497,526號中揭露了一種高度較小的插座,其高度上的減少係藉由將閂鎖機制從插座移到已完備的以太網路裝置的外殼底表面上而達成。There are several ways in the industry to reduce the overall size of the RJ connector socket. Most of these practices focus on reducing the height H 1 of the socket. For example, a lower height socket is disclosed in U.S. Patent No. 4,497,526, the disclosure of which is incorporated herein by reference.

美國專利第5,378,172號揭露了一種低台設計(low-profile)的插座,其插座高度的減少是藉由將插座的閂鎖功能轉嫁到主電路板而達成。U.S. Patent No. 5,378,172 discloses a low-profile socket whose reduction in socket height is achieved by transferring the latching function of the socket to the main circuit board.

須注意,上述的改良對業界而言僅有些微的幫助,多數的RJ連接器插座一般仍是被建置在如第三圖所示之插座中。市場上甚至已經有非官方的RJ連接器插座尺寸「標準」。考量到設計公差並排除掉接地片211,這種非官方標準將高度H1 設定為約14mm,而寬度W1 約16mm。包含接地片211在內,「標準」高度H1 約為15mm,而「標準」寬度W1 約為17.5mm。現今所製造絕大多數的RJ連接器插座都具有上述寬度與高度。It should be noted that the above improvements are only slightly helpful to the industry, and most RJ connector sockets are still generally built into the socket as shown in the third figure. There are even unofficial RJ connector socket sizes "standard" on the market. Considering the design tolerances and eliminating the ground lug 211, this unofficial standard sets the height H 1 to about 14 mm and the width W 1 to about 16 mm. The "standard" height H 1 including the grounding piece 211 is about 15 mm, and the "standard" width W 1 is about 17.5 mm. Most RJ connector sockets manufactured today have the above width and height.

由於大部分的RJ連接器插座都具有「標準」的高度,故其通常決定了整合有該些RJ連接器插座的已完備以太網路裝置的高度。考量到現在大部分的電子組件皆為低台設計,使得RJ連接器插座會比電子電路的其他部位高出一截。如此已完備的以太網路裝置中會有一大部分的內部空間(一般位於RJ連接器插座後方)不會被用到。Since most RJ connector sockets have a "standard" height, they typically determine the height of a completed Ethernet device incorporating the RJ connector sockets. Considering that most of today's electronic components are low-profile, the RJ connector socket is a bit higher than the rest of the electronic circuit. A large portion of the internal space of such a completed Ethernet device (usually located behind the RJ connector socket) will not be used.

電子裝置持續小型化的結果造成了我們需要在印刷電路板上不斷提高組件設置的密度。當連網電子裝置的大小縮減時,以太網路模組的製造商就有壓力要縮小該模組在主電路板上所佔據的面積(footprint)。The continued miniaturization of electronic devices has created a need to continuously increase the density of component placement on printed circuit boards. When the size of the networked electronic device is reduced, the manufacturer of the Ethernet circuit module has the pressure to reduce the footprint of the module on the main circuit board.

上述問題會在以太網路模組開始逼近「尺寸減少的上限」時發生,其中有些模組甚至幾乎大到僅能勉強裝進整合有CPU或微控制器、以太網路控制器、記憶體、UART(s)與幾乎所有模組運作所需之其他組件的單一積體電路中。The above problems occur when the Ethernet circuit module starts to approach the "upper limit of size reduction". Some of the modules are almost even large enough to fit into the integrated CPU or microcontroller, Ethernet controller, memory, The UART(s) is in a single integrated circuit with almost all of the components required for module operation.

鑑於上述缺失,本發明之目的在於減少以太網路模組在主電路板上的佔板面積。本發明之另一目的在於增加該已完備之以太網路裝置的內部空間利用率。In view of the above-mentioned deficiencies, the object of the present invention is to reduce the footprint of an Ethernet circuit module on a main circuit board. Another object of the present invention is to increase the internal space utilization of the completed Ethernet circuit device.

本發明提出了一種用於已完備的以太網路裝置之以太網路模組,該已完備的以太網路裝置包含一主電路板以及裝設在該主電路板上的一連接器插座,其中該以太網路模組包含垂直裝設在該主電路板上的一電路板,該以太網路模組之尺寸係設計成與該連接器插座之一後側表面對應。The present invention provides an Ethernet circuit module for a completed Ethernet circuit device, the completed Ethernet circuit device comprising a main circuit board and a connector socket mounted on the main circuit board, wherein The Ethernet circuit module includes a circuit board vertically mounted on the main circuit board, and the Ethernet circuit module is sized to correspond to a rear side surface of the connector socket.

