TWI498649B - Display panel and method for manufacturing the same - Google Patents

Description

Display panel and method of manufacturing same

The present invention relates to a display panel and a method of fabricating the same, and more particularly to a display panel and a method of fabricating the same, including an annular sealant formed by using a conductive paste and an insulating colloid.

In the design of the liquid crystal panel, in order to achieve the design of the narrow margin, conductive particles are added to the sealant as an interface for conducting a common voltage (VCOM) between the thin film transistor substrate and the color filter substrate.

FIG. 1 is a partial cross-sectional view of the display panel 1000. As shown in FIG. 1 , the sealant 910 is disposed between the thin film transistor substrate 920 and the color filter substrate 930 to fix the color filter substrate 930 to the thin film transistor substrate 920 . A liquid crystal layer (not shown) is disposed in a space defined between the sealant 910, the thin film transistor substrate 920, and the color filter substrate 930. The sealant 910 is doped with conductive particles 911, and the common voltage trace 921 of the thin film transistor substrate 920 is electrically connected to the common voltage layer 931 of the color filter substrate 930. Since the sealant 910 contains the conductive particles 911, the sealant 910 cannot contact or interfere with other circuit designs of the thin film transistor substrate 920 (for example, lines of different voltages such as gate lines, data lines, and power lines). If the sealant 910 is exposed to a voltage other than the common voltage, the display of the panel is likely to be poor. In order to avoid the problem that the sealant 910 contacts the voltage outside the common voltage trace 921 in the design of the narrow margin, the sealant will avoid the trace 922 having a different voltage at a predetermined distance D, resulting in less than 1 mm. There are difficulties in designing the narrow margin.

Therefore, there is a need to provide a display panel and a method of manufacturing the same that includes different sealant designs that solve the aforementioned problems.

It is an object of the present invention to provide a narrow-width display panel and a method of manufacturing the same, which comprises an annular sealant formed by using a conductive colloid and an insulating colloid.

A display panel includes: a first substrate; a second substrate; and a ring-shaped sealant disposed between the first substrate and the second substrate for bonding the first substrate to the second substrate The ring frame rubber includes a first portion and a second portion; wherein the first portion of the ring frame rubber is a conductive gel, and the second portion of the ring frame rubber is an insulating colloid .

A method for assembling a display panel, comprising the steps of: forming a conductive paste around a portion of a surface of a first substrate to form a pattern of the first portion; forming an insulating colloid around a portion of a surface of the second substrate Forming a pattern of the second portion; and aligning the alignment mark of one of the first substrate with the alignment mark of the second substrate, bonding the first substrate to the second substrate, and making the first The partial pattern forms a ring-shaped sealant with the pattern of the second portion.

The display panel of the present invention comprises a ring-shaped sealant composed of a conductive colloid and an insulating colloid. The ring-stack adhesive can combine the first substrate and the second substrate, and can also share the common voltage and signal of the first substrate. Or the static electricity is transferred to the second substrate by the conductive colloid, and then the insulating colloid is used to design the trace of the first substrate or the second substrate more flexibly, so that different traces are not short-circuited by the conductive colloid, thereby enabling display The front edge of the panel is reduced to less than 1 mm to reach the display panel of the narrow margin.

The above and other objects, features, and advantages of the present invention will become more apparent from the accompanying drawings.

100, 200, 300, 400, 1000‧‧‧ display panels

101‧‧‧ display area

102‧‧‧Non-display area

110, 260, 310, 460‧‧‧ first substrate

111, 112, 311, 312‧‧‧ alignment mark

113, 313‧‧‧ ring frame glue

113a‧‧‧ corner

113b‧‧‧ side

120, 220, 320, 420‧‧‧ conductive colloid

121, 321‧‧‧ conductive particles

130, 230, 921‧‧‧ shared voltage traces

140, 240‧‧‧Specific voltage traces

150, 250, 350, 450‧‧‧ insulating colloid

160, 210, 360, 410‧‧‧ second substrate

170‧‧‧Color filter layer

180‧‧‧Transparent plate

190, 931‧‧ ‧ shared voltage layer

330, 430‧‧‧ first conductive pad

340, 440‧‧‧ second conductive pad

390‧‧‧Specific voltage layer

910‧‧‧Box glue

911‧‧‧ conductive particles

920‧‧‧Thin film transistor substrate

922‧‧‧ Trace

930‧‧‧Color filter substrate

S100~S104‧‧‧Steps

A, A’‧‧‧ openings

Figure 1 is a partial cross-sectional view of the display panel.

