CN103278970B - Display panel and manufacture method thereof - Google Patents
Display panel and manufacture method thereof Download PDFInfo
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- CN103278970B CN103278970B CN201310126930.7A CN201310126930A CN103278970B CN 103278970 B CN103278970 B CN 103278970B CN 201310126930 A CN201310126930 A CN 201310126930A CN 103278970 B CN103278970 B CN 103278970B
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- substrate
- display panel
- ring
- frame glue
- conductive rubber
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Abstract
The present invention relates to a kind of display panel to comprise: a first substrate; One second substrate; And a ring-type frame glue, be arranged between this first substrate and this second substrate, in order to this first substrate is incorporated into this second substrate, this ring-type frame glue comprises a first part and one second part; Wherein the first part of this ring-type frame glue is a conductive rubber, and second of this ring-type frame glue the part is an insulation colloid.
Description
Technical field
The invention relates to a kind of display panel and manufacture method thereof, particularly about a kind of display panel and manufacture method thereof, it includes the ring-type frame glue simultaneously utilizing conductive rubber and insulation colloid to be formed.
Background technology
In the design of liquid crystal panel, in order to reach the design of narrow margo frontalis, conducting particles can be added in frame glue, as between thin film transistor base plate and colored filter substrate in order to conduct the interface of share voltage (VCOM).
As shown in Figure 1, be the fragmentary sectional schematic diagram of display panel 1000.As can be known from Fig. 1, frame glue 910 around being arranged between thin film transistor base plate 920 and colored filter substrate 930, in order to this colored filter substrate 930 is fixed on this thin film transistor base plate 920.One liquid crystal layer (not shown) is arranged in the space that defined between this frame glue 910, thin film transistor base plate 920 and colored filter substrate 930.Be mixed with conducting particles 911 in frame glue 910, make the share voltage cabling 921 of thin film transistor base plate 920 be electrically connected the share voltage layer 931 of colored filter substrate 930.Because frame glue 910 is containing conducting particles 911, therefore for other the line design (such as, the circuit of the different voltages such as brake cable, data line and power lead) of thin film transistor base plate 920, frame glue 910 all can not contact or interfere.If frame glue 910 touches the voltage beyond share voltage, easily cause the display of panel bad.In order to avoid frame glue 910 touches the problem of the voltage beyond share voltage cabling 921 in the design of narrow margo frontalis, frame glue can be avoided the cabling 922 with different voltage with a predetermined distance D, cause be less than 1 millimeter narrow margo frontalis design on have any problem.
Therefore, just have needs to provide a kind of display panel and manufacture method thereof, it includes different frame glue designs, can solve aforesaid problem.
Summary of the invention
The object of the present invention is to provide a kind of display panel and manufacture method thereof of narrow margo frontalis, it includes the ring-type frame glue simultaneously utilizing conductive rubber and insulation colloid to be formed.
The invention provides a kind of display panel, comprising: a first substrate; One second substrate; And a ring-type frame glue, be arranged between this first substrate and this second substrate, in order to this first substrate is incorporated into this second substrate, this ring-type frame glue comprises a first part and one second part; Wherein the first part of this ring-type frame glue is a conductive rubber, and second of this ring-type frame glue the part is an insulation colloid.
Further, wherein this conductive rubber is be mixed with multiple conducting particles in colloid to have electric conductivity.
Further, the wherein rectangle that forms for four corners and four limits of this ring-type frame glue, this first part of this ring-type frame glue is these four corners of this ring-type frame glue, and this second part of this ring-type frame glue is these four limits of this ring-type frame glue.
Further, wherein this first substrate is provided with a share voltage cabling and a specific voltage cabling, and this share voltage cabling is contacted with this conductive rubber, and this specific voltage cabling is contiguous or be contacted with this insulation colloid away from this conductive rubber.
Further, wherein this second substrate comprises a shared voltage layer, and this conductive rubber is arranged between share voltage cabling and this share voltage layer.
Further, wherein this display panel comprises a viewing area and a non-display area, and this non-display area is around this viewing area, and this share voltage cabling of this first substrate and this specific voltage cabling are arranged at this non-display area.
Further, wherein this first substrate comprises one first conductive pad and one second conductive pad, and this second substrate comprises a specific voltage layer, and this conductive rubber is arranged between this first conductive pad and this specific voltage layer, and this insulation colloid covers this second conductive pad.
