TWI501487B - Coaxial connector - Google Patents
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- TWI501487B TWI501487B TW102126189A TW102126189A TWI501487B TW I501487 B TWI501487 B TW I501487B TW 102126189 A TW102126189 A TW 102126189A TW 102126189 A TW102126189 A TW 102126189A TW I501487 B TWI501487 B TW I501487B
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Description
本發明係關於一種具備具有筒狀部之外部導體、及與該外部導體呈同軸地配置之中心導體，並表面構裝於電路基板之同軸連接器。The present invention relates to a coaxial connector including an outer conductor having a tubular portion and a center conductor disposed coaxially with the outer conductor and having a surface mounted on the circuit board.
行動電話或筆記型PC、平板型PC等之電子機器或電氣機器，具備有各種之電連接器。於電連接器連接各種之訊號傳送媒介例如同軸纜線、扁平纜線或可撓性纜線，於該電子機器之內部或於該電子機器與外部機器之間，進行電氣訊號或電力之傳送接收。作為如此之電連接器之一種，已知有表面構裝於印刷電路基板之同軸連接器(插座連接器)。Electronic devices or electrical devices such as mobile phones, notebook PCs, and tablet PCs have various electrical connectors. The electrical connector is connected to various signal transmission media such as a coaxial cable, a flat cable or a flexible cable, and the electrical signal or power transmission and reception is performed inside the electronic device or between the electronic device and the external device. . As one of such electrical connectors, a coaxial connector (socket connector) having a surface mounted on a printed circuit board is known.
同軸連接器，一般而言具備具有筒狀部之外部導體、及與該筒狀部呈同軸地配置之中心導體，且於外部導體與中心導體之間配置樹脂成形體而構成。此外，外部導體與中心導體之底面，與印刷電路基板接觸並焊接於該印刷電路基板。The coaxial connector generally includes an outer conductor having a tubular portion and a center conductor disposed coaxially with the tubular portion, and a resin molded body disposed between the outer conductor and the center conductor. Further, the outer conductor and the bottom surface of the center conductor are in contact with and soldered to the printed circuit board.
樹脂成形體，係於樹脂成形模具內安裝外部導體與中心導體，並於該樹脂成形模具之內部填充樹脂而成形，但於將同軸連接器焊接於印刷電路基板時產生熱應變，而於樹脂成形體與外部導體之間產生微細之間隙。因此，存在有因熔解之焊料通過該微細之間隙而往樹脂成形體之上面滲出之現象亦即毛細管現象而導致產生焊料滲溢(solder wicking)之情況。焊料滲溢成為與對象方連接器之電連接不良等之原因。The resin molded body is formed by attaching an outer conductor and a center conductor to a resin molding die, and molding the inside of the resin molding die with a resin. However, when the coaxial connector is soldered to the printed circuit board, thermal strain is generated, and the resin is molded. A fine gap is created between the body and the outer conductor. Therefore, there is a case where solder which is caused by the molten solder oozing out through the fine gap to the upper surface of the resin molded body, that is, a capillary phenomenon, causes solder wicking. The solder bleed is a cause of poor electrical connection with the target connector.
尤其是近年來，同軸連接器亦被要求小型化、低背化，而降低樹脂成形體之高度，且縮小印刷電路基板之構裝面與樹脂成形體之上面之距離。因此，使得易於產生焊料滲溢。In particular, in recent years, the coaxial connector has been required to be downsized and low-profile, and the height of the resin molded body is lowered, and the distance between the mounting surface of the printed circuit board and the upper surface of the resin molded body is reduced. Therefore, it is easy to generate solder bleed.
抑制同軸連接器之焊料滲溢之發明，已被提出有若干個。例如，於專利文獻1所揭示之同軸連接器，具有具有筒狀部之外部導體、及與該筒狀部呈同軸地配置之中心導體，且透過經樹脂成形之介電體(樹脂成形體)而相互地保持兩導體，並於中心導體之與介電體(樹脂成形體)接觸之面形成有突出部、沒入部。The invention of suppressing solder leakage of a coaxial connector has been proposed in several cases. For example, the coaxial connector disclosed in Patent Document 1 has an outer conductor having a tubular portion and a center conductor disposed coaxially with the tubular portion, and transmits a resin-molded dielectric body (resin molded body) On the other hand, the two conductors are held together, and a protruding portion and an immersed portion are formed on the surface of the center conductor that is in contact with the dielectric body (resin molded body).
