CN201242716Y - Securing component - Google Patents

Securing component Download PDF

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Publication number
CN201242716Y
CN201242716Y CNU2008201295109U CN200820129510U CN201242716Y CN 201242716 Y CN201242716 Y CN 201242716Y CN U2008201295109 U CNU2008201295109 U CN U2008201295109U CN 200820129510 U CN200820129510 U CN 200820129510U CN 201242716 Y CN201242716 Y CN 201242716Y
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CN
China
Prior art keywords
peripheral device
casing
electronic apparatus
support plate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008201295109U
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Chinese (zh)
Inventor
陈正隆
廖廷伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro Star International Co Ltd
Original Assignee
Micro Star International Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Star International Co Ltd filed Critical Micro Star International Co Ltd
Priority to CNU2008201295109U priority Critical patent/CN201242716Y/en
Application granted granted Critical
Publication of CN201242716Y publication Critical patent/CN201242716Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

Disclosed is a fixing component, which is used for fixing a peripheral device into the machine casing of an electronic device and exchanging heat with the peripheral device. The fixing component comprises a carrying plate and a pair of side plates; wherein, the carrying plate has an inner surface and an outer surface, the inner surface is contacted with the peripheral device, and a plurality of guiding and connecting parts are arranged on the outer surface and are contacted with the machine casing of the electronic device, and the heat energy of the peripheral device is conducted to the machine casing of the electronic device through the carrying plate; the pair of side plates are respectively arranged at the both lateral sides of the carrying plat so as to form a bearing range for installing the peripheral device, and the carrying plate is fixed in the machine casing of the electronic device in combination with the side plates. The heat generated by the peripheral device can be transferred to the machine casing of the electronic device through the guiding and connecting parts after passing through the carrying plate, thus achieving the purpose of heat elimination of the peripheral device.