The present invention also provides a kind of assemble method of display panel, comprises the following steps: that formation one conductive rubber is in the peripheral portion on a first substrate surface, to form a Part I pattern; Form an insulation colloid in the peripheral portion on a second substrate surface, to form a Part II pattern; And aim at an alignment mark of this first substrate and an alignment mark of this second substrate, make this first substrate be incorporated into this second substrate, and make this first part pattern and this second part pattern form a ring-type frame glue.
Further, wherein this conductive rubber utilizes wire mark mode or some glue mode to be formed in the peripheral portion on this first substrate surface.
Further, wherein this insulation colloid utilizes wire mark mode or some glue mode to be formed in the peripheral portion on this second substrate surface.
Further, wherein this first substrate is provided with a share voltage cabling and a specific voltage cabling, and this conductive rubber is contacted with this share voltage cabling, and this specific voltage cabling is contiguous or be contacted with this insulation colloid away from this conductive rubber.
Further, wherein this first substrate comprises one first conductive pad and one second conductive pad, and this conductive rubber is arranged between this first conductive pad and this specific voltage layer, and this insulation colloid covers this second conductive pad.
Display panel of the present invention includes the ring-type frame glue simultaneously utilizing conductive rubber and insulation colloid to form, this ring-type frame glue is except in conjunction with except first substrate and second substrate, the common voltage of first substrate, signal or electrostatic can also be sent to second substrate by conductive rubber, coordinated insulation colloid again, the cabling of first substrate or second substrate can be designed more flexibly, make different cablings can not the short circuit because of conductive rubber, and then the margo frontalis of display panel can be made to be contracted to the degree being less than 1 millimeter, reach the display panel of narrow margo frontalis.
Accompanying drawing explanation
Fig. 1 is the fragmentary sectional schematic diagram of display panel.
Fig. 2 is the assemble method of display panel in the present invention.
Fig. 3 a is the top view of first substrate in first embodiment of the invention.
Fig. 3 b is the top view of second substrate in first embodiment of the invention.
Fig. 3 c is the top view of display panel in first embodiment of the invention.
Fig. 3 d is the sectional view of AA ' line segment in Fig. 3 c.
Fig. 3 e is the sectional view of BB ' line segment in Fig. 3 c.
Fig. 4 a is the top view of first substrate in second embodiment of the invention.
Fig. 4 b is the top view of second substrate in second embodiment of the invention.
Fig. 4 c is the top view of display panel in second embodiment of the invention.
Fig. 5 a is the top view of first substrate in third embodiment of the invention.
Fig. 5 b is the top view of second substrate in third embodiment of the invention.
Fig. 5 c is the top view of display panel in third embodiment of the invention.
Fig. 5 d is the sectional view of CC ' line segment in Fig. 5 c.
Fig. 6 a is the top view of first substrate in fourth embodiment of the invention.
Fig. 6 b is the top view of second substrate in fourth embodiment of the invention.
Fig. 6 c is the top view of display panel in fourth embodiment of the invention.
Symbol description: 100,200,300,400,1000 display panels
101 viewing areas
102 non-display areas
110,260,310,460 first substrates
111,112,311,312 alignment marks
113,313 ring-type frame glue
113a corner
113b limit
120,220,320,420 conductive rubbers
121,321 conducting particless
130,230,921 share voltage cablings
140,240 specific voltage cablings
150,250,350,450 insulation colloids
160,210,360,410 second substrates
170 color filter layers
180 transparent plate bodys
190,931 share voltage layers
330,430 first conductive pads
340,440 second conductive pads
390 specific voltage layers
910 frame glue
911 conducting particless
920 thin film transistor base plates
922 cablings
930 colored filter substrates
S100 ~ S104 step.
Embodiment
More obviously, hereafter can will coordinate appended diagram, be described in detail below to allow above and other object of the present invention, feature and advantage.
Fig. 2 is the assemble method of display panel in the present invention.Borrow assemble method as shown in Figure 2 to complete the display panel 100 (as shown in Figure 3 c) of first embodiment of the invention, the assemble method of this display panel 100 comprises the following steps:
Step S100: form conductive rubber in the peripheral portion on first substrate surface, to form Part I pattern.In this step, as shown in Figure 3 a, this conductive rubber 120 can utilize wire mark mode (ScreenPrinting) or some glue mode (SealantDispensing) to be formed in the peripheral portion on first substrate 110 surface.This first substrate 110 can be thin film transistor base plate or colored filter substrate.In embodiments of the present invention, this first substrate 110 is provided with share voltage cabling (VCOM) 130 and a specific voltage cabling 140 (such as data line, brake cable or power lead etc.) for thin film transistor base plate.This conductive rubber 120 has electric conductivity (as shown in Figure 3 e) for being mixed with multiple conducting particles 121 in colloid.This conductive rubber 120 is formed in the surface of first substrate 110, and share voltage cabling 130 is contacted with this conductive rubber 120.According to the difference of the position of share voltage cabling 130 on first substrate 110, this conductive rubber 120 can be formed in different positions, such as in fig. 3 a, conductive rubber 120 is formed in four corners of first substrate 110 according to share voltage cabling 130, to form the pattern of a Part I.Illustrate be and not all share voltage cabling 130 all needs to contact conductive rubber 120, can be a part of share voltage cabling 130 contacts conductive rubber 120.