2 is a method of assembling a display panel of the present invention.

Figure 3a is a top plan view of a first substrate in accordance with a first embodiment of the present invention.

Figure 3b is a top plan view of a second substrate in accordance with a first embodiment of the present invention.

Figure 3c is a top plan view of a display panel in accordance with a first embodiment of the present invention.

Figure 3d is a cross-sectional view of the AA' line of Figure 3.

Figure 3e is a cross-sectional view of the BB' line of Figure 3c.

4a is a top plan view of a first substrate in accordance with a second embodiment of the present invention.

Figure 4b is a top plan view of a second substrate in accordance with a second embodiment of the present invention.

Figure 4c is a top plan view of a display panel in accordance with a second embodiment of the present invention.

Figure 5a is a top plan view of a first substrate in accordance with a third embodiment of the present invention.

Figure 5b is a top plan view of a second substrate in accordance with a third embodiment of the present invention.

Figure 5c is a top plan view of a display panel in accordance with a third embodiment of the present invention.

Figure 5d is a cross-sectional view of the CC' line of Figure 5c.

Figure 6a is a top plan view of a first substrate in accordance with a fourth embodiment of the present invention.

Figure 6b is a top plan view of a second substrate in accordance with a fourth embodiment of the present invention.

Figure 6c is a top plan view of a display panel in accordance with a fourth embodiment of the present invention.

2 is a method of assembling a display panel of the present invention. The display panel 100 of the first embodiment of the present invention (shown in FIG. 3c) is completed by the assembly method shown in FIG. 2. The method for assembling the display panel 100 includes the following steps: Step S100: forming a conductive paste on the first substrate A portion of the surface is formed to form a pattern of the first portion. In this step, as shown in FIG. 3a, the conductive paste 120 may be formed around a portion of the surface of the first substrate 110 by screen printing or Sealing Dispensing. The first substrate 110 can be a thin film transistor substrate or a color filter substrate. In the embodiment of the present invention, the first substrate 110 is provided with a common voltage trace (VCOM) 130 and a specific voltage trace 140 for the thin film transistor substrate (for example, data). Line, gate line or power line, etc.). The conductive paste 120 has a plurality of conductive particles 121 mixed in a gel body and has electrical conductivity (as shown in FIG. 3e). The conductive paste 120 is formed on the surface of the first substrate 110 and contacts the common voltage trace 130 to the conductive paste 120. The conductive paste 120 may be formed at different positions according to the position of the common voltage trace 130 on the first substrate 110. For example, in FIG. 3a, the conductive paste 120 is formed on the first substrate 110 according to the common voltage trace 130. The four corners form a pattern of the first part. It should be particularly noted that not all of the common voltage traces 130 need to contact the conductive paste 120, and a portion of the common voltage traces 130 may contact the conductive paste 120.

Step S102: forming an insulating colloid around a portion of the surface of the second substrate to form a pattern of the second portion. In this step, as shown in FIG. 3b, the insulating paste 150 may be formed around the portion of the surface of the second substrate 160 by screen printing or dispensing. The second substrate 160 can be a thin film transistor substrate or a color filter substrate. In the embodiment of the present invention, the second substrate 160 is a color filter substrate. The color filter substrate 160 refers to a color filter layer 170 and a common voltage layer 190 formed on a surface of the transparent plate body 180. (As shown in FIG. 3d), the common voltage layer 190 may use a transparent oxidized metal material such as Indium Tin Oxide (ITO). In FIG. 3b, the insulating paste 150 is formed on four sides of the second substrate 160, particularly in the surface of the second substrate 160 adjacent to or in contact with the specific voltage trace 140 of the first substrate 110. The colloid 150 is formed to form a pattern of the second portion.

It should be particularly noted that step S100 and step S102 can be performed simultaneously in actual operation, and there is no relationship.

