TWI494050B - Peripheral module - Google Patents

Peripheral module Download PDF

Info

Publication number
TWI494050B
TWI494050B TW101122848A TW101122848A TWI494050B TW I494050 B TWI494050 B TW I494050B TW 101122848 A TW101122848 A TW 101122848A TW 101122848 A TW101122848 A TW 101122848A TW I494050 B TWI494050 B TW I494050B
Authority
TW
Taiwan
Prior art keywords
peripheral device
peripheral
heat
heat pipe
male connector
Prior art date
Application number
TW101122848A
Other languages
Chinese (zh)
Other versions
TW201401991A (en
Inventor
Kim Yeung Sip
Original Assignee
Acer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acer Inc filed Critical Acer Inc
Priority to TW101122848A priority Critical patent/TWI494050B/en
Publication of TW201401991A publication Critical patent/TW201401991A/en
Application granted granted Critical
Publication of TWI494050B publication Critical patent/TWI494050B/en

Links

Description

周邊模組Peripheral module

本發明是有關於一種電子裝置之周邊模組。The invention relates to a peripheral module of an electronic device.

隨著電子科技的不斷演進,電腦已逐漸成為日常生活中不可或缺的工具。市面上亦有越來越多種電腦的周邊裝置,來滿足使用者的各種需求。常見的周邊裝置有外接式硬碟或是外接式光碟機等,透過此類裝置可讓電腦的功能更為強大。With the continuous evolution of electronic technology, computers have gradually become an indispensable tool in daily life. There are also more and more computer peripheral devices on the market to meet the various needs of users. Common peripheral devices include external hard drives or external optical drives, which make the computer more powerful.

由於使用者可能需要同時使用多個周邊裝置之功能,當將這些周邊裝置連接到電腦時,桌面上往往被這些周邊裝置佔據。目前雖已有可將周邊裝置如積木般堆疊的周邊模組以節省桌面空間。然而,由於周邊裝置在運作時會產熱,這些被疊置的周邊裝置可能會有散熱不良的問題。Since the user may need to use the functions of multiple peripheral devices at the same time, when these peripheral devices are connected to the computer, the desktop is often occupied by these peripheral devices. At present, there are peripheral modules that can stack peripheral devices such as building blocks to save desktop space. However, since the peripheral devices generate heat during operation, these stacked peripheral devices may have a problem of poor heat dissipation.

本發明提供一種周邊模組,不但能夠使多個周邊裝置以堆疊的方式擺放來節省空間,更具有良好的散熱效果。The invention provides a peripheral module, which can not only save a plurality of peripheral devices in a stacked manner, but also has a good heat dissipation effect.

本發明提出一種周邊模組,適於電性連接至一電子裝置,周邊模組包括一第一周邊裝置及一第二周邊裝置。第一周邊裝置包括一第一熱源、一第一導熱管、一風扇及一第一連接埠組,第一導熱管熱耦合於第一熱源。第二周邊裝置包括一第二熱源、一第二導熱管及一第二連接埠組, 第二導熱管熱耦合於第二熱源。第一周邊裝置與第二周邊裝置適於相互疊置,以使第一導熱管熱耦合於第二導熱管,且第一連接埠組電性連接至第二連接埠組。The invention provides a peripheral module, which is suitable for being electrically connected to an electronic device. The peripheral module comprises a first peripheral device and a second peripheral device. The first peripheral device includes a first heat source, a first heat pipe, a fan and a first port set, and the first heat pipe is thermally coupled to the first heat source. The second peripheral device includes a second heat source, a second heat pipe and a second port set. The second heat pipe is thermally coupled to the second heat source. The first peripheral device and the second peripheral device are adapted to overlap each other such that the first heat pipe is thermally coupled to the second heat pipe, and the first port is electrically connected to the second port group.

在本發明之一實施例中,上述之第一周邊裝置具有相對之一第一面及一第二面,第一導熱管包括一第一公接頭及一第一母接頭,第一公接頭外露於第一周邊裝置之第一面,第一母接頭凹陷於第一周邊裝置之第二面。In an embodiment of the present invention, the first peripheral device has a first surface and a second surface. The first heat pipe includes a first male connector and a first female connector, and the first male connector is exposed. The first female connector is recessed on the second side of the first peripheral device on the first side of the first peripheral device.

在本發明之一實施例中,上述之第二周邊裝置具有相對之一第一面及一第二面,第二導熱管包括一第二公接頭及一第二母接頭,第二公接頭外露於第二周邊裝置之第一面,第二母接頭凹陷於第二周邊裝置之第二面。In an embodiment of the present invention, the second peripheral device has a first surface and a second surface. The second heat pipe includes a second male connector and a second female connector. The second male connector is exposed. The second female connector is recessed on the second side of the second peripheral device on the first side of the second peripheral device.

在本發明之一實施例中,上述之第一周邊裝置具有相對之一第一面及一第二面,第一連接埠組包括一第一公連接埠及一第一母連接埠,第一公連接埠外露於第一周邊裝置之第一面,第一母連接埠凹陷於第一周邊裝置之第二面。In an embodiment of the present invention, the first peripheral device has a first side and a second side, and the first connecting unit includes a first male connector and a first female connector. The male connector is exposed on the first side of the first peripheral device, and the first female connector is recessed on the second side of the first peripheral device.

在本發明之一實施例中,上述之第一公連接埠與第一母連接埠分別包括一第一導熱殼體,第一導熱管位於第一面與第二面之間,且第一導熱管之兩端分別連接於第一公連接埠之第一導熱殼體及第一母連接埠之第一導熱殼體。In an embodiment of the invention, the first male connector and the first female connector respectively comprise a first heat conducting housing, the first heat pipe is located between the first surface and the second surface, and the first heat conduction The two ends of the tube are respectively connected to the first heat conducting housing of the first male connector and the first heat conducting housing of the first female connector.

在本發明之一實施例中,上述之第二周邊裝置具有相對之一第一面及一第二面,第二連接埠組包括一第二公連接埠及一第二母連接埠,第二公連接埠外露於第二周邊裝置之第一面,第二母連接埠凹陷於第二周邊裝置之第二面。In an embodiment of the present invention, the second peripheral device has a first side and a second side, and the second connecting unit includes a second male connector and a second female connector. The male connector is exposed on the first side of the second peripheral device, and the second female connector is recessed on the second side of the second peripheral device.