Step S102: form insulation colloid in the peripheral portion on second substrate surface, to form Part II pattern.In this step, as shown in Figure 3 b, this insulation colloid 150 can utilize wire mark mode or some glue mode to be formed in the peripheral portion on second substrate 160 surface.This second substrate 160 can be thin film transistor base plate or colored filter substrate.In embodiments of the present invention, this second substrate 160 is colored filter substrate, this colored filter substrate 160 refers to that forming a color filter layers 170 and on the surface of a transparent plate body 180 shares voltage layer 190 (as shown in Figure 3 d), this share voltage layer 190 can use transparent Indium metal material, such as tin indium oxide (IndiumTinOxide, ITO).In fig 3b, this insulation colloid 150 is formed on four limits of second substrate 160, particularly form insulation colloid 150, to form a Part II pattern on the surface of this second substrate 160 of specific voltage cabling 140 position that is contiguous or that be contacted with this first substrate 110.
Illustrate, step S100 and step S102 can carry out when practical operation simultaneously, there is no precedence relationship.
Step S104: aim at the alignment mark of first substrate and the alignment mark of second substrate, make first substrate be incorporated into second substrate, and make first part pattern and the second part pattern form ring-type frame glue, be the combination of conducting resin material and insulating gel material.Referring again to Fig. 3 a and Fig. 3 b, in this step, first substrate 110 and second substrate 160 respectively there is alignment mark 111, 112, in order to when first substrate 110 is incorporated into second substrate 160, alignment mark 111 on first substrate 110 aims at the alignment mark 112 on second substrate 160, just exactly first substrate 110 can be incorporated into second substrate 160, this first part pattern and this second part pattern just can form ring-type frame glue 113, as shown in Figure 3 c, this ring-type frame glue 113 is four corner 113a and four rectangle that limit 113b is formed, the first part of this ring-type frame glue 113 is four corner 113a of this ring-type frame glue 113, second part of this ring-type frame glue 113 is four limit 113b of this ring-type frame glue 113.Again ring-type frame glue 113 is cured afterwards, first substrate 110 and second substrate 160 is be combined with each other, display panel 100 can be completed.This ring-type frame glue 113 can in order to seal the element (such as liquid crystal) between first substrate 110 and second substrate 160.Display panel 100 after completing has viewing area 101 and a non-display area 102, and this non-display area 102 is around this viewing area 101, and the share voltage cabling 130 of this first substrate and specific voltage cabling 140 are arranged at this non-display area 102.
Fig. 3 d is the sectional view of AA ' line segment in Fig. 3 c.This ring-type frame glue 113 of this display panel 100 is arranged between this first substrate 110 and this second substrate 160.This first substrate 110 is thin film transistor base plate, comprises a share voltage cabling 130 and specific voltage cabling 140.This second substrate 160 is colored filter substrate, comprises colored filter 170 and share voltage layer 190.Because this specific voltage cabling 140 is contiguous or be contacted with this insulation colloid 150, so specific voltage cabling 140 can not be electrically connected with the share voltage layer 190 of second substrate 160.
Fig. 3 e is the sectional view of BB ' line segment in Fig. 3 c.This ring-type frame glue 113 comprises this conductive rubber 120 and this insulation colloid 150.Share voltage cabling 130 is concentrated on the position being contacted with conductive rubber 120 by the design of the circuit of first substrate 110, and is arranged on specific voltage cabling 140 away from conductive rubber 120 and contiguous or be contacted with the position of this insulation colloid 150.Display panel 100 of the present invention can by the use by this conductive rubber 120 and this insulation colloid 150, coordinate the share voltage cabling 130 of first substrate 110 and the cabling design of specific voltage cabling 140 again, share voltage cabling 130 can be made to be electrically connected the share voltage layer 190 of second substrate 160 by the conducting particles 121 of the conductive rubber 120 of ring-type frame glue 113, and the insulation colloid 150 of ring-type frame glue 113 need not avoid specific voltage cabling 140 again, make display panel 100 can reach the design of narrow margo frontalis.
