CN212486881U

CN212486881U - Circuit overline structure

Info

Publication number: CN212486881U
Application number: CN202021836003.6U
Authority: CN
Inventors: 郭善仁; 詹尚登
Original assignee: Kunshan Huaguan Trademark Printing Co Ltd
Current assignee: Kunshan Huaguan Trademark Printing Co Ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-02-05
Anticipated expiration: 2030-08-28

Abstract

The utility model discloses a circuit overline structure contains the base plate that has bearing surface, sets up electronic circuit and electronic component on bearing surface. The electronic circuit comprises two side conductors and a central conductor. The central wire is arranged between and separated from the first terminal and the second terminal of the two side wires, and the first terminal and the second terminal are arranged separately from each other. The electronic component is provided with two end points and an insulating shell, the electronic component is arranged on the supporting surface, the two end points of the electronic component are connected with the first terminal and the second terminal, the outer surface of the insulating shell faces the central conducting wire, the central conducting wire is located between two sides, contacted with the supporting surface, of the insulating shell, and the orthographic projection of the electronic component on the supporting surface extends to cross the orthographic projection of the central conducting wire on the supporting surface.

Description

Circuit overline structure

Technical Field

The present invention relates to a circuit crossover structure, and more particularly to a circuit crossover structure suitable for a single-layer circuit.

Background

Generally, the circuit crossover structure is realized by a multi-layer substrate. That is, when two wires meet (cross), one of the wires must be sunk to another layer of the substrate to cross the other wire disposed on the surface of the substrate.

The above-described conventional methods have been widely used and applied to various electronic products of multilayer substrates; however, this technique cannot be applied to circuit designs that are too fragile or sensitive to form vias in the substrate. In other words, a new circuit crossover structure is needed to realize an electronic product with a circuit formed on a substrate that cannot have a via hole.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a circuit jumper structure that satisfies the above-mentioned needs.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts as follows:

a circuit overline structure, characterized in that: comprises the following steps:

a substrate having a support surface;

an electronic circuit disposed on the support surface of the substrate, wherein the electronic circuit comprises:

two side wires, one of the two side wires having a first terminal and the other side wire having a second terminal, wherein the first terminal and the second terminal are spaced apart from each other; and

a central conductor disposed between and spaced apart from the first and second terminals; and

an electronic component having two ends and an insulating housing, the electronic component being disposed on the supporting surface and the two ends being connected to the first terminal and the second terminal, wherein an outer surface of the insulating housing faces the central conductive line, the central conductive line is located between two sides of the insulating housing contacting the supporting surface, and an orthographic projection of the electronic component on the supporting surface extends across an orthographic projection of the central conductive line on the supporting surface.

In the above-mentioned circuit crossover structure, the insulating casing is disposed on the central conductor.

In an embodiment of the invention, the insulating casing has a recess for the central conductive line to pass through.

In the above-mentioned circuit flying lead structure, the electronic component is a passive component.

In an embodiment, the two side wires and the central wire have the same height relative to the supporting surface.

In an embodiment, the two side wires and the central wire have different heights relative to the supporting surface.

In an embodiment, the supporting surface of the substrate has a groove for accommodating the central conductive line.

In an embodiment, the trench is formed in a region of the supporting surface, and the trench is formed in a region of the supporting surface opposite to the region of the supporting surface.

The utility model has the advantages that:

1. the circuit overline structure provided by the utility model can realize the circuit overline structure suitable for the single-layer circuit design, so as to realize the circuit substrate which can not have the through hole due to the specific reasons such as the strength of the substrate or the manufacture procedure;

2. according to the utility model discloses a circuit overline structure, circuit pattern can also be simplified and need not to form the through-hole to, owing to can save traditional printed circuit board's through-hole structure, the event can also reduce the volume of circuit overline structure, consequently, though the utility model discloses shown circuit overline structure is suitable for the design that realizes the individual layer circuit, the utility model discloses shown circuit overline structure does also be used for realizing the design of multilayer circuit in order to reduce the size of whole circuit.

Drawings

FIG. 1 is a perspective view of an embodiment of a circuit flying lead structure according to the present disclosure.

Fig. 2 is a side perspective view of an embodiment of a circuit flying lead structure according to the present disclosure.

FIG. 3 is an exploded view of the cross-line structure of the circuit shown in FIG. 1.

Fig. 4 is a perspective view of another embodiment of a circuit flying lead structure according to the present disclosure.

Fig. 5 is an exploded view of another embodiment of a circuit flying lead structure according to the present disclosure.

Fig. 6 is a flowchart illustrating a method for manufacturing a circuit crossover structure according to an embodiment of the disclosure.

Detailed Description

The detailed features and advantages of the present invention are described in detail below in the detailed description, which is sufficient for any person skilled in the art to understand the technical content of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by any person skilled in the art from the disclosure, claims and drawings of the present specification. The following examples are provided to further illustrate the aspects of the present invention in detail, but are not intended to limit the scope of the present invention in any way.