在本發明之一實施例中,上述之第二公連接埠與第二 母連接埠分別包括一第二導熱殼體,第二導熱管位於第一面與第二面之間,且第二導熱管分別連接於第二公連接埠之第二導熱殼體及第二母連接埠之第二導熱殼體。In an embodiment of the invention, the second male connection and the second The female connecting ports respectively comprise a second heat conducting housing, the second heat conducting tube is located between the first surface and the second surface, and the second heat conducting tube is respectively connected to the second heat conducting shell of the second male joint and the second female Connect the second heat conducting housing of the crucible.

在本發明之一實施例中,上述之第一熱源為一圖形處理器(Graphic Processing Unit,GPU)。In an embodiment of the invention, the first heat source is a Graphic Processing Unit (GPU).

在本發明之一實施例中,上述之第一周邊裝置更包括一第一熱感測器及一控制器,第一熱感測器及風扇電性連接至該控制器。In an embodiment of the invention, the first peripheral device further includes a first thermal sensor and a controller, and the first thermal sensor and the fan are electrically connected to the controller.

在本發明之一實施例中,上述之第一周邊裝置更包括一控制器,風扇及第一連接埠組電性連接至控制器,第二周邊裝置更包括一第二熱感測器,第二熱感測器電性連接於第二連接埠組。In an embodiment of the present invention, the first peripheral device further includes a controller, the fan and the first port are electrically connected to the controller, and the second peripheral device further includes a second thermal sensor. The two thermal sensors are electrically connected to the second connection group.

在本發明之一實施例中,上述之第一周邊裝置具有相對之一第一面及一第二面,第一周邊裝置更包括外露於第一周邊裝置之第一面的一第一公電力傳輸埠及凹陷於第一周邊裝置之第二面的一第一母電力傳輸埠,第一公電力傳輸埠及第一母電力傳輸埠分別電性連接於第一熱源或風扇。In an embodiment of the invention, the first peripheral device has a first surface and a second surface, and the first peripheral device further includes a first public power exposed on the first surface of the first peripheral device. The first male power transmission port and the first female power transmission port are electrically connected to the first heat source or the fan, respectively.

在本發明之一實施例中,上述之第二周邊裝置具有相對之一第一面及一第二面,第二周邊裝置更包括外露於第二周邊裝置之第一面的一第二公電力傳輸埠及凹陷於第二周邊裝置之第二面的一第二母電力傳輸埠,第二公電力傳輸埠及第二母電力傳輸埠分別電性連接於第二熱源。In an embodiment of the invention, the second peripheral device has a first surface and a second surface, and the second peripheral device further includes a second power source exposed on the first side of the second peripheral device. And transmitting a second female power transmission port and a second female power transmission port electrically connected to the second heat source.

在本發明之一實施例中,上述之第二周邊裝置為一硬 碟或一光碟機。In an embodiment of the invention, the second peripheral device is a hard Disc or a CD player.

在本發明之一實施例中,上述之第一連接埠組與第二連接埠組之傳輸介面為通用序列匯流排(USB)或雷電介面(Thunderbolt)。In an embodiment of the invention, the transmission interface of the first connection group and the second connection group is a universal serial bus (USB) or a lightning interface (Thunderbolt).

基於上述,本發明之周邊模組透過第一周邊裝置與第二周邊裝置相互疊置時,彼此電性連接且第一導熱管熱耦合於第二導熱管。由於第一周邊裝置之風扇運作時,可降低第一周邊裝置之溫度。因此,第一導熱管與第二導熱管之間存在溫度差異,而使得第二周邊裝置之第二熱源之產熱可經過第二導熱管傳遞至第一導熱管,以降低第二周邊裝置的溫度。本發明之周邊模組的周邊裝置不但可利用相互堆疊的方式擺放以提高空間運用度之外,亦具有良好散熱以避免周邊裝置因過熱而發生故障的狀況。Based on the above, the peripheral module of the present invention is electrically connected to each other when the first peripheral device and the second peripheral device are stacked on each other, and the first heat pipe is thermally coupled to the second heat pipe. When the fan of the first peripheral device operates, the temperature of the first peripheral device can be lowered. Therefore, there is a temperature difference between the first heat pipe and the second heat pipe, so that the heat generated by the second heat source of the second peripheral device can be transmitted to the first heat pipe through the second heat pipe to reduce the second peripheral device. temperature. The peripheral device of the peripheral module of the present invention can be placed not only by stacking to increase the space utilization degree, but also has good heat dissipation to avoid the failure of the peripheral device due to overheating.

為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.

圖1A是依照本發明之一實施例之一種周邊模組。請參閱圖1A,本實施例之一種周邊模組100,適於電性連接至一電子裝置10。在本實施例中,電子裝置10可為電腦,但電子裝置10之種類不以此為限制。周邊模組100包括一第一周邊裝置110及一第二周邊裝置120。第一周邊裝置110包括一第一熱源113、一第一導熱管114、一風扇115及一第一連接埠組116,第一導熱管114熱耦合於第一熱 源113。第二周邊裝置120包括一第二熱源123、一第二導熱管124及一第二連接埠組125,第二導熱管124熱耦合於第二熱源123。第一周邊裝置110與第二周邊裝置120適於相互疊置,以使第一導熱管114熱耦合於第二導熱管124,且第一連接埠組116電性連接至第二連接埠組125。1A is a peripheral module in accordance with an embodiment of the present invention. Referring to FIG. 1A , a peripheral module 100 of the present embodiment is adapted to be electrically connected to an electronic device 10 . In this embodiment, the electronic device 10 can be a computer, but the type of the electronic device 10 is not limited thereto. The peripheral module 100 includes a first peripheral device 110 and a second peripheral device 120. The first peripheral device 110 includes a first heat source 113, a first heat pipe 114, a fan 115, and a first port set 116. The first heat pipe 114 is thermally coupled to the first heat. Source 113. The second peripheral device 120 includes a second heat source 123 , a second heat pipe 124 , and a second port set 125 . The second heat pipe 124 is thermally coupled to the second heat source 123 . The first peripheral device 110 and the second peripheral device 120 are adapted to be stacked on each other such that the first heat pipe 114 is thermally coupled to the second heat pipe 124, and the first port group 116 is electrically connected to the second port group 125. .