此外，於專利文獻2所揭示之同軸連接器，係由合成樹脂製之殼(下側絕緣殼與上側絕緣殼)、金屬製之固定端子、可動端子及外部端子構成，且於下側絕緣殼(樹脂成形體)形成有分別收納固定端子與可動端子之缺口部。而且，該缺口部，於兩端子之引線(lead)部(基板連接部)與下側絕緣殼之間，具有不產生毛細管現象之程度之間隙(clearance)。Further, the coaxial connector disclosed in Patent Document 2 is composed of a synthetic resin case (a lower insulating case and an upper insulating case), a metal fixed terminal, a movable terminal, and an external terminal, and is disposed on the lower insulating case. (Resin molded body) is formed with a notch portion that accommodates the fixed terminal and the movable terminal, respectively. Further, the notch portion has a clearance between the lead portion (substrate connection portion) of the two terminals and the lower insulating case to the extent that no capillary phenomenon occurs.
專利文獻1：日本特開2004-221055號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-221055
專利文獻2：日本特開2001-176612號公報Patent Document 2: Japanese Laid-Open Patent Publication No. 2001-176612
專利文獻1之同軸連接器，係於中心導體之與介電體(樹脂成形體)接觸之面形成突出部、沒入部，使中心導體與介電體(樹脂成形體)之間之保持力提高，而即使受到焊接之熱亦不會於中心導體與介電體(樹脂成形體)之間產生微細之間隙，但於外部導體與介電體(樹脂成形體)之間未實施如此之對策。因此，於外部導體與介電體(樹脂成形體)之間存在有產生焊料滲溢之可能性。In the coaxial connector of the patent document 1, the protruding portion and the immersed portion are formed on the surface of the center conductor that is in contact with the dielectric body (resin molded body), and the holding force between the center conductor and the dielectric body (resin molded body) is improved. However, even if heat is applied, a fine gap is not formed between the center conductor and the dielectric body (resin molded body), but no such countermeasure is taken between the outer conductor and the dielectric body (resin molded body). Therefore, there is a possibility that solder leakage occurs between the outer conductor and the dielectric body (resin molded body).
此外，專利文獻2之同軸連接器，雖係於設置於下側絕緣殼(介電體)之缺口部與兩端子(固定端子、可動端子)之間，設定不產生毛細管現象之程度之間隙，而抑制焊料滲溢，但由於近期之同軸連接器被強烈要求小型化、低背化，因此無法輕鬆地設定間隙。也就是，設定如此之間隙與小型化、低背化之要求相矛盾。Further, the coaxial connector of Patent Document 2 is provided between the notch portion of the lower insulating case (dielectric body) and the two terminals (fixed terminal, movable terminal), and is set to a gap that does not cause capillary phenomenon. However, the solder leakage is suppressed, but since the recent coaxial connector is strongly required to be miniaturized and low-profile, the gap cannot be easily set. That is, setting such a gap contradicts the requirements of miniaturization and low-profile.
本發明係鑒於上述情況而完成者，其目的在於提供一種於外部導體與樹脂成形體之間難以產生焊料滲溢，且適於小型化、低背化之同軸連接器。The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a coaxial connector which is less likely to cause solder leakage between an outer conductor and a resin molded body, and which is suitable for downsizing and low-profile.