The assemble method of the display panel 200 (as illustrated in fig. 4 c) of second embodiment of the invention, by again with shown in Fig. 2 step illustrate as after.The assemble method of the display panel 200 of the second embodiment is similar to the assemble method of the display panel 100 of the first embodiment, the label that similar element marking is similar substantially, and different places is the forming position of conductive rubber 220 and this insulation colloid 250.The assemble method of this display panel 200 comprises the following steps:
Step S100: in this step, is revised as action: form conductive rubber in the peripheral portion on second substrate surface, to form Part I pattern.As shown in fig. 4 a, second substrate 210 is colored filter substrate, to forming this conductive rubber 220 in the share voltage of first substrate 260 surface of walking this second substrate 210 of line position 230 (as shown in Figure 4 b).In fig .4, conductive rubber 220 is formed in four corners of second substrate 210, to form the pattern of a Part I.
Step S102: in this step, is revised as action: form insulation colloid in the peripheral portion on first substrate surface, to form Part II pattern.As shown in Figure 4 b, first substrate 260 is thin film transistor base plate, comprise share voltage cabling 230 and a specific voltage cabling 240, such as this share voltage cabling 230 is arranged on four corners of first substrate 260, and specific voltage cabling 240 is arranged on a limit of first substrate 260.This insulation colloid 250 is formed in this first substrate 260 surface, and is close to or is contacted with this specific voltage cabling 240.In fig. 4b, this insulation colloid 250 is formed on four limits of first substrate 260, and leaves breach in four corners of first substrate 260, to form a Part II pattern.
The assemble method of the display panel 200 of the second embodiment place different from the assemble method of the display panel 100 of the first embodiment is only: the conductive rubber 120 of the first embodiment is formed in the surface of thin film transistor base plate, and the conductive rubber 220 of the second embodiment is formed in the surface of colored filter substrate.The insulation colloid 150 of the first embodiment is formed in the surface of colored filter substrate, and the insulation colloid 250 of the second embodiment is formed in the surface of thin film transistor base plate.The step S104 of the second embodiment is identical with the step S104 of the first embodiment, and at this, then it will not go into details.
The assemble method of the display panel 300 (as shown in Figure 5 c) of third embodiment of the invention, by again with shown in Fig. 2 step illustrate as after.The assemble method of the display panel 300 of the 3rd embodiment is similar to the assemble method of the display panel of the first embodiment, the label that similar element marking is similar substantially.The assemble method of this display panel comprises the following steps:
Step S100: in this step, as shown in Figure 5 a, first substrate 310 is thin film transistor base plate, comprises one first conductive pad 330 and one second conductive pad 340.Conductive rubber 320 is formed in the surface of first substrate 310, and covers the first conductive pad 330, has formed Part I pattern.This conductive rubber 320 according to the difference of the first conductive pad 330 position, and can be formed in different positions.
Step S102: in this step, as shown in Figure 5 b, this second substrate 360 is colored filter substrate.This second substrate 360 comprises a specific voltage layer 390 (as fig 5d), and this specific voltage layer 390 can be transparent Indium metal material, such as tin indium oxide (IndiumTinOxide, ITO).To the surface of this second substrate 360 of the second conductive pad 340 position forming this insulation colloid 350.In figure 5b, this insulation colloid 350 is more around the surface of second substrate 360, and the colloid 350 that insulate leaves an opening on the position relative to the first conductive pad 330, has formed a Part II pattern.
Step S104: the alignment mark 311 on first substrate 310 is aimed at the alignment mark 312 on second substrate 360, just exactly first substrate 310 can be incorporated into second substrate 360, this first part pattern and this second part pattern just can form a ring-type frame glue 313, as shown in Figure 5 c.Again ring-type frame glue 313 is cured, first substrate 310 and second substrate 360 is be combined with each other, display panel 300 can be completed.