圖1B是圖1A之周邊模組之第一周邊裝置與第二周邊裝置未疊合時的第一面的示意圖。圖1C是圖1A之周邊模組之第一周邊裝置與第二周邊裝置未疊合時的第二面的示意圖。請參閱圖1B與圖1C,第一周邊裝置110具有相對之一第一面111及一第二面112,第一導熱管114包括一第一公接頭114a及一第一母接頭114b,第一公接頭114a外露於第一周邊裝置110之第一面111,第一母接頭114b凹陷於第一周邊裝置110之第二面112。第二周邊裝置120具有相對之一第一面121及一第二面122,第二導熱管124包括一第二公接頭124a及一第二母接頭124b,第二公接頭124a外露於第二周邊裝置120之第一面121,第二母接頭124b凹陷於第二周邊裝置120之第二面122。第一導熱管114與第二導熱管124之材質可為銅,但不以此為限制。1B is a schematic view of the first side of the peripheral module of FIG. 1A when the first peripheral device and the second peripheral device are not overlapped. 1C is a schematic view of the second side of the peripheral module of FIG. 1A when the first peripheral device and the second peripheral device are not overlapped. Referring to FIG. 1B and FIG. 1C, the first peripheral device 110 has a first surface 111 and a second surface 112. The first heat pipe 114 includes a first male connector 114a and a first female connector 114b. The male connector 114a is exposed on the first face 111 of the first peripheral device 110, and the first female connector 114b is recessed in the second face 112 of the first peripheral device 110. The second peripheral device 120 has a first surface 121 and a second surface 122. The second heat pipe 124 includes a second male connector 124a and a second female connector 124b. The second male connector 124a is exposed to the second periphery. The first face 121 of the device 120 and the second female connector 124b are recessed in the second face 122 of the second peripheral device 120. The material of the first heat pipe 114 and the second heat pipe 124 may be copper, but is not limited thereto.

此外,第一周邊裝置110之第一連接埠組116包括一第一公連接埠116a及一第一母連接埠116b。第一公連接埠116a外露於第一周邊裝置110之第一面111,第一母連接埠116b凹陷於第一周邊裝置110之第二面112。第二周邊裝置120之第二連接埠組125包括一第二公連接埠125a及一第二母連接埠125b。第二公連接埠125a外露於第二 周邊裝置120之第一面121,第二母連接埠125b凹陷於第二周邊裝置120之第二面122。第一連接埠組116與第二連接埠組125之傳輸介面可為USB或Thunderbolt,但不以上述為限制。In addition, the first port group 116 of the first peripheral device 110 includes a first male port 116a and a first female port 116b. The first male connector 116a is exposed on the first face 111 of the first peripheral device 110, and the first female connector 116b is recessed in the second face 112 of the first peripheral device 110. The second port set 125 of the second peripheral device 120 includes a second male port 125a and a second female port 125b. The second male connector 125a is exposed to the second The first surface 121 of the peripheral device 120 and the second female connector 125b are recessed in the second surface 122 of the second peripheral device 120. The transmission interface of the first port group 116 and the second port group 125 may be USB or Thunderbolt, but is not limited to the above.

如圖1B及圖1C所示,第一周邊裝置110之第二面112上的第一母接頭114b與第一母連接埠116b的位置對應於第二周邊裝置120之第一面121的第二公接頭124a與第二公連接埠125a的位置。因此,當第一周邊裝置110與第二周邊裝置疊合時,第一周邊裝置110便可如同圖1A所示地以第一母接頭114b與第一母連接埠116b與第二周邊裝置120的第二公接頭124a與第二公連接埠125a對接。如此一來,第二周邊裝置120之第二熱源123之產熱便能透過第二導熱管124傳遞至第一周邊裝置110之第一導熱管114。此外,由於第二周邊裝置120的第二公連接埠125a對接於第一周邊裝置110的第一母連接埠116b。第二周邊裝置120之資訊便能透過第二連接埠組125傳出,經過第一周邊裝置110而傳至電子裝置10。As shown in FIG. 1B and FIG. 1C, the position of the first female connector 114b and the first female connector 116b on the second face 112 of the first peripheral device 110 corresponds to the second face 121 of the second peripheral device 120. The position of the male connector 124a and the second male connector 125a. Therefore, when the first peripheral device 110 is overlapped with the second peripheral device, the first peripheral device 110 can be the first female connector 114b and the first female connector 116b and the second peripheral device 120 as shown in FIG. 1A. The second male connector 124a is docked with the second male connector 125a. As a result, the heat generated by the second heat source 123 of the second peripheral device 120 can be transmitted to the first heat pipe 114 of the first peripheral device 110 through the second heat pipe 124. In addition, since the second male port 125a of the second peripheral device 120 is docked to the first female port 116b of the first peripheral device 110. The information of the second peripheral device 120 can be transmitted through the second port group 125 and transmitted to the electronic device 10 through the first peripheral device 110.

在本實施例中,第一周邊裝置110之第一面111上的第一公接頭114a與第一公連接埠116a的位置亦對應於第二周邊裝置120之第二面122的第二母接頭124b與第二母連接埠125b的位置。也就是說,第一周邊裝置110亦可透過第一公接頭114a與第一公連接埠116a來與第二周邊裝置120的第二母接頭124b與第二母連接埠125b對接,使用者可自行選擇所需的對接方式。此外,公接頭/母接頭及 公連接埠/母連接埠為突出或凹陷並不限於以上所述之方式。In this embodiment, the position of the first male connector 114a and the first male connector 116a on the first face 111 of the first peripheral device 110 also corresponds to the second female connector of the second face 122 of the second peripheral device 120. The position of 124b is connected to the second female port 125b. In other words, the first peripheral device 110 can also be connected to the second female connector 124b of the second peripheral device 120 through the first male connector 114a and the first male connector 116a, and the user can Select the desired docking method. In addition, male/female connectors and The male or female connection 埠 is protruded or recessed and is not limited to the manner described above.

此外,本實施例之第一周邊裝置110之第一熱源113可為一圖形處理器(Graphic Processing Unit,GPU),第二周邊裝置120可為一硬碟或一光碟機,但第一熱源113與第二周邊裝置120之種類並不以此為限制。In addition, the first heat source 113 of the first peripheral device 110 of the embodiment may be a graphic processing unit (GPU), and the second peripheral device 120 may be a hard disk or a CD player, but the first heat source 113 The type of the second peripheral device 120 is not limited thereto.