為達成上述目的，本發明之同軸連接器，具備：外部導體，係具有筒狀部、與印刷電路基板接觸並焊接之基板連接部、及將該基板連接部與該筒狀部電連結之連結部；中心導體，係與該筒狀部呈同軸地配置於該外部導體之筒狀部之內部空間；及樹脂成形體，係填充於該筒狀部之內部空間並使該外部導體與該中心導體電絕緣；並表面構裝於電路基板，其特徵在於：於該連結部，開設有從該筒狀部之內部空間貫通至該筒狀部之外部之貫通孔。In order to achieve the above object, a coaxial connector according to the present invention includes an outer conductor having a tubular portion, a substrate connecting portion that is in contact with and soldered to the printed circuit board, and a connection that electrically connects the substrate connecting portion and the tubular portion. a central conductor disposed coaxially with the tubular portion in an inner space of the tubular portion of the outer conductor; and a resin molded body filled in an inner space of the tubular portion and the outer conductor and the center The conductor is electrically insulated and is surface-mounted on the circuit board. The connecting portion is provided with a through hole penetrating from the internal space of the tubular portion to the outside of the tubular portion.
該連結部之內側端面之該貫通孔之剖面積，亦可大於該連結部之外側端面之該貫通孔之剖面積。The cross-sectional area of the through hole of the inner end surface of the connecting portion may be larger than the cross-sectional area of the through hole at the outer end surface of the connecting portion.
該樹脂成形體之一部分，亦可成形於該筒狀部之外部，該一部分亦可通過該貫通孔並與位於該筒狀部之內部空間之該樹脂成形體連續。A part of the resin molded body may be formed outside the cylindrical portion, and the portion may pass through the through hole and be continuous with the resin molded body located in the inner space of the cylindrical portion.
於該筒狀部之該電路基板側之端面，亦可形成有將該筒狀部之內部與外部連結之溝槽。A groove that connects the inside and the outside of the tubular portion may be formed on the end surface of the tubular portion on the circuit board side.
該樹脂成形體之一部分，亦可成形於該筒狀部之外部，該一部分亦可通過該溝槽並與位於該筒狀部之內部空間之該樹脂成形體連續。A part of the resin molded body may be formed outside the cylindrical portion, and the portion may pass through the groove and be continuous with the resin molded body located in the inner space of the cylindrical portion.
根據本發明，由於可在具備外部導體與樹脂成形體之同軸連接器中，使外部導體與樹脂成形體之間之保持力提高，因此能夠提供一種即使受到焊接之熱，亦難以於外部導體與樹脂成形體產生微細之間隙，也就是難以於外部導體與樹脂成形體之間產生焊料滲溢，並提高電連接可靠性，且適於小型化、低背化之同軸連接器。According to the present invention, since the holding force between the outer conductor and the resin molded body can be improved in the coaxial connector including the outer conductor and the resin molded body, it is possible to provide a heat conductor which is difficult to be bonded to the outer conductor. The resin molded body has a fine gap, that is, a coaxial connector which is difficult to cause solder leakage between the outer conductor and the resin molded body, improves electrical connection reliability, and is suitable for downsizing and low-profile.
1‧‧‧同軸連接器1‧‧‧ coaxial connector
2‧‧‧外部導體2‧‧‧External conductor
3‧‧‧中心導體3‧‧‧Center conductor
4‧‧‧樹脂成形體4‧‧‧Resin molded body
21‧‧‧筒狀部21‧‧‧Cylinder
22、23、24‧‧‧基板連接部22, 23, 24‧‧ ‧ substrate connection
25a、25b、25c‧‧‧貫通孔25a, 25b, 25c‧‧‧through holes
26、27、28‧‧‧連結部26, 27, 28‧ ‧ link
29‧‧‧下端緣部29‧‧‧Bottom edge
29a、29b、29c、29d‧‧‧溝槽29a, 29b, 29c, 29d‧‧‧ trench
31‧‧‧基板連接部31‧‧‧Substrate connection
32‧‧‧接觸部32‧‧‧Contacts
101‧‧‧主印刷電路基板101‧‧‧Main printed circuit board
211‧‧‧接觸部211‧‧‧Contacts
圖1，係表示本發明之實施形態之同軸連接器之使用狀態之立體圖。Fig. 1 is a perspective view showing a state of use of a coaxial connector according to an embodiment of the present invention.