Description

Fixed component
Technical field
The utility model relates to a kind of fixed component, particularly can carry out the fixed component of heat interchange.
Background technology
Present electronic installation on the market, heat-generating units that it is inner such as central processing unit (CentralProcessing Unit, CPU), internal memory (Random access memory, RAM) speed that can move is more and more faster, then data processing amount also doubles in the unit interval.Therefore, under long-time situation about using, tend to cause the operating ambient temperature of electronic installation inside too high, normally move, increase the probability of electronic device failure and damage and have influence on electronic installation.
For avoiding causing electronic installation to be under abnormal operating ambient temperature because of the heat energy that heat-generating units produces, therefore in casing of electronic apparatus, all can install a fan additional, again heat-generating units is connected with radiating tube, the thermal energy conduction that heat-generating units is produced by radiating tube is to the fan place, by fan running heat energy is expelled to outside the electronic installation, takes place to avoid overheated phenomenon.
Yet prior art has following problem for the Winchester disk drive heat abstractor of notebook computer: general Winchester disk drive all is the corner that is installed in casing of electronic apparatus inside, and the simple heat pipe that passes through helps when dispelling the heat, and efficient is lower with respect to internal memory and central processing unit.Therefore, usually all be to increase radiating fin or install module such as fan additional to increase radiating efficiency at the Winchester disk drive shell, but notebook computer volume inside framework has its restriction, if install the Winchester disk drive radiating module additional in order to cooperate, then needs to increase the volume of notebook computer.Therefore, install the Winchester disk drive radiating module additional, not only can cause in assembling and the dismounting more difficult, and increase the assembly expenses that manually reaches man-hour, also need extra-pay to make the Winchester disk drive radiating module.
Summary of the invention
Because existing Winchester disk drive heat abstractor, under the framework condition of limited of notebook computer inner space, be still and additionally install modules such as radiating fin or fan at the Winchester disk drive shell additional, will cause the space crowded, and increase the weight of notebook computer, lost the convenience of carrying, and on assembling and making, all need to expend more time and cost, the purpose of this utility model is to provide a kind of fixed component, it is made easily, easy accessibility, can reduce the assembling in artificial and man-hour.
The fixed component that the utility model is disclosed in order to a peripheral device is fixed in the casing of electronic apparatus, and carries out heat interchange with peripheral device, and fixed component includes a support plate and pair of side plates.Side plate is divided into the support plate dual-side, and by side plate support plate is fixed in casing of electronic apparatus.Support plate has an inside surface and an outside surface, constitute a carrying scope by inside surface and side plate, in order to the carrying peripheral device, outside surface is provided with a plurality of lead pieces, lead piece contacts with casing of electronic apparatus, is passed to casing of electronic apparatus with the heat energy that peripheral device is produced through support plate.
Particularly, fixed component of the present utility model, in order to a peripheral device is fixed in the casing of electronic apparatus, and carrying out heat interchange with this peripheral device, this fixed component includes: a support plate has an inside surface and an outside surface, this inside surface contacts with this peripheral device, this outside surface is provided with a plurality of lead pieces, and this lead piece contacts with this casing of electronic apparatus, and the heat energy of this peripheral device conducts to this casing of electronic apparatus through this support plate; And pair of side plates, being divided into this support plate dual-side to constitute the carrying scope of this peripheral device of installing, this support plate hardens to close with this offside and is fixed in this casing of electronic apparatus.
Useful technique effect of the present utility model is, peripheral device is arranged at the carrying scope that support plate inside surface and the side plate that is divided into the support plate dual-side constitute, and support plate is fixed in the casing of electronic apparatus by side plate, the support plate outside surface is provided with a plurality of lead pieces, and lead piece contacts with casing of electronic apparatus, by lead piece the heat energy that peripheral device produces is passed to casing of electronic apparatus through support plate, peripheral device is dispelled the heat to reach.So, can avoid additionally installing modules such as radiating fin or fan additional, only need utilize lead piece can effectively utilize the temperature that casing reduces peripheral device, and make easy, easy accessibility, can reduce the assembling in artificial and man-hour at the peripheral device place.
Above about the utility model content explanation and the explanation of following embodiment in order to demonstration with explain spirit of the present utility model and principle, and provide claim of the present utility model further to explain.
Description of drawings
Fig. 1 is a schematic perspective view of the present utility model;
Fig. 2 is a decomposing schematic representation of the present utility model;
Fig. 3 is a schematic perspective view of the present utility model;
Fig. 4 is a schematic perspective view of the present utility model;
Fig. 5 is an assembling synoptic diagram of the present utility model;
Fig. 6 A is a diagrammatic cross-section of the present utility model; And
Fig. 6 B is a diagrammatic cross-section of the present utility model.
Wherein, description of reference numerals is as follows:
10 notebook computers, 11 casing of electronic apparatus
115 through holes, 12 heating radiators
121 fans, 122 heat conduction fin pipes
20 fixed components, 30 support plates
31 inside surfaces, 311 thermal greases
312 heat transfer pad, 32 outside surfaces
321 lead pieces, 322 lead pieces
33 Connection Blocks, 331 grip parts
332 salient points, 333 lockholes
34 perforation, 40 side plates
41 perforation, 50 peripheral devices
51 lockholes
Embodiment
Below in embodiment, be described in detail detailed features of the present utility model and advantage, its content is enough to make any personage who is familiar with correlation technique to understand technology contents of the present utility model and implements according to this, and according to the disclosed content of this instructions, claims and accompanying drawing, any personage who is familiar with correlation technique can understand the utility model relevant purpose and advantage easily.Following embodiment further describes viewpoint of the present utility model, but non-to limit category of the present utility model anyways.