由於圖形處理器在處理複雜的圖形運算時會產生大量的熱量,通常需要藉由風扇115運作以對流的方式來降低第一導熱管114的溫度。本實施例之周邊模組100透過第一周邊裝置110與第二周邊裝置120疊置時,第一導熱管114熱耦合於第二導熱管124。當第一周邊裝置110之風扇115運作時,第一導熱管114與第二導熱管124存在溫度差異,而使得第二周邊裝置120之第二熱源123之產熱可經過第二導熱管124傳遞至第一導熱管114,以降低第二周邊裝置120的溫度。Since the graphics processor generates a large amount of heat when processing complex graphics operations, it is generally necessary to operate the fan 115 to reduce the temperature of the first heat pipe 114 by convection. When the peripheral module 100 of the embodiment is stacked with the second peripheral device 120 through the first peripheral device 110, the first heat transfer pipe 114 is thermally coupled to the second heat transfer pipe 124. When the fan 115 of the first peripheral device 110 operates, there is a temperature difference between the first heat pipe 114 and the second heat pipe 124, so that the heat generated by the second heat source 123 of the second peripheral device 120 can be transmitted through the second heat pipe 124. The first heat pipe 114 is lowered to lower the temperature of the second peripheral device 120.

此外,若第一周邊裝置110與第二周邊裝置120之功耗(power consumption)較大,僅靠第一連接埠組116與第二連接埠組125供電,可能會有電力不足而導致第一周邊裝置110與第二周邊裝置120損壞的問題。在本實施例中,第一周邊裝置110包括外露於第一面111的一第一公電力傳輸埠117a及凹陷於第二面112的一第一母電力傳輸埠117b。第一公電力傳輸埠117a及第一母電力傳輸埠117b分別電性連接於第一熱源113或風扇115。第二周邊裝置120更包括外露於第一面121的一第二公電力傳輸埠126a 及凹陷於第二面122的一第二母電力傳輸埠126b,第二公電力傳輸埠126a及第二母電力傳輸埠126b分別電性連接於第二熱源123。本實施例之周邊模組100可透過外接電源的方式來為第一周邊裝置110與第二周邊裝置120供電,以確保第一周邊裝置110與第二周邊裝置120運作時電力穩定。In addition, if the power consumption of the first peripheral device 110 and the second peripheral device 120 is large, only the first port group 116 and the second port group 125 are powered, and there may be insufficient power to cause the first The problem that the peripheral device 110 and the second peripheral device 120 are damaged. In the present embodiment, the first peripheral device 110 includes a first common power transmission port 117a exposed on the first surface 111 and a first female power transmission port 117b recessed on the second surface 112. The first public power transmission port 117a and the first parent power transmission port 117b are electrically connected to the first heat source 113 or the fan 115, respectively. The second peripheral device 120 further includes a second public power transmission port 126a exposed on the first surface 121. And a second female power transmission port 126b recessed in the second surface 122, the second common power transmission port 126a and the second female power transmission port 126b are electrically connected to the second heat source 123, respectively. The peripheral module 100 of the present embodiment can supply power to the first peripheral device 110 and the second peripheral device 120 by means of an external power source to ensure power stability when the first peripheral device 110 and the second peripheral device 120 operate.

另外,在本實施例中,第一周邊裝置110更包括一第一熱感測器118及一控制器119。第一熱感測器118用以感測第一熱源113的溫度。風扇115、第一連接埠組116及第一熱感測器118分別電性連接至控制器119,以使控制器119控制風扇115之轉速。第二周邊裝置120更包括一第二熱感測器127。第二熱感測器127用以感測第二熱源123的溫度,且第二熱感測器127電性連接於第二連接埠組125。當周邊裝置100運作時,第一熱感測器118與第二熱感測器127分別感測第一熱源113與第二熱源123的溫度。第二熱源123的溫度資訊透過第二連接埠組125與第一連接埠組116被傳遞至控制器119,控制器119再根據所接受的第一熱源113與第二熱源123的溫度資訊來調整風扇115轉速。In addition, in the embodiment, the first peripheral device 110 further includes a first thermal sensor 118 and a controller 119. The first thermal sensor 118 is configured to sense the temperature of the first heat source 113. The fan 115, the first port set 116 and the first thermal sensor 118 are electrically connected to the controller 119, respectively, to enable the controller 119 to control the rotational speed of the fan 115. The second peripheral device 120 further includes a second thermal sensor 127. The second thermal sensor 127 is configured to sense the temperature of the second heat source 123 , and the second thermal sensor 127 is electrically connected to the second connection stack 125 . When the peripheral device 100 operates, the first thermal sensor 118 and the second thermal sensor 127 sense the temperatures of the first heat source 113 and the second heat source 123, respectively. The temperature information of the second heat source 123 is transmitted to the controller 119 through the second port group 125 and the first port group 116, and the controller 119 adjusts according to the received temperature information of the first heat source 113 and the second heat source 123. Fan 115 speed.

圖2是依照本發明之另一實施例之一種周邊模組的側視示意圖。請參閱圖2,圖2之周邊模組200與圖1A之周邊模組100的差異在於,圖2之周邊模組200之第一導熱管214與第二導熱管224並非如圖1A之周邊模組100透過專門用來導熱之第二公接頭124a連接於第一母接頭 114b,以將第二導熱管124之熱量傳遞至第一導熱管114。2 is a side elevational view of a peripheral module in accordance with another embodiment of the present invention. Referring to FIG. 2, the difference between the peripheral module 200 of FIG. 2 and the peripheral module 100 of FIG. 1A is that the first heat pipe 214 and the second heat pipe 224 of the peripheral module 200 of FIG. 2 are not the peripheral mode of FIG. 1A. The group 100 is connected to the first female connector through a second male connector 124a dedicated to heat conduction 114b, to transfer heat of the second heat pipe 124 to the first heat pipe 114.

在本實施例中,圖2之周邊模組200之第一公連接埠216a與第一母連接埠216b分別包括一第一導熱殼體216c、216d。第一導熱管214位於第一周邊裝置210之第一面211與第二面212之間,且第一導熱管214之兩端分別連接於第一公連接埠216a之第一導熱殼體216c及第一母連接埠216b之第一導熱殼體216d。並且,圖2之周邊模組200之第二公連接埠225a與第二母連接埠225b亦分別包括一第二導熱殼體225c、225d。第二導熱管224位於第二周邊裝置220之第一面221與第二面222之間,且第二導熱管224分別連接於第二公連接埠225a之第二導熱殼體225c及第二母連接埠225b之第二導熱殼體225d。In this embodiment, the first male connector 216a and the first female connector 216b of the peripheral module 200 of FIG. 2 respectively include a first heat conducting housing 216c, 216d. The first heat pipe 214 is located between the first surface 211 and the second surface 212 of the first peripheral device 210, and the two ends of the first heat pipe 214 are respectively connected to the first heat conducting shell 216c of the first male port 216a and The first female connector 216b is connected to the first heat conducting housing 216d. Moreover, the second male connector 225a and the second female connector 225b of the peripheral module 200 of FIG. 2 also include a second heat conducting housing 225c, 225d, respectively. The second heat pipe 224 is located between the first surface 221 and the second surface 222 of the second peripheral device 220, and the second heat pipe 224 is respectively connected to the second heat conducting shell 225c and the second mother of the second male port 225a. The second heat conducting housing 225d of the port 225b is connected.