圖2，係同軸連接器之俯視圖。Figure 2 is a top plan view of a coaxial connector.
圖3，係同軸連接器之仰視圖。Figure 3 is a bottom plan view of the coaxial connector.
圖4A，係以圖2之AA線切斷同軸連接器裝置之剖面圖。4A is a cross-sectional view of the coaxial connector device taken along line AA of FIG. 2.
圖4B，係以圖2之BB線切斷同軸連接器裝置之剖面圖。4B is a cross-sectional view showing the coaxial connector device cut along line BB of FIG. 2.
圖5A，係從上方觀察外部導體之立體圖。Fig. 5A is a perspective view of the outer conductor as viewed from above.
圖5B，係從下方觀察外部導體之立體圖。Fig. 5B is a perspective view of the outer conductor as viewed from below.
以下，對用以實施本發明之最佳形態，一邊參照圖式一邊詳細地進行說明。Hereinafter, the best mode for carrying out the invention will be described in detail with reference to the drawings.
同軸連接器1，係本發明之實施形態之例示，如圖1所示般，係表面構裝於主印刷電路基板101之插座連接器，且具備嵌合或拔去未圖示之同軸插頭連接器之構造。此外，如圖1至圖3所示，同軸連接器1，係 由外部導體2、中心導體3及樹脂成形體4所構成。另外於以下，於本說明書中，將同軸連接器1之與主印刷電路基板101相接之面稱為同軸連接器1之「底面」，將與主印刷電路基板101分離之面稱為同軸連接器1之「上面」。而且，將從「底面」朝向「上面」之方向稱為「上方向」，將從「上面」朝向「底面」之方向稱為「下方向」。例如，將該同軸插頭連接器從同軸連接器1之「上面」朝向「下方向」插入，且往「上方向」拔去。The coaxial connector 1 is an example of an embodiment of the present invention, and as shown in FIG. 1, the surface is mounted on a socket connector of the main printed circuit board 101, and is provided with a coaxial plug connection that is not shown or removed. The construction of the device. In addition, as shown in FIGS. 1 to 3, the coaxial connector 1 is The outer conductor 2, the center conductor 3, and the resin molded body 4 are formed. In the present specification, the surface of the coaxial connector 1 that is in contact with the main printed circuit board 101 is referred to as the "bottom surface" of the coaxial connector 1, and the surface separated from the main printed circuit board 101 is referred to as a coaxial connection. The "above" of the device 1. Further, the direction from "bottom" to "upper" is referred to as "upward direction", and the direction from "upper" to "bottom" is referred to as "downward direction". For example, the coaxial plug connector is inserted from the "upper side" of the coaxial connector 1 toward the "downward direction" and is pulled out in the "upward direction".
[外部導體]外部導體2，係與該同軸插頭連接器之外部導體接觸之金屬零件，並由衝壓加工金屬板而成形。此外，外部導體2，具有供該同軸插頭連接器插入之筒狀部21、及焊接於主印刷電路基板101之未圖示之配線圖案之基板連接部22,23,24。另外，關於外部導體2之詳細形狀，將於後述。[External Conductor] The outer conductor 2 is a metal part that is in contact with the outer conductor of the coaxial plug connector, and is formed by press working a metal plate. Further, the outer conductor 2 has a cylindrical portion 21 into which the coaxial plug connector is inserted, and substrate connecting portions 22, 23, 24 which are soldered to a wiring pattern (not shown) of the main printed circuit board 101. In addition, the detailed shape of the outer conductor 2 will be described later.
[中心導體]中心導體3，係與筒狀部21呈同軸地配置於筒狀部21之內部空間，並與該同軸插頭之中心導體接觸之金屬零件，並由衝壓加工金屬板而成形。此外，中心導體3具有基板連接部31與接觸部32，且基板連接部31焊接於主印刷電路基板101之未圖示之配線圖案，且接觸部32與未圖示之該同軸插頭連接器之中心導體接觸。The center conductor 3 is a metal component that is disposed coaxially with the tubular portion 21 in the internal space of the tubular portion 21 and that is in contact with the center conductor of the coaxial plug, and is formed by press-working a metal plate. Further, the center conductor 3 has a board connecting portion 31 and a contact portion 32, and the board connecting portion 31 is soldered to a wiring pattern (not shown) of the main printed circuit board 101, and the contact portion 32 and the coaxial plug connector (not shown) The center conductor is in contact.