According to fixed component of the present utility model, can be applicable to notebook computer (NoteBook), desktop computer (Desktop Computer), panel computer (Tablet Personal Computer), and mini Mobile computer (Ultra Mobile Personal Computer, UMPC) etc. on the electronic installation, its mode docking port equipment by heat interchange dispels the heat, but not as limit.
See also Fig. 1 to Fig. 5, it is a synoptic diagram of the present utility model.Fixed component 20 of the present utility model includes a support plate 30 and pair of side plates 40.
Notebook computer 10 has casing of electronic apparatus 11 and LCD (not being shown in accompanying drawing), casing of electronic apparatus 11 inside constitute a plurality of accommodation spaces that vary in size by lower surface and a plurality of wallboard perpendicular to lower surface, are available for users to dispose different peripheral device 50.Wherein, peripheral device 50 can be Winchester disk drive (Hard Disk Drive, HDD), bluetooth module (Bluetooth module), CD-ROM drive etc., and present embodiment with Winchester disk drive as explanation.
Casing of electronic apparatus 11 inside have heating radiator 12, and heating radiator 12 has fan 121 and heat conduction fin pipe 122.Heat conduction fin pipe 122 intersperses among in the notebook computer 10, with with central processing unit (CentralProcess Unit, CPU), internal memory (Random access memory, electronic package (not in graphic) contact such as RAM), with with the heat conduction of its generation to fan 121 places, and utilize fan 121 with the thermal source band from casing of electronic apparatus 11 inside.Yet these electronic packages are not the technical characterictic that the utility model is desired to emphasize, therefore do not add to give unnecessary details at this.
Support plate 30 links to each other with Connection Block 33, and Connection Block 33 has grip part 331, a plurality of salient point 332, and two lockholes 333.Support plate 30 is corresponding to salient point 332 places, have corresponding one to one perforation 34, support plate 30 utilized modes such as welding, hot melt after wearing perforation 34 by salient point 332, with making the diameter of its diameter after the thawing of salient point 332 tops, the cooling, make support plate 30 be fixed in Connection Block 33 greater than perforation 34.Casing of electronic apparatus 11 has through hole 115 respectively corresponding to two lockhole 333 places, and after Connection Block 33 wore lockhole 333 and through hole 115 by screw, promptly Connection Block 33 can be fixed in casing of electronic apparatus 11 inside together with support plate 30.Grip part 331 is in order to making things convenient for user's fixed component 20 of taking, and grip part 331 is in fixed component 20 is arranged at casing of electronic apparatus 11 time, can with casing of electronic apparatus 11 driving fits.
Support plate 30 has inside surface 31 and outside surface 32, and side plate 40 is arranged at the dual-side of support plate 30 respectively, and 50 of peripheral devices are to be arranged at the carrying scope that is formed by support plate 30 and side plate 40, and contact with inside surface 31.Wherein, the material of support plate 30 and side plate 40 is all the material of heat conduction, for example: aluminium, alloy etc.One side of peripheral device 50 has lockhole 51, and side plate 40 has perforation 41 corresponding to lockhole 51, stretches through by screw and bores a hole 41, and be locked in lockhole 51, so that peripheral device 50 is fixed in support plate 30.Wherein, between inside surface 32 and the peripheral device 50, be coated with thermal grease 311 (as shown in Figure 3) or be provided with heat transfer pad 312 (as shown in Figure 4), 50 of peripheral devices are transmitted to inside surface 32 by thermal grease 311 or heat transfer pad 312 equably with the heat energy of its generation.If do not apply thermal grease 311 or heat transfer pad 312 be set and be used as the words that heat is transmitted media, when the shell of peripheral device 50 contacts with inside surface 31, just can't be covered on inside surface fully, can cause some local to produce hot stack, can cause the too high overheated problem of peripheral device 50 that causes of temperature on the contrary.Outside surface 32 is provided with a plurality of lead piece 321 and lead pieces 322 that extend from outside surface 32.Wherein, lead piece 321,322 is the design of shell fragment, and the curvature of lead piece 321 is big than the curvature of lead piece 322.And lead piece 321 and lead piece 322 also can be the design of one except being divided into as synoptic diagram three sections.
See also Fig. 6 A and Fig. 6 B, it is the utility model is observed lead piece 321 and lead piece 322 respectively from both sides a synoptic diagram.When fixed component 20 was installed in casing of electronic apparatus 11, lead piece 321 was transferred greatly because of curvature, therefore can contact with casing of electronic apparatus 11, and lead piece 322 does not contact with casing of electronic apparatus 11 because of curvature is less, so lead piece 322 contacts with heat conduction fin pipe 122.Because lead piece 321 and lead piece 322 are shell fragment, therefore can closely contact with casing of electronic apparatus 11 and heat conduction fin pipe 122 respectively.When casing of electronic apparatus 11 is made by the material of a heat conduction, after the heat energy that peripheral device 50 produces conducts to support plate 30 via thermal grease 311 or heat transfer pad 312, except can thermal energy conduction being dispelled the heat by casing of electronic apparatus 11 to casing of electronic apparatus 11 by lead piece 321, also can by lead piece 322 with thermal energy conduction to heat conduction fin pipe 122, by fan 121 heat energy is taken away again.If casing of electronic apparatus 11 is not made up of the material of heat conduction, also the thermal energy conduction that can peripheral device 50 be produced by lead piece 322 is taken away heat energy by fan 121, so that peripheral device 50 is dispelled the heat to heat conduction fin pipe 122 again.
According to fixed component of the present utility model, its effect is that peripheral device is arranged in the carrying scope that support plate and side plate constitute and with the inside surface of support plate and contacts that the outside surface of support plate is provided with the lead piece that contacts with casing of electronic apparatus.Therefore, after the heat energy that peripheral device produces conducted to casing of electronic apparatus by support plate and lead piece, peripheral device promptly can dispel the heat.So, can avoid additionally installing modules such as radiating fin or fan additional, only need utilize lead piece can effectively utilize the temperature that casing reduces peripheral device, and make easy, easy accessibility, can reduce the assembling in artificial and man-hour at the peripheral device place.
Though the utility model discloses as above with aforesaid embodiment, so it is not in order to limit the utility model.In not breaking away from spirit and scope of the present utility model, change and the retouching carried out all belong to scope of patent protection of the present utility model.Please refer to appending claims about the protection domain that the utility model defined.