Step S104: aligning the alignment mark of the first substrate with the alignment mark of the second substrate, bonding the first substrate to the second substrate, and forming the pattern of the first portion and the pattern of the second portion to form a ring frame Glue, which is a combination of conductive rubber and insulating rubber. Referring to FIG. 3a and FIG. 3b, in this step, the first substrate 110 and the second substrate 160 respectively have alignment marks 111 and 112 for first bonding when the first substrate 110 is coupled to the second substrate 160. Alignment on substrate 110 The mark 111 is aligned with the alignment mark 112 on the second substrate 160, so that the first substrate 110 can be accurately bonded to the second substrate 160, and the pattern of the first portion and the pattern of the second portion can form a ring. As shown in FIG. 3c, the ring sealant 113 has a rectangular shape formed by four corners 113a and four sides 113b. The first part of the annular sealant 113 is the annular sealant 113. The four corners 113a of the ring-shaped sealant 113 are the four sides 113b of the annular sealant 113. Then, the ring-shaped sealant 113 is cured, and the first substrate 110 and the second substrate 160 are bonded to each other to complete the display panel 100. The annular sealant 113 can be used to seal an element (such as a liquid crystal) between the first substrate 110 and the second substrate 160. The display panel 100 has a display area 101 and a non-display area 102. The non-display area 102 surrounds the display area 101. The common voltage trace 130 and the specific voltage trace 140 of the first substrate are disposed in the non-display area 102. .

Figure 3d is a cross-sectional view of the AA' line of Figure 3c. The annular sealant 113 of the display panel 100 is disposed between the first substrate 110 and the second substrate 160. The first substrate 110 is a thin film transistor substrate, and includes a common voltage trace 130 and a specific voltage trace 140. The second substrate 160 is a color filter substrate, and includes a color filter 170 and a common voltage layer 190. Since the specific voltage trace 140 is adjacent to or in contact with the insulating colloid 150, the specific voltage trace 140 is not electrically connected to the common voltage layer 190 of the second substrate 160.

Figure 3e is a cross-sectional view of the BB' line of Figure 3c. The annular sealant 113 includes the conductive paste 120 and the insulating paste 150. The design of the wiring of the first substrate 110 concentrates the common voltage trace 130 at a position in contact with the conductive paste 120, and sets the specific voltage trace 140 at a position away from the conductive paste 120 and adjacent to or in contact with the insulating paste 150. The display panel 100 of the present invention can be used in conjunction with the use of the conductive paste 120 and the insulating paste 150 to match the common voltage trace 130 of the first substrate 110 and the trace of the specific voltage trace 140, so that the common voltage can be taken. The wire 130 is electrically connected to the common voltage layer 190 of the second substrate 160 by the conductive particles 121 of the conductive paste 120 of the annular sealant 113, and the insulating paste 150 of the annular sealant 113 does not have to avoid a specific voltage. The wire 140 is routed to enable the display panel 100 to achieve a narrow edge design.

The method of assembling the display panel 200 (shown in FIG. 4c) of the second embodiment of the present invention will be described again with the steps shown in FIG. 2. The assembling method of the display panel 200 of the second embodiment is substantially similar to the assembling method of the display panel 100 of the first embodiment, and similar components are denoted by similar reference numerals, except that the conductive colloid 220 and the position of the insulating colloid 250 are formed. . The assembling method of the display panel 200 includes the following steps: Step S100: In this step, the action is modified to form a conductive colloid around a portion of the surface of the second substrate to form a pattern of the first portion. As shown in FIG. 4a, the second substrate 210 is a color filter substrate, and the conductive paste 220 is formed on the surface of the second substrate 210 corresponding to the common voltage trace position 230 (shown in FIG. 4b) of the first substrate 260. . In FIG. 4a, conductive pastes 220 are formed at the four corners of the second substrate 210 to form a pattern of the first portions.

Step S102: In this step, the action is modified to form an insulating colloid around a portion of the surface of the first substrate to form a pattern of the second portion. As shown in FIG. 4b, the first substrate 260 is a thin film transistor substrate, and includes a common voltage trace 230 and a specific voltage trace 240. For example, the common voltage trace 230 is disposed at four corners of the first substrate 260. A specific voltage trace 240 is disposed on one side of the first substrate 260. The insulating paste 250 is formed on the surface of the first substrate 260 and adjacent to or in contact with the specific voltage trace 240. In FIG. 4b, the insulating paste 250 is formed on the four sides of the first substrate 260 and leaves a notch at the four corners of the first substrate 260 to form a pattern of the second portion.