Fig. 5 d is the sectional view of CC ' line segment in Fig. 5 c.This ring-type frame glue 313 of this display panel 300 is arranged between this first substrate 310 and this second substrate 360.This ring-type frame glue 313 comprises this conductive rubber 320 and this insulation colloid 350, and this conductive rubber 320 is arranged between this first conductive pad 330 and this specific voltage layer 390, and this insulation colloid 350 covers this second conductive pad 340.First conductive pad 330 of this first substrate 310 is electrically connected by the conducting particles 321 of conductive rubber 320 with the specific voltage layer 390 of second substrate 360.Such as, when signal need be passed to second substrate 360 by a brake cable or a data line, just can pass through the first conductive pad 330 and signal is passed to second substrate 360 by conductive rubber 320, or when eliminating the electrostatic on first substrate 310, also can pass through the first conductive pad 330 and the electrostatic on first substrate 310 is passed to second substrate 360.In addition, because this insulation colloid 350 covers this second conductive pad 340, can avoid being electrically connected via conductive rubber 320 with the first conductive pad 330 and the second conductive pad 340.
The assemble method of the display panel 400 (as fig. 6 c) of fourth embodiment of the invention is by with the step explanation shown in Fig. 2.The assemble method of the display panel 400 of the 4th embodiment is similar to the assemble method of the display panel 300 of the 3rd embodiment, the label that similar element marking is similar substantially.The assemble method of this display panel 400 comprises the following steps:
Step S100: in this step, is revised as action: form conductive rubber in the peripheral portion on second substrate surface, to form Part I pattern.As shown in Figure 6 a, second substrate 410 is colored filter substrate, to should first substrate 460 the first conductive pad 430 position (as shown in Figure 6 b) this second substrate 410 surface formed conductive rubber 420, to form Part I pattern.
Step S102: in this step, is revised as action: form insulation colloid in the peripheral portion on first substrate surface, to form Part II pattern.As shown in Figure 6 b, first substrate 460 is thin film transistor base plate, comprises one first conductive pad 430 and one second conductive pad 440.This insulation colloid 450 is formed in the surface of first substrate 460, and cover this second conductive pad 440, in fig. 4b, this insulation colloid 450 covers the second conductive pad 440 and around the surface of second substrate 460, and the colloid 450 that insulate leaves an opening on the position of the first conductive pad 430, to form a Part II pattern.
The place that the assemble method of the display panel 400 of the 4th embodiment is different from the assemble method of the display panel 300 of the 3rd embodiment is only: the conductive rubber 320 of the 3rd embodiment is formed in the surface of thin film transistor base plate, and the conductive rubber 420 of the 4th embodiment is formed in the surface of colored filter substrate.The insulation colloid 350 of the 3rd embodiment is formed in the surface of colored filter substrate, and the insulation colloid 450 of the 4th embodiment is formed in the surface of thin film transistor base plate.Therefore the step S104 of the 4th embodiment is identical with the step S104 of the 3rd embodiment, and at this, then it will not go into details.
In sum, display panel of the present invention includes the ring-type frame glue simultaneously utilizing conductive rubber and insulation colloid to form, this ring-type frame glue is except in conjunction with except first substrate and second substrate, the common voltage of first substrate, signal or electrostatic can also be sent to second substrate by conductive rubber, coordinated insulation colloid again, the cabling of first substrate or second substrate can be designed more flexibly, make different cablings can not the short circuit because of conductive rubber, and then the margo frontalis of display panel can be made to be contracted to the degree being less than 1 millimeter, reach the display panel of narrow margo frontalis.
In sum, being only embodiment or the embodiment of notebook invention for presenting adopted technological means of dealing with problems, being not used for limiting the scope of patent working of the present invention.Namely all and of the present invention patent claim contexts conform to, or change according to the equalization that the scope of the claims of the present invention does and modify, and are all the scope of the claims of the present invention and contain.
Claims (8)
1. a display panel, comprising:
One first substrate;
One second substrate; And
One ring-type frame glue, is arranged between this first substrate and this second substrate, and in order to this first substrate is incorporated into this second substrate, this ring-type frame glue comprises a first part and one second part;
Wherein this first part of this ring-type frame glue is a conductive rubber, and this second part of this ring-type frame glue is an insulation colloid;
The wherein rectangle that forms for four corners and four limits of this ring-type frame glue, this first part of this ring-type frame glue is these four corners of this ring-type frame glue, and this second part of this ring-type frame glue is these four limits of this ring-type frame glue;
Wherein this first substrate is provided with a share voltage cabling and a specific voltage cabling, and this share voltage cabling is contacted with this conductive rubber, and this specific voltage cabling is contiguous or be contacted with this insulation colloid away from this conductive rubber;
Wherein this second substrate comprises a shared voltage layer, and this conductive rubber is arranged between share voltage cabling and this share voltage layer.