也就是說,圖2之周邊模組200的第一導熱管214與第二導熱管224是透過用以傳遞資料的第二公連接埠225a與第一母連接埠216b接合時,第二公連接埠225a之第二導熱殼體225c連接於第一母連接埠216b之第一導熱殼體216d,以將第二熱源223的產熱透過第二導熱管224、第二公連接埠225a之第二導熱殼體225c、第一母連接埠216b之第一導熱殼體216d傳遞至第一導熱管214,再藉由第一周邊裝置210中的風扇215以對流的方式將溫度帶離第一周邊裝置210。That is, when the first heat pipe 214 and the second heat pipe 224 of the peripheral module 200 of FIG. 2 are coupled to the first female port 216b through the second male port 225a for transferring data, the second male connection The second heat conducting housing 225c of the first 225a is connected to the first heat conducting housing 216d of the first female connecting port 216b to transmit the heat generated by the second heat source 223 through the second heat conducting tube 224 and the second second connecting port 225a. The heat conducting housing 225c, the first heat conducting housing 216d of the first female port 216b is transferred to the first heat pipe 214, and the temperature is removed from the first peripheral device by the fan 215 in the first peripheral device 210. 210.

因此,圖2之周邊模組200不需如圖1A之周邊裝置100在第一周邊裝置110與第二周邊裝置120的第一面111、121及第二面112、122上開孔以設置第一公接頭 114a、第一母接頭114b、第二公接頭124a及第二母接頭124b,可節省生產成本及減少製造工序。Therefore, the peripheral module 200 of FIG. 2 does not need to open a hole in the first surface 111, 121 and the second surface 112, 122 of the first peripheral device 110 and the second peripheral device 120 as shown in FIG. 1A. a male connector 114a, the first female connector 114b, the second male connector 124a, and the second female connector 124b can save production costs and reduce manufacturing processes.

圖3是依照本發明之再一實施例之一種周邊模組的側視示意圖。請參閱圖3,圖3之周邊模組300與圖1A之周邊模組100的差異在於,圖3之周邊模組300更包括一第三周邊裝置330。如同第一周邊裝置310與第二周邊裝置320,第三周邊裝置330具有相對之一第一面331及一第二面332。一第三導熱管334之一第三公接頭334a、一第三連接埠組335之一第三公連接埠335a及一第三公電力傳輸埠336a分別外露於第三周邊裝置330之第一面331。第三導熱管334之一第三母接頭334b、第三連接埠組335之一第三母連接埠335b及一第三母電力傳輸埠336b分別凹陷於第三周邊裝置330之第二面332。3 is a side elevational view of a peripheral module in accordance with still another embodiment of the present invention. Referring to FIG. 3 , the difference between the peripheral module 300 of FIG. 3 and the peripheral module 100 of FIG. 1A is that the peripheral module 300 of FIG. 3 further includes a third peripheral device 330 . Like the first peripheral device 310 and the second peripheral device 320, the third peripheral device 330 has a first surface 331 and a second surface 332 opposite to each other. A third male connector 334a, a third male connector 335a and a third male power transmitter 336a of a third heat pipe 334 are exposed on the first side of the third peripheral device 330, respectively. 331. A third female connector 334b, a third female connector 335b, and a third female power transmitting port 336b of the third heat pipe 334 are respectively recessed in the second face 332 of the third peripheral device 330.

在本實施例中,第三周邊裝置330之第三公接頭334a、第三公連接埠335a及第三公電力傳輸埠336a接合於第二周邊裝置320之第二母接頭324b、第二母連接埠325b及第二母電力傳輸埠326b。第二周邊裝置320被夾置於第一周邊裝置310與第三周邊裝置330之間。由於第一周邊裝置310之風扇315運作可降低第一導熱管314的溫度,第一導熱管314的溫度較低,第二導熱管324與第三導熱管334的溫度較高,而使得第三周邊裝置330之第三熱源333之產熱沿著箭頭方向經過第三導熱管334傳遞至第二導熱管324,且與第二周邊裝置320之第二熱源323的產熱共同透過第二導熱管324傳遞至第一導熱管314, 以降低第二周邊裝置320與第三周邊裝置330的溫度。In this embodiment, the third male connector 334a, the third male connector 335a, and the third male power transmitting port 336a of the third peripheral device 330 are coupled to the second female connector 324b of the second peripheral device 320, and the second female connector.埠 325b and second mother power transmission 埠 326b. The second peripheral device 320 is sandwiched between the first peripheral device 310 and the third peripheral device 330. Since the temperature of the first heat pipe 314 is lowered by the operation of the fan 315 of the first peripheral device 310, the temperature of the first heat pipe 314 is lower, and the temperature of the second heat pipe 324 and the third heat pipe 334 is higher, so that the third The heat generated by the third heat source 333 of the peripheral device 330 is transmitted to the second heat pipe 324 through the third heat pipe 334 in the direction of the arrow, and communicates with the heat of the second heat source 323 of the second peripheral device 320 through the second heat pipe. 324 is transferred to the first heat pipe 314, To lower the temperature of the second peripheral device 320 and the third peripheral device 330.

圖4是依照本發明之又一實施例之一種周邊模組的側視示意圖。請參閱圖4,圖4之周邊模組400與圖3之周邊模組300的差異在於,圖4之周邊模組400的第三周邊裝置430是透過第三母接頭434b、第三母連接埠435b及第三母電力傳輸埠436b接合於第一周邊裝置410之第一公接頭414a、第一公連接埠416a及第一公電力傳輸埠417a。也就是說,第一周邊裝置410被夾置於第二周邊裝置420與第三周邊裝置430之間。因此,在本實施例中,熱量的傳遞方向是由位於第一周邊裝置410兩側的第二周邊裝置420與第三周邊裝置430往中間的第一周邊裝置410傳遞。4 is a side elevational view of a peripheral module in accordance with yet another embodiment of the present invention. Referring to FIG. 4, the difference between the peripheral module 400 of FIG. 4 and the peripheral module 300 of FIG. 3 is that the third peripheral device 430 of the peripheral module 400 of FIG. 4 is transmitted through the third female connector 434b and the third female connector. The 435b and the third female power transmission port 436b are coupled to the first male connector 414a, the first male connector 416a, and the first male power transmitter 417a of the first peripheral device 410. That is, the first peripheral device 410 is sandwiched between the second peripheral device 420 and the third peripheral device 430. Therefore, in the present embodiment, the heat transfer direction is transmitted by the first peripheral device 410 located between the second peripheral device 420 and the third peripheral device 430 on both sides of the first peripheral device 410.