在本發明較佳具體實施例中,以太網路模組的電路板並非朝向與主電路板大致平行的方向。在本發明較佳具體實施例中,該電路板係朝向與主電路板垂直之方向。In a preferred embodiment of the invention, the circuit board of the Ethernet circuit module is not oriented in a direction substantially parallel to the main circuit board. In a preferred embodiment of the invention, the circuit board is oriented in a direction perpendicular to the main circuit board.

根據本發明較佳具體實施例,以太網路模組使用一積體電路,其包含CPU或微控制器、以太網路控制器、記憶體、UART(s)、以及I/O線路。該積體電路係裝設在以太網路模組的電路板之一第一側上。In accordance with a preferred embodiment of the present invention, an Ethernet circuit module uses an integrated circuit that includes a CPU or microcontroller, an Ethernet circuit controller, a memory, a UART(s), and an I/O line. The integrated circuit is mounted on a first side of one of the circuit boards of the Ethernet circuit module.

以太網路模組的電路板第二側係設想來讓一般以完備的以太網路模組電路所需之小型(或較小)的組件來佔置。The second side of the board of the Ethernet circuit module is envisioned to be typically occupied by the small (or smaller) components required for a complete Ethernet circuit module circuit.

發明中更設想該以太網路模組的電路之第二側含有一連接器,其包含大致平行於該以太網路模組電路板且大致垂直主電路板的接腳或引線。這些接腳或引線係用於將該以太網路模組裝設在主電路板上,並於以太網路模組與主電路板之間傳遞電性訊號。It is further contemplated in the invention that the second side of the circuitry of the Ethernet circuit module includes a connector that includes pins or leads that are substantially parallel to the Ethernet circuit module circuit board and that are substantially perpendicular to the main circuit board. These pins or leads are used to assemble the Ethernet circuit module on the main circuit board and transmit electrical signals between the Ethernet circuit module and the main circuit board.

根據本發明較佳具體實施例,本發明創新的以太網路模組之高度與寬度在考量到接地片的情況下可設計成不超過(或僅稍微超過)RJ連接器插座的「標準」寬度與高度。In accordance with a preferred embodiment of the present invention, the height and width of the inventive Ethernet circuit module can be designed to not exceed (or only slightly exceed) the "standard" width of the RJ connector socket, taking into account the grounding strip. With height.

本發明設想將以太網路模組係裝設在RJ連接器插座正後方的主電路板上。由於本發明以太網路模組之高度與寬度尺寸係設計成與RJ連接器插座的後側表面對應,故其將可有效率地利用已完備的以太網路裝置的內部空間。The invention envisages that the Ethernet circuit module is mounted on the main circuit board directly behind the RJ connector socket. Since the height and width dimensions of the Ethernet circuit module of the present invention are designed to correspond to the rear side surface of the RJ connector socket, it will be able to efficiently utilize the internal space of the completed Ethernet circuit device.

亦即,本發明創新之以太網路模組在主電路板上佔據了非常小的空間,且其利用了RJ以太網路插座後方可用的空間。That is, the inventive Ethernet circuit module occupies a very small space on the main circuit board, and it utilizes the space available behind the RJ Ethernet circuit socket.

在本發明另一具體實施例中,以太網路模組並未使用以引線封裝在標準外殼中的積體電路。在本發明該另一具體實施例中,以太網路模組係利用板上連接式(chip-on-board,COB)技術將一或多個矽晶粒固定在以太網路模組電路板的第一側與第二側。In another embodiment of the invention, the Ethernet circuit module does not use an integrated circuit that is packaged in a standard housing with leads. In another embodiment of the present invention, the Ethernet circuit module fixes one or more germanium dies on the Ethernet circuit module circuit board by using chip-on-board (COB) technology. The first side and the second side.

閱者在參照下述詳細說明並結合隨附圖式後將可進一步瞭解本發明的其他目的、特徵與優點。Other objects, features, and advantages of the present invention will become apparent from the accompanying drawings.

下列實施方式係參照如附圖式來詳細說明,該些圖式構成了本發明說明書之一部分,且其以圖說、具體實施例來表示本發明可據以實施之態樣與/或方式。The following embodiments are described in detail with reference to the accompanying drawings, which illustrate, FIG.

