JP2014022315A - Coaxial connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coaxial connector in which rising of solder is hard to occur between an external conductor and a resin molding and which is suitable for reduction in size and height.SOLUTION: A coaxial connector includes: an external conductor 2 having a cylindrical part 21, substrate connection parts 22, 23 and 24, and a communication part which electrically communicates the substrate connection parts 22, 23 and 24 with the cylindrical part 21; a central conductor 3 which is arranged coaxially with the cylindrical part 21 in an internal space of the cylindrical part 21; and a resin molding 4 which electrically insulates the external conductor 2 and the central conductor 3 from each other. In a coaxial connector 1 which is surface-mounted on a circuit board, through-holes 25a, 25b and 25c are formed in the communication part.

Description

  The present invention relates to a coaxial connector that includes an outer conductor having a cylindrical portion and a central conductor disposed coaxially with the outer conductor and is surface-mounted on a circuit board.

  Electronic devices or electrical devices such as mobile phones, notebook PCs, and tablet PCs include various electrical connectors. Various signal transmission media such as a coaxial cable, a flat cable, or a flexible cable are connected to the electrical connector, and electrical signals or electric power can be transmitted and received within the electronic device or between the electronic device and an external device. Done. As one type of such an electrical connector, a coaxial connector (receptacle connector) that is surface-mounted on a printed circuit board is known.

  A coaxial connector generally includes an outer conductor having a cylindrical portion and a central conductor disposed coaxially with the cylindrical portion, and a resin molded body is disposed between the outer conductor and the central conductor. Also, the bottom surfaces of the outer conductor and the center conductor are in contact with the printed circuit board and soldered to the printed circuit board.

  A resin molded body is formed by attaching an outer conductor and a center conductor in a resin molding die and filling the resin molding die with resin. When soldering the coaxial connector to the printed circuit board, Thermal distortion occurs, and a fine gap is formed between the resin molded body and the outer conductor. For this reason, a phenomenon that the melted solder oozes out to the upper surface of the resin molded body through the fine gap, that is, solder rise due to a capillary phenomenon may occur. Soldering up causes poor electrical connection with the mating connector.

  Particularly in recent years, the coaxial connector is also required to be downsized and reduced in height, so that the height of the resin molding is reduced, and the distance between the mounting surface of the printed circuit board and the upper surface of the resin molding is reduced. For this reason, solder rise tends to occur.

  Several inventions for suppressing the solder rise of the coaxial connector have already been proposed. For example, the coaxial connector disclosed in Patent Document 1 includes an outer conductor having a cylindrical portion and a central conductor arranged coaxially with the cylindrical portion, and a resin-molded dielectric (resin molded body). The two conductors are held together, and a projecting portion and an immersing portion are formed on the surface that contacts the dielectric (resin molding) of the central conductor.

  The coaxial connector disclosed in Patent Document 2 is composed of a synthetic resin case (lower insulating case and upper insulating case), a metal fixed terminal, a movable terminal, and an external terminal. The resin molded body is formed with notches for receiving the fixed terminal and the movable terminal, respectively. The notch has a clearance that does not cause capillary action between the lead portions (substrate connection portions) of both terminals and the lower insulating case.

JP 2004-221055 A JP 2001-176612 A

  The coaxial connector of Patent Document 1 has a protrusion / immersion formed on the surface of the center conductor that contacts the dielectric (resin molded body) to improve the holding force between the center conductor and the dielectric (resin molded body). Therefore, even if it receives the heat of soldering, a fine gap is not generated between the central conductor and the dielectric (resin molding), but between the outer conductor and the dielectric (resin molding) No such countermeasure has been taken. Therefore, there is a possibility that the solder rises between the outer conductor and the dielectric (resin molding).

  Further, the coaxial connector of Patent Document 2 sets a clearance that does not cause capillary action between a notch provided in the lower insulating case (dielectric) and both terminals (fixed terminal, movable terminal), Although solder rise is suppressed, recent coaxial connectors are strongly required to be small and low in profile, so there is no room for setting clearance. In other words, setting such a clearance contradicts the demand for miniaturization and low profile.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a coaxial connector that is less likely to cause soldering between an outer conductor and a resin molded body and that is suitable for downsizing and low profile. To do.