本發明之周邊模組的這些周邊裝置的排列方式以及個數並不以上述為限制。無論第一周邊裝置是位於周邊模組的邊緣或是中間,或是周邊模組之周邊裝置的個數為兩個、三個或是更多。這些周邊裝置之間均藉由導熱管的相互連接,以使第一周邊裝置為其他周邊裝置提供降溫散熱。The arrangement and number of these peripheral devices of the peripheral module of the present invention are not limited to the above. Whether the first peripheral device is located at the edge or in the middle of the peripheral module, or the number of peripheral devices of the peripheral module is two, three or more. The peripheral devices are connected to each other by heat pipes, so that the first peripheral device provides cooling and heat dissipation for other peripheral devices.

綜上所述,本發明之周邊模組透過第一周邊裝置與第二周邊裝置疊置時,第一導熱管熱耦合於第二導熱管。由於第一周邊裝置之風扇運作時可降低第一導熱管的溫度,第一導熱管與第二導熱管之間存在溫度差異,而使得第二周邊裝置之第二熱源之產熱可經過第二導熱管傳遞至第一導熱管,以降低第二周邊裝置的溫度。本發明之周邊模組的周邊裝置不但是以相互堆疊的方式擺放以提高空間運用度之外,亦具有良好散熱以避免周邊裝置因過熱而發生故 障的狀況。In summary, when the peripheral module of the present invention is stacked with the second peripheral device through the first peripheral device, the first heat pipe is thermally coupled to the second heat pipe. The temperature of the first heat pipe can be lowered when the fan of the first peripheral device operates, and there is a temperature difference between the first heat pipe and the second heat pipe, so that the heat of the second heat source of the second peripheral device can pass through the second The heat pipe is transferred to the first heat pipe to lower the temperature of the second peripheral device. The peripheral devices of the peripheral module of the present invention are not only disposed in a manner of being stacked on each other to improve the space utilization degree, but also have good heat dissipation to prevent the peripheral device from being overheated. The condition of the barrier.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧電子裝置10‧‧‧Electronic devices

100、200、300、400‧‧‧周邊模組100, 200, 300, 400‧‧‧ peripheral modules

110、210、310、410‧‧‧第一周邊裝置110, 210, 310, 410‧‧‧ first peripheral device

111、211‧‧‧第一面111, 211‧‧‧ first side

112、212‧‧‧第二面112, 212‧‧‧ second side

113、213‧‧‧第一熱源113, 213‧‧‧ first heat source

114、214、314‧‧‧第一導熱管114, 214, 314‧‧‧ first heat pipe

114a、414a‧‧‧第一公接頭114a, 414a‧‧‧ first male connector

114b‧‧‧第一母接頭114b‧‧‧First female connector

115、215、315‧‧‧風扇115, 215, 315‧ ‧ fans

116‧‧‧第一連接埠組116‧‧‧First connection group

116a、216a、416a‧‧‧第一公連接埠116a, 216a, 416a‧‧‧ first public connection埠

116b、216b‧‧‧第一母連接埠116b, 216b‧‧‧ first female connection埠

117a、417a‧‧‧第一公電力傳輸埠117a, 417a‧‧‧First public power transmission埠

117b‧‧‧第一母電力傳輸埠117b‧‧‧First Mother Power Transmission埠

118‧‧‧第一熱感測器118‧‧‧First thermal sensor

119‧‧‧控制器119‧‧‧ Controller

120、220、320、420‧‧‧第二周邊裝置120, 220, 320, 420‧‧‧second peripheral device

121、221‧‧‧第一面121, 221‧‧‧ first side

122、222‧‧‧第二面122, 222‧‧‧ second side

123、223、323‧‧‧第二熱源123, 223, 323‧‧‧ second heat source

124、224、324‧‧‧第二導熱管124, 224, 324‧‧‧ second heat pipe

124a‧‧‧第二公接頭124a‧‧‧Second male connector

124b、324b‧‧‧第二母接頭124b, 324b‧‧‧ second female connector

125‧‧‧第二連接埠組125‧‧‧Second connection group

125a、225a‧‧‧第二公連接埠125a, 225a‧‧‧second public connection埠

125b、225b、325b‧‧‧第二母連接埠125b, 225b, 325b‧‧‧ second female connection埠

126a‧‧‧第二公電力傳輸埠126a‧‧‧Second public power transmission埠

126b、326b‧‧‧第二母電力傳輸埠126b, 326b‧‧‧Second mother power transmission埠

127‧‧‧第二熱感測器127‧‧‧Second thermal sensor

216c‧‧‧第一導熱殼體216c‧‧‧First heat conducting housing

216d‧‧‧第一導熱殼體216d‧‧‧First thermal housing

225c‧‧‧第二導熱殼體225c‧‧‧second heat conducting housing

225d‧‧‧第二導熱殼體225d‧‧‧Second thermal housing

330、430‧‧‧第三周邊裝置330, 430‧‧‧ third peripheral device

331‧‧‧第一面331‧‧‧ first side

332‧‧‧第二面332‧‧‧ second side

333‧‧‧第三熱源333‧‧‧ third heat source

334‧‧‧第三導熱管334‧‧‧ Third heat pipe

334a‧‧‧第三公接頭334a‧‧‧ third male connector

334b、434b‧‧‧第三母接頭334b, 434b‧‧‧ third female connector

335‧‧‧第三連接埠組335‧‧‧ Third connection group

335a‧‧‧第三公連接埠335a‧‧‧ Third public connection埠

335b、435b‧‧‧第三母連接埠335b, 435b‧‧‧ third female connection埠

336a‧‧‧第三公電力傳輸埠336a‧‧‧ Third Public Power Transmission埠

336b、346b‧‧‧第三母電力傳輸埠336b, 346b‧‧‧ third mother power transmission埠

337‧‧‧第三熱感測器337‧‧‧ third thermal sensor

圖1A是依照本發明之一實施例之一種周邊模組。1A is a peripheral module in accordance with an embodiment of the present invention.