The assembly method of the display panel 200 of the second embodiment is different from the assembly method of the display panel 100 of the first embodiment only in that the conductive paste 120 of the first embodiment is formed on the surface of the thin film transistor substrate, and the second implementation The conductive paste 220 of the example is formed on the surface of the color filter substrate. The insulating colloid 150 of the first embodiment is formed on the surface of the color filter substrate, and the insulating colloid 250 of the second embodiment is formed on the surface of the thin film transistor substrate. Step S104 of the second embodiment is the same as step S104 of the first embodiment, and details are not described herein.

The method of assembling the display panel 300 (shown in FIG. 5c) of the third embodiment of the present invention will be described again with the steps shown in FIG. 2 as follows. The assembling method of the display panel 300 of the third embodiment is substantially similar to the assembling method of the display panel of the first embodiment, and like elements are denoted by like reference numerals. The assembly method of the display panel includes the following steps:

Step S100: In this step, as shown in FIG. 5a, the first substrate 310 is a thin film transistor substrate, and includes a first conductive pad 330 and a second conductive pad 340. The conductive paste 320 is formed on the surface of the first substrate 310 and covers the first conductive pad 330 to form a pattern of the first portion. The conductive paste 320 may be formed at different positions according to the position of the first conductive pad 330.

Step S102: In this step, as shown in FIG. 5b, the second substrate 360 is a color filter substrate. The second substrate 360 includes a specific voltage layer 390 (shown in FIG. 5d). The specific voltage layer 390 can be a transparent oxidized metal material such as Indium Tin Oxide (ITO). The insulating colloid 350 is formed on the surface of the second substrate 360 corresponding to the position of the second conductive pad 340. In FIG. 5b, the insulating paste 350 further surrounds the surface of the second substrate 360, and the insulating paste 350 leaves an opening A at a position relative to the first conductive pad 330 to form a pattern of the second portion.

Step S104: aligning the alignment mark 311 on the first substrate 310 with the alignment mark 312 on the second substrate 360, and accurately bonding the first substrate 310 to the second substrate 360, the pattern of the first portion An annular sealant 313 can be formed with the pattern of the second portion, as shown in Figure 5c. Then, the annular frame glue 313 is cured, and the first substrate 310 and the second substrate 360 are bonded to each other to complete the display panel 300.

Figure 5d is a cross-sectional view of the CC' line of Figure 5c. The annular sealant 313 of the display panel 300 is disposed between the first substrate 310 and the second substrate 360. The ring-shaped sealant 313 includes the conductive paste 320 and the insulating colloid 350. The conductive paste 320 is disposed on the first conductive pad 330 and the specific voltage. The insulating paste 350 covers the second conductive pad 340 between the layers 390. The first conductive pad 330 of the first substrate 310 and the specific voltage layer 390 of the second substrate 360 are electrically connected by the conductive particles 321 of the conductive paste 320. For example, when a gate line or a data line needs to transmit a signal to the second substrate 360, the signal can be transmitted to the second substrate 360 through the first conductive pad 330 and the conductive paste 320, or the first substrate 310 can be eliminated. In the static electricity, the static electricity on the first substrate 310 can also be transmitted to the second substrate 360 through the first conductive pad 330. In addition, since the insulating paste 350 covers the second conductive pad 340, the first conductive pad 330 and the second conductive pad 340 are electrically connected to each other via the conductive paste 320.

The method of assembling the display panel 400 (shown in Fig. 6c) of the fourth embodiment of the present invention will be described with the steps shown in Fig. 2. The assembly method of the display panel 400 of the fourth embodiment is substantially similar to the assembly method of the display panel 300 of the third embodiment, and like elements are denoted by like reference numerals. The assembly method of the display panel 400 includes the following steps:

Step S100: In this step, the action is modified to form a conductive paste around a portion of the surface of the second substrate to form a pattern of the first portion. As shown in FIG. 6a, the second substrate 410 is a color filter substrate, and a surface of the second substrate 410 corresponding to the first conductive pad 430 of the first substrate 460 (as shown in FIG. 6b) is formed with a conductive paste 420. To form a pattern of the first portion.

Step S102: In this step, the action is modified to form an insulating colloid around a portion of the surface of the first substrate to form a pattern of the second portion. As shown in FIG. 6b, the first substrate 460 is a thin film transistor substrate, and includes a first conductive pad 430 and a second conductive pad 440. The insulating paste 450 is formed on the surface of the first substrate 460 and covers the second conductive pad 440. In FIG. 4b, the insulating paste 450 covers the second conductive pad 440 and surrounds the surface of the second substrate 460, and the insulating colloid 450 leaves an opening A' at the location of the first conductive pad 430 to form a pattern of the second portion.