Referring to fig. 1, fig. 1 is a perspective view of an embodiment of a circuit flying lead structure according to the disclosure. The circuit flying structure 1 includes a substrate 10, an electronic circuit 20, and an electronic component 30.

The substrate 10 comprises a support surface 100, wherein the substrate 10 may be a single layer structure. In detail, the substrate 10 may be a rigid circuit board (rigid circuit board) or a single-layer flexible circuit board (flexible circuit board). The substrate 10 may be made of polyethylene terephthalate (PET), polyimide (polyimide), glass epoxy (glass epoxy), or FR4, but the disclosure is not limited thereto.

The electronic circuit 20 is arranged on a support surface 100 of the substrate 10. The electronic circuit 20 comprises two side wires 201, wherein one side wire 201 has a first terminal 201a and the other side wire 201 has a second terminal 201b, the first terminal 201a and the second terminal 201b being spaced apart from each other. It is to be noted that the first terminal 201a and the second terminal 201b are not necessarily physical terminals of the side conductor 201; that is, any portion of the side wire 201 connected to the electronic component 30 may serve as the first terminal 201a and the second terminal 201 b.

The electronic circuit 20 further includes a center conductive line 202, wherein the center conductive line 202 is disposed between the first terminal 201a and the second terminal 201b and is separated from the first terminal 201a and the second terminal 201 b. In other words, the two side wires 201 are disposed on two sides of the central wire 202, wherein the two side wires 201 and the central wire 202 are preferably wires having the function of transmitting electrical signals, and the two side wires 201 and the central wire 202 are designed to be separated from each other.

The electronic component 30 is disposed above the supporting surface 100, and two terminals 301 of the electronic component 30 are respectively connected to the first terminal 201a and the second terminal 201b, so that an electrical signal can be received from one of the side wires 201 and transmitted to the other side wire 201. The electronic component 30 has an insulating housing 302, and an outer surface of the insulating housing 302 faces the central conductive wire 202, so that the electronic component 30 is not electrically connected to the central conductive wire 202. In other words, the insulating case 302 is located between the conductive portion of the electronic component 30 and the central conductive line 202. Specifically, the electronic assembly 30 may have an insulating housing, and the insulating housing 302 is a lower portion of the insulating housing near the central conductive line 202. The electronic component 30 is preferably a passive component such as a resistor, an inductor, or a capacitor, but the invention is not limited thereto. The electronic assembly 30 may also be other types of electronic assemblies having an insulative housing.

For a better understanding of the present embodiment, please refer to fig. 2, in which fig. 2 is a side perspective view of an embodiment of a circuit flying lead structure according to the present disclosure. Specifically, the two side wires 201 and the center wire 202 preferably have the same height h relative to the supporting surface 100, wherein the electronic component 30 is disposed above the center wire 202. That is, the height h shown in fig. 2 is the thickness of the two side wires 201 in a thickness direction perpendicular to the supporting surface 100, but the present invention is not limited to the two side wires 201 and the central wire 202 having the same height h. The two side wires 201 and the center wire 202 may have different heights with respect to the supporting surface 100. In particular, the center line 202 may also be implemented to be disposed within a trench of the substrate 10.

Please continue to refer to fig. 2. The electronic component 30 may contact the center conductor 202. In detail, the electronic component 30 may be disposed on the central conductive wire 202, and the recess 302a of the insulating housing 302 preferably faces the central conductive wire 202 for the central conductive wire 202 to pass through. In addition, since the central conductive line 202 extends through the recess 302a and penetrates the electronic component 30, and the depth of the recess 302a is greater than the height h of the central conductive line 202, two sides 302b of the insulating housing 302 can be supported on the supporting surface 100, and the central conductive line 202 is located between the two sides 302b of the insulating housing 302 contacting the supporting surface 100, wherein the recess 302a can be formed by a groove of the insulating housing surrounding the electronic component 30. The grooves shown in fig. 2 are exemplary only and the grooves are not limited to any shape or size. That is, the groove may be circular, rectangular, triangular, etc., but the present invention is not limited thereto.

Referring again to fig. 1 and also to fig. 3, fig. 3 is an exploded view of the cross-line structure of the circuit shown in fig. 1. The central conductive line 202 and the electronic component 30 are disposed on the supporting surface 100, and the electronic component 30 is disposed above the central conductive line 202. An orthographic projection P2 of the center conductor 202 on the support surface 100 extends across an orthographic projection P3 of the electronic component 30 on the support surface 100. In other words, the orthographic projection P2 of the center conductor 202 on the support surface 100 intersects the orthographic projection P3 of the electronic component 30 on the support surface 100.