圖1B是圖1A之周邊模組之第一周邊裝置與第二周邊裝置未疊合時的第一面的示意圖。1B is a schematic view of the first side of the peripheral module of FIG. 1A when the first peripheral device and the second peripheral device are not overlapped.

圖1C是圖1A之周邊模組之第一周邊裝置與第二周邊裝置未疊合時的第二面的示意圖。1C is a schematic view of the second side of the peripheral module of FIG. 1A when the first peripheral device and the second peripheral device are not overlapped.

圖2是依照本發明之另一實施例之一種周邊模組的側視示意圖。2 is a side elevational view of a peripheral module in accordance with another embodiment of the present invention.

圖3是依照本發明之再一實施例之一種周邊模組的側視示意圖。3 is a side elevational view of a peripheral module in accordance with still another embodiment of the present invention.

圖4是依照本發明之又一實施例之一種周邊模組的側視示意圖。4 is a side elevational view of a peripheral module in accordance with yet another embodiment of the present invention.

10‧‧‧電子裝置10‧‧‧Electronic devices

100‧‧‧周邊模組100‧‧‧ peripheral modules

110‧‧‧第一周邊裝置110‧‧‧First peripheral device

111‧‧‧第一面111‧‧‧ first side

112‧‧‧第二面112‧‧‧ second side

113‧‧‧第一熱源113‧‧‧First heat source

114‧‧‧第一導熱管114‧‧‧First heat pipe

114a‧‧‧第一公接頭114a‧‧‧first male connector

115‧‧‧風扇115‧‧‧Fan

116‧‧‧第一連接埠組116‧‧‧First connection group

116a‧‧‧第一公連接埠116a‧‧‧First public connection埠

116b‧‧‧第一母連接埠116b‧‧‧First mother connection埠

117a‧‧‧第一公電力傳輸埠117a‧‧‧First Public Power Transmission埠

117b‧‧‧第一母電力傳輸埠117b‧‧‧First Mother Power Transmission埠

118‧‧‧第一熱感測器118‧‧‧First thermal sensor

119‧‧‧控制器119‧‧‧ Controller

120‧‧‧第二周邊裝置120‧‧‧second peripheral device

121‧‧‧第一面121‧‧‧ first side

122‧‧‧第二面122‧‧‧ second side

123‧‧‧第二熱源123‧‧‧second heat source

124‧‧‧第二導熱管124‧‧‧Second heat pipe

124a‧‧‧第二公接頭124a‧‧‧Second male connector

124b‧‧‧第二母接頭124b‧‧‧Second female connector

125‧‧‧第二連接埠組125‧‧‧Second connection group

125a‧‧‧第二公連接埠125a‧‧‧Second public connection埠

125b‧‧‧第二母連接埠125b‧‧‧Second mother connection埠

126a‧‧‧第二公電力傳輸埠126a‧‧‧Second public power transmission埠

126b‧‧‧第二母電力傳輸埠126b‧‧‧Second mother power transmission埠

127‧‧‧第二熱感測器127‧‧‧Second thermal sensor

Claims (11)