The assembly method of the display panel 400 of the fourth embodiment is different from the assembly method of the display panel 300 of the third embodiment only in that: The conductive paste 320 of the embodiment is formed on the surface of the thin film transistor substrate, and the conductive paste 420 of the fourth embodiment is formed on the surface of the color filter substrate. The insulating colloid 350 of the third embodiment is formed on the surface of the color filter substrate, and the insulating colloid 450 of the fourth embodiment is formed on the surface of the thin film transistor substrate. Therefore, step S104 of the fourth embodiment is the same as step S104 of the third embodiment, and details are not described herein.

In summary, the display panel of the present invention includes a ring-shaped sealant composed of a conductive paste and an insulating colloid, and the ring-shaped sealant can be combined with the first substrate and the second substrate to form the first substrate. The common voltage, signal or static electricity is transmitted to the second substrate through the conductive colloid, and the insulating colloid is used to design the wiring of the first substrate or the second substrate more flexibly, so that different traces are not short-circuited by the conductive colloid. In turn, the front edge of the display panel can be reduced to less than 1 mm to reach the display panel of the narrow margin.

In summary, it is only stated that the present invention is used to solve the problem. The embodiments or examples of the technical means are not intended to limit the scope of the practice of the invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.

100‧‧‧ display panel

110‧‧‧First substrate

113‧‧‧Ring frame glue

120‧‧‧Electrical colloid

121‧‧‧ conductive particles

130‧‧‧Common voltage wiring

150‧‧‧Insulating colloid

160‧‧‧second substrate

190‧‧‧Common voltage layer

Claims (10)

A display panel includes a first substrate including a first conductive pad and a second conductive pad, a second substrate including a specific voltage layer, and a ring-shaped sealant disposed on the first substrate and the Between the second substrate, the first substrate is bonded to the second substrate, the annular frame rubber includes a first portion and a second portion; wherein the first portion of the annular frame glue The conductive paste is disposed between the first conductive pad and the specific voltage layer, and the second portion of the annular sealant is an insulating colloid, and the insulating colloid covers the second conductive pad. And the insulating colloid leaves an opening at a position relative to the first conductive pad. The display panel of claim 1, wherein the conductive colloid is electrically conductive by mixing a plurality of conductive particles in a colloid. The display panel of claim 1, wherein the annular frame glue is a rectangle formed by four corners and four sides, and the first part of the ring frame glue is the ring frame glue. The four corners of the annular frame rubber are the four sides of the annular sealant. The display panel of claim 1, wherein the first substrate is provided with a common voltage trace and a specific voltage trace, the common voltage trace is in contact with the conductive paste, and the specific voltage trace is away from the The conductive colloid is adjacent to or in contact with the insulating colloid. The display panel of claim 4, wherein the second substrate comprises a common voltage layer disposed between the common voltage trace and the common voltage layer. The display panel of claim 4, wherein the display panel comprises a display area and a non-display area, the non-display area surrounds the display area, and the common voltage trace of the first substrate and the specific voltage The trace is set in the non-display area. A method for assembling a display panel, comprising the following steps: Forming a conductive paste around a portion of a surface of one of the first substrate or the second substrate to form a pattern of the first portion; forming an insulating colloid on the first substrate or the second substrate a portion of the surface of the one surface to form a pattern of the second portion; and an alignment mark between the alignment mark of the first substrate and the second substrate, such that the first substrate is bonded to the first substrate a second substrate, and the pattern of the first portion and the pattern of the second portion form a ring-shaped sealant; wherein the first substrate comprises a first conductive pad and a second conductive pad, the second substrate comprises a specific voltage layer, the conductive paste is disposed between the first conductive pad and the specific voltage layer, the insulating paste covers the second conductive pad, and the insulating colloid leaves a position relative to the first conductive pad Opening. The method of assembling a display panel according to claim 7, wherein the conductive paste is formed around a portion of the surface of the first substrate by screen printing or dispensing. The method of assembling a display panel according to claim 7, wherein the insulating colloid is formed around a portion of the surface of the second substrate by screen printing or dispensing. The method of assembling a display panel according to claim 7, wherein the first substrate is provided with a common voltage trace and a specific voltage trace, the conductive paste is in contact with the common voltage trace, and the specific voltage is taken. The line is away from the conductive paste and is adjacent to or in contact with the insulating colloid.