Claims (5)

1. fixed component in order to a peripheral device is fixed in the casing of electronic apparatus, and carries out heat interchange with this peripheral device, it is characterized in that this fixed component includes:
One support plate has an inside surface and an outside surface, and this inside surface contacts with this peripheral device, and this outside surface is provided with a plurality of lead pieces, and this lead piece contacts with this casing of electronic apparatus, and the heat energy of this peripheral device conducts to this casing of electronic apparatus through this support plate; And
Pair of side plates is divided into this support plate dual-side to constitute the carrying scope of this peripheral device of installing, and this support plate hardens to close with this offside and is fixed in this casing of electronic apparatus.
2. fixed component as claimed in claim 1 is characterized in that, is coated with a thermal grease between this inside surface and this peripheral device.
3. fixed component as claimed in claim 1 is characterized in that, has a heat transfer pad between this inside surface and this peripheral device.
4. fixed component as claimed in claim 1 is characterized in that, this lead piece is a shell fragment from the outside surface extension.
5. fixed component as claimed in claim 1 is characterized in that, this lead piece contacts with a heating radiator that is installed in this casing of electronic apparatus inside.
CNU2008201295109U 2008-08-21 2008-08-21 Securing component Expired - Lifetime CN201242716Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201295109U CN201242716Y (en) 2008-08-21 2008-08-21 Securing component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201295109U CN201242716Y (en) 2008-08-21 2008-08-21 Securing component

Publications (1)

Publication Number Publication Date
CN201242716Y true CN201242716Y (en) 2009-05-20

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ID=40716005

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201295109U Expired - Lifetime CN201242716Y (en) 2008-08-21 2008-08-21 Securing component

Country Status (1)

Country Link
CN (1) CN201242716Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103885562A (en) * 2014-04-09 2014-06-25 北京德能恒信科技有限公司 Heat transfer type server machine shell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103885562A (en) * 2014-04-09 2014-06-25 北京德能恒信科技有限公司 Heat transfer type server machine shell

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GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090520

CX01 Expiry of patent term