一種周邊模組,適於電性連接至一電子裝置,該周邊模組包括:一第一周邊裝置,包括一第一熱源、一第一導熱管、一風扇及一第一連接埠組,該第一導熱管熱耦合於該第一熱源;以及一第二周邊裝置,包括一第二熱源、一第二導熱管及一第二連接埠組,該第二導熱管熱耦合於該第二熱源,其中:該第一周邊裝置與該第二周邊裝置適於相互疊置,以使該第一導熱管熱耦合於該第二導熱管,且該第一連接埠組電性連接至該第二連接埠組。A peripheral module is configured to be electrically connected to an electronic device. The peripheral module includes: a first peripheral device, a first heat source, a first heat pipe, a fan, and a first port set. a first heat pipe is thermally coupled to the first heat source; and a second peripheral device includes a second heat source, a second heat pipe, and a second port set, the second heat pipe is thermally coupled to the second heat source The first peripheral device and the second peripheral device are adapted to be stacked on each other such that the first heat pipe is thermally coupled to the second heat pipe, and the first port is electrically connected to the second Connect to the group. 如申請專利範圍第1項所述之周邊模組,其中該第一周邊裝置具有相對之一第一面及一第二面,該第一導熱管包括一第一公接頭及一第一母接頭,該第一公接頭設於該第一周邊裝置之該第一面,該第一母接頭設於該第一周邊裝置之該第二面;該第二周邊裝置具有相對之一第一面及一第二面,該第二導熱管包括一第二公接頭及一第二母接頭,該第二公接頭設於該第二周邊裝置之該第一面,該第二母接頭設於該第二周邊裝置之該第二面。The peripheral module of claim 1, wherein the first peripheral device has a first surface and a second surface, and the first heat pipe comprises a first male connector and a first female connector The first male connector is disposed on the first side of the first peripheral device, the first female connector is disposed on the second surface of the first peripheral device; the second peripheral device has a first side opposite to the first a second surface, the second heat pipe includes a second male connector and a second female connector, the second male connector is disposed on the first side of the second peripheral device, and the second female connector is disposed on the first side The second side of the two peripheral devices. 如申請專利範圍第1項所述之周邊模組,其中該第一周邊裝置具有相對之一第一面及一第二面,該第一連接埠組包括一第一公連接埠及一第一母連接埠,該第一公連接埠設於該第一周邊裝置之該第一面,該第一母連接埠設 於該第一周邊裝置之該第二面;該第二周邊裝置具有相對之一第一面及一第二面,該第二連接埠組包括一第二公連接埠及一第二母連接埠,該第二公連接埠設於該第二周邊裝置之該第一面,該第二母連接埠設於該第二周邊裝置之該第二面。The peripheral module of claim 1, wherein the first peripheral device has a first side and a second side, and the first connecting group includes a first male connector and a first connector a first connection port disposed on the first side of the first peripheral device, the first female connection device On the second side of the first peripheral device; the second peripheral device has a first side and a second side, and the second connecting group includes a second male connector and a second female connector The second male connector is disposed on the first surface of the second peripheral device, and the second female connector is disposed on the second surface of the second peripheral device. 如申請專利範圍第3項所述之周邊模組,其中該第一公連接埠與該第一母連接埠分別包括一第一導熱殼體,該第一導熱管位於該第一面與該第二面之間,且該第一導熱管之兩端分別連接於該第一公連接埠之該第一導熱殼體及該第一母連接埠之該第一導熱殼體。The peripheral module of claim 3, wherein the first male connector and the first female connector respectively comprise a first heat conducting housing, the first heat pipe is located at the first side and the first Between the two sides, the two ends of the first heat pipe are respectively connected to the first heat conducting shell of the first male connector and the first heat conducting shell of the first female connector. 如申請專利範圍第3項所述之周邊模組,其中該第二公連接埠與該第二母連接埠分別包括一第二導熱殼體,該第二導熱管位於該第一面與該第二面之間,且該第二導熱管分別連接於該第二公連接埠之該第二導熱殼體及該第二母連接埠之該第二導熱殼體。The peripheral module of claim 3, wherein the second male connector and the second female connector respectively comprise a second heat conducting housing, the second heat pipe is located at the first side and the second Between the two sides, the second heat transfer tube is respectively connected to the second heat conducting housing of the second male connector and the second heat conducting housing of the second female connector. 如申請專利範圍第1項所述之周邊模組,其中該第一熱源為一圖形處理器(Graphic Processing Unit,GPU)。The peripheral module of claim 1, wherein the first heat source is a Graphic Processing Unit (GPU). 如申請專利範圍第1項所述之周邊模組,其中該第一周邊裝置更包括一第一熱感測器及一控制器,該第一熱感測器及該風扇電性連接至該控制器。The peripheral module of claim 1, wherein the first peripheral device further comprises a first thermal sensor and a controller, wherein the first thermal sensor and the fan are electrically connected to the control Device. 如申請專利範圍第1項所述之周邊模組,其中該第一周邊裝置更包括一控制器,該風扇及該第一連接埠組電性連接至該控制器,該第二周邊裝置更包括一第二熱感測器,該第二熱感測器電性連接於該第二連接埠組。The peripheral module of claim 1, wherein the first peripheral device further comprises a controller, the fan and the first port are electrically connected to the controller, and the second peripheral device further comprises A second thermal sensor is electrically connected to the second connection group. 如申請專利範圍第1項所述之周邊模組,其中該第一周邊裝置具有相對之一第一面及一第二面,該第一周邊裝置更包括設於該第一面的一第一公電力傳輸埠及設於該第二面的一第一母電力傳輸埠,該第一公電力傳輸埠及該第一母電力傳輸埠分別電性連接於該第一熱源或該風扇。 The peripheral module of claim 1, wherein the first peripheral device has a first surface and a second surface, and the first peripheral device further includes a first surface disposed on the first surface The first power transmission port and the first parent power transmission port are electrically connected to the first heat source or the fan, respectively. 如申請專利範圍第1項所述之周邊模組,其中該第二周邊裝置具有相對之一第一面及一第二面,該第二周邊裝置更包括設於該第一面的一第二公電力傳輸埠及設於該第二面的一第二母電力傳輸埠,該第二公電力傳輸埠及該第二母電力傳輸埠分別電性連接於該第二熱源。 The peripheral module of claim 1, wherein the second peripheral device has a first surface and a second surface, and the second peripheral device further includes a second portion disposed on the first surface The second power transmission port and the second parent power transmission port are electrically connected to the second heat source. 如申請專利範圍第1項所述之周邊模組,其中該第一連接埠組與該第二連接埠組之傳輸介面為通用序列匯流排或雷電介面。The peripheral module of claim 1, wherein the transmission interface of the first connection group and the second connection group is a universal serial bus or a lightning interface.
TW101122848A 2012-06-26 2012-06-26 Peripheral module TWI494050B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101122848A TWI494050B (en) 2012-06-26 2012-06-26 Peripheral module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101122848A TWI494050B (en) 2012-06-26 2012-06-26 Peripheral module

Publications (2)

Publication Number Publication Date
TW201401991A TW201401991A (en) 2014-01-01
TWI494050B true TWI494050B (en) 2015-07-21

Family

ID=50345281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101122848A TWI494050B (en) 2012-06-26 2012-06-26 Peripheral module

Country Status (1)

Country Link
TW (1) TWI494050B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
TW200946011A (en) * 2007-12-17 2009-11-01 Tanima Holdings Llc Double bonded heat dissipation
CN101636062A (en) * 2008-07-25 2010-01-27 白豪 Stacked heat conduction module
DE102008033452A1 (en) * 2008-07-16 2010-01-28 Ontorix Gmbh Printed circuit board arrangement for upgrading peripheral component interconnect express bus system of embedded personal computer, has bus coupler for coupling secondary-bus system with primary bus system in computer system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050259402A1 (en) * 2004-05-18 2005-11-24 Denso Corporation Power stack
TW200946011A (en) * 2007-12-17 2009-11-01 Tanima Holdings Llc Double bonded heat dissipation
DE102008033452A1 (en) * 2008-07-16 2010-01-28 Ontorix Gmbh Printed circuit board arrangement for upgrading peripheral component interconnect express bus system of embedded personal computer, has bus coupler for coupling secondary-bus system with primary bus system in computer system
CN101636062A (en) * 2008-07-25 2010-01-27 白豪 Stacked heat conduction module

Also Published As

Publication number Publication date
TW201401991A (en) 2014-01-01

Similar Documents

Publication Publication Date Title
US10354356B2 (en) Systems and methods for interconnecting and cooling multiple graphics processing unit (GPU) cards
TW201426335A (en) Solid state drive and motherboard for supporting the solid state drive
JP2017508278A (en) High power portable device and docking system
TW201337516A (en) Expansion card having synergistic cooling, structural and volume reduction solutions
JP2013125545A (en) Solid state drive assembly
TW201251590A (en) Heat dissipating system
JP2017508278A5 (en)
TWI391058B (en) Mainboard and portable electronic device using the same
US9287669B2 (en) SATA express connector
CN103901982A (en) Electronic device having an active edge
TWI494050B (en) Peripheral module
US11310936B2 (en) Thermal modules for electronic devices
JP2014115990A (en) Solid-state drive and mother board equipped with the same
TW201214101A (en) Data transmitting system and data transmitting method
US20120134098A1 (en) Computing device thermal module
CN104571398B (en) Servomechanism and its radiating subassembly
TWI321724B (en) Fluid providing module and electronic device using the same
TW201324176A (en) Disk on module
TWI558298B (en) Sever
TWM541034U (en) Computer host
TWI601002B (en) Server
CN104932643A (en) Desktop computer mainframe box capable of dissipating heat intelligently
TW201305801A (en) Power docking station and general transmission interface
TWM445713U (en) External storage device and bridge chip
TW201301688A (en) Transfer module