本發明具體實施例的詳細說明足使該領域之熟習技藝人士得以實施本發明,然須瞭解本發明可採用其他的具體實施例,亦須瞭解本發明可在不背離本發明之精神與範疇下加以變化。因此,以下的詳細說明並非作為限制之用,本發明之範疇係以其申請專利範圍及均等物來限定。The detailed description of the embodiments of the present invention is intended to be understood by those of ordinary skill in the art of the invention. Change it. Therefore, the following detailed description is not to be taken in a limiting

請參照第四圖至第六圖,其表示了本發明之具體實施例。Please refer to the fourth to sixth figures, which show specific embodiments of the present invention.

其中請特別參照第四圖,其繪示了根據本發明較佳具體實施例一以太網路模組的前視圖、側視圖及後側視圖。In particular, reference is made to the fourth figure, which shows a front view, a side view and a rear side view of an Ethernet circuit module in accordance with a preferred embodiment of the present invention.

本發明較佳具體實施例之以太網路模組係利用一積體電路300來實行,其整合有CPU或微控制器以及以太網路控制器。該積體電路亦可整合有儲存CPU程式(韌體)的快閃記憶體、儲存變數與數據的SRAM(Static Random Access Memory,靜態隨機記憶體)、普通的I/O線路、以及UART(s)。The Ethernet circuit module of the preferred embodiment of the present invention is implemented by an integrated circuit 300 that integrates a CPU or a microcontroller and an Ethernet path controller. The integrated circuit can also integrate a flash memory for storing a CPU program (firmware), a SRAM (Static Random Access Memory) for storing variables and data, a normal I/O line, and a UART (s ).

積體電路300的其中一實例為Luminary Micro(現為德州儀器所有)的LM3S8930部件。這種積體電路內整合有上方所列出的所有功能區塊。該電路可用於外型尺寸為16x16 mm、100-接腳的LQFP(low profile quad flat package,薄型四邊扁平式封裝)封裝結構中,或是用於外型尺寸為10x10 mm、108-焊球的BGA(Ball Grid Array,球閘陣列式)封裝結構中。One example of integrated circuit 300 is the LM3S8930 component of Luminary Micro (now owned by Texas Instruments). This integrated circuit incorporates all of the functional blocks listed above. The circuit can be used in a 16x16 mm, 100-pin LQFP (low profile quad flat package) package or for a 10x10 mm, 108-bump BGA (Ball Grid Array) package structure.

根據本發明較佳具體實施例,積體電路300係裝設在以太網路模組10的電路板100的第一側101上,電路板100的第一側101上可具有、或不具有其他電子部件裝設於其上。According to a preferred embodiment of the present invention, the integrated circuit 300 is mounted on the first side 101 of the circuit board 100 of the Ethernet circuit module 10, and the first side 101 of the circuit board 100 may or may not have other Electronic components are mounted thereon.

現在請參閱第五圖,該領域之熟習技藝人士將瞭解到電路板100的高度H2 與寬度W2 、並因而瞭解到根據本發明較佳具體實施例所架構出之以太網路模組10的整體高度與寬度係由積體電路300的外型大小所決定。Referring now to the fifth diagram, those skilled in the art will appreciate the height H 2 and width W 2 of the circuit board 100 and thus understand the Ethernet circuit module 10 constructed in accordance with a preferred embodiment of the present invention. The overall height and width are determined by the size of the integrated circuit 300.

對於外型尺寸為16×16mm的100-接腳LQFP封裝結構而言,電路板100的高度H2 與寬度W2 可製作成17×17mm般大小,此大小僅稍微超過RJ連接器插座(包括彈簧片)的「標準」高度H1 與寬度W1 。因此,根據本發明較佳具體實施例,雖然電路板100的高度H2 與寬度W2 可能大於RJ連接器插座的個別高度H1 與寬度W1 ,然其對應尺寸間的差異很小,不會實質增加已完備的以太網路裝置的高度和寬度。For a 100-pin LQFP package structure with a size of 16×16 mm, the height H 2 and the width W 2 of the circuit board 100 can be made to be 17×17 mm, which is only slightly larger than the RJ connector socket (including The "standard" height H 1 and width W 1 of the leaf spring). Therefore, according to a preferred embodiment of the present invention, although the height H 2 and the width W 2 of the circuit board 100 may be larger than the individual heights H 1 and W 1 of the RJ connector socket, the difference between the corresponding sizes is small, It will substantially increase the height and width of the completed Ethernet device.