  In order to achieve the above object, a coaxial connector according to the present invention includes a cylindrical portion, a substrate connecting portion that is soldered in contact with a printed circuit board, and electrically connecting the substrate connecting portion and the cylindrical portion. An outer conductor having a connecting portion, a central conductor disposed coaxially with the cylindrical portion in the inner space of the cylindrical portion of the outer conductor, and the outer conductor filled in the inner space of the cylindrical portion. A coaxial connector having a resin molded body that electrically insulates the central conductor and is surface-mounted on a circuit board. In the coaxial connector, a through hole that penetrates from the internal space of the cylindrical portion to the outside of the cylindrical portion It is characterized by being opened.

  The cross-sectional area of the through hole at the inner end face of the connecting portion may be larger than the cross-sectional area of the through hole at the outer end face of the connecting portion.

  A part of the resin molded body is molded outside the cylindrical part, and the part passes through the through hole and is continuous with the resin molded body in the internal space of the cylindrical part. Good.

  A groove that connects the inside and the outside of the cylindrical portion may be formed on the end surface of the cylindrical portion on the circuit board side.

  A part of the resin molded body is molded outside the cylindrical part, and the part passes through the groove and is continuous with the resin molded body in the internal space of the cylindrical part. Also good.

  According to the present invention, in the coaxial connector including the outer conductor and the resin molded body, the holding force between the outer conductor and the resin molded body can be improved. A coaxial connector that is unlikely to have a minute gap in the body, that is, a coaxial connector that is less likely to cause soldering between the outer conductor and the resin molded body, and has high electrical connection reliability and is suitable for downsizing and low profile. A coaxial connector can be provided.

It is a perspective view which shows the use condition of the coaxial connector which concerns on embodiment of this invention. It is a top view of a coaxial connector. It is a bottom view of a coaxial connector. It is sectional drawing of a coaxial connector apparatus, Comprising: (a) is sectional drawing cut | disconnected by the AA line of FIG. 2, (b) is sectional drawing cut | disconnected by the BB line. It is the perspective view which shows the external shape of an external conductor, Comprising: (a) is the figure which looked at the external conductor from upper direction, (b) is the figure which looked at the external conductor from the downward direction.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  The coaxial connector 1 is an example of an embodiment of the present invention. As shown in FIG. 1, the coaxial connector 1 is a receptacle connector that is surface-mounted on the main printed circuit board 101, and a structure in which a coaxial plug connector (not shown) is fitted or removed. Is provided. As shown in FIGS. 1 to 3, the coaxial connector 1 includes an outer conductor 2, a center conductor 3, and a resin molded body 4. Hereinafter, in this specification, a surface of the coaxial connector 1 that contacts the main printed circuit board 101 is referred to as a “bottom surface” of the coaxial connector 1, and a surface away from the main printed circuit board 101 is referred to as an “upper surface” of the coaxial connector 1. Call. The direction from the “bottom surface” to the “upper surface” is referred to as “upward direction”, and the direction from the “top surface” to the “bottom surface” is referred to as “downward direction”. For example, the coaxial plug connector is inserted in the “downward direction” from the “upper surface” of the coaxial connector 1 and removed in the “upward direction”.

[External conductor]
The outer conductor 2 is a metal part that contacts the outer conductor of the coaxial plug connector, and is formed by pressing a metal plate. Further, the outer conductor 2 has a cylindrical portion 21 into which the coaxial plug connector is inserted, and substrate connecting portions 22, 23, 24 to be soldered to a wiring pattern (not shown) of the main printed circuit board 101. The detailed shape of the outer conductor 2 will be described later.

[Center conductor]
The central conductor 3 is a metal part that is disposed coaxially with the cylindrical portion 21 in the inner space of the cylindrical portion 21 and contacts the central conductor of the coaxial plug, and is formed by pressing a metal plate. The central conductor 3 has a board connecting part 31 and a contact part 32. The board connecting part 31 is soldered to a wiring pattern (not shown) of the main printed circuit board 101, and the contact part 32 is not shown in the coaxial plug connector (not shown). In contact with the center conductor.