[樹脂成形體]樹脂成形體4，係使外部導體2與中心導體3電絕緣之絕緣體。此外，樹脂成形體4，係於未圖示之樹脂成形模具載置外部導體2與中心導體3，並於該樹脂成形模具注入已熔解之樹脂而成形。[Resin Molded Body] The resin molded body 4 is an insulator that electrically insulates the outer conductor 2 from the center conductor 3. Further, the resin molded body 4 is formed by placing the outer conductor 2 and the center conductor 3 on a resin molding die (not shown), and injecting the melted resin into the resin molding die.
樹脂成形體4之一部分，如圖4A及圖4B所示，亦形成於筒狀部21之外側，且如圖1及圖2所示，構成平面形狀為大致矩形之輪廓。此外，樹脂成形體4之形成於筒狀部21之外側之部位，通過形成於外部導 體2之貫通孔25a,25b,25c，與形成於筒狀部21之內側之部位連續。也就是，樹脂成形體4之形成於筒狀部21之外側之部位與形成於筒狀部21之內側之部位係一體成形。另外，亦應注意到中心導體3之接觸部32係從基板連接部31立起並突出成凸面(boss)狀、及中心導體3整體上係成為大致倒T字狀。As shown in FIGS. 4A and 4B, a part of the resin molded body 4 is also formed on the outer side of the tubular portion 21, and as shown in FIGS. 1 and 2, the planar shape is a substantially rectangular outline. Further, a portion of the resin molded body 4 formed on the outer side of the tubular portion 21 is formed on the outer guide. The through holes 25a, 25b, and 25c of the body 2 are continuous with the portion formed on the inner side of the tubular portion 21. In other words, the portion of the resin molded body 4 formed on the outer side of the tubular portion 21 is integrally formed with the portion formed on the inner side of the tubular portion 21. In addition, it should be noted that the contact portion 32 of the center conductor 3 rises from the board connecting portion 31 and protrudes into a boss shape, and the center conductor 3 as a whole has a substantially inverted T shape.
[外部導體之形狀之細節]如圖5A及圖5B所示，於外部導體2之筒狀部21之外面，具有接觸部211，接觸部211並與未圖示之該同軸插頭連接器之外部導體接觸。此外，於筒狀部21與基板連接部22,23,24之間，具有連結部26,27,28。藉由具備連結部26,27,28，而於筒狀部21與主印刷電路基板101(參照圖1)之間形成間隙，且於該間隙填充樹脂成形體4(參照圖4A、圖4B)，而將筒狀部21對主印刷電路基板101電絕緣。貫通孔25a,25b,25c，係於連結部26,27,28之寬度方向之大致中心穿孔，並於厚度方向貫通連結部26,27,28。此外，貫通孔25a,25b,25c之孔之剖面積，係於筒狀部21之外側、亦即圖5A中可見之側較小，於筒狀部21之內側、亦即圖5B中可見之側較大。[Details of the shape of the outer conductor] As shown in FIG. 5A and FIG. 5B, the outer surface of the cylindrical portion 21 of the outer conductor 2 has a contact portion 211 which is external to the coaxial plug connector (not shown). Conductor contact. Further, between the tubular portion 21 and the substrate connecting portions 22, 23, 24, there are connecting portions 26, 27, 28. A gap is formed between the tubular portion 21 and the main printed circuit board 101 (see FIG. 1) by providing the connecting portions 26, 27, and 28, and the resin molded body 4 is filled in the gap (see FIGS. 4A and 4B). The cylindrical portion 21 is electrically insulated from the main printed circuit board 101. The through holes 25a, 25b, and 25c are pierced substantially at the center in the width direction of the connecting portions 26, 27, and 28, and penetrate the connecting portions 26, 27, and 28 in the thickness direction. Further, the cross-sectional area of the holes of the through holes 25a, 25b, 25c is smaller on the outer side of the tubular portion 21, that is, the side visible in Fig. 5A, and is visible on the inner side of the cylindrical portion 21, that is, in Fig. 5B. The side is larger.