當使用108-焊球的BGA封裝結構時,電路板100的整體尺寸實質上可進一步縮得比RJ連接器插座的對應尺寸更小。因此,根據本發明較佳具體實施例,電路板100的高度H2 與寬度W2 係比RJ連接器插座的個別高度H1 與寬度W1 更小。When a 108-bump BGA package structure is used, the overall size of the board 100 can be substantially further reduced to a smaller size than the corresponding size of the RJ connector socket. Thus, in accordance with a preferred embodiment of the present invention, the height H 2 and width W 2 of the circuit board 100 are smaller than the individual height H 1 and width W 1 of the RJ connector receptacle.

在上述兩種情況下,以太網路模組10的尺寸都可藉由下列方式來決定:選擇積體電路300合適的封裝結構並將電路板100的尺寸設計成實質上分別與RJ連接器插座的高度與寬度相同、或是設計成分別小於RJ連接器插座之高度與寬度、或是設計成分別大於RJ連接器插座之高度與寬度但實質上不增加已完備的以太網路裝置的高度與寬度。In both cases, the size of the Ethernet circuit module 10 can be determined by selecting the appropriate package structure of the integrated circuit 300 and dimensioning the circuit board 100 to substantially separate the RJ connector sockets. The height and width are the same, or are designed to be smaller than the height and width of the RJ connector socket, respectively, or designed to be greater than the height and width of the RJ connector socket, respectively, without substantially increasing the height of the completed Ethernet device width.

須注意文中所使用之特定積體電路部件數量與封裝類型係僅為說明之用,其不應被視為是對本發明任何形式上的限制。本發明中亦可使用現有多種其他的積體電路,且這些積體電路可用於許多的封裝選項中。It is to be noted that the specific number of integrated circuit components and package types used herein are for illustrative purposes only and are not to be considered as limiting the scope of the invention. A variety of other integrated circuits are also available in the present invention, and these integrated circuits can be used in many package options.

其他已完備以太網路模組10電路所需之大部分的電子組件係裝設在第二側102上,該第二側102上亦裝設有連接器303。該連接器303包含了複數個接腳或引線16,其用於將以太網路模組10裝設在主電路板(未示出)上,並於該以太網路模組10與主電路板間傳遞電性訊號。這些接腳或引線16會被設置成與電路板100大致平行且與主電路板大致垂直的形式。Most of the electronic components required for the other completed Ethernet circuit module 10 circuits are mounted on the second side 102, and the second side 102 is also provided with a connector 303. The connector 303 includes a plurality of pins or leads 16 for mounting the Ethernet circuit module 10 on a main circuit board (not shown), and the Ethernet circuit module 10 and the main circuit board. Transfer electrical signals between. These pins or leads 16 will be disposed generally parallel to the circuit board 100 and generally perpendicular to the main circuit board.

連接器303係設計成以表面黏著方式(suface mounting)固定在電路板100的第二側102上,連接器303的塑膠部304亦是以此方式來設計,而整個連接器303以這樣的形式設置在電路板100上,以使塑膠部304完全處於電路板100的邊界內部,使得電路板100的整體高度H2 最小化。The connector 303 is designed to be attached to the second side 102 of the circuit board 100 in a surface mount manner. The plastic portion 304 of the connector 303 is also designed in this manner, and the entire connector 303 is in this form. It is disposed on the circuit board 100 such that the plastic portion 304 is completely inside the boundary of the circuit board 100 such that the overall height H 2 of the circuit board 100 is minimized.

須注意根據本發明較佳具體實施例,以太網路模組亦可能包含一外殼(未圖示),這類外殼可由塑膠、金屬片衝壓、或其他合適的材質與/或方式製成。It should be noted that in accordance with a preferred embodiment of the present invention, the Ethernet circuit module may also include a housing (not shown) that may be fabricated from plastic, sheet metal stamping, or other suitable material and/or manner.

外殼主要的功用在於作為一法拉第屏蔽體之用、或作為電路板與其組件之散熱體、或僅為裝飾之用。該外殼係完全包覆電路板100或僅部分覆蓋該電路板。所有這類的變化例都屬於本發明之範疇與精神。The main function of the housing is as a Faraday shield, or as a heat sink for the board and its components, or just for decoration. The outer casing completely covers the circuit board 100 or only partially covers the circuit board. All such variations are within the scope and spirit of the invention.