Referring to fig. 4, fig. 4 is a perspective view and an exploded view of another embodiment of a circuit flying lead structure according to the disclosure. Compared to the aforementioned embodiments, the supporting surface 100 'of the substrate 10' of the present embodiment further has two grooves 110 formed therein for accommodating the two side wires 201, and a groove 120 formed therein for accommodating the central wire 202. Specifically, the portions of the support surface 100 ' defining the

grooves

110 and 120 are recessed from the support surface 100 ' relative to other portions of the support surface 100 '. The substrate 10' may also be implemented with only the groove 120 for receiving the central conductive line 202. In other words, the two side wires 201 and the central wire 202 may have different heights with respect to the supporting surface 100', and the present invention is not limited thereto. In the case that the center wire 202 is received in the groove 120, the electronic component 30 without the recess 302a can also be stably supported by the portion of the supporting surface 100' adjacent to the groove 120.

Referring to fig. 1, fig. 2 and fig. 6, fig. 6 is a flowchart illustrating a method for manufacturing a circuit cross-line structure according to an embodiment of the disclosure. The method mainly comprises steps S01, S02 and S03. Specifically, step S01 includes: a substrate 10 having a supporting surface 100 is provided, wherein the step S01 is preferably realized by selecting a substrate having a single-layer structure as the substrate 10.

Step S01 can also be achieved by providing a substrate 10' with

trenches

110 and 120 formed thereon to accommodate two side wires 201 and a central wire 202. Also, the surfaces of the

grooves

110 and 120 are the support surfaces 100'.

Step S02 includes: the two side wires 201 and the center wire 202 are formed on the supporting surface 100, and the step S02 is preferably performed by printing the two side wires 201 and the center wire 202 on the supporting surface 100, so that the two side wires 201 and the center wire 202 can have the same height h relative to the supporting surface 100. The printing of the two side wires 201 and the center wire 202 on the supporting surface 100 is preferably performed in a single-time printing (one-time printing), that is, the two side wires 201 and the center wire 202 are preferably formed on the supporting surface 100 at the same time. Alternatively, when only the trench 120 is formed on the substrate 10, the two side wires 201 and the central wire 202 are formed on the supporting surface 100, so that the two side wires 201 and the central wire 202 have different heights relative to the supporting surface 100.

Specifically, the two side wires 201 each have a first terminal 201a and a second terminal 201 b. The first terminal 201a and the second terminal 201b are separated from each other, wherein the central conductive line 202 is disposed between the first terminal 201a and the second terminal 201 b.

Step S03 includes: the electronic component 30 is disposed over the supporting surface and crosses the central conductive line 202, and two terminals 301 of the electronic component 30 are connected to the first terminal 201a and the second terminal 201 b. Disposing the electronic component 30 over the supporting surface and across the center conductor 202 further includes placing the insulating housing 302 of the electronic component 30 on the center conductor 202 while passing the center conductor 202 through the recess 302a of the insulating housing 302 and abutting the two sides 302 of the insulating housing 302 on the supporting surface 100, so that the electronic component 30 is not directly electrically connected to the center conductor 202.

Continuing from the above, the method of manufacturing the circuit flying lead structure 1 includes extending the orthographic projection P3 of the electronic component 30 on the supporting surface 100 and across the orthographic projection P2 of the central lead 202 on the supporting surface 100 when the electronic component 30 crosses the central lead 202. In other words, the orthographic projections P2 and P3 intersect each other on the supporting surface 100, so that the electrical signals transmitted through the two side wires 201 (via the electronic component 30) do not interfere with the central wire 202.

In summary, according to the circuit flying lead structure and the manufacturing method thereof of one or more embodiments of the present invention, a circuit flying lead structure suitable for single-layer circuit design can be implemented to realize a circuit substrate that cannot have a through hole due to a specific reason, such as strength or manufacturing process of the substrate. In addition, according to the circuit flying lead structure and the method for manufacturing the same of one or more embodiments of the present invention, the circuit pattern can be simplified without forming a via hole. In addition, the through hole structure of the traditional printed circuit board can be omitted, so that the volume of the circuit overline structure can be reduced. Therefore, although the present invention discloses an exemplary circuit jumper structure suitable for single-layer circuit design, the present invention also provides a circuit jumper structure suitable for multi-layer circuit design to reduce the size of the overall circuit.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto. Without departing from the spirit and scope of the present invention, the following claims should be interpreted in an illustrative and non-limiting manner. For the protection defined by the present invention, reference should be made to the appended claims.

Claims

1. A circuit overline structure, characterized in that: comprises the following steps:

a substrate having a support surface;

2. The circuit flying lead structure of claim 1, wherein: wherein the insulating case is placed on the center conductor.

3. The circuit flying lead structure of claim 2, wherein: wherein the insulating shell is provided with a recess for the central lead to pass through.

4. The circuit flying lead structure of claim 3, wherein: wherein the electronic component is a passive component.

5. The circuit flying lead structure of claim 1, wherein: wherein the two side wires and the central wire have the same height relative to the supporting surface.

6. The circuit flying lead structure of claim 1, wherein: wherein the two side wires and the central wire have different heights relative to the supporting surface.

7. The circuit flying lead structure of claim 1, wherein: wherein the supporting surface of the substrate has a groove for accommodating the central conductive line.

8. The circuit flying lead structure of claim 7, wherein: wherein portions of the support surface defining the groove are recessed from the support surface relative to other portions of the support surface.