此外，由於在筒狀部21之下端緣部29，形成有溝槽29a,29b,29c,29d，因此樹脂成形體4之形成於筒狀部21之外側之部位，通過溝槽29a,29b,29c,29d，並與形成於筒狀部21之內側之部位連續。因此，由於樹脂成形體4於貫通孔25a,25b,25c及溝槽29a,29b,29c,29d中，與外部導體2咬合而卡合，因此樹脂成形體4與外部導體2機械性地牢固地結合。因此，外部導體2與樹脂成形體4之間隙難以形成，可抑制經熔解之焊料之焊料滲溢。In addition, since the grooves 29a, 29b, 29c, and 29d are formed in the lower end portion 29 of the tubular portion 21, the resin molded body 4 is formed on the outer side of the cylindrical portion 21 through the grooves 29a, 29b. 29c, 29d are continuous with the portion formed on the inner side of the tubular portion 21. Therefore, since the resin molded body 4 is engaged with the outer conductor 2 in the through holes 25a, 25b, 25c and the grooves 29a, 29b, 29c, 29d, the resin molded body 4 and the outer conductor 2 are mechanically firmly fixed. Combine. Therefore, it is difficult to form a gap between the outer conductor 2 and the resin molded body 4, and it is possible to suppress solder leakage of the melted solder.
另外，於從上方俯視外部導體2之情形(參照圖2)，基板 連接部22,23,24成為大致矩形，並以與筒狀部21之平面形狀之圓大致相切之方式配置，且該矩形之長邊方向係與該圓之切線平行地延伸。此外，於圖2中，若將筒狀部21之平面形狀比喻成時鐘之時刻盤，則基板連接部22配置於6時之位置，基板連接部23與基板連接部24分別配置於9時與12時之位置。Further, in the case where the outer conductor 2 is viewed from above (refer to FIG. 2), the substrate The connecting portions 22, 23, and 24 are substantially rectangular, and are disposed substantially in line with the circle of the planar shape of the tubular portion 21, and the longitudinal direction of the rectangle extends in parallel with the tangent to the circle. In addition, in FIG. 2, when the planar shape of the cylindrical portion 21 is referred to as a clock of the clock, the substrate connecting portion 22 is disposed at a position of 6 o'clock, and the substrate connecting portion 23 and the substrate connecting portion 24 are respectively disposed at 9 o'clock. 12 o'clock position.
[貫通孔之效果]最後，針對貫通孔25a,25b,25c之效果進行說明。如上所述，一般而言，於將同軸連接器1焊接於主印刷電路基板101(參照圖1)之情形，基板連接部22,23,24之底面與熔解焊料之液面接觸，熔解焊料因毛細管現象而導致從外部導體2與樹脂成形體4之間之微小間隙爬上，且恐有產生焊料滲溢之情況。然而，由於同軸連接器1於連結部26,27,28中具備貫通孔25a,25b,25c，因此熔解焊料所流經之流路之寬度(同軸連接器1之水平剖面中之樹脂成形體4與連結部26,27,28之邊界之長度)變小。因此，可阻止焊料滲溢。此外，由於連結部26,27,28位於基板連接部22,23,24與筒狀部21之間並彎曲，因此於基板連接部22,23,24與筒狀部21之間，熔解焊料所流經之流路之長度變長。藉此，亦可阻止焊料滲溢。因此，於筒狀部21之內側產生之焊料滲溢得以有效地受到抑制，且可抑制損害同軸連接器1之形狀、或產生連接不良等情況。[Effect of Through Hole] Finally, the effects of the through holes 25a, 25b, and 25c will be described. As described above, in general, in the case where the coaxial connector 1 is soldered to the main printed circuit board 101 (refer to FIG. 1), the bottom surfaces of the board connecting portions 22, 23, 24 are in contact with the liquid surface of the molten solder, and the solder is melted. The capillary phenomenon causes the minute gap between the outer conductor 2 and the resin molded body 4 to climb, and there is a fear that solder leakage occurs. However, since the coaxial connector 1 is provided with the through holes 25a, 25b, 25c in the joint portions 26, 27, 28, the width of the flow path through which the molten solder flows (the resin molded body 4 in the horizontal cross section of the coaxial connector 1) The length of the boundary with the joint portions 26, 27, 28) becomes small. Therefore, solder leakage can be prevented. Further, since the connecting portions 26, 27, 28 are located between the substrate connecting portions 22, 23, 24 and the cylindrical portion 21, the solder is melted between the substrate connecting portions 22, 23, 24 and the cylindrical portion 21. The length of the flow path through it becomes longer. Thereby, the solder can also be prevented from seeping. Therefore, the solder bleed which is generated inside the cylindrical portion 21 is effectively suppressed, and the shape of the coaxial connector 1 or the connection failure or the like can be suppressed.