現在請參閱第五圖,其繪示出一主電路板400、一「標準」RJ連接器插座17、及根據本發明較佳具體實施例之一以太網路模組10,其中該以太網路模組10係裝設在該RJ連接器插座17後方。Referring now to the fifth drawing, a main circuit board 400, a "standard" RJ connector socket 17, and an Ethernet circuit module 10 according to a preferred embodiment of the present invention are illustrated, wherein the Ethernet circuit The module 10 is mounted behind the RJ connector socket 17.

該領域之熟習技藝人士將可立即領會到根據本發明較佳具體實施例所建置之以太網路模組10在利用了RJ連接器插座17後方的可用空間後其本身在主電路板400上的佔板面積已達到最小。該以太網路模組10的高度H2 與寬度W2 係與RJ連接器插座17的高度H1 與寬度W1 密切對應。Those skilled in the art will immediately appreciate that the Ethernet circuit module 10 constructed in accordance with a preferred embodiment of the present invention is itself on the main circuit board 400 after utilizing the available space behind the RJ connector socket 17. The footprint of the board has been minimized. The height H 2 and the width W 2 of the Ethernet circuit module 10 closely correspond to the height H 1 of the RJ connector socket 17 and the width W 1 .

現在請參閱第六圖,其繪示了本發明另一具體實施例中一以太網路模組的前視圖、側視圖與後視圖。Referring now to the sixth drawing, there is shown a front view, a side view and a rear view of an Ethernet circuit module in another embodiment of the present invention.

在本發明該另一具體實施例中,以太網路模組10並未使用積體電路300。在該具體實施例中,以太網路模組10係利用板上連接式晶片(Chip-on-Board,COB)技術來將一或多個封裝後的矽晶粒500裝設在電路板100的第一側101上,必要時亦可裝設在其第二側102上。In another embodiment of the invention, the Ethernet circuit module 10 does not use the integrated circuit 300. In this embodiment, the Ethernet circuit module 10 utilizes Chip-on-Board (COB) technology to mount one or more packaged germanium die 500 on the circuit board 100. The first side 101 can also be mounted on its second side 102 if desired.

該領域之熟習技藝人士將可瞭解板上連接式晶片技術的使用可進一步降低以太網路模組10的成本與大小。Those skilled in the art will appreciate that the use of on-board bonded wafer technology can further reduce the cost and size of the Ethernet circuit module 10.

須注意本發明中所使用之矽晶粒數量、其於電路板100上的位置、封裝在一起的晶粒數目、以及用於晶粒封裝的形狀與材料等特徵都可加以改變,而第六圖所示特定的晶粒排列設置並不應被視為是對本發明範疇任何形式上的限制。It should be noted that the number of germanium grains used in the present invention, the position on the circuit board 100, the number of crystal grains packaged together, and the shape and material used for the die package can be changed, and the sixth The particular arrangement of crystal grains shown in the figures should not be construed as limiting the scope of the invention in any way.

雖然本發明係以目前被認為最實用及較佳的具體實施例來加以描述,然應瞭解本發明不需受限於所揭露之具體實施例;相反的,本發明意欲涵蓋所附申請專利範圍之精神與範疇內的各種修改與相似的配置,其應予以最廣義的解釋以涵蓋所有這類的修改與類似結構。Although the present invention has been described with respect to the preferred embodiments of the present invention, it is understood that the invention is not limited to the specific embodiments disclosed; rather, the invention is intended to cover the scope of the appended claims. The various modifications and similar configurations within the spirit and scope of the invention are to be interpreted in the broadest sense to cover all such modifications and similar structures.