[Resin molding]
The resin molded body 4 is an insulator that electrically insulates the outer conductor 2 and the center conductor 3. The resin molded body 4 is molded by placing the outer conductor 2 and the center conductor 3 in a resin molding die (not shown) and injecting molten resin into the resin molding die.

  A part of the resin molded body 4 is also formed outside the cylindrical portion 21 as shown in FIGS. 4 (a) and 4 (b), and is substantially rectangular in a planar shape as shown in FIGS. Construct a contour. Further, the portion formed on the outer side of the cylindrical portion 21 of the resin molded body 4 passes through the through holes 25a, 25b, 25c formed in the outer conductor 2 and the portion formed on the inner side of the cylindrical portion 21. It is continuous. That is, the portion formed outside the cylindrical portion 21 of the resin molded body 4 and the portion formed inside the cylindrical portion 21 are integrally molded. It should be noted that the contact portion 32 of the center conductor 3 rises from the board connecting portion 31 and protrudes in a boss shape, and that the center conductor 3 has a substantially inverted T shape as a whole.

[Details of outer conductor shape]
As shown in FIGS. 5A and 5B, a contact portion 211 is provided on the outer surface of the cylindrical portion 21 of the outer conductor 2, and the contact portion 211 contacts an outer conductor of the coaxial plug connector (not shown). . Further, there are connecting portions 26, 27, 28 between the cylindrical portion 21 and the substrate connecting portions 22, 23, 24. By providing the connecting portions 26, 27, 28, a gap is formed between the tubular portion 21 and the main printed circuit board 101 (see FIG. 1), and the resin molded body 4 is filled in the gap (see FIG. 4). The cylindrical portion 21 is electrically insulated from the main printed circuit board 101. The through holes 25a, 25b, and 25c are drilled at substantially the center in the width direction of the connecting portions 26, 27, and 28, and pass through the connecting portions 26, 27, and 28 in the thickness direction. The cross-sectional areas of the through holes 25a, 25b, and 25c are small on the outer side of the cylindrical part 21, that is, on the side visible in FIG. 5A, and are visible on the inner side of the cylindrical part 21, that is, FIG. Big on the side.

  Moreover, since the groove parts 29a, 29b, 29c, and 29d are formed in the lower end edge part 29 of the cylindrical part 21, the site | part formed in the outer side of the cylindrical part 21 of the resin molding 4 is groove | channel 29a, It passes through 29b, 29c, 29d and continues to the portion formed inside the cylindrical portion 21. Therefore, since the resin molded body 4 is engaged with and engaged with the outer conductor 2 in the through holes 25a, 25b, and 25c and the grooves 29a, 29b, 29c, and 29d, the resin molded body 4 is mechanically connected to the outer conductor 2. It is firmly bonded to. For this reason, it becomes difficult to form a gap between the outer conductor 2 and the resin molded body 4, and the solder rise of the melted solder is suppressed.

  When the external conductor 2 is viewed from above (see FIG. 2), the board connecting portions 22, 23, and 24 are arranged in a substantially rectangular shape so as to be substantially in contact with the planar circle of the cylindrical portion 21. The longitudinal direction of the rectangle extends parallel to the tangent to the circle. Further, in FIG. 2, if the planar shape of the cylindrical portion 21 is compared to a clock face, the board connecting portion 22 is arranged at the 6 o'clock position, and the board connecting portion 23 and the board connecting portion 24 are each set at 9 o'clock. And 12 o'clock.