2. display panel according to claim 1, is characterized in that: wherein this conductive rubber is be mixed with multiple conducting particles in colloid to have electric conductivity.
3. display panel according to claim 1, it is characterized in that: wherein this display panel comprises a viewing area and a non-display area, this non-display area is around this viewing area, and this share voltage cabling of this first substrate and this specific voltage cabling are arranged at this non-display area.
4. display panel according to claim 1, it is characterized in that: wherein this first substrate comprises one first conductive pad and one second conductive pad, this second substrate comprises a specific voltage layer, this conductive rubber is arranged between this first conductive pad and this specific voltage layer, and this insulation colloid covers this second conductive pad.
5. an assemble method for display panel, is characterized in that, comprises the following steps:
Form a conductive rubber in the peripheral portion on a first substrate or a second substrate wherein one surface, to form a Part I pattern;
Form an insulation colloid in the peripheral portion on this first substrate or this second substrate wherein another one surface, to form a Part II pattern; And
Aim at an alignment mark of this first substrate and an alignment mark of this second substrate, make this first substrate be incorporated into this second substrate, and make this first part pattern and this second part pattern form a ring-type frame glue;
Wherein this first substrate is provided with a share voltage cabling and a specific voltage cabling, and this conductive rubber is contacted with this share voltage cabling, and this specific voltage cabling is contiguous or be contacted with this insulation colloid away from this conductive rubber.
6. the assemble method of display panel according to claim 5, is characterized in that: wherein this conductive rubber utilizes wire mark mode or some glue mode to be formed in the peripheral portion on this first substrate surface.
7. the assemble method of display panel according to claim 5, is characterized in that: wherein this insulation colloid utilizes wire mark mode or some glue mode to be formed in the peripheral portion on this second substrate surface.
8. the assemble method of display panel according to claim 5, it is characterized in that: wherein this first substrate comprises one first conductive pad and one second conductive pad, this conductive rubber is arranged between this first conductive pad and specific voltage layer, and this insulation colloid covers this second conductive pad.
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| CN201310126930.7A CN103278970B (en) | 2013-04-13 | 2013-04-13 | Display panel and manufacture method thereof |
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| CN201310126930.7A CN103278970B (en) | 2013-04-13 | 2013-04-13 | Display panel and manufacture method thereof |
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| CN104297979B (en) * | 2014-10-30 | 2017-04-12 | 京东方科技集团股份有限公司 | Display panel mother board, display panel, manufacturing method of display panel and display device |
| CN107703662A (en) * | 2017-09-26 | 2018-02-16 | 惠科股份有限公司 | Display base plate and preparation method thereof |
| CN108535921B (en) * | 2018-06-08 | 2024-01-16 | 张家港康得新光电材料有限公司 | Display panel and display device |
| CN109166863A (en) * | 2018-07-25 | 2019-01-08 | 深圳市华星光电技术有限公司 | Apparatus for coating and its coating method, tft array substrate |
| CN110119225B (en) * | 2019-05-20 | 2022-05-10 | 业成科技（成都）有限公司 | Touch panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794048A (en) * | 2004-12-23 | 2006-06-28 | Lg.菲利浦Lcd株式会社 | Liquid crystal display panel and method of fabricating the same |
| CN101051126A (en) * | 2006-04-07 | 2007-10-10 | 群康科技(深圳)有限公司 | Panel for liquid crystal display |
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| CN101963717A (en) * | 2009-07-24 | 2011-02-02 | 北京京东方光电科技有限公司 | Liquid crystal display panel and manufacturing method thereof |
| TWI454809B (en) * | 2011-06-24 | 2014-10-01 | Au Optronics Corp | Liquid crystal display panel |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794048A (en) * | 2004-12-23 | 2006-06-28 | Lg.菲利浦Lcd株式会社 | Liquid crystal display panel and method of fabricating the same |
| CN101051126A (en) * | 2006-04-07 | 2007-10-10 | 群康科技(深圳)有限公司 | Panel for liquid crystal display |
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Effective date of registration: 20170807 Address after: 1#, building third, fourth, 6 West Road, Mawei West Road, Mawei District, Fujian, Fuzhou Co-patentee after: Chunghwa Picture Tubes Ltd. Patentee after: CPT DISPLAY TECHNOLOGY (SHENZHEN)CO., LTD. Address before: 350015, Xingye Road, Mawei Science Park, Fujian, Fuzhou 1, China Co-patentee before: Chunghwa Picture Tubes Ltd. Patentee before: Fujian Huaying Display Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20200413 |