10...以太網路模組10. . . Ethernet circuit module

11...以太網路裝置11. . . Ethernet road device

12...CPU或微處理器12. . . CPU or microprocessor

13...資料匯流排13. . . Data bus

14...以太網路控制器14. . . Ethernet road controller

15...硬體15. . . Hardware

16...接腳/引線16. . . Pin/lead

17...RJ連接器插座17. . . RJ connector socket

18...接收與發送線路對18. . . Receiving and transmitting line pairs

19...以太網路狀態LED控制線路19. . . Ethernet road status LED control line

20...以太網路狀態LED20. . . Ethernet road status LED

21...I/O線路twenty one. . . I/O line

22...外部硬體twenty two. . . External hardware

23...CPU或微處理器twenty three. . . CPU or microprocessor

24...UARTtwenty four. . . UART

25...模組狀態LED控制線路25. . . Module status LED control circuit

26...模組狀態LED26. . . Module status LED

100...電路板100. . . Circuit board

101...第一側101. . . First side

102...第二側102. . . Second side

200...外殼200. . . shell

201...前表面201. . . Front surface

202...插座202. . . socket

203...底表面203. . . Bottom surface

204...右表面204. . . Right surface

205...左表面205. . . Left surface

206...後比面206. . . Post-surface

207...頂表面207. . . Top surface

208...閂鎖肩部208. . . Latching shoulder

209...接腳/引線209. . . Pin/lead

210...屏蔽體210. . . Shield

211...接地片211. . . Grounding piece

300...積體電路300. . . Integrated circuit

303...連接器303. . . Connector

304...塑膠部304. . . Plastic department

400...主電路板400. . . Main circuit board

500...晶粒500. . . Grain

第一圖為習知技術中一典型的以太網路模組以及以該以太網路模組為基礎的已完備以太網路裝置之簡要區塊圖。The first figure is a typical block diagram of a typical Ethernet circuit module in the prior art and a completed Ethernet circuit device based on the Ethernet circuit module.

第二圖為習知技術中典型的以太網路模組的簡圖。The second figure is a simplified diagram of a typical Ethernet circuit module in the prior art.

第三圖表示了習知技術中典型的RJ連接器插座的簡要架構。The third figure shows a simplified architecture of a typical RJ connector socket in the prior art.

第四圖為根據本發明較佳具體實施例以太網路模組的示意圖。The fourth figure is a schematic diagram of an Ethernet circuit module in accordance with a preferred embodiment of the present invention.

第五圖為根據本發明較佳具體實施例一主電路板、一「標準」RJ連接器插座、及一固定在該RJ連接器插座後方之以太網路模組的示意圖。Figure 5 is a schematic diagram of a main circuit board, a "standard" RJ connector socket, and an Ethernet circuit module secured to the rear of the RJ connector socket in accordance with a preferred embodiment of the present invention.

第六圖為根據本發明另一具體實施例之一以太網路模組之示意圖。Figure 6 is a schematic diagram of an Ethernet circuit module in accordance with another embodiment of the present invention.

10...以太網路模組10. . . Ethernet circuit module

17...RJ連接器插座17. . . RJ connector socket

400...主電路板400. . . Main circuit board

Claims (12)

