TWI500942B - - Google Patents

Info

Publication number
TWI500942B
TWI500942B TW103119957A TW103119957A TWI500942B TW I500942 B TWI500942 B TW I500942B TW 103119957 A TW103119957 A TW 103119957A TW 103119957 A TW103119957 A TW 103119957A TW I500942 B TWI500942 B TW I500942B
Authority
TW
Taiwan
Application number
TW103119957A
Other versions
TW201546462A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW103119957A priority Critical patent/TW201546462A/zh
Application granted granted Critical
Publication of TWI500942B publication Critical patent/TWI500942B/zh
Publication of TW201546462A publication Critical patent/TW201546462A/zh

Links

TW103119957A 2014-06-09 2014-06-09 具特性匹配功能的半導體測試載具 TW201546462A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103119957A TW201546462A (zh) 2014-06-09 2014-06-09 具特性匹配功能的半導體測試載具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103119957A TW201546462A (zh) 2014-06-09 2014-06-09 具特性匹配功能的半導體測試載具

Publications (2)

Publication Number Publication Date
TWI500942B true TWI500942B (zh) 2015-09-21
TW201546462A TW201546462A (zh) 2015-12-16

Family

ID=54608150

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119957A TW201546462A (zh) 2014-06-09 2014-06-09 具特性匹配功能的半導體測試載具

Country Status (1)

Country Link
TW (1) TW201546462A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116990656A (zh) * 2023-09-27 2023-11-03 苏州朗之睿电子科技有限公司 半导体测试器用测试片及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684007B (zh) * 2016-05-18 2020-02-01 佳思科技有限公司 半導體測試治具之靜電消散結構

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265888B1 (en) * 1998-03-27 2001-07-24 Scs Hightech, Inc. Wafer probe card
TW200830524A (en) * 2006-12-29 2008-07-16 Advanced Chip Eng Tech Inc RF module package
TW201339584A (zh) * 2012-03-20 2013-10-01 Mpi Corp 高頻探針及其探針卡

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265888B1 (en) * 1998-03-27 2001-07-24 Scs Hightech, Inc. Wafer probe card
TW462103B (en) * 1998-03-27 2001-11-01 Shiu Fu Jia Wafer testing device and method
TW200830524A (en) * 2006-12-29 2008-07-16 Advanced Chip Eng Tech Inc RF module package
TW201339584A (zh) * 2012-03-20 2013-10-01 Mpi Corp 高頻探針及其探針卡

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116990656A (zh) * 2023-09-27 2023-11-03 苏州朗之睿电子科技有限公司 半导体测试器用测试片及其制备方法
CN116990656B (zh) * 2023-09-27 2023-12-12 苏州朗之睿电子科技有限公司 半导体测试器用测试片及其制备方法

Also Published As

Publication number Publication date
TW201546462A (zh) 2015-12-16

Similar Documents

Publication Publication Date Title
BR112015027867A2 (zh)
BR112016023418A2 (zh)
BR112016023360A2 (zh)
BR112016026638A2 (zh)
BR112016016403A2 (zh)
BR112016017356A2 (zh)
BR112016021674A2 (zh)
BR112016022141A2 (zh)
BR112016025754A2 (zh)
BR112016016453A2 (zh)
BR112016022820A2 (zh)
BR112016018007A2 (zh)
BR112016015736A2 (zh)
BR112016030337A2 (zh)
BR112016026226A2 (zh)
BR112016020390A2 (zh)
BR112016022075A2 (zh)
BR112016016675A2 (zh)
JP1520081S (zh)
JP1522257S (zh)
BR202014013313U2 (zh)
CN302707533S (zh)
CN302719817S (zh)
CN302700104S (zh)
CN302698829S (zh)