此外，貫通孔25a,25b,25c之剖面積，於筒狀部21之內側較大，於筒狀部21之外側較小，因此可一邊確保外部導體2之強度或導電性之確保所需之連結部26,27,28之水平剖面積，一邊有效地縮小熔解焊料流經之流路之寬度。Further, since the cross-sectional areas of the through holes 25a, 25b, and 25c are larger inside the tubular portion 21 and smaller on the outer side of the tubular portion 21, it is possible to secure the strength or conductivity of the outer conductor 2. The horizontal cross-sectional area of the joint portions 26, 27, and 28 effectively reduces the width of the flow path through which the molten solder flows.
另外，上述實施態樣係本發明之具體的實施態樣之例示，本 發明之技術範圍並不受上述實施態樣所限定。本發明可於申請專利範圍中所記載之技術性思想之範圍內，自由地應用、變形、或改良而實施。In addition, the above embodiment is an example of a specific embodiment of the present invention, The technical scope of the invention is not limited by the above embodiments. The present invention can be implemented freely, modified, or improved within the scope of the technical idea described in the claims.
尤其是，外部導體2之形狀係為例示，本發明之技術範圍並不受外部導體2之形狀所限定。例如，基板連接部22,23,24之數量可任意地設計。此外，對於1塊連結部26,27,28要設置幾個貫通孔25a,25b,25c係任意的。重點是，只要熔解焊料流經之流路之寬度縮小，並開設有抑制焊料滲溢所需之充分之數量或大小之貫通孔即可。In particular, the shape of the outer conductor 2 is exemplified, and the technical scope of the present invention is not limited by the shape of the outer conductor 2. For example, the number of substrate connecting portions 22, 23, 24 can be arbitrarily designed. Further, a plurality of through holes 25a, 25b, and 25c are provided for one connecting portion 26, 27, and 28, respectively. The point is that as long as the width of the flow path through which the molten solder flows is reduced, and a sufficient number or size of through holes for suppressing the solder leakage is provided.
此外，於本發明中，所謂的「連結部」，只要是「位於外部導體之筒狀部與基板連接部之間，並電連結兩者之部位」即可。也就是，如連結部26,27,28般，亦可不具備如可明確區分筒狀部21及基板連接部22,23,24般之形態特徵。此外，若將筒狀部21與基板連接部22,23,24機械性地直接結合，則筒狀部21與基板連接部22,23,24之邊界相當於「連結部」。In the present invention, the "connecting portion" may be any "part between the cylindrical portion of the outer conductor and the substrate connecting portion and electrically connect the two portions". That is, as in the connection portions 26, 27, and 28, the morphological features such as the cylindrical portion 21 and the substrate connecting portions 22, 23, and 24 may not be clearly defined. Further, when the tubular portion 21 and the board connecting portions 22, 23, 24 are mechanically directly coupled, the boundary between the tubular portion 21 and the board connecting portions 22, 23, 24 corresponds to the "connecting portion".