一種用於已完備的以太網路裝置之以太網路模組,該已完備的以太網路裝置包含:一主電路板以及裝設於該主電路板上的一連接器插座;其中該以太網路模組藉由可垂直裝設於該主電路板上的單一電路板完成以太網路資料處理,且該單一電路板之尺寸係設計成與該連接器插座之一外殼的一後側表面對應;其中該單一電路板係設置於該連接器插座之該外殼的外部,且係位在該外殼的該後側表面之後方;以及其中該以太網路模組非與該連接器插座機械組合,且該以太網路模組係僅藉由該主電路板上之電線耦合至該連接器插座。 An Ethernet circuit module for a completed Ethernet circuit device, the completed Ethernet circuit device comprising: a main circuit board and a connector socket mounted on the main circuit board; wherein the Ethernet The circuit module performs Ethernet path data processing by a single circuit board vertically mounted on the main circuit board, and the single circuit board is sized to correspond to a rear side surface of one of the connector sockets Wherein the single circuit board is disposed outside the outer casing of the connector socket and is located behind the rear side surface of the outer casing; and wherein the Ethernet circuit module is not mechanically combined with the connector socket And the Ethernet circuit module is coupled to the connector socket only by wires on the main circuit board. 如申請專利範圍第1項所述之以太網路模組,其中該以太網路模組之尺寸係設計成具有一高度與一寬度,其實質上分別與該連接器插座之高度與寬度相等。 The Ethernet circuit module of claim 1, wherein the Ethernet circuit module is sized to have a height and a width that are substantially equal to the height and width of the connector socket, respectively. 如申請專利範圍第1項所述之以太網路模組,其中該以太網路模組之尺寸係設計成具有一高度與一寬度,其分別小於該連接器插座之高度與寬度。 The Ethernet circuit module of claim 1, wherein the Ethernet circuit module is sized to have a height and a width that are respectively smaller than a height and a width of the connector socket. 如申請專利範圍第1項所述之以太網路模組,其中該以太網路模組之尺寸係設計成具有一高度與一寬度,該高度與寬度分別大於該連接器插座之高度與寬度,但實質上不增加該已完備的以太網路裝置之高度 與寬度。 The Ethernet circuit module of claim 1, wherein the Ethernet circuit module is sized to have a height and a width respectively greater than a height and a width of the connector socket. But does not substantially increase the height of the completed Ethernet device With width. 如申請專利範圍第1項所述之以太網路模組,更包含一積體電路,其中該積體電路包含一中央處理單元或一微控制器。 The Ethernet circuit module of claim 1, further comprising an integrated circuit, wherein the integrated circuit comprises a central processing unit or a microcontroller. 如申請專利範圍第5項所述之以太網路模組,其中該積體電路更包含一以太網路控制器。 The Ethernet circuit module of claim 5, wherein the integrated circuit further comprises an Ethernet path controller. 如申請專利範圍第6項所述之以太網路模組,其中該積體電路更包含一通用非同步接收發送器。 The Ethernet circuit module of claim 6, wherein the integrated circuit further comprises a universal asynchronous receiving transmitter. 如申請專利範圍第1項所述之以太網路模組,更包含固定於該電路板上之一或多個矽晶粒。 The Ethernet circuit module of claim 1, further comprising one or more germanium dies fixed on the circuit board. 如申請專利範圍第1項所述之以太網路模組,其中該電路板係至少部分為一外殼所覆蓋。 The Ethernet circuit module of claim 1, wherein the circuit board is at least partially covered by a casing. 如申請專利範圍第1項所述之以太網路模組,其中該電路板之尺寸係設計成具有一高度與一寬度,該高度與寬度實質上分別與該連接器插座之高度與寬度相等。 The Ethernet circuit module of claim 1, wherein the circuit board is sized to have a height and a width substantially equal to the height and width of the connector socket, respectively. 如申請專利範圍第1項所述之以太網路模組,其中該電路板之尺寸係設計成具有一高度與一寬度,其分別小於該連接器插座之高度與寬度。 The Ethernet circuit module of claim 1, wherein the circuit board is sized to have a height and a width which are respectively smaller than a height and a width of the connector socket. 如申請專利範圍第1項所述之以太網路模組,其中該電路板之尺寸係設計成具有一高度與一寬度,其分別大於該連接器插座之高度與寬度,但實質上不增加該已完備的以太網路裝置之高度與寬度。 The Ethernet circuit module of claim 1, wherein the circuit board is sized to have a height and a width respectively greater than a height and a width of the connector socket, but substantially not increasing The height and width of the completed Ethernet device.
TW099113453A 2010-04-28 2010-04-28 An improved ethernet module having a reduced host pcb footprint and dimensioned to correspond to a rear face of an rj connector jack TWI504070B (en)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
US5754764A (en) * 1994-02-22 1998-05-19 National Semiconductor Corp. Combination of input output circuitry and local area network systems
US20030194908A1 (en) * 2002-04-15 2003-10-16 Brown Curtis D. Compact serial -to ethernet conversion port
TW200820522A (en) * 2006-10-23 2008-05-01 Xmultiple Technology Inc Multiple function RJ connector with split internal housing opening cavity
TW200941837A (en) * 2008-03-20 2009-10-01 Aten Int Co Ltd UART/USB converting apparatus
TWM372006U (en) * 2009-05-25 2010-01-01 Hon Hai Prec Ind Co Ltd Modular jack connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754764A (en) * 1994-02-22 1998-05-19 National Semiconductor Corp. Combination of input output circuitry and local area network systems
US20030194908A1 (en) * 2002-04-15 2003-10-16 Brown Curtis D. Compact serial -to ethernet conversion port
TW200820522A (en) * 2006-10-23 2008-05-01 Xmultiple Technology Inc Multiple function RJ connector with split internal housing opening cavity
TW200941837A (en) * 2008-03-20 2009-10-01 Aten Int Co Ltd UART/USB converting apparatus
TWM372006U (en) * 2009-05-25 2010-01-01 Hon Hai Prec Ind Co Ltd Modular jack connector

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