TWI497717B - High source to drain breakdown voltage vertical field effect transistors - Google Patents
High source to drain breakdown voltage vertical field effect transistors Download PDFInfo
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- TWI497717B TWI497717B TW099115603A TW99115603A TWI497717B TW I497717 B TWI497717 B TW I497717B TW 099115603 A TW099115603 A TW 099115603A TW 99115603 A TW99115603 A TW 99115603A TW I497717 B TWI497717 B TW I497717B
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- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
本發明係一種高源漏崩潰電壓之垂直場效電晶體,包括有自源極之N+、N-、P、N-及漏極之N+,其源極之N+、N-及P型體構成一體二極體(Body Diode),而自源極之N+、N-及P型體亦構成一體二極體,亦就是形成一背對背連接之二極體,具雙向性之高崩潰電壓值之垂直場效電晶體。 The invention is a vertical field effect transistor with high source-drain breakdown voltage, comprising N+, N-, P, N- and drain N+ from the source, and N+, N- and P-type bodies of the source thereof. The body Diode, and the N+, N-, and P-type bodies from the source also form an integral diode, that is, form a back-to-back connection diode, which has a bidirectional high breakdown voltage value vertical. Field effect transistor.
如圖1所示為習知第1功率金屬氧化半導體場效電晶體(Power MOSFET)之構造圖,自圖中可知,其將源極S之N+與P型體連接在一起,而形成一第1體二極體(First Body Diode,BD1),自漏極D視之,其漏源崩潰電壓值(Drain-Source Breakdown Voltage,BVds)高;而自源極S視之,其源漏崩潰電壓值(Source-Drain Breakdown Voltage,BVsd)只有PN結合壓降,其壓降值低。 FIG. 1 is a structural diagram of a conventional first power metal oxide semiconductor field effect transistor (Power MOSFET). As can be seen from the figure, the N+ of the source S is connected with the P type body to form a first 1 Body Diode (BD1), which is viewed from the drain D, has a Drain-Source Breakdown Voltage (BVds) high; and since the source S, its source-drain breakdown voltage The Source-Drain Breakdown Voltage (BVsd) has only a PN combined with a voltage drop and a low voltage drop.
如圖2所示為習知第2功率金屬氧化半導體場效電晶體(Power MOSFET)之構造圖,自圖中可知,其自源極S之N+、P、N-到漏極D之N+型體,其漏極D到源極S之崩潰電壓值為第2體二極體BD2與第3體二極體BD3之崩潰電壓值,其中第3體二極體BD3之崩潰電壓值高,而第2體二極體BD2為順向電壓降值;而自源極S視之,其源漏極崩潰電壓值BVsd為第2體二極體BD2之崩潰電壓值與第3體二極體BD3之順向電壓值,自N+ N-結合理論可知,其第2體二極體BD2之N+ P結合二極體之崩潰電壓值,絕對小於本發明之N+ N- P結合之崩潰電壓值。 2 is a structural diagram of a conventional second power metal oxide semiconductor field effect transistor (Power MOSFET). It can be seen from the figure that it is N+ type from the source S of N+, P, N- to the drain D. The breakdown voltage of the drain D to the source S is a breakdown voltage value of the second body diode BD2 and the third body diode BD3, wherein the breakdown voltage of the third body diode BD3 is high, and The second body diode BD2 is a forward voltage drop value, and the source-drain breakdown voltage value BVsd is the breakdown voltage value of the second body diode BD2 and the third body diode BD3 from the source S. The forward voltage value is known from the N+N-binding theory, and the breakdown voltage value of the N+P combined diode of the second body diode BD2 is absolutely smaller than the collapse voltage value of the N+N-P combination of the present invention.
為了提供雙向開關或同步整流(Synchronous Rectifier)之需求: 本發明在源極N+與P型體間加有N-型體,以得高源漏崩潰電壓值。 In order to provide the need for bidirectional switching or synchronous rectification (Synchronous Rectifier): In the present invention, an N-type body is added between the source N+ and the P-type body to obtain a high source-drain breakdown voltage value.
本發明可以得源漏極崩潰電壓值等於漏源極崩潰電壓值之雙向開關特徵。 The invention can obtain a bidirectional switching characteristic in which the source drain breakdown voltage value is equal to the drain source breakdown voltage value.
本發明亦可以依同步整流功能需求,而任意設定源漏極崩潰電壓值與漏源極崩潰電壓值。 The present invention can also arbitrarily set the source-drain breakdown voltage value and the drain-source breakdown voltage value according to the requirements of the synchronous rectification function.
如圖3所示為本發明N通道金屬氧化半導體場效電晶體(N-Channel MOSFET)之構造圖,自圖中可知,源極S與N+型體連接在一起,N+型體與N-型體結合在一起,N-型體再與P型體結合而形成N+ N- P結合之第4體二極體(Fourth Body Diode,BD4);漏極D與N+型體連接在一起,N+型體與N-型體結合在一起,N-型體再與P型體結合而形成N+ N- P結合之第5體二極體(Fifth Body Diode,BD5);自圖3可知,其第4體二極體BD4之P型體與第5體二極體BD5之P型體是共同體,自圖3之源漏極或漏源極視之,其為背對背之體二極體;其N+與N-之摻雜濃度(Doping Concentrations)依崩潰電壓值之需求而定,而不予自限。 FIG. 3 is a structural diagram of an N-channel metal oxide semiconductor field effect transistor (N-channel MOSFET) according to the present invention. As can be seen from the figure, the source S and the N+ body are connected together, and the N+ type and the N-type are connected. The body is combined, the N-type body is combined with the P-type body to form a N+ N-P-bonded Fourth Body Diode (BD4); the drain D is connected with the N+ type body, N+ type The body is combined with the N-type body, and the N-type body is combined with the P-type body to form a N+ N-P-bonded fifth body diode (BD5); as shown in Fig. 3, the fourth The P-type body of the body diode BD4 and the P-type body of the 5th body diode BD5 are a common body, which are viewed from the source drain or drain source of FIG. 3, which are back-to-back body diodes; The Doping Concentrations of N- are determined by the demand of the breakdown voltage value, and are not self-limiting.