，本申請案係主張基於2012年7月23日已提出申請之日本國專利申請案2012-162659號之優先權者，且以該日本國專利申請案之說明書、申請專利範圍、圖式、及摘要中所揭示之全部內容為主張優先權之基礎。該日本國專利申請案中之揭示內容，其整體作為參照而包含於本說明書中。The present application claims the priority of Japanese Patent Application No. 2012-162659, which is filed on Jul. 23, 2012, and the specification of the Japanese Patent Application, the scope of application, the drawings, and The entire disclosure of the abstract is the basis for claiming priority. The disclosure in the Japanese Patent Application is hereby incorporated by reference in its entirety in its entirety in its entirety in its entirety in its entirety herein
1‧‧‧同軸連接器1‧‧‧ coaxial connector
2‧‧‧外部導體2‧‧‧External conductor
3‧‧‧中心導體3‧‧‧Center conductor
4‧‧‧樹脂成形體4‧‧‧Resin molded body
21‧‧‧筒狀部21‧‧‧Cylinder
22、24‧‧‧基板連接部22, 24‧‧ ‧ substrate connection
25a、25c‧‧‧貫通孔25a, 25c‧‧‧through holes
32‧‧‧接觸部32‧‧‧Contacts
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012162659A JP6047973B2 (en) | 2012-07-23 | 2012-07-23 | Coaxial connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201405978A TW201405978A (en) | 2014-02-01 |
| TWI501487B true TWI501487B (en) | 2015-09-21 |
Family
ID=50051060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102126189A TWI501487B (en) | 2012-07-23 | 2013-07-23 | Coaxial connector |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6047973B2 (en) |
| CN (1) | CN103579803B (en) |
| TW (1) | TWI501487B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075265B (en) * | 2017-12-04 | 2019-09-27 | 昆山杰顺通精密组件有限公司 | Plate is to template radio frequency plug |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6074217A (en) * | 1995-05-25 | 2000-06-13 | Murata Manufacturing Co., Ltd. | Coaxial connector receptacle |
| US6783374B2 (en) * | 1999-12-21 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component, coaxial connector, and communication device |
| TWI251968B (en) * | 2002-12-26 | 2006-03-21 | Hirose Electric Co Ltd | Coaxial electrical connector |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330007A (en) * | 1995-05-29 | 1996-12-13 | Sato Seiki:Kk | Electric part for connection |
| US6474995B1 (en) * | 2001-10-30 | 2002-11-05 | Hon Hai Precision Ind. Co., Ltd. | Low profile RF connector and method of manufacturing the RF connector |
| CN201048220Y (en) * | 2007-04-29 | 2008-04-16 | 连展科技（深圳）有限公司 | Electrical connector |
| JP4325885B1 (en) * | 2009-03-27 | 2009-09-02 | 株式会社アイペックス | Coaxial connector device |
| JP5191568B2 (en) * | 2009-07-31 | 2013-05-08 | 株式会社フジクラ | Coaxial connector |
-
2012
- 2012-07-23 JP JP2012162659A patent/JP6047973B2/en active Active
-
2013
- 2013-07-23 TW TW102126189A patent/TWI501487B/en not_active IP Right Cessation
- 2013-07-23 CN CN201310310422.4A patent/CN103579803B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6074217A (en) * | 1995-05-25 | 2000-06-13 | Murata Manufacturing Co., Ltd. | Coaxial connector receptacle |
| US6783374B2 (en) * | 1999-12-21 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component, coaxial connector, and communication device |
| TWI251968B (en) * | 2002-12-26 | 2006-03-21 | Hirose Electric Co Ltd | Coaxial electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014022315A (en) | 2014-02-03 |
| CN103579803B (en) | 2018-04-20 |
| CN103579803A (en) | 2014-02-12 |
| TW201405978A (en) | 2014-02-01 |
| JP6047973B2 (en) | 2016-12-21 |
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