[Effect of through hole]
Finally, the effect of the through holes 25a, 25b, and 25c will be described. As described above, in general, when the coaxial connector 1 is soldered to the main printed circuit board 101 (see FIG. 1), the bottom surfaces of the board connecting portions 22, 23, and 24 touch the liquid surface of the molten solder. The capillarity may cause a slight gap between the outer conductor 2 and the resin molded body 4 to rise, resulting in solder rise. However, since the coaxial connector 1 includes the through holes 25a, 25b, and 25c in the connecting portions 26, 27, and 28, the width of the flow path through which the molten solder flows (the resin molded body 4 and the connecting portion 26 in the horizontal cross section of the coaxial connector 1). , 27, 28). For this reason, soldering is prevented. Further, the connecting portions 26, 27, 28 are between the substrate connecting portions 22, 23, 24 and the cylindrical portion 21, and are curved, so that melting occurs between the substrate connecting portions 22, 23, 24 and the cylindrical portion 21. The length of the flow path through which the solder flows increases. This also prevents the solder from rising. Therefore, the solder rise generated inside the cylindrical portion 21 is effectively suppressed, and the coaxial connector 1 is prevented from being damaged or poorly connected.

  Moreover, since the cross-sectional areas of the through holes 25a, 25b, and 25c are large inside the cylindrical portion 21 and small outside the cylindrical portion 21, communication necessary for ensuring the strength and conductivity of the outer conductor 2 is achieved. The width of the flow path through which the molten solder flows can be effectively reduced while securing the horizontal cross-sectional areas of the portions 26, 27, and 28.

  In addition, the said embodiment is an illustration of the specific embodiment of this invention, Comprising: The technical scope of this invention is not limited by the said embodiment. The present invention can be freely applied, modified or improved within the scope of the technical idea described in the claims.

  In particular, the shape of the outer conductor 2 is an example, and the technical scope of the present invention is not limited by the shape of the outer conductor 2. For example, the number of board connection parts 22, 23, and 24 can be designed arbitrarily. Moreover, it is arbitrary how many through-holes 25a, 25b, and 25c are provided about one piece of connection parts 26, 27, and 28. FIG. In short, it is sufficient if the width of the flow path through which the molten solder flows is reduced and a sufficient number or size of through holes are provided to suppress soldering.

  Further, in the present invention, the “communication portion” is sufficient if it is “a portion between the cylindrical portion of the outer conductor and the substrate connection portion and electrically connecting both”. In other words, like the connecting portions 26, 27, and 28, the morphological features that can be clearly distinguished from the cylindrical portion 21 and the substrate connecting portions 22, 23, and 24 may not be provided. Moreover, if the cylindrical part 21 and the board | substrate connection part 22,23,24 are couple | bonded directly mechanically, the boundary of the cylindrical part 21 and the board | substrate connection part 22,23,24 will correspond to a "communication part." .

DESCRIPTION OF SYMBOLS 1 ... Coaxial connector, 2 ... Outer conductor, 3 ... Center conductor, 31 ... Board | substrate connection part, 32 ... Contact part, 4 ... Resin molding 21 ... Cylindrical part , 211 ... contact part, 22, 23, 24 ... board connection part, 25a, 25b, 25c ... through hole, 26, 27, 28 ... communication part, 29 ... lower end edge part, 29a, 29b, 29c, 29d ... grooves, 101 ... main printed circuit board

Claims (5)

A cylindrical part, a board connecting part to be soldered in contact with the printed circuit board, an external conductor having a connecting part for electrically connecting the board connecting part and the cylindrical part,
In the internal space of the cylindrical portion of the outer conductor, a central conductor disposed coaxially with the cylindrical portion,
A resin molded body that is filled in the internal space of the cylindrical portion and electrically insulates the outer conductor and the central conductor,
In coaxial connectors that are surface-mounted on circuit boards,
A through hole that penetrates from the internal space of the cylindrical part to the outside of the cylindrical part is formed in the communication part. 2. The coaxial connector according to claim 1, wherein a cross-sectional area of the through hole in an inner end surface of the connecting portion is larger than a cross-sectional area of the through hole in an outer end surface of the connecting portion. A part of the resin molded body is molded outside the cylindrical part, and the part is continuous with the resin molded body in the internal space of the cylindrical part through the through hole. The coaxial connector according to claim 1 or 2, wherein the coaxial connector is characterized in that: The coaxial connector according to claim 1, wherein a groove that connects the inside and the outside of the cylindrical portion is formed on an end surface of the cylindrical portion on the circuit board side. A part of the resin molded body is molded outside the cylindrical part, and the part is continuous with the resin molded body in the internal space of the cylindrical part through the groove. The coaxial connector according to claim 4.

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