如圖4所示為本發明P通道金屬氧化半導體場效電晶體(P-Channel MOSFET)之構造圖,自圖中可知,源極S與P+型體連接在一起,P+型體與P-型體結合在一起,P-型體再與N型體結合而形成P+ P- N結合之第6體二極體(sixth Body Diode,BD6);漏極D與P+型體連接在一起,P+型體與P-型體結合在一起,P-型體再與N型體結合而形成P+ P- N結合之第7體二極體(Seventh Body Diode,BD7);自圖4可知,其第6體二極體BD6之N型體與第7體二極體BD7之N型體是共同體,自圖4之源漏極或漏源極視之,其為面對面之體二極體;其P+與P-之摻雜濃度(Doping Concentrations)依崩潰電壓值之需求而定,而不予自限。 FIG. 4 is a structural diagram of a P-channel metal oxide semiconductor field effect transistor (P-Channel MOSFET) according to the present invention. As can be seen from the figure, the source S and the P+ body are connected together, and the P+ type and the P-type are connected. When the bodies are combined, the P-type body is combined with the N-type body to form a P+ P-N combined sixth body Diode (BD6); the drain D is connected with the P+ type body, P+ type The body is combined with the P-type body, and the P-type body is combined with the N-type body to form a P+ P-N combined seventh body diode (Seventh Body) Diode, BD7); It can be seen from Fig. 4 that the N-type body of the sixth body diode BD6 and the N type body of the seventh body diode BD7 are a common body, which is viewed from the source drain or drain source of FIG. It is a face-to-face body diode; its Doping Concentrations of P+ and P- depend on the demand of the breakdown voltage value, and are not self-limiting.
S‧‧‧源極 S‧‧‧ source
D‧‧‧漏極 D‧‧‧Drain
G‧‧‧閘極 G‧‧‧ gate
N+‧‧‧重掺雜N型體 N+‧‧‧ heavily doped N-type body
N-‧‧‧輕掺雜N型體 N-‧‧‧Lightly doped N-type body
N‧‧‧N型體 N‧‧‧N body
P+‧‧‧重掺雜P型體 P+‧‧‧ heavily doped P type body
P-‧‧‧輕掺雜P型體 P-‧‧‧Lightly doped P-type body
P‧‧‧P型體 P‧‧‧P body
BD1、BD2、BD3、BD4、BD5、BD6、BD7‧‧‧第1、第2、第3、第4、第5、第6、第7體二極體 BD1, BD2, BD3, BD4, BD5, BD6, BD7‧‧‧1st, 2nd, 3rd, 4th, 5th, 6th, 7th body diodes
圖1 為習知第1功率金屬氧化半導體場效電晶體之構造圖。 1 is a structural diagram of a conventional first power metal oxide semiconductor field effect transistor.
圖2 為習知第2功率金屬氧化半導體場效電晶體之構造圖。 2 is a structural diagram of a conventional second power metal oxide semiconductor field effect transistor.
圖3 為本發明N通道金屬氧化半導體場效電晶體之構造圖。 3 is a structural diagram of an N-channel metal oxide semiconductor field effect transistor of the present invention.
圖4 為本發明P通道金屬氧化半導體場效電晶體之構造圖。 4 is a structural diagram of a P-channel metal oxide semiconductor field effect transistor of the present invention.
N+‧‧‧重掺雜N型體(Heavy doping N type material) N+‧‧‧Heady doping N type material
N-‧‧‧輕掺雜N型體(Light doping N type material) N-‧‧‧Light doping N type material
P‧‧‧P型體 P‧‧‧P body
S‧‧‧源極 S‧‧‧ source
G‧‧‧閘極 G‧‧‧ gate
D‧‧‧漏極 D‧‧‧Drain
BD4‧‧‧第4體二極體 BD4‧‧‧4th body diode
BD5‧‧‧第5體二極體 BD5‧‧‧5th body diode
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TW099115603A TWI497717B (en) | 2010-05-17 | 2010-05-17 | High source to drain breakdown voltage vertical field effect transistors |
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TW099115603A TWI497717B (en) | 2010-05-17 | 2010-05-17 | High source to drain breakdown voltage vertical field effect transistors |
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TWI497717B true TWI497717B (en) | 2015-08-21 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298781A (en) * | 1987-10-08 | 1994-03-29 | Siliconix Incorporated | Vertical current flow field effect transistor with thick insulator over non-channel areas |
US5637898A (en) * | 1995-12-22 | 1997-06-10 | North Carolina State University | Vertical field effect transistors having improved breakdown voltage capability and low on-state resistance |
US20060138538A1 (en) * | 2003-05-26 | 2006-06-29 | Tadahiro Ohmi | P-channel power MIS field effect transistor and switching circuit |
-
2010
- 2010-05-17 TW TW099115603A patent/TWI497717B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298781A (en) * | 1987-10-08 | 1994-03-29 | Siliconix Incorporated | Vertical current flow field effect transistor with thick insulator over non-channel areas |
US5637898A (en) * | 1995-12-22 | 1997-06-10 | North Carolina State University | Vertical field effect transistors having improved breakdown voltage capability and low on-state resistance |
US20060138538A1 (en) * | 2003-05-26 | 2006-06-29 | Tadahiro Ohmi | P-channel power MIS field effect transistor and switching circuit |
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TW201143089A (en) | 2011-12-01 |
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